Annealing parameter setting method and device for bonding wire production

Abstract

The invention relates to the technical field of bonding wire production, in particular to an annealing parameter setting method and device for bonding wire production. Acquiring a target tensile strength and a target elongation (acquiring corresponding annealing parameters according to the initial tensile strength, the elongation, the target tensile strength and the elongation); determining a preset annealing temperature and a preset annealing speed based on the established annealing parameter selection strategy; the bonding wire sample is subjected to annealing treatment according to the preset annealing temperature and the preset annealing speed, a bonding wire finished product is obtained, and when the measured actual tensile strength and actual elongation of the bonding wire finished product reach the requirements of the target tensile strength and target elongation, the bonding wire is obtained. And taking the preset annealing temperature and the preset annealing speed as actual annealing parameters for batch production of the bonding wires. Therefore, the annealing parameters corresponding to the target tensile strength and the target elongation can be quickly found through the established annealing parameter selection strategy, and the bonding wire product performance is accurately controlled while the bonding wire production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of bonding wire production, and in particular to a method and device for setting annealing parameters for bonding wire production. Background Art

[0002] Bonding wire is a metal wire used to achieve electrical interconnection in semiconductor devices and integrated circuit assembly. For example, it acts as a bridge in the chip packaging process to connect the chip to the external circuit or other chips, so that an electrical circuit can be formed between the chips, ensuring signal transmission and current conduction, thereby realizing the normal function of the semiconductor device. Among them, in the production process of bonding wire, the selection of annealing parameters has an important influence on the processing performance and final use performance of the material. Online annealing of bonding wire can generally be divided into intermediate annealing and final annealing. Intermediate annealing can eliminate work hardening and increase the subsequent machinability of the material. At the same time, selecting appropriate annealing parameters can improve the mechanical and electrical properties of the bonding wire, thereby improving the reliability and service life of the product.

[0003] The online annealing of bonding wires includes two parameters: annealing temperature and annealing speed. Currently, the target breaking force and elongation are obtained by changing the annealing temperature or annealing speed mainly through experimental methods. This method is costly and time-consuming, and affects the production efficiency of the product. Summary of the invention

[0004] In order to overcome the deficiencies in the prior art, the present application provides a method and device for setting annealing parameters for bonding wire production, which can quickly set the annealing temperature and annealing speed according to the target performance of the bonding wire, thereby improving production efficiency.

[0005] In a first aspect, the present application provides a method for setting annealing parameters for bonding wire production, the method comprising the following steps:

[0006] Selecting a bonding wire sample that has not been annealed, and measuring the initial breaking force and initial elongation of the bonding wire sample, and obtaining the target breaking force and target elongation of the bonding wire sample after annealing;

[0007] Determine the preset annealing temperature and the preset annealing speed when the bonding wire sample is annealed based on the established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed to represent the mapping relationship between the target breaking force, the target elongation, the bonding wire diameter, the initial breaking force, the preset annealing temperature, and the preset annealing speed;

[0008] Annealing the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measuring an actual breaking force and an actual elongation of the finished bonding wire;

[0009] If a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range, the preset annealing temperature and the preset annealing speed are used as actual annealing parameters for batch production of bonding wires.

[0010] In a possible implementation, the established annealing parameter selection strategy includes a first relational expression for representing a mapping relationship between a target breaking force, a bonding wire diameter, an initial breaking force, a preset annealing temperature, and a preset annealing speed, and a second relational expression for representing a mapping relationship between a target elongation, a bonding wire diameter, an initial breaking force, a preset annealing temperature, and a preset annealing speed, wherein the first relational expression and the second relational expression are as follows:

[0011]

[0012] F b is the target breaking force, is the bonding wire diameter, F0 is the initial breaking force, T is the annealing temperature, V is the annealing speed, and E is the target elongation.

[0013] In a possible implementation manner, the bonding wire diameter of the bonding wire sample is 15~50μm.

