Light emitting assembly, optical module and packaging method of light emitting assembly

Abstract

The invention discloses a light emitting assembly, an optical module and a packaging method of the light emitting assembly. The light emitting assembly comprises an integrated base, a tube cap, a tube shell, a metal block, a coc substrate and an adapter assembly. The integrated base comprises a heat dissipation bottom plate, a cold surface substrate and bismuth antimonide particles; the bismuth antimonide particles are arranged between the cold surface substrate and the heat dissipation bottom plate; the metal block is welded and fixed on the cold surface substrate; the coc substrate is welded and fixed on the metal block, and a laser chip and a backlight monitoring chip are arranged on the coc substrate; pins are embedded in the heat dissipation bottom plate and are respectively connected with the laser chip and the backlight monitoring chip; the pipe cap seals the cold surface substrate, the bismuth antimonide particles, the metal block and the coc substrate; the connecting port of the tube shell is welded and fixed on the edge of the heat dissipation bottom plate; the adapter assembly is welded and fixed to the light outlet of the tube shell. According to the light emitting assembly, the heat conduction difference between different substances caused by bonding of the conventional ceramic hot surface substrate and the metal base is avoided, and the heat conversion efficiency of the light emitting assembly is improved.

Description

Technical Field

[0001] The present invention relates to the technical fields of data communication center, Internet of Things cloud, sensing and mapping, and in particular to an optical emission component, an optical module and a packaging method for the optical emission component. Background Art

[0002] The optical transmitter assembly (TOSA, the abbreviation of Transmitter Optical Subassembly) is mainly used to convert electrical signals into optical signals (E / O conversion), generally including semiconductor coolers (Thermoelectric Cooler, English abbreviation TEC), lenses, COC substrates (Chip on Carrier, a substrate that can carry chips, which can be made of materials such as aluminum nitride), laser chips (LD chips), backlight monitoring chips (MPD chips) and other devices. Due to the differences in the performance of each device, most of the devices inside the optical transmitter assembly are mainly fixed with conductive silver glue, the laser chip is welded on the COC substrate, and the lens is fixed with UV glue.

[0003] When packaging the chip optical path, considering the heat generation characteristics of the chip during operation, a semiconductor cooler is needed to control the temperature of the chip to keep it at a constant temperature so that it can be in the best working state and the best designed service life for a long time. Then, the cap is used for airtight packaging to achieve the original intention of reliability design.

[0004] In the prior art, the method of packaging a base with a semiconductor refrigerator includes: bonding and curing the metal base with the conductive silver glue of the semiconductor refrigerator, and combining the metal base with pre-set solder and the hot surface of the semiconductor refrigerator. Summary of the invention

[0005] In order to enrich the product types of optical emission components and increase the selection space of optical emission component packaging methods, an embodiment of the present invention provides an optical emission component, an optical module and a packaging method of an optical emission component.

[0006] In a first aspect, an embodiment of the present invention provides an optical transmission component, including an integrated base, a tube cap, a tube shell, a metal block, a coc substrate and an adapter component;

[0007] The integrated base comprises a heat dissipation base plate, a cold surface substrate and bismuth antimonide particles;

[0008] The bismuth antimonide particles are arranged between the cold surface substrate and the heat dissipation bottom plate for thermoelectric conversion;

[0009] The metal block is welded and fixed to the cold surface substrate;

[0010] The coc substrate is welded and fixed to the metal block, and a wire bonding capacitor, a thermistor, a laser chip and a backlight monitoring chip are arranged on the coc substrate;

[0011] The heat dissipation base plate is embedded with pins, which are respectively connected to the laser chip and the backlight monitoring chip;

[0012] The open end of the tube cap is welded and fixed to the surface of the heat dissipation base plate, and the cold surface substrate, the bismuth antimonide particles, the metal block and the coc substrate are sealed;

[0013] The connection port of the tube shell is welded and fixed to the edge of the heat dissipation base plate;

[0014] The adapter assembly is welded and fixed to the light outlet of the tube shell.

[0015] In one or some optional embodiments, the light emitting assembly further comprises a lens;

[0016] The lens is fixed to the metal block;

[0017] The lens is coupled to the laser chip.

[0018] In one or some optional embodiments, a filter is provided on a side of the tube cap facing the light outlet of the tube shell.

[0019] In one or some optional embodiments, the adapter assembly includes an optical port adapter and an adjustment ring;

[0020] The optical port adapter is fixedly connected to the adjustment ring;

[0021] The adjusting ring is fixedly connected to the light outlet of the tube shell.

