Etching equipment and system for semiconductor chip production

Abstract

The invention provides etching equipment and system for semiconductor chip production. The etching equipment for semiconductor chip production comprises a base; the three treatment barrels are respectively, correspondingly and fixedly arranged on the base; the stirring mechanism comprises a motor and a stirring part, the motor is fixedly arranged on the base, and the shaft end of the motor penetrates through one treatment barrel and then is fixedly connected with the stirring part; according to the semiconductor chip production system, the etching equipment for semiconductor chip production is adopted for etching treatment, and technical support is provided for continuous production of semiconductor chips. According to the scheme, in the etching treatment process of one group of wafers, cleaning, drying, feeding and discharging of the other three groups of wafers can be synchronously carried out, the waiting time needed by etching treatment of each group of wafers is shortened, continuous etching processing of the wafers is facilitated, and the etching treatment efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to an etching device and system for producing semiconductor chips. Background Art

[0002] Wafer etching is an essential process in the production and manufacturing of semiconductor chips. It removes the surface material of the wafer by chemical or physical methods to form the required pattern and structure on the surface of the wafer. During the chemical wet etching process, impurities such as etching solution and byproducts generated by the reaction will remain on the surface of the wafer; after the etching is completed, the wafer needs to be cleaned and dried to remove the chemical solution and residues on the surface.

[0003] In the related art, the etching equipment includes an etching cabinet, a loading mechanism, an etching chamber, a cleaning chamber and a drying chamber arranged in the etching cabinet, and the etching solution is stored in the etching chamber. A group of wafers are immersed in the etching chamber, and the etching process is completed after the set temperature and time; after the etching process is completed, the group of wafers are transferred from the etching chamber to the cleaning chamber for cleaning; after the cleaning process is completed, the group of wafers are transferred from the cleaning chamber to the drying chamber for drying. The transfer of the wafers is completed by the loading mechanism.

[0004] Using the above-mentioned etching equipment, a group of wafers are transferred in the etching chamber, the cleaning chamber and the drying chamber in turn, and are etched, cleaned and dried in turn; the next group of wafers needs to wait until the first group of wafers completes all processes before entering the processing process, resulting in the continuity of wafer production efficiency being limited.

[0005] Therefore, it is necessary to provide a new etching equipment for semiconductor chip production to solve the above-mentioned technical problems. Summary of the invention

[0006] The present invention provides an etching device for semiconductor chip production, which solves the technical problem in the related art that the next group of wafers needs to wait until the previous group of wafers completes all processes before entering the processing process, resulting in the continuity of wafer production efficiency being limited.

[0007] In order to solve the above technical problems, the present invention provides an etching device for semiconductor chip production, comprising: Base; Three processing barrels, the three processing barrels are respectively fixed on the base; A stirring mechanism, the stirring mechanism comprising a motor and a stirring member, the motor being fixedly mounted on the base, the shaft end of the motor passing through one of the processing barrels and then being fixedly connected to the stirring member; A lifting mechanism, the lifting mechanism comprising a telescopic member, a fixing ring, a support plate and four support arms, the telescopic member connects the base and the fixing ring, the support plate is rotatably mounted in the fixing ring, the four support arms are fixedly arranged around the bottom of the support plate, and the bottom of the support arm is used to load the arc-shaped carrier; A switching mechanism, wherein the switching mechanism is mounted on the base; Among them, the telescopic part is used to drive the fixing ring to rise and fall. When the telescopic part drives the fixing ring and the support plate to rise to a switching state, the switching mechanism is used to drive the support plate to rotate; when the telescopic part drives the fixing ring and the support plate to descend to a working state, the three support arms are loaded into the corresponding three processing barrels.

[0008] Preferably, the switching mechanism comprises a first bevel gear, a support shaft and a second bevel gear, the first bevel gear is fixedly arranged at the shaft end of the motor, the support shaft is rotatably mounted on the base, and the second bevel gear is mounted on the support shaft; The etching equipment for semiconductor chip production also includes a connecting mechanism, which includes a docking block, a connecting tube and a docking ring, wherein the docking block is fixedly arranged on the top of the supporting shaft, the top of the connecting tube is fixedly connected to the supporting plate, and the docking ring is fixedly arranged on the bottom of the connecting tube; A cross slot is provided on the docking snap ring. When the support plate rises to a switching state, the docking block is assembled with the docking snap ring through the cross slot; and the first bevel gear is meshed with the second bevel gear.

[0009] Preferably, the second bevel gear sliding key is mounted on the support shaft; The connecting mechanism also includes an elastic contraction member and a rotating ring. The elastic contraction member is fixedly embedded in the connecting tube. The elastic contraction member elastically connects the connecting tube and the rotating ring. The bottom of the rotating ring is rotatably connected to the top of the second bevel gear.

[0010] Preferably, two elastic contraction members are provided, and the two elastic contraction members are distributed in parallel and symmetrically in the connecting tube.

[0011] Preferably, a plurality of elastic contraction members are provided.

[0012] Preferably, the etching equipment for producing semiconductor chips further comprises a loading mechanism, and the loading mechanism is mounted on the base.