[0014] In a possible implementation manner, the breaking force and elongation of the bonding wire sample or the finished bonding wire are measured in the following manner, including the following steps:

[0015] Fixing the bonding wire sample or the finished bonding wire product in a fixture of a tensile testing machine equipped with an extensometer according to a set gauge length;

[0016] Applying tension to the bonding wire sample or the bonding wire finished product based on the tensile testing machine according to a set tensile speed;

[0017] The tensile force value and the length change of the gauge section when the bonding wire sample or the finished bonding wire is broken are recorded, and the tensile force value is used as the measured breaking force, and the elongation is calculated according to the length change and the set gauge length.

[0018] In a possible implementation manner, the gauge length is set to 100 mm, and the stretching speed is set to 10 mm / min.

[0019] In a possible implementation, the method further includes the following steps:

[0020] If a first error between the actual breaking force and the target breaking force is not within a set first error range, or a second error between the actual elongation and the target elongation is not within a set second error range, fine-tuning the preset annealing temperature and / or the preset annealing speed;

[0021] The bonding wire sample is annealed according to the fine-tuned preset annealing temperature and the preset annealing speed until a first error between an actual breaking force of the obtained bonding wire product and the target breaking force is within a set first error range, and a second error between an actual elongation and the target elongation is within a set second error range, and the fine-tuned preset annealing temperature and the preset annealing speed are used as actual annealing parameters for mass production of bonding wires.

[0022] In a possible implementation, the preset annealing temperature is fine-tuned in a range of 200 to 600° C. according to a set step and / or the preset annealing speed is fine-tuned in a range of 20 to 160 m / min according to a set step; the step of fine-tuning the preset annealing temperature is 2 to 5° C., and the step of fine-tuning the preset annealing speed is 5 to 20 m / min.

[0023] In a second aspect, the present application provides an annealing parameter setting device for bonding wire production, the device comprising:

[0024] A selection module, used for selecting a bonding wire sample that has not been annealed, measuring an initial breaking force and an initial elongation of the bonding wire sample, and obtaining a target breaking force and a target elongation of the bonding wire sample after annealing;

[0025] A preset module, used to determine a preset annealing temperature and a preset annealing speed when the bonding wire sample is annealed based on an established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed with a mapping relationship between a target breaking force, a target elongation, a bonding wire diameter, an initial breaking force, an annealing temperature, and an annealing speed;

[0026] A measuring module, configured to anneal the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measure an actual breaking force and an actual elongation of the finished bonding wire;

[0027] A determination module is used to use the preset annealing temperature and the preset annealing speed as actual annealing parameters for batch production of bonding wires if a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range.

[0028] In a third aspect, the present application provides an electronic device, comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the steps of the annealing parameter setting method for bonding wire production as described in any one of the first aspects are performed.

[0029] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the annealing parameter setting method for bonding wire production as described in any one of the first aspects are executed.

[0030] The present embodiment provides an annealing parameter setting method and device for bonding wire production, which selects a bonding wire sample that has not been annealed, and measures the initial breaking force and initial elongation of the bonding wire sample, and obtains the target breaking force and target elongation of the bonding wire sample after annealing; determines the preset annealing temperature and preset annealing speed when the bonding wire sample is annealed based on the established annealing parameter selection strategy; anneals the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measures the actual breaking force and actual elongation of the finished bonding wire; if the first error between the actual breaking force and the target breaking force is within the set first error range, and the second error between the actual elongation and the target elongation is within the set second error range, the preset annealing temperature and the preset annealing speed are used as the actual annealing parameters for batch production of bonding wires. Thus, through the established annealing parameter selection strategy, the annealing parameters corresponding to the target breaking force and target elongation can be quickly found, while improving the production efficiency of the bonding wire and the consistency of product performance. This method not only reduces the number of trial and error, saves time and cost, but also ensures the stability and reliability of the breaking force and elongation of each batch of bonding wires produced, meeting the needs of high-quality production. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A flow chart of an annealing parameter setting method for bonding wire production according to an embodiment of the present application is shown;

