Shaping detection device and method for integrated circuit package outer pin

Abstract

The invention provides shaping detection equipment and method for an integrated circuit package outer pin. The equipment comprises a conveying mechanism, a shaping mechanism, a detection mechanism and at least one carrying mechanism, the conveying mechanism comprises one or more bearing tables used for containing products to be processed, and the conveying mechanism can move in a stepping mode, so that any bearing table at least can stay and pass through the working positions of the shaping mechanism and the detecting mechanism. The shaping mechanism comprises a pressure device, and the pressure device at least can apply pressure to the pins of the to-be-treated products placed on the bearing table and keeps the pressure for preset time; the detection mechanism is used for detecting the shaped product placed on the bearing table, obtaining the shape information of the pin of the shaped product, and obtaining detection result information based on the shape information; the carrying mechanism is used for picking up one or more to-be-disposed products and placing the to-be-disposed products on the bearing table, and / or taking the detected products out of the bearing table, and placing the detected products at preset positions based on detection result information.

Description

Technical Field

[0001] The present disclosure relates to the field of integrated circuit packaging, and in particular to a device and method for detecting the shaping of external pins of an integrated circuit package. Background Art

[0002] Integrated circuit packaging refers to the process of electrically connecting the circuit in the chip to the pins of the package shell through wires. These pins are then soldered to the solder joints on the printed circuit board (PCB), and electrically connected to the external circuit including other devices through the wires in the PCB, thereby achieving electrical connection between the chip and the external circuit.

[0003] The quality of the aforementioned integrated circuit packaging directly affects the performance of the chip itself, and also affects the design and manufacturing process of the PCB connected to it, which shows that the quality of the integrated circuit packaging is crucial.

[0004] During the production process, due to the influence of external forces, the metal pins on the casing of the packaged products (such as small out-line package, SOP) may appear warped, skewed and other poor morphology. The aforementioned products with poor morphology may experience unstable phenomena such as desoldering, solder leakage, and false connection when welded to the PCB board, affecting product quality and reliability.

[0005] In order to improve the aforementioned problem of poor pin morphology, the prior art uses, for example, a pin pressing device to reshape the pin, but the shaping effect is poor and the efficiency is very low, which is difficult to meet the requirements. Summary of the invention

[0006] In order to solve or improve the above problems existing in the prior art, the present disclosure provides, in a first aspect, a shaping and detecting device for an external pin of an integrated circuit package, the device specifically comprises a conveying mechanism, a shaping mechanism, a detecting mechanism and at least one handling mechanism; wherein:

[0007] The conveying mechanism includes one or more carriers and a module detachably mounted under the carrier, the module having a shaping reference surface for supporting the pins of the product to be processed; the conveying mechanism can move in a step-by-step manner so that any carrier can at least stay and pass through the working positions of the shaping mechanism and the detection mechanism;

[0008] The shaping mechanism includes a pressure device and an upper module. The upper module has an upper shaping surface that can be pressed with the shaping reference surface. The pressure device can drive the upper module to apply pressure to the pins of the product to be processed supported by the lower module and maintain it for a preset time.

[0009] The detection mechanism is used to detect the shaped product placed in the lower module, obtain the morphology information of the pins of the shaped product, and obtain the detection result information based on the morphology information;

[0010] The transport mechanism is used to: pick up one or more products to be processed and place them on the carrier, and / or take out the detected products from the lower module and place the detected products at a preset position based on the detection result information.

[0011] The above technical solution provides an automated shaping and testing equipment, in which the transport mechanism can load and unload materials, place the product to be processed on the carrier, or take the tested product out of the carrier, and the conveying mechanism preferably carries multiple carriers at the same time. Through the movement of the conveying mechanism, the product to be processed on the carrier passes through and stays at the working position of the shaping mechanism and the testing mechanism. The pins are first shaped by the shaping mechanism, then tested by the testing mechanism, and qualified / unqualified products are screened out by the transport mechanism, realizing the automation of the shaping and testing of the external pins of the integrated circuit package. Compared with the existing technology, the consistency of the shaping quality can be guaranteed, and the efficiency is significantly higher than manual operation.

[0012] Optionally, the conveying mechanism includes a dividing plate and a stepper motor; the stepper motor is located below the dividing plate, and the shaft of the stepper motor is connected to the center of the dividing plate; a plurality of bearing platforms are circumferentially arranged on the upper surface of the dividing plate; at least one handling mechanism, a shaping mechanism and a detection mechanism are arranged around the dividing plate.

[0013] In the optional technical solution, a disc-type transmission mechanism is used, and various mechanisms are arranged around it. The product is compact as a whole, and the loading and unloading are located at the same position or close to each other. The stepper motor as the driving device is placed under the indexing plate, which effectively utilizes the space.

[0014] Optionally, the shaping mechanism includes an upper module; the support platform is installed with a lower module corresponding to the upper module; wherein the lower module includes a first groove and a shaping reference surface, the first groove is used to place the package of the product to be disposed, and the shaping reference surface is used to support the pins of the product to be disposed; the upper module can move in a direction perpendicular to the shaping reference surface under the drive of the pressure device, and the upper module has an upper shaping surface, which is used to press with the shaping reference surface to shape the pins located between the upper shaping surface and the shaping reference surface.

[0015] In the above optional technical solution, the upper and lower modules have matching reference surfaces and shaping reference surfaces. By pressing the two together, the external pins of the package between the two can be pressed into a shape that fits the shaping reference surface, thereby shaping the pins. Compared with the prior art, this shaping device has better consistency, especially for shaping the flatness of a single pin and the overall flatness of all pins on the product.

[0016] Optionally, the lower module includes blocking blocks disposed at both ends of the first groove, and one or more products to be disposed can be placed between the blocking blocks.

[0017] Since the conveying mechanism is in the form of a dividing plate, when it rotates, the carrier platform thereon and the products to be disposed therein make circular motion. Due to the centrifugal force, the products to be disposed therein may be "thrown out". In order to avoid this situation, the aforementioned blocking block is provided.

[0018] Furthermore, the positions of the blocking blocks at both ends of the first groove can be adjusted relative to each other. Optionally, one or more products to be processed can be placed between them. Simultaneous shaping and inspection of multiple products can improve overall efficiency. On the other hand, simultaneous shaping of multiple products can improve the consistency between these products.

[0019] Optionally, the upper module also includes:

[0020] The correction structure includes a protrusion or a recessed portion whose position corresponds to the first groove; wherein the correction structure is configured to apply pressure to the package of the product to be processed before the upper shaping surface contacts the pin during the process of the upper module moving close to the lower module.

[0021] Assuming that there is no correction structure, during the shaping process, the upper shaping surface is directly pressed onto the pins of the product to be processed. At this time, the partially warped pins will lift the tube shell in the groove after being pressed. Compared with when the tube shell is not lifted, the pressure on the root and / or middle section of the pin is reduced and the deformation produced is also reduced. Therefore, the root and / or the middle section of these pins do not produce the necessary and sufficient deformation. In addition, due to the resilience of the pins themselves, after the upper module is separated from the lower module, the pins will still show a certain degree of warping, thus affecting the shaping quality.

[0022] In the aforementioned optional technical solution, since a correction structure is provided, during the shaping process, the correction structure can be pressed onto the surface of the tube shell before the upper module is pressed onto the pins on the lower module, so that the pins of the product can first be warped upward. In other words, the aforementioned tube shell lifting phenomenon is avoided, and then the upper module is directly pressed onto the pins on the lower module, avoiding the pins from warping again.

[0023] Optionally, the detection mechanism includes a scanning module and a detection bracket, and the detection bracket is used to drive the scanning module to scan the shaped product placed on the lower module to obtain the pin morphology information;

[0024] The pin topography information includes the flatness of a single pin, the inclination of a single pin, and the total flatness of all pins on the same shaped product.

