Processing technology of crystal resonator
By adopting the technology of straightening unit and adjustment unit in the crystal resonator cutting equipment, the deformation problems caused by inconsistent pin lengths and unprotected are solved, and higher electrical connection reliability and lower cutting errors are achieved.
Patent Information
- Application Number
- CN202411501155.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-02-07
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When cutting the crystal resonator pins, the pin length is prone to inconsistent due to measurement errors, which affects the reliability of the electrical connection and fails to effectively protect the pins, which may lead to deformation or damage.
Using a cutting device including a straightening unit and a adjustment unit, the pins of the crystal resonator are synchronized from the back to the front through the straightening unit to ensure that the pins are straightened before cutting and through the compression plate and the lower plate Protect to reduce cutting errors and pin deformation.
Improves the consistency of the pin length of the crystal resonator after cutting, reduces the error in pin cutting processing, protects the pins, avoids deformation and damage caused by cutting, and ensures the reliability of electrical connections.
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Figure CN119401965A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of crystal resonator processing, in particular to a processing technology for a crystal resonator. Background Art
[0002] A crystal resonator is an electronic component that uses the piezoelectric effect of a quartz crystal to generate an extremely stable frequency signal. In high-power applications or applications that require particularly high stability and precision, crystal resonators with larger physical sizes are used. These resonators can be several centimeters or even larger. Larger crystal resonators have better frequency stability, higher load capacity, and stronger anti-interference capabilities. To meet the different installation requirements of crystal resonators, the pins of the crystal resonators must be cut into corresponding lengths during the crystal resonator processing process so that all pins have the same length when straightened, which is convenient for subsequent installation and welding, thereby ensuring the reliability of the electrical connection of the crystal resonator.
[0003] Existing cutting of crystal resonator pins usually requires workers to measure the length of the pins, then mark the cutting position on the crystal resonator pins, and then use cutting equipment (such as pliers and pin shears, etc.) to cut the crystal resonator pins.
[0004] The above-mentioned cutting of the crystal resonator pins has the following deficiencies: during the cutting process of the crystal resonator pins by the staff, the pins of the crystal resonator are easily in a bent state during measurement, resulting in poor consistency in the lengths of the two pins of the crystal resonator after cutting, and it is easy for the pins of the crystal resonator to be unable to be stably soldered to the circuit board, thereby affecting the reliability of the electrical connection; secondly, the pins of the crystal resonator are not protected during the above-mentioned cutting process, and the crystal resonator pins are easily deformed or damaged due to cutting, which will affect the correct installation and electrical connection of the crystal resonator. Summary of the invention
[0005] Based on this, it is necessary to provide a processing technology for a crystal resonator to solve the above technical problems.
[0006] The present application provides a processing technology for a crystal resonator, which specifically includes the following steps:
[0007] S1. Prepare materials: Select high-purity natural quartz as raw material and prepare quartz crystal rods by hydrothermal method.
[0008] S2. Wafer processing: According to the required frequency characteristics and temperature coefficient requirements, select an appropriate cutting angle to perform directional cutting on the quartz crystal rod obtained in step S1 to obtain a wafer, and then perform rough grinding, fine grinding, polishing and cleaning steps on the wafer to obtain the required wafer.
[0009] S3, electrode deposition: a thin layer of metal electrode is deposited on both sides of the wafer obtained in step S2 by electroplating.
[0010] S4. Packaging and welding: Fix the chip after electrode deposition on a base and weld the pins. Use airtight packaging technology to package the chip in a protective shell to obtain a preliminarily completed resonator. Then, cut the pins of the resonator according to the required pin length to obtain the final product.
[0011] S5, inspection and testing: check whether the resonator package obtained in step S4 is damaged, and confirm whether its various performance indicators meet the specification standards, and finally perform anti-static packaging on the resonator that passes the inspection and test.
[0012] The preparation process of the crystal resonator using the above steps S1-S5 also specifically involves a pin cutting device for the crystal resonator during the processing of the crystal resonator, including: a placement plate, a lifting plate is arranged on the placement plate, a hydraulic cylinder is arranged between the lifting plate and the placement plate, and the placement plate and the lifting plate are jointly provided with a plurality of cutting mechanisms equidistantly distributed from left to right, the cutting mechanism including a sliding block, two sliding blocks symmetrically distributed on the left and right are slidably arranged on the placement plate, a lifting rod is slidably penetrated on the sliding block, the upper end surface of the lifting rod is fixedly connected to the lifting plate, a placement groove is opened on the placement plate, a cutting tool is fixedly arranged on the lower end surface of the lifting plate, and the cutting mechanism also includes a straightening unit and an adjustment unit.
