PCB cutting and typesetting method and system

Abstract

The invention relates to the technical field of PCBs, and particularly discloses a PCB cutting and typesetting method and system. According to the invention, the quality index of the PCB is obtained according to the surface integrity and the side integrity of the PCB, so that whether the PCB has defects can be quickly judged under the action of the quality index of the PCB, whether the quality index of the PCB is greater than the preset quality index of the PCB is judged, if not, the PCB is judged to have defects, and the defect detection accuracy of the PCB is improved. The method comprises the steps of obtaining material plate appearance feature information, obtaining material plate defect position information according to the material plate appearance feature information, marking the material plate area according to the material plate defect position information to obtain a defect-marked PCB material plate area, and then carrying out typesetting adaptation on a plurality of preset segmentation demand areas and the defect-marked PCB material plate area based on CAD to obtain adaptive typesetting information; and the PCB material plate is subjected to cutting and typesetting processing according to the adaptive typesetting information, so that the PCB material plate with defects can be reused after typesetting again, and meanwhile, the problem of waste of a large number of material plates can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB, and in particular to a PCB cutting and layout method and system. Background Art

[0002] Printed Circuit Board (PCB) is a substrate used for electrical connection and support between electronic components. It is one of the most basic and important components in modern electronic devices. The main function of PCB is to provide a platform so that various electronic components (such as resistors, capacitors, transistors, integrated circuits, etc.) can be fixed on it and achieve electrical connection through pre-designed routing.

[0003] During the processing of PCB material boards, it is necessary to layout the material boards. However, during the processing of existing PCB material boards, the layout and division of the divided areas with uniform area specifications are usually performed. In this way, when a material board defect is encountered, the preset divided area with the material board defect will be discarded, which will cause a large amount of material board waste. Therefore, a PCB cutting layout method and system are needed to solve the problem of discarding the preset divided area with material board defects and causing a large amount of material board waste. Summary of the invention

[0004] The purpose of the present invention is to provide a PCB cutting layout method and system to solve the technical problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A PCB cutting and layout method, comprising:

[0007] Acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas;

[0008] Acquire the material board area and material board appearance feature information according to the material board image information, acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity;

[0009] Determine whether the PCB board quality index is greater than a preset PCB board quality index;

[0010] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area;

[0011] Based on CAD, multiple preset segmentation required areas are matched with defective marked PCB material board areas to obtain matching layout information;

[0012] The PCB material board is cut and laid out according to the adapted layout information.

[0013] Preferably, the step of obtaining the surface integrity and the side integrity according to the appearance feature information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity comprises:

[0014] Grayscale processing is performed on the image information of the material plate to obtain black and white surface image information, and the black and white surface image information is screened to obtain black stripes, coordinates are respectively set for both ends of the black stripes to obtain first coordinates and second coordinates, and the surface crack length of the black stripes is calculated according to the first coordinates and the second coordinates, and a corresponding first weight value is obtained according to the surface crack length;

[0015] Based on the sonic scanner, a plurality of sonic pulse signals are emitted to the black stripes, and a plurality of rebound signals returned after the sonic pulse signals hit the black stripes are received, the surface crack depth is obtained according to the plurality of rebound signals, and the corresponding second weight value is obtained according to the surface crack depth;

[0016] Acquire the contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between the openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire the corresponding third weight value according to the appearance crack width;

[0017] Obtaining a preset crack length judgment threshold according to the surface crack length;

[0018] Obtaining a preset crack depth judgment threshold according to the surface crack depth;

[0019] Obtaining a preset crack width judgment threshold according to the surface crack width;

[0020] The surface integrity is calculated according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is:

[0021]

[0022] Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value;

[0023] Acquire a first dark stripe and side flatness of the PCB side according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and side flatness, wherein the side integrity is calculated in the same manner as the surface integrity;

[0024] Acquire a corresponding surface integrity weight value according to the surface integrity;

[0025] Acquire a corresponding aspect integrity weight value according to the aspect integrity;

[0026] The PCB board quality index is calculated according to the surface integrity and the side integrity, wherein the calculation formula is:

[0027] s(c)=[B(M)*a+C(D)*b]*100%;

[0028] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0029] Preferably, the step of obtaining the defect position information of the material sheet according to the appearance feature information of the material sheet comprises:

