Substrate pressing device suitable for laminating process

Abstract

The invention relates to the technical field of display panels, in particular to a substrate pressing device suitable for a laminating process. Comprising a rack, a mounting rack, a driving module, guide modules, a vacuum chuck, a curing module and a separating module, the mounting rack is mounted on the rack, the driving module is mounted at the top of the rack and connected with the mounting rack, the guide modules are mounted on two sides of the mounting rack and fixedly connected with the rack, and the vacuum chuck is fixedly mounted at the bottom of the mounting rack. The curing module is mounted on the mounting frame above the vacuum chuck, and the separation modules are symmetrically mounted on the mounting frame above the curing module. The device has the advantages that the working precision is improved, the curing work is continuously completed, errors are reduced, the universality is good and the device adapts to the liquid environment, and the problems that existing substrate assembling equipment is low in working precision, discontinuous in curing work, large in error, poor in universality and difficult to work in the liquid environment are solved; and the transfer and processing requirements of the substrate are met.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a substrate pressing device suitable for a bonding process. Background Art

[0002] With the development of science and technology, more and more products are equipped with electronic screens to display visual information to users and enhance the usability of products. After removing the external protective glass and touch screen, the main body of the electronic screen is a display panel with display function. It is usually a multi-layer structure, and the functional substrates of each layer need to be produced and assembled separately. Therefore, during production and manufacturing, the substrates need to be assembled and moved so that the substrates of each layer can be pressed and bonded in a specific area on the workstation.

[0003] The substrate pressing device in the prior art usually only provides the basic function of moving the substrate. When the substrate needs to be subjected to common curing treatment, other equipment on the workstation needs to be used for subsequent processing. In the process of exiting the pressing device and switching to other equipment, the substrate is prone to additional movement deviation due to vibration, thereby reducing the process accuracy.

[0004] In addition, the existing substrate pressing and bonding work usually operates under room temperature, but some new processes have very low temperature requirements and need to work in a liquid environment filled with dielectric liquid. The structure of the existing equipment is difficult to cope with, especially when the transfer work is completed and the assembly device is retracted, the substrate in the liquid is easily adsorbed on the assembly device under the action of air pressure and is difficult to detach normally, causing the substrate product to deviate and be damaged under the action of tension. Therefore, a new substrate pressing device is needed to solve the above-mentioned shortcomings. Summary of the invention

[0005] In view of the defects of the prior art, the purpose of this application is to provide a substrate pressing device suitable for the bonding process, aiming to solve the technical problems of the existing substrate pressing device, such as low working accuracy, discontinuous curing work, increased error, poor versatility and difficulty in working in a liquid environment.

[0006] To achieve the above-mentioned purpose, the present application provides a substrate pressing device suitable for a bonding process, including a frame, a mounting frame, a driving module, a guide module, a vacuum suction cup, a curing module and a detachment module. The frame is provided with a mounting frame, the top of the frame is provided with a driving module, the driving module extends to the bottom of the frame and is connected to the mounting frame, the driving module is used to drive the mounting frame to move up and down, guide modules are provided on both sides of the mounting frame, the guide module is fixedly connected to the frame so that the mounting frame can slide up and down, a vacuum suction cup is fixedly provided at the bottom of the mounting frame, a curing module is provided on the mounting frame above the vacuum suction cup, and a detachment module is symmetrically provided on the mounting frame above the curing module.

[0007] In some embodiments, the mounting frame includes a first frame body, a second frame body, a fine-tuning cylinder and an assembly seat, the first frame body and the second frame body are rectangular frames, the second frame body is slidably mounted on the first frame body, a fine-tuning cylinder is mounted between the second frame body and the first frame body, the cylinder barrel of the fine-tuning cylinder is connected to the second frame body, the piston rod of the fine-tuning cylinder is connected to the first frame body, the fine-tuning cylinder is used to drive the first frame body to move up and down, and an assembly seat is fixedly mounted on the bottom of the first frame body.

