High-temperature belleville spring and thermal forming process thereof

Abstract

The invention relates to a high-temperature belleville spring thermal forming process, which relates to the technical field of belleville spring production, and comprises the following steps: a heating step: heating a blank; in the pressing step, the heated blank is placed between an upper die and a lower die, and the blank is pressed through cooperation of the upper die and the lower die; a displacement step: moving the position of the blank; a repeating step, namely repeating the pressing step and the shifting step for a plurality of times; and heat preservation is conducted, specifically, the temperature of the upper mold and the temperature of the lower mold are adjusted to be within the standard range. The die has the advantage of being capable of reducing the probability of die deformation.

Description

Technical Field

[0001] The present application relates to the technical field of disc spring production, and in particular to a high-temperature disc spring and a hot forming process thereof. Background Art

[0002] Disc springs need to be heated and pressed during production to obtain products that meet standards. However, during the use of existing molds, due to the heat of the product itself, the heat is transferred to the mold. During repeated heating and cooling, the mold will deform after long-term use, which will lead to increased errors in the produced products and reduced yield. Summary of the invention

[0003] In view of the deficiencies in the prior art, one of the purposes of the present application is to provide a high-temperature disc spring and a hot forming process thereof, which have the advantage of being able to reduce the probability of mold deformation.

[0004] The above-mentioned purpose of the present application is achieved through the following technical solutions:

[0005] A high-temperature disc spring hot forming process includes the following steps: a heating step, heating a blank; a pressing step, placing the heated blank between an upper die and a lower die, and pressing the blank by the cooperation of the upper die and the lower die; a shifting step, moving the blank; a repeating step, repeating the pressing step and the shifting step for several times; and a heat preservation step, adjusting the temperature of the upper die and the lower die so that the temperature is within a standard range.

[0006] By adopting the above technical solution, during the production process, the temperatures of the upper mold and the lower mold are adjusted so that the temperatures of the upper mold and the lower mold are within the range, thereby reducing repeated heating and cooling of the mold, thereby reducing the probability of deformation of the mold after long-term use.

[0007] In a preferred example, the present application can be further configured as follows: both the upper mold and the lower mold are provided with a heat-conducting cavity, and the heat-conducting cavity is used to accommodate a heat-conducting medium.

[0008] By adopting the above technical solution, the existence of the heat-conducting cavity for accommodating the heat-conducting medium makes the temperatures of the upper mold and the lower mold more stable.

[0009] In a preferred example, the present application can be further configured as follows: the upper mold is provided with an upper inlet and an upper outlet both connected to the heat-conducting cavity on the upper mold, the lower mold is provided with a lower outlet and a lower inlet both connected to the heat-conducting cavity on the lower mold, the upper inlet is used to be connected to the lower outlet, and the upper outlet is used to be connected to the lower inlet.

[0010] By adopting the above technical solution, since the product is placed on the lower mold, the temperature of the lower mold will be slightly higher than that of the upper mold. Therefore, the heat conduction cavity of the upper mold is connected to the heat conduction cavity of the lower mold, thereby achieving the purpose of temperature adjustment.

[0011] In a preferred example, the present application can be further configured as follows: a one-way valve 1 is provided at both the upper inlet and the lower inlet, and the one-way valve 1 is unidirectionally conductive toward the heat conduction cavity; a one-way valve 2 is provided at both the upper outlet and the lower outlet, and the one-way valve 2 is unidirectionally conductive toward the outside.

[0012] By adopting the above technical solution, the presence of the one-way valve can reduce the probability of liquid leakage in the heat transfer cavity.

[0013] In a preferred example, the present application can be further configured as follows: a pressure relief port and a pressure boosting port are also provided on the upper mold, and both the pressure relief port and the pressure boosting port are connected to the heat conduction cavity on the upper mold.

[0014] By adopting the above technical solution, the existence of the pressure-increasing port and the pressure-releasing port enables the heat-conducting medium in the heat-conducting cavity on the upper mold and the heat-conducting cavity on the lower mold to flow faster.

[0015] In a preferred example, the present application can be further configured as follows: in the heat preservation step, it includes a temperature obtaining step and a temperature adjustment step. In the temperature obtaining step, the temperature in the heating chamber is obtained. When the temperature of the heating chamber on the lower mold does not meet the standard, the temperature adjustment step is entered. In the temperature adjustment step, the heating chamber on the upper mold is pressurized to increase the pressure in the heating chamber on the upper mold, thereby allowing the heat-conducting medium to enter the heating chamber on the lower mold, and the heat-conducting medium in the heating chamber on the lower mold is replaced.

