Semiconductor wafer automatic gluing device and gluing method thereof

Abstract

The invention relates to a semiconductor wafer automatic gluing device and a gluing method thereof, and relates to the technical field of wafer gluing, the semiconductor wafer automatic gluing device comprises a machine base, an inner ring base is fixedly arranged on the machine base, a left working table and a right working table are symmetrically arranged on the inner ring base, and the left working table and the right working table are both rotationally connected with the inner ring base; the left working table and the right working table are symmetrically provided with a group of suction cups, the suction cups are used for fixing wafers, the outer ring seat is provided with a gluing support and a drying support, the gluing support is fixedly provided with a spraying gun, the spraying gun is used for spraying glue to the wafers, the drying support is provided with an electric heating tube, and the electric heating tube is used for heating. The semiconductor wafer gluing device has the advantages that the semiconductor wafer can be conveniently glued, and the gluing efficiency of the semiconductor wafer is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer gluing, in particular to an automatic gluing device for semiconductor wafers and a gluing method thereof. Background Art

[0002] In the field of semiconductor production, glue coating is a process of applying glue liquid or plating thin film on semiconductor wafers. This process is common in the photolithography process of semiconductor wafer processing. During the photolithography process, photoresist needs to be coated on the surface of the wafer. The ideal requirement is that the photoresist liquid on the surface should have a uniform thickness and a flat surface, which is the basis for the subsequent exposure and development processes to proceed smoothly.

[0003] In the related art, a Chinese patent with authorization announcement number CN219898887U provides a spin glue coating machine for a single wafer, which includes a machine base, a glue coating cavity is arranged on the machine base, a tray is installed in the glue coating cavity, a machine cover is movably arranged above the tray, and an electric heater is installed at the bottom of the machine cover. After the wafer on the tray is glued, the machine cover moves to cover the glue coating cavity, and then the electric heater is powered on to generate heat to dry the glue on the wafer.

[0004] In the process of implementing this application, the inventors found that there are at least the following problems in this technology: after the electric heater is powered on to heat up and dry the glue on the chip, due to the high temperature inside the glue coating chamber, it is necessary to wait for the temperature inside the glue coating chamber to drop before taking out the chip on the tray and coating the next chip with glue, which limits the improvement of the gluing efficiency of semiconductor chips. Summary of the invention

[0005] In order to facilitate gluing of semiconductor wafers and improve the gluing efficiency of semiconductor wafers, the present application provides an automatic gluing device for semiconductor wafers and a gluing method thereof.

[0006] The present application provides a semiconductor wafer automatic glue coating device adopts the following technical solution: A semiconductor wafer automatic gluing device comprises a machine base, an inner ring seat is fixedly arranged on the machine base, a left workbench and a right workbench are symmetrically arranged on the inner ring seat, the left workbench and the right workbench are both rotatably connected to the inner ring seat, a group of suction cups are symmetrically arranged on the left workbench and the right workbench, the suction cups are used to fix the wafer, a gluing bracket and a drying bracket are arranged on the outer ring seat, a spray gun is fixedly arranged on the gluing bracket, the spray gun is used to spray glue onto the wafer, and an electric heating tube is arranged on the drying bracket, the electric heating tube is used to generate heat.

[0007] By adopting the above technical scheme, when the left workbench is located on one side of the gluing bracket and the right workbench is located on one side of the drying bracket, the suction cup on the left workbench located below the spray gun is the gluing station, the suction cup on the left workbench not located below the spray gun is the cooling station, the suction cup on the right workbench located below the electric heating tube is the drying station, and the suction cup on the right workbench not located below the electric heating tube is the material changing station; when the right workbench is located on one side of the gluing bracket and the left workbench is located on one side of the drying bracket, the suction cup on the right workbench located below the spray gun is the gluing station, the suction cup on the right workbench not located below the spray gun is the cooling station, the suction cup on the left workbench located below the electric heating tube is the drying station, and the suction cup on the left workbench not located below the electric heating tube is the material changing station. At the gluing station, the glue is coated on the surface of the wafer, at the drying station, the glue on the surface of the wafer is solidified, at the cooling station, the wafer is cooled down, at the material changing station, the processed wafer is first removed and then the wafer to be processed is placed. When the processes at the gluing station, drying station, cooling station and material changing station are completed, the outer ring seat rotates 180°. If the spray gun rotates from the top of the left workbench to the top of the right workbench, the right workbench rotates 180° synchronously. When the spray gun rotates from the top of the right workbench to the top of the left workbench, the left workbench rotates 180° synchronously. The gluing station, drying station, cooling station and material changing station work simultaneously, which shortens the interval time between adjacent wafer processing and improves the gluing efficiency of semiconductor wafers.