[0033] Figure 2A flow chart showing the measurement of breaking force and elongation of the bonding wire sample according to an embodiment of the present application is shown;

[0034] Figure 3 A schematic structural diagram of an annealing parameter setting device for bonding wire production according to an embodiment of the present application is shown;

[0035] Figure 4 A structural block diagram of an electronic device described in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0036] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the drawings in the present application only serve the purpose of explanation and description and are not used to limit the scope of protection of the present application. In addition, it should be understood that the schematic drawings are not drawn in real proportion. The flowchart used in this application shows the operations implemented according to some embodiments of the present application. It should be understood that the operations of the flowchart can be implemented out of sequence, and the steps without logical context can be reversed in order or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart under the guidance of the content of the present application, or remove one or more operations from the flowchart.

[0037] In addition, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0038] It should be noted that the term "comprising" will be used in the embodiments of the present application to indicate the existence of the features declared thereafter, but does not exclude the addition of other features.

[0039] In view of the problems raised by the background technology, the present application provides an annealing parameter setting method and device for bonding wire production, which can quickly set the annealing temperature and annealing speed according to the target performance of the bonding wire, thereby improving production efficiency.

[0040] In one embodiment, see the attached specification Figure 1 The present application provides a method for setting annealing parameters for bonding wire production, the method comprising the following steps:

[0041] S1. Select a bonding wire sample that has not been annealed, measure the initial breaking force and initial elongation of the bonding wire sample, and obtain a target breaking force and target elongation of the bonding wire sample after annealing;

[0042] S2. Determine a preset annealing temperature and a preset annealing speed for annealing the bonding wire sample based on an established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed with a mapping relationship between a target breaking force, a target elongation, a bonding wire diameter, an initial breaking force, a preset annealing temperature, and a preset annealing speed;

[0043] S3, annealing the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measuring the actual breaking force and actual elongation of the finished bonding wire;

[0044] S4. If a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range, the preset annealing temperature and the preset annealing speed are used as actual annealing parameters for batch production of bonding wires.

[0045] Specifically, in step S1, the bonding wire sample that has not been annealed refers to a thin wire formed by processes such as intermediate alloy smelting, continuous casting, and diameter reduction drawing in the bonding wire production process. The intermediate alloy smelting is to put the prepared high-purity gold raw material and other alloy element raw materials that may be needed into a high-temperature vacuum melting furnace and smelt them under specific temperature and atmosphere conditions; the continuous casting is to put the smelted intermediate alloy and gold raw material into a continuous casting furnace according to a preset ratio, and melt, stir, cool, and cast under the protection of inert gas to form a casting with good internal and surface quality; the diameter reduction drawing is to pass the casting through a series of gradually smaller drawing dies, and gradually reduce the diameter under the action of tension to form a bonding wire of the required size. Since the bonding wire will produce certain stress and deformation during the drawing process, in order to eliminate these stresses and improve the performance of the bonding wire, it is necessary to perform annealing treatment later to finally generate a bonding wire that achieves the target performance (in this application, the target performance specifically refers to the target breaking force and the target elongation). Among them, the bonding wire production process should be a technical means well known to technicians in this field and will not be elaborated here.

[0046] In the embodiment of the present application, the diameter range of the bonding wire sample is limited to 15 to 50 μm. The selection of this diameter range is based on process requirements and actual application scenarios. A thinner diameter helps to adapt to higher packaging density in microelectronic devices, and can better control grain refinement and mechanical property improvement during annealing.

