Microcup device mask, electronic paper screen and manufacturing method of electronic paper screen

Abstract

The invention provides a microcup device mask, an electronic paper screen and a manufacturing method thereof.The manufacturing method of the electronic paper screen comprises the following steps that S1, a substrate material is conveyed to a gluing mechanism through a first feeding roller shaft, and a first ITO electrode layer is coated with a layer of imprinting glue through the gluing mechanism; s2, feeding the substrate material and the imprinting glue to a micro-cup device mask plate, and carrying out imprinting and exposure by a micro-cup manufacturing mechanism to form a micro-cup device; s3, ink adding equipment adds ink into the microcup device; and S4, pressing the second ITO electrode layer of the packaging film on the microcup device and the ink to form the electronic paper screen. Through the composite manufacturing method based on nanoimprint lithography and contact lithography and the packaging method based on roller-to-roller, manufacturing and packaging of the microcup structure needed by the electronic paper screen are achieved, the production efficiency is high, the product precision is easy to guarantee, the depth-to-width ratio of the microcup is large, and the product using effect is good.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic paper display, and in particular to a microcup device mask, an electronic paper screen and a manufacturing method thereof. Background Art

[0002] Electronic paper is a new type of display. Compared with traditional displays, electronic paper has the advantages of ultra-thin and ultra-light, wide viewing angle, comfortable reading, passive maintenance, power saving, erasable, reusable, and resource saving. This green and energy-saving display technology is one of the key technologies for building a resource-saving and environmentally friendly society. Therefore, the theoretical basis and core material technology of electronic paper have become research hotspots in recent years.

[0003] There are two main types of microstructures used to realize electronic paper display, one is microcapsule structure and the other is microcup structure. The microcup structure has good mechanical properties and excellent display performance under bending, curling or pressure; it does not need side sealing glue and can be cut into any required form and size. During electrophoretic display, liquids in adjacent areas will not mix or cross-talk with each other, ensuring the accuracy of the display. The two existing methods for manufacturing microcup structures each have their own advantages and disadvantages. The microcup structure processed by mask lithography has high dimensional accuracy but low production efficiency and high production cost. As the aspect ratio increases, the side wall of the microcup will tilt, resulting in a decrease in product quality. The nanoimprinting method has high production efficiency and low cost, but the yield rate is also low and it is also impossible to produce microcup structures with high aspect ratios. Summary of the invention

[0004] The purpose of the present invention is to provide a microcup device mask, an electronic paper screen and a manufacturing method thereof with high production efficiency and easy product precision assurance

[0005] The present invention provides a method for manufacturing an electronic paper screen, comprising the following steps:

[0006] S1: providing a substrate material having a first substrate at the bottom and a first ITO electrode layer on the first substrate, wherein the substrate material is fed to a coating mechanism by a first feeding roller and a layer of embossing glue is coated on the first ITO electrode layer by the coating mechanism;

[0007] S2: The substrate material and the imprinting glue are sent to the microcup device mask and the microcup manufacturing mechanism performs imprinting and exposure to form a microcup device;

[0008] S3: ink adding device adds ink to the microcup device;

[0009] S4: providing a packaging film with a second substrate at the bottom and a second ITO electrode layer on the second substrate, wherein the second ITO electrode layer of the packaging film is pressed tightly on the microcup device and the ink to form an electronic paper screen.

[0010] Furthermore, the method further comprises the following steps: S5: the collecting roller collects the processed electronic paper screen.

[0011] Furthermore, the microcup device mask includes a substrate, a plurality of microcup structure layers arrayed on the substrate, and a metal layer located on each microcup structure layer.