[0016] By adopting the above technical solution, during use, the temperature is detected, and when the temperature does not meet the standard, the heat transfer medium is replaced.

[0017] In a preferred example, the present application can be further configured as follows: in the pressing step, the number of executions of the displacement step of the current blank is obtained, and the pressing time is adjusted according to the number of executions.

[0018] By adopting the above technical solution, that is, in production, the blank needs to be pressed multiple times, and the blank is replaced once each time it is pressed. Different pressing times are used for different times, so that a good forming effect can be achieved on the blank.

[0019] In a preferred example, the present application can be further configured as follows: in the temperature adjustment step, the number of executions of the displacement step of the current blank is obtained, and the temperature of the heat-conducting medium that enters the heating cavity on the upper mold through pressurization is adjusted according to the number of executions.

[0020] By adopting the above technical solution, at different pressing times, since the duration is inconsistent, the temperature can be adjusted by confirming the pressing duration, thereby achieving a good adjustment effect.

[0021] The present application also discloses a high-temperature disc spring, which is obtained by adopting the above-mentioned high-temperature disc spring hot forming process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the cross-sectional structure of the mold of this application.

[0023] Figure numerals: 1, upper die; 11, upper outlet; 12, upper inlet; 2, lower die; 21, lower inlet; 22, lower outlet; 3, heat transfer cavity; 31, B cavity; 32, A cavity; 4, insertion tube; 5, blank. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings.

[0025] Reference Figure 1 , a high-temperature disc spring hot forming process disclosed in the present application, including the following steps: a heating step, heating the blank 5; a pressing step, placing the heated blank 5 between the upper die 1 and the lower die 2, obtaining the number of executions of the displacement step of the current blank 5, and adjusting the pressing time according to the number of executions, and pressing the blank 5 by the cooperation of the upper die 1 and the lower die 2; a displacement step, moving the position of the blank 5; a repeating step, repeating the pressing step and the displacement step several times; a heat preservation step, adjusting the temperature of the upper die 1 and the lower die 2 so that the temperature is within the standard range. For example, in the repeating step, the pressing step is repeated twice and the displacement step is repeated once, for example, the first pressing is 15 seconds, the first displacement (rotating the blank 5 180°), the first repeated pressing is 20 seconds, the first repeated displacement (rotating the blank 5 180°); the second repeated pressing is 90 seconds.

[0026] The upper mold 1 and the lower mold 2 are both provided with a heat-conducting cavity 3, and the heat-conducting cavity 3 is used to accommodate a heat-conducting medium. The upper mold 1 is provided with an upper inlet 12 and an upper outlet 11 both connected to the heat-conducting cavity 3 on the upper mold 1. The heat-conducting cavity 3 on the upper mold 1 is divided into an A cavity 32 and a B cavity 31 that are not connected to each other. The upper mold 1 is also provided with a pressure relief port and a pressure boost port. The pressure relief port is connected to the A cavity 32, and the pressure boost port is connected to the B cavity 31. The lower mold 2 is provided with a lower outlet 22 and a lower inlet 21 both connected to the heat-conducting cavity 3 on the lower mold 2. The upper inlet 12 is used to be connected to the lower outlet 22, and the upper inlet 11 is used to be connected to the lower outlet 22. 2 or the lower outlet 22 can be provided with an insertion tube 4, for example, an insertion tube 4 is provided at the upper inlet 12, and the insertion tube 4 is used to be inserted into the lower outlet 22, and a rubber sealing ring is provided on the surface of the insertion tube 4 for sealing connection with the lower outlet 22, and the scheme for the upper outlet 11 to be connected with the lower inlet 21 is the same as the connection scheme of the upper outlet 11 and the lower inlet 21, and a one-way valve 1 is provided at the upper inlet 12 and the lower inlet 21, and the one-way valve 1 is unidirectionally conducted toward the heat conduction cavity 3, and a one-way valve 2 is provided at the upper outlet 11 and the lower outlet 22, and the one-way valve 2 is unidirectionally conducted toward the outside. In order to ensure the strength of the mold, a supporting structure, such as a supporting beam, a supporting column, etc., can be provided in the heat conduction cavity 3.