[0008] In some embodiments, the driving module includes a motor bracket, a driving motor, a reducer, a transmission screw and a transmission nut. The motor bracket is equipped with a driving motor, and the driving motor is connected to the reducer. The reducer is used to reduce speed and increase torque for the driving motor. A transmission screw is arranged below the motor bracket. The end of the transmission screw is fixedly connected to the output shaft of the reducer through a coupling. A transmission nut is threadedly installed on the transmission screw. The transmission screw is used to convert the rotation of the driving motor into axial movement of the transmission nut.

[0009] In some embodiments, the guide module includes a guide plate, a slider and a guide rail, the slider is symmetrically mounted on the guide plate, and the guide rail is slidably mounted on the slider.

[0010] In some embodiments, a plurality of air pipe joints are arranged in pairs on the side of the vacuum suction cup, and the air pipe joints are used to connect a vacuum pump. A plurality of air holes are arranged at the bottom of the vacuum suction cup, and the air holes are used to generate negative pressure to adsorb the substrate. An air channel is also arranged inside the vacuum suction cup to connect the air holes with the air pipe joints.

[0011] In some embodiments, the curing module includes a fixed frame, a lifting cylinder, a movable frame, a clamping block and an ultraviolet lamp. The movable frame is installed on the fixed frame, and a lifting cylinder is installed between the movable frame and the fixed frame. The cylinder barrel of the lifting cylinder is connected to the fixed frame, and the piston rod of the lifting cylinder is connected to the movable frame. The lifting cylinder is used to drive the movable frame to move up and down. The clamping blocks are symmetrically installed on the movable frame through butterfly screws, and the ultraviolet lamp is clamped and installed on the clamping blocks.

[0012] In some embodiments, the movable frame is symmetrically provided with adjustment slots, and a plurality of positioning holes are provided in the adjustment slots.

[0013] In some embodiments, the detachment module includes a mounting plate, an adjustment frame, an adjusting bolt and a micro cylinder. The mounting plate is fixedly installed with an adjustment frame at intervals, the adjusting frame is equipped with an adjusting bolt, and a micro cylinder is fixedly installed at the bottom of the adjusting bolt. The adjusting bolt is used to adjust the height of the micro cylinder, and the micro cylinder is used to push the substrate away at the end of assembly.

[0014] In some embodiments, the mounting plate is provided with an avoidance groove to avoid interference with the curing module.

[0015] In some embodiments, the mounting frame is further provided with a distance measuring sensor, and the distance measuring sensor is used to measure the height of the mounting frame.

[0016] The beneficial effects of the technical solution provided by this application include:

[0017] The embodiment of the present application provides a substrate pressing device suitable for very low temperature liquid environments, which has the advantages of improving working accuracy, continuously completing curing work, reducing errors, good versatility and adaptability to liquid environments. It solves the problems of existing substrate assembly equipment such as low working accuracy, discontinuous curing work, increased errors, poor versatility and difficulty in working in liquid environments, and meets the needs of substrate transfer and processing.

[0018] The present application drives the mounting frame to move up and down through a driving module, and then uses a fine-tuning cylinder to further adjust the height of the first frame body, thereby improving the accuracy of the height position, so that the loaded substrate can be accurately moved to the predetermined position. The present application installs a curing module on the mounting frame above the vacuum suction cup. When the substrate is moved and assembled in place, the lifting cylinder drives the movable frame to move downward, so that the ultraviolet lamp approaches and irradiates the substrate for curing without switching to other tools and equipment, thereby realizing continuous assembly movement and light curing work.

[0019] By setting a distance measuring sensor on the mounting frame and using a grating scale sensor to provide feedback on the moving distance, the working error can be effectively reduced. In addition, the present application symmetrically installs a separation module on the mounting frame. After the assembly and curing work is completed, the substrate is pushed downward by a micro cylinder to prevent the substrate from continuing to be adsorbed on the vacuum suction cup, thereby achieving normal operation in the liquid environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional structural schematic diagram of the present application;

[0021] Figure 2 This application Figure 1 A local enlarged schematic diagram of the middle A;

[0022] Figure 3 It is a three-dimensional structural schematic diagram of the mounting frame of the present application;

[0023] Figure 4 is a schematic diagram of the three-dimensional structure of the driving module of the present application;

[0024] Figure 5 It is a three-dimensional structural schematic diagram of the guide module of the present application;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the vacuum suction cup of the present application;

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the curing module of the present application;

[0027] Figure 8 It is a three-dimensional structural schematic diagram of the movable frame of the present application;

[0028] Fig. 9 It is a three-dimensional structural schematic diagram of the separation module of the present application;

[0029] Fig.10 It is a three-dimensional structural schematic diagram of the adjusting bolt of the present application.

