Positioning device for chip testing
By designing an automated chip test positioning device, the conveyor body and the upper and lower ejection mechanism are used to realize the automatic loading and unloading positioning of the chip, solving the problems of low efficiency and high cost of placement of small and medium-sized chips in the prior art, and improving the testing efficiency and finished product rate .
Patent Information
- Application Number
- CN202411925214.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2044-12-25
AI Technical Summary
The existing positioning device for chip testing requires operators to focus heavily when placing small-sized chips, resulting in low working efficiency. When positioning by pushing the cylinder, it is costly and may damage the chip, affecting the yield rate.
A chip test positioning device including a positioning body, a conveying body, a test mechanism and an upper and lower ejection mechanism is designed. Through the reserved groove and conveyor belt on the conveyor body, the chip is automatically transported to the testing mechanism for testing, and the upper and lower ejection mechanism is used to realize the automatic loading and unloading positioning of the chip, avoiding manual clamping and placement.
It realizes the automatic loading and unloading positioning of the chip, improves the testing efficiency, reduces the cost of manual operation and the risk of chip damage, and is suitable for chip positioning testing of different sizes.
Smart Images

Figure CN119395512A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field related to chip testing, and in particular to a positioning device for chip testing. Background Art
[0002] Chip testing is a very important part of the semiconductor industry. It ensures the function, performance and reliability of the chip. Through chip testing, defective chips can be identified and eliminated to ensure that only chips that meet quality standards are delivered to customers, thereby improving product reliability. It can also detect and repair defects early, reduce rework and scrap rates, and reduce production costs. When conducting chip testing, the general testing method is to place the chip inside the positioning device and complete the test by simulating the working state of the chip; For example, the application number is 202123161379.9, a positioning device for chip testing, including an operating platform, a control unit and a testing mechanism, characterized in that the operating platform is composed of a positioning mechanism, a horizontal operating table, four top feet and a distribution box; the positioning mechanism is embedded in the horizontal operating table, and the positioning mechanism is located in the middle of the horizontal operating table; the distribution box is connected to the control unit, the positioning mechanism and the testing mechanism through wires; the control unit is installed on the horizontal operating table, and the control unit is connected to the positioning mechanism through a wire; the testing mechanism is bolted to the horizontal operating table; the testing mechanism is located next to the positioning mechanism, and the testing mechanism is connected to the control unit through a wire; the control unit controls the testing mechanism and the positioning mechanism by transmitting instructions; the device can accurately position the chip, and can identify whether the chip is tightened; it can improve the detection efficiency of chip detection, and can perform positioning tests on chips of different sizes and shapes; However, the above-mentioned positioning device, first of all, due to the small size of the chip, when placing the chip, the chip needs to be manually picked up and placed inside the chip positioning groove. The clamping and placement of the small-sized chip in the whole process require the operator to maintain a high degree of concentration in order to work efficiently. Otherwise, the working efficiency of the entire device will be very low when placing and positioning. The chip positioning work is completed by setting a pushing cylinder inside the chip positioning groove, which is too expensive and will also cause damage to the surroundings of the chip, affecting the chip yield. In addition, the setting of multiple electronic components will also increase the cost of the entire device and reduce the cost performance. Summary of the invention
[0003] The purpose of the present invention is to provide a positioning device for chip testing to solve the problem raised by the above background technology that due to the small size of the chips in the current market, when placing the chips, the chips need to be manually taken and placed inside the chip positioning groove. The clamping and placement of the small-sized chips in the whole process require the operator to maintain a high degree of concentration in order to work efficiently. Otherwise, the working efficiency of the entire device will be very low when placing and positioning. The positioning of the chip is completed by setting a pushing cylinder inside the chip positioning groove, which is too expensive and will also cause damage to the surrounding areas of the chip, affecting the chip yield problem.
