Electronic seal label and preparation method thereof

Abstract

The invention discloses an electronic seal label and a preparation method thereof, and belongs to the technical field of wireless radio frequency identification. The electronic seal label comprises a base body structure which comprises a substrate, a first antenna and a label chip, the first antenna and the label chip are located on one side of the substrate in the thickness direction, and the first antenna is connected with the label chip; the base body structure is arranged in the sealing structure in a sealed mode, a pit is formed in the outer side of the sealing structure, and the pit is located in the side, away from the first antenna, of the substrate; the second antenna is located on the side wall of the recess and connected with the first antenna, and the plane where the second antenna is located is different from the plane where the first antenna is located. The antenna gain can be improved and the read-write distance of the tag can be increased under the condition that the size of the substrate is reduced.

Description

Technical Field

[0001] The present application belongs to the field of wireless radio frequency identification technology, and in particular, relates to an electronic seal label and a preparation method thereof. Background Art

[0002] In the related art, the antenna in the electronic seal tag is printed on the substrate, and the antenna area and radiation performance are severely limited by the size of the substrate. In order to meet the production yield and cost requirements, the size of the substrate is reduced, resulting in a smaller antenna area, weaker antenna gain and tag reading distance performance. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an electronic seal tag and a preparation method thereof, which can improve antenna gain and enhance tag reading and writing distance while reducing the size of the substrate.

[0004] In a first aspect, the present application provides an electronic seal label, comprising:

[0005] The base structure includes a substrate, and a first antenna and a tag chip located on one side of the substrate in a thickness direction, wherein the first antenna is connected to the tag chip;

[0006] A sealing structure, wherein the base structure is sealed in the sealing structure, and the outer side of the sealing structure has a recess, and the recess is located on a side of the substrate away from the first antenna;

[0007] The second antenna is located on the side wall of the recess and connected to the first antenna. The second antenna is not in the same plane as the plane where the first antenna is located.

[0008] According to the electronic seal label of the present application, a second antenna is arranged on the side of the substrate away from the first antenna, and the second antenna is located on the side wall of the recess of the sealing structure, so that the second antenna is not in the same plane as the plane where the first antenna is located, that is, the second antenna is a three-dimensional antenna, and the second antenna is connected to the first antenna, so as to reduce the size of the substrate and the area of ​​the first antenna without reducing or even increasing the area of ​​the tag antenna (including the first antenna and the second antenna), thereby improving the antenna gain and increasing the tag reading and writing distance while meeting the production yield and cost requirements.

[0009] According to one embodiment of the present application, the second antenna includes at least one closed-loop structure spaced apart along the thickness direction, each of the closed-loop structures extends circumferentially along the side wall of the recess, and each of the closed-loop structures is respectively connected to the first antenna.

[0010] According to an embodiment of the present application, the second antenna includes a helical structure extending along the thickness direction, and the helical structure is connected to the first antenna.

[0011] According to one embodiment of the present application, the first antenna includes an inductive coil and a radiating arm;

[0012] The inductor coil is arranged near the edge of the substrate and extends along the circumference of the substrate, and two ends of the inductor coil are respectively connected to the tag chip;

[0013] The radiation branch arm is located inside the inductor coil and extends along the circumference of the substrate. One end of the radiation branch arm is connected to the inductor coil.

[0014] According to one embodiment of the present application, the inductor coil includes a bending line and an extension line;

[0015] The bending line is arranged close to the edge of the substrate and extends along the circumference of the substrate. Both ends of the bending line are respectively connected to the tag chip. The extension line is located between the bending line and the radiation arm and is connected to the bending line.

[0016] According to one embodiment of the present application, the bending line includes a first line segment and a second line segment alternately arranged along the circumference of the substrate, and a third line segment connected between adjacent first line segments and second line segments;

[0017] The first line segment and the second line segment extend along the circumferential direction of the substrate respectively, one end of the extension line is connected to one end of the third line segment, and the other end of the extension line extends along the extension direction of the third line segment.

[0018] According to one embodiment of the present application, the electronic seal tag further includes a microstrip transmission line;

[0019] One end of the microstrip transmission line is connected to the radiation branch arm, and the other end of the microstrip transmission line passes through the substrate and the sealing structure along the thickness direction and extends to the side wall of the recess, and is connected to the second antenna.

[0020] According to an embodiment of the present application, the connection point between the microstrip transmission line and the radiation branch arm is close to an end of the radiation branch arm connected to the inductor coil.

[0021] According to one embodiment of the present application, the substrate includes a hollow area, the first antenna is arranged around the hollow area, and the orthographic projection of the second antenna on the substrate is located outside the hollow area.

[0022] According to an embodiment of the present application, the substrate has a protrusion extending toward the hollow area, and the tag chip is located at the protrusion.

[0023] In a second aspect, the present application provides a method for preparing an electronic seal label, comprising:

[0024] The base structure is sealed in a sealing structure, wherein the base structure includes a substrate, and a first antenna and a tag chip located on one side of the substrate in a thickness direction, and the first antenna is connected to the tag chip; the outer side of the sealing structure has a recess, and the recess is located on a side of the substrate away from the first antenna;

[0025] A second antenna is formed on the side wall of the recess, the second antenna is connected to the first antenna, and the second antenna is not in the same plane as the plane where the first antenna is located.

[0026] According to one embodiment of the present application, forming a second antenna on the sidewall of the recess includes:

[0027] Determining an antenna area of ​​the side wall of the recess according to the three-dimensional model of the second antenna and the three-dimensional model of the sealing structure;

[0028] The second antenna is formed in the antenna area.