[0022] In one or some optional embodiments, the light emitting assembly further comprises a spacer;

[0023] The pad is fixed to the heat dissipation base plate by welding and connected to the coc substrate.

[0024] In a second aspect, an embodiment of the present invention provides an optical module, comprising the optical emitting component described in the first aspect.

[0025] In a third aspect, an embodiment of the present invention provides a packaging method for an optical transmission component, comprising:

[0026] After the bismuth antimonide particles are sequentially mounted on the heat dissipation base plate, the heat dissipation base plate is placed in an oven for baking and pre-curing;

[0027] Mounting a cold surface substrate on the bismuth antimonide particles so that the bismuth antimonide particles are located between the heat dissipation base plate and the cold surface substrate;

[0028] Mounting a metal block on the cold surface substrate;

[0029] Mounting the coc substrate on the cold surface substrate;

[0030] Mounting the laser chip, thermistor, bonding capacitor and backlight monitoring chip on the cold surface substrate in sequence according to preset positions;

[0031] Connecting the laser chip and the backlight monitoring chip to the heat dissipation base plate through gold wire bonding;

[0032] Welding the bottom of the tube cap to the surface of the heat dissipation base plate to seal the cold surface substrate, the bismuth antimonide particles and the coc substrate;

[0033] Welding and fixing the connection port of the tube shell to the edge of the heat dissipation base plate;

[0034] The adapter assembly is welded and fixed to the light outlet of the tube shell.

[0035] In one or some optional embodiments, the step of welding and fixing the adapter assembly to the light outlet of the tube shell comprises:

[0036] According to the preset coupling value range, the adjustment ring is welded and fixed to the optical port adapter;

[0037] According to the center value of the preset coupling value range, the adjustment ring is welded and fixed to the light outlet of the tube shell.

[0038] In one or some optional embodiments, before welding the bottom of the tube cap to the surface of the heat dissipation base plate to seal the cold surface substrate, the bismuth antimonide particles and the coc substrate, it also includes:

[0039] The lens is fixed to the metal block.

[0040] In one or some optional embodiments, fixing the lens to the metal block comprises:

[0041] Place the lens at a preset initial position and power on the laser chip;

[0042] The lens is moved so that the optical power value detected by the optical power detection device is the maximum, and the lens is fixedly connected to the metal block.

[0043] The beneficial effects of the above technical solution provided in the embodiments of the present invention include at least:

[0044] The light emitting assembly provided in the embodiment of the present invention is different from the traditional method of sandwiching a semiconductor cooling sheet between a metal base and a coc substrate. Instead, bismuth antimonide particles are arranged between a cold surface substrate and a heat dissipation base plate, and an integrated base with a semiconductor refrigerator is obtained by combining them, so that the heat generated by the semiconductor refrigerator after work is directly dissipated from the heat dissipation base plate, thereby avoiding the difference in heat conduction between different materials caused by the bonding of a conventional ceramic hot surface substrate and a metal base. In addition, the connection port of the tube shell is directly welded and fixed to the edge of the heat dissipation base plate, and will not form a wrap around the heat dissipation base plate. The heat received by the heat dissipation base plate does not need to be transferred outward through another structure, which greatly improves the heat conversion efficiency of the light emitting assembly. At the same time, the heat dissipation base plate is embedded with pins, which can be electrically connected to each component on the coc substrate, simplifying the structure of the light emitting assembly, reducing the steps of packaging and wiring, and helping to improve the packaging production efficiency.

[0045] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0046] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0048] Figure 1 A schematic diagram of the structure of a light emitting assembly provided in an embodiment of the present invention;

[0049] Figure 2 A partial structural schematic diagram of a light emitting assembly provided in an embodiment of the present invention;

[0050] Figure 3 A schematic diagram of the structure of a heat dissipation base plate provided in an embodiment of the present invention;

[0051] Figure 4 A schematic diagram of the structure of an integrated base provided in an embodiment of the present invention;

[0052] Figure 5 The figure is a flow chart of a packaging method of a light emitting component provided in an embodiment of the present invention.