[0012] Further, step S2 includes the following steps:

[0013] S21: The microcup device mask is pressed into the imprinting glue, and there is a certain distance between the bottom of the metal layer of the microcup device mask and the first ITO electrode layer of the substrate material;

[0014] S22: applying UV light irradiation in a direction perpendicular to the microcup device mask, the metal layer of the microcup device mask acts as a light shielding layer, so that part of the embossed adhesive cannot be completely cured, and the embossed adhesive forms a cured adhesive and an uncured adhesive at the bottom of the metal layer of the microcup device mask, and the cured adhesive and the uncured adhesive (132) are arranged at intervals;

[0015] S23: The uncured colloid can be removed by soaking in a developer solution, and the colloid is cured to form a microcup structure, thereby forming a microcup device.

[0016] Further, in step S3, the ink is located between adjacent microcup mechanisms.

[0017] Furthermore, the specific steps of step S4 are: the first packaging roller and the second packaging roller press the second ITO electrode layer of the packaging film wound by the second feeding roller onto the microcup device and the ink to form an electronic paper screen.

[0018] The present invention also provides an electronic paper screen, which includes a first substrate, a first ITO electrode layer located below the first substrate, a microcup mechanism located below the first ITO electrode layer and arranged in an array, ink located between adjacent microcup mechanisms, a second ITO electrode layer covering the microcup mechanism and the ink, and a second substrate located on the second ITO electrode layer.

[0019] Furthermore, the first substrate and the second substrate are both PET substrates.

[0020] The present invention also provides a microcup device mask, which comprises a substrate, a plurality of microcup structure layers arranged in an array on the substrate, and a metal layer located on each microcup structure layer.

[0021] Furthermore, the metal layer is chromium metal.

[0022] The present invention firstly adopts the method of nano-imprinting after glue coating, and the efficiency of micro-cup production can be comparable to that of micro-cups produced by single imprinting, thereby greatly realizing the high-efficiency production of micro-cup structures and reducing production costs.

[0023] At the same time, on the basis of achieving the basic micro-cup width-to-depth ratio by nanoimprinting, the manufacturing accuracy of the micro-cup is further improved through glue coating and photolithography, while achieving a larger depth-to-width ratio in the production of micro-cups and improving the yield rate of micro-cup production.

[0024] In summary, the present invention realizes the manufacturing and packaging of the microcup structure required for the electronic paper screen through a composite manufacturing method based on nanoimprint lithography and contact lithography, and a packaging method based on roll-to-roll. The production efficiency is high, the product precision is easy to ensure, the microcup has a large aspect ratio, and the product has a good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 is a schematic diagram of a microcup device mask according to an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the manufacturing process of an electronic paper screen according to an embodiment of the present invention;

[0028] Figures 3 to 5 A schematic diagram of a manufacturing process of a microcup device for an electronic paper screen according to an embodiment of the present invention;

[0029] Figure 6 A schematic structural diagram of an electronic paper screen according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0032] The present invention discloses a microcup device mask, such as Figure 1 As shown, the microcup device mask 100 includes a substrate 101, a plurality of microcup structure layers 102 arrayed on the substrate 101, and a metal layer 103 located on each microcup structure layer 102. In this embodiment, the metal layer 103 is chromium metal and serves as a light shielding layer.

[0033] The present invention also discloses a method for manufacturing an electronic paper screen, which includes a contact photolithography and embossing composite manufacturing method and a packaging method based on roll-to-roll embossing.

[0034] like Figure 2 The figure shows a schematic diagram of the manufacturing process of an electronic paper screen. The components required for the manufacturing of the electronic paper screen include a first feeding roller 10, a glue coating mechanism 20, a microcup device manufacturing mechanism 30, a microcup device mask 100 located on the microcup device manufacturing mechanism 30, an ink adding device 40, a first packaging roller 50, a second packaging roller 60, a second feeding roller 80, and a receiving roller 70 located between the first packaging roller 50 and the second packaging roller 60.

[0035] The first feed roller 10 is a raw material storage and supply mechanism, and the substrate material provided by the raw material storage and supply mechanism is a PET substrate film coated with ITO. Since the raw material is flexible, the substrate material can be wound on the first feed roller 10. The first feed roller 10 provides raw materials for the manufacture of microcup devices, and the second feed roller 20 provides packaging film for the packaging process, and the packaging film is wound on the second feed roller 20. The substrate material provided by the first feed roller 10 and the packaging film provided by the second feed roller 20 have the same material shape and can be interchangeable.