[0025] In this alternative, in addition to the flatness of the single / multiple pins handled by the aforementioned shaping mechanism, the detection mechanism can additionally detect the inclination of the pins.

[0026] Optionally, the transport mechanism includes a first transport mechanism and a second transport mechanism;

[0027] The first transport mechanism is used to pick up one or more products to be processed and place them in the lower module;

[0028] The second transport mechanism is used to take out the inspected products from the lower module and place the qualified products and unqualified products therein into designated containers respectively;

[0029] The first transport mechanism and / or the second transport mechanism comprises a mechanical arm and a suction device installed at the end of the mechanical arm, wherein the suction device comprises a replaceable suction nozzle.

[0030] In this optional solution, two transport mechanisms are provided to respectively perform the loading / unloading work, and they can work simultaneously without interfering with each other.

[0031] In addition, nozzles of different sizes can be replaced to suit products of various packaging sizes to be processed, and the equipment as a whole has good versatility.

[0032] Optionally, the shaping detection device further includes a first lower module detection device and a second lower module detection device; based on the running direction of the conveying mechanism, wherein:

[0033] The first lower module detection device is disposed between the shaping mechanism and the first transport mechanism and is configured to sound an alarm when it is detected that the product to be disposed in the carrier is not correctly placed;

[0034] The second lower module detection device is disposed between the second conveying mechanism and the first conveying mechanism, and is configured to issue an alarm when it is detected that the carrying platform is not empty.

[0035] When the product to be disposed is not correctly placed in the support platform, if the shaping mechanism applies pressure to it, it will damage the product to be disposed and may also damage the equipment. The first lower module detection device in this solution can prevent this from happening.

[0036] In addition, the second transport mechanism (used for unloading) may make mistakes, resulting in incomplete unloading. Disposed products may still remain in the lower module after passing through the second transport mechanism. The second lower module detection device can detect this situation and sound an alarm or shut down the equipment to prevent the first transport mechanism from repeatedly loading materials into it, causing damage to the equipment or products.

[0037] Optionally, six bearing platforms are evenly distributed on the circumference of the upper surface of the indexing plate;

[0038] A first conveying mechanism, a first lower module detection device, a shaping mechanism, a detection mechanism, a second conveying mechanism and a second lower module detection device are sequentially arranged around the indexing plate along the circumferential direction.

[0039] The various mechanisms surrounding the indexing plate are reasonably distributed, and in the interval of any stepping movement of the indexing plate, the working position of each mechanism has products to be processed, which can realize effective and comprehensive utilization of the various mechanisms surrounding the indexing plate.

[0040] Optionally, the lower module is detachably connected to the carrier platform;

[0041] Also includes:

[0042] A lower module replacement switch is electrically connected to the transmission mechanism;

[0043] The transmission mechanism is configured to perform a step-by-step movement when the shaping mechanism, the detection mechanism and the handling mechanism stop running and the lower module replacement switch is triggered.

[0044] The shaping inspection device in the disclosed embodiment has good versatility, including multiple lower modules of different specifications (mainly reflected in the size of the first groove and the parameters of the shaping reference surface). When the specifications of the product to be processed need to be changed, the operator can trigger the lower module replacement switch. Each time it is triggered, a lower module and the carrier can be turned to the replacement operation position (usually directly behind the device), so that the lower modules can be replaced one by one.

[0045] Optionally, also include:

[0046] A top camera, disposed above the product to be processed to be picked up, for obtaining position information of the product to be processed to be picked up, so as to enable the transport mechanism to pick up the product to be processed according to the position information;

[0047] The bottom camera has a shooting direction opposite to that of the top camera and is arranged on the moving path of the transport mechanism to place the product to be disposed on the lower module, and is used to obtain the position and angle information of the picked product to be disposed;

[0048] The transport mechanism is configured to place the picked-up products to be disposed on a carrying platform or a preset position according to the position and angle information of the picked-up products to be disposed.

[0049] The aforementioned optional technical solutions have the following functions:

[0050] The top camera takes real-time photos and obtains the placement information of the products to be disposed of, which allows the products to be placed arbitrarily without being restricted to a specific placement form and does not affect the picking up of the products to be disposed of by the handling mechanism.

[0051] The bottom camera can confirm whether the angle and position of the product to be processed are correct after it is picked up, so as to avoid incorrectly picked products from being loaded, and further avoid the situation where the product to be processed is placed crookedly or incompletely in the lower module.

[0052] Optionally, the device also includes:

[0053] Safety cover;

[0054] A loading box for placing the products to be picked up and disposed of;

[0055] Unloading box, used to place qualified products among the inspected products;

[0056] The loading and unloading mechanism can at least:

[0057] Move the loading box from outside the safety cover to below the top camera.

[0058] Move the unloading box out of the safety cover.

[0059] In a second aspect of the embodiments of the present disclosure, there is provided a method for performing a shaping inspection on an external pin of an integrated circuit package using a shaping inspection device as described in the technical solution of the first aspect and any one of the optional solutions thereof, the method comprising:

[0060] The handling mechanism places at least one product to be processed onto the lower module of the conveying mechanism;

[0061] The conveying mechanism conveys at least one product to be processed to the working position of the shaping mechanism;

[0062] The shaping mechanism shapes the pins of at least one product to be processed;

[0063] The conveying mechanism conveys the shaped at least one product to be processed to the working position of the detection mechanism;

[0064] The detection mechanism detects the pins of at least one product to be processed that has been shaped;

[0065] The transport mechanism takes out the shaped at least one product to be processed from the lower module.

[0066] Optionally, the conveying mechanism moves in a step-by-step manner, and in the intermittent phase of the step-by-step movement, the actions performed by the shaping mechanism, the detection mechanism and the transport mechanism are performed at least partially simultaneously;

[0067] The duration of the intermittent phase is the working time of the shaping mechanism.

[0068] In the above method, the step-by-step interval time of the conveying mechanism is set based on the working time of the shaping mechanism which takes the longest time among all the mechanisms, and the other mechanisms are made to work simultaneously during the above-mentioned interval time, so that the overall working efficiency of the equipment is higher.

[0069] Optionally, the pressure value and pressure holding time of the pressure device in the shaping mechanism are set according to the number of pins and the nominal thickness of the pins of the product to be processed;

[0070] Among them, the number of pins and the nominal thickness of the pins have the following corresponding relationship with the pressure value and the pressure holding time:

[0071] Number of pins Nominal pin thickness (mm) Pressure(N) Pressure holding time (s) 6 0.08～0.12 110～130 2.8～3.2 4 0.13～0.17 110～130 2.8～3.2 8 0.13～0.17 190～210 3.8～4.2 12 0.13～0.17 230～250 3.8～4.2 16 0.13～0.17 230～250 5.8～6.2 16 0.18～0.22 240～260 5.8～6.2 4 0.18～0.22 140～160 3.8～4.2 4 0.23～0.27 170～190 3.8～4.2 8 0.23～0.27 190～210 5.8～6.2

[0072] The aforementioned pressure value and holding time set based on the pin thickness (including the thickness of the coating thereon) and the number of pins have been verified through experiments and can significantly prevent the pins from rebounding due to their own elasticity, as well as damage such as breakage, deformation, and tilting, and have a good and highly consistent shaping effect.

[0073] To sum up, using the pin shaping and detection equipment and corresponding methods provided in the embodiments of the present disclosure, not only can the pins outside the product package be automatically shaped, avoiding the problems caused by manual or semi-automatic equipment such as uncontrolled press pressure, deformation of tube legs due to excessive force, and failure to meet the shaping standards due to insufficient force, but also the shaping effect can be automatically detected, solving the problem of poor quality consistency caused by the existing operator's naked eye observation and judgment, and achieving good results.