[0047] In addition, in step S1, the reason for measuring the initial breaking force and initial elongation of the bonding wire sample is to prepare for the subsequent determination of annealing parameters when the bonding wire sample is annealed. Figure 2 , measuring the breaking force and elongation of the bonding wire sample in the following manner, comprising the following steps:

[0048] P1. Fixing the bonding wire sample in a fixture of a tensile testing machine equipped with an extensometer according to a set gauge length;

[0049] P2, applying tension to the bonding wire sample based on the tensile testing machine according to a set tensile speed;

[0050] P3. Record the tensile force value when the bonding wire sample is broken and the length change of the gauge length, use the tensile force value as the measured breaking force, and calculate the elongation according to the length change and the set gauge length.

[0051] In step P1, a professional tensile testing machine can be selected to measure the breaking force. The measuring range is selected according to the specifications of the bonding wire and the expected breaking force, and generally it can meet the test requirements. For example, for thinner bonding wires, a tensile testing machine with a small range but high precision is selected; for thicker bonding wires or bonding wires with larger breaking force, a tensile testing machine with a larger range needs to be selected. Among them, a certain length of specimen can be cut from the bonding wire sample to be tested, and the specimen can be fixed in the upper and lower clamps of the tensile testing machine according to the set gauge length, and it is ensured that the clamp clamps the bonding wire, and the axis of the bonding wire coincides with the center line of the clamp to ensure that the tension can be evenly applied to the bonding wire. In addition, the selected tensile testing machine also needs to be equipped with an extensometer for elongation measurement. The extensometer is an important auxiliary equipment for measuring material deformation, and its accuracy and range should match the elongation range of the bonding wire. In this embodiment, after the bonding wire is fixed in the clamp of the tensile testing machine, the extensometer is installed on the gauge section of the bonding wire.

[0052] In step P2 and step P3, the tensile testing machine is driven to apply tension to the bonding wire according to the set tensile speed, and during the test, the tensile force value applied to the bonding wire is recorded in real time, and the length change of the bonding wire gauge section is measured in real time by the extensometer. When the bonding wire is broken, the tensile testing machine automatically stops and records the maximum tensile force value when it is broken. This maximum tensile force value is the breaking force of the bonding wire sample; at the same time, the elongation is calculated based on the original length of the gauge section recorded by the extensometer and the length change after breaking. The calculation formula of the elongation is: Elongation (%) = (gauge length after breaking - original gauge length) / original gauge length × 100%.

[0053] In step S2, the preset annealing temperature and preset annealing speed of the bonding wire sample during annealing are determined by the established annealing parameter selection strategy, so that the breaking force and elongation of the finished bonding wire obtained after annealing can meet the target requirements. Specifically, the established annealing parameter selection strategy includes a first relationship for representing the mapping relationship between the target breaking force, bonding wire diameter, initial breaking force, preset annealing temperature, and preset annealing speed, and a second relationship for representing the mapping relationship between the target elongation, bonding wire diameter, initial breaking force, preset annealing temperature, and preset annealing speed. The first relationship and the second relationship are as follows:

[0054]

[0055] Among them, F b is the target breaking force, is the bonding wire diameter, F0 is the initial breaking force, T is the preset annealing temperature, V is the preset annealing speed, and E is the target elongation.

[0056] In the present application, the annealing parameter selection strategy takes into account the specific materials and production process characteristics of the bonding wire, and is established through a large amount of bonding wire production experimental data, theoretical analysis and combined with symbolic regression fitting. The combination of the first relationship and the second relationship can simultaneously ensure that the breaking force and elongation of the bonding wire reach the expected values. Among them, although the preset annealing temperature and the preset annealing speed calculated by measuring the initial breaking force and initial elongation, as well as the obtained target breaking force and target elongation, can largely ensure that the finished bonding wire generated after annealing can achieve the target performance, it is not necessarily 100%. Therefore, after calculating the preset annealing temperature and the preset annealing speed, the bonding wire cannot be mass-produced according to the parameters, and steps S3 and S4 need to be continued to be executed to verify the calculated preset annealing temperature and preset annealing speed.