[0030] In the figure:

[0031] 1. Rack,

[0032] 2. Mounting frame, 21. First frame body, 22. Second frame body, 23. Fine adjustment cylinder, 24. Assembly seat, 25. Distance sensor, 26. Slide rail, 27. First avoidance hole,

[0033] 3. Drive module, 31. Motor bracket, 32. Drive motor, 33. Reducer, 34. Drive screw, 35. Drive nut, 36. Coupling,

[0034] 4. Guide module, 41. Guide plate, 42. Grating ruler sensor, 43. Slider, 44. Guide rail,

[0035] 5. Vacuum suction cup, 51. Air pipe joint, 52. Air hole, 53. Second avoidance hole,

[0036] 6. Curing module, 61. Fixed frame, 62. Lifting cylinder, 63. Movable frame, 64. Clamping block, 65. UV lamp, 66. Adjustment slot, 67. Positioning hole, 68. Butterfly screw,

[0037] 7. Disengagement module, 71. Mounting plate, 72. Adjustment bracket, 73. Adjustment bolt, 74. Micro cylinder, 75. Avoidance groove, 76. Adjustment screw, 77. Adjustment nut. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0039] The embodiment of the present application provides a substrate pressing device suitable for a bonding process, which utilizes a vacuum suction cup 5 to absorb the substrate to be assembled, and then drives the mounting frame 2 and the substrate to move up and down under the action of the driving module 3, adopts the curing module 6 to continuously perform the curing work, and pushes the substrate downward through the disengagement module 7 after the work is completed, thereby solving the problems existing in the prior art of low working accuracy, discontinuous curing work, increased error, poor versatility and difficulty in working in a liquid environment.

[0040] like Figure 1 As shown, a substrate pressing device suitable for a bonding process includes a frame 1, a mounting frame 2, a driving module 3, a guide module 4, a vacuum suction cup 5, a curing module 6 and a separation module 7. The frame 1 is a gantry frame for providing support and installation foundation. The mounting frame 2 is installed on the frame 1. Specifically, as shown in Figure 3 As shown, the mounting frame 2 includes a first frame body 21, a second frame body 22, a fine-tuning cylinder 23 and an assembly seat 24. The first frame body 21 and the second frame body 22 are rectangular frames. The second frame body 22 is slidably mounted on the first frame body 21. The assembly seat 24 is fixedly mounted on the bottom of the first frame body 21. The assembly seat 24 is a combination of a variable diameter cylindrical body and a stepped rectangular body, and is used to provide an assembly basis.

[0041] As a preferred implementation of the present application, Figure 3 As shown, a fine-tuning cylinder 23 is installed between the second frame body 22 and the first frame body 21, the cylinder barrel of the fine-tuning cylinder 23 is connected to the second frame body 22, and the piston rod of the fine-tuning cylinder 23 is connected to the first frame body 21. The fine-tuning cylinder 23 is used to drive the first frame body 21 to move up and down relative to the second frame body 22, so that when the second frame body 22 is adjusted to a predetermined position, the height of the first frame body 21 can be further finely adjusted. Furthermore, a slide rail 26 is installed between the second frame body 22 and the first frame body 21, which is used to enable the first frame body 21 to move smoothly along the second frame body 22.

[0042] like Figure 2 As shown, the mounting frame 2 is also provided with a distance sensor 25. Optionally, the distance sensor 25 uses laser distance measurement to measure the height of the mounting frame 2 so as to determine whether the mounting frame 2 has reached a predetermined position.