[0029] According to one embodiment of the present application, the second antenna includes a first metal layer and a second metal layer;

[0030] The forming the second antenna in the antenna area includes:

[0031] forming the first metal layer in the antenna region;

[0032] The second metal layer is plated on the surface of the first metal layer.

[0033] According to an embodiment of the present application, before forming the second antenna in the antenna area, the method further includes:

[0034] The antenna area is subjected to a surface roughening treatment.

[0035] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0036] By arranging a second antenna on the side of the substrate away from the first antenna, and the second antenna is located on the side wall of the depression of the sealing structure, the second antenna is not in the same plane as the plane where the first antenna is located, that is, the second antenna is a three-dimensional antenna, and the second antenna is connected to the first antenna, so as to reduce the size of the substrate and the area of ​​the first antenna without reducing or even increasing the area of ​​the tag antenna (including the first antenna and the second antenna), thereby improving the antenna gain and increasing the tag reading and writing distance while meeting the production yield and cost requirements.

[0037] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0039] Figure 1 is a schematic diagram of the structure of the electronic seal label provided in the embodiment of the present application;

[0040] Figure 2 is a schematic diagram of the structure of the second antenna in the electronic seal tag provided in the embodiment of the present application;

[0041] Figure 3 is a schematic structural diagram of a base structure in an electronic seal label provided in an embodiment of the present application;

[0042] Figure 4 This is a comparison diagram of antenna gain directions of the electronic seal tag provided in the embodiment of the present application and the electronic seal tag in the related art;

[0043] Figure 5 It is a schematic diagram of the process of preparing the electronic seal label provided in the embodiment of the present application. DETAILED DESCRIPTION

[0044] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0045] The electronic seal label and the method for preparing the same provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0046] Figure 1 A schematic diagram of the structure of the electronic seal label provided in an embodiment of the present application.

[0047] like Figure 1 As shown, the electronic seal tag provided in the embodiment of the present application includes a base structure and a seal structure 2, and the base structure is sealed in the seal structure 2. Among them, the base structure includes a substrate 1, a first antenna 5 and a tag chip 6. The first antenna 5 and the tag chip 6 are respectively located on one side of the thickness direction X of the substrate 1, and the first antenna 5 is connected to the tag chip 6.

[0048] The substrate 1 may be a PCB board. The cross section of the substrate 1 (the cross section is perpendicular to the thickness direction X) may be a regular polygon (such as a square), an irregular polygon, a circle, an ellipse or a ring. The shape of the substrate 1 may be set according to actual needs and is not specifically limited here. The material of the substrate 1 may include ceramic, glass fiber, resin dielectric material or FR4 material.

[0049] The first antenna 5 is located on one side of the thickness direction X of the substrate 1. The first antenna 5 may be a planar antenna, and the plane where the first antenna 5 is located is parallel to the lower surface of the substrate 1 (the surface of the substrate 1 close to the first antenna 5). The first antenna 5 is used to radiate electromagnetic energy. The material of the first antenna 5 may include metal materials such as copper, aluminum, and zinc, and the material of the first antenna 5 may also include silver paste and conductive ink.

[0050] The tag chip 6 is located on one side of the thickness direction X of the substrate 1, and the tag chip 6 and the first antenna 5 can be located on the same side of the substrate 1. The tag chip 6 is connected to the first antenna 5, and the tag chip 6 is used to store product information and transmit the product information to the tag reading and writing device through the first antenna 5. The tag chip 6 can be an RFID (radio frequency identification) chip.

[0051] The base structure is sealed in the sealing structure 2, so that the substrate 1, the first antenna 5 and the tag chip 6 are all sealed in the sealing structure 2. The base structure can be embedded in the sealing structure 2 by integrated injection molding. The sealing structure 2 can ensure that the electronic tag is not physically changed or removed without authorization. The sealing structure 2 also has waterproof, dustproof and anti-vibration properties, etc., effectively protecting the electronic tag from the influence of the external environment. The material of the sealing structure 2 may include PS plastic, ABS plastic, etc.

[0052] The outer side of the sealing structure 2 has a recess 21, and the recess 21 is located on the side of the substrate 1 away from the first antenna 5. The bottom of the recess 21 can be perpendicular to the thickness direction X, and the side wall of the recess 21 can be parallel to the thickness direction X, so that the side wall of the recess 21 can be perpendicular to the lower surface of the substrate 1.

[0053] The electronic seal tag also includes a second antenna 3, which is located on the side wall of the recess 21, and the second antenna 3 can extend along the side wall of the recess 21. The second antenna 3 is not in the same plane as the plane where the first antenna 5 is located, that is, the second antenna 3 and the plane where the first antenna 5 is located are not in the same plane. For example, the second antenna 3 is arranged vertically to the plane where the first antenna 5 is located, and the second antenna 3 is a three-dimensional antenna.

[0054] The second antenna 3 is connected to the first antenna 5, and the second antenna 3 and the first antenna 5 can be connected directly or indirectly. For example, the second antenna 3 can penetrate the sealing structure 2 and extend to the first antenna 5 to be connected to the first antenna 5, or the second antenna 3 can be connected to the first antenna 5 through the microstrip transmission line 4, that is, one end of the microstrip transmission line 4 is connected to the first antenna 5, and the other end of the microstrip transmission line 4 penetrates the sealing structure 2 and extends along the side wall of the recess 21 to be connected to the second antenna 3.

