Probe installation structure and wafer reliability test system

Abstract

The invention relates to the technical field of testing devices, and particularly provides a probe mounting structure and a wafer reliability testing system, the probe mounting structure comprises a tray, a clamping slide and a cover plate, the upper surface of the tray is provided with a groove, a plurality of mounting holes penetrating along the thickness direction are arranged in the groove in an array manner, and the surface of the clamping slide is provided with a plurality of clamping holes penetrating along the thickness direction. A plurality of butt joint holes penetrating in the thickness direction are formed in the surface of the cover plate in an array mode, the clamping slide glass can be installed in the groove in an embedded mode, the cover plate can be installed in the groove in an embedded mode and covers the clamping slide glass, the clamping holes, the installation holes and the butt joint holes are in one-to-one correspondence, and a probe is arranged in each clamping hole in a clamped mode. And an embeddable design is adopted, and the clamping slide glass is matched, so that a large number of probes can be quickly replaced.

Description

Technical Field

[0001] The present invention relates to the technical field of testing devices, and in particular to a probe installation structure and a wafer reliability testing system. Background Art

[0002] In the semiconductor manufacturing process, wafer-level testing is an important step to ensure that each chip meets the design specifications before entering the packaging stage. In this test, the probe and its mounting structure are key components that measure various electrical parameters through electrical contact with the surface of the wafer. However, with the continuous development of semiconductor technology, the size of chips on the wafer is getting smaller and smaller, and the integration is getting higher and higher, which puts higher requirements on the accuracy, reliability and replacement efficiency of the probe.

[0003] Existing probe replacement methods mainly rely on manual or semi-automatic operations. When the probe needs to be replaced due to wear or damage, the operator must use special tools to remove and install the probe one by one. There are multiple problems with this manual replacement method: First, manual replacement of probes is inefficient, especially in large-scale production environments. Replacing probes one by one is not only time-consuming and labor-intensive, but may also cause production line shutdowns, reducing overall production efficiency; second, the manual replacement process is easily affected by human factors, which may lead to improper installation of the probe or damage to the probe and probe card, affecting the accuracy and reliability of the test; finally, since the probe material is usually fragile, manual operation may also cause accidental breakage or deformation of the probe, further increasing the replacement cost and difficulty of operation.

[0004] In addition, most existing probe installation structures adopt a rigid fixed design, and the fixation and replacement of the probes rely on mechanical clamping or welding, which lacks flexibility. Although this design can maintain the stability of the probes during the test, it is not convenient and efficient enough when the probes need to be replaced frequently. At the same time, in the testing of high-density integrated circuits, the density of probe arrangement is getting higher and higher, and the traditional probe replacement method is difficult to adapt to such high-density and diversified needs.

[0005] In order to overcome the above problems, it is necessary to develop a device and method that can realize rapid replacement of probes to improve replacement efficiency, reduce production line downtime, reduce operating difficulty and cost, and improve test accuracy and reliability. Summary of the invention

[0006] A first aspect of the present invention provides a probe installation structure that can efficiently replace the probe.

[0007] The technical solution of the present invention is implemented as follows: The present invention provides a probe installation structure, including: a tray, a clamping carrier and a cover plate, a groove is opened on the upper surface of the tray, a plurality of mounting holes are arrayed in the groove and penetrate along the thickness direction, a plurality of clamping holes are arrayed on the surface of the clamping carrier and penetrate along the thickness direction, a plurality of docking holes are arrayed on the surface of the cover plate and penetrate along the thickness direction, the clamping carrier can be embedded and installed in the groove, the cover plate can be embedded and installed in the groove and covered above the clamping carrier, the clamping holes, mounting holes and docking holes are all in one-to-one correspondence, and a probe is clamped in each clamping hole.

[0008] In some embodiments, the clamping hole is a square hole, and the four inner walls of the clamping hole extend inward to form clamping flaps, the free ends of the clamping flaps are against the side of the probe, the clamping flaps are made of thermoplastic material, and the softening temperature of the clamping flaps is 80-150°C.

[0009] In some embodiments, a stress concentration groove is provided below the clamping flap along its width direction.

[0010] In some embodiments, the stress concentration groove coincides with an inner sidewall extension surface of the mounting hole on the side where the stress concentration groove is located.

[0011] In some embodiments, a heating module is embedded inside the tray, and the heating module is used to provide heat so that the clamping flap can be heated to a softening temperature. The clamped probe is released by softening the clamping flap, thereby preventing the clamping flap from obstructing the probe and affecting the detection of the probe during subsequent detection.