[0030] Acquire a plurality of first corner fixed-point coordinates corresponding to the sheet area, and select one of the plurality of first corner fixed-point coordinates as the first origin coordinate;

[0031] Obtaining a corresponding first center point according to the black stripes, and obtaining a first coordinate of the first center point according to the first origin coordinates and the first center point;

[0032] Acquire a plurality of corresponding second corner fixed point coordinates according to the side surface area, and select one of the plurality of second corner fixed point coordinates as the second origin coordinate;

[0033] Acquire a corresponding second center point according to the first dark stripe, and acquire a second coordinate of the second center point according to the second origin coordinates and the second center point;

[0034] The position information corresponding to the first coordinate and the second coordinate is used as the sheet material defect position information.

[0035] Preferably, the step of marking the sheet area according to the sheet defect position information to obtain the defect marked PCB sheet area comprises:

[0036] According to the first dark stripe, the corresponding dark stripe depth is obtained, and according to the dark stripe depth and the side stripe crack width, the side defective PCB material board area is obtained;

[0037] Obtain the surface defective PCB material board area according to the second origin coordinate and the surface crack length, wherein the second origin coordinate is used as the center of the circle and the surface crack length is used as the diameter;

[0038] The side defect PCB material board area and the surface defect PCB material board area are marked respectively to obtain the side defect marked PCB material board area and the surface defect marked PCB material board area, and the side defect marked PCB material board area and the surface defect marked PCB material board area are used as the defect marked PCB material board area.

[0039] Preferably, the step of performing layout adaptation on the plurality of preset segmentation requirement areas and the defective marked PCB material board area based on CAD to obtain the adapted layout information comprises:

[0040] Obtain the actual use area of ​​the PCB board according to the defect marked PCB board area;

[0041] Based on particle swarm optimization, the preset segmentation required area is randomly arranged as particles on the actual use area to obtain multiple layouts, wherein each particle represents a layout of the PCB;

[0042] According to the plurality of layout layouts, corresponding layout characteristic parameters are obtained, wherein the layout characteristic parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and according to the plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, a plurality of fitness comprehensive values ​​are calculated in sequence, wherein the calculation formula is:

[0043] S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...;

[0044] [L(J) n *Cn +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ;

[0045] Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i represents the utilization rate of the i-th layout area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the number of layouts for the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents a counting number, i=1, 2, 3...n;

[0046] The multiple comprehensive suitability values ​​are screened according to the maximum value to obtain a first screening comprehensive suitability value, and the layout layout corresponding to the first screening comprehensive suitability value is used as the optimal layout scheme, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value to obtain adapted layout information.

[0047] Preferably, the step of cutting and typesetting the PCB material board according to the adapted typesetting information comprises:

[0048] Acquire a plurality of corresponding first preset segmentation required areas according to the adaptive layout information;

[0049] A corresponding first cutting path is acquired according to the adaptation layout information, and a plurality of the first preset segmentation required areas are cut and laid out on the PCB material board according to the first cutting path.

[0050] The present application also provides a PCB cutting and layout system, including:

[0051] A first acquisition module is used to acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas;

[0052] A second acquisition module is used to acquire the material board area and material board appearance feature information according to the material board image information, and acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity;

[0053] A first judgment module is used to judge whether the PCB board quality index is greater than a preset PCB board quality index;

[0054] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area;

[0055] The first layout module is used to layout and adapt the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information;

[0056] The first processing module is used to perform cutting and layout processing on the PCB material board according to the adapted layout information.

[0057] Preferably, the second acquisition module includes:

[0058] a first acquisition unit, configured to grayscale the sheet image information to obtain black-and-white surface image information, filter the black-and-white surface image information to obtain black stripes, respectively set coordinates at both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes according to the first coordinates and the second coordinates, and obtain a corresponding first weight value according to the surface crack length;

[0059] A second acquisition unit is used to transmit a plurality of acoustic wave pulse signals to the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, acquire the surface crack depth according to the plurality of rebound signals, and acquire a corresponding second weight value according to the surface crack depth;

[0060] a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire a corresponding third weight value according to the appearance crack width;

[0061] A fourth acquisition unit, configured to acquire a preset crack length judgment threshold according to the surface crack length;

[0062] A fifth acquisition unit, configured to acquire a preset crack depth judgment threshold according to the surface crack depth;

[0063] A sixth acquisition unit, configured to acquire a preset crack width judgment threshold according to the surface crack width;