[0074] In addition, the equipment and method provided by the embodiments of the present disclosure avoid the need for operators to manually load / unload products during manual or semi-automatic equipment shaping operations, thereby reducing the considerable time required for product clamping and fixing operations, thereby improving both product quality and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the background technology, the drawings required for use in the embodiments of the present disclosure or the background technology will be described below.

[0076] Figure 1 is an overall three-dimensional schematic diagram of a plastic surgery detection device in an embodiment of the present disclosure;

[0077] Figure 2 is an overall top view schematic diagram of the plastic surgery detection device in an embodiment of the present disclosure;

[0078] Figure 3 is a partial three-dimensional schematic diagram of a transmission mechanism in a plastic surgery detection device in an embodiment of the present disclosure;

[0079] Figure 4is a side view schematic diagram of a transmission mechanism portion in a plastic surgery detection device in an embodiment of the present disclosure;

[0080] Figure 5 is a schematic diagram of a shaping mechanism part in a shaping detection device in an embodiment of the present disclosure;

[0081] Figure 6 The positional coordination relationship between the transmission mechanism and the shaping mechanism in the embodiment of the present disclosure is shown;

[0082] Figure 7 The structural features of the upper module and the lower module in the embodiment of the present disclosure and the matching relationship between the two are shown;

[0083] Figure 8 The structural features of the upper module and the lower module in the embodiment of the present disclosure are shown, and the correction structure located in the upper module is shown in particular;

[0084] Fig. 9 are examples of several different correction structure forms involved in the embodiments of the present disclosure;

[0085] Fig.10 is a three-dimensional schematic diagram of a detection mechanism in a plastic surgery detection device in an embodiment of the present disclosure;

[0086] Fig.11 is a schematic diagram of a transport mechanism in a plastic surgery detection device in an embodiment of the present disclosure;

[0087] Fig.12 The structure of the first / second lower module detection device in the embodiment of the present disclosure and the working mode of the transmission mechanism thereof are shown;

[0088] Fig.13 is a schematic diagram of a loading and unloading mechanism in a plastic surgery detection device in an embodiment of the present disclosure;

[0089] Fig.14 The top camera in the embodiment of the present disclosure and its setting position relative to the loading and unloading mechanism are shown;

[0090] Fig.15 is a bottom view of the top camera in the embodiment of the present disclosure;

[0091] Fig.16 is an overall schematic diagram of the plastic surgery detection device including the safety cover in the embodiment of the present disclosure;

[0092] Fig.17 It is a schematic diagram of the product to be disposed of and its reference plane;

[0093] Fig.18 It is a schematic diagram of the inclination error of the product to be processed and its external pins.

[0094] Note in the figure:

[0095] 100 transmission mechanism, 200 shaping mechanism, 300 detection mechanism, 400 handling mechanism;

[0096] 110 load-bearing platform, 120 lower module, 130 indexing plate, 140 stepping motor;

[0097] 121 first groove, 122 shaping reference surface, 123 blocking block;

[0098] 210 pressure device, 220 upper module, 221 upper shaping surface, 222 correction structure;

[0099] 310 scanning module, 320 detection bracket;

[0100] 410 a first transport mechanism, 420 a second transport mechanism;

[0101] 401 mechanical arm, 402 suction device, 403 replaceable suction nozzle;

[0102] 510 first lower module detection device, 520 second lower module detection device, 530 column;

[0103] 501 optical waveguide, 502 vertical plate, 503 fixing hole, 504 cantilever;

[0104] 600 lower module replacement switch;

[0105] 710 top camera; 720 bottom camera;

[0106] 711 top camera surface light source, 712 top camera support;

[0107] 800 safety cover; display device 810;

[0108] 900 loading and unloading mechanism, 910 loading box, 920 unloading box, 930 loading NG box, 940 unqualified product box;

[0109] 01 tube shell, 02 pins, 03 tilted pins. DETAILED DESCRIPTION

[0110] In this specification, it will also be understood that when an element is referred to as being relative to other elements, such as being "connected to" other elements, the one element may be directly connected to or directly coupled to the one element, or there may also be a third element in between; in addition, in the embodiments of the present disclosure, "connection" may specifically be an electrical connection or a mechanical connection.

[0111] The present disclosure will now be described more fully below with reference to the accompanying drawings, however, the present disclosure can be implemented in many different ways and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments herein will make the present disclosure more detailed and complete, and fully convey the scope of the present disclosure to those skilled in the art. The same reference numerals throughout the text represent the same objects.

[0112] The pin detection and shaping devices or methods in the prior art are suitable for the whole-page products that have not been cut and arranged in an array, but for the cut products, there is no device or method in the prior art that takes into account both the shaping effect and efficiency. On the other hand, although the prior art can shape the whole-page products that have not been cut, new pin deformation may occur in the subsequent cutting stage, which has not received enough attention in the prior art.

[0113] The inventors of the present disclosure have found in their research that the shaping effect of the external pins (pins) of the chip package in the prior art is poor and the efficiency is low. The reasons are:

[0114] (1) In the prior art, pin shaping is mainly completed by manual or semi-automatic pressing equipment. The pressure of the pressing equipment is not controlled. If the force is too large, the tube leg will be deformed. If the force is too small, the shaping standard will not be met and the shaping quality cannot be guaranteed. On the other hand, for multiple products, the shaping results lack consistency.

[0115] (2) In the prior art, there is a lack of effective detection means after the pins are reshaped, and the qualification is entirely determined by the naked eye, which also affects the final quality of the product.

[0116] (3) In the prior art, the clamping of the product to be processed, its placement in the pressing equipment, and its removal after shaping all need to be done manually by operators, which takes a lot of time. More importantly, during the clamping process, the pins may be accidentally touched and deformed.

[0117] The inventors also discovered that during the aforementioned clamping process, the pins may be accidentally touched, causing them to tilt / skew in the welding plane. This deformation often cannot be corrected by the pressing equipment (the pressing equipment can only correct the flatness relative to the welding plane), and is easily overlooked in the manual inspection process. Therefore, the existing pin technology not only has poor effects and low efficiency, but may also cause new quality problems.

[0118] In view of this, without wishing to be bound by any theory, the present disclosure aims to provide a device for shaping and inspecting the external pins of an integrated circuit package, and a high-efficiency and high-quality shaping and inspection method corresponding to the device.

[0119] The present disclosure provides an embodiment of a plastic surgery detection device, such as Figure 1 and Figure 2As shown, this device specifically includes:

[0120] A conveying mechanism 100, a shaping mechanism 200, a detection mechanism 300 and at least one transport mechanism 400; wherein,

[0121] The conveying mechanism 100 includes one or more carriers 110 for placing the products to be processed. The conveying mechanism 100 can move in a step-by-step manner so that any carrier 110 can at least stay at and pass through the working positions of the shaping mechanism 200 and the detection mechanism 300.

[0122] A lower module 120 is detachably disposed on the carrier 110 , and the lower module 120 has a shaping reference surface 122 for supporting the pins of the product to be processed.

[0123] Among them, any carrier 110 first passes through the shaping mechanism 200 and stops to allow the shaping mechanism 200 to shape the pins of the product to be processed on the carrier 110, and then passes through the inspection mechanism 300 and stops to allow the inspection mechanism 300 to inspect the shaped product.

[0124] In an embodiment, the conveying mechanism 100 may be a device that performs rotational motion or linear motion, such as a disk that can rotate step by step, or a form similar to a conveyor belt.

[0125] In an embodiment, a plurality of carriers on the conveying mechanism 100 move / stop synchronously.

