Testing device

Abstract

The invention discloses a testing device, and the device comprises a testing board which is provided with a plurality of installation areas, each installation area is suitable for the arrangement of a to-be-tested intelligent power module, each installation area is provided with a plurality of slots, and the slots are suitable for being electrically connected with pins on the to-be-tested intelligent power module in a plugging manner; the plurality of slots of each mounting area comprise a temperature signal output pin slot, a power supply voltage pin slot and a grounding pin slot; the operation wire comprises a power supply wire and a grounding wire; and a test line. Therefore, the plurality of mounting areas are arranged on the test board, each mounting area is suitable for arranging the intelligent power module to be tested, and the slots in the mounting areas are suitable for being electrically connected with the pins on the intelligent power module to be tested in a plugging manner, so that the test efficiency can be improved; in addition, the intelligent power module to be tested can be replaced easily, damage to pins of the intelligent power module is avoided, and the reliability of the testing device can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a testing device. Background Art

[0002] The intelligent power module (IPM) is a device on the variable frequency drive board, and its performance is easily affected by changes in the external ambient temperature. Working under excessively high temperature conditions may damage the power device, so the IPM is equipped with a temperature output function and an over-temperature protection function. In order to ensure that the external MCU can accurately judge the real-time junction temperature of the IPM, it is necessary to verify whether the actual temperature output voltage (VOT) of the IPM is consistent with the product specification.

[0003] At present, the most commonly used test method in the laboratory is to build a temperature signal output circuit, that is, to provide the IPM with a normal working VCC voltage, and the VOT pin pulls down a 5kΩ resistor. The IPM surface is heated by a heating sheet, and the IPM surface temperature and the output voltage of the VOT pin are measured. The corresponding relationship between the two is obtained at different temperatures and the VOT curve is drawn. This method is cumbersome to operate, especially when multiple devices need to be tested to obtain the discrete range of the VOT curve. Each device needs to build a test circuit separately and heat the test separately, which has low test efficiency. And after the device is soldered with a pull-down resistor, it may cause irreversible damage to the pin. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a testing device, which has higher testing efficiency and does not cause damage to the pins of the intelligent power module.

[0005] The test device according to the present invention comprises: a test board, on which a plurality of mounting areas are arranged, each of which is suitable for arranging an intelligent power module to be tested, and a plurality of slots are arranged on the mounting area, and the slots are suitable for plugging and electrically connecting with pins on the intelligent power module to be tested; the plurality of slots in each mounting area include a temperature signal output pin slot, a power supply voltage pin slot and a ground pin slot, the temperature signal output pin slot is suitable for plugging and electrically connecting with the temperature signal output pin on the intelligent power module to be tested, and the power supply voltage pin slot is connected to the power supply voltage pin on the intelligent power module to be tested. The ground pin slot is electrically connected to the ground pin on the intelligent power module to be tested; an operating line, the operating line includes a power supply line and a grounding line, the first end of the power supply line is electrically connected to the power supply voltage pin slots of the plurality of installation areas, the first end of the grounding line is electrically connected to the grounding pin slots of the plurality of installation areas, the second end of the power supply line and the second end of the grounding line are both suitable for being electrically connected to an external power supply; a test line, the first end of the test line is electrically connected to the temperature signal output pin slots of the plurality of installation areas, and the second end of the test line is electrically connected to an external tester.

[0006] Therefore, by setting up multiple installation areas on the test board, each installation area is suitable for setting the intelligent power module to be tested, and the slots on the installation area are suitable for plugging and electrically connecting with the pins on the intelligent power module to be tested. This not only improves the test efficiency, but also facilitates the replacement of the intelligent power module to be tested, avoids damage to the pins of the intelligent power module, and improves the reliability of the test device.

[0007] In some examples of the present invention, a temperature signal output circuit is provided in the test board, a first end of the temperature signal output circuit is electrically connected to the temperature signal output pin slots of the plurality of installation areas, and a second end of the temperature signal output circuit is electrically connected to the test line.