[0012] In some embodiments, a venting groove is provided on a surface of a side of the tray away from the clamping carrier, and each mounting hole is connected to the side surface of the tray through at least one venting groove.

[0013] In the second aspect, the present invention also provides a wafer reliability testing system, which includes: a testing machine, a test circuit board, a probe and the probe mounting structure described in any one of claims 1-6, the testing machine is used to provide power for testing, a plurality of first solder pads and a plurality of second solder pads are arranged on the surface of the test circuit board, the first solder pads are electrically connected to the second solder pads one-to-one, the first solder pads are electrically connected to the probes in the docking holes one-to-one, the second solder pads are electrically connected to the testing machine, the wafer to be tested is electrically connected to the probes in the mounting hole, and the wafer to be tested is also electrically connected to the testing machine to form a test loop.

[0014] In some embodiments, a plurality of ventilation holes are arranged in an array on the surface of the test circuit board, and each docking hole is connected to one ventilation hole.

[0015] In some embodiments, a wafer chuck is further included, and an air outlet is opened on the surface of the wafer chuck. The edge of the wafer chuck is tightly fitted with the edge of the test circuit board to form an air outlet cavity. The air outlet is connected to the mounting hole through the air outlet cavity. The wafer chuck is used to support the wafer to be tested.

[0016] In some embodiments, an air intake hood is further included, wherein an air intake port is provided on the surface of the air intake hood, the air intake hood cover is disposed on a side of the test circuit board away from the tray and is enclosed with the test circuit board to form an air intake cavity, and the air intake port is connected to the mounting hole through the air intake cavity.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present invention adopts an embeddable design and cooperates with a clamping carrier to realize the rapid replacement of a large number of probes, avoiding the tedious operation of traditional manual replacement of probes, greatly improving the replacement efficiency of probes, being suitable for large-scale production environments, and reducing production line downtime. At the same time, the present invention adopts a thermoplastic clamping flap structure, which releases the probe by heating and softening the clamping flap, thereby avoiding the problem that the probe may affect the test accuracy due to improper installation or damage during manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is an axonometric diagram of the probe installation structure of the present invention;

[0021] Figure 2 An exploded view of the probe installation structure of the present invention;

[0022] Figure 3 An exploded view of the probe installation structure of the present invention from another perspective;

[0023] Figure 4 is a side sectional view of the probe mounting structure of the present invention;

[0024] Figure 5 An isometric diagram of a wafer reliability testing system of the present invention;

[0025] Figure 6 An exploded diagram of a wafer reliability testing system of the present invention;

[0026] Figure 7 is a side cross-sectional view of the wafer reliability testing system of the present invention;

[0027] Figure 8 An isometric view of a test circuit board in the wafer reliability test system of the present invention;

[0028] Fig. 9 for Figure 3 A partial enlarged view of part A;

[0029] Fig.10 for Figure 4 A partial enlarged view of part B;

[0030] Fig.11 for Figure 7 A partial enlarged view of part C in the middle;

[0031] Fig.12 It is a connection schematic diagram of the wafer reliability testing system of the present invention.

[0032] In the figure: 1-tray, 2-clamping carrier, 3-cover, 4-probe, 5-heating module, 6-testing machine, 7-testing circuit board, 8-wafer to be tested, 9-wafer chuck, 10-air inlet hood, 11-groove, 12-mounting hole, 13-exhaust groove, 21-clamping hole, 211-clamping flap, 212-stress concentration groove, 31-docking hole, 70-air inlet cavity, 71-first welding pad, 72-second welding pad, 73-vent, 90-air outlet cavity, 91-air outlet, 100-probe mounting structure, 101-air inlet. DETAILED DESCRIPTION

[0033] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the embodiments of the present invention belong. If the definitions set forth in this section are contrary to or otherwise inconsistent with the definitions set forth in the patents, patent applications, published patent applications, and other publications incorporated herein by reference, the definitions listed in this section take precedence over the definitions incorporated herein by reference.

[0038] Unless otherwise specified, the methods used in the following examples are all conventional methods. Unless otherwise specified, the materials, reagents and instruments used are all conventional materials, reagents and instruments in the art, and can be obtained by those skilled in the art through commercial channels.