[0057] In step S3, when measuring the actual breaking force and actual elongation of the finished bonding wire obtained by annealing according to the preset annealing temperature and the preset annealing speed, the above-mentioned steps P1 to P3 for measuring the breaking force and elongation of the bonding wire sample can be referred to, and the repeated parts will not be repeated. It should be noted that in order to ensure the accuracy and consistency of the measurement results, the gauge length and stretching speed set when measuring the breaking force and elongation of the finished bonding wire are the same as the gauge length and stretching speed set when measuring the breaking force and elongation of the bonding wire sample. For example, the set gauge length is 100mm, and the set stretching speed is 10mm / min.

[0058] In step S4, after measuring the actual breaking force and actual elongation of the finished bonding wire, it is verified whether the preset annealing temperature and the preset annealing speed can be used as actual annealing parameters for mass production of bonding wires by judging whether a first error between the actual breaking force and the target breaking force is within a set first error range, and whether a second error between the actual elongation and the target elongation is within a set second error range.

[0059] For example, the first error range is set to ±2%, and the second error range is set to ±3%. Only when the first error between the actual breaking force and the target breaking force is within ±2%, and the second error between the actual elongation and the target elongation is within ±3%, the preset annealing temperature and the preset annealing speed are used as the actual annealing parameters for batch production of bonding wires. In one embodiment, the selected material is high-purity gold (99.99%), and a gold bonding wire with a diameter of 25 μm is formed through intermediate alloy smelting, continuous casting and diameter reduction drawing. According to the obtained target breaking force of 10.76 g and target elongation of 4.36%, the preset annealing temperature determined for the gold bonding wire by the established annealing parameter selection strategy is 520°C, and the preset annealing speed is 90 m / min. The gold bonding wire is installed on an online annealing device, the furnace length of which is 0.78 m, and it has the function of accurately controlling the annealing temperature and annealing speed. The breaking force of the gold bonding wire after annealing is tested to be 10.94 g, and the elongation is 4.26%. Then the first error = (10.94g-10.76g) / 10.76g*% = 1.67%, which is within the set first error range of ±2%, and the second error = (4.26%-4.36%) / 4.36%*% = -2.29%, which is within the set second error range of ±3%. Therefore, the preset annealing temperature of 520°C and the preset annealing speed of 90m / min calculated by the annealing parameter selection strategy are successfully verified and can be used as actual annealing parameters for mass production of bonding wires.

[0060] In other embodiments, if the first error between the actual breaking force and the target breaking force is not within the set first error range, or the second error between the actual elongation and the target elongation is not within the set second error range, that is, when the preset annealing temperature and the preset annealing speed calculated by the annealing parameter selection strategy fail to be verified, it is necessary to fine-tune the preset annealing temperature and / or the preset annealing speed.

[0061] Generally, as the annealing temperature increases, the breaking force of the bonding wire decreases and the elongation increases; a faster annealing speed is usually beneficial to increase the breaking force but reduce the elongation. Therefore, when the actual breaking force and / or the actual elongation deviate from the expected value, the preset annealing temperature and / or the preset annealing speed can be fine-tuned according to the set steps based on experience. For example, if the actual value of the elongation is slightly lower than the target value, the annealing temperature can be increased or the annealing speed can be decreased by fine-tuning to increase the elongation; if the actual value of the elongation is slightly higher than the target value or the actual value of the breaking force is slightly lower than the target value, the annealing temperature can be decreased or the annealing speed can be increased by fine-tuning to increase the breaking force or reduce the elongation. In one embodiment, the preset annealing temperature is fine-tuned in the range of 200 to 600°C according to the steps of 2 to 5°C. The preset annealing speed is fine-tuned in the range of 20 to 160 m / min according to a step of 5 to 20 m / min; and the bonding wire sample is annealed according to the preset annealing temperature and the preset annealing speed after fine-tuning, until a first error between an actual breaking force of the obtained bonding wire product and the target breaking force is within a set first error range, and a second error between an actual elongation and the target elongation is within a set second error range, and the preset annealing temperature and the preset annealing speed after fine-tuning are used as actual annealing parameters for batch production of bonding wires, and usually fine-tuning once or twice is successful.