[0126] In an embodiment, the conveying mechanism 100 includes a stepping servo motor for driving. The stepping servo motor should include a necessary control device capable of setting parameters such as the speed, acceleration, and intermittent time of the stepping motion. The selection of the servo motor is not the focus of this disclosure. Those skilled in the art can choose according to actual needs and it is not described in detail in this disclosure.

[0127] The shaping mechanism 200 includes a pressure device 210, which can at least apply pressure to the pins of the product to be processed placed on the support platform 110 and maintain it for a preset time. The pressure device 210 can be specifically driven by an electric machine, for example, through a screw, rack, worm gear and other structures in conjunction with an electric motor, or it can be driven by a fluid drive device such as a pneumatic or hydraulic drive device.

[0128] The shaping mechanism 200 further includes an upper module 220 , and the upper module 220 has an upper shaping surface 221 that can be pressed against the shaping reference surface 122 .

[0129] In an embodiment, the shaping mechanism 200 also includes a pressure sensor for detecting the pressure value applied to the pin in real time. The pressure device 210 can apply a pressure of a preset pressure value to the pin, and can dynamically adjust the pressure to ensure that the actual pressure value is consistent with the preset pressure value. For example, when the pressure sensor detects that the pressure applied to the pin is less than the preset pressure value, the pressure device 210 can adjust the pressure applied to the pin in time to reach the preset pressure value. By setting a pressure sensor to monitor the pressure in real time, the technical problem of poor consistency of shaping quality caused by the unstable pressure applied by the pressure device 210 is avoided.

[0130] The inspection mechanism 300 is used to inspect the shaped product placed on the carrier 110, obtain the shape information of the pins of the shaped product, and obtain the inspection result information based on the shape information. Typical inspection result information includes the qualified / unqualified information of the product.

[0131] In an embodiment, the inspection mechanism 300 includes at least one image acquisition device, such as a 3D camera or a camera, for example, for photographing the product to be inspected from above to obtain pin inclination information, or for photographing the product to be inspected from the side to obtain pin flatness information.

[0132] In a typical embodiment, the inspection mechanism 300 includes a linear light source emitting device and a camera, both of which can move and scan the product to be inspected to obtain the depth information of the pins of the product to be inspected, thereby obtaining the flatness information of the pins.

[0133] As mentioned above, the detection or shaping of the device in the embodiment of the present disclosure involves the flatness and inclination / skewness of the pins of the product to be processed. In order to facilitate the understanding of the embodiment of the present disclosure, the above-mentioned flatness and inclination of the pins are explained as follows:

[0134] like Fig.17 and Fig.18 As shown in the figure, a SOP package product suitable for the embodiment of the present disclosure is shown, including a tube shell 01 and a pin 02. Fig.17 As shown in the figure, the dotted line a shows the soldering plane of the pins. Ideally, all the pin tails (pin ends) should be in the soldering plane. In non-ideal conditions, for a single pin, the difference between the maximum height and the minimum height of its tail is the flatness of the single pin; for multiple pins of the same product, the difference between the maximum height and the minimum height of the tail of all the pins is the overall pin flatness of the product.

[0135] like Fig.18 As described above, the pin shown in the dotted frame 03 is a typical inclined pin, that is, it is not parallel to other pins in the welding plane, and the inclination of the pin is obtained according to the angle between the edge of the pin and the edge of the tube shell 01 of the product to be processed.

[0136] Although the SOP package is described as an example, the present application is not limited to this. The shaping detection equipment can also shape and monitor the external pins of integrated circuit packages such as thin small outline package (TSOP), very small outline package (VSOP), shrink SOP (SSOP), TSSOP (thin shrink SOP), small outline transistor (SOT), small outline integrated circuit (SOIC), quad flat package (QFP), etc.

[0137] The transport mechanism 400 is used to pick up one or more products to be processed and place them on the carrier 110, and / or take out the detected products from the carrier 110 and place the detected products at a preset position based on the detection result information.

[0138] In the embodiment of the present disclosure, there can be one conveying mechanism 400, which has both loading and unloading functions, or two conveying mechanisms, one for loading and the other for unloading. In the embodiment with only one conveying mechanism 400, the working range of the conveying mechanism 400 needs to cover the stop position of the carrier platform on the conveying mechanism 100 upstream of the shaping mechanism and the stop position downstream of the detection mechanism at the same time.

[0139] According to the embodiments of the present disclosure, in a typical example, Figure 3 and Figure 4 As shown, the transmission mechanism 100 specifically includes a dividing plate 130 and a stepping motor 140. Figure 4 As shown, the stepper motor 140 is located below the indexing plate 130 , and the shaft of the stepper motor 140 is connected to the center of the indexing plate 130 .

[0140] In the embodiment, a necessary transmission device is provided between the shaft of the stepping motor 140 and the center of the indexing plate 130 .

[0141] In a typical embodiment, Figure 3 As shown, the indexing plate 130 has a through hole at the center, and the transmission device includes a hollow shaft coaxially connected to the through hole, or a similar structure that can avoid the space below the through hole at the center. The through hole and other structures can at least be used to set the lower module detection device in the embodiment.

[0142] A plurality of carriers 110 are arranged circumferentially on the upper surface of the indexing plate 130. At the same time, the at least one transport mechanism 400, the shaping mechanism 200 and the detection mechanism 300 are arranged around the indexing plate 130. Figure 2 The wraparound method is shown.

[0143] In one embodiment, the indexing plate 130 has a plurality of through holes, for example Figure 3The fan-shaped through holes shown are used at least for weight reduction. It should be noted that the fan-shaped through holes should be evenly distributed to ensure the dynamic balance of the indexing plate 130 when it rotates.

[0144] In one embodiment, the support platform 110 is disposed at a position as close to the edge of the indexing plate 130 as possible.

[0145] like Figure 5 As shown, the shaping mechanism 200 includes an upper module 220 and a pressure device 210. The upper module 220 has an upper shaping surface 221 and is connected to the driving end of the pressure device 210. In a typical embodiment, Figure 5 As shown, the shaping mechanism 200 includes a support, a pressure device 210 with a driving end facing downward and integrally arranged above the support. A pressure sensor (not shown in the figure) is arranged between the driving end of the pressure device 210 and the upper module 220.

[0146] like Figure 3 As shown, each supporting platform is detachably mounted with a lower module 120 corresponding to the upper module 220 .

[0147] like Figure 7 As shown, the lower module 120 includes a first groove 121 and a shaping reference surface 122. The first groove 121 is used to place the tube shell of the product to be processed, and the shaping reference surface 122 is used to support the pins of the product to be processed.

[0148] like Fig.17 As shown, there is a distance h between the welding reference surface a and the shell surface b of the product to be treated, so Figure 7 or Figure 8 As shown, when the product to be disposed of is placed in the lower module 120, the top of the tube shell has a certain sinking relative to the shaping reference surface 122 (slightly larger or slightly smaller than h), and the pins on both sides are respectively placed on the shaping reference surface 122. When the upper module 220 is pressed down, the upper shaping surface 221 exerts pressure on the pins to deform them, and the shape of the deformed pins fits the shaping reference surface 122, thereby improving the flatness.

[0149] Since the pin of the product to be processed may be warped before shaping, the actual sinking amount of the shell surface b relative to the shaping reference plane 122 may be slightly larger or smaller than h. For example, if the pin is warped downward (with Fig.17 If the pin is tilted upward, the shell surface b will move downward, and the actual sinking amount will be greater than h.

[0150] In an alternative embodiment, if Figure 7 or Figure 8 As shown, a plurality of products to be processed are placed in the first groove 121 at the same time, and the plurality of products to be processed can be shaped at the same time.