[0053] Reference numerals:

[0054] 1. Integrated base; 101. Heat dissipation base plate; 102. Cold surface substrate; 103. Bismuth antimonide particles; 2. Tube cap; 3. Tube shell; 4. Metal block; 5. Coc substrate; 6. Adapter assembly; 601. Optical port adapter; 602. Adjustment ring; 7. Bonding capacitor; 8. Thermistor; 9. Laser chip; 10. Backlight monitoring chip; 11. Spacer; 12. Lens. DETAILED DESCRIPTION

[0055] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0056] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "far", "near", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The inventors found that the base and the semiconductor cooler were mounted and cured using conductive silver glue, which resulted in reduced heat conduction efficiency and insufficient heat dissipation area due to material differences. The base was pre-mounted with solder and eutectic mounted with the hot surface of the semiconductor cooler, which increased the heat conduction efficiency compared to the conductive silver glue. However, due to the differences in materials, the thermal conduction and heat dissipation could not reach the optimal state.

[0059] In view of this, an embodiment of the present invention provides an optical transmission component, an optical module, and a packaging method of the optical transmission component, which are described in detail below through specific embodiments.

[0060] Embodiment 1

[0061] An embodiment of the present invention provides a light emitting component, referring to Figure 1-Figure 4 As shown, it includes an integrated base 1, a tube cap 2, a tube shell 3, a metal block 4, a coc substrate 5 and an adapter assembly 6;

[0062] The integrated base 1 includes a heat dissipation base plate 101, a cold surface substrate 102 and bismuth antimonide particles 103;

[0063] The bismuth antimonide particles 103 are disposed between the cold surface substrate 102 and the heat dissipation base plate 101 for thermoelectric conversion;

[0064] The metal block 4 is welded and fixed to the cold surface substrate 102;

[0065] The coc substrate 5 is welded and fixed to the metal block 4, and a bonding capacitor 7, a thermistor 8, a laser chip 9 and a backlight monitoring chip 10 are arranged on the coc substrate 5;

[0066] The heat dissipation base plate 101 is embedded with pins, which are respectively connected to the laser chip 9 and the backlight monitoring chip 10;

[0067] The open end of the tube cap 2 is welded and fixed to the surface of the heat dissipation base plate 101, and the cold surface substrate 102, the bismuth antimonide particles 103, the metal block 4 and the coc substrate 5 are sealed;

[0068] The connection port of the tube shell 3 is welded and fixed to the edge of the heat dissipation base plate 101;

[0069] The adapter assembly 6 is welded and fixed to the light outlet of the tube shell 3 .

[0070] In the embodiment of the present invention, the optical emission assembly further comprises a pad 11 fixed on the heat dissipation base plate 101 , and the pad 11 is connected to the coc substrate 5 via a gold wire bonding wire.

[0071] In the embodiment of the present invention, referring to Figure 1 and Figure 2 As shown, the optical emitting assembly further includes a lens 12 fixed on the metal block 4, and the lens 12 is coupled to the laser chip 9, that is, the mounting position of the lens 12 on the metal block 4 is determined according to the target coupling value between the lens 12 and the laser chip 9.

[0072] In the embodiment of the present invention, a filter (not shown in the figure) is provided on the side of the tube cap 2 facing the light outlet of the tube shell 3, so that the light emitted by the laser chip 9 and transmitted through the lens 12 can pass through the tube cap 2 and be transmitted in the direction of the adapter assembly 6.

[0073] In the embodiment of the present invention, bismuth antimonide particles 103 are arranged between a cold surface substrate 102 and a heat dissipation base plate 101 to obtain an integrated base 1 with a semiconductor refrigerator, and the size of the cold surface substrate 102 is smaller than that of the heat dissipation base plate 101, and the cold surface substrate 102 is located at the center of the heat dissipation base plate 101; the metal block 4 is fixed on the cold surface substrate 102, the coc substrate 5 and the lens 12 mounted with components such as a laser chip 9 are fixed on the metal block 4, and the open end of the tube cap 2 is fixed to the surface of the heat dissipation base plate 101 connected with the bismuth antimonide particles 103, so that the bismuth antimonide particles 103, the cold surface substrate 102, the pad 11, the lens 12, the metal block 4, the coc substrate 5 and the components on the coc substrate 5 located on the heat dissipation base plate 101 are sealed, and the tube shell 3 is sleeved on the outside of the tube cap 2, and the connection port of the tube shell 3 is directly welded and fixed to the surface of the tube shell 3, so as to obtain an integrated packaged laser. Compared with existing lasers and light emitting components, the laser provided in this embodiment has an integrated base 1 with a semiconductor cooler function. There is no need to set an additional metal base under the heat dissipation base plate 101, nor is there a need to set a fully wrapped tube shell 3. Instead, the tube shell 3 is fixed to the edge of the integrated base 1, so that the bottom surface of the heat dissipation base plate 101 does not need to be bonded or welded to other components, and the heat can be directly dissipated.

