Memory bank installation device, system and method

Abstract

The invention discloses a memory bank installation device, system and method which are applied to the field of memory installation, a press-fitting assembly comprises a pressing block and a power component, and the pressing block is installed on the power component; the pressure sensor is used for acquiring a first pressure value and a second pressure value of the pressing block on the memory bank; and the controller is used for controlling the power part to stop acting when the first pressure value is greater than the upper limit of the first threshold value, the first pressure value is smaller than or equal to the upper limit of the first threshold value, and the second pressure value is greater than a preset pressure value in the second threshold value. According to the memory bank installation device provided by the invention, the pressure values of the memory bank at the first preset position and the second preset position are respectively detected to serve as a judgment basis for judging whether the memory bank is inserted obliquely or not and whether the memory bank is installed in place or not, so that the probability of damage to the memory bank or a memory slot can be effectively reduced, and the memory bank installation device is convenient to operate and high in practicability. The cost is saved, and the installation efficiency and the automation degree of the memory bank can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of memory installation, and in particular to a memory bar installation device, system and method. Background Art

[0002] Memory sticks are one of the core components of electronic devices and are often used in large quantities in products. During automatic installation by robots, if the installation point is offset or the jig for grabbing the memory stick is worn and causes errors, the memory stick may be inserted into the slot incorrectly, causing damage to the memory stick or the slot material. If the damaged parts do not meet the equipment alarm conditions, it may cause batch damage to the material.

[0003] In the related art, when a memory stick box arrives, the memory stick is generally captured through the absolute position point data of the PLC program, or the position of the memory stick box is located by taking a photo with a camera; during the memory stick installation process, the robot grabs the memory stick and locates the position of the motherboard through a photo with a camera, and inserts the memory stick into the slot of the motherboard. The electronic equipment monitors the maximum pressing force during the installation process.

[0004] However, the memory stick installation method in the related art is that the spacing position of the memory sticks in the material box is basically the same, but the outer edge size of the material box has errors, resulting in the material box being placed on the carrier. The position is not exactly the same, resulting in the robot grabbing the memory stick. The position of the clamp does not match the actual position of the memory stick, resulting in the memory stick not being clamped in place; and using a camera to locate the position of the memory stick material box or the memory stick position cannot accurately capture features. The structure of the material box is relatively complex, resulting in multiple features in the camera's field of view, and the positioning accuracy is low. In addition, when the memory stick is installed, the pressure sensor only monitors the maximum pressure value when the pressing is completed. When the memory stick is inserted off-center and causes an alarm for the pressure value exceeding the limit, the material may have been damaged.

[0005] Therefore, how to effectively improve the efficiency and accuracy of memory stick installation is a technical problem that those skilled in the art currently need to solve. Summary of the invention

[0006] The object of the present invention is to provide a memory bar installation device, system and method for improving the installation efficiency of the memory bar and reducing damage.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A memory stick installation device, comprising:

[0009] A press-fit assembly, the press-fit assembly includes a press block and a power component, the press block is installed on the power component and moves with the power component;

[0010] A pressure sensor, used to obtain a first pressure value and a second pressure value of the pressure block on the memory stick when the memory stick is installed in a first preset position and a second preset position in the memory slot, respectively; and the first preset position is close to the notch of the memory slot, and the second preset position is located at the bottom of the slot of the memory slot;

[0011] The controller is used to control the power component to stop moving when the first pressure value is greater than the upper limit of the first threshold value, and when the first pressure value is less than or equal to the upper limit of the first threshold value, and the second pressure value is greater than a preset pressure value in the second threshold value.

[0012] On the other hand, it also includes an elastic component, which is installed between the pressure block and the power component. After the pressure block contacts the memory stick, it can compress the elastic component; and the maximum compression distance of the elastic component is equal to the distance between the notch of the memory slot and the first preset position.

[0013] On the other hand, a limiting rod is provided on the pressing block, one end of the limiting rod away from the pressing block is movably mounted on the power component, and the elastic component is sleeved on the limiting rod.

[0014] On the other hand, the distance between the first preset position and the notch is 10%-40% of the depth of the memory slot.

[0015] On the other hand, press-fit assemblies also include:

[0016] The clamping component is used to obtain the memory stick and move the memory stick to the memory slot; the controller is connected to the clamping component and is used to control the clamping component to move the memory stick to the notch of the memory slot.

[0017] On the other hand, the clamping assembly includes at least two clamping jaws and a clamping jaw driving component, the clamping jaws are installed on the clamping jaw driving component, the clamping jaws are located on both sides of the pressing block, and the clamping jaw driving component is used to drive the clamping jaws to move to grab or release the memory stick.

[0018] On the other hand, the press-fitting assembly also includes a press-fitting support component, on which a power component, a press block and a clamp driving component are all mounted, and the clamp driving component is slidably connected to the press-fitting support component; a slide groove is provided on the press-fitting support component, and the clamp driving component includes a slider and a cylinder, the slider is movably arranged in the slide groove, and the slider can move in a direction close to or away from the press block.

[0019] On the other hand, it also includes:

[0020] An image acquisition component, used to obtain the actual position of the memory slot;

[0021] The supporting body and the rotating component, the image acquisition component and the press-fitting component are all installed on the supporting body, and the rotating component is used to drive the supporting body to move and rotate;

[0022] The image acquisition component and the rotating part are both connected to the controller. The controller is also used to compare the actual position of the memory slot with the reference position of the memory slot, calculate the target angle that the supporting body needs to rotate, and control the rotation of the rotating part according to the target angle.

[0023] On the other hand, the image acquisition assembly includes an image acquisition bracket and at least two image acquisition components. The image acquisition bracket is arranged on a side of the support body close to the press-fit assembly, and the image acquisition components are installed on the image acquisition bracket.

[0024] On the other hand, the image acquisition component also includes a light source component and a light source bracket. The light source bracket is installed on the side of the image acquisition bracket away from the supporting body. The light source component is installed on the light source bracket. The light source component is used to provide lighting for the image acquisition component.

[0025] On the other hand, it also includes:

[0026] A first material box position detection component, used for obtaining the actual position of the material box on the carrier plate;

[0027] The first material box position detection component is connected to the controller, and the controller is also used to control the press-fitting assembly to obtain the memory stick according to the actual position of the material box on the carrier.

[0028] On the other hand, a carrying groove for placing a material box is provided on the carrier, and the first material box position detection component is a laser sensor, which is used to obtain the edge position of the carrying groove and the edge position of the material box; the controller is used to determine the actual position of the material box on the carrier according to the edge position of the carrying groove and the edge position of the material box.

[0029] On the other hand, it also includes a cache turntable, which is installed at the front end of the memory bar installation device. The cache turntable is provided with a loading position, a cache position and a unloading position along its circumference; the cache turntable is used to transport the memory bar from the loading position to the unloading position, and the memory bar installation device is also used to obtain the memory bar located at the unloading position.

