Automatic unboxing and feeding machine for silicon wafers
By designing a silicon wafer automatic box-removing and loading machine including multiple automation mechanisms, the problem of silicon wafer box-removing and loading in the photovoltaic industry depends on manual operation, and the automated processing of silicon wafers is realized, and the production efficiency and Security, reduces costs.
Patent Information
- Application Number
- CN202411540217.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-02-11
AI Technical Summary
In the existing photovoltaic industry, the disassembly and loading of silicon wafers mainly relies on manual operations, and there are problems such as high arbitraryness, easy to damage silicon wafers and storage boxes, low operating efficiency, and high cost.
A silicon wafer automatic box-removing and loading machine is designed, including a frame, robot loading and unloading mechanism, box opening mechanism, cover removal mechanism, silicon wafer removal mechanism, cardboard absorption mechanism, foam cardboard conveying line, silicon wafer conveying line, silicon wafer conveying line, silicon The chip clamping mechanism and the silicon wafer stacking visual inspection mechanism can realize the automatic box removal and loading of the silicon wafer through the collaborative work of these mechanisms.
Automatic disassembly and loading of silicon wafers is realized, avoiding damage to silicon wafers and storage boxes caused by manual operation, improving production efficiency, reducing product defect rate, and saving production costs.
Smart Images
Figure CN119408818A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of new photovoltaic materials, and in particular to an automatic silicon wafer unpacking and loading machine. Background Art
[0002] Currently, the unpacking of silicon wafer storage boxes and the loading of silicon wafers in the photovoltaic industry are all done manually or semi-automatically, that is, the silicon wafer foam storage box is manually cut open, the silicon wafers are taken out and placed in a designated location for inspection, the empty storage box is placed in a designated storage position, and the qualified silicon wafers are manually placed into the wafer launcher.
[0003] Manual disassembly of silicon wafer storage boxes is highly random and can easily scratch the boxes. At the same time, there are relatively many silicon wafers and they are fragile. Manual grabbing is labor-intensive and can easily break silicon wafers and injure people with blades, causing great losses. In addition, manual operation is inefficient and costly.
[0004] It can be seen that whether it is possible to provide an automatic silicon wafer unpacking and loading machine has become a technical problem that needs to be solved urgently in this field. Summary of the invention
[0005] The technical problem to be solved by the present invention is to overcome the defects in the prior art and provide an automatic silicon wafer unpacking and loading machine.
[0006] The present invention solves the above technical problems through the following technical solutions:
[0007] An automatic silicon wafer unpacking and loading machine comprises a frame and a robot loading and unloading mechanism installed on the frame, a box opening mechanism, a cover taking mechanism, a silicon wafer taking mechanism, a paperboard suction mechanism, a foam paperboard conveying line, a silicon wafer conveying line, a silicon wafer clamping mechanism and a silicon wafer stacking visual inspection mechanism;
[0008] The robot loading and unloading mechanism is used to complete the loading action: grab the storage box to be opened from the storage area to the box opening area;
[0009] The box opening mechanism is used to complete the separation action: after the robot loading and unloading mechanism completes the loading action, the storage box upper cover and the lower storage box of the storage box to be opened located in the box opening area are separated;
[0010] The cover removal mechanism is used to complete the cover removal action: after the box opening mechanism completes the separation action, the upper cover of the storage box is removed from the lower storage box;
[0011] The silicon wafer taking mechanism is used to complete the material taking action: after the cover taking mechanism completes the cover taking action, the silicon wafer in the lower storage box, the upper foam paperboard on the upper surface of the silicon wafer, and the lower foam paperboard on the lower surface of the silicon wafer are taken out and transported to the foam paperboard transportation line;
[0012] The cover taking mechanism is also used to complete the cover closing action: after the silicon wafer taking mechanism completes the material taking action, the upper cover of the storage box is put back on the lower storage box and closed;
[0013] The robot loading and unloading mechanism is also used to complete the unloading action: after the cover removal mechanism completes the cover closing action, the storage box upper cover and the lower storage box are transported to the storage area;
[0014] The paperboard suction mechanism is used to complete the action of taking the upper paperboard: after the silicon wafer taking mechanism completes the material taking action, the upper foam paperboard is taken off the silicon wafer and transported to the foam paperboard conveying line;
[0015] The silicon wafer taking mechanism is also used to complete the flipping action: after the paperboard suction mechanism completes the action of taking the upper paperboard, the silicon wafer and the lower foam paperboard are flipped over so that the lower foam paperboard faces upward;
[0016] The paperboard suction mechanism is also used to complete the paperboard removal action: after the silicon wafer removal mechanism completes the flipping action, the lower foam paperboard is removed from the silicon wafer and transported to the foam paperboard conveying line;
[0017] The silicon wafer clamping mechanism is used to complete the action of loading the silicon wafer: after the paperboard suction mechanism completes the action of removing the paperboard, the silicon wafer is transported from the foam paperboard conveying line to the silicon wafer conveying line;
[0018] The silicon wafer stacking visual inspection mechanism is used to complete the visual inspection action: after the silicon wafer clamping mechanism completes the silicon wafer loading action, the effect of inspecting the surroundings of the stacked silicon wafer is determined to determine whether the silicon wafer is qualified;
[0019] The silicon wafer clamping mechanism is also used to complete the silicon wafer unloading action: after the silicon wafer stacking visual inspection mechanism completes the visual inspection action, the qualified silicon wafers are transported to the next process.