[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: A positioning device for chip testing, comprising a positioning body, which is used to place and position the chip; A conveying body, which is arranged at the bottom of the positioning body, and whose central axis corresponds to the central axis of the positioning body in vertical correspondence; Also includes; A testing mechanism is provided at one side of the top of the positioning body and is used to test the chip positioned on the positioning body; The lower ejection mechanism is arranged at the other side of the top of the positioning body, and is used to eject the chip after the test downward to the top of the conveying body to complete the output work; An upper ejection mechanism is also provided above the conveying body, which is used to eject the chip conveyed on the conveying body upward to the positioning body.
[0005] Preferably, a circular rotating worktable is arranged in the middle of the positioning body, a cylinder is coaxially connected to the bottom of the rotating worktable, and a driving assembly is arranged outside the cylinder for rotating and driving the cylinder; The driving assembly includes a driving motor, a driving gear and a meshing gear. The top of the driving motor is coaxially connected to the driving gear, and the top of the driving gear is connected to the bottom bearing of the positioning body. The outer side of the driving gear is meshed with the meshing gear, and the meshing gear is coaxially connected to the bottom of the cylinder.
[0006] Preferably, two placement grooves are symmetrically arranged on the outside of the rotating workbench, and through grooves are symmetrically arranged below the placement grooves, the through grooves penetrate the positioning body, and an extrusion limiting mechanism is arranged inside the placement groove for performing extrusion limiting work on the chip.
[0007] Preferably, the conveying body includes two fixed frames, a rotating roller and a conveyor belt, the head and tail middle bearings of the two fixed frames are provided with rotating rollers, and the outside of the head and tail rotating rollers are wrapped with conveyor belts, and the top end of one rotating roller is coaxially connected to a control motor for controlling the rotating roller to rotate.
[0008] Preferably, reserved grooves are evenly distributed on the outside of the conveyor belt, and the reserved grooves penetrate the conveyor belt. An intermediate plate is fixed in the middle of the conveyor belt, and both sides of the intermediate plate are connected to the fixing frame. An upper ejection mechanism is arranged above the intermediate plate, and the position of the upper ejection mechanism corresponds to the position of the testing mechanism. Limiting plates are arranged around the inside of the reserved groove for placing the chip.
[0009] Preferably, the test mechanism comprises a first fixed frame, a first cylinder and a test body, the first fixed frame is arranged in an "L"-shaped structure, and the first cylinder and the test body are connected at the bottom of the top end.
[0010] Preferably, the lower ejection mechanism comprises a second fixed frame, a second cylinder and a lower ejector head, the second fixed frame has the same shape as the first fixed frame, and the top bottom of the second fixed frame is provided with a second cylinder connected to the lower ejector head; The positions of the testing mechanism and the lower ejection mechanism correspond to the positions of the placement slots, and the distance between the testing mechanism and the lower ejection mechanism is the same as the distance between adjacent reserved slots.
[0011] Preferably, the extrusion limiting mechanism includes a placing component and an extrusion component, and the placing component and the extrusion component are arranged at staggered positions on the four sides of the placing slot, and the placing component is arranged toward the lower position of the placing slot, and the extrusion component is arranged toward the upper position of the placing slot, and the placing component and the extrusion component are both composed of two rotating baffle mechanisms.
[0012] Preferably, the upper ejection mechanism comprises a third cylinder and a top plate, the top of the third cylinder is provided with a top plate, and the central axis of the top plate coincides with the central axis of the testing mechanism.