[0074] The light emitting assembly provided in the embodiment of the present invention is different from the conventional semiconductor cooling sheet sandwiched between the metal base and the coc substrate 5. Instead, the bismuth antimonide particles 103 are arranged between the cold surface substrate 102 and the heat dissipation base plate 101, and an integrated base 1 with a semiconductor refrigerator is obtained by combining them, so that the heat generated by the semiconductor refrigerator after work is directly dissipated from the heat dissipation base plate 101, thereby avoiding the difference in heat conduction between different materials caused by the bonding of the conventional ceramic hot surface substrate and the metal base. In addition, the connection port of the tube shell 3 is directly welded and fixed to the edge of the heat dissipation base plate 101, and will not form a wrap around the heat dissipation base plate 101. The heat received by the heat dissipation base plate 101 does not need to be transferred outward through another structure, which greatly improves the heat conversion efficiency of the light emitting assembly. At the same time, the heat dissipation base plate 101 is embedded with pins, which can be electrically connected to each component on the coc substrate 5, simplifying the structure of the light emitting assembly, reducing the operation steps of packaging and wiring, and helping to improve the packaging production efficiency.

[0075] In the embodiment of the present invention, referring to Figure 1 and Figure 2 As shown, the laser chip 9 is connected to the wire bonding capacitor 7 and thermistor 8 through gold wire bonding wires to obtain an integrated laser light source driving circuit for driving the laser chip 9 to emit light. The backlight monitoring chip 10 is connected to the heat dissipation base plate 101 through gold wire bonding wires to monitor the light emission state of the laser chip 9.

[0076] The light emitting component provided in the embodiment of the present invention, by setting a metal block 4 on the cold surface substrate 102 and mounting the coc substrate 5 on the metal block 4, can effectively transfer the cold energy generated by the semiconductor refrigerator after working to the coc substrate 5, thereby effectively reducing the temperature of the coc substrate 5 and each component on the coc substrate 5.

[0077] The light emitting component provided in the embodiment of the present invention can avoid damage to the light emitting component by the external environment by setting a tube cap 2 to seal the cold surface substrate 102, bismuth antimonide particles 103, metal block 4, coc substrate 5 and various components on the coc substrate 5, which is beneficial to ensure the stable operation of the light emitting component and increase the service life of the light emitting component.

[0078] In an alternative embodiment, referring to Figure 1 As shown, the adapter assembly 6 includes an optical port adapter 601 and an adjustment ring 602. The adjustment ring 602 is disposed between the laser and the optical port adapter 601 and is used to adjust the focal length. Specifically, the optical port adapter 601 and the adjustment ring 602 are coupled with the laser, one end of the adjustment ring 602 is welded and fixed to the optical port adapter 601, and the other end is welded and fixed to the light-emitting port of the tube shell 3.

[0079] In an optional embodiment, the heat dissipation base plate 101 is a ceramic substrate with wired guide strips and metal pins embedded in its vias, so as to realize the integration of the base function and the hot surface substrate function of the semiconductor refrigerator, thereby improving the heat dissipation efficiency. The cold surface substrate 102 is a ceramic substrate with wired guide strips. The bismuth antimonide particles 103 are P particles and N particles that have been cut according to preset specifications, and are powered through the guide strips arranged on the heat dissipation base plate 101 and the cold surface substrate 102, thereby performing cooling.

[0080] Embodiment 2

[0081] Based on the same inventive concept, the embodiment of the present invention also provides a packaging method for an optical transmitter component, referring to Figure 5 As shown, including:

[0082] S101: After the bismuth antimonide particles 103 are sequentially mounted on the heat dissipation base plate 101, the heat dissipation base plate 101 is placed in an oven for baking and pre-curing;

[0083] S102: attaching the cold surface substrate 102 to the bismuth antimonide particles 103 so that the bismuth antimonide particles 103 are located between the heat dissipation base plate 101 and the cold surface substrate 102;

[0084] S103: attaching the metal block 4 to the cold surface substrate 102;

[0085] S104: Mounting the coc substrate 5 on the cold surface substrate 102;

[0086] S105: mounting the laser chip 9, thermistor 8, bonding capacitor 7 and backlight monitoring chip 10 on the cold surface substrate 102 in sequence according to preset positions;

[0087] S106: Connect the laser chip 9 and the backlight monitoring chip 10 to the heat dissipation base plate 101 through gold wire bonding;

[0088] S107: welding the bottom of the tube cap 2 to the surface of the heat dissipation base plate 101 to seal the cold surface substrate 102, the bismuth antimonide particles 103 and the coc substrate 5;

[0089] S108: welding and fixing the connection port of the tube shell 3 to the edge of the heat dissipation base plate 101;

[0090] S109 : welding and fixing the adapter assembly 6 to the light outlet of the tube shell 3 .