[0020] In some embodiments, the box opening mechanism includes a first rotary cylinder, a first servo module, a slide cylinder fixing frame, a slide cylinder, a blade, a guide, a storage box placement plate, a second rotary cylinder, a rotating shaft, a support, a second servo module, and a camera; the blade is mounted on the slide cylinder; the slide cylinder is mounted on the first servo module through the slide cylinder fixing frame, the first servo module is mounted on the frame, the guide is connected to the storage box placement plate, and the storage box placement plate is connected to the second rotary cylinder; the rotating shaft connects the storage box placement plate and the support is installed on the second servo module; the first rotary cylinder is connected to the storage box placement plate, and the camera is configured to detect the gap between the storage box upper cover and the lower storage box of the storage box to be removed located in the box opening area.
[0021] In some embodiments, the cap removal mechanism includes a suction cup fixture, a vacuum adsorption assembly, a linear bearing, a guide shaft, a bracket, and a hydraulic cylinder. The vacuum adsorption assembly is installed on the suction cup fixture, the suction cup fixture is connected to the bracket through the guide shaft and the linear bearing, the hydraulic cylinder is installed on the bracket, and the bracket is installed on the frame.
[0022] In some embodiments, the silicon wafer taking mechanism includes a gear rack, a motor fixing plate, a module connecting plate, a motor, a third servo module, a first module fixing plate, a guide rail fixing plate, a guide rail, a clamp, a third rotating cylinder, and a first cylinder. The clamp is connected to the guide rail and fixed on the guide rail fixing plate, the guide rail fixing plate is connected to the first module fixing plate, the first module fixing plate is fixed on the third servo module, the third servo module is fixed on the module connecting plate, the motor and the third servo module are fixed on the motor fixing plate, the motor fixing plate is connected to the gear rack, and the gear rack is fixed on the frame.
[0023] In some embodiments, the paper suction board mechanism includes a second cylinder, a fixed plate, a floating head, a third cylinder, a suction cup assembly, a suction cup fixing part, a cylinder fixing part, and a guide rail slider. The suction cup assembly is connected to the suction cup fixing part, the suction cup fixing part is fixed on the third cylinder, the third cylinder is fixed on the cylinder fixing part, the cylinder fixing part is connected to the guide rail slider, the third cylinder connects the floating head and the second cylinder, the second cylinder is fixed on the fixed plate, and the fixed plate is fixed on the silicon wafer taking mechanism.
[0024] In some embodiments, the foam paperboard conveying line includes a first positioning bracket, and the first positioning bracket is used to receive the silicon wafer and the foam paperboard from the silicon wafer taking mechanism;
[0025] And / or, the silicon wafer conveying line includes a second positioning bracket, and the second positioning bracket is used for receiving the silicon wafer.
[0026] In some embodiments, the silicon wafer clamping mechanism includes an upper silicon wafer clamping mechanism for conveying the silicon wafer to the second positioning bracket for visual inspection of silicon wafer stacking and an unloading silicon wafer clamping mechanism for grabbing the silicon wafer that passes the visual inspection into the wafer launching machine to enter the next process.
[0027] In some embodiments, the silicon wafer stack visual inspection mechanism includes a rotating mechanism, a silicon wafer chamfer detection camera, a camera bracket and a silicon wafer side detection camera; the rotating mechanism drives the stacked silicon wafer products to rotate on the work surface, the silicon wafer chamfer detection camera is installed on the camera bracket, the silicon wafer chamfer detection camera is used to detect whether there are defects in the chamfer of the silicon wafer, the silicon wafer side detection camera is installed on the camera bracket, and the silicon wafer side detection camera is used to detect whether there are defects on the side of the silicon wafer.