[0151] In an optional embodiment, a product to be disposed is placed in the first groove 121. It has been verified that the shaping effect of a single product to be disposed is better.

[0152] In one embodiment, the first grooves 121 are arranged along the radial direction of the indexing disk 130 . In other words, the first grooves 121 in all the lower modules 120 point to the center of the circle / rotation center of the indexing disk 130 .

[0153] In one embodiment, the outer sides of the supporting platform 110 and the lower module 120 have arc-shaped edges that fit the outer edge of the indexing plate.

[0154] Although the shaping reference surface 122 described in the embodiments and drawings is a plane, the present disclosure is not limited thereto. Under special use conditions, the shaping reference surface 122 may be a curved surface, and the shape of the upper shaping surface 221 needs to correspond to the shaping reference surface 122 .

[0155] In an embodiment, the upper module 220 can move in a direction perpendicular to the shaping reference surface 122 under the drive of the pressure device 210. The upper shaping surface 221 in the upper module 220 is used to press with the shaping reference surface 122 to shape the pins located between the upper shaping surface 221 and the shaping reference surface 122.

[0156] like Figure 6 , Figure 7 As shown, the upper module 220 is detachably mounted on the bottom of the driving end of the pressure device 210. Figure 7 As shown, the top of the upper module 220 has a protrusion, which can also be in the form of a trapezoid or dovetail shape, etc., for corresponding to, for example, a trapezoidal groove or a dovetail groove at the bottom of the driving end of the pressure device 210 and being detachably connected.

[0157] like Figure 8 As shown, the side of the protrusion above the upper module 220 has one or more positioning grooves. When the upper module 220 is installed on the pressure device 210, the positioning grooves are positioned by screws or pins arranged on the side to determine the position of the upper module 220 along the direction of the first groove 121.

[0158] like Figure 7 , Figure 8 As shown, the lower module 120 includes blocking blocks 123 disposed at both ends of the first groove 121 , and one or more products to be processed can be placed between the blocking blocks 123 .

[0159] In one embodiment, the position of the blocking block 123 is adjustable along the direction of the first groove 121 .

[0160] In a typical embodiment, Figure 8As shown, a second groove is provided on the blocking block 123, the direction of the second groove is the same as that of the first groove, and the depth of the second groove at least partially coincides with the height of the tube shell of the product to be disposed placed in the first groove 121. In other words, when the product to be disposed is placed in the first groove 121, its tube shell will be blocked between the second grooves of the blocking blocks 123 at both ends.

[0161] The inventors discovered that during the shaping process, the upper shaping surface is directly pressed onto the pins of the product to be processed. At this time, some of the warped pins will lift the tube shell in the groove after being pressed, but these pins do not produce sufficient deformation. In addition, due to the resilience of the pins themselves, after the upper module is separated from the lower module, the pins will warp again, thus affecting the shaping quality.

[0162] In view of the above problems, in a typical embodiment, Figure 8 As shown, the upper module 220 also includes:

[0163] The correction structure 222 includes a protrusion or a recessed portion whose position corresponds to the first groove 121; wherein the correction structure 222 is configured to: in the process of the upper module 220 moving close to the lower module 120, before the upper shaping surface 221 contacts the pin, first apply pressure to the shell of the product to be disposed of.

[0164] During the shaping process, the correction structure 222 can be pressed to the surface of the tube shell before the upper module 220 is pressed onto the pins on the lower module 120, so that the product pins can first be lifted up. In other words, the aforementioned tube shell lifting phenomenon is avoided. After that, the upper module 220 is directly pressed onto the pins on the lower module 120, avoiding the pins from warping again.

[0165] In an alternative embodiment, the correction structure may be as follows Figure 8 The segmented type shown can also be Fig. 9 The overall structure of the upper module is shown in FIG.

[0166] In an alternative embodiment, the correction structure may be as follows Fig. 9 The various structures shown include: Fig. 9 The concave shape shown in part A, Fig. 9 The protrusion shown in part B is Fig. 9 Part C in the figure shows multiple parallel protrusions.

[0167] In a typical embodiment, Fig. 9 The protruding correction structure shown in parts B and C in FIG. 1 has a height h of the protruding part. 校 Set to:

[0168] h 校 =h+0.8*d

[0169] The h value is as follows Fig.15 As shown, the distance between the welding plane a and the surface b of the tube shell 01, d is the lead thickness. 校 The units of , h and d are all mm.

[0170] In an alternative embodiment, if Figure 7 , Figure 8 As shown, a lower module mounting groove is provided on the carrier platform 110 , and the depth of the lower module mounting groove is less than the thickness of the lower module 120 .

[0171] In an optional embodiment, a side wall of the lower module installation groove and a corresponding side surface of the lower module 120 serve as installation reference surfaces for the supporting platform 110 and the lower module 120 .

[0172] In an optional embodiment, the lower module installation groove also includes various positioning structures for positioning the lower module 120, such as positioning columns, positioning pins, etc.

[0173] like Fig.10 As shown, in a typical embodiment, the detection mechanism 300 includes a scanning module 310 and a detection bracket 320. The detection bracket 320 is used to drive the scanning module 310 to scan the shaped product placed on the carrier 110 to obtain pin morphology information; the pin morphology information includes the aforementioned single pin flatness, single pin inclination and the total flatness of all pins on the same shaped product.

[0174] In an optional embodiment, the scanning module 310 includes a 3D camera capable of acquiring image depth information.

[0175] The detection bracket 320 includes a detection driving device, which can drive the scanning module 310 to reciprocate along the radial direction of the indexing disk or the long axis direction of the aforementioned first groove.

[0176] In a typical embodiment, during the intermittent stage of the movement of the conveying mechanism 100, the scanning module 310 is located above the lower module 120 that has entered its working position, and is driven by the detection bracket 320 to move along the long axis direction of the first groove 121 to obtain image information of one or more products to be inspected in the first groove 121, especially including the depth information of the pin portion.

[0177] In a typical embodiment, the scanning module 310 extracts the dot matrix information (including the height and angle of the pins) on all pins by means of image recognition, and compares this information with the shaping reference surface 122. If it exceeds the rated range, it is judged as unqualified. The scanning module 310 specifically detects the pins in three ways: single pin flatness detection, single pin inclination detection and total flatness detection.

[0178] In a typical embodiment, the scanning module 310 specifically works as follows:

[0179] After scanning, the scanning module 310 obtains a 16-bit depth map. Through the image mapping tool, the image is first converted into an 8-bit grayscale image, and the template tool is used to find the location of the product to be inspected. Then the spot tool is followed to the location of the pins on both sides, and the pin contour area is extracted based on the connectivity analysis of the grayscale value, and the minimum circumscribed affine rectangle of the pin part is obtained (that is, the angled rectangle that fits the outer contour of the pin most closely), and its main axis angle is analyzed to determine the skewness of the pin.

[0180] In the 16-bit depth map, a 25*25 rectangular area is taken at each corner of the carrier surface to fit the carrier plane; the outlines of each pin extracted above are mapped to the 16-bit depth map, and then a certain number of pixels are eroded to avoid the edge of the pin to avoid misjudgment. In the wheel width area after corrosion (that is, all pixels in this area participate in the height calculation, and the number of pixels participating in the calculation varies with the pin size. Taking a certain product as an example, the points participating in the height calculation are about 2000), the high tail and low tail values ​​are calculated. The high tail is the maximum height value obtained by sorting all pixel points to the fitted carrier plane height values ​​and removing a certain percentage of the head; the low tail is the minimum height value obtained by sorting all pixel points to the fitted carrier plane height values ​​and removing a certain percentage of the lowest point at the tail. This can remove the interference of camera noise and other abnormal points.