[0030] On the other hand, it also includes a conveying mechanism and a carrier plate disassembling mechanism. The conveying mechanism is used to convey a plurality of stacked carrier plates into the carrier plate disassembling mechanism. A memory strip material box is placed on the carrier plate. The carrier plate disassembling mechanism is used to block and release the carrier plates one by one.

[0031] On the other hand, the plate disassembling mechanism includes a plate disassembling mechanism clamp and a plate carrying component. The plate carrying component is used to carry the stacked carriers, and the plate disassembling mechanism clamp is used to lift the second layer and above carriers from bottom to top.

[0032] On the other hand, it also includes a memory stick transfer clamp and a second material box position detection component, the second material box position detection component is used to obtain the actual position of the material box on the carrier; the second material box position detection component is connected to the controller, and the controller is also used to control the memory stick transfer clamp to obtain the memory stick according to the actual position of the material box on the carrier.

[0033] A memory stick installation system comprises the above-mentioned memory stick installation device.

[0034] A memory bar installation method comprises the following steps:

[0035] Controlling the memory bar to be installed into the memory slot and moved to a first preset position;

[0036] Acquire a first pressure value borne by the memory bar when the memory bar is located at a first preset position, and control the memory bar to stop moving when the first pressure value is greater than a first threshold upper limit;

[0037] When the first pressure value is less than or equal to the upper limit of the first threshold, controlling the memory bar to continue to be installed in the memory slot and move to the second preset position;

[0038] A second pressure value borne by the memory bar when the memory bar is located at a second preset position is obtained, and when the second pressure value is greater than a preset pressure value in a second threshold, the memory bar is controlled to stop moving.

[0039] On the other hand, after obtaining the second pressure value borne by the memory bar when the memory bar is located at the second preset position, the method further includes:

[0040] When the second pressure value is less than or equal to the second lower threshold, the memory bar is controlled to stop moving.

[0041] On the other hand, when the memory bar is located at the first preset position, the first pressure value borne by the memory bar is obtained, and then the following is included:

[0042] When the first pressure value is greater than the first threshold upper limit, an alarm signal is issued;

[0043] After obtaining the second pressure value borne by the memory bar when the memory bar is located at the second preset position, the method further includes:

[0044] When the first pressure value is less than or equal to the first threshold lower limit, and the second pressure value is less than or equal to the second threshold lower limit, an alarm signal is issued.

[0045] The memory stick installation device provided by the present invention has the following beneficial effects: through the setting of the press-fitting component, the pressure sensor can be installed on the press block by utilizing the interaction force between the press block and the memory stick; in the process of the press block pushing the memory stick into the memory slot, friction will be generated between the memory slot and the memory stick; in order to overcome the friction, the press block needs to exert a certain force on the memory stick, and the pressure sensor can obtain the pressure between the press block and the memory stick; in order to ensure the stability of the pressure exerted by the press block on the memory stick, the moving speed of the press block can be set, and the press block can be controlled to push the memory stick steadily, so that the memory stick moves to the first preset position and the second preset position in sequence after entering the memory slot, and then the first pressure value and the second pressure value of the press block on the memory stick are respectively obtained by the pressure sensor; and, through the setting of the controller, when the memory stick moves to When the pressure value is less than or equal to the upper limit of the first threshold, it indicates that the installation of the memory stick is deviated, for example, the memory stick is skewed relative to the memory slot. At this time, by controlling the power component to stop moving, the pressure block no longer applies pressure to the memory stick, thereby avoiding damage to the memory stick or the memory slot. Further, when the first pressure value is less than or equal to the upper limit of the first threshold, it indicates that the installation process of the memory stick is not blocked. At this time, the power component can be controlled to continue to push the pressure block to move, and the pressure block continues to push the memory stick toward the second preset position, that is, pushes the memory stick toward the bottom of the memory slot. When the memory stick moves to the second preset position, by detecting the pressure value applied by the pressure block to the memory stick, and when the second pressure value is greater than the preset pressure value in the second threshold, it indicates that the memory stick is installed in place. At this time, the power component can be controlled to stop moving to complete the installation process of the memory stick.

[0046] The memory stick installation device detects the pressure values ​​of the memory stick at the first preset position and the second preset position respectively as the basis for judging whether the memory stick is inserted skewly and whether the memory stick is installed in place. This can effectively prevent the memory stick or the memory slot from being damaged due to continued pushing of the memory stick when the memory stick is inserted skewly. The device is easy to operate, can effectively save costs, and improves the installation efficiency and automation of the memory stick.

[0047] In one embodiment, an image acquisition component is used to obtain the actual position of the memory slot, and the actual position of the memory slot is compared with the reference position of the memory slot to calculate the target angle that the supporting body needs to rotate, and the rotating component is controlled to rotate according to the target angle. The supporting body rotates to drive the press-fitting component, and the press-fitting component drives the memory stick to rotate, thereby achieving positioning accuracy between the memory stick and the memory slot, ensuring that the memory stick can be smoothly installed in the memory slot, reducing the risk of the memory stick being inserted off-center, and further reducing the probability of damage to the memory stick or the memory slot; further, since the structure of the memory slot is relatively simple, it is more efficient to use an image acquisition component to obtain the position of the memory slot.

[0048] The memory stick installation system provided by the present invention is provided with the above-mentioned memory stick installation device. Since the memory stick installation device has the above-mentioned technical effects, the memory stick installation system provided with the memory stick installation device should also have corresponding technical effects.

[0049] The memory stick installation method provided by the present invention controls the memory stick to be installed in the memory slot, and when the memory stick moves to a first preset position in the memory slot, obtains a first pressure value borne by the memory stick, the first pressure value being a pressure value applied to the memory stick by a pressure block or other components, and determines whether the first pressure value is greater than a first threshold upper limit. When the first pressure value is greater than the first threshold upper limit, it indicates that the installation position of the memory stick is deviated and has not been successfully installed in the memory slot. At this time, the memory stick can be controlled to stop moving, thereby reducing the probability of damage to the memory stick or the memory slot; when the first pressure value is less than or equal to the first threshold upper limit, it indicates that the memory stick is not successfully installed in the memory slot. It means that there is no obstacle during the installation of the memory stick. At this time, the memory stick can continue to be pushed toward the second preset position, that is, the memory stick can be pushed toward the bottom of the memory slot. When the memory stick moves to the second preset position, by detecting the pressure value that the memory stick is borne at the second preset position, it is determined whether the memory stick is installed in place. At this time, the preset pressure value can be selected in the second threshold value. When the second pressure value is greater than the preset pressure value in the second threshold value, it means that the memory stick is installed in place. At this time, the memory stick can be controlled to stop moving, and the installation process of the memory stick can be completed. The installation of the memory stick is reliable, reducing the damage to the memory stick or the memory slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 The present invention is a schematic structural diagram of a specific implementation of the memory stick installation device provided by the present invention.

[0052] Figure 2 for Figure 1 The schematic diagram of the structure of the press-fit assembly in the memory module installation device is shown.