[0013] The placement plate is provided with a straightening unit, and the straightening unit includes a support plate, the upper end surface of the placement plate is provided with a support plate for sliding back and forth through a moving bar, the upper end surface of the support plate is fixedly provided with a fixed block, the lower end surface of the moving bar is fixedly provided with a sliding plate, and the sliding plate is provided with a pressing plate for sliding respectively through two vertical bars symmetrically distributed on the left and right, the lower end surface of the support plate is provided with a pressing group, the opposite back surfaces of the two pressing plates are both provided with lower pressing strips for sliding, the lower end surface of the sliding plate is provided with a lower pressing group, the lifting plate and the placement plate are jointly provided with a linkage group, and a limiting position group is provided in the placement groove.
[0014] The adjusting unit is arranged on the placement plate, and the adjusting unit comprises an adjusting group. The sliding block is provided with an adjusting group for adjusting the cutting position, and a positioning group is arranged between the lifting plate and the placement plate.
[0015] According to a favorable embodiment, the adjustment group includes a limit groove, and a plurality of limit grooves equidistantly distributed from front to back are arranged on the inner wall of the slide groove. A spring telescopic rod is arranged on the sliding block, and the telescopic end of the spring telescopic rod is an arc-shaped surface. A positioning strip is fixedly arranged between the two sliding blocks in the same cutting mechanism.
[0016] According to a favorable embodiment, the positioning group includes a positioning rod, and two positioning rods symmetrically distributed on the lower end surface of the lifting plate are fixedly provided, and two groups of multiple guide cylinders symmetrically distributed on the upper end surface of the placement plate are fixedly provided. The guide cylinders are divided into inverted conical sections and cylindrical sections from top to bottom, and the placement plate is penetrated by multiple through holes corresponding to the positions of the guide cylinders, and the through holes are connected to the cylindrical sections of the guide cylinders.
[0017] According to a favorable embodiment, the limiting group includes a clamping plate, the lower inner wall of the placement groove is slidably provided with a clamping plate through a connecting block, and the connecting block slides through the placement plate, the clamping plate is composed of two inclined sections close to each other from front to back and a U-shaped section with an opening facing the front side, a connecting strip is fixedly provided on the lower end face of the connecting block, a gear one is rotatably provided on the lower end face of the placement plate through a rotating shaft, and the gear one is located between the connecting strip and the sliding plate, and a rack one meshing with the gear one is fixedly provided on the front end face of the connecting strip.
[0018] According to a favorable embodiment, the clamping group includes a sliding groove, and two sliding grooves symmetrically distributed left and right are opened on the connecting bar front and back, and a Z-shaped bar is arranged in the sliding groove, and the Z-shaped bar is fixedly connected to the corresponding vertical bar on the sliding plate, and two racks 2 meshing with gear 1 are slidably arranged on the lower end surface of the placement plate, and the two racks 2 are respectively slidably connected to the corresponding Z-shaped bars, and the rack 1 and the two racks 2 are staggered with each other, and the opposite back surfaces of the two racks 2 are fixedly provided with horizontal rods through rectangular plates, and the horizontal rods slide through the Z-shaped bar, and a spring 1 mounted on the corresponding horizontal rod is fixedly arranged between the Z-shaped bar and the rectangular plate.
[0019] According to an advantageous embodiment, the lower pressing bar is an L-shaped structure, and two lower pressing plates symmetrically distributed front and back are fixedly arranged on the horizontal section of the lower pressing bar.
[0020] According to a favorable embodiment, the lower pressure group includes a fixing bar, and the lower end surface of the sliding plate is fixedly provided with two fixing bars which are symmetrically distributed on the left and right, and the two fixing bars are close to each other from top to bottom, and a transmission groove having the same extension direction as the fixing bar is opened, and a transmission column having an axis extending from front to rear is fixedly provided on the lower pressure bar, and the transmission column is located in the transmission groove.
[0021] According to a favorable embodiment, the linkage group includes rack three, and the lower end surface of the lifting plate is fixedly provided with two rack three symmetrically distributed on the left and right. The opposite back surfaces of the two sliding blocks in the same cutting mechanism are fixedly provided with vertical plates, and the opposite back surfaces of the two vertical plates are rotatably provided with gear two through the transmission shaft, and gear two is meshed with rack three.
[0022] According to a favorable embodiment, two L-shaped plates symmetrically distributed on the left and right are fixedly provided on the front end face of the sliding plate, and the horizontal section of the L-shaped plate extending from left to right slides through a sliding rod with an axis extending from front to rear, and a circular plate is fixedly provided on the rear end face of the L-shaped plate, and a spring 2 mounted on the sliding rod is fixedly provided between the circular plate and the L-shaped plate, and a rack 4 is fixedly provided on the front end face of the sliding rod through a connecting plate, and the rack 4 is meshed with gear 2.
[0023] According to a favorable embodiment, the fixed block and the corresponding sliding plate slide together and are penetrated by a downward pressure rod, a pushing plate is fixedly provided on the upper end surface of the downward pressure rod, a spring three mounted on the downward pressure rod is fixedly provided between the pushing plate and the fixed block, and a plurality of equidistantly distributed positioning holes are penetrated on the placement plate.