[0013] Preferably, the rotating baffle mechanism comprises a fixing rod, a baffle assembly and a torsion spring, wherein the fixing rod is fixedly arranged in a groove on the inner wall of the placement slot, and the outside of the fixing rod is connected to the baffle assembly through a torsion spring, and the baffle assembly is an up-and-down rotating mechanism under the action of the torsion spring, the baffle assembly on the placement assembly is initially in a horizontal state, and the baffle assembly on the extrusion assembly is initially in a downwardly inclined state; The baffle assembly includes a rotating seat, a middle hole, a mounting groove, a rotating plate and a mounting block. The outer side of the rotating seat is penetrated by a middle hole for connecting with a fixing rod through a torsion spring, and a mounting groove is arranged at the top of the rotating seat. The inside of the mounting groove is connected with the mounting block, and a rotating plate with an inclined bottom structure is integrally installed at the top of the mounting block. A disassembly and installation structure is provided between the rotating seat and the installation block, and the installation method thereof is any one of bolts, screws or mortise and tenon joints.
[0014] Compared with the prior art, the beneficial effects of the present invention are: the positioning device for chip testing; A conveying body is provided, and a reserved groove is provided on the conveying body. Therefore, when the chip is initially placed, the chip can be placed in the reserved groove on the conveying body first. As the conveyor belt is transported, when it reaches the bottom of the testing mechanism, the chip can be pushed upward through the upper ejection mechanism below so that it reaches the top of the placement component and the bottom of the extrusion component. When moving upward, the chip will press the placement component upward to rotate it upward. When the outer side of the chip is completely separated from the placement component, the placement component is reset to a horizontal state, the upper ejection mechanism descends, and the chip will automatically reach the placement component. The chip is pressed and fixed on the top of the placement component, and because the pressing component is initially in a downward tilted state, when it is tilted downward, the chip can be pressed and fixed on the top of the placement component for the testing mechanism to perform the testing work. After the test is completed, the entire rotary table can be rotated so that the tested chip reaches the bottom of the lower ejection mechanism. At this time, the lower ejection mechanism is started, and the chip can be pressed downward to the limit plate above the reserved groove for limiting. With the transmission work of the conveyor belt, the output work can be completed, thereby completing the automatic loading and unloading positioning of the chip, without the need for manual clamping and placement, with higher efficiency and better practicality; The rotating plate on the baffle assembly can be disassembled and installed between the rotating seat, so the rotating plates of different sizes can be disassembled and installed according to the size of the chip. As a result, the entire positioning device can be suitable for positioning tests of chips of different sizes, and can also complete the rapid positioning and clamping of chips of different sizes, with a wider range of uses. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the main structure of the present invention; Figure 2 This is a schematic diagram of the main structure of the positioning device of the present invention; Figure 3 It is a partially enlarged structural schematic diagram of the extrusion limiting mechanism inside the placement groove of the present invention; Figure 4 It is a bottom view structural schematic diagram of the present invention; Figure 5 This is a schematic diagram of the enlarged structure of the driving assembly of the present invention when viewed from above; Figure 6 It is a schematic diagram of the structure of the conveying main body of the present invention; Figure 7 It is a partial enlarged structural schematic diagram of the upper ejection mechanism of the present invention; Figure 8 It is a half-section structural schematic diagram of the rotating baffle mechanism of the present invention; Fig. 9 It is a schematic diagram of the disassembled structure of the baffle assembly of the present invention.