[0053] Figure 3 for Figure 1 The schematic diagram of the structure of the press-fit assembly and the image acquisition assembly in the memory stick installation device is shown.

[0054] Figure 4 for Figure 1 A schematic diagram of the structure of a clamping assembly in a memory stick installation device is shown.

[0055] Figure 5 This is a structural diagram of the memory module when it is installed in the memory slot.

[0056] Figure 6 It is a schematic diagram of the structure of the material box and the carrier plate.

[0057] Figure 7 for Figure 6 Schematic diagram of the structure of the carrier board shown.

[0058] Figure 8 This is a schematic diagram of the control process of the memory stick installation device provided by the present invention.

[0059] Fig. 9 The present invention provides a schematic diagram of the positions of a cache turntable, a conveying mechanism, a carrier plate removal mechanism, and a memory stick transfer clamp in the memory stick installation device provided by the present invention.

[0060] Fig.10 for Fig. 9 A partial structural schematic diagram of a memory stick installation device is shown.

[0061] Fig.11 The present invention provides a flowchart of the method for installing a memory stick.

[0062] Reference numerals:

[0063] 100-memory bar; 200-memory slot; 300-material box; 400-carrier board; 401-carrier slot;

[0064] 1-pressing assembly; 11-pressing block; 12-power component; 13-gripping assembly; 131-gripping claw; 132-sliding block; 14-pressing support component; 2-pressure sensor; 3-controller; 4-elastic component; 41-limiting rod; 5-image acquisition assembly; 51-image acquisition bracket; 52-image acquisition component; 53-light source component; 54-light source bracket; 6-support body; 61-rotating component; 7-first material box position detection component; 8-cache turntable; 81-loading position; 82-cache position; 83-waiting unloading position; 84-unloading position; 9-conveying mechanism; 10-carrier plate disassembly mechanism; 20-memory bar transfer clamp. DETAILED DESCRIPTION

[0065] The core of the present invention is to provide a memory bar installation device, system and method, which can significantly improve the installation accuracy and efficiency of the memory bar and save costs.

[0066] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0067] In this implementation, please refer to Figure 1 and Figure 2 , the memory module installation device comprises:

[0068] The press-fitting assembly 1 comprises a pressing block 11 and a power component 12, wherein the pressing block 11 is mounted on the power component 12 and moves with the power component 12;

[0069] The pressure sensor 2 is used to obtain the first pressure value and the second pressure value of the pressure block 11 on the memory stick 100 when the memory stick 100 is installed in the first preset position and the second preset position in the memory slot 200; and the first preset position is close to the notch of the memory slot 200, and the second preset position is located at the bottom of the slot of the memory slot 200; the pressure sensor 2 can be arranged between the pressure block 11 and the power component 12, and the reaction force of the memory stick 100 on the pressure block 11 is transmitted to the power component 12 through the pressure block 11. The pressure sensor 2 can obtain the pressure between the pressure block 11 and the power component 12 by obtaining the pressure between the pressure block 11 and the power component 12; of course, the pressure sensor 2 can also be arranged at other positions, such as between the pressure block 11 and the memory stick 100;

[0070] The controller 3 is used to control the power component 12 to stop moving when the first pressure value is greater than the upper limit of the first threshold value, and when the first pressure value is less than or equal to the upper limit of the first threshold value, and the second pressure value is greater than a preset pressure value in the second threshold value.

[0071] Specifically, the press-fitting assembly 1 serves to push the memory stick 100 to move. The memory stick 100 can be obtained by a robot or manually moved to the memory stick 100. In actual operation, whether the memory stick 100 moves to the first preset position and the second preset position can be judged by the moving position of the pressing block 11. For example, the moving distance of the memory stick 100 can be judged according to the distance the pressing block 11 moves toward the memory slot 200. When the end face of the gold finger of the memory stick 100 is flush with the notch of the memory slot 200, it is used as the reference position; please refer to Figure 5, the distance from the notch of the memory slot 200 to the first preset position is h, the distance from the notch of the memory slot 200 to the second preset position is H, that is, the depth of the memory slot 200 is H, when the gold finger end face of the memory stick 100 is flush with the notch of the memory slot 200, the position of the pressure block 11 is the initial position, when the pressure block 11 moves downward from the initial position by a distance h, the pressure sensor 2 obtains the first pressure value, and when the pressure block 11 moves downward from the initial position by a distance H, the pressure sensor 2 obtains the second pressure value; wherein, since the position of the memory stick 100 no longer moves when it moves to the second preset position, that is, after the memory stick 100 moves to the bottom of the slot of the memory slot 200, the acquisition of the second pressure value is Continuously, when the memory stick 100 moves to the second preset position, the second pressure value will continue to increase, until the second pressure value is greater than the preset pressure value in the second threshold, it means that it is installed in place, and the power component 12 can be stopped from continuing to operate; or, when the memory stick 100 moves to the second preset position, the continuous pressure value applied to the memory stick 100 by the pressing block 11 for a preset time can be obtained, and the maximum pressure value can be recorded as the second pressure value; the second pressure value is within the second threshold, indicating that the pressure value of the memory stick 100 is not too large and is not easy to be damaged. When the second pressure value is greater than the upper limit of the second threshold, the memory stick 100 is easily damaged, indicating that the power component 12 has not stopped operating, and an alarm signal can be issued at this time to provide timely processing for the staff. It should be noted that the first threshold and the second threshold are both certain pressure ranges, the upper limit of the first threshold refers to the maximum value within the first threshold range, and the lower limit of the first threshold refers to the minimum value within the first threshold range; the upper limit of the second threshold refers to the maximum value within the second threshold range, and the lower limit of the second threshold refers to the minimum value within the second threshold range.

[0072] The memory stick installation device, through the setting of the press-fitting component 1, utilizes the interaction force between the pressing block 11 and the memory stick 100, and the pressure sensor 2 can be installed on the pressing block 11. In the process of the pressing block 11 pushing the memory stick 100 to be installed into the memory slot 200, friction will be generated between the memory slot 200 and the memory stick 100. In order to overcome the friction, the pressing block 11 needs to apply a certain force to the memory stick 100, and the pressure sensor 2 can obtain the pressure between the pressing block 11 and the memory stick 100; in order to ensure the stability of the pressure applied by the pressing block 11 to the memory stick 100, the moving speed of the pressing block 11 can be set, and the pressing block 11 can be controlled to push the memory stick 100 smoothly, so that the memory stick 100 moves to the first preset position and the second preset position in sequence after entering the memory slot 200, and then the first pressure value and the second pressure value of the pressing block 11 on the memory stick 100 are respectively obtained by the pressure sensor 2; and, through the setting of the controller 3, when the memory stick 100 moves to the first preset position, the pressure sensor 2 can obtain the first pressure value and the second pressure value of the pressing block 11 on the memory stick 100. position, and the first pressure value is greater than the upper limit of the first threshold, it indicates that the installation of the memory stick 100 is deviated, for example, the memory stick 100 is skewed relative to the memory slot 200. At this time, by controlling the power component 12 to stop the action, the pressure block 11 no longer applies pressure to the memory stick 100, thereby avoiding damage to the memory stick 100 or the memory slot 200; further, when the first pressure value is less than or equal to the upper limit of the first threshold, it indicates that the installation process of the memory stick 100 is not blocked. At this time, the power component 12 can be controlled to continue to push the pressure block 11 to move, and the pressure block 11 continues to push the memory stick 100 to move toward the second preset position, that is, push the memory stick 100 to move toward the bottom of the slot of the memory slot 200. When the memory stick 100 moves to the second preset position, by detecting the pressure value applied by the pressure block 11 to the memory stick 100, and when the second pressure value is greater than the preset pressure value in the second threshold, it indicates that the memory stick 100 is installed in place. At this time, the power component 12 can be controlled to stop the action to complete the installation process of the memory stick 100.