[0008] Preferably, a left motor and a right motor are fixedly arranged on the inner ring seat, the output shaft of the left motor is fixedly connected to the bottom of the left workbench, the output shaft of the right motor is fixedly connected to the bottom of the right workbench, the first motor and the second motor are fixedly arranged on the left workbench, the third motor and the fourth motor are fixedly arranged on the right workbench, a rotating seat is fixedly arranged on the first motor, the second motor, the third motor and the fourth motor, and the suction cup is fixedly arranged on the rotating seat.

[0009] By adopting the above technical solution, the left motor starts to drive the left workbench to rotate 180°, the right motor starts to drive the right workbench to rotate 180°, the first motor, the second motor, the third motor and the fourth motor drive the corresponding rotating seat to rotate, the rotation of the rotating seat drives the suction cup to rotate, and the rotation of the suction cup drives the wafer to rotate, so that the glue on the wafer is evenly distributed.

[0010] Preferably, an air cavity is provided in the rotating seat, an air pipe is provided between the air cavity and the suction cup, a piston head is slidably provided in the air cavity, and the piston head is in contact with the inner wall of the air cavity.

[0011] By adopting the above technical solution, after the chip is placed on the suction cup, the piston head moves to draw the gas between the chip and the suction cup into the air cavity, thereby fixing the chip on the suction cup. When the chip is removed from the suction cup, the piston head moves to squeeze the gas in the air cavity between the chip and the suction cup.

[0012] Preferably, a piston motor is fixedly arranged in the air cavity, a piston screw is fixedly arranged on the output shaft of the piston motor, and the piston screw is threadedly connected to the piston head.

[0013] By adopting the above technical solution, the piston motor starts to drive the piston screw to rotate, and the rotation of the piston screw drives the piston head to move in the air cavity.

[0014] Preferably, a driving motor is fixedly arranged on the machine base, a driving worm is fixedly arranged on the output shaft of the driving motor, a driving worm wheel is sleeved on the outer ring seat, the driving worm wheel is fixedly connected to the outer ring seat, and the driving worm wheel and the driving worm are meshed with each other.

[0015] By adopting the above technical solution, the driving motor starts to drive the driving worm to rotate, the driving worm rotates to drive the driving worm wheel to rotate, and the driving worm wheel rotates the outer ring seat to rotate.

[0016] Preferably, a lifting motor is fixedly arranged on the drying bracket, a lifting screw is fixedly arranged on the output shaft of the lifting motor, the lifting screw is threadedly connected to the lifting seat, a lifting slide rod is fixedly arranged on the drying bracket, the lifting slide rod passes through the lifting seat, an insulation cover is fixedly arranged on the lifting seat, and the electric heating pipe is fixedly arranged in the insulation cover.

[0017] By adopting the above technical solution, the lifting motor is started to drive the lifting screw to rotate, the lifting screw rotates to drive the lifting seat to move along the lifting slide bar, the lifting seat drives the insulation cover and the electric heating tube to move, when the wafer on the drying station is dried, the lifting seat descends to place the wafer cover in the insulation cover, and the electric heating tube generates heat to solidify the glue on the wafer.

[0018] Preferably, an exhaust motor is fixedly arranged on the inner ring seat, an exhaust box is fixedly arranged on the exhaust motor, an exhaust pump is connected to the exhaust box, a U-shaped tube is connected to the exhaust pump, and an exhaust hood is connected to the U-shaped tube.

[0019] By adopting the above technical solution, the vacuum motor drives the vacuum box to rotate, and the vacuum box drives the vacuum pump and the U-shaped tube to rotate, so that the U-shaped tube faces the cooling station, and the vacuum pump starts to pump the gas on the cooling station into the vacuum box, accelerating the heat flow on the cooling station, thereby accelerating the cooling of the chip.