[0013] Preferably, the feeding mechanism comprises a rotating device and a hanging bracket, the rotating device is mounted on the base, and the hanging bracket is fixed on the rotating part of the rotating device; The arc-shaped carrier is provided with a first pair of interfaces, and the bottom of the arc-shaped carrier is provided with a second pair of interfaces, and the hanger is interference-engaged with the arc-shaped carrier through the first pair of interfaces; The support arm is in an L-shaped structure, and the bottom of the support arm is interference-engaged with the arc-shaped carrier through the second docking interface; The hanging bracket corresponds to one of the supporting arms up and down and is staggeredly distributed.

[0014] Preferably, the hanger is in a U-shaped structure.

[0015] Preferably, a sealing ring is provided on the top of the processing barrel.

[0016] The present invention also provides a semiconductor chip production system, comprising a wafer production unit, an oxidation treatment unit, a photolithography unit, a thin film deposition unit, an interconnection unit, a testing unit, a packaging unit and the etching equipment for semiconductor chip production; the wafer production unit, the oxidation treatment unit, the photolithography unit, the etching equipment for semiconductor chip production, the thin film deposition unit, the interconnection unit, the testing unit and the packaging unit are connected in sequence.

[0017] Compared with the related art, the etching equipment for semiconductor chip production provided by the present invention has the following beneficial effects: The three processing barrels facilitate simultaneous etching, cleaning and drying of a group of wafers at three stations, without waiting for the previous group to complete all processes before etching, cleaning and drying, thus reducing waiting time and improving the continuity of system operation; After the etching, cleaning and drying processes of a group of wafers at three stations are completed, the telescopic member is started, and the telescopic member drives the fixed ring, the supporting plate and the supporting arm to move upward as a whole, so as to realize the synchronous unloading of a group of wafers at three stations, and simultaneously automatically load a group of wafers at the loading station; after the supporting plate is fully opened, the supporting plate is controlled to rotate by the switching mechanism, and the supporting plate synchronously drives the four groups of wafers at the four stations to perform synchronous station switching; Ultimately, while one group of wafers is being etched, the other three groups of wafers can be cleaned, dried, and loaded and unloaded simultaneously, reducing the waiting time required for etching each group of wafers, facilitating continuous etching processing of wafers, and improving etching processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 A three-dimensional diagram of a preferred embodiment of an etching device for semiconductor chip production provided by the present invention; Figure 2 for Figure 1 AA section view shown; Figure 3 for Figure 1 A top view of the distribution of the treatment barrels shown; Figure 4 for Figure 2 A three-dimensional view of a partial cross-section of the connecting tube shown; Figure 5 for Figure 2 A three-dimensional diagram showing the distribution of docking blocks and docking rings; Figure 6 A three-dimensional diagram of another preferred embodiment of the etching equipment for semiconductor chip production provided by the present invention; Figure 7 for Figure 6 BB section view shown; Figure 8 The lifting principle diagram of the second main gear of the etching equipment for semiconductor chip production provided by the present invention, wherein: Figure 8 (a) is the left side view of the support plate in the sealed closed mode. Figure 8 (b) is the left view of the support plate when it is first opened. Figure 8 (c) is the left view in the switching state; Fig. 9 for Figure 8 The schematic diagram of the support arm moving upward is shown in FIG. Fig. 9 (a) Figure 8 (a) Front view of the loading station support arm, Fig. 9 (b) Figure 8 (b) Front view of the loading station support arm in the state, Fig. 9 (c) Figure 8 (c) Front view of the loading station support arm in the state; Fig.10 for Fig. 9 The schematic diagram of the upward movement of the supporting arm and the arc-shaped carrier is shown, wherein: Fig.10 (a) Fig. 9 (b) Front view of the support arm and the arc-shaped carrier in this state, Fig.10 (b) Fig. 9 (b) to Fig. 9 (c) Front view of the supporting arm and the arc-shaped carrier being fully engaged during the process. Fig.10 (c) Fig. 9 (b) to Fig. 9 (c) Front view of the arc-shaped carrier and the bracket about to separate during the process. Fig.10 (d) Fig. 9 (b) to Fig. 9 (c) Front view of the arc-shaped carrier and the bracket being completely separated during the process; Fig.11 This is a system block diagram of the semiconductor chip production system provided by the present invention.

[0020] Description of Figure Numbers: 10, wafer; 100, etching station; 200, cleaning station; 300, drying station; 400, loading station; 1. Base; 2. Processing barrel; 3. stirring mechanism; 31. motor; 32. stirring element; 4. Lifting mechanism; 41. Telescopic member; 42. Fixed ring; 43. Support plate; 44. Support arm; 5. arc-shaped carrier; 501. first pair of interfaces; 502. second pair of interfaces; 6. Switching mechanism; 61. First bevel gear; 62. Support shaft; 63. Second bevel gear; 7. Connecting mechanism; 71. Docking block; 72. Connecting tube; 73. Docking clamp ring; 74. Elastic shrink member; 75. Swivel; 8. Feeding mechanism; 81. Rotating device; 82. Hanging bracket.

[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The invention provides an etching device for producing semiconductor chips.