[0008] In some examples of the present invention, a pull-down resistor is provided on the temperature signal output circuit, one end of the pull-down resistor is electrically connected to the temperature signal output pin slot, and the other end of the pull-down resistor is electrically connected to the ground pin slot.

[0009] In some examples of the present invention, the pull-down resistor is welded on the test board.

[0010] In some examples of the present invention, the pull-down resistor is a chip resistor, and / or the pull-down resistor is a thin-film resistor.

[0011] In some examples of the present invention, a test line connector and an operating line connector are provided on the test board, the test line connector is electrically connected to the second end of the temperature signal output circuit, and the test line connector is plug-in electrically connected to the first end of the test line; and / or the operating line connector is respectively electrically connected to the power supply voltage pin slot and the ground pin slot, and the operating line connector is plug-in electrically connected to the first end of the operating line.

[0012] In some examples of the present invention, the first end of the test line is welded on the test board; and / or the first end of the running line is welded on the test board.

[0013] In some examples of the present invention, there are multiple test lines, the multiple test lines are spaced apart from each other, and the first ends of the multiple test lines are electrically connected to the temperature signal output pin slots of the multiple installation areas in a one-to-one correspondence.

[0014] In some examples of the present invention, there is one power supply line and one grounding line, one power supply line is electrically connected to the power supply voltage pin slots of the plurality of installation areas, and one grounding line is electrically connected to the grounding pin slots of the plurality of installation areas.

[0015] In some examples of the present invention, an incubator is further included, wherein the test board is disposed in the incubator, the operating line extends from the incubator and is electrically connected to an external power supply, and the test line extends from the incubator and is electrically connected to the external tester.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic diagram of a testing device according to an embodiment of the present invention;

[0019] Figure 2 is a circuit diagram of a testing device according to an embodiment of the present invention.

[0020] Reference numerals:

[0021] 100. Testing device;

[0022] 10. test board; 101. installation area; 1011. slot;

[0023] 20, operating line; 201, power supply line; 202, grounding line; 203, power supply line connector; 204, grounding line connector;

[0024] 30. Test line; 301. Test line connector;

[0025] 40. Pull-down resistor. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0027] Reference below Figure 1-Figure 2 The test device 100 according to an embodiment of the present invention is described. The test device 100 can be applied to test the temperature output parameters of an intelligent power module.

[0028] Combination Figure 1-Figure 2 As shown, the test device 100 according to the present invention can mainly include: a test board 10, a running line 20, and a test line 30. Among them, a plurality of installation areas 101 are provided on the test board 10, each installation area 101 is suitable for setting the intelligent power module to be tested, and a plurality of slots 1011 are provided on the installation area 101, and the slots 1011 are suitable for plugging and electrically connecting with the pins on the intelligent power module to be tested, so that it can be ensured that the multiple intelligent power modules to be tested are electrically connected with the test board 10 through the slots 1011 at the same time, and it can be ensured that the multiple intelligent power modules to be tested are tested at the same time, thereby improving the test efficiency. In addition, the intelligent power module to be tested is plugged into the corresponding installation area 101 of the test board 10 through the slots 1011, so that the damage to the pins of the intelligent power module to be tested can be prevented or reduced.

[0029] Furthermore, the multiple slots 1011 of each installation area 101 include a temperature signal output pin slot, a power supply voltage pin slot and a ground pin slot. The temperature signal output pin slot is suitable for being plugged and electrically connected to the temperature signal output pin on the intelligent power module to be tested, the power supply voltage pin slot is plugged and electrically connected to the power supply voltage pin on the intelligent power module to be tested, and the ground pin slot is plugged and electrically connected to the ground pin on the intelligent power module to be tested. In this way, by electrically connecting different slots 1011 with the pins of the corresponding intelligent power modules, the normal working performance and test performance of the test device 100 can be ensured, and abnormal testing of the test device 100 or abnormal function of the intelligent power module to be tested due to connection problems can be avoided, thereby improving the reliability of the test device 100.

[0030] Furthermore, if the pin position of the intelligent power module to be tested is fixed, and the combination arrangement order of each pin is consistent with the combination arrangement order of slot 1011, or the intelligent power module to be tested matches the model of the testing device 100, the intelligent power module to be tested can be installed quickly, which can further improve the testing efficiency.