[0073] The memory stick installation device detects the pressure values ​​of the memory stick 100 at the first preset position and the second preset position respectively, and uses them as the basis for judging whether the memory stick 100 is inserted offset and whether the memory stick 100 is installed in place. This can effectively prevent the memory stick 100 or the memory slot 200 from being damaged due to the continued movement of the memory stick 100 when the memory stick 100 is inserted offset. The operation is convenient, the cost can be effectively saved, and the installation efficiency and automation level of the memory stick 100 are improved.

[0074] The memory stick installation device provided by the present invention uses a pressure sensor 2 to monitor the pressure values ​​at the beginning and end of the installation of the memory stick 100. The upper and lower limit values ​​of the first threshold and the second threshold can be manually set and adjusted according to the production operation conditions. Different pressure value formulas can be adapted for different motherboards or memory sticks 100, and the pressure value can be automatically called according to the production order configuration to achieve accurate monitoring and prevention. Of course, it can also be applied to the installation actions of other slot-type products. When the male head is inserted into the female head, the pressure sensor 2 can monitor its pressure conditions at multiple positions.

[0075] In some embodiments, please refer to Figure 3 , and also includes an elastic component 4, which is installed between the pressure block 11 and the power component 12. After the pressure block 11 contacts the memory stick 100, it can compress the elastic component 4; and the maximum compression distance of the elastic component 4 is equal to the distance between the notch of the memory slot 200 and the first preset position; specifically, when the elastic component 4 is provided, the end of the elastic component 4 away from the pressure block 11 can abut on the pressure sensor 2, that is, the elastic component 4 is provided between the pressure block 11 and the pressure sensor 2, and the pressure applied by the pressure block 11 to the memory stick 100 is determined by the reaction force of the elastic component 4. When the memory stick 100 is inserted off-center, the pressure block 11 continues to press down, the memory stick 100 supports the pressure block 11 and compresses the elastic component 4 to offset the downward pressing stroke, the deformation elastic force of the elastic component 4 gradually increases, and when it reaches the upper limit of the first threshold, the detection pressure value is out of range, the power component 12 is controlled to stop moving, and the device can issue an alarm prompt; when the memory stick 100 is accurately inserted into the slot, the elastic force of the elastic component 4 is greater than the friction force of the memory stick 100 entering the memory slot 200, the deformation of the elastic component 4 is slight, and the first pressure value detected by the pressure sensor 2 is the friction force when inserting into the memory slot 200; such a setting can avoid the memory stick 100 being damaged due to the continued downward pressing of the pressure block 11 when the memory stick 100 is inserted off-center; when the elastic component 4 is provided, and the installation position of the memory stick 100 is determined according to the position of the pressure block 11, it is necessary to increase the compression amount of the elastic component 4 in the stroke of the pressure block 11.

[0076] In some embodiments, please refer to Figure 2 A limiting rod 41 is provided on the pressing block 11, and one end of the limiting rod 41 away from the pressing block 11 is movably installed on the power component 12, and the elastic component 4 is sleeved on the limiting rod 41. The elastic component 4 can be a spring, and the limiting rod 41 plays a good limiting role to prevent the elastic component 4 from detaching.

[0077] In some embodiments, the distance between the first preset position and the slot is 10%-40% of the depth of the memory slot 200, that is, h=0.1 H~0.4 H. This value can be set as needed. For example, the distance between the first preset position and the slot can be one-third of the depth of the memory slot 200.

[0078] In some embodiments, please refer to Figure 3 and Figure 4 , the press-fit assembly 1 further comprises:

[0079] The clamping component 13 is used to obtain the memory stick 100 and move the memory stick 100 to the memory slot 200. The clamping component 13 can be a manipulator or a gripper; the controller 3 is connected to the clamping component 13, and is used to control the clamping component 13 to move the memory stick 100 to the notch of the memory slot 200; after the clamping component 13 clamps the memory stick 100, the upper surface of the memory stick 100 and the pressing block 11 just contact each other, and the pressing block 11 descends, and the pressing block 11 presses the memory stick 100 into the memory slot 200; before the pressing block 11 presses the memory stick 100 to the first preset position, since the memory stick 100 has no support when it just enters the notch of the memory slot 200, the clamping component 13 needs to clamp the memory stick 100 at this time. After the memory stick 100 successfully enters the first preset position, the clamping component 13 can release the memory stick 100 to reduce the impact of the pressure on the pressing block 11.

[0080] In some embodiments, the clamping assembly 13 includes at least two jaws 131 and a jaw driving component, the jaws 131 are installed on the jaw driving component, the jaws 131 are located on both sides of the pressure block 11, and the jaw driving component is used to drive the jaws 131 to move to grab or release the memory stick 100; specifically, the jaw driving component can be a cylinder, the cylinder drives the two jaws 131 to approach each other, so as to grab the memory stick 100, and the cylinder drives the two jaws 131 away from each other, so as to release the memory stick 100; further, the jaws 131 are provided with limit grooves for the two sides of the memory stick 100 to be clamped, so as to ensure the stability of the memory stick 100.

[0081] In some embodiments, the press-fitting assembly 1 also includes a press-fitting support component 14, and the power component 12, the pressure block 11 and the clamping jaw driving component are all installed on the press-fitting support component 14. Specifically, the pressure sensor 2 can also be arranged on the press-fitting support component 14, and the pressure sensor 2 is located between the press-fitting support component 14 and the pressure block 11 to ensure the detection accuracy of the pressure sensor 2, and the clamping jaw driving component is slidably connected to the press-fitting support component 14; a slide groove is provided on the press-fitting support component 14, and the clamping jaw driving component includes a slider 132 and a cylinder, and the slider 132 is movably arranged in the slide groove to facilitate the movement of the slider 132, guide the slider 132, and the slider 132 can move in a direction close to and away from the pressure block 11. Specifically, in order to ensure that the pressure of the pressure block 11 can act on the middle position of the memory stick 100, two sliders 132 can be provided, and the clamping jaws 131 are installed on the slider 132. The two sliders 132 are symmetrically arranged relative to the pressure block 11 to ensure the stability between the clamping jaws 131, the pressure block 11 and the memory stick 100.