[0024] In summary, the present invention includes at least one of the following beneficial effects: First, the straightening unit in the cutting mechanism of the present invention straightens the two pins of the crystal resonator synchronously from back to front, thereby preventing the pins of the crystal resonator from being in a bent state when the cutting tool cuts the pins, thereby improving the consistency of the pin length on the crystal resonator after cutting, and cutting is performed after the pins of the crystal resonator are straightened, thereby reducing the error of the pin cutting process. At the same time, the two pins of the crystal resonator are pressed and protected by the straightening unit, thereby reducing the deformation of the pins during the cutting process and reducing the impact on the correct installation and electrical connection of the crystal resonator. Secondly, the cutting length of the pin is adjusted by the adjustment mechanism before cutting, thereby simplifying the operating steps of cutting the crystal resonator pins and improving the work efficiency of the cutting operation.
[0025] 2. In the present invention, the pressing plate and the lower pressing plate are used to press in the left and right and up and down directions, and then the pins of the crystal resonator are straightened from back to front, so that the pins of the crystal resonator are in a straightened state for cutting, thereby improving the consistency of the pin length on the crystal resonator after cutting, and at the same time protecting the pins of the crystal resonator, avoiding the problem of poor contact between the pins of the crystal resonator and the circuit board after welding.
[0026] 3. In the present invention, the staff only needs to adjust the cutting position of the cutting tool and the position of the crystal resonator pin, and then limit the position of the cutting tool during the operation of the cutting mechanism, so that the cutting tool is in the specified position to cut the pin of the crystal resonator, and then the straightening unit limits the crystal resonator and straightens the pin of the crystal resonator, which simplifies the manual operation steps, and multiple cutting mechanisms simultaneously cut the pins of multiple crystal resonators, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.
[0028] Figure 1 A flow chart of a processing technology for a crystal resonator provided according to an embodiment of the present invention is shown.
[0029] Figure 2 A schematic diagram of the three-dimensional structure of a crystal resonator pin cutting device provided according to an embodiment of the present invention is shown.
[0030] Figure 3 A schematic diagram of the three-dimensional structure of a straightening unit, an adjustment unit and a placement plate provided according to an embodiment of the present invention is shown.
[0031] Figure 4 A cross-sectional view of some parts of the three-dimensional structure of a positioning group, an adjustment group and a linkage group provided according to an embodiment of the present invention is shown.
[0032] Figure 5 A top view of a placement slot, a placement plate, and a pressing group provided according to an embodiment of the present invention is shown.
[0033] Figure 6 A schematic diagram of the three-dimensional structure of a cutting tool, a sliding block and a placement plate provided according to an embodiment of the present invention is shown.
[0034] Figure 7 The embodiment provided according to the present invention shows Figure 6 A magnified view of the structure in the middle.
[0035] Figure 8 A schematic structural diagram of a limit group and a pressing group structure provided according to an embodiment of the present invention is shown.
[0036] Fig. 9 A front view of a cutting mechanism, a placing plate and a lifting plate provided according to an embodiment of the present invention is shown.
[0037] Fig.10 A partial cross-sectional view of the three-dimensional structure of a placement plate, a spring telescopic rod and a sliding block provided according to an embodiment of the present invention is shown.
[0038] Fig.11 A partial cross-sectional view of the three-dimensional structure of a connecting bar, a moving bar and a connecting block provided according to an embodiment of the present invention is shown.
[0039] The above drawings include the following reference numerals:
[0040] 1. Placement plate; 10. Placement slot; 2. Lifting plate; 20. Hydraulic cylinder; 21. Cutting tool; 3. Cutting mechanism; 30. Slide slot; 31. Sliding block; 310. Lifting rod; 4. Straightening unit; 40. Support plate; 41. Fixed block; 42. Sliding plate; 43. Pressing group; 430. Pressing plate; 431. Sliding slot; 432. Z-shaped bar; 433. Rack 2; 434. Horizontal bar; 435. Spring 1; 44. Pressing group; 440. Pressing bar; 441. Pressing plate; 442. Fixed bar; 443. Transmission slot; 444. Transmission column; 45. Limiting group; 450. Clamping plate; 45 1. Connecting strip; 452. Gear 1; 453. Rack 1; 46. Linkage group; 460. Rack 3; 461. Vertical plate; 462. Gear 2; 463. L-shaped plate; 464. Sliding rod; 465. Spring 2; 466. Rack 4; 5. Adjusting unit; 50. Adjusting group; 500. Limiting groove; 501. Spring telescopic rod; 502. Positioning strip; 51. Positioning group; 510. Positioning rod; 511. Guide cylinder; 52. Pressing rod; 520. Pushing plate; 521. Spring 3; 522. Positioning hole; 53. Moving strip; 530. Vertical strip; 531. Rectangular plate; 532. Connecting block. DETAILED DESCRIPTION
[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0042] like Figure 1 As shown, a processing technology of a crystal resonator is as follows:
[0043] S1. Prepare materials: First, high-purity natural quartz is selected as the raw material. In order to obtain a purer and more uniform quartz crystal rod, the quartz is dissolved and recrystallized in an autoclave under high temperature and high pressure conditions by hydrothermal method, thereby preparing a quartz crystal rod with higher purity and consistency.
