Aluminum-based copper-clad plate adhesive layer coating equipment and coating method thereof
By designing the straightening removal, glue coating, shaking and forming mechanism of aluminum-based copper clad coated glue coating equipment, the problem of dust pollution on the surface of aluminum-based copper clad coated board is solved, uniform coating and molding of glue is achieved, and coating is improved quality.
Patent Information
- Application Number
- CN202510000145.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-02
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2045-01-02
AI Technical Summary
The existing aluminum-based copper clad rubber layer coating equipment is prone to cause dust to adsorb the surface of aluminum-based copper clad in factory environment, and the direct coating of the glue layer will contaminate and affect the coating quality.
An aluminum-based copper clad rubber layer coating equipment is designed, including a straightening and cleaning mechanism, a glue coating mechanism, a shaking mechanism and a forming mechanism. The dust is removed by straightening and cleaning mechanism, the glue coating mechanism is evenly applied to the glue, the shaking mechanism prevents the glue from being glued, and the molding mechanism blows the glue dry.
It effectively avoids dust pollution, realizes uniform coating and molding of glue, and improves the quality of aluminum-based copper clad rubber layer coating.
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Figure CN119387113A_ABST
Abstract
Citation Information
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