[0064] A first calculation unit is used to calculate the surface integrity according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is:

[0065]

[0066] Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value;

[0067] a seventh acquisition unit, configured to acquire a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and the side flatness, wherein a side integrity calculation method is the same as a surface integrity calculation method;

[0068] An eighth acquisition unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity;

[0069] A ninth acquisition unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity;

[0070] The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is:

[0071] s(c)=[B(M)*a+C(D)*b]*100%;

[0072] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0073] The present application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0074] The present application also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0075] The beneficial effects of the present application are as follows: the present invention first obtains the segmentation feature information of the PCB material board, wherein the segmentation feature information includes the material board image information and a plurality of preset segmentation required areas, and then obtains the material board area and material board appearance feature information according to the material board image information, so that after obtaining the material board area and material board appearance feature information, it can provide a basis for subsequent re-layout, and at the same time, the surface integrity and side integrity can be obtained according to the material board appearance feature information, and the PCB board quality index can be obtained according to the surface integrity and side integrity, so that under the action of the PCB board quality index, it can be quickly judged whether the PCB material board has defects, and whether the PCB board quality index is greater than the preset PCB board quality index, if the PCB board quality index is not large, Based on the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defective marked PCB board area. In this way, after obtaining the defective marked PCB board area, it can be avoided and the PCB board can be re-layouted. At the same time, multiple preset segmentation required areas are layout-adapted with the defective marked PCB board area through CAD to obtain the adapted layout information, and then the PCB board is cut and laid out according to the adapted layout information. In this way, the re-layouted PCB board can reuse the defective PCB board, and at the same time, it can also avoid the problem of causing a large amount of board waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 A schematic diagram of a method flow chart of an embodiment of the present application.

[0077] Figure 2 A schematic diagram of the system structure of an embodiment of the present application.

[0078] Figure 3 A schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0079] Figure 4 This is a schematic diagram related to a PCB material board according to an embodiment of the present application.

[0080] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0081] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0082] like Figure 1-3 As shown, the present application provides a PCB cutting and layout method, which is applied to an earphone charging seat detection platform, comprising:

[0083] S1. Acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas;

[0084] S2. Acquire the material board area and material board appearance feature information according to the material board image information, acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity;

[0085] S3, judging whether the PCB board quality index is greater than a preset PCB board quality index;

[0086] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area;

[0087] S4, based on CAD, performing layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area to obtain adaptation layout information;

[0088] S5. Cutting and layout processing are performed on the PCB material board according to the adapted layout information.

[0089] As described in the above steps S1-S5, during the processing of the PCB material board, it is necessary to layout the material board, but the existing PCB material board usually layouts and segments the segmented areas with uniform area specifications during the processing. In this way, when a material board defect is encountered, the preset segmented area with the material board defect will be discarded, which will cause a large amount of material board waste. Therefore, the present invention first obtains the segmentation feature information of the PCB material board, wherein the segmentation feature information includes the material board image information and a plurality of preset segmentation required areas, and then obtains the material board area and material board appearance feature information according to the material board image information. In this way, after obtaining the material board area and material board appearance feature information, a basis can be provided for subsequent re-layout, and at the same time, the surface integrity and side integrity can be obtained according to the material board appearance feature information, and the PCB board quality index can be obtained according to the surface integrity and side integrity. In this way, the PCB board quality index can be used to quickly judge the PCB board quality. Whether there is a defect in the CB board, and whether the PCB board quality index is greater than the preset PCB board quality index, if the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defective marked PCB board area, so that after obtaining the defective marked PCB board area, it can be avoided and the PCB board is re-layouted, the specific steps are: based on CAD, multiple preset segmentation requirement areas are layout-adapted with the defective marked PCB board area to obtain the adapted layout information, and then the PCB board is cut and laid out according to the adapted layout information, so that the re-layouted PCB board can reuse the defective PCB board, and at the same time, it can also avoid the problem of causing a large amount of board waste.