[0020] The present application provides a method for automatically coating semiconductor wafers using the following technical solutions: A method for automatically coating semiconductor wafers with glue comprises the following steps: Step 1: fix the first wafer on the suction cup directly below the spray gun, and the spray gun applies glue to the first wafer; Step 2: After the first chip is coated with glue, proceed to step 3; Step 3: The outer ring seat and the vacuum box rotate 180° synchronously; Step 4: Detect the rotation direction of the outer ring seat; Step 5: If the glue coating bracket rotates from the left workbench to the right workbench, the right workbench rotates 180° synchronously, and step 6 is performed; if the glue coating bracket rotates from the left workbench to the right workbench, the left workbench rotates 180° synchronously, and step 7 is performed; Step 6: The wafers on the right workbench located under the spray gun are coated with glue, the wafers on the right workbench not located under the spray gun are cooled, the wafers on the left workbench located under the electric heating tube are dried, and the suction cups on the left workbench not located under the electric heating tube are first unloaded and then loaded, and step 8 is performed; Step 7, the wafer under the spray gun on the left workbench is coated with glue, the wafer not under the spray gun on the left workbench is cooled, the wafer under the electric heating tube on the right workbench is dried, the suction cup on the right workbench not under the electric heating tube is unloaded first and then loaded, and step 8 is performed; Step eight, the gluing process, drying process, cooling process and material changing process work simultaneously. After the gluing process, drying process, cooling process and material changing process are completed, step three is carried out.

[0021] In summary, the present application includes at least one of the following beneficial technical effects: 1. By setting the machine base, inner ring base, left workbench, right workbench, suction cup, glue coating bracket, drying bracket, spray gun and electric heating pipe, the interval time between adjacent wafer processing is shortened and the glue coating efficiency of semiconductor wafer is improved; 2. By setting a driving motor, a driving worm and a driving worm wheel, the outer ring seat and the machine base are rotated; 3. The adhesive on the wafer is cured by setting a lifting motor, a lifting screw, a lifting seat, a lifting slide bar and a heat preservation cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a cross-sectional view of an automatic gluing device for semiconductor wafers in an embodiment of the present application.

[0023] Figure 2 It is a schematic diagram showing the positional relationship between the left workbench and the right workbench in the embodiment of the present application.

[0024] Figure 3 It is a cross-sectional view showing the connection relationship between the suction cup and the rotating seat in the embodiment of the present application.

[0025] Figure 4 It is a schematic diagram showing the connection relationship between the exhaust hood and the inner ring seat in the embodiment of the present application.

[0026] Figure 5It is a cross-sectional view showing the connection relationship between the heat preservation cover and the drying bracket in the embodiment of the present application.

[0027] Description of the accompanying drawings: 1. machine base; 11. glue coating station; 12. drying station; 13. cooling station; 14. material changing station; 2. inner ring seat; 21. left workbench; 211. left motor; 22. right workbench; 221. right motor; 3. suction cup; 31. air cavity; 32. air pipe; 33. piston head; 34. piston screw; 35. piston motor; 4. outer ring seat; 41. glue coating bracket; 411. spray gun; 42. drying station Dry support; 421, electric heating tube; 422, insulation cover; 5, rotating seat; 51, first motor; 52, second motor; 53, third motor; 54, fourth motor; 6, driving motor; 61, driving screw; 62, driving worm gear; 7, lifting motor; 71, lifting screw; 72, lifting slide; 73, lifting seat; 8, exhaust motor; 81, exhaust box; 82, exhaust pump; 83, U-shaped tube; 84, exhaust hood. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-5 This application is described in further detail.