[0082] In some embodiments, please refer to Figure 3 , also includes:

[0083] An image acquisition component 5, used to obtain the actual position of the memory slot 200;

[0084] The support body 6 and the rotating component 61, the image acquisition component 5 and the press-fitting component 1 are all installed on the support body 6, and the rotating component 61 is used to drive the support body 6 to move and rotate; specifically, the movement of the support body 6 can be achieved by controlling the movement of the rotating component 61;

[0085] The image acquisition component 5 and the rotating part 61 are both connected to the controller 3. The controller 3 is also used to compare the actual position of the memory slot 200 with the reference position of the memory slot 200, calculate the target angle that the support body 6 needs to rotate, and control the rotation of the rotating part 61 according to the target angle.

[0086] Specifically, the actual position of the memory slot 200 is obtained through the image acquisition component 5, and the actual position of the memory slot 200 is compared with the reference position of the memory slot 200 to calculate the target angle that the support body 6 needs to rotate, and the rotating component 61 is controlled to rotate according to the target angle. The support body 6 rotates, driving the press-fitting component 1, and the press-fitting component 1 drives the memory stick 100 to rotate, thereby achieving the positioning accuracy between the memory stick 100 and the memory slot 200, ensuring that the memory stick 100 can be smoothly installed in the memory slot 200, reducing the risk of the memory stick 100 being inserted off-center, and further reducing the probability of damage to the memory stick 100 or the memory slot 200; further, since the structure of the memory slot 200 is relatively simple, it is more efficient to use the image acquisition component 5 to obtain the position of the memory slot 200.

[0087] In some embodiments, the image acquisition component 5 includes an image acquisition bracket 51 and at least two image acquisition components 52. The image acquisition bracket 51 is arranged on a side of the support body 6 close to the press-fitting component 1, and the image acquisition component 52 is installed on the image acquisition bracket 51; the image acquisition bracket 51 can be a camera, and image acquisition is convenient and accurate; the image acquisition bracket 51 can facilitate the installation of the image acquisition component 52, and the image acquisition component 52 is detachably connected to the image acquisition bracket 51, which is convenient for the disassembly and maintenance of the image acquisition component 52; a dual camera is used to photograph and locate the memory slot 200 of the motherboard, and the offset value and rotation angle of the memory slot 200 are accurately and quickly identified; specifically, dual camera positioning is adopted, and a camera is used to photograph the edge feature points of the memory slot 200 on each side, and the coordinates are calculated after capturing the feature points, and compared with the original debugging coordinates, the offset and the offset angle are calculated.

[0088] In some embodiments, the image acquisition component 5 further includes a light source component 53 and a light source bracket 54. The light source bracket 54 is mounted on the side of the image acquisition bracket 51 away from the supporting body 6. The light source component 53 is mounted on the light source bracket 54. The light source component 53 is used to provide light for the image acquisition component 52. Specifically, two sets of image acquisition components 52 are used to photograph the positions on both sides of the memory slot 200, identify and correct the position of the memory stick 100 when it is inserted into the memory slot 200; and the light source component 53 is used to fill light for the image acquisition component 52 to improve the accuracy.

[0089] In some embodiments, it further comprises:

[0090] A first material box position detection component 7, used to obtain the actual position of the material box 300 on the carrier plate 400;

[0091] The first magazine position detection component 7 is connected to the controller 3 , and the controller 3 is further used to control the press-fitting assembly 1 to obtain the memory stick 100 according to the actual position of the magazine 300 on the carrier plate 400 .

[0092] Specifically, the first material box position detection component 7 can be set separately, for example, a transverse movement mechanism is set above the carrier plate 400, and the first material box position detection component 7 is installed on the transverse movement mechanism, equipped with a servo motor control, and independently designed; it can also be installed on the support body 6, so as to realize the detection of the material box 300, the removal and installation of the memory stick 100, and the position detection of the memory slot 200, which can be integrated on the same support body 6, which is conducive to simplifying the entire device, reducing the volume, and facilitating the layout. Further, the first material box position detection component 7 can detect at least two positions on the same side of the material box 300, according to the X / Y coordinates, and the X coordinate is detected. The action of the clamping jaw 131 to release the clamping has a certain range of compatibility with the offset of the Y coordinate.

[0093] In some embodiments, a bearing slot 401 for placing the material box 300 is provided on the carrier plate 400, and the first material box position detection component 7 is a laser sensor, and the first material box position detection component 7 is used to obtain the edge position of the bearing slot 401 and the edge position of the material box 300. Figure 6 As shown in the position A in the middle, the edge position of the material box 300 is as shown in the Figure 6As shown in the B position, the edge position of the bearing slot 401 and the edge position of the material box 300 should be on the same side, and at least two points should be selected for measurement accuracy; the controller 3 is used to determine the actual position of the material box 300 on the carrier 400 according to the edge position of the bearing slot 401 and the edge position of the material box 300. For example, a laser sensor is used in conjunction with a servo motor, and the laser sensor is fixed on a crossbar, and the crossbar can be controlled and moved by the servo motor. A carrier 400 with a material box 300 is selected as a reference plate, and the laser sensor is vertically downwardly irradiated onto the carrier 400; as shown in FIG. Figure 6 As shown, when the laser sensor irradiates the inner edge A position of the carrier 400, the program records the laser sensor position data at this time as the first reference value, and records the laser sensor feedback value as the first feedback value; when the laser sensor reaches the outer upper edge B position of the material box 300, the reflection value received by the laser sensor changes due to the height change, and the program records the laser sensor position data at this time as the second reference value, and the laser sensor feedback value is the second feedback value; the reference position of the material box 300 on the carrier 400 on the reference plate = the second reference value - the first reference value; the reference plate is used for debugging when the debugging clamping component 13 grabs the memory bar 100 in the material box 300; when the memory bar installation device is running, the laser sensor reaches the first reference value position, that is, the laser sensor reaches the inner edge A position of the carrier 400, triggering the program to start counting, and the laser sensor starts to move to the outer upper edge of the material box 300, that is, position B, until the laser sensor feedback value reaches the second feedback value, at which time the program records the laser sensor position as the first detection value. The program can calculate the offset value of the entire material box 300 on the carrier 400 = (first detection value - first reference value) - (second reference value - first reference value). When the clamping claw 131 in the clamping component 13 clamps the memory stick 100 from the material box 300, when the program calls the reference board debugging, the clamping claw 131 clamps the position data of each memory stick 100, and adds the offset value to obtain the actual position data of the memory stick 100, so as to achieve the correction effect. The laser sensor detects the different reflection values ​​of objects at different heights, and cooperates with the movement stroke of the mechanism controlled by the servo motor to realize the detection of the offset value of the material box 300 on the carrier 400, which can quickly and effectively solve the problem of inaccurate clamping of the memory stick 100 caused by the size deviation of multiple types of material boxes 300.