[0044] S2, wafer processing: According to the required frequency characteristics and temperature coefficient requirements, select the appropriate cutting angle (such as AT cutting, SC cutting, etc.), and perform directional cutting on the quartz crystal rod obtained in step S1 to obtain a wafer. Next, a series of surface treatments are performed on the cut wafer, including rough grinding, fine grinding, polishing and cleaning, etc., to improve the surface flatness, and finally obtain a wafer that meets the requirements.
[0045] S3, electrode deposition: A thin layer of metal electrode is deposited on both sides of the wafer processed in step S2 by electroplating. Commonly used metal materials include gold, silver or aluminum. The function of the electrode is to provide a current input and output path, and it is also a key part of subsequent frequency tuning.
[0046] S4, packaging and welding: fix the chip after electrode deposition on a base and weld the pins. In this process, it is necessary to ensure the firm bond between the chip and the base and the good conductivity of the pins. Then, the chip is packaged in a protective shell using airtight packaging technology to prevent the external environment from affecting the chip. After the packaging is completed, the pins of the resonator need to be cut according to the required pin length to adapt to different application requirements, so as to obtain the final product.
[0047] S5. Inspection and testing: Carry out a comprehensive inspection on the packaged resonator to ensure that there is no damage caused by the packaging process and that all performance indicators (such as frequency stability, temperature characteristics, load capacitance, etc.) meet the specifications. Only resonators that have passed strict inspection and testing can proceed to the next step. Finally, the resonators that have passed the inspection and test are packaged in anti-static packaging to prevent static electricity from damaging the device during transportation and storage.
[0048] like Figure 2 , Figure 3 and Figure 4 As shown, the preparation process of the crystal resonator using the above steps S1-S5 also specifically involves a crystal resonator pin cutting device in the process of processing the crystal resonator, including: a placement plate 1, a lifting plate 2 is arranged on the placement plate 1, a hydraulic cylinder 20 is arranged between the lifting plate 2 and the placement plate 1, and a plurality of cutting mechanisms 3 equidistantly distributed from left to right are arranged on the placement plate 1 and the lifting plate 2, the cutting mechanism 3 includes a slide groove 30, two slide grooves 30 symmetrically distributed on the left and right are arranged through the placement plate 1, a sliding block 31 is slidably arranged in the slide groove 30, a lifting rod 310 is slidably penetrated on the sliding block 31, the upper end surface of the lifting rod 310 is fixedly connected to the lifting plate 2, a placement groove 10 located on the rear side of the lifting plate 2 is opened on the placement plate 1, a cutting tool 21 is fixedly arranged on the lower end surface of the lifting plate 2, and the cutting mechanism 3 also includes a straightening unit 4 and an adjustment unit 5.
[0049] like Figure 2 , Figure 3 and Fig. 9 As shown, the adjusting unit 5 is arranged on the placing plate 1 , and the adjusting unit 5 includes an adjusting group 50 . The sliding block 31 is provided with an adjusting group 50 for adjusting the cutting position, and a positioning group 51 is provided between the lifting plate 2 and the placing plate 1 .
[0050] like Figure 4 and Fig.10As shown, the adjustment group 50 includes a limit groove 500, and a plurality of limit grooves 500 are arranged on the inner wall of the slide groove 30 and are evenly spaced from front to back. A spring telescopic rod 501 is arranged on the sliding block 31, and the telescopic end of the spring telescopic rod 501 is an arc-shaped surface. A positioning bar 502 is fixedly arranged between the two sliding blocks 31 in the same cutting mechanism 3.
[0051] like Figure 4 , Figure 5 and Fig. 9 As shown, the positioning group 51 includes a positioning rod 510, and two positioning rods 510 symmetrically distributed on the left and right are fixedly provided on the lower end surface of the lifting plate 2, and two groups of multiple guide cylinders 511 symmetrically and linearly arranged on the upper end surface of the placement plate 1 are fixedly provided, and the guide cylinders 511 are divided into inverted conical sections and cylindrical sections from top to bottom, and the placement plate 1 is penetrated by multiple through holes corresponding to the positions of the guide cylinders 511, and the through holes are connected to the cylindrical sections of the guide cylinders 511.
[0052] 500, and the lifting plate 2 is moved forward and backward, so that the lifting plate 2 can move backward and the lifting plate 2 can move backward and backward, so that the lifting plate 2 can move backward and backward, and the lifting plate 2 can move backward and backward, so that the lifting plate 2 can move backward and backward, and the lifting plate 2 can move backward and backward, so that the lifting plate 2 can move backward and backward, and the lifting plate 2 can move backward and backward, so that the lifting plate 2 can move backward and backward, and the lifting plate 2 can move the positioning rod 510 synchronously, and the positioning rod 510 can move downward and pass through the corresponding through hole through the guidance of the inverted cone section of the guide tube 511 at the corresponding position, and the positioning rod 510 can move downward and pass through the corresponding through hole through the cooperation between the positioning rod 510 and the through hole, so as to avoid the problem of increased cutting error caused by the front and rear movement of the lifting plate 2.