[0091] In an embodiment of the present invention, the bismuth antimonide particles 103 are P particles and N particles that have been cut according to preset specifications. Step S101: after the bismuth antimonide particles 103 are sequentially mounted on the heat dissipation base plate 101, the heat dissipation base plate 101 is placed in an oven for baking and pre-curing. Specifically, it may include: alternately mounting the P particles and the N particles on the heat dissipation base plate 101 according to preset mounting positions, so that the P particles and the N particles are electrically connected to the guide strips arranged on the surface of the heat dissipation base plate 101, and then placing the heat dissipation base plate 101 in an oven for baking and pre-curing, so that the P particles and the N particles will not shift during subsequent mounting work. Correspondingly, step S102: mounting the cold surface substrate 102 on the bismuth antimonide particles 103 so that the bismuth antimonide particles 103 are located between the heat dissipation base plate 101 and the cold surface substrate 102, which may specifically include mounting the cold surface substrate 102 on the other side of the P particles and the N particles, and electrically connecting the P particles and the N particles to the guide strips arranged on the surface of the cold surface substrate 102.

[0092] In the embodiment of the present invention, through steps S103, S104, S105 and S106, the metal block 4, the coc substrate 5, the laser chip 9, the thermistor 8, the bonding capacitor 7 and the backlight monitoring chip 10 are stacked and mounted and connected by welding wires in sequence according to preset positions. Compared with the traditional planar mounting, the cumulative tolerance of the patch can be reduced, and the glue or solder used for mounting can be maximized.

[0093] In the embodiment of the present invention, between step S106 and step S107, the process may further include welding and fixing the pad 11 to the heat dissipation base plate 101, and connecting the pad 11 to the coc substrate 5 through a gold wire bonding line.

[0094] In the embodiment of the present invention, before step S107, the method further includes: fixing the lens 12 to the metal block 4 according to the preset coupling value between the lens 12 and the laser chip 9. Specifically, the method may include:

[0095] The lens 12 is placed at a preset initial position on the metal block 4, and the laser chip 9 is powered on;

[0096] The lens 12 is moved so that when the optical power value detected by the optical power detection device is the maximum, the lens 12 is fixedly connected to the metal block 4, so that the mounting position of the lens 12 can ensure the optimal working state of the laser.

[0097] In the embodiment of the present invention, the adapter assembly 6 includes an adjustment ring 602 and an optical port adapter 601. Step S109: welding and fixing the adapter assembly 6 to the optical port of the tube shell 3 may specifically include:

[0098] According to the preset coupling value range, the adjustment ring 602 is welded and fixed to the optical port adapter 601; specifically, the adjustment ring 602 and the optical port adapter 601 are placed together at the light outlet of the tube shell 3, so that the adjustment ring 602 and the optical port adapter 601 are coupled with the laser. When the coupling degree between the adjustment ring 602 and the optical port adapter 601 and the laser reaches the preset coupling value range, the adjustment ring 602 and the optical port adapter 601 are welded and fixed to obtain an integrated adapter assembly 6, and then the integrated adapter assembly 6 is coupled to the laser. When the coupling degree between the integrated adapter assembly 6 and the laser reaches the central value of the preset coupling value range, the adjustment ring 602 end of the adapter assembly 6 is welded and fixed to the light outlet of the tube shell 3 to complete the overall connection of the light emitting assembly. When the light emitting component is powered on, the integrated base transfers the cold energy generated by the semiconductor refrigeration from the cold surface substrate 102 to the coc substrate 5, thereby cooling the laser chip 9 and the entire light emitting circuit. In addition, the heat of the heat dissipation base plate 101 is transferred to the outside of the light emitting component through the heat dissipation base plate 101 itself and the tube shell 3, thereby realizing the overall cooling of the light emitting component.