[0024] Please refer to Figure 1 and Figure 2In one embodiment of the present invention, an etching device for producing semiconductor chips comprises: Base 1; Three processing barrels 2, the three processing barrels 2 are respectively fixed on the base 1; A stirring mechanism 3, the stirring mechanism 3 comprises a motor 31 and a stirring member 32, the motor 31 is fixedly mounted on the base 1, and the shaft end of the motor 31 passes through one of the processing barrels 2 and is fixedly connected to the stirring member 32; The lifting mechanism 4 includes a telescopic member 41, a fixing ring 42, a support plate 43 and four support arms 44. The telescopic member 41 connects the base 1 and the fixing ring 42. The support plate 43 is rotatably mounted in the fixing ring 42. The four support arms 44 are fixedly mounted around the bottom of the support plate 43. The bottom of the support arm 44 is used to load the arc-shaped carrier 5. A switching mechanism 6, wherein the switching mechanism 6 is mounted on the base 1; Among them, the telescopic member 41 is used to drive the fixing ring 42 to rise and fall. When the telescopic member 41 drives the fixing ring 42 and the support plate 43 to rise to the switching state, the switching mechanism 6 is used to drive the support plate 43 to rotate; when the telescopic member 41 drives the fixing ring 42 and the support plate 43 to descend to the working state, the three support arms 44 are installed in the corresponding three processing barrels 2.

[0025] Please refer again Figure 2 In this embodiment, the arc-shaped carrier 5 is used to place a group of wafers 10 to be processed.

[0026] Please refer to Figure 3 , Figure 2 and Figure 1 , the base 1 is provided with four operating stations: A loading station 400, where the corresponding support arm 44 is staggered with the processing barrel 2, and is used for unloading and loading a group of wafers 10 to be processed; The etching station 100 corresponds to a processing barrel 2 filled with an etching solution, which is used for etching treatment after a group of wafers 10 are inserted; A cleaning station 200 corresponds to a treatment barrel 2 filled with a cleaning solution for inserting and cleaning the etched wafer 10; The drying station 300 corresponds to a processing barrel 2 in which a ventilation and drying device is integrated and installed, and is used for drying the wafer 10 after cleaning.

[0027] The three processing barrels 2 are respectively arranged at the etching station 100 , the cleaning station 200 and the drying station 300 .

[0028] Etching principle: by immersing the developed wafer 10 in an etching solution, the etching solution will chemically react with the portion of the wafer 10 surface not protected by the photoresist, thereby removing it. The etching time and temperature need to be controlled according to specific process requirements to ensure the etching effect and quality.

[0029] The support plate 43 has two usage modes: See also Figure 8 (a), in the working state, the bottom of the support plate 43 completely abuts against the top of the processing barrel 2, and the connection is sealed; See also Figure 8 (c) In the switching state, the support plate 43 drives the support arm 44 to completely leave the processing barrel 2, providing an escape space for the rotation switching of the support arm 44.

[0030] Continuous processing flow of wafer 10: After the first group of wafers 10 are loaded, they are first transferred from the loading station 400 to the etching station 100 for etching treatment. During the etching treatment, the second group of wafers 10 are loaded to the loading station 400 for standby; After the etching of the first group of wafers 10 is completed, the first group of wafers 10 is transferred from the etching station 100 to the cleaning station 200 for cleaning, and the second group of wafers 10 is transferred from the loading station 400 to the etching station 100 for etching. During the simultaneous etching and cleaning process, the third group of wafers 10 is loaded to the loading station 400 for standby; After the first group of wafers 10 are cleaned and the second group of wafers 10 are etched, the first group of wafers 10 are transferred from the cleaning station 200 to the drying station 300 for drying, the second group of wafers 10 are transferred from the etching station 100 to the cleaning station 200 for cleaning, the third group of wafers 10 are transferred from the loading station 400 to the etching station 100 for etching, and during the simultaneous etching, cleaning and drying process, the fourth group of wafers 10 are loaded to the loading station 400 for standby; After the first group of wafers 10 are dried, the second group of wafers 10 are cleaned, and the third group of wafers 10 are etched, the first group of wafers 10 are transferred from the drying station 300 to the loading station 400 for unloading, the second group of wafers 10 are adjusted from the cleaning station 200 to the drying station 300 for drying, the third group of wafers 10 are transferred from the etching station 100 to the cleaning station 200 for cleaning, the fourth group of wafers 10 are transferred from the loading station 400 to the etching station 100 for etching, and in the process of simultaneous etching, cleaning and drying, the fifth group of wafers 10 are loaded to the loading station 400 after the unloading for standby; At this point, a cycle of continuous etching process is completed, and by analogy, continuous etching process of the wafer 10 is achieved, thus reducing waiting time.

[0031] In this embodiment, the telescopic member 41 is a hydraulic telescopic cylinder, which provides a power source for the lifting and lowering adjustment of the fixing ring 42. The support plate 43 is rotatably mounted on the fixing ring 42. When the telescopic member 41 drives the support plate 43 to move downward through the fixing ring 42, the support plate 43 can automatically dock with the processing barrel 2 to control the automatic closing of the processing barrel 2; When the telescopic member 41 drives the supporting plate 43 to move upward through the fixing ring 42 , the supporting plate 43 can be automatically separated from the processing barrel 2 , so as to automatically open the processing barrel 2 .

[0032] Because, during the etching process, proper stirring or oscillation can promote the full contact between the etching solution and the surface of the wafer 10, thereby improving the uniformity and rate of etching; in the process of promoting the contact of the etching solution, the stirring speed of the stirring mechanism 3 is controlled to make the etching solution slowly turbulent and stirred.