[0027] The heat preservation step includes a temperature obtaining step and a temperature adjustment step. In the temperature obtaining step, the temperature in the heating chamber is obtained. When the temperature of the heating chamber on the lower mold 2 does not meet the standard, the temperature adjustment step is entered. In the temperature adjustment step, the number of executions of the displacement step of the current blank 5 is obtained, and the temperature of the heat-conducting medium that enters the heating chamber on the upper mold 1 by pressurization is adjusted according to the number of executions. The heat-conducting medium is poured into the heating chamber on the upper mold 1 through the pressurization port to pressurize the heating chamber on the upper mold 1, so that the pressure in the heating chamber on the upper mold 1 is increased, thereby allowing the heat-conducting medium to enter the heating chamber on the lower mold 2, and the heat-conducting medium in the heating chamber on the lower mold 2 is replaced. The heat-conducting medium of the lower mold 2 enters the heat-conducting chamber 3 of the upper mold 1 under the action of pressure. In actual use, for example, the heat transfer medium is heat transfer oil. When the heat transfer oil is circulated, gas is injected into the B cavity 31 through the boost port to increase the pressure of the B cavity 31. Under the action of pressure, the liquid in the B cavity 31 will flow to the heat transfer cavity 3 in the lower mold 2. Since the temperature in the heat transfer cavity 3 in the lower mold 2 is greater than the temperature in the heat transfer cavity 3 in the upper mold 1, the high-temperature heat transfer medium in the heat transfer cavity 3 in the lower mold 2 will flow into the A cavity 32. Due to the presence of the pressure relief hole, the heat transfer medium in the A cavity 32 will be partially discharged, and this part of the heat transfer medium will be collected and injected into the B cavity 31 through the pipeline.

[0028] The present application also discloses a high-temperature disc spring, which is prepared by the above process.

[0029] The implementation principle of this embodiment is: by regulating the temperature of the mold, the probability of deformation of the mold during long-term use is reduced.

[0030] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high temperature disc spring hot forming process, characterized in that: The method comprises the following steps: a heating step, heating the blank (5); a pressing step, placing the heated blank (5) between an upper die (1) and a lower die (2), and pressing the blank (5) by the cooperation of the upper die (1) and the lower die (2); a shifting step, moving the position of the blank (5); a repeating step, repeating the pressing step and the shifting step for several times; and a heat preservation step, adjusting the temperature of the upper die (1) and the lower die (2) so that the temperature is within a standard range.

2. A high temperature disc spring hot forming process according to claim 1, characterized in that: The upper mold (1) and the lower mold (2) are both provided with a heat-conducting cavity (3), and the heat-conducting cavity (3) is used to accommodate a heat-conducting medium.

3. A high temperature disc spring hot forming process according to claim 2, characterized in that: The upper mold (1) is provided with an upper inlet (12) and an upper outlet (11) both connected to the heat-conducting cavity (3) on the upper mold (1); the lower mold (2) is provided with a lower outlet (22) and a lower inlet (21) both connected to the heat-conducting cavity (3) on the lower mold (2); the upper inlet (12) is used to be connected to the lower outlet (22), and the upper outlet (11) is used to be connected to the lower inlet (21).

4. A high temperature disc spring hot forming process according to claim 3, characterized in that: A one-way valve (1) is provided at the upper inlet (12) and the lower inlet (21), and the one-way valve (1) is unidirectionally conducted toward the heat transfer cavity (3). A one-way valve (2) is provided at the upper outlet (11) and the lower outlet (22), and the one-way valve (2) is unidirectionally conducted toward the outside.

5. A high temperature disc spring hot forming process according to claim 4, characterized in that: The upper die (1) is also provided with a pressure relief port and a pressure boost port, and both the pressure relief port and the pressure boost port are connected to the heat conduction cavity (3) on the upper die (1).

6. A high temperature disc spring hot forming process according to claim 5, characterized in that: The heat preservation step includes a temperature obtaining step and a temperature adjustment step. In the temperature obtaining step, the temperature in the heating chamber is obtained. When the temperature of the heating chamber on the lower mold (2) does not meet the standard, the temperature adjustment step is entered. In the temperature adjustment step, the heating chamber on the upper mold (1) is pressurized so that the pressure in the heating chamber on the upper mold (1) increases, thereby allowing the heat-conducting medium to enter the heating chamber on the lower mold (2), and the heat-conducting medium in the heating chamber on the lower mold (2) is replaced.

7. A high temperature disc spring hot forming process according to claim 6, characterized in that: In the pressing step, the number of executions of the displacement step of the current blank (5) is obtained, and the pressing time is adjusted according to the number of executions.

8. The high temperature disc spring hot forming process according to claim 7, characterized in that: In the temperature adjustment step, the number of executions of the displacement step of the current blank (5) is obtained, and the temperature of the heat-conducting medium that enters the heating cavity on the upper mold (1) by pressurization is adjusted according to the number of executions.

9. A high temperature disc spring, characterized in that: It is obtained by a high-temperature disc spring hot forming process as described in any one of claims 1-8.

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