[0016] In the figure: 1. positioning body; 11. rotating workbench; 12. placing groove; 2. conveying body; 21. fixed frame; 22. rotating roller; 23. conveyor belt; 24. reserved groove; 241. limit plate; 3. testing mechanism; 31. first fixed frame; 32. first cylinder; 33. testing body; 4. lower ejection mechanism; 41. second fixed frame; 42. second cylinder; 43. lower ejector; 5. placing assembly; 6. extrusion assembly; 7. upper ejection mechanism; 71. third cylinder; 72. ejector plate; 8. driving assembly; 81. driving motor; 82. driving gear; 83. meshing gear; 9. rotating baffle mechanism; 91. fixed rod; 92. baffle assembly; 93. torsion spring; 921. rotating seat; 922. middle hole; 923. mounting groove; 924. rotating plate; 925. mounting block; 10. through groove. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0018] See also Figure 1-5 , the present invention provides a technical solution: a positioning device for chip testing, comprising a positioning body 1, which is used for placing and positioning the chip; The conveying body 2 is arranged at the bottom of the positioning body 1, and its central axis corresponds to the central axis of the positioning body 1 in the vertical direction; Also includes; A testing mechanism 3 is provided at one side of the top of the positioning body 1 and is used to test the chip positioned on the positioning body 1; The lower ejection mechanism 4 is arranged at the other side of the top of the positioning body 1, and is used to eject the chip after the test downward to the top of the conveying body 2 to complete the output work; An upper ejection mechanism 7 is also provided above the conveying body 2, which is used to eject the chip conveyed on the conveying body 2 upward to the positioning body 1; The present application provides a positioning device for chip testing with a lower ejection mechanism 4 and an upper ejection mechanism 7. Specifically, when in use, first, the chip to be tested is placed above the conveying body 2, and then the chip is allowed to reach the position of the upper ejection mechanism 7 along with the conveying body 2. Then, the upper ejection mechanism 7 is started to drive the chip to move upward to the top of the positioning body 1 for positioning. Then, the testing mechanism 3 can be started to complete the testing of the positioned chip. After the test is completed, the positioning body 1 drives the chip after the test to be transferred to the position of the lower ejection mechanism 4, and then the lower ejection mechanism 4 is started, so that the positioned chip can be dropped again above the conveying body 2 and conveyed by the conveying body 2, thereby completing the automatic loading and positioning, detection and unloading and conveying effects of the chip.
[0019] Among them, according to Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a circular rotating worktable 11 is arranged in the middle of the positioning body 1, a cylinder is coaxially connected to the bottom of the rotating worktable 11, and a driving assembly 8 is arranged outside the cylinder for rotating the cylinder; The driving assembly 8 includes a driving motor 81, a driving gear 82 and a meshing gear 83. The top of the driving motor 81 is coaxially connected to the driving gear 82, and the top of the driving gear 82 is connected to the bottom bearing of the positioning body 1. The outer side of the driving gear 82 is meshed with the meshing gear 83, and the meshing gear 83 is coaxially connected to the bottom of the cylinder. Two placement grooves 12 are symmetrically arranged outside the rotating worktable 11, and a through groove 10 is symmetrically arranged below the placement groove 12. The through groove 10 penetrates the positioning body 1, and an extrusion limiting mechanism is arranged inside the placement groove 12 for performing extrusion limiting work of the chip; Among them, when the chip is lifted up by the lower ejection mechanism 4, the chip will be moved upward to the top of the corresponding placement groove 12 for positioning to complete the test work. After that, it is necessary to start the drive motor 81 to drive the active gear 82 at its top to rotate. When the active gear 82 rotates, it will mesh with the meshing gear 83, so that the meshing gear 83 drives the cylinder coaxially connected with it to rotate. The rotation of the cylinder drives the rotating workbench 11 to rotate, which can achieve the effect of changing the position of the two placement grooves 12. Therefore, the chip after the test is completed reaches the bottom of the lower ejection mechanism 4, is ejected by the lower ejection mechanism 4, and reaches the top of the conveying body 2 to complete the output work.
[0020] Further, according to Figure 6 and Figure 7 As shown, the conveying body 2 includes two fixed frames 21, a rotating roller 22 and a conveyor belt 23. The rotating rollers 22 are arranged at the middle bearings of the two fixed frames 21, and the conveyor belts 23 are wound around the outsides of the rotating rollers 22 at the front and rear ends. A control motor is coaxially connected to the top end of one rotating roller 22 for controlling the rotating roller 22 to rotate.