[0033] Therefore, by providing a stirring mechanism 3 on the etching station 100, it is convenient to provide power for the stirring turbulence of the etching solution in the processing barrel 2, so as to promote the full contact between the etching solution and the surface of the wafer 10, and improve the etching process efficiency and quality.

[0034] The three processing barrels 2 facilitate simultaneous etching, cleaning and drying of a group of wafers 10 at three stations, without waiting for the previous group to complete all processes before etching, cleaning and drying, thus reducing waiting time and improving the continuity of system operation; After the etching, cleaning and drying processes of a group of wafers 10 at three stations are completed, the telescopic member 41 is started, and the telescopic member 41 drives the fixing ring 42, the supporting plate 43 and the supporting arm 44 to move upward as a whole, so as to realize the synchronous unloading of a group of wafers 10 at three stations, and simultaneously automatically load a group of wafers 10 at the loading station 400; after the supporting plate 43 is fully opened, the supporting plate 43 is controlled to rotate by the switching mechanism 6, and the supporting plate 43 synchronously drives the four groups of wafers 10 at four stations to perform synchronous station switching; Ultimately, during the etching process of one group of wafers 10, the cleaning, drying, loading and unloading of another three groups of wafers 10 can be carried out simultaneously, reducing the waiting time required for the etching process of each group of wafers 10, facilitating the continuous etching process of the wafers 10, and improving the etching process efficiency.

[0035] In an optional implementation of the present embodiment, the switching mechanism 6 may be an independent driving motor, the driving shaft of which is key-connected to the supporting plate 43 , thereby realizing the station switching of the arc-shaped carrier 5 on the supporting arm 44 .

[0036] Please refer to Figure 2 , Figure 4 and Figure 5 The switching mechanism 6 includes a first bevel gear 61, a support shaft 62 and a second bevel gear 63, wherein the first bevel gear 61 is fixed to the shaft end of the motor 31, the support shaft 62 is rotatably mounted on the base 1, and the second bevel gear 63 is mounted on the support shaft 62; The etching device for producing semiconductor chips further comprises a connecting mechanism 7, which comprises a docking block 71, a connecting tube 72 and a docking clamp ring 73, wherein the docking block 71 is fixedly arranged on the top of the supporting shaft 62, the top of the connecting tube 72 is fixedly connected to the supporting plate 43, and the docking clamp ring 73 is fixedly arranged on the bottom of the connecting tube 72; The docking snap ring 73 is provided with a cross slot. When the support plate 43 rises to the switching state, the docking block 71 is assembled with the docking snap ring 73 through the cross slot; the first bevel gear 61 is meshed with the second bevel gear 63 .

[0037] Specifically, the transmission ratio between the first bevel gear 61 and the second bevel gear 63 is 1:1.

[0038] In one embodiment, the second bevel gear 63 is fixedly mounted on the support shaft 62. At this time, the motor 31 has two usage modes: In the working state, the support plate 43 is completely closed, the docking block 71 is separated from the docking clamp ring 73, the stirring member 32 is driven to rotate independently, and the support shaft 62 rotates; In the switching state, please refer to Figure 8 (c) and Fig. 9 (c) When the support plate 43 is fully opened, the docking block 71 is assembled with the docking clamp ring 73, and the stirring member 32 and the support plate 43 are driven to rotate synchronously.

[0039] In the switching state, the motor 31 can drive the stirring member 32 to rotate, and the motor 31 also drives the first bevel gear 61, and the first bevel gear 61 drives the second bevel gear 63 to rotate, and the second bevel gear 63 drives the support shaft 62 and the docking block 71 and the docking clamp ring 73 in the engaged state to rotate synchronously, and the docking clamp ring 73 drives the connecting cylinder 72 and the supporting plate 43 to rotate as a whole, so as to provide support for the station switching of the support arm 44 after opening, so as to facilitate the wafer 10 in the upward moving process to enter the next process after completing the corresponding processing; In the working state, when the motor 31 drives the stirring member 32 to stir, the first bevel gear 61 is meshed with the second bevel gear 63, and the support shaft 62 rotates, so that the stirring member 32 rotates independently; Finally, the support plate 43 is adjusted from the sealed closing mode to the open switching mode, and the motor 31 is synchronously driven to adjust from the stirring state to the switching state.

[0040] In another embodiment, please refer to Figure 2 and Figure 4 , the second bevel gear 63 is key mounted on the support shaft 62; The connecting mechanism 7 also includes an elastic contraction member 74 and a swivel 75. The elastic contraction member 74 is fixedly embedded in the connecting tube 72. The elastic contraction member 74 elastically connects the connecting tube 72 and the swivel 75. The bottom of the swivel 75 is rotatably connected to the top of the second bevel gear 63.

[0041] In this embodiment, a sliding key connection structure is adopted between the second bevel gear 63 and the support shaft 62, which can avoid contact and relative movement between the first bevel gear 61 and the second bevel gear 63 when the motor 31 is in a stirring state, thereby extending the service life of the gear connection.

[0042] Please refer to Figure 2 and Figure 8 (a) The elastic contraction member 74 elastically connects the rotating ring 75 and the connecting tube 72, so that when the connecting tube 72 drives the docking clamp ring 73 to move downward, the elastic contraction member 74 can also synchronously drive the second bevel gear 63 to move downward and separate from the first bevel gear 61, thereby providing support for the independent stirring of the stirring member 32.