[0055] The second antenna 3 is used to match the antenna impedance and enhance the antenna's longitudinal radiation performance (thickness direction). The material of the second antenna 3 may include metal materials such as copper, aluminum, and zinc, and the material of the second antenna 3 may also include silver paste and conductive ink.

[0056] This embodiment provides a second antenna 3 connected to the first antenna 5, and the second antenna 3 is a three-dimensional antenna, so as to reduce the size of the substrate 1 and the area of ​​the first antenna 5 without reducing or even increasing the area of ​​the tag antenna (including the first antenna 5 and the second antenna 3), thereby improving the antenna gain and the tag reading and writing distance while meeting the production yield and cost requirements. Moreover, the sealing structure 2 and the second antenna 3 can be produced in an integrated manner, that is, the sealing structure 2 and the second antenna 3 can be integrated into a compact unit to achieve efficient and convenient manufacturing and deployment.

[0057] In some embodiments, Figure 2 As shown, the second antenna 3 includes at least one closed-loop structure 31 spaced apart along the thickness direction X, each closed-loop structure 31 extends circumferentially along the sidewall of the recess 21 , and each closed-loop structure 21 is connected to the first antenna 5 .

[0058] The closed loop structure 31 is a closed structure without end points. The closed loop structure 31 extends circumferentially along the sidewall of the recess 21, so that the central axis of the closed loop structure 31 coincides with the central axis of the recess 21. The closed loop structure 31 can be square, circular, elliptical, etc. The shape of the closed loop structure 31 matches the shape enclosed by the sidewall of the recess 21 (i.e., the shape of the cross section of the recess 21). For example, the cross section of the recess 21 is circular, and the closed loop structure 31 is a ring.

[0059] Each closed-loop structure 21 can be connected to the first antenna 5 via a microstrip transmission line 4, that is, the microstrip transmission line 4 is connected to the first antenna 5, and the other end of the microstrip transmission line 4 passes through the sealing structure 2 and extends along the side wall of the recess 21 to be connected to each closed-loop structure 31 respectively.

[0060] The number of closed-loop structures 31 may be one or more (two or more). The number of closed-loop structures 31 may be set according to actual needs and is not specifically limited here. In the case where the second antenna 3 includes multiple closed-loop structures 31, the multiple closed-loop structures 31 are spaced apart along the thickness direction X on the sidewall of the recess 21. The shapes and sizes of the multiple closed-loop structures 31 may be the same, and the multiple closed-loop structures 31 may be evenly distributed along the thickness direction X.

[0061] The antenna impedance matching can be fine-tuned by adjusting the spacing between the closed-loop structures 31 and the size and position of the closed-loop structures 31. The size of the closed-loop structure 31 includes the width and / or thickness along the thickness direction X, and the position of the closed-loop structure 31 includes the spacing between the closed-loop structure and the substrate 1. The size and position of the closed-loop structure 31 are mainly limited by the size of the sealing structure 2. For a large-sized sealing structure, the position of the closed-loop structure 31 can be appropriately adjusted.

[0062] For example, the second antenna 3 includes two closed-loop structures 31 spaced apart in the thickness direction X. The cross section of the recess 21 in the sealing structure 2 is a circle with a diameter of 6 mm, and the diameters of the two closed-loop structures 31 are both 6 mm, the widths are both 0.5 mm, and the thicknesses are both 10 um to 30 um. The spacing between the two closed-loop structures 31 is 0.5 mm, and the spacings between the two closed-loop structures 31 and the substrate 1 are 0.5 mm and 1 mm, respectively.

[0063] In some embodiments, the second antenna 3 includes a helical structure extending along the thickness direction X, and the helical structure is connected to the first antenna 5 .

[0064] The central axis of the spiral structure coincides with the central axis of the recess 21, and the spiral structure spirally extends along the side wall of the recess 21 in the thickness direction X. The number of turns of the spiral structure can be set according to actual needs and is not specifically limited here. One end of the spiral structure close to the bottom of the recess 21 can be connected to the first antenna 5 through a microstrip transmission line 4.

[0065] In some embodiments, Figure 3 As shown, the first antenna 5 includes an inductor 51 and a radiation arm 52. The inductor 51 is arranged near the edge of the substrate 1 and extends along the circumferential direction Y of the substrate 1, and both ends of the inductor 51 are respectively connected to the tag chip 6. The radiation arm 52 is located on the inner side of the inductor 51 and extends along the circumferential direction Y of the substrate 1, and one end of the radiation arm 52 is connected to the inductor 51.

[0066] The tag chip 6 can be arranged near the edge of the substrate 1. The tag chip 6 can include two chip pin solder joints 61, and the two chip pin solder joints 61 can be located on opposite sides of the chip 6 (such as Figure 3The tag chip 6 may further include two chip signal transmission microstrip lines 62, the two chip signal transmission microstrip lines 62 are correspondingly connected to the two chip pin solder joints 61, and the first end of the chip signal transmission microstrip line 62 is connected to the corresponding chip pin solder joint 61, and the second end of the chip signal transmission microstrip line 62 extends toward the edge of the substrate 1. The two chip pin solder joints 61 may be symmetrically arranged, and the two signal transmission microstrip lines 62 may be symmetrically arranged. In addition, the tag chip 6 may further include a chip pad 63, and the chip pad 63 may be located between the two signal transmission microstrip lines 62.