[0039] When an amount, concentration or other value or parameter is expressed as a range, a preferred range or a range defined by a series of upper preferred values ​​and lower preferred values, this should be understood as specifically disclosing all ranges formed by any pairing of any range upper limit or preferred value with any range lower limit or preferred value, regardless of whether the range is disclosed separately. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted as including the range "1 to 4", "1 to 3", "1 to 2", "1 to 2 and 4 to 5", "1 to 3 and 5", etc. When a numerical range is described herein, unless otherwise stated, the range is intended to include its end values ​​and all integers and fractions within the range. In the present specification and claims, range definitions can be combined and / or interchanged, and if not otherwise stated, these ranges include all subranges contained therein.

[0040] like Figure 1 As shown, combined Figure 2-4 The probe mounting structure 100 of the present invention comprises: a tray 1, a clamping carrier 2 and a cover plate 3. A groove 11 is provided on the upper surface of the tray 1. A plurality of mounting holes 12 penetrating along the thickness direction are arranged in an array in the groove 11. A plurality of clamping holes 21 are arranged penetrating along the thickness direction on the surface of the clamping carrier 2. A plurality of docking holes 31 penetrating along the thickness direction are arranged in an array on the surface of the cover plate 3. The clamping carrier 2 can be embedded and installed in the groove 11. The cover plate 3 can be embedded and installed in the groove 11 and is covered above the clamping carrier 2. The clamping holes 21, the mounting holes 12 and the docking holes 31 correspond to each other one by one. A probe 4 is clamped in each clamping hole 21.

[0041] The groove 11 on the tray 1 provides a fixed base for the entire probe 4 mounting structure, and multiple mounting holes 12 arranged in an array in the groove 11 penetrate the thickness of the tray 1, which facilitates the insertion and fixation of the probe 4. The design of the groove 11 helps to embed and fix the clamping slide 2 and the cover plate 3 in the tray 1, ensuring the stability and accuracy of the structure.

[0042] These holes penetrate along the thickness direction of the tray to provide installation positions for the probes 4, and correspond one-to-one with the clamping holes 21 of the clamping carrier 2 and the docking holes 31 of the cover plate 3. This corresponding structure ensures the stable positioning of the probes 4, and the strong structure of the tray 1 ensures that the probes will not shift during the test process.

[0043] The surface of the clamping slide 2 is provided with a plurality of clamping holes 21 through-through in the thickness direction for clamping and fixing the probe. The design of the clamping holes 21 can ensure that the probe 4 is stably fixed in the clamping slide 2 without loosening or displacement. The clamping slide 2 can be embedded in the groove 11 of the tray 1. This design not only facilitates the rapid alignment of the probe 4 during installation, but also ensures that the probe 4 is stably held in subsequent operations without being affected by external factors.

[0044] The cover plate 3 can be embedded in the groove 11 and cover the top of the holding slide 2. This not only provides additional physical protection, but also ensures that the positioning of the probe 4 during the test is not disturbed by the outside world, further improving the stability of the structure.

[0045] The biggest advantage of this structure is that the installation and replacement of the probe no longer requires manual adjustment. The clamping slide 2 and the cover plate 3 are fixed in the tray 1 through an embedded design, and the probe 4 can be quickly installed or removed, greatly improving the replacement efficiency.

[0046] In some embodiments, the clamping hole 21 is a square hole, and the four inner walls of the clamping hole 21 extend inward to form a clamping flap 211. The free end of the clamping flap 211 is against the side of the probe 4. The clamping flap 211 is made of thermoplastic material, and the softening temperature of the clamping flap 211 is 80-150°C.

[0047] The square clamping hole 21 can avoid forming a fully enclosed clamping of the probe 4. The clamping through four protruding clamping petals 211 can make the subsequent release process smoother. The clamping petal structure adopts thermoplastic material. When heated to a certain temperature range (80-150°C), the clamping petal will soften. This design can make the installation of the probe more convenient. The clamping carrier 2 structure is used to provide initial clamping and support. When the clamping carrier 2 is accurately placed in the groove 11, the clamping petal 211 can be softened by heating, and the corresponding probe 4 is released and falls into the installation hole 12, thereby completing the installation of the probe 4.

[0048] In some embodiments, a stress concentration groove 212 is provided below the clamping flap 211 along its width direction.

[0049] The design of the stress concentration groove 212 makes the lower part of the clamping flap 211 more flexible and adjustable. This means that the clamping flap 211 can respond to changes more flexibly when subjected to external force or thermal stress. The design is intended to allow the clamping flap 211 to be fully deformed from a preset position first when heated. When the deformation positions of multiple clamping flaps 211 are consistent, it is beneficial to keep the installation position of the probe 4 consistent, which helps to improve the stability and accuracy of the detection. At the same time, the bent clamping flap 211 can be used as a limiting structure to further improve the accuracy of the installation position of the probe 4.