[0043] Please refer to Figure 8 (a) and Fig. 9 (a), the motor 31 is in a stirring state, the second bevel gear 63 is separated from the first bevel gear 61, the docking block 71 is separated from the docking clamp ring 73, and the motor 31 is only used to drive the stirring member 32 to rotate and stir; Please refer to Figure 8 (c) and Fig. 9 (c) The motor 31 is in a switching state, the second bevel gear 63 is meshed with the first bevel gear 61 , the docking block 71 is engaged with the docking ring 73 , and the motor 31 can be used to drive the stirring member 32 to rotate and stir, and can also be used for synchronous switching of four groups of wafer 10 stations.

[0044] Finally, when the motor 31 is in the switching state, the motor 31 can synchronously drive the stirring member 32 and the supporting plate 43 to rotate and adjust, so as to realize synchronous switching of wafers 10 at different workstations; During the process of adjusting the motor 31 from the switching state to the working state (stirring), the support plate 43 controls the support arm 44 to move downward, and simultaneously realizes the automatic loading of the etching station 100, the cleaning station 200 and the drying station 300, and the automatic unloading of the loading station 400. After the unloading is completed, the support plate 43 is closed above the three processing barrels 2 to provide support for the synchronous etching, cleaning and drying of the three groups of wafers 10. While the etching process is being carried out, a group of wafers 10 received by the rack 82 can also be replaced.

[0045] In this embodiment, two elastic contraction members 74 are provided, and the two elastic contraction members 74 are arranged in parallel and symmetrically in the connecting tube 72. The provision of the two elastic contraction members 74 facilitates increasing the stability of the elastic connection between the rotating ring 75 and the connecting tube 72.

[0046] In other embodiments, the elastic contraction member 74 may be provided in plurality to further increase the stability of the elastic connection between the swivel 75 and the connecting tube 72 .

[0047] See also Figure 6 The etching equipment for producing semiconductor chips further includes a loading mechanism 8 , and the loading mechanism 8 is mounted on the base 1 .

[0048] The loading mechanism 8 is used to load and unload the arc-shaped carrier 5 at the loading station 400 .

[0049] In an optional implementation of this embodiment, the loading mechanism 8 may be a robotic arm, which is used to directly grab the arc-shaped carrier 5, on which a group of wafers 10 are mounted, so as to facilitate loading a group of wafers 10 that need to be etched from the loading station 400; and also facilitate unloading a group of wafers 10 that have been processed from the loading station 400.

[0050] In another optional implementation of this embodiment, please refer to Figure 6 and Figure 7 The feeding mechanism 8 includes a rotating device 81 and a hanging bracket 82. The rotating device 81 is installed on the base 1, and the hanging bracket 82 is fixed on the rotating part of the rotating device 81; The arc-shaped carrier 5 is provided with a first docking port 501, and the bottom of the arc-shaped carrier 5 is provided with a second docking port 502, and the hanger 82 is interference-engaged with the arc-shaped carrier 5 through the first docking port 501; The support arm 44 is in an L-shaped structure, and the bottom of the support arm 44 is interference-engaged with the arc-shaped carrier 5 through the second docking port 502; The hanger 82 corresponds to one of the support arms 44 in a vertically displaced manner.

[0051] The loading and unloading principle of the rack 82 is as follows: Unloading principle: the rack 82 is aligned with the loading station 400 and is not loaded with the arc-shaped carrier 5. After the arc-shaped carrier 5 of the drying station 300 is transferred to the loading station 400, the first docking port 501 on the arc-shaped carrier 5 corresponds to the rack 82 up and down; when the arc-shaped carrier 5 is driven to move downward, the arc-shaped carrier 5 drives a group of processed wafers 10 to move downward, and the arc-shaped carrier 5 automatically docks with the rack 82 during the downward movement; after docking, the support arm 44 can continue to move downward to realize the automatic separation of the support arm 44 and the arc-shaped carrier 5, so as to provide support for the rotation unloading and assembly of the arc-shaped carrier 5; Loading principle: after the support arm 44 of the drying station 300 completes unloading, a group of the arc-shaped carriers 5 are pre-installed on the rack 82, and a group of wafers 10 to be processed are installed on the arc-shaped carrier 5. The support arm 44 is located below the rack 82 to provide support for the support arm 44 to dock and engage with the arc-shaped carrier 5 on the rack 82 when moving upward.

[0052] When the motor 31 is adjusted from the working state to the switching state, the support arms 44 in the three processing barrels 2 drive the wafers 10 in the processing process to automatically move upward; the other support arm 44 moves upward along the range of the loading station 400, and during the upward movement, the support arm 44 automatically docks and engages at the second docking port 502 at the bottom of the arc-shaped carrier 5, and after docking, it also synchronously drives the arc-shaped carrier 5 to move upward as a whole, so that the arc-shaped carrier 5 is automatically separated from the rack 82, and is used for automatic loading of the arc-shaped carrier 5 on the loading station 400; Finally, when the motor 31 is adjusted from the working state to the switching state, the three groups of wafers 10 are synchronously taken out and one group of wafers 10 are automatically loaded; after loading is completed, when the motor 31 is adjusted from the switching state to the working state, the three groups of wafers 10 are synchronously inserted and one group of wafers 10 is automatically unloaded, and after unloading is completed, the processing barrel 2 is automatically closed.