[0021] The outside of the conveyor belt 23 is evenly distributed with reserved grooves 24, and the reserved grooves 24 penetrate the conveyor belt 23. An intermediate plate is fixed in the middle of the conveyor belt 23, and both sides of the intermediate plate are connected to the fixing frame 21. An upper ejection mechanism 7 is arranged above the intermediate plate, and the position of the upper ejection mechanism 7 corresponds to the position of the testing mechanism 3. A limiting plate 241 is arranged around the inside of the reserved slot 24 for placing the chip; In the present application, first, the chips to be tested are placed on the limit plates 241 inside the reserved slots 24 according to the positions of the reserved slots 24 on the conveyor belt 23. Then, the control motor is started to drive the rotating roller 22 to rotate. When the rotating roller 22 rotates, it drives the conveyor belt 23 to transport the chips in the reserved slots 24 on the conveyor belt 23.
[0022] Furthermore, according to Figure 1 As shown, the test mechanism 3 includes a first fixed frame 31, a first cylinder 32 and a test body 33. The first fixed frame 31 is arranged in an "L" shape, and the first cylinder 32 and the test body 33 are connected at the bottom of the top thereof; After the chip reaches the placement slot 12 and is positioned, the first cylinder 32 at the bottom of the first fixed frame 31 can be started to drive the test body 33 at the bottom thereof to descend, thereby completing the test of the chip.
[0023] In this application, according to Figure 1 and Figure 2 As shown, the lower ejection mechanism 4 includes a second fixed frame 41, a second cylinder 42 and a lower ejector head 43. The shape of the second fixed frame 41 is the same as that of the first fixed frame 31, and the second cylinder 42 and the lower ejector head 43 are connected to each other at the top and bottom of the second fixed frame 41. The positions of the testing mechanism 3 and the lower ejection mechanism 4 correspond to the positions of the placement slots 12, and the distance between the testing mechanism 3 and the lower ejection mechanism 4 is the same as the distance between adjacent reserved slots 24; Specifically, in the process of conveying the chips in the reserved slots 24 by the conveyor belt 23, since the positions of the reserved slots 24 correspond to the positions of the two placement slots 12, the chip loading work can be completed in the placement slots 12 at the bottom of the test mechanism 3, and the chip unloading work can be completed at the same time, thereby achieving the effect of continuous loading and unloading and improving the test efficiency; When unloading, it is necessary to start the second cylinder 42 at the bottom of the second fixed frame 41 to drive the lower ejector 43 at the bottom thereof to descend, thereby completing the effect of ejecting and conveying the chips in the placement slot 12 below it downward.
[0024] As a further preferred embodiment of this invention, according to Figure 3 As shown, the extrusion limiting mechanism includes a placement component 5 and an extrusion component 6, which are arranged at staggered positions on four sides of the placement slot 12, and the placement component 5 is arranged at a position biased toward the lower side of the placement slot 12, and the extrusion component 6 is arranged at an upper side of the placement slot 12, and the placement component 5 and the extrusion component 6 are both composed of two rotating baffle mechanisms 9; When the chip is fed from bottom to top into the extrusion limiting mechanism, the chip is lifted up by the upper ejection mechanism 7 at the bottom, and the extrusion placement component 5 and the extrusion component 6 rotate upward together. When the chip is lifted up, when the chip is completely separated from the placement component 5 but not separated from the extrusion component 6, the upper ejection mechanism 7 needs to be closed. At this time, the chip automatically falls, and the placement component 5 is reset to a horizontal state, so that the chip can fall to the placement component 5 for placement. At this time, the extrusion component 6 is reset and tilted downward, and the chip is squeezed, thereby completing the limiting work. When unloading, the chip will be squeezed by the lower ejection mechanism 4, causing it to drive the placement component 5 to descend. When the chip is completely separated from the placement component 5, the chip falls onto the limiting plate 241 on the corresponding reserved groove 24 for limiting, and is then completely transported out by the conveyor belt 23.
[0025] Specifically, according to Figure 7 As shown, the upper ejection mechanism 7 includes a third cylinder 71 and a top plate 72. The top plate 72 is provided at the top of the third cylinder 71, and the central axis of the top plate 72 coincides with the central axis of the testing mechanism 3. When lifting upward, the third cylinder 71 needs to be started so that it drives the top plate 72 to move upward, thereby achieving the effect of lifting upward.