[0050] In some embodiments, the stress concentration groove 212 coincides with an extension surface of the inner wall of the mounting hole 12 on the side where the stress concentration groove 212 is located.

[0051] In the above embodiments, as a preferred structural design, the inner wall shape of the mounting hole 12 is similar to or the same as the outer wall shape of the probe 4, and the size is slightly larger than the outer size of the probe 4. At this time, the clamping flap 211 at the stress concentration groove 212 can basically remain in contact with the inner wall of the mounting hole 12 after being bent and deformed by heat. This design helps to further improve the installation position accuracy of the probe 4.

[0052] In some embodiments, Fig.11 As shown, a heating module 5 is embedded and installed inside the tray 1 .

[0053] In the above embodiments, the heating module 5 can be used to generate heat and heat the nearby clamping flaps 211 , so that the heating flaps 211 are deformed by heat, thereby releasing the probe 4 .

[0054] In some embodiments, a venting groove 13 is formed on a surface of the tray 1 on one side away from the holding wafer 2 , and each mounting hole 12 is connected to the side surface of the tray 1 through at least one venting groove 13 .

[0055] In the above embodiments, the exhaust groove 13 is used to provide a gas passage connecting the mounting hole 12 to the outside from below. When the probe 4 is in contact with the wafer 8 to be tested, the tray 1 and the wafer 8 to be tested will not be completely sealed due to the presence of the exhaust groove 13.

[0056] At the same time, based on the above-mentioned probe installation structure, the present invention also provides a wafer reliability testing system, the structure of which is as follows: Figure 5-12As shown. It includes: a test machine 6, a test circuit board 7, a probe 4 and a probe mounting structure 100, the test machine 6 is used to provide test power, a plurality of first pads 71 ​​and a plurality of second pads 72 are arranged on the surface of the test circuit board 7, the first pads 71 ​​are electrically connected with the second pads 72 in a one-to-one correspondence, the first pads 71 ​​are electrically connected with the probes 4 in the docking holes 31 in a one-to-one correspondence, the second pads 72 are electrically connected with the test machine 6, the wafer 8 to be tested is electrically connected with the probes 4 in the mounting hole 12, and the wafer 8 to be tested is also electrically connected with the test machine 6 to form a test loop.

[0057] In the wafer reliability test system, due to the flexibility and modular design of the probe mounting structure 100, when the probe 4 is worn or damaged, the probe 4 can be quickly replaced, which reduces the downtime of the test equipment and improves the test efficiency. The probe mounting structure 100 ensures the stability and reliability of the electrical connection between the probe 4 and the wafer 8 to be tested and the test circuit board 7 through its embedded design, and is not affected by external vibration or other factors.

[0058] In some embodiments, a plurality of ventilation holes 73 are arranged in an array on the surface of the test circuit board 7 , and each docking hole 31 is connected to one ventilation hole 73 .

[0059] In the above embodiments, the vent holes 73 are arranged to provide an air discharge and circulation channel for the surface of the test circuit board 7. Each vent hole 73 is connected to the docking hole 31 to ensure that when the probe 4 contacts the wafer through the docking hole 31, the air flow can flow smoothly to avoid the electrical contact between the probe and the test object being affected by gas accumulation. When the probe 4 is inserted into the docking hole 31 and contacts the wafer, a certain amount of air pressure accumulation may occur. Through the vent holes 73, the gas can flow freely between the test circuit board 7 and the probe 4. The gas flowing from top to bottom also helps to separate the clamping flap 212 from the probe 4 to avoid adverse effects on the probe.

[0060] In some embodiments, a wafer chuck 9 is also included, and an air outlet 91 is opened on the surface of the wafer chuck 9. The edge of the wafer chuck 9 is tightly fitted with the edge of the test circuit board 7 to form an air outlet cavity 90. The air outlet 91 is connected to the mounting hole 12 through the air outlet cavity 90. The wafer chuck 9 is used to support the wafer 8 to be tested.

[0061] The wafer chuck 9 is used to provide support and necessary heat conduction for the wafer 8 to be tested. At the same time, an air outlet cavity 90 is formed between the wafer chuck 9 and the test circuit board 7, so that a certain high-pressure environment can be applied to the wafer 8 to be tested to meet the test requirements. The outlet gas is connected to the external gas collection device through the outlet port 91.