[0062] It can be seen that the annealing parameter setting method for bonding wire production provided in this application, compared with the existing technology that relies on experimental methods to change the annealing temperature or annealing speed to obtain the target breaking force and target elongation, can quickly help the operator find the annealing parameters corresponding to the target breaking force and target elongation through the established annealing parameter selection strategy, thereby improving the production efficiency of the bonding wire and achieving precise control of the performance of the bonding wire product.

[0063] Based on the same inventive concept, an annealing parameter setting device for bonding wire production is also provided in an embodiment of the present application. Since the principle of solving the problem by the device in the embodiment of the present application is similar to the above-mentioned annealing parameter setting method for bonding wire production in the embodiment of the present application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0064] As the instruction manual Figure 3 As shown, an annealing parameter setting device for bonding wire production provided in an embodiment of the present application includes:

[0065] A selection module 301 is used to select a bonding wire sample that has not been annealed, and measure the initial breaking force and initial elongation of the bonding wire sample, and obtain the target breaking force and target elongation of the bonding wire sample after annealing;

[0066] A preset module 302 is used to determine a preset annealing temperature and a preset annealing speed when the bonding wire sample is annealed based on an established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed with a mapping relationship between a target breaking force, a target elongation, a bonding wire diameter, an initial breaking force, an annealing temperature, and an annealing speed;

[0067] The measuring module 303 is used to anneal the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measure the actual breaking force and actual elongation of the finished bonding wire;

[0068] The determination module 304 is used to use the preset annealing temperature and the preset annealing speed as actual annealing parameters for batch production of bonding wires if a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range.

[0069] In one embodiment, the established annealing parameter selection strategy includes a first relational expression for representing the mapping relationship between the target breaking force, the bonding wire diameter, the initial breaking force, the annealing temperature, and the annealing speed, and a second relational expression for representing the mapping relationship between the target elongation, the bonding wire diameter, the initial breaking force, the preset annealing temperature, and the preset annealing speed, wherein the first relational expression and the second relational expression are as follows:

[0070]

[0071] F b is the target breaking force, is the wire diameter of the bonding wire, F0 is the initial breaking force, T is the preset annealing temperature, V is the preset annealing speed, and E is the target elongation. 15~40μm.

[0072] In one embodiment, the device measurement module 303 measures the breaking force and elongation of the bonding wire sample or the finished bonding wire, including: fixing the bonding wire sample or the finished bonding wire in a fixture of a tensile testing machine equipped with an extensometer according to a set gauge length; applying tension to the bonding wire sample or the finished bonding wire according to a set tensile speed based on the tensile testing machine; recording the tensile force value and the length change of the gauge section when the bonding wire sample or the finished bonding wire is broken, so as to use the tensile force value as the measured breaking force, and calculating the elongation according to the length change and the set gauge length; wherein the set gauge length is 100 mm, and the set tensile speed is 10 mm / min.

[0073] In one embodiment, the device further comprises:

[0074] A fine-tuning module is used to fine-tune the preset annealing temperature and / or the preset annealing speed if a first error between the actual breaking force and the target breaking force is not within a set first error range, or a second error between the actual elongation and the target elongation is not within a set second error range; anneal the bonding wire sample according to the fine-tuned preset annealing temperature and the preset annealing speed until the first error between the actual breaking force of the obtained bonding wire product and the target breaking force is within the set first error range, and The second error between the actual elongation and the target elongation is within the set second error range, and the fine-tuned preset annealing temperature and the preset annealing speed are used as actual annealing parameters for batch production of bonding wires; wherein, the preset annealing temperature is fine-tuned in the range of 200 to 600°C according to a set step and / or the preset annealing speed is fine-tuned in the range of 20 to 160 m / min according to a set step, the step of fine-tuning the preset annealing temperature is 2 to 5°C, and the step of fine-tuning the preset annealing speed is 5 to 20 m / min.