[0028] In some embodiments, there are two sets of silicon wafer chamfer inspection cameras and they are symmetrically mounted on the camera bracket;
[0029] And / or, there are two sets of the silicon wafer side detection camera and the camera bracket, and they are symmetrically installed above the silicon wafer conveyor line.
[0030] In some embodiments, the rotation angle of the rotating mechanism is 0-90 degrees.
[0031] On the basis of being in accordance with the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.
[0032] The positive progressive effect of the present invention is that the present invention can solve the problems of manual taking out of storage boxes, improper operation of removing storage boxes, scratching of storage boxes or silicon wafers, etc., avoid the occurrence of situations such as scratching people due to sharp blades, etc., improve production efficiency, reduce product defective rate, and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 It is a schematic structural diagram of a silicon wafer automatic box unpacking and loading machine according to a preferred embodiment of the present invention.
[0034] Figure 2 It is a structural schematic diagram of the box opening mechanism of the preferred embodiment of the present invention.
[0035] Figure 3 It is a structural schematic diagram of a cover removal mechanism according to a preferred embodiment of the present invention.
[0036] Figure 4 It is a schematic structural diagram of a silicon wafer taking mechanism according to a preferred embodiment of the present invention.
[0037] Figure 5 It is a structural schematic diagram of a paperboard suction mechanism according to a preferred embodiment of the present invention.
[0038] Figure 6 A schematic structural diagram of a stacking visual inspection mechanism according to a preferred embodiment of the present invention.
[0039] Description of reference numerals:
[0040] Frame 1, robot loading and unloading mechanism 2, box opening mechanism 3, cover taking mechanism 4, silicon wafer taking mechanism 5, paperboard suction mechanism 6, silicon wafer clamping mechanism 7, foam paperboard conveyor line 8, silicon wafer conveyor line 9, silicon wafer stacking visual inspection mechanism 10, first rotary cylinder 11, first servo module 12, slide cylinder fixing frame 13, slide cylinder 14, blade 15, guide member 16, storage box placement plate 17, second rotary cylinder 18, rotating shaft 19, support 20, second servo module 21, camera 22, suction cup fixing member 23, vacuum adsorption component 24, linear bearing 25, guide The shaft 26, the bracket 27, the hydraulic cylinder 28, the gear rack 31, the motor fixing plate 32, the module connecting plate 33, the motor 34, the third servo module 35, the first module fixing plate 36, the guide rail fixing plate 37, the guide rail 38, the clamp 39, the third rotating cylinder 40, the first cylinder 41, the second cylinder 42, the fixing plate 43, the floating head 44, the third cylinder 45, the suction cup assembly 46, the suction cup fixing part 47, the cylinder fixing part 48, the guide rail slider 49, the rotating mechanism 50, the silicon wafer chamfering detection camera 51, the camera bracket 52, and the silicon wafer side detection camera 53. DETAILED DESCRIPTION
[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0042] It should be noted that in the claims and description of this patent, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including one" do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0043] like Figure 1-Figure 6As shown, this embodiment discloses a novel automatic silicon wafer unpacking and loading machine, which includes a frame 1 and a robot loading and unloading mechanism 2 installed on the frame, a box opening mechanism 3, a cover removing mechanism 4, a silicon wafer removing mechanism 5, a paperboard suction mechanism 6, a silicon wafer clamping mechanism 7, a foam paperboard conveyor line 8, a silicon wafer conveyor line 9 and a silicon wafer stacking visual inspection mechanism 10.
[0044] The robot loading and unloading mechanism 2 is used to complete the loading action: grabbing the storage box to be opened from the storage area to the box opening area.
[0045] The box opening mechanism 3 is used to complete the separation action: after the robot loading and unloading mechanism 2 completes the loading action, the storage box upper cover and the lower storage box of the storage box to be opened in the box opening area are separated.
[0046] The cover-removing mechanism 4 is used to complete the cover-removing action: after the box-opening mechanism 3 completes the separation action, the upper cover of the storage box is removed from the lower storage box.
[0047] The silicon wafer taking mechanism 5 is used to complete the material taking action: after the cover taking mechanism 4 completes the cover taking action, the silicon wafer in the lower storage box, the upper foam cardboard on the upper surface of the silicon wafer, and the lower foam cardboard on the lower surface of the silicon wafer are taken out together and transported to the foam cardboard transportation line 8.