[0090] In one embodiment, the step S2 of obtaining the surface integrity and the side integrity according to the appearance feature information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity includes:

[0091] S201, grayscale processing is performed on the image information of the material plate to obtain black and white surface image information, and the black and white surface image information is screened to obtain black stripes, coordinates are respectively set for both ends of the black stripes to obtain first coordinates and second coordinates, and the surface crack length of the black stripes is calculated according to the first coordinates and the second coordinates, and a corresponding first weight value is obtained according to the surface crack length;

[0092] S202, transmitting a plurality of acoustic wave pulse signals to the black stripes based on an acoustic wave scanner, and receiving a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, obtaining the surface crack depth according to the plurality of rebound signals, and obtaining a corresponding second weight value according to the surface crack depth;

[0093] S203, obtaining the contour information of the black stripes based on Canny edge detection, and obtaining multiple crack widths between the openings of the black stripes according to the contour information of the black stripes, sorting the multiple crack widths in ascending order to obtain a crack width sorting table, taking the last crack width in the crack width sorting table as the surface crack width, and obtaining a corresponding third weight value according to the surface crack width;

[0094] S204, obtaining a preset crack length judgment threshold according to the surface crack length;

[0095] S205, obtaining a preset crack depth judgment threshold according to the surface crack depth;

[0096] S206, obtaining a preset crack width judgment threshold according to the surface crack width;

[0097] S207, calculating the surface integrity according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is:

[0098]

[0099] Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value;

[0100] S208, obtaining a first dark stripe and a side flatness of the PCB side according to the black-and-white surface image information, obtaining a side stripe crack width according to the first dark stripe, and obtaining a side integrity according to the side stripe crack width and the side flatness, wherein the side integrity is calculated in the same manner as the surface integrity;

[0101] S209, obtaining a corresponding surface integrity weight value according to the surface integrity;

[0102] S2010, obtaining a corresponding side integrity weight value according to the side integrity;

[0103] S2011. Calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is:

[0104] s(c)=[B(M)*a+C(D)*b]*100%;

[0105] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0106] As described in the above steps S201-S2011, since the defects of the PCB material board are usually cracks on the side and surface, it is necessary to find the position of the crack of the PCB material board. Since the crack is black or dark black in the image after grayscale processing, the present invention first performs grayscale processing on the image information of the material board to obtain black and white surface image information, and screens the black and white surface image information to obtain black stripes. In this way, the position of the defect on the surface of the PCB material board can be judged by the black stripes. Since the length, width and depth of the crack have a certain influence on the PCB material board, coordinates are respectively set for the two ends of the black stripe to obtain the first coordinate and the second coordinate, and the surface crack length of the black stripe is calculated according to the first coordinate and the second coordinate. For example, one end of the crack is at the coordinate (100, 200) and the other end is at the coordinate (300, 400), and the length unit is mm. Then the crack length can be calculated by the following formula: And obtain the corresponding first weight value according to the surface crack length, so that after obtaining the surface crack length, it is helpful to evaluate the severity of the crack, and then based on the acoustic wave scanner, multiple acoustic wave pulse signals are emitted to the black stripe, and multiple rebound signals returned after the acoustic wave pulse signals hit the black stripe are received, and the surface crack depth is obtained according to the multiple rebound signals, and the corresponding second weight value is obtained according to the surface crack depth, so that the damage degree of the surface crack depth can be determined, and then the contour information of the black stripe is obtained based on the Canny edge detection, and the multiple crack widths between the openings of the black stripe are obtained according to the contour information of the black stripe, and the multiple crack widths are sorted in an ascending manner to obtain a crack width sorting table, and the last crack width in the crack width sorting table is used as the surface crack width, and the surface crack width is also an important parameter basis for judging the integrity of the PCB, and then the preset crack length judgment threshold is obtained according to the surface crack length, and then the preset crack depth judgment threshold is obtained according to the surface crack depth, and then the preset crack width judgment threshold is obtained according to the surface crack width, and finally, according to the surface crack length, the surface crack depth, and the surface The surface integrity is calculated based on the crack width, the preset crack length judgment threshold, the preset crack depth judgment threshold, the preset crack width judgment threshold, the first weight value, the second weight value and the third weight value. In this way, the surface integrity of the PCB material board surface can be judged by the surface integrity, and a basis is provided for calculating the PCB material quality index. Then, the first dark stripe and the side flatness of the PCB side are obtained according to the black and white surface image information, and the side stripe crack width is obtained according to the first dark stripe, and the side stripe crack width is obtained according to the side stripe crack width and the side flatness. The side integrity is obtained according to the side stripe crack width and the side flatness. The side integrity is calculated in the same way as the surface integrity. In this way, the PCB material quality index can be completely obtained after the surface integrity and the side integrity are obtained. Then, the corresponding surface integrity weight value is obtained according to the surface integrity, and then the corresponding side integrity weight value is obtained according to the side integrity. Finally, the PCB material quality index is calculated according to the surface integrity and the side integrity. In this way, the integrity of the PCB material board can be understood through the PCB material quality index, and an important basis is provided for subsequent PCB material defect judgment. The above-mentioned numerical values ​​are only used for example and are not used as the only reference.