[0075] The present application provides an annealing parameter setting device for bonding wire production, which selects a bonding wire sample that has not been annealed through a selection module, measures the initial breaking force and initial elongation of the bonding wire sample, and obtains a target breaking force and target elongation of the bonding wire sample after annealing; determines a preset annealing temperature and a preset annealing speed when the bonding wire sample is annealed based on an established annealing parameter selection strategy through a preset module; anneals the bonding wire sample according to the preset annealing temperature and the preset annealing speed through a measuring module to obtain a finished bonding wire, and measures the actual breaking force and actual elongation of the finished bonding wire; if a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range, the preset annealing temperature and the preset annealing speed are used as actual annealing parameters for batch production of bonding wires through a determination module. Therefore, the established annealing parameter selection strategy can quickly find the annealing parameters corresponding to the target breaking force and target elongation, thereby improving the production efficiency of the bonding wire and the consistency of product performance.

[0076] Based on the same concept of the present invention, the specification is attached Figure 4As shown, the structure of an electronic device 400 provided in an embodiment of the present application includes: at least one processor 401, at least one network interface 404 or other user interface 403, a memory 405, and at least one communication bus 402. The communication bus 402 is used to realize the connection and communication between these components. The electronic device 400 optionally includes a user interface 403, including a display (for example, a touch screen, LCD, CRT, holographic imaging (Holographic) or projection (Projector), etc.), a keyboard or a pointing device (for example, a mouse, a trackball (trackball), a touch pad or a touch screen, etc.).

[0077] The memory 405 may include a read-only memory and a random access memory, and provides instructions and data to the processor 401. A portion of the memory 405 may also include a non-volatile random access memory (NVRAM).

[0078] In some implementations, the memory 405 stores the following elements, executable modules or data structures, or a subset thereof, or an extended set thereof:

[0079] Operating system 4051, including various system programs for implementing various basic services and processing hardware-based tasks;

[0080] The application module 4052 includes various application programs, such as a launcher, a media player, a browser, etc., which are used to implement various application services.

[0081] In an embodiment of the present application, by calling a program or instruction stored in the memory 405, the processor 401 is used to execute steps in a method for setting annealing parameters for bonding wire production, and can quickly set the annealing temperature and annealing speed according to the target performance of the bonding wire, thereby improving production efficiency.

[0082] The present application also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps in the annealing parameter setting method for bonding wire production are executed.

[0083] Specifically, the storage medium can be a general storage medium, such as a mobile disk, a hard disk, etc. When the computer program on the storage medium is run, the above-mentioned annealing parameter setting method for bonding wire production can be executed.

[0084] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0085] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0086] In addition, each functional unit in the embodiments provided in the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0087] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, and other media that can store program codes.

[0088] Finally, it should be noted that the above embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the aforementioned embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. They should all be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for setting annealing parameters for bonding wire production, characterized in that: The method comprises the following steps: Selecting a bonding wire sample that has not been annealed, and measuring the initial breaking force and initial elongation of the bonding wire sample, and obtaining the target breaking force and target elongation of the bonding wire sample after annealing; Determine the preset annealing temperature and the preset annealing speed when the bonding wire sample is annealed based on the established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed to represent the mapping relationship between the target breaking force, the target elongation, the bonding wire diameter, the initial breaking force, the preset annealing temperature, and the preset annealing speed; Annealing the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measuring an actual breaking force and an actual elongation of the finished bonding wire; If a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range, the preset annealing temperature and the preset annealing speed are used as actual annealing parameters for batch production of bonding wires.