[0036] like Figure 3 As shown, the substrate material includes a first substrate 11 at the bottom and a first ITO electrode layer 12 located on the first substrate 11. Figure 6 As shown, the encapsulation film includes a second substrate 15 at the bottom and a second ITO electrode layer 16 located on the second substrate 15, wherein the first substrate 11 and the second substrate 15 are both PET substrates.

[0037] The method for manufacturing the electronic paper screen of the present invention comprises the following steps:

[0038] S1: Figure 3 As shown, a substrate material having a first substrate 11 at the bottom and a first ITO electrode layer 12 on the first substrate 11 is provided, the substrate material is fed to a glue coating mechanism 20 by a first feeding roller 10, and a layer of embossing glue 13 is coated on the first ITO electrode layer 12 by the glue coating mechanism 20;

[0039] S2: The substrate material and the embossing glue 13 are sent to the microcup device mask 100 and are embossed and exposed by the microcup manufacturing mechanism 30 to form a microcup device;

[0040] S3: The ink adding device 40 adds ink 200 to the microcup device;

[0041] S4: providing a packaging film having a second substrate 15 at the bottom and a second ITO electrode layer 16 on the second substrate 15, and pressing the second ITO electrode layer 16 of the packaging film wound by the second feeding roller 20 onto the microcup device and the ink 200 by the first packaging roller 50 and the second packaging roller 60 to form an electronic paper screen;

[0042] S5: The collecting roller 70 collects the processed electronic paper screen.

[0043] The above method forms an electronic paper screen.

[0044] The microcup structure 12 formed in the above step S2 is based on a combination of contact lithography and nanoimprint lithography.

[0045] like Figures 3 to 5 The schematic diagram of the stamping process of step S2 is shown, and the steps are:

[0046] S21: Figure 3 As shown, the microcup device mask 100 is pressed into the imprint glue 13 with a certain mechanical force, and the bottom of the metal layer 103 of the microcup device mask 100 is at a certain distance from the first ITO electrode layer 12 of the substrate material;

[0047] S22: UV light is applied perpendicular to the direction of the microcup device mask 100. At this time, since the metal layer 103 of the microcup device mask 100 serves as a light shielding layer, part of the imprint glue 13 cannot be completely cured. Figure 4 As shown, the embossing glue 13 forms a solidified glue 131 and an unsolidified glue 132 located at the bottom of the metal layer 103 of the microcup device mask 100, and the solidified glue 131 and the unsolidified glue 132 are arranged at intervals;

[0048] S23: Figure 5As shown, the uncured colloid 132 can be removed by soaking in a developing solution, and the cured colloid 131 forms a microcup structure 14 with a high aspect ratio. The height, width and distance between adjacent microcup structures 14 are determined by the microcup structure layer 102 of the microcup device mask 100, thereby forming a microcup device.

[0049] In step S3 , the ink 200 is located between adjacent microcup mechanisms 14 .

[0050] The ink adding process mainly involves adding the ink 200 required for the electronic screen into the microcup mechanism 14, and then sealing the ink 200 inside the microcup device through a packaging process.

[0051] In step S4, Figure 6 As shown, the process of packaging the ink 200 is as follows: the first packaging roller 50 and the second packaging roller 60 are pressed together with a certain pressure, and the second ITO electrode layer 16 of the packaging film wrapped by the second feed roller 20 is pressed tightly onto the microcup mechanism 14 of the microcup device and the ink 200, thereby packaging the ink 200.

[0052] The present invention also discloses an electronic paper screen, such as Figure 6 As shown, it includes a first substrate 11, a first ITO electrode layer 12 located below the first substrate 11, a microcup mechanism 14 located below the first ITO electrode layer 12 and arranged in an array, ink 200 located between adjacent microcup mechanisms 14, a second ITO electrode layer 15 covering the microcup mechanism 14 and the ink 200, and a second substrate 16 located on the second ITO electrode layer 15.