[0048] The cover taking mechanism 4 is also used to complete the cover closing action: after the silicon wafer taking mechanism 5 completes the material taking action, the upper cover of the storage box is put back on the lower storage box and closed.
[0049] The robot loading and unloading mechanism 2 is also used to complete the unloading action: after the cover removal mechanism 4 completes the cover closing action, the upper cover of the storage box and the lower storage box are transported to the storage area.
[0050] The paperboard suction mechanism 6 is used to complete the action of taking the upper paperboard: after the silicon wafer taking mechanism 5 completes the material taking action, the upper foam paperboard is taken off the silicon wafer and transported to the foam paperboard conveyor line 8.
[0051] The silicon wafer taking mechanism 5 is also used to complete the flipping action: after the paperboard suction mechanism 6 completes the action of taking the upper paperboard, the silicon wafer and the lower foam paperboard are flipped over so that the lower foam paperboard faces upward.
[0052] The paperboard suction mechanism 6 is also used to complete the paperboard removal action: after the silicon wafer removal mechanism 5 completes the flipping action, the lower foam paperboard is removed from the silicon wafer and transported to the foam paperboard conveyor line 8.
[0053] The silicon wafer clamping mechanism 7 is used to complete the silicon wafer loading action: after the paperboard suction mechanism 6 completes the paperboard removal action, the silicon wafer is transported from the foam paperboard conveying line 8 to the silicon wafer conveying line 9.
[0054] The silicon wafer stacking visual inspection mechanism 10 is used to complete the visual inspection action: after the silicon wafer clamping mechanism 7 completes the silicon wafer loading action, the effect around the stacked silicon wafer is inspected to determine whether the silicon wafer is qualified.
[0055] The silicon wafer clamping mechanism 7 is also used to complete the silicon wafer unloading action: after the silicon wafer stacking visual inspection mechanism completes the visual inspection action, the qualified silicon wafers are transported to the next process.
[0056] The automatic silicon wafer box unpacking and loading machine of this embodiment adopts the above-mentioned structural form, which can solve the problems of manual removal of storage boxes, improper operation of unpacking storage boxes, scratches on storage boxes or silicon wafers, and dangerous operations such as sharp blades and scratches on personnel, thereby improving production efficiency, reducing product defective rate, and saving production costs.
[0057] In this embodiment, the box opening mechanism 3 and the cover removal mechanism 4 are used in conjunction. The box opening mechanism 3 includes a first rotary cylinder 11, a first servo module 12, a slide cylinder fixing frame 13, a slide cylinder 14, a blade 15, a guide 16, a storage box placement plate 17, a second rotary cylinder 18, a rotating shaft 19, a support 20, a second servo module 21, and a camera 22. The blade 15 of the box opening mechanism 3 is fixed on the slide cylinder 14, the slide cylinder 14 is fixed on the first servo module 12 through the slide cylinder fixing frame 13, the first servo module 12 is fixed on the frame 1, the guide 16 is connected to the storage box placement plate 17, the storage box placement plate 17 is fixedly connected to the second rotary cylinder 18, the rotating shaft 19 is connected to the storage box placement plate 17 and the support 20 is fixed on the second servo module 21. The first rotary cylinder 11 is connected to the storage box placement plate 17, and the camera 22 is configured to detect a gap between the storage box upper cover and the lower storage box of the storage box to be opened in the box opening area.
[0058] The capping mechanism 4 includes a suction cup fixing part 23, a vacuum adsorption component 24, a linear bearing 25, a guide shaft 26, a bracket 27, and a hydraulic cylinder 28. The vacuum adsorption component 24 of the capping mechanism 4 is fixed on the suction cup fixing part 23, the suction cup fixing part 23 is connected to the bracket 27 through the guide shaft 26 and the linear bearing 25, the hydraulic cylinder 28 is also connected to the bracket 27, and the bracket 27 is fixed on the frame 1.
[0059] The working principle of the box opening mechanism 3 and the cover removal mechanism 4 / the coordination between the components are as follows:
[0060] The robot loading and unloading mechanism 2 grabs the storage box to be opened from the storage area to the box opening area.