[0062] In some embodiments, an air inlet hood 10 is further included, and an air inlet port 101 is opened on the surface of the air inlet hood 10. The air inlet hood 10 covers the side of the test circuit board 7 away from the tray 1 and is surrounded by the test circuit board 7 to form an air inlet cavity 70. The air inlet port 101 is connected to the mounting hole 12 through the air inlet cavity 70.

[0063] In the above embodiment, the air inlet cavity 70 cooperates with the air outlet cavity 90 to achieve the pressure-maintaining effect on the environment of the mounting hole 12 and the wafer 8 to be tested. At the same time, the air inlet hood 10 is inlet, and the wafer chuck 9 is exhausted, so that the airflow always flows in from the top of the mounting hole 12 and flows out from the bottom, which can assist the clamping flap 211 to bend downward uniformly, avoiding unnecessary resistance or collision to the probe 4, and helping to improve the test stability of the probe.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A probe installation structure, characterized in that: include: A tray (1), a clamping carrier (2) and a cover plate (3); a groove (11) is provided on the upper surface of the tray (1); a plurality of mounting holes (12) are arranged in an array in the groove (11) and are penetrated in the thickness direction; a plurality of clamping holes (21) are arranged in an array on the surface of the clamping carrier (2) and are penetrated in the thickness direction; a plurality of docking holes (31) are arranged in an array on the surface of the cover plate (3) and are penetrated in the thickness direction; the clamping carrier (2) can be embedded and installed in the groove (11); the cover plate (3) can be embedded and installed in the groove (11) and is arranged above the clamping carrier (2); the clamping holes (21), the mounting holes (12) and the docking holes (31) are all in one-to-one correspondence; and a probe (4) is clamped and arranged in each clamping hole (21).

2. The probe mounting structure according to claim 1, characterized in that: The clamping hole (21) is a square hole, and the four inner walls of the clamping hole (21) extend inward to form a clamping flap (211). The free end of the clamping flap (211) is abutted against the side of the probe (4). The clamping flap (211) is made of thermoplastic material, and the softening temperature of the clamping flap (211) is 80-150°C.

3. The probe mounting structure according to claim 2, characterized in that: A stress concentration groove (212) is provided below the clamping flap (211) along its width direction.

4. The probe mounting structure according to claim 3, characterized in that: The stress concentration groove (212) coincides with an extended surface of the inner wall of the mounting hole (12) on the side where the stress concentration groove (212) is located.

5. The probe mounting structure according to claim 2, characterized in that: A heating module (5) is embedded and installed inside the tray (1).

6. The probe mounting structure according to claim 1, characterized in that: An exhaust groove (13) is provided on a surface of a side of the tray (1) away from the clamping carrier (2), and each mounting hole (12) is connected to the side of the tray (1) via at least one exhaust groove (13).

7. A wafer reliability testing system, characterized in that: The invention comprises a test machine (6), a test circuit board (7), a probe (4) and a probe mounting structure (100) as described in any one of claims 1 to 6, wherein the test machine (6) is used to provide power for testing, a plurality of first solder pads (71) and a plurality of second solder pads (72) are arranged on the surface of the test circuit board (7), the first solder pads (71) and the second solder pads (72) are electrically connected in a one-to-one correspondence, the first solder pads (71) and the probes (4) in the docking holes (31) are electrically connected in a one-to-one correspondence, the second solder pads (72) are electrically connected to the test machine (6), the wafer to be tested (8) is electrically connected to the probes (4) in the mounting holes (12), and the wafer to be tested (8) is also electrically connected to the test machine (6) to form a test loop.

8. The wafer reliability testing system according to claim 7, characterized in that: A plurality of ventilation holes (73) are arranged in an array on the surface of the test circuit board (7), and each docking hole (31) is connected to a ventilation hole (73).

9. The wafer reliability testing system according to claim 8, characterized in that: It also comprises a wafer chuck (9), a surface of which is provided with an air outlet (91), an edge of the wafer chuck (9) and an edge of the test circuit board (7) are tightly fitted to form an air outlet cavity (90), the air outlet (91) is connected to the mounting hole (12) through the air outlet cavity (90), and the wafer chuck (9) is used to support the wafer (8) to be tested.

10. The wafer reliability testing system according to claim 8, wherein: The invention also comprises an air intake cover (10), wherein an air intake port (101) is provided on the surface of the air intake cover (10), the air intake cover (10) is arranged on a side of the test circuit board (7) away from the tray (1) and is enclosed with the test circuit board (7) to form an air intake cavity (70), and the air intake port (101) is connected to the mounting hole (12) through the air intake cavity (70).

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