[0029] The present application embodiment discloses an automatic glue coating device for semiconductor wafers. Figures 1 to 5, including a machine base 1, an inner ring seat 2 and an outer ring seat 4 are installed on the machine base 1, the inner ring seat 2 is welded on the machine base 1, and the outer ring seat 4 is rotatably arranged on the machine base 1. The outer ring seat 4 is sleeved on the inner ring seat 2, and the outer ring seat 4 is coaxially arranged with the inner ring seat 2. The inner ring seat 2 is installed with a left motor 211, a right motor 221 and an air extraction motor 8, the air extraction motor 8 is located at the center of the inner ring seat 2, and the left motor 211 and the right motor 221 are symmetrically arranged on both sides of the air extraction motor 8. An air extraction box 81 is installed on the air extraction box 81, and an air extraction pump 82 is connected to the air extraction pump 82, and a U-shaped pipe 83 is connected to the air extraction pump 82, and an air extraction hood 84 is connected to the U-shaped pipe 83. The left workbench 21 is installed on the left motor 211, and the right workbench 22 is installed on the right motor 221. The first motor 51 and the second motor 52 are symmetrically installed on the left workbench 21, and the third motor 53 and the fourth motor 54 are symmetrically installed on the right workbench 22. The first motor 51, the second motor 52, the third motor 53 and the fourth motor 54 are mounted on the rotating seat 5, and the suction cup 3 is mounted on the top of the rotating seat 5, and the suction cup 3 is used to fix the wafer. The outer ring seat 4 is symmetrically mounted with a glue coating bracket 41 and a drying bracket 42, and the glue coating bracket 41 is mounted with a spray gun 411, and the spray gun 411 is used to spray glue on the wafer, and the drying bracket 42 is mounted with an electric heating pipe 421, and the electric heating pipe 421 is used to generate heat. When the left workbench 21 is located at one side of the glue coating bracket 41 and the right workbench 22 is located at one side of the drying bracket 42, the suction cup 3 on the left workbench 21 located below the spray gun 411 is the glue coating station 11, the suction cup 3 on the left workbench 21 not located below the spray gun 411 is the cooling station 13, the suction cup 3 on the right workbench 22 located below the electric heating pipe 421 is the drying station 12, and the suction cup 3 on the right workbench 22 not located below the electric heating pipe 421 is the material replacement station 14. When the right workbench 22 is located on one side of the glue coating bracket 41 and the left workbench 21 is located on one side of the drying bracket 42, the suction cup 3 on the right workbench 22 located below the spray gun 411 is the glue coating station 11, the suction cup 3 on the right workbench 22 that is not located below the spray gun 411 is the cooling station 13, the suction cup 3 on the left workbench 21 that is located below the electric heating tube 421 is the drying station 12, and the suction cup 3 on the left workbench 21 that is not located below the electric heating tube 421 is the material changing station 14. The spray gun 411 applies the glue on the wafer at the glue coating station 11, and at the same time, the rotating seat 5 on the glue coating station 11 rotates to evenly distribute the glue on the wafer; the electric heating tube 421 bakes the wafer on the drying station 12 to solidify the glue on the surface of the wafer; the exhaust motor 8 drives the exhaust box 81 to rotate, and the exhaust box 81 drives the exhaust pump 82 and the U-shaped tube 83 to rotate, so that the U-shaped tube 83 faces the cooling station 13, and the exhaust pump 82 starts to extract the gas on the cooling station 13 into the exhaust box 81, accelerating the heat flow on the cooling station 13, thereby accelerating the heat dissipation and cooling of the wafer on the cooling station 13; the processed wafer is first removed from the material changing station 14, and then the wafer to be processed is placed on the material changing station 14.After the processes at the glue coating station 11, the drying station 12, the cooling station 13 and the material changing station 14 are carried out synchronously, when the processes at the glue coating station 11, the drying station 12, the cooling station 13 and the material changing station 14 are all completed, the outer ring seat 4 rotates 180°. If the spray gun 411 rotates from the top of the left workbench 21 to the top of the right workbench 22, the right motor 221 drives the right workbench 22 to rotate 180° synchronously; when the spray gun 411 rotates from the top of the right workbench 22 to the top of the left workbench 21, the left motor 211 drives the left workbench 21 to rotate 180° synchronously. Since the glue coating station 11, the drying station 12, the cooling station 13 and the material changing station 14 work simultaneously, the interval time between adjacent wafer processing is shortened, and the glue coating efficiency of semiconductor wafers is improved.

[0030] In order to make the suction cup 3 absorb the wafer, refer to Figure 3 An air cavity 31 is provided in the rotating seat 5, and an air pipe 32 is provided between the air cavity 31 and the suction cup 3. A piston head 33 is provided in the air cavity 31 for sliding movement, and the piston head 33 and the inner wall of the air cavity 31 are in contact with each other. A piston motor 35 is installed in the air cavity 31, and a piston screw 34 is installed on the output shaft of the piston motor 35, and the piston screw 34 is threadedly connected with the piston head 33. The piston motor 35 is started to drive the piston screw 34 to rotate, and the rotation of the piston screw 34 drives the piston head 33 to move in the air cavity 31. After the wafer is placed on the suction cup 3, the piston head 33 moves to draw the gas between the wafer and the suction cup 3 into the air cavity 31, thereby fixing the wafer on the suction cup 3. When the wafer is removed from the suction cup 3, the piston head 33 moves to squeeze the gas in the air cavity 31 between the wafer and the suction cup 3.