2. The annealing parameter setting method for bonding wire production according to claim 1, characterized in that: in, The established annealing parameter selection strategy includes a first relational expression for representing the mapping relationship between the target breaking force, the bonding wire diameter, the initial breaking force, the preset annealing temperature, and the preset annealing speed, and a second relational expression for representing the mapping relationship between the target elongation, the bonding wire diameter, the initial breaking force, the preset annealing temperature, and the preset annealing speed. The first relational expression and the second relational expression are as follows: F b The target breaking force; is the bonding wire diameter; F0 is the initial breaking force; T is the preset annealing temperature; V is the preset annealing speed; E is the target elongation.

3. The annealing parameter setting method for bonding wire production according to claim 1, characterized in that: The bonding wire diameter of the bonding wire sample 15~50μm.

4. The annealing parameter setting method for bonding wire production according to claim 1, characterized in that: The initial breaking force and elongation of the bonding wire sample or the finished bonding wire are measured in the following manner, including the following steps: Fixing the bonding wire sample or the finished bonding wire product in a fixture of a tensile testing machine equipped with an extensometer according to a set gauge length; Applying tension to the bonding wire sample or the bonding wire finished product based on the tensile testing machine according to a set tensile speed; The tensile force value and the length change of the gauge section when the bonding wire sample or the finished bonding wire is broken are recorded, and the tensile force value is used as the measured breaking force, and the elongation is calculated according to the length change and the set gauge length.

5. The annealing parameter setting method for bonding wire production according to claim 3, characterized in that: in, The set gauge length is 100 mm, and the set stretching speed is 10 mm / min.

6. The annealing parameter setting method for bonding wire production according to claim 1, characterized in that: The method further comprises the following steps: If a first error between the actual breaking force and the target breaking force is not within a set first error range, or a second error between the actual elongation and the target elongation is not within a set second error range, fine-tuning the preset annealing temperature and / or the preset annealing speed; The bonding wire sample is annealed according to the fine-tuned preset annealing temperature and the preset annealing speed until a first error between an actual breaking force of the obtained bonding wire product and the target breaking force is within a set first error range, and a second error between an actual elongation and the target elongation is within a set second error range, and the fine-tuned preset annealing temperature and the preset annealing speed are used as actual annealing parameters for mass production of bonding wires.

7. The annealing parameter setting method for bonding wire production according to claim 6, characterized in that: in, The preset annealing temperature is fine-tuned in a range of 200 to 600°C according to a set step and / or the preset annealing speed is fine-tuned in a range of 20 to 160 m / min according to a set step; the step of fine-tuning the preset annealing temperature is 2 to 5°C, and the step of fine-tuning the preset annealing speed is 5 to 20 m / min.

8. An annealing parameter setting device for bonding wire production, characterized in that: The device comprises: A selection module, used for selecting a bonding wire sample that has not been annealed, measuring an initial breaking force and an initial elongation of the bonding wire sample, and obtaining a target breaking force and a target elongation of the bonding wire sample after annealing; A preset module, used to determine a preset annealing temperature and a preset annealing speed when the bonding wire sample is annealed based on an established annealing parameter selection strategy; wherein the annealing parameter selection strategy is constructed with a mapping relationship between a target breaking force, a target elongation, a bonding wire diameter, an initial breaking force, an annealing temperature, and an annealing speed; A measuring module, configured to anneal the bonding wire sample according to the preset annealing temperature and the preset annealing speed to obtain a finished bonding wire, and measure an actual breaking force and an actual elongation of the finished bonding wire; A determination module is used to use the preset annealing temperature and the preset annealing speed as actual annealing parameters for batch production of bonding wires if a first error between the actual breaking force and the target breaking force is within a set first error range, and a second error between the actual elongation and the target elongation is within a set second error range.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the annealing parameter setting method for bonding wire production as described in any one of claims 1 to 7 are performed.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the annealing parameter setting method for bonding wire production according to any one of claims 1 to 7 are executed.

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