[0043] The top of the rack 1 is provided with a driving module 3, which extends to the bottom of the rack 1 and is connected to the mounting frame 2. The driving module 3 is used to drive the mounting frame 2 to move up and down as a whole. Specifically, Figure 4As shown, the driving module 3 includes a motor bracket 31, a driving motor 32, a reducer 33, a transmission screw 34 and a transmission nut 35. The motor bracket 31 is fixedly mounted on the frame 1. The motor bracket 31 is equipped with a driving motor 32. The driving motor 32 is connected to the reducer 33. The reducer 33 is used to reduce the speed and increase the torque of the driving motor 32.

[0044] A transmission screw 34 is arranged below the motor bracket 31. The end of the transmission screw 34 is fixedly connected to the output shaft of the reducer 33 through a coupling 36, so that the drive motor 32 drives the transmission screw 34 to rotate. A transmission nut 35 is threadedly installed on the transmission screw 34. The transmission screw 34 is used to convert the rotation of the drive motor 32 into axial movement of the transmission nut 35. The transmission nut 35 is fixedly connected to the second frame body 22. The advantage of this arrangement is that the drive motor 32 drives the transmission nut 35 and the mounting frame 2 to move.

[0045] Guide modules 4 are installed on both sides of the mounting frame 2, and the guide modules 4 are fixedly connected to the frame 1 so that the mounting frame 2 can slide up and down. Specifically, Figure 5 As shown, the guide module 4 includes a guide plate 41, a slider 43 and a guide rail 44. The end face of the guide plate 41 is fixedly connected to the second frame body 22. The slider 43 is symmetrically mounted on the guide plate 41. The guide rail 44 is slidably mounted on the slider 43. The guide rail 44 is fixedly connected to the frame 1. Further, the guide rail 44 is an air-floating guide rail, which is used to reduce the friction resistance when the slider 43 slides on the guide rail 44. Optionally, as a feasible embodiment of the present application, a displacement sensor 42 is fixedly mounted on one side of the guide plate 41. The displacement sensor 42 is used to measure the displacement data of the guide plate 41 relative to the frame 1. The displacement sensor 42 includes a grating scale sensor and a magnetic scale sensor. When the grating scale sensor is used, the reading head of the sensor is connected to the guide plate 41, and the main scale of the sensor is fixedly mounted on the frame 1. The movement accuracy of the mounting frame 2 is improved through closed-loop control.

[0046] A vacuum suction cup 5 is fixedly mounted on the bottom of the mounting frame 2. The vacuum suction cup 5 is fixedly connected to the assembly seat 24 so as to move synchronously with the mounting frame 2. Specifically, Figure 6 As shown, a plurality of air pipe joints 51 are arranged in pairs on the side of the vacuum suction cup 5, and the air pipe joints 51 are used to connect a vacuum pump. A plurality of air holes 52 are arranged at the bottom of the vacuum suction cup 5, and the air holes 52 are used to generate negative pressure to adsorb the substrate. An air channel is also arranged inside the vacuum suction cup 5 to connect the air holes 52 with the air pipe joints 51.

[0047] A curing module 6 is mounted on the mounting frame 2 above the vacuum suction cup 5. Specifically, Figure 7As shown, the curing module 6 includes a fixed frame 61, a lifting cylinder 62, a movable frame 63, a clamping block 64 and an ultraviolet lamp 65. The fixed frame 61 is installed on the assembly seat 24, and the movable frame 63 is installed on the fixed frame 61. A lifting cylinder 62 is installed between the movable frame 63 and the fixed frame 61. The cylinder barrel of the lifting cylinder 62 is connected to the fixed frame 61, and the piston rod of the lifting cylinder 62 is connected to the movable frame 63. The lifting cylinder 62 is used to drive the movable frame 63 to move up and down. The clamping blocks 64 are symmetrically installed on the movable frame 63 through butterfly screws 68. The advantage of setting the butterfly screws 68 is that it is convenient to operate with bare hands so as to quickly install the clamping blocks 64. An ultraviolet lamp 65 is installed on the clamping block 64. The ultraviolet lamp 65 is used to emit ultraviolet rays to irradiate the glue between the substrates to complete curing.