[0181] Subtract the low tail value from the high tail value of a single pin to obtain the flatness of the single pin, then sort the high and low tail values ​​of all pins, subtract the minimum low tail value from the maximum high tail value of all pins to obtain the flatness of the pins of the entire product to be tested.

[0182] In a typical embodiment, the transport mechanism 400 includes a first transport mechanism 410 and a second transport mechanism 420;

[0183] The first transport mechanism 410 is used to pick up one or more products to be processed and place them on the carrying platform 110;

[0184] The second transport mechanism 420 is used to take the inspected products out of the carrying platform 110 and place the qualified products and unqualified products in designated containers respectively;

[0185] like Fig.11 As shown, the first transport mechanism 410 and / or the second transport mechanism 420 include a mechanical arm 401 and a sucker 402 mounted at the end of the mechanical arm, and the sucker 402 includes a replaceable suction nozzle 403. The mechanical arm 401 can drive the sucker 402 to suck the product from the loading box 910 and place it in the lower module 120 of the carrier table through movement.

[0186] In one embodiment, relative to the robot arm 401 , the suction device 402 can independently move in the vertical direction.

[0187] In one embodiment, the first transport mechanism 410 and the second transport mechanism 420 have the same structure.

[0188] In one embodiment, a plurality of suction nozzles 403 of different sizes are provided and can be replaced according to different products.

[0189] In the embodiment, the transport mechanism 400 includes a control module for driving the mechanical arm 401 and the suction device 402 to operate according to a preset program to achieve the above-mentioned purpose. The control module and the control program therein can be designed and written according to the prior art, and are not described in detail in this disclosure due to space limitations.

[0190] In a typical embodiment, multiple products to be processed are placed in the loading box 910 according to preset rules through partitions or similar structures. The control module in the conveying mechanism 400 stores or can call the preset rules and picks up the products to be processed one by one based on the preset rules.

[0191] In a typical embodiment, Fig.14 As shown, the plastic inspection device further includes a top camera 710, which is electrically connected to at least the first conveying mechanism 410, and continuously photographs the products to be processed in the loading box 910, and transmits image information of the products to be processed to the first conveying mechanism 410. The first conveying mechanism 410 picks up the products to be processed one by one according to the position information of the products to be processed obtained from the image information. In this embodiment, the products to be processed that are randomly placed in the loading box 910 can also be correctly picked up.

[0192] In a typical embodiment, Figure 1 As shown, it also includes a bottom camera 720, which has a shooting direction opposite to that of the top camera 710 and is arranged on the conveying mechanism 400 to place the product to be disposed on the moving path of the supporting platform 110, and is used to obtain the position and angle information of the picked product to be disposed; the conveying mechanism 400 is configured to place the picked product to be disposed on the supporting platform 110 or a preset position after passing through the bottom camera 720 according to the position and angle information of the picked product to be disposed.

[0193] For example, when the position and / or angle of the picked-up product to be processed is incorrect, making it impossible to correctly place it on the upper module 120, the transport mechanism 400 places the product to be processed on the upper module 120. Figure 1 The loading NG box 930 is shown.

[0194] Alternatively, when the position and / or angle of the picked-up product to be disposed can be corrected, based on the information captured by the bottom camera 720, the robotic arm 401 drives the suction nozzle 403 to fine-tune the picked-up product to be disposed so that it can be correctly placed in the first groove 121 of the lower module 120.

[0195] In one embodiment, the top camera 710 or other photographing devices simultaneously photograph the loading NG box 930 , select the products to be processed that can be picked up again, and enable the transport mechanism 400 to pick them up again.

[0196] In a typical embodiment, Figure 3 As shown, the shaping detection equipment also includes a first lower module detection device 510 and a second lower module detection device 520; based on the running direction of the conveying mechanism 100, wherein: the first lower module detection device 510 is arranged between the shaping mechanism 200 and the first conveying mechanism 410, and is configured to issue an alarm when it is detected that the product to be disposed in the carrier 110 is not correctly placed; the second lower module detection device 520 is arranged between the second conveying mechanism 420 and the first conveying mechanism 410, and is configured to issue an alarm when it is detected that the carrier 110 is not empty.

[0197] In a typical embodiment, the plastic surgery detection device further includes a column 530, which is arranged through the through hole at the center of the indexing plate 130. The column 530 may include a through hole arranged concentrically with the center of the indexing plate 130.

[0198] The first lower module detection device 510 and the second lower module detection device 520 both include a cantilever 504 , the proximal end of the cantilever 504 is connected to the column 530 , and the distal end extends to the inner side of the support platform 110 .

[0199] The first lower module detection device 510 and the second lower module detection device 520 also include a light source, preferably disposed below the indexing plate 130. The first lower module detection device 510 and the second lower module detection device 520 both include an optical waveguide 501 (such as an optical fiber), and the incident end of the optical waveguide 501 is connected to the light source, such as Fig.12 and Figure 3 As shown, the emission end is arranged at the distal end of the cantilever. Figure 3 In the figure, the end of the optical waveguide 501 close to the pillar 530 is shown to be spaced apart from the pillar 530 , but it is easy to understand that the optical waveguide 501 can extend to the pillar 530 and pass through the through hole of the pillar 530 to be connected to the light source.

[0200] The first lower module detection device 510 and the second lower module detection device 520 further include two optical sensors (not shown) disposed outside the support platform 110 and opposite to the optical waveguide emission ends of the first lower module detection device 510 and the second lower module detection device 520 , respectively.

[0201] like Fig.12 As shown, a vertical plate 502 is disposed at the far end of the cantilever 504 , and the vertical plate 502 has fixing holes 503 of different heights for adjusting the height of the emitting end of the optical waveguide 501 .

[0202] Furthermore, if Fig.12 As shown, the fixing holes 503 on the vertical plate 502 include two types, one is a circular hole in the middle of the upper part and the other is a long strip hole on both sides of the lower part, wherein:

[0203] The circular hole is used to fix the output end of the optical waveguide and allows the light emitted from the optical waveguide to pass through and be received by the optical sensor;

[0204] The long strip hole is used to adjust the height of the vertical plate 502, and then adjust the height of the light waveguide emitting end. Specifically, the vertical plate 502 can be moved up and down to make the height of the light waveguide emitting end on it meet the requirements, and then the vertical plate 502 is fixed to the cantilever 504 with screws passing through the long strip hole.

[0205] In a typical embodiment, the height of the exit end of the optical waveguide 501 on the first lower module detection device 510 is slightly higher than the top height of the tube shell of the product to be processed correctly placed in the first groove, for example, higher than the top surface of the tube shell of the product to be processed correctly placed in the first groove and lower than the shaping reference surface 122 of the lower module 120. When the product to be processed is not correctly placed in the first groove and passes through the first lower module detection device 510, the light emitted from the exit end of the optical waveguide 501 will be blocked by the tube shell of the product to be processed and cannot be received by the corresponding sensor. According to the configuration, the sensor sends an alarm or shutdown signal.

[0206] In a typical embodiment, the height of the exit end of the optical waveguide 501 on the second lower module detection device 520 is set to be able to pass through the second groove on the aforementioned blocking block and be incident on the corresponding sensor. According to the depth setting of the second groove and the height setting of the exit end of the optical waveguide 501 described in the aforementioned embodiment, when the detected product is not correctly unloaded and remains in the first groove and passes through the second lower module detection device 520, the light emitted from the exit end of the optical waveguide 501 will be blocked by the detected product remaining in the first groove and cannot be received by the corresponding sensor. According to the configuration, the sensor sends an alarm or a shutdown signal, thereby preventing the first transport mechanism from repeatedly loading materials therein, causing damage to the equipment or product.