[0053] The present invention realizes the manufacture and packaging of the microcup structure required for the electronic paper screen through a composite manufacturing method based on nanoimprint lithography and contact lithography, and a roll-to-roll packaging method, with high production efficiency, easy to ensure product precision, and a large aspect ratio of the microcup structure (which is ensured by the microcup device mask), and the product has a good use effect.

[0054] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A method for manufacturing an electronic paper screen, characterized in that: The steps include: S1: providing a substrate material having a first substrate (11) at the bottom and a first ITO electrode layer (12) located on the first substrate (11); the substrate material is fed to a glue coating mechanism (20) by a first feeding roller (10); and a layer of embossing glue (13) is coated on the first ITO electrode layer (16) by the glue coating mechanism (20); S2: The substrate material and the embossing glue (13) are sent to the microcup device mask (100) and are embossed and exposed by the microcup manufacturing mechanism to form a microcup device; S3: The ink adding device (40) adds ink (200) to the microcup device; S4: providing a packaging film having a second substrate (15) at the bottom and a second ITO electrode layer (16) located on the second substrate (15), wherein the second ITO electrode layer (16) of the packaging film is pressed onto the microcup device and the ink (200) to form an electronic paper screen.

2. The method for manufacturing an electronic paper screen according to claim 1, characterized in that: The following steps are also included: S5: The collecting roller (70) collects the processed electronic paper screen.

3. The method for manufacturing an electronic paper screen according to claim 1, characterized in that: The microcup device mask (100) comprises a substrate (101), a plurality of microcup structure layers (102) arranged in an array on the substrate (101), and a metal layer (103) located on each microcup structure layer (102).

4. The method for manufacturing an electronic paper screen according to claim 3, characterized in that: Step S2 includes the following steps: S21: the microcup device mask (100) is pressed into the embossing glue (13), and a certain distance exists between the bottom of the metal layer (103) of the microcup device mask (100) and the first ITO electrode layer (12) of the substrate material; S22: applying UV light irradiation in a direction perpendicular to the microcup device mask (100), with the metal layer (102) of the microcup device mask (100) serving as a light shielding layer, so that part of the embossed adhesive (13) cannot be completely cured, and the embossed adhesive (13) forms a cured adhesive (131) and an uncured adhesive (132) located at the bottom of the metal layer (103) of the microcup device mask (100), and the cured adhesive (131) and the uncured adhesive (132) are arranged at intervals; S23: The uncured colloid (132) is removed by soaking in a developing solution, and the colloid (131) is cured to form a microcup structure (14), thereby forming a microcup device.

5. The method for manufacturing an electronic paper screen according to claim 4, characterized in that: In step S3, the ink (200) is located between adjacent microcup mechanisms (14).

6. The method for manufacturing an electronic paper screen according to claim 1, characterized in that: The specific steps of step S4 are: the first packaging roller (50) and the second packaging roller (60) press the second ITO electrode layer (16) of the packaging film wound by the second feeding roller (20) onto the microcup device and the ink (200) to form an electronic paper screen.

7. An electronic paper screen manufactured by the method for manufacturing an electronic paper screen according to any one of claims 1 to 6, characterized in that: The invention comprises a first substrate (11), a first ITO electrode layer (12) located below the first substrate (11), microcup structures (14) located below the first ITO electrode layer (12) and arranged in an array, ink (200) located between adjacent microcup structures (14), a second ITO electrode layer (15) covering the microcup structures (14) and the ink (200), and a second substrate (16) located on the second ITO electrode layer (15).

8. The electronic paper screen according to claim 7, characterized in that: The first substrate (11) and the second substrate (15) are both PET substrates.

9. A microcup device mask, characterized in that: The invention comprises a substrate (101), a plurality of microcup structure layers (102) arranged in an array on the substrate (101), and a metal layer (103) located on each microcup structure layer (102).

10. The microcup device mask according to claim 1, characterized in that: The metal layer (103) is chromium metal.

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