[0107] In one embodiment, the step S3 of acquiring the defect position information of the sheet material according to the sheet material appearance feature information comprises:

[0108] S301, acquiring a plurality of first corner fixed point coordinates corresponding to the sheet area, and selecting one of the plurality of first corner fixed point coordinates as a first origin coordinate;

[0109] S302, obtaining a corresponding first center point according to the black stripes, and obtaining a first coordinate of the first center point according to the first origin coordinates and the first center point;

[0110] S303, acquiring a plurality of corresponding second corner fixed point coordinates according to the side surface area, and selecting one of the plurality of second corner fixed point coordinates as a second origin coordinate;

[0111] Acquire a corresponding second center point according to the first dark stripe, and acquire a second coordinate of the second center point according to the second origin coordinates and the second center point;

[0112] S304, using the position information corresponding to the first coordinate and the second coordinate as the sheet material defect position information.

[0113] As described in the above steps S301-S304, after determining that the PCB material board has defects, it is necessary to identify the defective position and provide a basis for the subsequent re-cutting and layout of the PCB material board. Therefore, firstly, the corresponding multiple first corner fixed point coordinates are obtained according to the area of ​​the material board, and one is selected as the first origin coordinate according to the multiple first corner fixed point coordinates. In this way, a coordinate system can be established based on the first origin coordinates to facilitate subsequent calculation and positioning. Then, the corresponding first center point is obtained according to the black stripes, and the first coordinate of the first center point is obtained according to the first origin coordinates and the first center point. Then, the corresponding multiple second corner fixed point coordinates are obtained according to the side surface area, and one is selected as the second origin coordinate according to the multiple second corner fixed point coordinates. In this way, the potential defective area can be inferred from the position of the black stripes, and a basis for subsequent re-layout is provided. Then, the corresponding second center point is obtained according to the first dark stripes, and the second coordinate of the second center point is obtained according to the second origin coordinates and the second center point (such as Figure 4 As shown), the position corresponding to the first coordinate and the second coordinate is the defect position of the material sheet. After obtaining the defect position of the material sheet, it can provide an important basis for the subsequent rearrangement segmentation path planning and the adaptation of the preset segmentation requirement area.

[0114] In one embodiment, the step S3 of marking the sheet area according to the sheet defect position information to obtain the defective marked PCB sheet area includes:

[0115] S301, obtaining the corresponding dark stripe depth according to the first dark stripe, and obtaining the side defective PCB material board area according to the dark stripe depth and the side stripe crack width;

[0116] S302, obtaining the surface defective PCB material board area according to the second origin coordinates and the surface crack length, wherein the second origin coordinates are used as the center of the circle and the surface crack length is used as the diameter;

[0117] S303, marking the side defect PCB material board area and the surface defect PCB material board area respectively to obtain the side defect marked PCB material board area and the surface defect marked PCB material board area, and using the side defect marked PCB material board area and the surface defect marked PCB material board area as the defect marked PCB material board area.

[0118] As described in the above steps S301-S303, since the defective position of the material board affects the segmentation and layout of the PCB, it is necessary to mark the area corresponding to the defective position of the material board, and then provide data support for subsequent re-planning. On this basis, the present invention first obtains the corresponding dark stripe depth according to the first dark stripe, and obtains the side defective PCB material board area according to the dark stripe depth and the side stripe crack width. Since it is necessary to cut the surface of the PCB material board when removing the defective part of the PCB material board, the dark stripe depth in the surface represents the width, and the side stripe crack width in the surface represents the length (such as Figure 4 As shown), the area of ​​the PCB material board with side defects is the product of the depth of the dark stripes and the width of the cracks on the side stripes. Then, the area of ​​the PCB material board with surface defects is obtained according to the coordinates of the second origin and the length of the surface cracks, where the coordinates of the second origin are taken as the center of the circle and the length of the surface cracks are taken as the diameter (as shown). Figure 4 As shown), after the defects on the side and the surface are standardized, it can provide an important basis for subsequent re-layout (such as defect path avoidance), and then mark the side defect PCB material board area and the surface defect PCB material board area respectively to obtain the side defect marked PCB material board area and the surface defect marked PCB material board area, and use the side defect marked PCB material board area and the surface defect marked PCB material board area as the defect marked PCB material board area. After knowing the defect marked PCB material board area, it is possible to provide a basis for re-layout of PCB materials that are scrapped due to defects in a targeted manner, so that a large amount of materials can be saved after re-layout and a large amount of waste can be avoided.