[0067] In order to increase the length of the inductor 51, the inductor 51 is disposed close to the edge of the substrate 1. The first end of the inductor 51 is located at the first side of the tag chip 6 (eg, Figure 3 The second end of the inductor 51 extends along the circumferential direction Y of the substrate 1 to the second side of the tag chip 6 (the second side is arranged opposite to the first side, such as the second side is Figure 3 The inductor 51 is connected to the second end of another chip signal transmission microstrip line 62, so that the two ends of the inductor 51 are respectively connected to the second ends of the two chip signal transmission microstrip lines 62 of the tag chip 6. The inductor 51 is used to match the chip capacitive impedance.

[0068] The antenna resistance matching can be adjusted by adjusting the line width of the signal transmission microstrip line 62. The distance between the inductor coil 51 and the edge of the substrate 1 can be adjusted by adjusting the line length of the signal transmission microstrip line 62, thereby adjusting the length of the inductor coil 51. The signal transmission microstrip line 62 is set as long as possible to make the inductor coil 51 as close to the edge of the substrate 1 as possible.

[0069] The radiation arm 52 is located at the inner side of the inductor 51, that is, the radiation arm 52 is located at a side of the inductor 51 close to the center of the substrate 1. The first end of the radiation arm 52 is located at the first side of the tag chip 6 and connected to the inductor 51, and the connection point between the first end of the radiation arm 52 and the inductor 51 is close to the first end of the inductor 51, that is, the connection point between the first end of the radiation arm 52 and the inductor 51 is close to the chip signal transmission microstrip line 62 connected to the first end of the inductor 51. For example, the spacing between the first end of the radiation arm 52 and the chip signal transmission microstrip line 62 is 0.5 mm, that is, the radiation arm 52 is drawn out from the inductor 51 0.5 mm away from the chip signal transmission microstrip line. The second end of the radiation arm 52 extends to the second side of the tag chip 6 along the circumferential direction Y of the substrate 1.

[0070] The radiation arm 52 is used to match the chip impedance and radiate electromagnetic energy outward. By adjusting the length, width and other dimensions of the radiation arm 52, the antenna impedance can be adjusted.

[0071] The shape of the radiation arm 52 can be a circle or an ellipse (i.e., an arc) with a notch, a rectangle (i.e., a broken line) with a notch, etc. The shape of the radiation arm 52 can match the shape of the cross section of the substrate 1. For example, the cross section of the substrate 1 is circular, the radiation arm 52 can be a circle with a notch, and the end point of the radiation arm 52 at the notch is connected to the inductor 51.

[0072] The shape of the inductor 51 can be a smooth curve, a broken line, or a combination of a curve and a broken line. The inductor 51 can be a symmetrical structure or an asymmetrical structure, which is not specifically limited here.

[0073] In some embodiments, the inductor coil 51 includes a bending line 510 and an extension line 520. The bending line 510 is arranged near the edge of the substrate 1 and extends along the circumferential direction Y of the substrate 1, and both ends of the bending line 510 are respectively connected to the tag chip 6. The extension line 520 is located between the bending line 510 and the radiation arm 52, and is connected to the bending line 510.

[0074] In order to further increase the length of the inductor 51, a zigzag line 510 is provided in the inductor 51, and the zigzag line 510 is close to the edge of the substrate 1. The first end of the zigzag line 510 is the first end of the inductor 51, and the second end of the zigzag line 510 is the second end of the inductor 51, that is, the first end of the zigzag line 510 is located at the first side of the tag chip 6 and connected to the second end of a chip signal transmission microstrip line 62, and the second end of the zigzag line 510 extends along the circumferential direction Y of the substrate 1 to the second side of the tag chip 6, and is connected to the second end of another chip signal transmission microstrip line 62, so that the two ends of the zigzag line 510 are respectively connected to the second ends of the two chip signal transmission microstrip lines 62 of the tag chip 6.

[0075] The extension line 520 is located inside the bending line 510, that is, the extension line 520 is located on the side of the bending line 510 close to the center of the substrate 1, and the extension line 520 is connected to the bending line 510. The number of extension lines 520 can be the same as the number of bends inside the bending line 510, that is, each bending point inside the bending line 510 can be connected to an extension line 520. One end of the extension line 520 is connected to the bending point inside the bending line 510, and the other end of the extension line 520 extends in a direction away from the bending line 510.

[0076] The length of the extension line 520 is related to the antenna impedance parameter. By adjusting the length of the extension line 520, the impedance matching between the antenna and the chip can be fine-tuned, thereby increasing the degree of freedom in design.

[0077] In some embodiments, the bending line 510 includes a first line segment 511 and a second line segment 512 alternately arranged along the circumferential direction Y of the substrate 1, and a third line segment 513 connected between adjacent first line segments 511 and second line segments 512. The first line segment 511 and the second line segment 512 extend along the circumferential direction Y of the substrate 1 respectively, one end of the extension line 520 is connected to one end of the third line segment 513, and the other end of the extension line 520 extends along the extension direction of the third line segment 513.

[0078] The bending line 510 may include a plurality of first line segments 511 and a plurality of second line segments 512, and the plurality of first line segments 511 and the plurality of second line segments 512 are alternately distributed along the circumferential direction Y of the substrate 1. The first line segments 511 and the second line segments 512 extend along the circumferential direction Y of the substrate 1 respectively, but the extension direction of the first line segment 511 does not coincide with the extension direction of the second line segment 512, that is, the extension direction of the first line segment 511 and the extension direction of the second line segment 512 may be parallel or intersecting. For example, the first line segment 511 is arranged close to the edge of the substrate 1, and the second line segment 512 is arranged close to the radiation arm 52.