[0031] The operation line 20 includes a power supply line 201 and a grounding line 202. The first end of the power supply line 201 is electrically connected to the power supply voltage pin slots of multiple installation areas 101, the first end of the grounding line 202 is electrically connected to the grounding pin slots of multiple installation areas 101, and the second end of the power supply line 201 and the second end of the grounding line 202 are both suitable for being electrically connected to an external power supply. Specifically, the first end of the grounding line 202 is electrically connected to the grounding pin slots of multiple installation areas 101, so that a stable zero potential reference can be provided for each installation area 101. Further, the first end of the power supply line 201 is electrically connected to the power supply voltage pin slots of multiple installation areas 101, so that the power supply of each installation area 101 can be guaranteed to be normal, and the required working voltage can be provided for the intelligent power module to be tested installed in the installation area 101, so that the intelligent power module to be tested can work normally. In addition, the second end of the power supply line 201 and the second end of the ground line 202 are both suitable for being electrically connected to an external power supply, so that a stable operating voltage can be provided for the test device 100, the normal operation of the test device 100 can be ensured, and the test device 100 is not limited by the built-in battery capacity and battery life of the test board 10. If no built-in battery is provided, the volume of the test board 10 can be reduced.

[0032] The first end of the test line 30 is electrically connected to the temperature signal output pin slots of the plurality of mounting areas 101, and the second end of the test line 30 is suitable for being electrically connected to an external tester. This ensures that the temperature signal can be accurately transmitted from the temperature signal output pin slot to the external tester, so that the tester can measure and analyze various parameters, thereby accurately determining the heating condition of the intelligent power module to be tested or determining whether its temperature output function is normal.

[0033] Specifically, when conducting a test, the intelligent power module to be tested must first be installed in the installation area 101 of the test board 10. Further, the operating line 20 and the test line 30 must be electrically connected to the slot 1011, the external power supply, and the external tester, respectively, and the connection lines must be confirmed to be correct. Further, after the test conditions are met, the external power supply, the external tester, and the test device 100 are turned on. After the circuit operates normally, the temperature-related signal output by the test line 30 is tested and analyzed to complete the test of the temperature output signal of the intelligent power module.

[0034] Therefore, by setting a plurality of installation areas 101 on the test board 10, each installation area 101 is suitable for setting the intelligent power module to be tested, and the slot 1011 on the installation area 101 is suitable for plugging and electrically connecting with the pins on the intelligent power module to be tested. This can not only improve the test efficiency, but also facilitate the replacement of the intelligent power module to be tested and avoid damage to the pins of the intelligent power module, thereby improving the reliability of the test device 100.

[0035] In some examples of the present invention, the power supply line 201 and the grounding line 202 of each installation area 101 are connected in parallel, and the number of installation areas 101 on the test board 10 can be set according to the test requirements. Furthermore, multiple test boards 10 can also be set. According to the test requirements, the power supply lines 201 and the grounding lines 202 of the multiple test boards 10 are connected in parallel or the power supply of the test boards 10 is guaranteed to be normal, which can further improve the test efficiency.

[0036] In some examples of the present invention, it should be noted that if the number of intelligent power modules to be tested is less than the number of mounting areas 101 on the test board 10, the redundant mounting areas 101 may be left vacant without affecting the test results.

[0037] In some examples of the present invention, the test socket of the mounting area 101 of the test device 100 may adopt different packaging forms, such as SDIP26 / DIP25 / DIP29, etc.

[0038] Combination Figure 1 and Figure 2 As shown, a temperature signal output circuit is provided in the test board 10 , a first end of the temperature signal output circuit is electrically connected to the temperature signal output pin slots of the plurality of mounting areas 101 , and a second end of the temperature signal output circuit is electrically connected to the test line 30 .

[0039] Specifically, the slot 1011 of the installation area 101 is suitable for electrically connecting to the pins on the intelligent power module to be tested. By electrically connecting the first end of the temperature signal output circuit to multiple temperature signal output pin slots of the installation area 101, an electrical connection between the intelligent power module and the temperature signal output circuit can be achieved, so that the temperature signal output by the intelligent power module can be transmitted to the first end of the temperature signal output circuit through the temperature signal output pin slot of the installation area 101.