[0119] In one embodiment, the step S4 of performing layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain the adapted layout information includes:

[0120] S401, obtaining the actual use area of ​​the PCB material board according to the defective marked PCB material board area;

[0121] S402, based on particle swarm optimization, randomly arranging the preset segmentation required area as particles on the actual use area to obtain multiple layouts, wherein each particle represents a layout of a PCB;

[0122] S403, obtaining corresponding layout characteristic parameters according to the plurality of layout layouts, wherein the layout characteristic parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and sequentially calculating a plurality of fitness comprehensive values ​​according to the plurality of cutting paths, the plurality of layout area utilization rates, the plurality of segmentation safety distances, and the plurality of preset segmentation required area layout quantities, wherein the calculation formula is:

[0123] S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...;

[0124] [L(J) n *C n +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ;

[0125] Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i represents the utilization rate of the i-th layout area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the number of layouts for the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents a counting number, i=1, 2, 3...n;

[0126] S404. Filter the multiple comprehensive suitability values ​​according to the maximum value to obtain a first screening comprehensive suitability value, use the typesetting layout corresponding to the first screening comprehensive suitability value as the optimal typesetting solution, and perform typesetting adaptation on the PCB material board based on the typesetting layout corresponding to the first screening comprehensive suitability value based on CAD to obtain adapted typesetting information.

[0127] As described in the above steps S401-S404, the present invention first obtains the actual use area of ​​the PCB material board according to the area of ​​the defective marked PCB material board, so that the PCB material board can be rearranged and segmented according to the actual use area, and then the preset segmentation requirement area is randomly arranged as particles on the actual use area based on particle swarm optimization to obtain multiple layout layouts, wherein each particle represents a PCB layout layout, wherein the particle swarm optimization algorithm is an optimization method that simulates social behavior, and finds the optimal solution to the problem through information exchange and collaboration between particles. Its simplicity and flexibility make it an effective tool for solving various complex optimization problems. Since multiple factors need to be considered in the process of rearrangement, and each layout scheme corresponds to a set of operation data, usually the operation data includes cutting path, layout area utilization, segmentation safety distance and preset segmentation requirement area layout quantity, so it only needs to find the optimal solution among these factors, and the optimal The solution is the best adaptation scheme, and the screening of the optimal solution is judged by the comprehensive value of suitability. Therefore, the corresponding layout feature parameters are obtained according to the multiple layout layouts, wherein the layout feature parameters include multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances and multiple preset segmentation requirement area layout quantities, and multiple comprehensive suitability values ​​are calculated in turn according to the multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances and multiple preset segmentation requirement area layout quantities, and then the multiple comprehensive suitability values ​​are screened according to the maximum value to obtain a first screened comprehensive suitability value, and the layout layout corresponding to the first screened comprehensive suitability value is used as the optimal layout scheme, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screened comprehensive suitability value based on CAD to obtain adapted layout information, so that the best segmentation scheme can be provided for the PCB material board through the adapted layout information.

[0128] In one embodiment, the step S5 of cutting and typesetting the PCB material board according to the adapted typesetting information includes:

[0129] S501, acquiring corresponding multiple first preset segmentation required areas according to the adaptive layout information;

[0130] S502: Obtain a corresponding first cutting path according to the adaptation layout information, and perform cutting and layout processing on the PCB material board according to the first cutting path for the plurality of first preset segmentation required areas.

[0131] As described in the above steps S501-S502, the present invention first obtains the corresponding multiple first preset segmentation required areas according to the adaptive layout information, and then obtains the corresponding first cutting path according to the adaptive layout information, and cuts and lays out the multiple first preset segmentation required areas on the PCB material board according to the first cutting path. In this way, the defective PCB material board can be reused after the re-layout of the PCB material board, and the problem of causing a large amount of material board waste can also be avoided.