[0094] Specifically, in a specific embodiment, the power component 12 drives the pressing block 11 to rise and fall, and the power component 12 is connected to the press-fitting support component 14, and the press-fitting support component 14 is installed with a clamping claw driving component and a pressure sensor 2; two sliders 132 can be set on the clamping claw driving component, and each slider 132 is respectively connected to a clamping claw 131 for clamping the memory stick 100; the pressure sensor 2 is connected to the pressing block 11, and when the clamping claw 131 clamps the memory stick 100, the upper surface of the memory stick 100 and the pressing block 11 just contact, and when the power component 12 is pushed along the Z axis, the pressing block 11 presses the memory stick 100 to the memory slot 200; two sets of image acquisition components 52 are designed on the support body 6 to shoot the two sides of the memory slot 200, identify and correct the position of the memory stick 100 when it is inserted into the memory slot 200; the camera light source provides fill light for the camera;

[0095] After the controller 3 receives the actual position data of the material box 300 from the device control system, it moves to the top of the first memory stick 100 of the material box 300, the power component 12 is actuated, the cylinder shaft extends, the clamping claws 131 descend and are located on both sides of the memory stick 100, the clamping claw driving component is actuated, and the clamping claws 131 clamp the memory stick 100; the power component 12 drives the press-fitting support component 14 to rise along the Z axis, drives the memory stick 100 to rise, and then rotates to the position of the first memory slot 200 on the mainboard, and the dual cameras are respectively located directly above the hippocampus buckle of the memory slot 200, and respectively photograph the two sides of the memory slot 200, and through the visual module in the controller 3, the center position (X1, Y1) and (X2, Y2) data of the two short sides of the memory slot 200 are respectively found, and compared with the original debugging position of the memory slot 200, the offsets of the X axis, Y axis and the center rotation angle R are calculated; the visual module sends the offset values ​​of the X, Y and R axes to the controller 3, and the controller 3 calculates the actual position data of the memory slot 200 after superimposing the offset values ​​on the original debugging position data.

[0096] The controller 3 moves and rotates the memory stick 100 on the clamp 131 to align with the memory slot 200, controls the power component 12 to drive the press-fit support component 14 to descend along the Z axis, and when the memory stick 100 is just inserted into the memory slot 200, the memory stick 100 and the inner side of the memory slot 200 contact to generate a friction force, and the memory stick 100 is forced to move slightly upward, causing the pressure sensor 2 to monitor a slight force, which is recorded as the first pressure value by the program; after the memory stick 100 is inserted into the memory slot 200 for a stroke, the clamp 131 is released, and the memory stick 100 continues to be inserted into the memory slot 200 under the action of the pressure block 11, and the press-fit support component 14 continues to descend along the Z axis until the pressure block 11 completely presses the memory stick 100 into the memory slot 200, at which time the pressure sensor 2 monitors the continuous pressure value during the pressing, and the program records the maximum pressure value as the second pressure value; the upper and lower limit values ​​of the first pressure value and the second pressure value are set in the system program, and when the pressure value exceeds the limit value when the memory stick 100 is installed, the device alarms and shuts down.

[0097] In another specific embodiment, the first pressure value and the second pressure value can be obtained using two pressure sensors 2. One pressure sensor 2 is installed between the press-fitting support component 14 and the clamp driving component, acts on the movement of the clamp 131, and directly monitors the first pressure value. The other pressure sensor 2 is installed at the aforementioned position to monitor the second pressure value.

[0098] In some embodiments, the method further includes a cache turntable 8, which is installed at the front end of the memory bar installation device, and the cache turntable 8 is provided with a loading position 81, a cache position 82 and a unloading position 84 along its circumference; the cache turntable 8 is used to transport the memory bar 100 from the loading position 81 to the unloading position 84, and the memory bar installation device is also used to obtain the memory bar 100 located at the unloading position 84; specifically, a waiting unloading position 83 can also be set on the cache turntable 8, and the loading position 81, the cache position 82, the waiting unloading position 83, and the unloading position 84 are distributed in sequence along the circumference of the cache turntable 8; the picking and discharging of the memory bar 100 can be performed by different mechanisms, and the transition through the cache turntable 8 can ensure the continuity of the feeding. Furthermore, the clamping component 13 can also include a CCD (Charge-Coupled Device) camera; after the clamping claw 131 clamps the memory stick 100 from the cache turntable 8, the supporting body 6 moves to above the mainboard, and after the CCD camera takes a picture to locate, the pressing component 1 presses down to complete the installation of the memory stick 100.

[0099] In some embodiments, it also includes a conveying mechanism 9 and a carrier plate disassembling mechanism 10. The conveying mechanism 9 is used to convey a plurality of stacked carrier plates 400 into the carrier plate disassembling mechanism 10. A material box 300 is placed on the carrier plate 400. The carrier plate disassembling mechanism 10 is used to block and release the carrier plates 400 one by one. The conveying mechanism 9 can be a roller module, and the transportation of the carrier plates 400 is achieved by arranging a plurality of rollers in parallel.

[0100] In some embodiments, the plate disassembling mechanism 10 includes a plate disassembling mechanism claw and a plate bearing component, the plate bearing component is used to carry the stacked carriers 400, and the plate disassembling mechanism claw is used to lift the second layer and above of the carriers 400 from bottom to top; through the plate disassembling mechanism 10, multiple trays of carriers 400 can be disassembled when multiple trays of carriers 400 are fed at the same time, the plate disassembling mechanism 10 will lift the second tray and above layers from bottom to top, and release the first tray of carriers 400, thereby reducing the number of material handling times; the conveying mechanism 9 is used to dock with AGV (Automated Guided Vehicle) for transportation and connection, and also serves as a cache position 82 of the plate disassembling mechanism 10. When there is material in the plate disassembling mechanism 10, the material does not enter and is cached in the conveying mechanism 9.

[0101] In some embodiments, a memory stick transfer component is also included. The memory stick transfer component and the pressing component 1 are separately provided. The memory stick transfer component includes a memory stick transfer jaw 20 and a second material box position detection component. The second material box position detection component is used to obtain the actual position of the material box 300 on the carrier 400; the second material box position detection component is connected to the controller 3, and the controller 3 is also used to control the memory stick transfer jaw 20 to obtain the memory stick 100 according to the actual position of the material box 300 on the carrier 400; specifically, in the above method, the clamping of the memory stick 100 is achieved by a separately designed memory stick transfer jaw 20, the memory stick transfer jaw 20 can be a three-axis manipulator, the second material box position detection component can be a laser sensor, and the memory stick transfer component can also include a CCD camera; the three-axis manipulator is used to grab the memory, the laser sensor is used to detect the offset of the material box 300, and the CCD camera is used to determine the number and position of the memory sticks 100 in the material box 300.