[0053] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Fig.11As shown, a straightening unit 4 is provided on the placement plate 1, and the straightening unit 4 includes a support plate 40. The upper end surface of the placement plate 1 is provided with a support plate 40 for sliding back and forth through a moving bar 53. A fixed block 41 is fixedly provided on the upper end surface of the support plate 40, and a sliding plate 42 is fixedly provided on the lower end surface of the moving bar 53. A clamping plate 430 is slidably provided on the sliding plate 42 through two vertical bars 530 symmetrically distributed on the left and right, respectively. A clamping group 43 is provided on the lower end surface of the support plate 40, and lower pressure strips 440 are slidably provided on the opposite back surfaces of the two pressure plates 430. A lower pressure group 44 for driving the lower pressure strip 440 to move up and down is provided on the lower end surface of the sliding plate 42. A linkage group 46 for driving the sliding plate 42 to move back and forth is commonly provided on the lifting plate 2 and the placement plate 1, and a limited position group 45 is provided in the placement groove 10.
[0054] like Figure 3 , Figure 5 , Figure 6 and Figure 8 As shown, the limiting group 45 includes a clamping plate 450, and the lower inner wall of the placement groove 10 is slidably provided with the clamping plate 450 through a connecting block 532, and the connecting block 532 slides through the placement plate 1, and the clamping plate 450 is composed of two inclined sections close to each other from front to back and a U-shaped section with an opening facing the front side, and a connecting strip 451 is fixedly provided on the lower end surface of the connecting block 532, and a gear 452 is rotatably provided on the lower end surface of the placement plate 1 through a rotating shaft, and the rotating shaft is connected to an external motor (not shown in the figure), and the gear 452 is located between the connecting strip 451 and the sliding plate 42, and a rack 453 meshing with the gear 452 is fixedly provided on the front end surface of the connecting strip 451.
[0055] like Figure 6 , Figure 8 and Fig.11 As shown, the clamping group 43 includes a sliding groove 431, and two sliding grooves 431 symmetrically distributed left and right are opened on the front and back of the connecting strip 451. A Z-shaped strip 432 is arranged in the sliding groove 431, and the Z-shaped strip 432 is fixedly connected to the corresponding vertical strip 530 on the sliding plate 42. Two rack gears 433 meshing with the gear 1 452 are slidably arranged on the lower end surface of the placement plate 1, and the rack gear 1 453 and the two rack gears 2 433 are staggered with each other, and the opposite back surfaces of the two rack gears 2 433 are fixedly provided with a horizontal rod 434 through a rectangular plate 531, and a connecting block 532 is slidably arranged on the Z-shaped strip 432, and the horizontal rod 434 slides through the connecting block 532, and a spring 1 435 sleeved on the corresponding horizontal rod 434 is fixedly arranged between the Z-shaped strip 432 and the rectangular plate 531.
[0056] During operation, after completing the adjustment of the position of the cutting tool 21, the staff places the crystal resonator in the placement slot 10, and makes the two pins of the crystal resonator respectively located between the fixed block 41 and the two clamping plates 430, and then the external motor works and drives the gear 452 to rotate through the rotating shaft, and the gear 452 is meshed with the rack 453 so that the rack 453 drives the connecting bar 451 to move forward, and the connecting bar 451 drives the clamping plate 450 to move forward synchronously through the connecting block 532, and after the clamping plate 450 moves to contact with the crystal resonator, the clamping plate 450 pushes the crystal resonator to move forward, and after the crystal resonator moves to contact the front inner wall of the placement slot 10, the clamping plate 450 continues to move forward, and through the cooperation between the inclined section of the clamping plate 450 and the crystal resonator, the position of the crystal resonator in the left and right directions is adjusted so that the crystal The body resonator is facing the fixed block 41, and then the clamping plate 450 continues to move until the horizontal section extending from left to right in the U-shaped section of the clamping plate 450 contacts the crystal resonator, and then the clamping plate 450 stops moving. While the connecting bar 451 moves forward, the two racks 433 are brought close to each other through the engagement between the gear 1 452 and the two racks 433, and the racks 433 drive the corresponding Z-shaped bar 432 to move synchronously, and the Z-shaped bar 432 drives the corresponding clamping plate 430 to move synchronously through the vertical bar 530 until the clamping plate 430 presses the pins of the crystal resonator tightly against the fixed block 41, and then the rack 2 433 continues to move while the Z-shaped bar 432 stops moving, and the spring 1 435 is compressed and deformed, and the elastic force generated by the deformation of the spring 1 435 acts on the pins through the clamping plate 430 until the clamping plate 450 is close to the crystal resonator, and the external motor stops working.