[0026] As a further preferred embodiment of this invention, according to Figure 8 and Fig. 9As shown, the rotating baffle mechanism 9 includes a fixing rod 91, a baffle assembly 92 and a torsion spring 93. The fixing rod 91 is fixedly arranged in a groove on the inner wall of the placement slot 12, and its outer portion is connected to the baffle assembly 92 through the torsion spring 93. The baffle assembly 92 is an up-and-down rotating mechanism under the action of the torsion spring 93. The baffle assembly 92 on the placement assembly 5 is initially in a horizontal state, and the baffle assembly 92 on the extrusion assembly 6 is initially in a downwardly inclined state. When the placement component 5 and the extrusion component 6 rotate, the baffle component 92 rotates. When the baffle component 92 rotates, it causes the torsion spring 93 to deform. Therefore, when the placement component 5 and the extrusion component 6 are not subjected to the extrusion force of the ejection mechanism, they will be reset under the action of the torsion spring 93 and return to the initial state, completing the extrusion and placement of the chip. The baffle assembly 92 includes a rotating seat 921, a middle hole 922, a mounting groove 923, a rotating plate 924 and a mounting block 925. The outer side of the rotating seat 921 is penetrated by a middle hole 922 for connecting with the fixing rod 91 through a torsion spring 93, and a mounting groove 923 is provided at the top of the rotating seat 921. The inside of the mounting groove 923 is connected to the mounting block 925, and the rotating plate 924 with an inclined bottom structure is integrally installed at the top of the mounting block 925. There is a disassembly and installation structure between the rotating seat 921 and the installation block 925, and its installation method is any one of bolts, screws or mortise and tenon joints; When it is necessary to test chips of different sizes, the mounting block 925 and the mounting slot 923 can be disassembled according to the gears of the chip. After that, the rotating plates 924 of different sizes can be replaced, thereby completing the positioning of chips of different sizes, ensuring that the entire device has a wider range of applications. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.
[0027] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A positioning device for chip testing, comprising: A positioning body (1) is used to place and position the chip; A conveying body (2), which is arranged at the bottom of the positioning body (1), and whose central axis corresponds vertically to the central axis of the positioning body (1); It is characterized in that Also includes; A testing mechanism (3) is arranged at a top side of the positioning body (1) and is used to test the chip positioned on the positioning body (1); A lower ejection mechanism (4) is arranged at the other side of the top of the positioning body (1) and is used to eject the chip after the test downward to the top of the conveying body (2) to complete the output work; An upper ejection mechanism (7) is also provided above the conveying body (2) for ejecting the chip conveyed on the conveying body (2) upwards to the positioning body (1).
2. A chip testing positioning device according to claim 1, characterized in that: A circular rotating worktable (11) is arranged in the middle of the positioning body (1), a cylinder is coaxially connected to the bottom of the rotating worktable (11), and a driving assembly (8) is arranged outside the cylinder for rotating the cylinder; The driving assembly (8) comprises a driving motor (81), a driving gear (82) and a meshing gear (83); the top end of the driving motor (81) is coaxially connected to the driving gear (82), and the top end of the driving gear (82) is connected to a bottom bearing of the positioning body (1); the outer side of the driving gear (82) is meshed with the meshing gear (83), and the meshing gear (83) is coaxially connected to the bottom of the cylinder.
3. A chip testing positioning device according to claim 2, characterized in that: Two placement grooves (12) are symmetrically arranged on the outside of the rotating worktable (11), and through grooves (10) are symmetrically arranged below the placement grooves (12). The through grooves (10) penetrate the positioning body (1), and an extrusion limiting mechanism is arranged inside the placement grooves (12) for performing extrusion limiting work on the chip.