[0102] In some embodiments, a barcode scanner is fixedly installed in the middle of the cache turntable 8, and four jigs for placing memory sticks 100 are designed on the cache turntable 8, which are respectively recorded as the loading position 81, the cache position 82, the unloading position 83, and the unloading position 84; after the memory stick transfer component clamps the memory stick 100 from the material box 300, the barcode scanner reads the barcode information of the memory stick 100 and stores it in the product file information; after reading the barcode, the memory stick transfer clamp 20 places the memory stick 100 into the jig of the cache turntable 8. After the placement is completed, the cache turntable 8 rotates 90 degrees, and the jig rotates to the cache position 8 2. When the jig rotates to the loading position 81, the memory stick transfer jaw 20 continues to take and discharge materials; when the memory stick 100 rotates to the unloading position 84, the jaw 131 in the press-fitting component 1 clamps the memory stick 100 from the jig of the cache turntable 8. After the memory stick 100 is taken away, the cache turntable 8 continues to rotate, and the memory stick transfer jaw 20 continues to take materials from the material box 300 and places them on the cache turntable 8; the jaw 131 in the press-fitting component 1 and the memory stick transfer jaw 20 work independently, and the design of the working cycle of the two is consistent, so that the same frequency operation can be achieved, there is no waiting time, and the work efficiency is improved.

[0103] In a specific embodiment, the material box 300 is placed on a carrier 400, and the automatic transport vehicle transports the carrier 400 to the memory stick installation device, and is connected to the loading roller of the memory stick installation device, that is, the conveying mechanism 9, and the carrier 400 is transported to the installation equipment. The laser sensor positions and corrects the material box 300 on the carrier 400, so that the clamp 131 in the press-fitting assembly 1 or the memory stick transfer clamp 20 can quickly and accurately grab each memory stick 100 in the material box 300.

[0104] In addition to the above-mentioned memory stick installation device, the present invention also provides a memory stick installation system including the above-mentioned memory stick installation device. For other structures of the memory stick installation system, please refer to the relevant technology and will not be described in detail herein.

[0105] In addition to the above memory module installation device, the present invention also provides a memory module installation method. Fig.11 , the memory module installation method comprises the following steps:

[0106] Step S1: Control the memory stick 100 to be installed into the memory slot 200 and move to a first preset position;

[0107] Step S2: obtaining a first pressure value borne by the memory stick 100 when the memory stick 100 is located at the first preset position, and controlling the memory stick 100 to stop moving when the first pressure value is greater than a first threshold upper limit;

[0108] Step S3: When the first pressure value is less than or equal to the upper limit of the first threshold, control the memory stick 100 to continue to be installed in the memory slot 200 and move to the second preset position;

[0109] Step S4: obtaining a second pressure value borne by the memory stick 100 when the memory stick 100 is located at the second preset position, and controlling the memory stick 100 to stop moving when the second pressure value is greater than a preset pressure value in the second threshold.

[0110] The memory stick installation method controls the memory stick 100 to be installed in the memory slot 200, and when the memory stick 100 moves to a first preset position in the memory slot 200, obtains a first pressure value borne by the memory stick 100, the first pressure value being a pressure value applied to the memory stick 100 by the pressure block 11 or other components, and determines whether the first pressure value is greater than a first threshold upper limit. When the first pressure value is greater than the first threshold upper limit, it indicates that the installation position of the memory stick 100 is deviated and has not been successfully installed in the memory slot 200. At this time, the memory stick 100 can be controlled to stop moving, thereby reducing the probability of damage to the memory stick 100 or the memory slot 200. When the first pressure value is less than the first threshold upper limit, the memory stick 100 is stopped. When it is equal to the upper limit of the first threshold, it means that there is no obstacle in the installation process of the memory stick 100. At this time, the memory stick 100 can continue to be pushed toward the second preset position, that is, the memory stick 100 is pushed toward the bottom of the memory slot 200. When the memory stick 100 moves to the second preset position, by detecting the pressure value that the memory stick 100 is subjected to at the second preset position, it is determined whether the memory stick 100 is installed in place. At this time, the preset pressure value can be selected in the second threshold. When the second pressure value is greater than the preset pressure value in the second threshold, it means that the memory stick 100 is installed in place. At this time, the memory stick 100 can be controlled to stop moving, and the installation process of the memory stick 100 can be completed.

[0111] In some implementations, after obtaining the second pressure value borne by the memory stick 100 when the memory stick 100 is located at the second preset position, the method further includes:

[0112] Step S41: when the second pressure value is less than or equal to the second lower threshold value, control the memory bar 100 to stop moving.

[0113] In some implementations, after obtaining the first pressure value borne by the memory stick 100 when the memory stick 100 is located at the first preset position, the method further includes:

[0114] Step S21: When the first pressure value is greater than the first upper threshold value, an alarm signal is issued;

[0115] After obtaining the second pressure value borne by the memory stick 100 when the memory stick 100 is located at the second preset position, the method further includes:

[0116] Step S42: When the first pressure value is less than or equal to the first threshold lower limit, and the second pressure value is less than or equal to the second threshold lower limit, an alarm signal is issued.

[0117] Specifically, when the memory stick 100 needs to be installed, the installation positions of materials such as the CPU (Central Processing Unit) and the memory stick 100 are automatically calculated first, and the installation rules are maintained in advance. One CPU is configured with one memory stick 100 or multiple memory sticks 100 installation rules, and two CPUs are configured with multiple memory sticks 100 installation rules, and the positions of the memory slots 200 are uniquely named. According to the number of memory sticks 100, the memory slots 200 into which the memory sticks 100 need to be inserted are automatically matched, and the MES (Manufacturing Execution System) sends the point names of the memory slots 200 to be installed to the controller 3 of the memory stick installation device. After the gripper 131 grabs the memory stick 100 from the material box 300, it is installed in sequence according to the positions of the received memory slots 200.

[0118] The memory stick installation device, system and method provided by the present invention can improve the intelligence level of automatic installation of the memory stick 100, improve the automatic installation efficiency of the memory stick 100, and effectively prevent damage caused by offset errors during the installation of the memory stick 100.

[0119] The memory stick installation device, system and method provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A memory module installation device, characterized in that: include: A press-fitting assembly (1), the press-fitting assembly (1) comprising a press block (11) and a power component (12), the press block (11) being mounted on the power component (12) and moving along with the power component (12); A pressure sensor (2) is used to respectively obtain a first pressure value and a second pressure value of the pressure block (11) on the memory bar (100) when the memory bar (100) is inserted into a first preset position and a second preset position in the memory slot (200); the first preset position is close to the notch of the memory slot (200), and the second preset position is located at the bottom of the slot of the memory slot (200); The controller (3) is used to control the power component (12) to stop moving when the first pressure value is greater than a first threshold upper limit, and when the first pressure value is less than or equal to the first threshold upper limit, and when the second pressure value is greater than a preset pressure value in a second threshold.

2. The memory module installation device according to claim 1, characterized in that: It also comprises an elastic component (4), wherein the elastic component (4) is installed between the pressing block (11) and the power component (12), and after the pressing block (11) contacts the memory bar (100), it is capable of compressing the elastic component (4); and the maximum compression distance of the elastic component (4) is equal to the distance between the notch of the memory slot (200) and the first preset position.