[0207] In a typical embodiment, Figure 3 As shown, six bearing platforms 110 are evenly distributed on the circumference of the upper surface of the indexing plate 130;

[0208] like Figure 2As shown, the first conveying mechanism 410, the first lower module detection device 510, the shaping mechanism 200, the detection mechanism 300, the second conveying mechanism 420 and the second lower module detection device 520 are sequentially arranged clockwise or counterclockwise around the dividing plate 130 along the circumferential direction.

[0209] In a typical embodiment, Figure 6 As shown, the lower module 120 is detachably connected to the carrier platform 110; the shaping and detection equipment also includes: a lower module replacement switch 600, which is electrically connected to the conveying mechanism 100; the conveying mechanism 100 is configured as follows: when the shaping mechanism 200, the detection mechanism 300 and the handling mechanism 400 stop running and the lower module replacement switch 600 is triggered, a stepping movement is performed, so that the carrier platform 110 and the lower module 120 thereon alternately pass through the lower module replacement position (usually directly behind the equipment), and the lower modules 120 are replaced one by one in one operation.

[0210] In a typical embodiment, Fig.13 , Fig.16 As shown, the plastic surgery inspection equipment also includes: a safety cover 800; a loading box 910 for placing products to be picked up and disposed of; a unloading box 920 for placing qualified products among the inspected products; and a loading and unloading mechanism 900, which can at least: move the loading box 910 from outside the safety cover 800 to below the top camera 710, and move the unloading box 920 out of the safety cover 800.

[0211] In a typical embodiment, the loading and unloading mechanism 900 includes a guide rail tangent to the outer circle of the indexing plate 130 , and the loading box 910 and the unloading box 920 can move along the guide rail.

[0212] In an embodiment, Figure 1 As shown, the plastic surgery inspection device also includes a defective product box 940.

[0213] In an embodiment, the plastic surgery detection device further comprises:

[0214] The main control module is electrically connected to the transmission mechanism 100, the shaping mechanism 200, the detection mechanism 300 and at least one handling mechanism 400, a pressure sensor, an optical sensor, etc.; and is used to drive the various mechanisms of the shaping and detection equipment to perform the actions described in the aforementioned embodiments.

[0215] Input and output devices are electrically connected to the main control module.

[0216] The input and output device includes one or more display devices 810, and the display device 810 is configured to display the following information in a split screen or in a centralized manner:

[0217] The product image currently being inspected by the inspection agency and the corresponding inspection result information, pin morphology information; the cumulative inspection result statistics within a working stage, including the number of qualified, unqualified, and feeding NG numbers, etc.

[0218] The present disclosure also provides a method for performing shaping detection on the external pins of an integrated circuit package, using the device in the aforementioned embodiment to perform the following steps respectively:

[0219] The transport mechanism 400 places at least one product to be processed onto the lower module 120 of the conveying mechanism 100;

[0220] The conveying mechanism 100 conveys at least one product to be processed to the working position of the shaping mechanism 200;

[0221] The shaping mechanism 200 shapes the pins of at least one product to be processed;

[0222] The conveying mechanism 100 conveys the shaped at least one product to be processed to the working position of the detection mechanism 300;

[0223] The detection mechanism 300 detects the pins of at least one product to be processed that has been shaped;

[0224] The transport mechanism 400 takes out the at least one shaped product to be processed from the lower module 120 .

[0225] In the method, further, the conveying mechanism 100 is driven to move in a stepwise manner, and in the intermittent stage of the stepwise movement, the following steps are performed at least partially and simultaneously:

[0226] The product to be processed in the carrying platform 110 at its working position is shaped by the shaping mechanism 200.

[0227] The inspection mechanism 300 inspects the shaped product in the carrier platform 110 at its working position to obtain inspection result information of the shaped product;

[0228] Pick up one or more products to be processed through the transport mechanism 400 and place them on the carrier 110 at its working position, and / or take out the inspected products from the carrier 110 at its working position, and place the inspected products at a preset position based on the inspection result information;

[0229] in,

[0230] The duration of the intermittent phase is the working time of the shaping mechanism 200.

[0231] In a preferred embodiment, the pressure value and pressure holding time applied by the pressure device 210 in the shaping mechanism 200 to the pins satisfy the following corresponding relationship with the pin thickness and the number of pins:

[0232] Number of pins Nominal pin thickness (mm) Pressure(N) Pressure holding time (s) 6 0.08～0.12 110～130 2.8～3.2 4 0.13～0.17 110～130 2.8～3.2 8 0.13～0.17 190～210 3.8～4.2 12 0.13～0.17 230～250 3.8～4.2 16 0.13～0.17 230～250 5.8～6.2 16 0.18～0.22 240～260 5.8～6.2 4 0.18～0.22 140～160 3.8～4.2 4 0.23～0.27 170～190 3.8～4.2 8 0.23～0.27 190～210 5.8～6.2

[0233] In the embodiment, it should be understood that the actual thickness of the pin should have a certain deviation based on its nominal thickness, and the deviation meets the tolerance range of the product in compliance with the production standard. In the method provided in the embodiment of the present disclosure, the nominal thickness of the pin is only used as a parameter for selecting the required pressure value and the pressure holding time, and does not limit the pin thickness of the product to be treated that is applicable to the method. The following is an exemplary embodiment of the specific steps of the aforementioned shaping detection method:

[0234] Place the product to be processed in the loading box 910, place the loading box 910 and the unloading box 920 on the loading and unloading mechanism 900, respectively, and start the loading and unloading mechanism 900 to transport the loading box 910 and the unloading box 920 to the loading position and the unloading position of the conveying mechanism 100 (in the form of a dividing plate), respectively;

[0235] The top camera captures the position information of the product to be processed in the loading box 910. According to the position information obtained by the top camera, the first conveying mechanism 410 absorbs the product to be processed and moves it to the bottom camera 720 to capture the position, angle and other information of the product. The first conveying mechanism 410 adjusts the position and angle of the captured product according to the information obtained by the bottom camera to accurately place the product in the first groove 121 of the lower module 120, and places the incorrectly captured product in the loading NG box 930. The first conveying mechanism 410 can fill multiple products in a single first groove 121 for multiple times in a row. In addition, one product can also be placed in a single first groove 121.

[0236] The indexing plate 130 rotates counterclockwise to move the lower module 120 to the first lower module detection device 510, where the optical waveguide 501 (such as an optical fiber) and the corresponding sensor monitor whether the product is correctly placed in the first groove 121. If it is not correctly placed in the first groove 121, the device will sound an alarm to prompt the operator to check.

[0237] The indexing plate 130 continues to rotate counterclockwise to the shaping station, and the product pins are flattened by the shaping mechanism 200;

[0238] The indexing plate 130 continues to rotate counterclockwise to the monitoring station, and the 3D camera of the detection mechanism 300 captures data of the product pins (including pin height, pin angle, etc.), calculates the flatness and single pin tilt, and outputs the monitoring results to the main control module. The detection mechanism 300 determines whether the product is qualified based on the requirements and the calculated product shaping data.

[0239] The indexing plate 130 continues to rotate counterclockwise to the unloading station, and the second transport mechanism 420 places the unqualified products in the unqualified product box 940 according to the monitoring result of the monitoring mechanism 300, and places the qualified products in the unloading box 920;

[0240] The dividing plate 130 continues to rotate counterclockwise to the second lower module detection device 520, wherein the optical waveguide 501 (such as optical fiber) and the corresponding sensor monitor whether there are any products remaining in the first groove 121. If there are products, the equipment will issue a corresponding alarm. If there are no products, the dividing plate 130 continues to rotate counterclockwise to the loading station, and repeats the steps of loading, shaping, and testing for other products to be disposed of.