[0079] The bending line 510 may further include a plurality of third line segments 513, and a third line segment 513 is connected between any adjacent first line segments 511 and second line segments 512. For example, one end of a first line segment 511 is connected to one end of a third line segment 513, the other end of the third line segment 513 is connected to one end of a second line segment 512, the other end of the second line segment 512 is connected to one end of a third line segment 513, and the other end of the third line segment 513 is connected to one end of a first line segment 511.

[0080] The connection point between the third line segment 513 and the first line segment 511 is a bending point on the outer side of the bending line 510 , and the connection point between the third line segment 513 and the second line segment 512 is a bending point on the inner side of the bending line 510 .

[0081] Each bending point inside the bending line 510 is connected to an extension line 520, that is, the extension line 520 is connected to one end of the third line segment 513 close to the second line segment 511. The extension line 520 extends along the extension direction of the third line segment 513 connected thereto, that is, the extension line 520 can be used as an extension line of the third line segment 513.

[0082] The first line segment 511 and the second line segment 512 may be straight line segments or curved line segments, respectively, and the third line segment 513 and the extension line 520 may be straight line segments. The line shape of the first line segment 511 and the second line segment 512 may match the shape of the cross section of the substrate 1, so as to utilize the space on the substrate 1 with maximum efficiency and increase the length of the inductor 51.

[0083] For example, the cross section of the substrate 1 is circular, the first line segment 511 and the second line segment 512 can be arc segments respectively, the third line segment 513 and the extension line 520 can be straight line segments, and the third line segment 513 and the extension line 520 can extend toward the center of the substrate 1. For example, the diameter of the cross section of the substrate 1 is 8.9 mm, and the distance between the first line segment 511 and the edge of the substrate 1 is 0.3 mm. The line width of the inductor 51 is 0.2 mm, that is, the line widths of the first line segment 511, the second line segment 512, the third line segment 513 and the extension line 520 are 0.2 mm respectively. The outer diameter of the first line segment 511 is 8.6 mm, the outer diameter of the second line segment 512 is 8 mm, the length of the third line segment 513 is 0.5 mm, and the angle between any two adjacent third line segments 513 is 4°. The radiation arm 52 is an arc segment, and the outer diameter of the radiation arm 52 is 7.1 mm, the width is 0.8 mm, and the length is 5 rad.

[0084] In some embodiments, the electronic seal tag further includes a microstrip transmission line 4. One end of the microstrip transmission line 4 is connected to the radiation arm 52, and the other end of the microstrip transmission line 4 passes through the substrate 1 and the sealing structure 2 along the thickness direction X and extends to the side wall of the recess 21, and is connected to the second antenna 3.

[0085] The microstrip transmission line 4 can be divided into three parts, and the first part of the microstrip transmission line passes through the substrate 1 along the thickness direction X. The cross section of the first part of the microstrip transmission line can be circular, for example, the diameter of the cross section of the first part of the microstrip transmission line is 0.3mm, and the length of the first part of the microstrip transmission line along the thickness direction X is the same as the thickness of the substrate 1. The second part of the microstrip transmission line passes through the sealing structure 2 along the thickness direction X, and the second part of the microstrip transmission line is connected to the first part of the microstrip transmission line. The cross section of the second part of the microstrip transmission line can be circular, for example, the diameter of the cross section of the second part of the microstrip transmission line is 0.3mm. The third part of the microstrip transmission line extends along the thickness direction X on the side wall of the recess 21, and the third part of the microstrip transmission line is connected to the second part of the microstrip transmission line. The third part of the microstrip transmission line and the second antenna 3 can be formed at the same time, that is, the third part of the microstrip transmission line and the second antenna 3 can be an integrated structure. The line width of the third part of the microstrip transmission line can be 0.5mm, and the length can be 2.2mm. The thickness of the third part of the microstrip transmission line can be the same as the thickness of the second antenna 3, such as 10um to 30um.

[0086] In some embodiments, Figure 3 As shown, the connection point A between the microstrip transmission line 4 and the radiation arm 52 is close to one end of the radiation arm 52 connected to the inductor 51 .

[0087] One end of the microstrip transmission line 4 passes through the sealing structure 2 and the substrate 1 and is connected to the radiation arm 52 . The connection point A is close to the first end of the radiation arm 52 , so as to further improve the antenna gain.

[0088] In some embodiments, the substrate 1 includes a hollow area 11 , the first antenna 5 is disposed around the hollow area 11 , and the orthographic projection of the second antenna 3 on the substrate 1 is located outside the hollow area 11 .

[0089] The hollow area 11 may be located at the center of the substrate 1. The cross section of the hollow area 11 may be a regular polygon (such as a square), an irregular polygon, a circle or an ellipse, etc. The first antenna 5 is arranged around the hollow area 11, that is, the inductor coil 51 is arranged around the hollow area 11, and the radiation arm 52 is arranged around the hollow area 11.

[0090] The orthographic projection of the recess 21 on the substrate 1 covers the hollow area 11, so that the orthographic projection of the second antenna 3 on the substrate 1 is located outside the hollow area 11. When the second antenna 3 includes a closed loop structure 31 or a spiral structure, the orthographic projection of the second antenna 3 on the substrate 1 is arranged around the hollow area 11.

[0091] In some embodiments, the substrate 1 has a protrusion 12 extending toward the hollow area 11, and the tag chip 6 is located at the protrusion 12. The protrusion 12 can be a regular polygon (such as a rectangle), an irregular polygon, a circle or an ellipse, etc., which is not specifically limited here.