[0132] The present application also provides a PCB cutting and layout system, including:

[0133] A first acquisition module is used to acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas;

[0134] A second acquisition module is used to acquire the material board area and material board appearance feature information according to the material board image information, and acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity;

[0135] A first judgment module is used to judge whether the PCB board quality index is greater than a preset PCB board quality index;

[0136] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area;

[0137] The first layout module is used to layout and adapt the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information;

[0138] The first processing module is used to perform cutting and layout processing on the PCB material board according to the adapted layout information.

[0139] In one embodiment, the second acquisition module includes:

[0140] a first acquisition unit, configured to grayscale the sheet image information to obtain black-and-white surface image information, filter the black-and-white surface image information to obtain black stripes, respectively set coordinates at both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes according to the first coordinates and the second coordinates, and obtain a corresponding first weight value according to the surface crack length;

[0141] A second acquisition unit is used to transmit a plurality of acoustic wave pulse signals to the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, acquire the surface crack depth according to the plurality of rebound signals, and acquire a corresponding second weight value according to the surface crack depth;

[0142] a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire a corresponding third weight value according to the appearance crack width;

[0143] A fourth acquisition unit, configured to acquire a preset crack length judgment threshold according to the surface crack length;

[0144] A fifth acquisition unit, configured to acquire a preset crack depth judgment threshold according to the surface crack depth;

[0145] A sixth acquisition unit, configured to acquire a preset crack width judgment threshold according to the surface crack width;

[0146] A first calculation unit is used to calculate the surface integrity according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is:

[0147]

[0148] Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value;

[0149] a seventh acquisition unit, configured to acquire a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and the side flatness, wherein a side integrity calculation method is the same as a surface integrity calculation method;

[0150] An eighth acquisition unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity;

[0151] A ninth acquisition unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity;

[0152] The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is:

[0153] s(c)=[B(M)*a+C(D)*b]*100%;

[0154] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0155] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned method for PCB cutting and typesetting are implemented.

[0156] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0157] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0158] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A PCB cutting and layout method, characterized in that: include: Acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas; Acquire the material board area and material board appearance feature information according to the material board image information, acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity; Determine whether the PCB board quality index is greater than a preset PCB board quality index; If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area; Based on CAD, multiple preset segmentation required areas are matched with defect-marked PCB material areas to obtain matching layout information; The PCB material board is cut and laid out according to the adapted layout information.

2. The PCB cutting and layout method according to claim 1, characterized in that: The step of obtaining the surface integrity and the side integrity according to the appearance feature information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity comprises: Grayscale processing is performed on the image information of the material plate to obtain black and white surface image information, and the black and white surface image information is screened to obtain black stripes, coordinates are respectively set for both ends of the black stripes to obtain first coordinates and second coordinates, and the surface crack length of the black stripes is calculated according to the first coordinates and the second coordinates, and a corresponding first weight value is obtained according to the surface crack length; Based on the sonic scanner, a plurality of sonic pulse signals are emitted to the black stripes, and a plurality of rebound signals returned after the sonic pulse signals hit the black stripes are received, the surface crack depth is obtained according to the plurality of rebound signals, and the corresponding second weight value is obtained according to the surface crack depth; Acquire the contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between the openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire the corresponding third weight value according to the appearance crack width; Obtaining a preset crack length judgment threshold according to the surface crack length; Obtaining a preset crack depth judgment threshold according to the surface crack depth; Obtaining a preset crack width judgment threshold according to the surface crack width; The surface integrity is calculated according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is: Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value; Acquire a first dark stripe and side flatness of the PCB side according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and side flatness, wherein the side integrity is calculated in the same manner as the surface integrity; Acquire a corresponding surface integrity weight value according to the surface integrity; Acquire a corresponding aspect integrity weight value according to the aspect integrity; The PCB board quality index is calculated according to the surface integrity and the side integrity, wherein the calculation formula is: s(c)=[B(M)*a+C(D)*b]*100%; Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

3. The PCB cutting and layout method according to claim 1, characterized in that: The step of obtaining the defect position information of the material sheet according to the appearance feature information of the material sheet comprises: Acquire a plurality of first corner fixed-point coordinates corresponding to the sheet area, and select one of the plurality of first corner fixed-point coordinates as the first origin coordinate; Obtaining a corresponding first center point according to the black stripes, and obtaining a first coordinate of the first center point according to the first origin coordinates and the first center point; Acquire a plurality of corresponding second corner fixed point coordinates according to the side surface area, and select one of the plurality of second corner fixed point coordinates as the second origin coordinate; Acquire a corresponding second center point according to the first dark stripe, and acquire a second coordinate of the second center point according to the second origin coordinates and the second center point; The position information corresponding to the first coordinate and the second coordinate is used as the sheet material defect position information.