[0057] like Figure 4 , Figure 5 , Figure 6 , Figure 7 and Fig. 9 As shown, the lower pressure bar 440 is an L-shaped structure, and two lower pressure plates 441 symmetrically distributed front to back are fixedly provided on the horizontal section of the lower pressure bar 440, and the lower pressure group 44 includes a fixing bar 442, and two fixing bars 442 symmetrically distributed left to right are fixedly provided on the lower end surface of the sliding plate 42, and the two fixing bars 442 are close to each other from top to bottom, and a transmission groove 443 having the same extension direction as the fixing bar 442 is opened, and a transmission column 444 with an axis extending from front to back is fixedly provided on the lower pressure bar 440, and the transmission column 444 is located in the transmission groove 443.
[0058] During operation, as the two clamping plates 430 approach each other, the clamping plates 430 drive the L lower pressure strip 440 to move synchronously. In the process of the two lower pressure strips 440 approaching each other, the cooperation between the transmission column 444 and the transmission groove 443 makes the lower pressure strips 440 move downward at the same time in the process of approaching each other. The lower pressure strips 440 drive the corresponding lower pressure plates 441 to move downward synchronously. When the clamping plates 430 press the pins tightly against the fixed block 41, the lower pressure plates 441 press the pins downward against the support plate 40.
[0059] like Figure 4 , Figure 6 and Figure 8 As shown, the linkage group 46 includes a rack three 460, and two rack three 460 symmetrically distributed on the left and right are fixedly provided on the lower end surface of the lifting plate 2. The opposite back surfaces of the two sliding blocks 31 in the same cutting mechanism 3 are fixedly provided with vertical plates 461, and the opposite back surfaces of the two vertical plates 461 are provided with gear two 462 through the rotation of the transmission shaft, and the gear two 462 is meshed with the rack three 460. The front end surface of the sliding plate 42 is fixedly provided with two L-shaped plates 463 symmetrically distributed on the left and right, and the horizontal section of the L-shaped plate 463 extending from left to right slides through a sliding rod 464 extending from front to back with an axis, and the rear end surface of the L-shaped plate 463 is fixedly provided with a circular plate, and a spring two 465 mounted on the sliding rod 464 is fixedly provided between the circular plate and the L-shaped plate 463, and the front end surface of the sliding rod 464 is fixedly provided with a rack four 466 through a connecting plate, and the rack four 466 is meshed with the gear two 462.
[0060] During operation, after the clamping plate 430 presses the pin of the crystal resonator against the fixing block 41, the lifting plate 2 moves downward, and the lifting plate 2 drives the rack three 460 to move downward synchronously, and the gear two 462 rotates through the meshing between the rack three 460 and the gear two 462, and the gear two 462 and the rack four 466 move forward through the meshing between the gear two 462 and the rack four 466, and the rack four 466 drives the sliding rod 464 to move synchronously through the connecting plate, and the sliding rod 464 drives the L-shaped plate 463 to move synchronously through the spring two 465, and the two The L-shaped plate 463 drives the sliding plate 42 to move forward synchronously, and the sliding plate 42 drives the fixed block 41 to move forward synchronously through the moving bar 53. At this time, the pins are pressed tightly against the fixed block 41 and the support plate 40 at the same time. The sliding plate 42 moves forward so that the pins of the crystal resonator are straightened from back to front until the sliding plate 42 moves to contact the positioning bar 502, and the rack four 466 continues to move forward, while the L-shaped plate 463 stops moving, and the spring two 465 is stretched and deformed, and the movement of the L-shaped plate 463 is compensated by the deformation of the spring two 465.
[0061] like Figure 4As shown, a lower pressure rod 52 is slidably penetrated on the fixed block 41 and the corresponding sliding plate 42, a push plate 520 is fixedly provided on the upper end surface of the lower pressure rod 52, a spring 521 sleeved on the lower pressure rod 52 is fixedly provided between the push plate 520 and the fixed block 41, and a plurality of equidistantly distributed positioning holes 522 are penetrated on the placement plate 1.
[0062] In the initial state, the pressing rod 52 and the positioning hole 522 are staggered with each other. During operation, the pins of the crystal resonator are straightened and then the lifting plate 2 continues to move downward. After the lifting plate 2 moves to contact with the pushing plate 520, the lifting plate 2 pushes the pushing plate 520 to move downward synchronously. The spring three 521 is compressed and deformed, and the pushing plate 520 drives the pressing rod 52 to move downward synchronously. After the pressing rod 52 moves downward into the positioning hole 522, the position of the support plate 40 is fixed by the cooperation between the pressing rod 52 and the positioning hole 522, so as to avoid the cutting of the pins by the cutting tool 21 during the cutting process, causing the support plate 40 to move backward, thereby causing the cutting surface to be uneven and the error to increase.