[0040] Furthermore, the second end of the temperature signal output circuit is electrically connected to the test line 30, and the temperature signal output circuit in the test board 10 converts the temperature signal received at the first end into an easily measurable electrical signal, such as voltage, current, resistance, etc., and accurately and reliably transmits the processed temperature signal to the test line 30 for output.

[0041] With such a configuration, the temperature signal received by the test device 100 can be accurately transmitted, thereby ensuring the effectiveness and reliability of the test device 100.

[0042] Combination Figure 1 and Figure 2 As shown, the temperature signal output circuit is provided with a pull-down resistor 40, one end of the pull-down resistor 40 is electrically connected to the temperature signal output pin slot, and the other end of the pull-down resistor 40 is electrically connected to the ground pin slot. Specifically, the temperature signal output circuit is provided with a pull-down resistor 40, the pull-down resistor 40 is arranged at the position of the temperature signal output pin VOT of the temperature signal output circuit, one end of the pull-down resistor 40 is electrically connected to the temperature signal output pin slot, and the other end of the pull-down resistor 40 is electrically connected to the ground pin slot.

[0043] With such a configuration, when the temperature signal output pin VOT is not actively driven, the pull-down resistor 40 can ensure that the voltage of the temperature signal output pin VOT remains at a relatively stable low level, avoiding voltage suspension and instability, and improving the stability of the temperature signal output circuit.

[0044] In some examples of the present invention, the number of the pull-down resistors 40 is the same as the number of the mounting areas 101 on the test board 10 .

[0045] Combination Figure 1 and Figure 2 As shown, the pull-down resistor 40 is welded and arranged on the test board 10. Such arrangement can not only provide a stable and reliable electrical connection for the pull-down resistor 40, ensuring that the pull-down resistor 40 will not be loose or have poor contact due to factors such as vibration and temperature changes, but also ensure the accuracy of signal transmission, thereby ensuring the stability and reliability of the circuit.

[0046] Combination Figure 1 and Figure 2 As shown, the pull-down resistor 40 is a chip resistor, and / or the pull-down resistor 40 is a thin film resistor. Specifically, both the chip resistor and the thin film resistor have high temperature stability, and can maintain a relatively stable resistance value under working environments with different temperatures. Therefore, setting the pull-down resistor 40 as a chip resistor and / or the pull-down resistor 40 as a thin film resistor can make the pull-down effect of the pull-down resistor 40 more reliable, reduce the influence of temperature on circuit performance, and thus improve the stability of the test device 100.

[0047] Furthermore, the installation of chip resistors and thin-film resistors does not require punching operations. Setting the pull-down resistor 40 as a chip resistor and / or a thin-film resistor can avoid damage to the test board 10 to a certain extent.

[0048] In addition, the chip resistors are small in size and light in weight. Using the chip resistors can effectively save space on the circuit board, thereby improving space utilization and making the test device 100 more miniaturized and integrated.

[0049] Combination Figure 1 and Figure 2 As shown, a test line connector 301 and an operating line 20 connector are provided on the test board 10, the test line connector 301 is electrically connected to the second end of the temperature signal output circuit, and the test line connector 301 is plug-connected and electrically connected to the first end of the test line 30; and / or the operating line 20 connector is respectively electrically connected to the power supply voltage pin slot and the ground pin slot, and the operating line 20 connector is plug-connected and electrically connected to the first end of the operating line 20.

[0050] Such a configuration can provide an interface for connecting external equipment to the test device 100, thereby facilitating the connection between the test device 100 and an external tester, an external power supply, etc. Specifically, the temperature signal output by the intelligent power module can be transmitted to the external tester, and the power signal of the external power supply can be transmitted to the power supply voltage pin slot and the ground pin slot. The test device 100 can be powered by the external power supply, and the normal operation of the test device 100 and the intelligent power module can be ensured. Furthermore, the transmission and exchange of data, signals, power, etc. between the test device 100 and the external equipment can be realized.