[0031] In order to drive the outer ring seat 4 to rotate, refer to Figure 1 , a driving motor 6 is installed on the frame, and a driving worm is installed on the output shaft of the driving motor 6. A driving worm wheel 62 is sleeved on the outer ring seat 4, and the driving worm wheel 62 is welded to the outer ring seat 4, and the driving worm wheel 62 and the driving worm are meshed with each other. When the driving motor 6 is started, the driving worm is driven to rotate, and the driving worm is driven to rotate the driving worm wheel 62, and the driving worm wheel 62 rotates the outer ring seat 4 to rotate.

[0032] In order to shorten the curing time of the chip surface glue, refer to Figure 1 and Figure 5, the drying bracket 42 is provided with a lifting motor 7 and a lifting slide bar 72, and a lifting seat 73 is sleeved on the lifting slide bar 72. A lifting screw 71 is installed on the output shaft of the lifting motor 7, and the lifting screw 71 is threadedly connected with the lifting seat 73. A heat preservation cover 422 is installed on the lifting seat 73, and an electric heating pipe 421 is installed in the heat preservation cover 422. When the lifting motor 7 is started, the lifting screw 71 is driven to rotate, and the lifting screw 71 rotates to drive the lifting seat 73 to move along the lifting slide bar 72, and the lifting seat 73 drives the heat preservation cover 422 and the electric heating pipe 421 to move. When the wafer on the drying station 12 is dried, the electric heating pipe 421 generates heat to solidify the glue on the wafer, and the lifting seat 73 descends to cover the wafer in the heat preservation cover 422, so that heat is not easily wasted.

[0033] Reference Figures 1 to 5 , an embodiment of the present application discloses a method for automatic gluing of semiconductor wafers, comprising the following steps.

[0034] Step 1: fix the first wafer on the suction cup 3 directly below the spray gun 411, and the spray gun 411 applies glue to the first wafer.

[0035] Step 2: After the first chip is coated with glue, proceed to step 3.

[0036] Step 3: The outer ring seat 4 and the vacuum box 81 rotate 180° synchronously.

[0037] Step 4: Detect the rotation direction of the outer ring seat 4.

[0038] Step 5: If the glue coating bracket 41 rotates from the left workbench 21 to the right workbench 22, the right workbench 22 rotates 180° synchronously, and step 6 is performed; if the glue coating bracket 41 rotates from the left workbench 21 to the right workbench 22, the left workbench 21 rotates 180° synchronously, and step 7 is performed.

[0039] Step six, the wafers on the right workbench 22 located below the spray gun 411 are coated with glue, the wafers on the right workbench 22 not located below the spray gun 411 are cooled, the wafers on the left workbench 21 located below the electric heating tube 421 are dried, the suction cups 3 on the left workbench 21 not located below the electric heating tube 421 are first unloaded and then loaded, and step eight is performed.

[0040] Step seven, the wafers on the left workbench 21 located below the spray gun 411 are coated with glue, the wafers on the left workbench 21 not located below the spray gun 411 are cooled, the wafers on the right workbench 22 located below the electric heating tube 421 are dried, the suction cups 3 on the right workbench 22 not located below the electric heating tube 421 are first unloaded and then loaded, and step eight is performed.

[0041] Step eight, the gluing process, drying process, cooling process and material changing process work simultaneously. After the gluing process, drying process, cooling process and material changing process are completed, step three is carried out.

[0042] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor wafer automatic glue coating device, comprising a base (1), characterized in that: An inner ring seat (2) is fixedly arranged on the machine base (1), a left workbench (21) and a right workbench (22) are symmetrically arranged on the inner ring seat (2), the left workbench (21) and the right workbench (22) are both rotatably connected to the inner ring seat (2), a group of suction cups (3) are symmetrically arranged on the left workbench (21) and the right workbench (22), the suction cups (3) are used to fix the wafer, a glue coating bracket (41) and a drying bracket (42) are arranged on the outer ring seat (4), a spray gun (411) is fixedly arranged on the glue coating bracket (41), the spray gun (411) is used to spray glue onto the wafer, and an electric heating pipe (421) is arranged on the drying bracket (42), the electric heating pipe (421) is used to generate heat.