[0063] During the specific work, the staff adjusts the front and rear positions of the cutting tool 21 through the adjustment group 50, and then the staff places multiple crystal resonators in each placement slot 10 respectively, and makes the two pins of each crystal resonator be respectively located between the corresponding fixed block 41 and the two clamping plates 430, and then the limiting group 45 works to limit the crystal resonator. In the process of the limiting group 45 limiting the crystal resonator, the clamping group 43 and the pressing group 44 work at the same time, and the pins of the crystal resonator are pressed tightly against the fixed block 41 and the support plate 40 at the same time, and then the hydraulic cylinder 20 works to drive the lifting plate 2 to move downward, and the positioning group 51 works to fix the position of the support plate 40. The pins of the crystal resonator are straightened from front to back through the cooperation between the clamping plate 430 and the fixed block 41 and between the lower pressure plate 441 and the support plate 40. After the sliding plate 42 moves to be close to the positioning bar 502, the lower pressure rod 52 is pushed to the positioning hole 522 to fix the position of the support plate 40. Then the lifting plate 2 drives the multiple cutting tools 21 to continue to move downward to cut the pins of all the crystal resonators at the same time. After the cutting is completed, the limit and clamping of the crystal resonator and its pins are released. Then the lifting plate 2 moves upward and the linkage group 46 drives the sliding plate 42 to move backward and reset.
[0064] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.
[0065] In addition, the terms "first", "second", "number one", "number two" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "number one", "number two" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0066] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0067] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. A process for processing a crystal resonator, characterized in that: A processing technology for a crystal resonator specifically comprises the following steps: S1. Prepare materials: select high-purity natural quartz as raw material and prepare quartz crystal rods by hydrothermal method; S2. Wafer processing: According to the required frequency characteristics and temperature coefficient requirements, select an appropriate cutting angle to perform directional cutting on the quartz crystal rod obtained in step S1 to obtain a wafer, and then perform rough grinding, fine grinding, polishing and cleaning steps on the wafer to obtain the required wafer; S3, electrode deposition: a thin layer of metal electrode is deposited on both sides of the wafer obtained in step S2 by electroplating; S4, packaging and welding: fix the electrode-deposited wafer on a base, weld the pins, and use airtight packaging technology to package the wafer in a protective shell to obtain a preliminarily completed resonator. Then, cut the pins of the resonator according to the required pin length to obtain the final product; S5, inspection and testing: Check whether the resonator package obtained in step S4 is damaged, and confirm whether its various performance indicators meet the specification standards, and finally perform anti-static packaging on the resonator that passes the inspection and test; The preparation process of the crystal resonator using the above steps S1-S5 also specifically involves a crystal resonator pin cutting device in the process of processing the crystal resonator, comprising: a placement plate (1), a lifting plate (2) is arranged on the placement plate (1), a hydraulic cylinder (20) is arranged between the lifting plate (2) and the placement plate (1), a plurality of cutting mechanisms (3) are arranged on the placement plate (1) and the lifting plate (2) and are equidistantly distributed from left to right, the cutting mechanism (3) comprising a sliding block (31), two sliding blocks (31) symmetrically distributed on the left and right are slidably arranged on the placement plate (1), a lifting rod (310) is slidably penetrated on the sliding block (31), the upper end surface of the lifting rod (310) is fixedly connected to the lifting plate (2), a placement groove (10) is opened on the placement plate (1), a cutting tool (21) is fixedly arranged on the lower end surface of the lifting plate (2), and the cutting mechanism (3) also includes a straightening unit (4) and an adjustment unit (5); The placement plate (1) is provided with a straightening unit (4), and the straightening unit (4) comprises a support plate (40), the upper end surface of the placement plate (1) is provided with a support plate (40) for sliding back and forth via a moving bar (53), the upper end surface of the support plate (40) is fixedly provided with a fixed block (41), the lower end surface of the moving bar (53) is fixedly provided with a sliding plate (42), and the sliding plate (42) is provided with a pressing plate (430) for sliding respectively via two vertical bars (530) symmetrically distributed on the left and right, the lower end surface of the support plate (40) is provided with a pressing group (43), the opposite back surfaces of the two pressing plates (430) are both slidably provided with a lower pressing bar (440), and the lower end surface of the sliding plate (42) is provided with a lower pressing group (44), the lifting plate (2) and the placement plate (1) are jointly provided with a linkage group (46), and a limit position group (45) is provided in the placement groove (10); The adjustment unit (5) is arranged on the placement plate (1), and the adjustment unit (5) comprises an adjustment group (50). The adjustment group (50) is arranged between the sliding block (31) and the sliding groove (30), and the positioning group (51) is arranged between the lifting plate (2) and the placement plate (1).
2. The processing technology of a crystal resonator according to claim 1, characterized in that: The adjustment group (50) comprises a limit groove (500), a plurality of limit grooves (500) are arranged on the inner wall of the slide groove (30) and are equidistantly distributed from front to back, a spring telescopic rod (501) is arranged on the sliding block (31), and the telescopic end of the spring telescopic rod (501) is an arc-shaped surface, and a positioning strip (502) is fixedly arranged between two sliding blocks (31) in the same cutting mechanism (3).