[0099] The packaging method of the light emitting component provided in the embodiment of the present invention combines the heat dissipation base plate 101, bismuth antimonide particles 103 and the cold surface substrate 102 to obtain an integrated base 1 with a semiconductor refrigerator function. There is no need to weld or bond the base and / or shell to the semiconductor refrigerator, which reduces the packaging steps, simplifies the structure in the light emitting component, and avoids the difference in thermal conduction between different substances caused by the bonding of conventional ceramic hot surface substrates and metal bases, thereby improving the heat dissipation efficiency and cooling efficiency.

[0100] Embodiment 3

[0101] Based on the same inventive concept, an embodiment of the present invention further provides an optical module, including the optical emitting component described in the first embodiment.

[0102] Obviously, various changes and modifications may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention. The present disclosure is not limited to the precise structure described above and shown in the accompanying drawings, and various changes and modifications may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims. Thus, if these changes and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these changes and modifications.

Claims

1. A light emitting component, characterized in that: Includes integrated base, cap, shell, metal block, coc substrate and adapter assembly; The integrated base comprises a heat dissipation base plate, a cold surface substrate and bismuth antimonide particles; The bismuth antimonide particles are arranged between the cold surface substrate and the heat dissipation bottom plate for thermoelectric conversion; The metal block is welded and fixed to the cold surface substrate; The coc substrate is welded and fixed to the metal block, and a wire bonding capacitor, a thermistor, a laser chip and a backlight monitoring chip are arranged on the coc substrate; The heat dissipation base plate is embedded with pins, which are respectively connected to the laser chip and the backlight monitoring chip; The open end of the tube cap is welded and fixed to the surface of the heat dissipation base plate, and the cold surface substrate, the bismuth antimonide particles, the metal block and the coc substrate are sealed; The connection port of the tube shell is welded and fixed to the edge of the heat dissipation base plate; The adapter assembly is welded and fixed to the light outlet of the tube shell.

2. The light emitting assembly according to claim 1, characterized in that: Also includes lenses; The lens is fixed to the metal block; The lens is coupled to the laser chip.

3. The light emitting assembly according to claim 1, characterized in that: A filter is arranged on one side of the tube cap facing the light outlet of the tube shell.

4. The light emitting assembly according to claim 1, characterized in that: The adapter assembly includes an optical port adapter and an adjustment ring; The optical port adapter is fixedly connected to the adjustment ring; The adjusting ring is fixedly connected to the light outlet of the tube shell.

5. The light emitting assembly according to claim 1, characterized in that: Also includes spacers; The pad is fixed to the heat dissipation base plate by welding and connected to the coc substrate.

6. An optical module, characterized in that: Comprising the light emitting assembly as claimed in any one of claims 1 to 5.

7. A packaging method for an optical transmission component, characterized in that: include: After the bismuth antimonide particles are sequentially mounted on the heat dissipation base plate, the heat dissipation base plate is placed in an oven for baking and pre-curing; Mounting a cold surface substrate on the bismuth antimonide particles so that the bismuth antimonide particles are located between the heat dissipation base plate and the cold surface substrate; Mounting a metal block on the cold surface substrate; Mounting the coc substrate on the cold surface substrate; Mounting the laser chip, thermistor, bonding capacitor and backlight monitoring chip on the cold surface substrate in sequence according to preset positions; Connecting the laser chip and the backlight monitoring chip to the heat dissipation base plate through gold wire bonding; Welding the bottom of the tube cap to the surface of the heat dissipation base plate to seal the cold surface substrate, the bismuth antimonide particles and the coc substrate; Welding and fixing the connection port of the tube shell to the edge of the heat dissipation base plate; The adapter assembly is welded and fixed to the light outlet of the tube shell.

8. The packaging method of the optical transmission component according to claim 7, characterized in that: The step of welding and fixing the adapter assembly to the light outlet of the tube shell comprises: According to the preset coupling value range, the adjustment ring is welded and fixed to the optical port adapter; According to the center value of the preset coupling value range, the adjustment ring is welded and fixed to the light outlet of the tube shell.

9. The packaging method of the optical transmission component according to claim 7, characterized in that: Before welding the bottom of the tube cap to the surface of the heat dissipation base plate to seal the cold surface substrate, the bismuth antimonide particles and the coc substrate, the method further includes: The lens is fixed to the metal block.

10. The packaging method of the optical transmission component according to claim 9, characterized in that: The step of fixing the lens to the metal block comprises: Place the lens at a preset initial position and power on the laser chip; The lens is moved so that when the optical power value detected by the optical power detection device is the maximum, the lens is fixedly connected to the metal block.

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