4. The PCB cutting and layout method according to claim 1, characterized in that: The step of marking the sheet area according to the sheet defect position information to obtain the defect marked PCB sheet area comprises: According to the first dark stripe, the corresponding dark stripe depth is obtained, and according to the dark stripe depth and the side stripe crack width, the side defective PCB material board area is obtained; Obtain the surface defective PCB material board area according to the second origin coordinate and the surface crack length, wherein the second origin coordinate is used as the center of the circle and the surface crack length is used as the diameter; The side defect PCB material board area and the surface defect PCB material board area are marked respectively to obtain the side defect marked PCB material board area and the surface defect marked PCB material board area, and the side defect marked PCB material board area and the surface defect marked PCB material board area are used as the defect marked PCB material board area.

5. The PCB cutting and layout method according to claim 1, characterized in that: The step of performing layout adaptation on the plurality of preset segmentation requirement areas and the defective marked PCB material board area based on CAD to obtain the adapted layout information comprises: Obtain the actual use area of ​​the PCB board according to the defect marked PCB board area; Based on particle swarm optimization, the preset segmentation required area is randomly arranged as particles on the actual use area to obtain multiple layouts, wherein each particle represents a layout of the PCB; According to the plurality of layout layouts, corresponding layout characteristic parameters are obtained, wherein the layout characteristic parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and according to the plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, a plurality of fitness comprehensive values ​​are calculated in sequence, wherein the calculation formula is: S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...; [L(J) n *C n +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ; Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i represents the utilization rate of the i-th layout area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the number of layouts for the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents a counting number, i=1, 2, 3...n; The multiple comprehensive suitability values ​​are screened according to the maximum value to obtain a first screening comprehensive suitability value, the layout corresponding to the first screening comprehensive suitability value is used as the optimal layout solution, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value to obtain adapted layout information.

6. The PCB cutting and layout method according to claim 1, characterized in that: The step of cutting and typesetting the PCB material board according to the adapted typesetting information comprises: Acquire a plurality of corresponding first preset segmentation required areas according to the adaptive layout information; A corresponding first cutting path is acquired according to the adaptation layout information, and a plurality of the first preset segmentation required areas are cut and laid out on the PCB material board according to the first cutting path.

7. A PCB cutting and layout system, characterized in that: include: A first acquisition module is used to acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas; A second acquisition module is used to acquire the material board area and material board appearance feature information according to the material board image information, and acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity; A first judgment module is used to judge whether the PCB board quality index is greater than a preset PCB board quality index; If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area; The first layout module is used to layout and adapt the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information; The first processing module is used to perform cutting and layout processing on the PCB material board according to the adapted layout information.

8. The PCB cutting and layout system according to claim 7, characterized in that: The second acquisition module includes: a first acquisition unit, configured to grayscale the sheet image information to obtain black-and-white surface image information, filter the black-and-white surface image information to obtain black stripes, respectively set coordinates at both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes according to the first coordinates and the second coordinates, and obtain a corresponding first weight value according to the surface crack length; A second acquisition unit is used to transmit a plurality of acoustic wave pulse signals to the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, acquire the surface crack depth according to the plurality of rebound signals, and acquire a corresponding second weight value according to the surface crack depth; a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire a corresponding third weight value according to the appearance crack width; A fourth acquisition unit, configured to acquire a preset crack length judgment threshold according to the surface crack length; A fifth acquisition unit, configured to acquire a preset crack depth judgment threshold according to the surface crack depth; A sixth acquisition unit, configured to acquire a preset crack width judgment threshold according to the surface crack width; A first calculation unit is used to calculate the surface integrity according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is: Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value; a seventh acquisition unit, configured to acquire a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and the side flatness, wherein a side integrity calculation method is the same as a surface integrity calculation method; An eighth acquisition unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity; A ninth acquisition unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity; The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is: s(c)=[B(M)*a+C(D)*b]*100%; Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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