3. The processing technology of a crystal resonator according to claim 1, characterized in that: The positioning group (51) comprises a positioning rod (510), the lower end surface of the lifting plate (2) is fixedly provided with two positioning rods (510) which are symmetrically distributed on the left and right, the upper end surface of the placement plate (1) is fixedly provided with a plurality of guide cylinders (511) which are located on both sides of the sliding plate (42) and are equidistantly distributed, the guide cylinders (511) are divided into inverted conical sections and cylindrical sections from top to bottom, and the placement plate (1) is penetrated by a plurality of through holes which correspond to the positions of the guide cylinders (511) one by one, and the through holes are connected to the cylindrical sections of the guide cylinders (511).
4. The processing technology of a crystal resonator according to claim 1, characterized in that: The limiting group (45) comprises a clamping plate (450), the lower inner wall of the placement groove (10) is slidably provided with the clamping plate (450) through a connecting block (532), and the connecting block (532) slides through the placement plate (1), the clamping plate (450) is composed of two inclined sections close to each other from front to back and a U-shaped section with an opening facing the front side, a connecting strip (451) is fixedly provided on the lower end surface of the connecting block (532), a gear one (452) is rotatably provided on the lower end surface of the placement plate (1) through a rotating shaft, and the gear one (452) is located between the connecting strip (451) and the sliding plate (42), and a rack one (453) meshing with the gear one (452) is fixedly provided on the front end surface of the connecting strip (451).
5. The processing technology of a crystal resonator according to claim 4, characterized in that: The pressing group (43) includes a sliding groove (431), and the connecting strip (451) is provided with two sliding grooves (431) symmetrically distributed on the left and right sides, and a Z-shaped strip (432) is arranged in the sliding groove (431), and the Z-shaped strip (432) is fixedly connected to the corresponding vertical strip (530) on the sliding plate (42), and the lower end surface of the placing plate (1) is slidably provided with two racks (433) meshing with the gears (452), and the two racks (432) (432) are arranged on the lower end surface of the placing plate (1), and the two racks (432) (432) mesh with the gears (452). 3) are respectively slidably connected to the corresponding Z-shaped bars (432), and the rack one (453) and the two rack twos (433) are staggered with each other, and the opposite sides of the two rack twos (433) are fixedly provided with horizontal rods (434) through rectangular plates (531), and the horizontal rods (434) slide through the Z-shaped bars (432), and a spring one (435) sleeved on the corresponding horizontal rod (434) is fixedly provided between the Z-shaped bars (432) and the rectangular plates (531).
6. The processing technology of a crystal resonator according to claim 1, characterized in that: The lower pressing strip (440) is an L-shaped structure, and two lower pressing plates (441) symmetrically distributed front and back are fixedly arranged on the horizontal section of the lower pressing strip (440).
7. The processing technology of a crystal resonator according to claim 6, characterized in that: The pressing group (44) comprises a fixing bar (442), the lower end surface of the sliding plate (42) is fixedly provided with two fixing bars (442) which are symmetrically distributed on the left and right, and the two fixing bars (442) are close to each other from top to bottom, and the fixing bars (442) are provided with a transmission groove (443) which is the same as the extension direction thereof, and the lower pressing bar (440) is fixedly provided with a transmission column (444) whose axis extends from front to rear, and the transmission column (444) is located in the transmission groove (443).
8. The process for processing a crystal resonator according to claim 1, characterized in that: The linkage group (46) comprises a rack three (460), and two rack threes (460) symmetrically distributed on the left and right are fixedly provided on the lower end surface of the lifting plate (2), and vertical plates (461) are fixedly provided on the opposite back surfaces of the two sliding blocks (31) in the same cutting mechanism (3), and gear two (462) is rotatably provided on the opposite back surfaces of the two vertical plates (461) through a transmission shaft, and the gear two (462) is meshed with the rack three (460).
9. The processing technology of a crystal resonator according to claim 8, characterized in that: The front end surface of the sliding plate (42) is fixedly provided with two L-shaped plates (463) symmetrically distributed on the left and right. The horizontal section of the L-shaped plate (463) extending from left to right slides through a sliding rod (464) with an axis extending from front to back. The rear end surface of the L-shaped plate (463) is fixedly provided with a circular plate. A second spring (465) sleeved on the sliding rod (464) is fixedly provided between the circular plate and the L-shaped plate (463). A fourth rack (466) is fixedly provided on the front end surface of the sliding rod (464) via a connecting plate, and the fourth rack (466) is meshed with the second gear (462).
10. The process for processing a crystal resonator according to claim 1, characterized in that: A lower pressure rod (52) is slidably passed through the fixed block (41) and the corresponding sliding plate (42); a push plate (520) is fixedly arranged on the upper end surface of the lower pressure rod (52); a spring three (521) sleeved on the lower pressure rod (52) is fixedly arranged between the push plate (520) and the fixed block (41); and a plurality of equidistantly distributed positioning holes (522) are penetrated through the placement plate (1).