[0053] Please refer to Figure 6 and Figure 7 , the bracket 82 is in a U-shaped structure; when the arc-shaped carrier 5 is installed on the bracket 82, the arc-shaped carrier 5 is interference-fitted with the bracket 82 through the first docking interface 501; the lifting range of the support arm 44 and the installation range of the bracket 82 are staggered up and down.

[0054] This facilitates quick installation or quick disassembly between the arc-shaped carrier 5 and the hanger 82 .

[0055] When it is necessary to install the arc-shaped carrier 5 carrying a group of unprocessed wafers 10 onto the hanger 82, the first docking port 501 on the arc-shaped carrier 5 can be directly inserted into the hanger 82 from top to bottom, so that the arc-shaped carrier 5 and the hanger 82 have an interference fit, which facilitates the quick installation or disassembly between the arc-shaped carrier 5 and the hanger 82.

[0056] Specifically, when a group of wafers 10 are processed and rotated to the range of the loading station 400, the telescopic member 41 is started, and the telescopic member 41 drives the fixed ring 42, the support plate 43 and the support arm 44 to move downward, while the support arm 44 drives the interference-fitted arc carrier 5 to move downward, and while the arc carrier 5 drives a group of wafers 10 to move downward, the first docking port 501 on the arc carrier 5 is automatically inserted into the hanger 82, so as to realize the automatic engagement between the arc carrier 5 and the hanger 82, and facilitate the automatic docking of the arc carrier 5 and the hanger 82 after processing.

[0057] After the arc-shaped carrier 5 is fully engaged with the hanger 82, the support arm 44 can continue to move downward, and the arc-shaped carrier 5 is blocked by the hanger 82 and cannot move downward. The support arm 44 automatically separates from the arc-shaped carrier 5 while moving downward, providing avoidance for the station switching of the hanger 82 and the processed arc-shaped carrier 5, and facilitating the readjustment of the unprocessed arc-shaped carrier 5 to the top of the support arm 44 through the rotating device 81, providing support for the loading of the next group of arc-shaped carriers 5.

[0058] When loading is required, the telescopic member 41 drives the fixed ring 42, the support plate 43 and the support arm 44 to move upward synchronously, and the support arm 44 is first inserted into the second docking port 502. When the support arm 44 completely abuts against the arc carrier 5, the support arm 44 pushes the arc carrier 5 to move upward and automatically separate from the hanger 82. After separation, the support arm 44 drives the arc carrier 5 and a group of unprocessed wafers 10 to move up to the height of the workstation switching, so as to facilitate the automatic loading of a group of unprocessed wafers 10.

[0059] In an optional implementation of the present embodiment, two hangers 82 are provided, and the two hangers 82 surround the rotating part provided on the rotating device 81 .

[0060] There is only one rack 82 on which a group of wafers 10 to be processed is mounted; and another rack 82 provides support for receiving a group of wafers 10 after processing.

[0061] In another optional implementation of the present embodiment, four racks 82 are provided, and the four racks 82 surround the rotating part of the rotating device 81. Only one group of wafers 10 is mounted on two adjacent racks 82, so that after one rack 82 receives a group of processed wafers 10, the other rack 82 can be used to feed an unprocessed group of wafers 10, so as to facilitate continuous etching processing and loading.

[0062] A sealing ring may be provided on the top of the processing barrel 2 to increase the stability of the processing barrel 2 and the supporting plate 43 when they are in contact and sealed, so as to prevent the etching process in the processing barrel 2 from being dried by the outside air.

[0063] In this embodiment, a sealed cabinet and a cover plate (not shown) are disposed on the periphery of the base 1 for sealed installation and use of equipment on the base 1. A sealed processing space is formed between the sealed cabinet, the cover plate and the base 1, which facilitates environmental protection and sealing when the wafer 10 is etched.

[0064] In this embodiment, the sealed cabinet is equipped with an exhaust purification device for absorbing and filtering the gas generated during the etching process of a group of wafers 10, avoiding the generation of gas exhaust, and providing an environmentally friendly and reliable production environment. The sealed cabinet and the cover plate provide a buffer space for the lifting range of the support plate 43.