4. A chip testing positioning device according to claim 1, characterized in that: The conveying body (2) comprises two fixed frames (21), a rotating roller (22) and a conveyor belt (23); the rotating rollers (22) are arranged at the middle bearings at the head and tail of the two fixed frames (21); the conveyor belts (23) are wound around the outsides of the rotating rollers (22) at the head and tail; and a control motor is coaxially connected to the top end of one of the rotating rollers (22) for controlling the rotating roller (22) to rotate.
5. A chip testing positioning device according to claim 4, characterized in that: The outside of the conveyor belt (23) is evenly distributed with reserved grooves (24), and the reserved grooves (24) penetrate the conveyor belt (23); an intermediate plate is fixed in the middle of the conveyor belt (23), and both sides of the intermediate plate are connected to the fixing frame (21); an upper ejection mechanism (7) is arranged above the intermediate plate, and the position of the upper ejection mechanism (7) corresponds to the position of the testing mechanism (3); Limiting plates (241) are arranged around the inside of the reserved slot (24) for placing the chip.
6. A chip testing positioning device according to claim 1, characterized in that: The testing mechanism (3) comprises a first fixed frame (31), a first cylinder (32) and a testing body (33); the first fixed frame (31) is arranged in an "L"-shaped structure, and the first cylinder (32) and the testing body (33) are connected to each other at the bottom of the top end.
7. A chip testing positioning device according to claim 1, characterized in that: The lower ejection mechanism (4) comprises a second fixed frame (41), a second cylinder (42) and a lower ejector head (43); the second fixed frame (41) has the same outer shape as the first fixed frame (31), and the second cylinder (42) and the lower ejector head (43) are connected to each other at the top and bottom of the second fixed frame (41); The positions of the testing mechanism (3) and the lower ejection mechanism (4) correspond to the positions of the placement slots (12), and the distance between the testing mechanism (3) and the lower ejection mechanism (4) is the same as the distance between adjacent reserved slots (24).
8. A chip testing positioning device according to claim 3, characterized in that: The extrusion limiting mechanism comprises a placement component (5) and an extrusion component (6); the placement component (5) and the extrusion component (6) are arranged at staggered positions on four sides of the placement slot (12); the placement component (5) is arranged at a position biased toward the bottom of the placement slot (12); and the extrusion component (6) is arranged at a position biased toward the top of the placement slot (12); and the placement component (5) and the extrusion component (6) are both composed of two rotating baffle mechanisms (9).
9. A chip testing positioning device according to claim 1, characterized in that: The upper ejection mechanism (7) comprises a third cylinder (71) and a top plate (72); the top of the third cylinder (71) is provided with the top plate (72), and the central axis of the top plate (72) coincides with the central axis of the testing mechanism (3).
10. A chip testing positioning device according to claim 8, characterized in that: The rotating baffle mechanism (9) comprises a fixing rod (91), a baffle assembly (92) and a torsion spring (93); the fixing rod (91) is fixedly arranged in a groove on the inner wall of the placement groove (12), and its exterior is connected to the baffle assembly (92) via the torsion spring (93); and the baffle assembly (92) is an up-and-down rotating mechanism under the action of the torsion spring (93); the baffle assembly (92) on the placement assembly (5) is initially in a horizontal state, and the baffle assembly (92) on the extrusion assembly (6) is initially in a downwardly inclined state; The baffle assembly (92) comprises a rotating seat (921), a middle hole (922), a mounting groove (923), a rotating plate (924) and a mounting block (925); the outer side of the rotating seat (921) is penetrated by a middle hole (922) for connecting with the fixed rod (91) via a torsion spring (93); the top end of the rotating seat (921) is provided with a mounting groove (923); the interior of the mounting groove (923) is connected with the mounting block (925); and the top end of the mounting block (925) is integrally mounted with a rotating plate (924) with an inclined bottom structure; A disassembly and installation structure is provided between the rotating seat (921) and the installation block (925), and the installation method is any one of bolts, screws or mortise and tenon joints.
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