[0048] As a preferred implementation of the present application, Figure 8 As shown, the movable frame 63 is symmetrically provided with adjustment slots 66, and a plurality of positioning holes 67 are provided in the adjustment slots 66. The positioning holes 67 are used to install butterfly screws 68. The advantage of this arrangement is that it can adapt to substrates of different sizes so as to adjust the position of the ultraviolet lamp 65 and solidify the corresponding points on the substrate. By rotating the butterfly screw 68 to remove the clamping block 64, and then sliding on the adjustment slot 66, the position of the clamping block 64 and the ultraviolet lamp 65 can be quickly adjusted, and then the butterfly screw 68 can be screwed into the corresponding positioning hole 67 again to achieve fixation, thereby improving the versatility of substrates of different sizes.

[0049] The mounting frame 2 above the curing module 6 is symmetrically provided with a separation module 7, specifically, Fig. 9 As shown, the disengagement module 7 includes a mounting plate 71, an adjustment frame 72, an adjustment bolt 73 and a micro cylinder 74. The mounting plate 71 is fixedly connected to the assembly seat 24. The mounting plate 71 is provided with an avoidance groove 75, which is used to avoid interference with the curing module 6. The mounting plate 71 is fixedly installed with an adjustment frame 72 at intervals, and the adjustment frame 72 is provided with an adjustment bolt 73. Further, as shown in FIG. Fig.10 As shown, the adjusting bolt 73 includes an adjusting screw 76 and a threaded adjusting nut 77. The extension length of the adjusting screw 76 can be controlled by rotating the adjusting screw 76. The adjusting nut 77 is also provided with a groove that matches the adjustment frame 72 to limit and fix the adjusting bolt 73.

[0050] As a preferred embodiment of the present application, a micro cylinder 74 is fixedly installed at the bottom of the adjusting bolt 73, and the adjusting bolt 73 is used to adjust the height of the micro cylinder 74. The micro cylinder 74 is used to push the substrate away at the end of assembly. The advantage of this arrangement is that when the substrate is in a liquid environment, when the movement and assembly work are completed, even if the vacuum suction cup 5 is closed, the substrate is likely to adhere to the bottom of the vacuum suction cup 5 under the action of air pressure, resulting in the substrate being easily pulled when the mounting frame 2 is retracted, thereby damaging the processed substrate. The present application utilizes the push of the micro cylinder 74 to correctly detach the substrate from the vacuum suction cup 5 to avoid damage and malfunction.

[0051] Furthermore, corresponding to the positions of the micro cylinder 74 and the ultraviolet lamp 65, the assembly seat 24 of the present application is also provided with a first avoidance hole 27, and the vacuum suction cup 5 is provided with a second avoidance hole 53. The second avoidance hole 53 and the first avoidance hole 27 are used to prevent the components from interfering with the micro cylinder 74 and the ultraviolet lamp 65.

[0052] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0053] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0054] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A substrate pressing device suitable for a bonding process, comprising a frame (1), a mounting frame (2), a driving module (3), a guiding module (4), a vacuum suction cup (5), a curing module (6) and a separation module (7), characterized in that: A mounting frame (2) is mounted on the frame (1), a driving module (3) is mounted on the top of the frame (1), the driving module (3) extends to the bottom of the frame (1) and is connected to the mounting frame (2), the driving module (3) is used to drive the mounting frame (2) to move up and down, guide modules (4) are mounted on both sides of the mounting frame (2), the guide modules (4) are fixedly connected to the frame (1) so that the mounting frame (2) can slide up and down, a vacuum suction cup (5) is fixedly mounted on the bottom of the mounting frame (2), a curing module (6) is mounted on the mounting frame (2) above the vacuum suction cup (5), and a separation module (7) is symmetrically mounted on the mounting frame (2) above the curing module (6).