[0065] A preferred working method of the etching equipment for semiconductor chip production provided by the present invention is as follows: The four support arms 44 on the support plate 43 are each equipped with the arc-shaped carrier 5 (a group of wafers 10 is mounted on the arc-shaped carrier 5); The arc-shaped carriers 5 are pre-assembled on the two spaced hangers 82, and the empty hangers 82 are aligned at the loading station 400, waiting for the unloading of the arc-shaped carrier 5 after processing; like Figure 8 (a) and Fig. 9 As shown in (a), it may be defined that in the initial state, the support plate 43 is in a sealed closed mode, and the stirring member 32 is in a stirring state, providing support for the synchronous etching process, cleaning process and drying process of the three groups of wafers 10; The rack 82 corresponding to the loading station 400 is equipped with the arc-shaped carrier 5 and a group of wafers 10 to be processed; Please refer to Figure 8 and Fig. 9 , when the wafers 10 corresponding to the etching station 100, the cleaning station 200 and the drying station 300 are all processed, and a group of wafers 10 need to be switched to another station; First, the telescopic member 41 is started, the telescopic member 41 drives the fixing ring 42 to move upward, the fixing ring 42 drives the supporting plate 43 to move upward, the supporting plate 43 drives the supporting arms 44 corresponding to the four workstations to move upward synchronously, and the supporting arms 44 drive the four groups of wafers 10 to move upward synchronously; On the one hand, it is used to take out the three arc-shaped carriers 5 and the wafers 10 from the processing barrels 2 corresponding to the three workstations; On the other hand, when the support plate 43 moves upward, the support plate 43 also drives the connecting tube 72 to move upward synchronously. During the upward movement of the connecting tube 72, the second bevel gear 63 is first driven upward by the elastic contraction member 74 and the rotating ring 75. After the second bevel gear 63 moves upward, it meshes and connects with the first bevel gear 61. After the second bevel gear 63 is fully meshed with the first bevel gear 61, the support plate 43 can continue to move upward, so that the support plate 43 is fully opened, and the motor 31 is adjusted from the working state to the switching state. The motor 31 is used to provide power for the synchronous rotation of the four support arms 44, and the positions of the four support arms 44 can be switched during rotation; When the station is switched, the motor 31 is started, and the motor 31 can synchronously drive the stirring member 32 and the supporting plate 43 to rotate, so as to be used for synchronous rotation adjustment of the four groups of wafers 10, thereby facilitating continuous processing of the wafers 10 and reducing the waiting time required for processing between two adjacent groups of wafers 10; Please refer to Fig.10 (a) to Fig.10 (d) When the support plate 43 moves upward, the support arm 44 corresponding to the loading station 400 moves upward. When the support arm 44 moves upward, it firstly engages with the arc-shaped carrier 5 through the second docking port 502 by interference fit; After being fully engaged, the arc-shaped carrier 5 is pushed upward, and the arc-shaped carrier 5 is automatically separated from the bracket 82 after being pushed upward, so that the arc-shaped carrier 5 corresponding to the loading station 400 is automatically docked and loaded in the process of adjusting the motor 31 from the stirring state to the switching state, so as to provide support for the synchronous switching of the arc-shaped carrier 5 corresponding to the four stations; like Figure 8 (c) and Fig. 9 As shown in (c), the motor 31 is in a switching state, and the stirring member 32 and the supporting plate 43 are synchronously driven to rotate, providing support for the station switching of the wafers 10 corresponding to the four stations; Finally, when the motor 31 is in a stirring state, the motor 31 can independently control the stirring element 32 to stir the etching solution, the support plate 43 is closed on the processing barrel 2, and the bracket 82 corresponding to the loading station 400 can rotate and switch freely; when the motor 31 is in a switching state, the motor 31 is used to control the rotation of the support plate 43, so as to synchronously realize the station switching of the wafers 10 corresponding to the four stations.

[0066] During the process of adjusting the motor 31 from the stirring state to the switching state, the support plate 43 is automatically opened, the arc-shaped carrier 5 is automatically pulled out from the processing barrel 2, and the arc-shaped carrier 5 corresponding to the loading station 400 is automatically loaded and automatically separated from the rack 82.

[0067] Similarly, the rack 82 corresponding to the loading station 400 is empty, and when a group of wafers 10 adjusted from the drying station 300 to the loading station 400 moves downward, it provides receiving support for a group of wafers 10 and the arc-shaped carrier 5 after processing; during the downward movement of the arc-shaped carrier 5, the arc-shaped carrier 5 is automatically engaged with the rack 82 through the first docking port 501, and after the arc-shaped carrier 5 is engaged with the rack 82, the support arm 44 continues to move downward to separate from the arc-shaped carrier 5, and provides avoidance for the rotation switching of the arc-shaped carrier 5 during the separation; The rack 82 is enabled to drive the arc carrier 5 and the group of wafers 10 to rotate and switch after processing, and switch the arc carrier 5 and the group of wafers 10 that need to be processed to the loading station 400 to provide support for the next loading of the support arm 44.

[0068] The invention also provides a semiconductor chip production system.

[0069] See also Fig.11 The semiconductor chip production system includes a wafer production unit, an oxidation treatment unit, a photolithography unit, a thin film deposition unit, an interconnection unit, a testing unit, a packaging unit and the etching equipment for semiconductor chip production; the wafer production unit, the oxidation treatment unit, the photolithography unit, the etching equipment for semiconductor chip production, the thin film deposition unit, the interconnection unit, the testing unit and the packaging unit are connected in sequence.

[0070] In this embodiment, the semiconductor chip production etching equipment can be referred to as Fig.11 The etching unit shown in .