[0241] To sum up, the equipment and method provided by the present invention can not only automatically shape the external leads (i.e., pins) of the product, avoiding the problems caused by manual or semi-automatic equipment due to uncontrolled press pressure, deformation of the tube legs caused by excessive force, and failure to meet the shaping standards due to insufficient force, but also can automatically detect the shaping effect, solving the problem of poor quality consistency caused by the existing operator's naked eye observation and judgment, and achieving good results; in addition, it avoids the operator manually loading and unloading the product during manual or semi-automatic equipment shaping operations, thereby reducing the large amount of time required for the clamping and fixing operations of the product, thereby improving both product quality and efficiency.

[0242] The above description is only part of the specific implementation methods of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the embodiments of the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A device for detecting the external pins of an integrated circuit package, characterized in that: It comprises a conveying mechanism (100), a shaping mechanism (200), a detecting mechanism (300) and at least one transporting mechanism (400); wherein: The conveying mechanism (100) comprises one or more carriers (110) and a lower module (120) detachably mounted on the carrier (110), wherein the lower module (120) has a shaping reference surface (122) for supporting pins of a product to be processed; the conveying mechanism (100) is capable of step-by-step movement, so that any of the carriers (110) can at least stay at and pass through the working positions of the shaping mechanism (200) and the detection mechanism (300); The shaping mechanism (200) comprises a pressure device (210) and an upper module (220), wherein the upper module (220) has an upper shaping surface (221) capable of being pressed against a shaping reference surface (122), and the pressure device (210) is capable of driving the upper module (220) to apply pressure to the pins of the product to be treated supported by the lower module (120) and maintain the pressure for a preset time; The detection mechanism (300) is used to detect the shaped product placed in the lower module (120), obtain the shape information of the pins of the shaped product, and obtain the detection result information based on the shape information; The transport mechanism (400) is used to: pick up one or more products to be processed and place them on the carrier (110), and / or take out the detected products from the lower module (120) and place the detected products at a preset position based on the detection result information.

2. The plastic surgery detection device according to claim 1, characterized in that: The transmission mechanism (100) comprises a dividing plate (130) and a stepping motor (140); The stepper motor (140) is located below the indexing plate (130), and the shaft of the stepper motor (140) is connected to the center of the indexing plate (130); A plurality of the bearing platforms (110) are arranged circumferentially on the upper surface of the indexing plate (130); The at least one transport mechanism (400), the shaping mechanism (200) and the detection mechanism (300) are arranged around the indexing plate (130).

3. The plastic surgery detection device according to claim 1 or 2, characterized in that: The lower module (120) comprises a first groove (121) for placing the package of the product to be processed; The upper module (220) can move in a direction perpendicular to the shaping reference plane (122) under the drive of the pressure device (210).

4. The plastic surgery detection device according to claim 3, characterized in that: The lower module (120) comprises blocking blocks (123) disposed at both ends of the first groove (121), and one or more products to be disposed can be placed between the blocking blocks (123).

5. The plastic surgery detection device according to claim 3, characterized in that: The upper module (220) further includes: A correction structure (222), the correction structure (222) comprising a protrusion or a recessed portion whose position corresponds to the first groove (121); wherein the correction structure (222) is configured to: during the process of the upper module (220) moving close to the lower module (120), before the upper shaping surface (221) contacts the pin, apply pressure to the package of the product to be processed.

6. The plastic surgery detection device according to claim 1 or 2, characterized in that: The detection mechanism (300) comprises a scanning module (310) and a detection bracket (320), wherein the detection bracket (320) is used to drive the scanning module (310) to scan the shaped product placed on the lower module (120) to obtain pin morphology information; The pin shape information includes the flatness of a single pin, the inclination of a single pin, and the total flatness of all pins on the same shaped product.

7. The plastic surgery detection device according to claim 2, characterized in that: The transport mechanism (400) comprises a first transport mechanism (410) and a second transport mechanism (420); The first transport mechanism (410) is used to pick up one or more products to be processed and place them in the lower module (120); The second transport mechanism (420) is used to take out the inspected products from the lower module (120), and place the qualified products and unqualified products therein into designated containers respectively; The first transport mechanism (410) and / or the second transport mechanism (420) comprises a mechanical arm (401) and a suction device (402) installed at the end of the mechanical arm, wherein the suction device comprises a replaceable suction nozzle (403).

8. The plastic surgery detection device according to claim 7, characterized in that: It also includes a first lower module detection device (510) and a second lower module detection device (520); based on the running direction of the conveying mechanism (100), wherein: The first lower module detection device (510) is disposed between the shaping mechanism (200) and the first transport mechanism (410), and is configured to issue an alarm when it is detected that the product to be disposed in the carrying platform (110) is not correctly placed; The second lower module detection device (520) is disposed between the second transport mechanism (420) and the first transport mechanism (410), and is configured to issue an alarm when it is detected that the support platform (110) is not empty.

9. The plastic surgery detection device according to claim 8, characterized in that: The first conveying mechanism (410), the first lower module detection device (510), the shaping mechanism (200), the detection mechanism (300), the second conveying mechanism (420) and the second lower module detection device (520) are sequentially arranged along the circumferential direction around the dividing plate (130).

10. The plastic surgery detection device according to claim 2, characterized in that: Also includes: A lower module replacement switch (600) electrically connected to the transmission mechanism (100); The conveying mechanism (100) is configured to perform a step-by-step movement when the shaping mechanism (200), the detection mechanism (300) and the transport mechanism (400) stop running and the lower module replacement switch (600) is triggered.

11. The plastic surgery detection device according to any one of claims 1, 2 or 10, characterized in that: Also includes: A top camera (710) is disposed above the product to be processed to be picked up, and is used to obtain position information of the product to be processed to be picked up, so that the transport mechanism (400) picks up the product to be processed according to the position information; A bottom camera (720) having a shooting direction opposite to that of the top camera and arranged on the moving path of the transport mechanism (400) to place the product to be processed on the lower module (120), and used to obtain position and angle information of the picked product to be processed; The transport mechanism (400) is configured to place the picked-up product to be disposed on the carrying platform (110) or a preset position according to the position and angle information of the picked-up product to be disposed.

12. The plastic surgery detection device according to claim 11, characterized in that: Also includes: Safety cover (800); A loading box (910) for placing products to be picked up and disposed of; A material box (920) for placing qualified products among the inspected products; The loading and unloading mechanism (900) can at least: Move the loading box (910) from outside the safety cover (800) to below the top camera (710), The material box (920) is removed from the safety cover (800).

13. A method for performing shaping inspection on external pins of integrated circuit packages using the shaping inspection device according to any one of claims 1 to 12, characterized in that: include: The transport mechanism (400) places at least one product to be processed on the lower module (120) of the conveying mechanism (100); The conveying mechanism (100) conveys the at least one product to be processed to the working position of the shaping mechanism (200); The shaping mechanism (200) shapes the pins of the at least one product to be processed; The conveying mechanism (100) conveys the at least one shaped product to be processed to the working position of the detection mechanism (300); The detection mechanism (300) detects the shaped pins of the at least one product to be processed; The transport mechanism (400) takes out the at least one shaped product to be processed from the lower module (120).

14. The method according to claim 13, characterized in that The conveying mechanism (100) moves in a step-by-step manner, and in the intermittent stage of the step-by-step movement, the actions performed by the shaping mechanism (200), the detection mechanism (300) and the transport mechanism (400) are at least partially performed simultaneously; The duration of the intermittent phase is the working time of the shaping mechanism (200).

15. The method according to claim 13 or 14, characterized in that According to the number of pins and the nominal thickness of the pins of the product to be processed, the pressure value and the pressure holding time of the pressure device (210) in the shaping mechanism (200) are set; The number of pins and the nominal thickness of the pins have the following corresponding relationship with the pressure value and the pressure holding time: 。

Images