2. A substrate pressing device suitable for a bonding process according to claim 1, characterized in that: The mounting frame (2) comprises a first frame body (21), a second frame body (22), a fine-tuning cylinder (23) and an assembly seat (24); the first frame body (21) and the second frame body (22) are rectangular frames; the second frame body (22) is slidably mounted on the first frame body (21); a fine-tuning cylinder (23) is mounted between the second frame body (22) and the first frame body (21); the cylinder barrel of the fine-tuning cylinder (23) is connected to the second frame body (22); the piston rod of the fine-tuning cylinder (23) is connected to the first frame body (21); the fine-tuning cylinder (23) is used to drive the first frame body (21) to move up and down; and an assembly seat (24) is fixedly mounted on the bottom of the first frame body (21).

3. A substrate pressing device suitable for a bonding process according to claim 1, characterized in that: The driving module (3) comprises a motor support (31), a driving motor (32), a reducer (33), a transmission screw (34) and a transmission nut (35). The motor support (31) is provided with a driving motor (32), the driving motor (32) is connected to the reducer (33), the reducer (33) is used to reduce speed and increase torque of the driving motor (32), a transmission screw (34) is arranged below the motor support (31), the end of the transmission screw (34) is fixedly connected to the output shaft of the reducer (33) through a coupling (36), a transmission nut (35) is threadedly mounted on the transmission screw (34), and the transmission screw (34) is used to convert the rotation of the driving motor (32) into the axial movement of the transmission nut (35).

4. The substrate pressing device suitable for the laminating process according to claim 1, characterized in that: The guide module (4) comprises a guide plate (41), a slider (43) and a guide rail (44); the slider (43) is symmetrically mounted on the guide plate (41), and the guide rail (44) is slidably mounted on the slider (43).

5. The substrate pressing device suitable for the laminating process according to claim 1, characterized in that: A plurality of air pipe joints (51) are arranged in pairs on the side of the vacuum suction cup (5), and the air pipe joints (51) are used to connect a vacuum pump. A plurality of air holes (52) are arranged at the bottom of the vacuum suction cup (5), and the air holes (52) are used to generate negative pressure to adsorb the substrate. An air channel is also arranged inside the vacuum suction cup (5) to connect the air holes (52) with the air pipe joints (51).

6. The substrate pressing device suitable for the laminating process according to claim 1, characterized in that: The curing module (6) comprises a fixed frame (61), a lifting cylinder (62), a movable frame (63), a clamping block (64) and an ultraviolet lamp (65). The movable frame (63) is installed on the fixed frame (61). The lifting cylinder (62) is installed between the movable frame (63) and the fixed frame (61). The cylinder barrel of the lifting cylinder (62) is connected to the fixed frame (61), and the piston rod of the lifting cylinder (62) is connected to the movable frame (63). The lifting cylinder (62) is used to drive the movable frame (63) to move up and down. The clamping block (64) is symmetrically installed on the movable frame (63) through a butterfly screw (68), and the ultraviolet lamp (65) is clamped and installed on the clamping block (64).

7. A substrate pressing device suitable for a bonding process according to claim 6, characterized in that: The movable frame (63) is symmetrically provided with adjustment grooves (66), and a plurality of positioning holes (67) are provided in the adjustment grooves (66).

8. The substrate pressing device suitable for a bonding process according to claim 1, characterized in that: The disengagement module (7) comprises a mounting plate (71), an adjustment frame (72), an adjusting bolt (73) and a micro cylinder (74); the mounting plate (71) is fixedly mounted with the adjusting frame (72) in an interval manner; the adjusting frame (72) is provided with the adjusting bolt (73); the bottom of the adjusting bolt (73) is fixedly mounted with the micro cylinder (74); the adjusting bolt (73) is used to adjust the height of the micro cylinder (74); and the micro cylinder (74) is used to push away the substrate when assembly is completed.

9. A substrate pressing device suitable for a bonding process according to claim 8, characterized in that: The mounting plate (71) is provided with an avoidance groove (75) for avoiding interference with the curing module (6).

10. The substrate pressing device suitable for the laminating process according to claim 2, characterized in that: The mounting frame (2) is also provided with a distance measuring sensor (25), and the distance measuring sensor (25) is used to measure the height of the mounting frame (2).

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