2. The automatic gluing device for semiconductor wafers according to claim 1, characterized in that: A left motor (211) and a right motor (221) are fixedly arranged on the inner ring seat (2); an output shaft of the left motor (211) is fixedly connected to the bottom of the left workbench (21); an output shaft of the right motor (221) is fixedly connected to the bottom of the right workbench (22); a first motor (51) and a second motor (52) are fixedly arranged on the left workbench (21); a third motor (53) and a fourth motor (54) are fixedly arranged on the right workbench (22); a rotating seat (5) is fixedly arranged on the first motor (51), the second motor (52), the third motor (53) and the fourth motor (54); and the suction cup (3) is fixedly arranged on the rotating seat (5).

3. The automatic gluing device for semiconductor wafers according to claim 2, characterized in that: An air cavity (31) is provided in the rotating seat (5); an air pipe (32) is provided between the air cavity (31) and the suction cup (3); a piston head (33) is slidably provided in the air cavity (31); the piston head (33) and the inner wall of the air cavity (31) are in contact with each other.

4. The automatic gluing device for semiconductor wafers according to claim 3, characterized in that: A piston motor (35) is fixedly arranged in the air cavity (31), a piston screw (34) is fixedly arranged on the output shaft of the piston motor (35), and the piston screw (34) is threadedly connected to the piston head (33).

5. The automatic gluing device for semiconductor wafers according to claim 1, characterized in that: A driving motor (6) is fixedly arranged on the machine base (1), a driving worm is fixedly arranged on the output shaft of the driving motor (6), a driving worm wheel (62) is sleeved on the outer ring seat (4), the driving worm wheel (62) is fixedly connected to the outer ring seat (4), and the driving worm wheel (62) and the driving worm are meshed with each other.

6. The automatic gluing device for semiconductor wafers according to claim 1, characterized in that: A lifting motor (7) is fixedly arranged on the drying bracket (42), a lifting screw (71) is fixedly arranged on the output shaft of the lifting motor (7), the lifting screw (71) is threadedly connected to the lifting seat (73), a lifting slide bar (72) is fixedly arranged on the drying bracket (42), the lifting slide bar (72) passes through the lifting seat (73), a heat preservation cover (422) is fixedly arranged on the lifting seat (73), and the electric heating pipe (421) is fixedly arranged in the heat preservation cover (422).

7. The automatic gluing device for semiconductor wafers according to claim 1, characterized in that: An air extraction motor (8) is fixedly arranged on the inner ring seat (2), an air extraction box (81) is fixedly arranged on the air extraction motor (8), an air extraction pump (82) is connected to the air extraction box (81), a U-shaped tube (83) is connected to the air extraction pump (82), and an air extraction hood (84) is connected to the U-shaped tube (83).

8. A method for automatic gluing of semiconductor wafers, characterized in that: The following steps are involved: Step 1: fix the first wafer on the suction cup (3) directly below the spray gun (411), and use the spray gun (411) to apply glue to the first wafer; Step 2: After the first chip is coated with glue, proceed to step 3; Step 3: The outer ring seat (4) and the vacuum box (81) are synchronously rotated 180°; Step 4: Detect the rotation direction of the outer ring seat (4); Step 5: If the glue coating bracket (41) rotates from the left workbench (21) to the right workbench (22), the right workbench (22) rotates 180° synchronously, and step 6 is performed; if the glue coating bracket (41) rotates from the left workbench (21) to the right workbench (22), the left workbench (21) rotates 180° synchronously, and step 7 is performed; Step 6: The wafers on the right workbench (22) located below the spray gun (411) are coated with glue, the wafers on the right workbench (22) that are not located below the spray gun (411) are cooled, the wafers on the left workbench (21) that are located below the electric heating tube (421) are dried, and the suction cups (3) on the left workbench (21) that are not located below the electric heating tube (421) are first unloaded and then loaded, and step 8 is performed; Step 7, the wafers on the left workbench (21) located below the spray gun (411) are coated with glue, the wafers on the left workbench (21) that are not located below the spray gun (411) are cooled, the wafers on the right workbench (22) that are located below the electric heating tube (421) are dried, and the suction cups (3) on the right workbench (22) that are not located below the electric heating tube (421) are first unloaded and then loaded, and step 8 is performed; Step eight, the gluing process, drying process, cooling process and material changing process work simultaneously. After the gluing process, drying process, cooling process and material changing process are completed, step three is carried out.

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