[0092] For example, the cross section of the substrate 1 is circular, the outer diameter of the cross section of the substrate 1 is 8.9 mm, the inner diameter is 5.8 mm, and the thickness is 0.3 mm. The protrusion 12 is rectangular, and the length of the protrusion 12 extending toward the hollow area 11 is 1.6 mm, and the width is 2.4 mm. The chip signal transmission microstrip line 62 has a line width of 0.1 mm and a line length of 3 mm. The reserved space for welding the tag chip 6 has a width of 2.2 mm and a depth of 1.5 mm.

[0093] The substrate 1 in this embodiment is a circular ring structure with a simple structure and convenient molding and demoulding. The inner diameter of the substrate 1 is large and the outer diameter is small, which meets the production yield and cost requirements. The tag chip 6 is set at the protrusion 12, so that when the electronic seal is destroyed by external force, the protrusion 12 breaks, so that the connection between the tag chip 6 and the first antenna 5 is disconnected, and the tag chip 6 becomes invalid when opened, thereby meeting the anti-counterfeiting function of the electronic seal.

[0094] Figure 4It is the antenna gain radiation pattern of the electronic seal tag in the related technology and the present embodiment. Among them, the electronic seal tag in the related technology includes a substrate structure and a seal structure, and the substrate structure and the seal structure in the related technology are the same in shape and size as the substrate structure and the seal structure in the present embodiment. It can be seen that under the condition of ±40°, the maximum gain of the antenna in the related technology is -40.95dB, and the maximum gain of the antenna in the present embodiment is -32.5dB, that is, the maximum gain of the antenna in the present embodiment is improved by 8.45dB compared with the related technology. Converted to the reading distance performance in the label product, it is equivalent to an increase of about 1.4 times in the reading distance performance index, which significantly improves the electrical performance of the label product. Moreover, the use of a three-dimensional antenna (i.e., the second antenna 3) can maintain a considerable electromagnetic radiation performance under the condition of reducing the size and area of ​​the substrate 1.

[0095] According to the electronic seal tag provided in the embodiment of the present application, a second antenna 3 is arranged on the side of the substrate 1 away from the first antenna 5, and the second antenna 3 is located on the side wall of the recess 21 of the sealing structure 2, so that the second antenna 3 is not in the same plane as the plane where the first antenna 5 is located, that is, the second antenna 3 is a three-dimensional antenna, and the second antenna 3 is connected to the first antenna 5, so that the area of ​​the tag antenna (including the first antenna 5 and the second antenna 3) is not reduced or even increased while reducing the size of the substrate 1 and the area of ​​the first antenna 5, thereby meeting the production yield and cost requirements while improving the antenna gain, realizing the change of radiation direction, and improving the tag reading and writing distance.

[0096] Correspondingly, the embodiment of the present application also provides a method for preparing an electronic seal label, which can produce the electronic seal label in the above embodiment.

[0097] like Figure 5 As shown, the method for preparing the electronic seal label provided in the embodiment of the present application includes step 110 and step 120.

[0098] Step 110, seal the base structure in the sealing structure, the base structure includes a substrate, and a first antenna and a tag chip located on one side of the substrate in the thickness direction, and the first antenna is connected to the tag chip; the outer side of the sealing structure has a recess, and the recess is located on the side of the substrate away from the first antenna.

[0099] First, the base structure is formed, and then the base structure is embedded in the sealing structure by integrated injection molding. The base structure and the sealing structure can be integrated by injection molding machine and split mold. The integrated injection molding process can improve production efficiency and product quality while reducing costs.

[0100] Combination Figure 1As shown, the base structure includes a substrate 1, a first antenna 5 and a tag chip 6. The first antenna 5 and the tag chip 6 are respectively located on one side of the thickness direction X of the substrate 1, and the first antenna 5 is connected to the tag chip 6.

[0101] The cross section of the substrate 1 (the cross section is perpendicular to the thickness direction X) can be a regular polygon (such as a square), an irregular polygon, a circle, an ellipse or a ring. The first antenna 5 can be a planar antenna, and the first antenna 5 is used to radiate electromagnetic energy. The tag chip 6 and the first antenna 5 can be located on the same side of the substrate 1. The tag chip 6 is used to store product information and transmit the product information to the tag reading and writing device through the first antenna 5.

[0102] In some embodiments, Figure 3 As shown, the first antenna 5 includes an inductor 51 and a radiation arm 52. The inductor 51 is arranged near the edge of the substrate 1 and extends along the circumferential direction Y of the substrate 1, and both ends of the inductor 51 are respectively connected to the tag chip 6. The radiation arm 52 is located on the inner side of the inductor 51 and extends along the circumferential direction Y of the substrate 1, and one end of the radiation arm 52 is connected to the inductor 51.

[0103] In some embodiments, the inductor coil 51 includes a bending line 510 and an extension line 520. The bending line 510 is arranged near the edge of the substrate 1 and extends along the circumferential direction Y of the substrate 1, and both ends of the bending line 510 are respectively connected to the tag chip 6. The extension line 520 is located between the bending line 510 and the radiation arm 52, and is connected to the bending line 510.

[0104] In some embodiments, the bending line 510 includes a first line segment 511 and a second line segment 512 alternately arranged along the circumferential direction Y of the substrate 1, and a third line segment 513 connected between adjacent first line segments 511 and second line segments 512. The first line segment 511 and the second line segment 512 extend along the circumferential direction Y of the substrate 1 respectively, one end of the extension line 520 is connected to one end of the third line segment 513, and the other end of the extension line 520 extends along the extension direction of the third line segment 513.