3. The memory module installation device according to claim 2, characterized in that: The pressing block (11) is provided with a limiting rod (41), one end of the limiting rod (41) facing away from the pressing block (11) is movably mounted on the power component (12), and the elastic component (4) is sleeved on the limiting rod (41).

4. The memory module installation device according to claim 1, characterized in that: The distance between the first preset position and the notch is 10%-40% of the depth of the memory slot (200).

5. The memory module installation device according to claim 1, characterized in that: The press-fit assembly (1) further comprises: The gripping component (13) is used to obtain the memory bar (100) and move the memory bar (100) to the memory slot (200); the controller (3) is connected to the gripping component (13) and is used to control the gripping component (13) to move the memory bar (100) to the notch of the memory slot (200).

6. The memory module installation device according to claim 5, characterized in that: The clamping assembly (13) comprises at least two clamping jaws (131) and a clamping jaw driving component, wherein the clamping jaws (131) are mounted on the clamping jaw driving component, and the clamping jaws (131) are located on both sides of the pressing block (11), and the clamping jaw driving component is used to drive the clamping jaws (131) to move so as to grasp or release the memory stick (100).

7. The memory module installation device according to claim 6, characterized in that: The press-fitting assembly (1) further comprises a press-fitting support component (14), the power component (12), the pressing block (11) and the clamping jaw driving component are all mounted on the press-fitting support component (14), and the clamping jaw driving component is slidably connected to the press-fitting support component (14); a slide groove is provided on the press-fitting support component (14), and the clamping jaw driving component comprises a slider (132) and a cylinder; the slider (132) is movably arranged in the slide groove, and the slider (132) can move in a direction close to or away from the pressing block (11).

8. The memory module installation device according to any one of claims 1 to 7, characterized in that: Also includes: An image acquisition component (5) for acquiring the actual position of the memory slot (200); A supporting body (6) and a rotating component (61), the image acquisition component (5) and the press-fitting component (1) are both mounted on the supporting body (6), and the rotating component (61) is used to drive the supporting body (6) to move and rotate; The image acquisition component (5) and the rotating component (61) are both connected to the controller (3); the controller (3) is further configured to compare the actual position of the memory slot (200) with the reference position of the memory slot (200), calculate the target angle at which the support body (6) needs to rotate, and control the rotating component (61) to rotate according to the target angle.

9. The memory module installation device according to claim 8, characterized in that: The image acquisition assembly (5) comprises an image acquisition bracket (51) and at least two image acquisition components (52); the image acquisition bracket (51) is arranged on a side of the support body (6) close to the press-fit assembly (1); and the image acquisition components (52) are mounted on the image acquisition bracket (51).

10. The memory module installation device according to claim 9, characterized in that: The image acquisition component (5) further comprises a light source component (53) and a light source bracket (54); the light source bracket (54) is mounted on a side of the image acquisition bracket (51) facing away from the supporting body (6); the light source component (53) is mounted on the light source bracket (54); and the light source component (53) is used to provide illumination for the image acquisition component (52).

11. The memory stick installation device according to any one of claims 1 to 7, characterized in that: Also includes: A first material box position detection component (7) used for acquiring the actual position of the material box (300) on the carrier plate (400); The first material box position detection component (7) is connected to the controller (3), and the controller (3) is further used to control the press-fitting component (1) to obtain the memory bar (100) according to the actual position of the material box (300) on the carrier plate (400).

12. The memory module installation device according to claim 11, characterized in that: The carrier plate (400) is provided with a bearing groove (401) for placing the material box (300); the first material box position detection component (7) is a laser sensor, and the first material box position detection component (7) is used to obtain the edge position of the bearing groove (401) and the edge position of the material box (300); the controller (3) is used to determine the actual position of the material box (300) on the carrier plate (400) according to the edge position of the bearing groove (401) and the edge position of the material box (300).

13. The memory module installation device according to any one of claims 1 to 7, characterized in that: It also includes a cache turntable (8), the cache turntable (8) being installed at the front end of the memory bar installation device, the cache turntable (8) being provided with a loading position (81), a cache position (82) and a unloading position (84) along its circumference; the cache turntable (8) is used to transport the memory bar (100) from the loading position (81) to the unloading position (84), and the memory bar installation device is also used to obtain the memory bar (100) located at the unloading position (84).

14. The memory stick installation device according to claim 13, characterized in that: It also comprises a conveying mechanism (9) and a carrier plate disassembling mechanism (10), wherein the conveying mechanism (9) is used to convey a plurality of stacked carrier plates (400) into the carrier plate disassembling mechanism (10), wherein a material box (300) is placed on the carrier plates (400), and the carrier plate disassembling mechanism (10) is used to block and release the carrier plates (400) one by one.

15. The memory module installation device according to claim 14, characterized in that: The plate disassembling mechanism (10) comprises a disassembling mechanism clamp and a plate bearing component, the plate bearing component is used to bear the stacked plates (400), and the disassembling mechanism clamp is used to lift the second layer and above of the plates (400) from bottom to top.

16. The memory module installation device according to claim 13, characterized in that: It also includes a memory bar transfer clamp (20) and a second material box position detection component, the second material box position detection component is used to obtain the actual position of the material box (300) on the carrier (400); the second material box position detection component is connected to the controller (3), and the controller (3) is further used to control the memory bar transfer clamp (20) to obtain the memory bar (100) according to the actual position of the material box (300) on the carrier (400).

17. A memory bar installation system, comprising a memory bar installation device, characterized in that: The memory stick installation device is the memory stick installation device according to any one of claims 1 to 16.

18. A method for installing a memory module, characterized in that: The following steps are involved: Controlling the memory bar (100) to be installed in the memory slot (200) and moved to a first preset position; Acquiring a first pressure value borne by the memory bar (100) when the memory bar (100) is located at the first preset position, and controlling the memory bar (100) to stop moving when the first pressure value is greater than a first upper threshold value; When the first pressure value is less than or equal to the first threshold upper limit, controlling the memory bar (100) to continue to be installed in the memory slot (200) and to move to a second preset position; A second pressure value borne by the memory bar (100) when the memory bar (100) is located at the second preset position is obtained, and when the second pressure value is greater than a preset pressure value in a second threshold, the memory bar (100) is controlled to stop moving.

19. The memory module installation method according to claim 18, characterized in that: After obtaining the second pressure value borne by the memory bar (100) when the memory bar (100) is located at the second preset position, the method further includes: When the second pressure value is less than or equal to a second lower threshold value, the memory bar (100) is controlled to stop moving.

20. The memory module installation method according to claim 19, characterized in that: After obtaining the first pressure value borne by the memory bar (100) when the memory bar (100) is located at the first preset position, the method further comprises: When the first pressure value is greater than a first threshold upper limit, an alarm signal is issued; After obtaining the second pressure value borne by the memory bar (100) when the memory bar (100) is located at the second preset position, the method further comprises: When the first pressure value is less than or equal to a first threshold lower limit, and the second pressure value is less than or equal to a second threshold lower limit, an alarm signal is issued.

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