[0051] In some examples of the present invention, the test line connector 301 and the running line connector can be arranged horizontally and / or vertically on the test board 10 , wherein the running line connector includes the power line connector 203 and the ground line connector 204 .

[0052] Combination Figure 1 and Figure 2 As shown, the first end of the test line 30 is welded on the test board 10; and / or the first end of the running line 20 is welded on the test board 10. Such a configuration can not only provide a stable and reliable electrical connection for the first end of the test line 30, ensuring that the first end of the test line 30 and / or the first end of the running line 20 will not be loose or have poor contact due to factors such as vibration and temperature changes, but also ensure the accuracy of signal transmission, thereby ensuring the stability and reliability of the circuit.

[0053] Combination Figure 1 and Figure 2 As shown, there are multiple test lines 30 , and the multiple test lines 30 are spaced apart from each other. The first ends of the multiple test lines 30 are electrically connected to the temperature signal output pin slots of the multiple installation areas 101 in a one-to-one correspondence.

[0054] In this arrangement, each test line 30 is electrically connected to a corresponding installation area 101, and the number of test lines 30 is equal to the number of installation areas 101. Furthermore, the test line 30 can output the temperature signal of the intelligent power module installed on the corresponding installation area 101, thereby ensuring the correctness of signal transmission and improving the reliability of the test device 100.

[0055] In addition, the multiple test lines 30 are arranged at intervals from each other, which can avoid interference or disturbance between the multiple test lines 30 and improve the stability of the test device 100.

[0056] Combination Figure 1 and Figure 2 As shown, there is one power supply line 201 and one grounding line 202 . One power supply line 201 is electrically connected to the power supply voltage pin slots of multiple installation areas 101 , and one grounding line 202 is electrically connected to the grounding pin slots of multiple installation areas 101 .

[0057] In this configuration, multiple installation areas 101 share one power supply line 201, which can simplify circuit design and reduce wiring difficulty while meeting power supply requirements.

[0058] Furthermore, multiple installation areas 101 share a grounding wire 202, which can not only provide a stable reference potential for the circuit, making the signal transmission in the circuit more accurate and stable, and improving the accuracy of the test results, but also can release the static electricity generated during the operation of the test device 100 in time, avoiding static electricity from interfering with and damaging the test device 100 and the circuit.

[0059] In some examples of the present invention, when circuit requirements are met or circuit upgrades are performed, power lines 201 and ground lines 202, as well as power line connectors 203 and ground line connectors 204 may be added to provide power supply using multiple power sources.

[0060] Combination Figure 1 and Figure 2 As shown, the test device 100 also includes an incubator, the test board 10 is arranged in the incubator, the operating line 20 extends from the incubator and is electrically connected to an external power supply, and the test line 30 extends from the incubator and is electrically connected to an external tester.

[0061] Specifically, when conducting a test, the test board 10 equipped with the intelligent power module must first be placed in an incubator, and then the operating line 20 and the test line 30 are passed from the inside of the incubator through the wire holes reserved on the wall of the incubator and led out of the incubator. The extended part of the operating line 20 is electrically connected to the external power supply, and the extended part of the test line 30 is electrically connected to the external tester.

[0062] It should be noted that the connecting wires placed in the incubator, such as the test wire 30 and the running wire 20, are all high temperature resistant wires, and their lengths can be specifically set according to the test requirements.

[0063] Furthermore, the temperature of the temperature box can be set according to the test requirements. After the temperature reaches the test point and stabilizes, the connected external power supply, external tester and test device 100 are turned on. After the circuit operates normally, the output signals of the temperature signal output pins VOT1~VOT6 are measured respectively by the external tester to obtain the corresponding relationship between the output signal and the temperature, thereby completing the detection and analysis of the temperature output signal of the intelligent power module.

[0064] It should be noted that more than one temperature test point may be required, and different temperature points may be set to perform multiple tests or multiple cycle tests.

[0065] Furthermore, after the test is completed, wait for the temperature box to return to normal temperature, open the temperature box, take out the device, and then remove the installed intelligent power module from the device.