[0105] The length of the extension line 520 is related to the antenna impedance parameter. By adjusting the length of the extension line 520, the impedance matching between the antenna and the chip can be fine-tuned, thereby increasing the degree of freedom in design.

[0106] Before the base structure is sealed in the sealing structure 2, a metallized via hole may be formed in the base structure, the metallized via hole passes through the substrate 1 and is connected to the radiating branch arm 52 in the first antenna 5. The metallized via hole is a part of the microstrip transmission line 4, that is, the microstrip transmission line 4 is connected to the radiating branch arm 52 in the first antenna 5.

[0107] In some embodiments, Figure 3As shown, the connection point A between the microstrip transmission line 4 and the radiation arm 52 is close to one end of the radiation arm 52 connected to the inductor 51 .

[0108] In some embodiments, the substrate 1 includes a hollow area 11 , the first antenna 5 is disposed around the hollow area 11 , and the orthographic projection of the second antenna 3 on the substrate 1 is located outside the hollow area 11 .

[0109] The hollow area 11 may be located at the center of the substrate 1. The cross section of the hollow area 11 may be a regular polygon (such as a square), an irregular polygon, a circle or an ellipse, etc. The inductor coil 51 in the first antenna 5 is arranged around the hollow area 11, and the radiation arm 52 in the first antenna 5 is arranged around the hollow area 11.

[0110] In some embodiments, the substrate 1 has a protrusion 12 extending toward the hollow area 11, and the tag chip 6 is located at the protrusion 12. The protrusion 12 can be a regular polygon (such as a rectangle), an irregular polygon, a circle or an ellipse, etc., which is not specifically limited here.

[0111] The outer side of the sealing structure 2 has a recess 21, and the recess 21 is located on the side of the substrate 1 away from the first antenna 5. The side wall of the recess 21 can be arranged perpendicular to the lower surface of the substrate 1.

[0112] Step 120 , forming a second antenna on the side wall of the recess, the second antenna being connected to the first antenna, and the second antenna being not in the same plane as the plane where the first antenna is located.

[0113] Combination Figure 1 As shown, the second antenna 3 is located on the side wall of the recess 21, and the second antenna 3 can extend along the side wall of the recess 21. The second antenna 3 is not in the same plane as the plane where the first antenna 5 is located. If the second antenna 3 is arranged perpendicular to the plane where the first antenna 5 is located, the second antenna 3 is a three-dimensional antenna. The second antenna 3 is used to match the antenna impedance and enhance the radiation performance of the antenna in the longitudinal direction.

[0114] The second antenna 3 can be directly or indirectly connected to the first antenna 5. The second antenna 3 can be connected to the first antenna 5 through a microstrip transmission line 4, that is, one end of the microstrip transmission line 4 is connected to the first antenna 5, and the other end of the microstrip transmission line 4 passes through the sealing structure 2 and extends along the side wall of the recess 21 to connect to the second antenna 3.

[0115] In some embodiments, forming a second antenna on a sidewall of the recess in step 120 includes:

[0116] Determine the antenna area of ​​the recessed side wall according to the three-dimensional model of the second antenna and the three-dimensional model of the sealing structure;

[0117] A second antenna is formed in the antenna region.

[0118] The antenna area includes the area where the second antenna 3 is located, and the antenna area may also include the area where the part of the microstrip transmission line 4 extending from the side wall of the recess 21 is located. When the second antenna 3 is formed in the antenna area, a part of the microstrip transmission line 4 may be formed in the antenna area, that is, the second antenna 3 and the part of the microstrip transmission line 4 are an integrated structure.

[0119] In some embodiments, before the antenna region forms the second antenna, the method further comprises:

[0120] The antenna area is subjected to surface roughening treatment.

[0121] The antenna area is roughened by laser to increase the contact area between the second antenna 3 and the microstrip transmission line 4 in the antenna area and to improve the adhesion strength between the second antenna 3 and the microstrip transmission line 4 and the sealing structure 2. Then, the second antenna 3 is formed on the roughened surface.

[0122] In some embodiments, the second antenna includes a first metal layer and a second metal layer;

[0123] A second antenna is formed in the antenna area, including:

[0124] forming a first metal layer in the antenna region;

[0125] A second metal layer is plated on the surface of the first metal layer.

[0126] First, a synchronous powder feeding process, laser induced solid phase or vapor phase deposition process is used to form a first metal layer in the antenna area. Then, a chemical plating or electroplating process is used to form a second metal layer on the surface of the first metal layer to achieve thickening of the metal layer.

[0127] In this embodiment, a first metal layer is first formed on the surface of the sealing structure 2 (i.e., the side wall of the recess 21) as a metal substrate, and then a second metal layer is plated on the metal substrate to thicken the second antenna 3, so that the second antenna 3 and the first antenna 5 can serve as the antenna of the electronic seal tag together, effectively improving the electrical performance of the tag antenna, reducing the substrate size, and improving the production yield.

[0128] In some embodiments, after forming the second antenna on the sidewall of the recess, the method further comprises:

[0129] Perform visual inspection of electronic seal labels.

[0130] The prepared electronic seal label is visually inspected using CCD to confirm that the second antenna 3 has no obvious burrs and that there is no obvious metal coating outside the antenna area. If it is detected that the second antenna 3 of the electronic seal label has obvious burrs or there is a metal coating outside the antenna area, it is determined that the visual inspection is unqualified, indicating that the electronic seal label is defective and the electronic seal label is removed.