[0071] In this embodiment, the wafer production unit is used to refine silica sand into high-purity electronic-grade silicon, and melt the silicon into liquid by the Czochralski method, and then solidify it into a single-crystal silicon rod; then the silicon rod is cut into thin slices, and after grinding and polishing, a smooth wafer 10 surface is formed; finally, the wafer 10 is cleaned to remove impurities and contaminants on the surface; The oxidation treatment unit is used to form a protective film on the surface of the wafer 10 by reacting oxygen or steam with silicon at high temperature to generate a silicon dioxide layer; The photolithography unit is used to coat photoresist on the surface of the wafer 10, and transfer the pattern on the mask to the photoresist by ultraviolet light irradiation to form a precise circuit pattern; The etching unit is used to remove the part of the material on the surface of the wafer 10 that is not covered by the photoresist by chemical or physical methods according to the pattern on the photoresist to form the required circuit structure; The thin film deposition unit is used to deposit thin film materials, such as metals, oxides and nitrides, on the wafer 10 to manufacture the conductive layer, insulating layer and protective layer of the circuit. The interconnection unit is used to connect different circuit elements through a metallization process to form a complete circuit network; The test unit is used to perform functional tests on the manufactured chips to ensure that their performance meets the design requirements; The packaging unit is used to package the tested qualified chips into final products that can be used in electronic devices, including connecting the chips to a substrate and connecting them to other components through wires or other connection methods. The semiconductor chip production system provided in this embodiment adopts the etching equipment for semiconductor chip production to perform etching treatment. The etching equipment for semiconductor chip production has all the technical features of the above-mentioned embodiments, and has all the technical features, technical effects and functions of the above-mentioned embodiments, which will not be repeated here one by one.

[0072] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An etching device for semiconductor chip production, characterized in that: include: Base; Three processing barrels, the three processing barrels are respectively fixed on the base; A stirring mechanism, the stirring mechanism comprising a motor and a stirring member, the motor being fixedly mounted on the base, the shaft end of the motor passing through one of the processing barrels and then being fixedly connected to the stirring member; A lifting mechanism, the lifting mechanism comprising a telescopic member, a fixing ring, a support plate and four support arms, the telescopic member connects the base and the fixing ring, the support plate is rotatably mounted in the fixing ring, the four support arms are fixedly arranged around the bottom of the support plate, and the bottom of the support arm is used to load the arc-shaped carrier; A switching mechanism, wherein the switching mechanism is mounted on the base; Wherein, the telescopic member is used to drive the fixing ring to rise and fall, and when the telescopic member drives the fixing ring and the supporting plate to rise to a switching state, the switching mechanism is used to drive the supporting plate to rotate; When the telescopic member drives the fixing ring and the supporting plate to descend to a working state, the three supporting arms are installed into the corresponding three processing barrels.

2. The etching equipment for semiconductor chip production according to claim 1, characterized in that: The switching mechanism comprises a first bevel gear, a support shaft and a second bevel gear, the first bevel gear is fixedly arranged at the shaft end of the motor, the support shaft is rotatably mounted on the base, and the second bevel gear is mounted on the support shaft; The etching equipment for semiconductor chip production also includes a connecting mechanism, which includes a docking block, a connecting tube and a docking ring, wherein the docking block is fixedly arranged on the top of the supporting shaft, the top of the connecting tube is fixedly connected to the supporting plate, and the docking ring is fixedly arranged on the bottom of the connecting tube; A cross slot is provided on the docking snap ring. When the support plate rises to a switching state, the docking block is assembled with the docking snap ring through the cross slot; and the first bevel gear is meshed with the second bevel gear.

3. The etching equipment for semiconductor chip production according to claim 2, characterized in that: The second bevel gear sliding key is installed on the support shaft; The connecting mechanism also includes an elastic contraction member and a rotating ring. The elastic contraction member is fixedly embedded in the connecting tube. The elastic contraction member elastically connects the connecting tube and the rotating ring. The bottom of the rotating ring is rotatably connected to the top of the second bevel gear.

4. The etching equipment for semiconductor chip production according to claim 3, characterized in that: The two elastic contraction members are provided, and the two elastic contraction members are distributed in parallel and symmetrically in the connecting tube.

5. The etching equipment for semiconductor chip production according to claim 3, characterized in that: The elastic shrinkage member is provided in plurality.

6. The etching equipment for semiconductor chip production according to claim 3, characterized in that: The etching equipment for producing semiconductor chips also includes a loading mechanism, and the loading mechanism is installed on the base.

7. The etching equipment for semiconductor chip production according to claim 6, characterized in that: The feeding mechanism comprises a rotating device and a hanging bracket, wherein the rotating device is mounted on the base, and the hanging bracket is fixedly mounted on the rotating part of the rotating device; The arc-shaped carrier is provided with a first pair of interfaces, and the bottom of the arc-shaped carrier is provided with a second pair of interfaces, and the hanger is interference-engaged with the arc-shaped carrier through the first pair of interfaces; The support arm is in an L-shaped structure, and the bottom of the support arm is interference-engaged with the arc-shaped carrier through the second docking interface; The hanging bracket corresponds to one of the supporting arms up and down and is staggeredly distributed.

8. The etching equipment for semiconductor chip production according to claim 7, characterized in that: The hanging bracket is in a U-shaped structure.

9. The etching equipment for semiconductor chip production according to claim 8, characterized in that: A sealing ring is arranged on the top of the processing barrel.

10. A semiconductor chip production system, characterized in that: It includes a wafer production unit, an oxidation treatment unit, a photolithography unit, a thin film deposition unit, an interconnection unit, a testing unit, a packaging unit and an etching device for semiconductor chip production according to any one of claims 1 to 9; the wafer production unit, the oxidation treatment unit, the photolithography unit, the etching device for semiconductor chip production, the thin film deposition unit, the interconnection unit, the testing unit and the packaging unit are connected in sequence.

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