[0066] With such a setting, a temperature box is used to complete the heating and cooling operations, which can not only maintain the stability and uniformity of the heating and cooling process, avoid excessive temperature fluctuations that affect the working performance of the intelligent power module and the test device 100, but also provide high-precision temperature setting and temperature control, avoid excessive temperature differences that affect the test results, and effectively improve the accuracy of the test results.

[0067] In addition, using a temperature box to complete heating and cooling operations can also facilitate testing by testers and improve the safety of the testing process.

[0068] According to the test device 100 of the present invention, in particular, since the test device 100 can be installed with multiple intelligent power modules and has good working performance, applying the test device 100 to test the temperature output parameters of the intelligent power modules can not only improve the test efficiency and the accuracy of the test results, but also improve the safety of the test process.

[0069] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0071] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A testing device, characterized in that: include: A test board, wherein a plurality of mounting areas are provided on the test board, each of the mounting areas is suitable for arranging an intelligent power module to be tested, and a plurality of slots are provided on the mounting areas, and the slots are suitable for plugging and electrically connecting with pins on the intelligent power module to be tested; The plurality of slots in each installation area include a temperature signal output pin slot, a power supply voltage pin slot and a ground pin slot, wherein the temperature signal output pin slot is adapted to be plugged and electrically connected to a temperature signal output pin on an intelligent power module to be tested, the power supply voltage pin slot is plugged and electrically connected to a power supply voltage pin on an intelligent power module to be tested, and the ground pin slot is plugged and electrically connected to a ground pin on an intelligent power module to be tested; An operating line, the operating line comprising a power supply line and a grounding line, a first end of the power supply line being electrically connected to the power supply voltage pin slots of the plurality of mounting areas, a first end of the grounding line being electrically connected to the grounding pin slots of the plurality of mounting areas, and a second end of the power supply line and a second end of the grounding line being both suitable for being electrically connected to an external power supply; A test line, wherein a first end of the test line is electrically connected to the temperature signal output pin slots of the plurality of installation areas, and a second end of the test line is suitable for being electrically connected to an external tester.

2. The testing device according to claim 1, characterized in that: A temperature signal output circuit is provided in the test board, a first end of the temperature signal output circuit is electrically connected to the temperature signal output pin slots of the plurality of installation areas, and a second end of the temperature signal output circuit is electrically connected to the test line.

3. The testing device according to claim 2, characterized in that: The temperature signal output circuit is provided with a pull-down resistor, one end of the pull-down resistor is electrically connected to the temperature signal output pin slot, and the other end of the pull-down resistor is electrically connected to the ground pin slot.

4. The testing device according to claim 3, characterized in that: The pull-down resistor is welded on the test board.

5. The testing device according to claim 3, characterized in that: The pull-down resistor is a chip resistor, and / or the pull-down resistor is a thin-film resistor.

6. The testing device according to claim 1, characterized in that: The test board is provided with a test line connector and a running line connector, the test line connector is electrically connected to the second end of the temperature signal output circuit, and the test line connector is plug-in electrically connected to the first end of the test line; and / or The running line connector is electrically connected to the power supply voltage pin slot and the ground pin slot respectively, and the running line connector is plug-in electrically connected to the first end of the running line.

7. The testing device according to claim 1, characterized in that: The first end of the test line is welded on the test board; and / or The first end of the running line is welded on the test board.

8. The testing device according to claim 1, characterized in that: There are a plurality of test lines, the plurality of test lines are spaced apart from each other, and the first ends of the plurality of test lines are electrically connected to the temperature signal output pin slots of the plurality of installation areas in a one-to-one correspondence.

9. The testing device according to claim 1, characterized in that: There is one power supply line and one grounding line. One power supply line is electrically connected to the power supply voltage pin slots of the plurality of installation areas. One grounding line is electrically connected to the grounding pin slots of the plurality of installation areas.

10. The testing device according to claim 1, characterized in that: It also includes a temperature box, the test board is arranged in the temperature box, the operating line extends from the temperature box and is connected to an external power supply, and the test line extends from the temperature box and is electrically connected to the external tester.

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