[0131] In some embodiments, Figure 2 As shown, the second antenna 3 includes at least one closed-loop structure 31 spaced apart along the thickness direction X, each closed-loop structure 31 extends circumferentially along the sidewall of the recess 21 , and each closed-loop structure 21 is connected to the first antenna 5 .

[0132] In some embodiments, the second antenna 3 includes a helical structure extending along the thickness direction X, and the helical structure is connected to the first antenna 5 .

[0133] According to the preparation method of the electronic seal label provided in the embodiment of the present application, by arranging the second antenna 3 on the side of the substrate 1 away from the first antenna 5, and the second antenna 3 is located on the side wall of the recess 21 of the sealing structure 2, the second antenna 3 is not in the same plane as the plane where the first antenna 5 is located, that is, the second antenna 3 is a three-dimensional antenna, and the second antenna 3 is connected to the first antenna 5, so as to reduce the size of the substrate 1 and the area of ​​the first antenna 5 without reducing or even increasing the area of ​​the tag antenna (including the first antenna 5 and the second antenna 3), thereby meeting the production yield and cost requirements while improving the antenna gain, realizing the change of radiation direction, and improving the tag reading and writing distance.

[0134] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0135] In the description of the present application, “plurality” means two or more.

[0136] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0137] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic seal label, characterized in that: include: The base structure includes a substrate, and a first antenna and a tag chip located on one side of the substrate in a thickness direction, wherein the first antenna is connected to the tag chip; A sealing structure, wherein the base structure is sealed in the sealing structure, and the outer side of the sealing structure has a recess, and the recess is located on a side of the substrate away from the first antenna; The second antenna is located on the side wall of the recess and connected to the first antenna. The second antenna is not in the same plane as the plane where the first antenna is located.

2. The electronic seal label according to claim 1, characterized in that: The second antenna includes at least one closed-loop structure spaced apart along the thickness direction, each of the closed-loop structures extending circumferentially along the sidewall of the recess, and each of the closed-loop structures is connected to the first antenna respectively.

3. The electronic seal label according to claim 1, characterized in that: The second antenna includes a helical structure extending along the thickness direction, and the helical structure is connected to the first antenna.

4. The electronic seal label according to claim 1, characterized in that: The first antenna includes an inductor coil and a radiating arm; The inductor coil is arranged near the edge of the substrate and extends along the circumference of the substrate, and two ends of the inductor coil are respectively connected to the tag chip; The radiation branch arm is located inside the inductor coil and extends along the circumference of the substrate. One end of the radiation branch arm is connected to the inductor coil.

5. The electronic seal label according to claim 4, characterized in that: The inductor coil includes a bending line and an extension line; The bending line is arranged close to the edge of the substrate and extends along the circumference of the substrate. Both ends of the bending line are respectively connected to the tag chip. The extension line is located between the bending line and the radiation arm and is connected to the bending line.

6. The electronic seal label according to claim 5, characterized in that: The bending line includes a first line segment and a second line segment alternately arranged along the circumference of the substrate, and a third line segment connected between adjacent first line segments and second line segments; The first line segment and the second line segment extend along the circumferential direction of the substrate respectively, one end of the extension line is connected to one end of the third line segment, and the other end of the extension line extends along the extension direction of the third line segment.

7. The electronic seal label according to claim 4, characterized in that: The electronic seal tag also includes a microstrip transmission line; One end of the microstrip transmission line is connected to the radiation branch arm, and the other end of the microstrip transmission line passes through the substrate and the sealing structure along the thickness direction and extends to the side wall of the recess, and is connected to the second antenna.

8. The electronic seal label according to claim 7, characterized in that: The connection point between the microstrip transmission line and the radiation branch arm is close to one end of the radiation branch arm connected to the inductor coil.

9. The electronic seal label according to any one of claims 1 to 8, characterized in that: The substrate comprises a hollow area, the first antenna is arranged around the hollow area, and the orthographic projection of the second antenna on the substrate is located outside the hollow area.

10. The electronic seal label according to claim 9, characterized in that: The substrate has a protrusion extending toward the hollow area, and the tag chip is located at the protrusion.

11. A method for preparing an electronic seal label, characterized in that: include: The base structure is sealed in a sealing structure, wherein the base structure includes a substrate, and a first antenna and a tag chip located on one side of the substrate in a thickness direction, and the first antenna is connected to the tag chip; the outer side of the sealing structure has a recess, and the recess is located on a side of the substrate away from the first antenna; A second antenna is formed on the side wall of the recess, the second antenna is connected to the first antenna, and the second antenna is not in the same plane as the plane where the first antenna is located.

12. The method for preparing an electronic seal label according to claim 11, characterized in that: The forming of a second antenna on the sidewall of the recess comprises: Determining an antenna area of ​​the side wall of the recess according to the three-dimensional model of the second antenna and the three-dimensional model of the sealing structure; The second antenna is formed in the antenna area.

13. The method for preparing an electronic seal label according to claim 12, characterized in that: The second antenna includes a first metal layer and a second metal layer; The forming the second antenna in the antenna area includes: forming the first metal layer in the antenna region; The second metal layer is plated on the surface of the first metal layer.

14. The method for preparing an electronic seal label according to claim 12, characterized in that: Before forming the second antenna in the antenna area, the method further includes: The antenna area is subjected to a surface roughening treatment.

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