[0061] The second servo module 21 of the box opening mechanism 3 moves the storage box to be opened and other parts fixed on the second servo module 21 placed in the box opening area to the designated position, and the camera 22 visually detects the gap between the upper cover and the lower storage box of the storage box to be opened. Then the first servo module 12 drives the slide cylinder 14 and the blade 15 to move up to the position of the gap between the upper cover and the lower storage box. The slide cylinder 14 drives the blade to pierce the tape and enter the gap between the upper cover and the lower storage box. The second rotary cylinder 18 rotates 180°, and the tape is cut by the two blades 15.
[0062] The cover-removing mechanism 4 drives the guide shaft 26, the suction cup fixing part 23 and the vacuum adsorption component 24 to move downward through the hydraulic cylinder 28, and the vacuum adsorption component 24 adsorbs the upper cover of the storage box, and then the hydraulic cylinder 28 retracts to drive the guide shaft 26, the suction cup fixing part 23 and the vacuum adsorption component 24 to move upward. The first rotating cylinder 11 of the box opening mechanism 3 rotates 90° clockwise, driving the lower storage box and the silicon wafer to rotate 90° clockwise together. After the silicon wafer taking mechanism 5 grabs the silicon wafer, the first rotating cylinder 11 rotates 90° counterclockwise to drive the lower storage box to rotate back. The cover-removing mechanism 4 repeats the above action to put the upper cover of the storage box back on the lower storage box and close it. When the first rotating cylinder 11 of the box opening mechanism 3 rotates 90° counterclockwise, the second servo module 21 brings it back to the initial position, and the robot loading and unloading mechanism 2 adsorbs the storage box (the entirety of the upper cover of the storage box and the lower storage box after closing) to the storage area.
[0063] In this embodiment, the box opening mechanism 3 and the cover removal mechanism 4 of the above structural form can solve the problems of manual removal of storage boxes, improper operation of removing storage boxes, scratches on storage boxes or silicon wafers, etc., and avoid the occurrence of scratches on personnel due to the sharp blade 15, thereby improving production efficiency, reducing product defective rate, and saving production costs.
[0064] In this embodiment, the silicon wafer taking mechanism 5 and the paperboard sucking mechanism 6 are used in conjunction with each other, and the silicon wafer taking mechanism 5 includes a gear rack 31, a motor fixing plate 32, a module connecting plate 33, a motor 34, a third servo module 35, a first module fixing plate 36, a guide rail fixing plate 37, a guide rail 38, a clamp 39, a third rotary cylinder 40, and a first cylinder 41. The clamp 39 of the silicon wafer taking mechanism 5 is connected to the guide rail 38 and fixed on the guide rail fixing plate 37. The guide rail fixing plate 37 is connected to the first module fixing plate 36 and fixed on the third servo module 35. The third servo module 35 is fixed on the module connecting plate 33. The motor 34 and the third servo module 35 are both fixed on the motor fixing plate 32, and the motor fixing plate 32 is connected to the gear rack 31. The gear rack 31 is fixed on the frame 1, and the gear rack is used to drive the silicon wafer taking mechanism 5 and the paperboard sucking mechanism 6 to move.
[0065] The paperboard suction mechanism 6 includes a second cylinder 42, a fixed plate 43, a floating head 44, a third cylinder 45, a suction cup assembly 46, a suction cup fixing part 47, a cylinder fixing part 48, and a guide rail slider 49. The suction cup assembly 46 in the paperboard suction mechanism 6 is connected to the suction cup fixing part 47, the suction cup fixing part 47 is fixed on the third cylinder 45, the third cylinder 45 is fixed on the cylinder fixing part 48, the cylinder fixing part 48 is connected to the guide rail slider 49, the third cylinder 45 is connected to the floating head 44 and the second cylinder 42 at the same time, the second cylinder 42 is fixed on the fixed plate 43, and the fixed plate 43 is fixed on the wafer taking mechanism 5.
[0066] The foam paperboard conveying line 8 comprises a first positioning bracket, and the first positioning bracket is used to receive the silicon wafer from the silicon wafer taking mechanism 5, the upper foam paperboard on the upper surface of the silicon wafer, and the lower foam paperboard on the lower surface of the silicon wafer.
[0067] The silicon wafer conveying line 9 includes a second positioning bracket, and the second positioning bracket is used to receive the silicon wafer.
[0068] The silicon wafer clamping mechanism 7 includes an upper silicon wafer clamping mechanism for conveying the silicon wafer to the second positioning bracket for visual inspection of the silicon wafer stacking and an unloading silicon wafer clamping mechanism for grabbing the silicon wafer that has passed the visual inspection into the wafer launching machine to enter the next process.
[0069] The silicon wafer stacking visual inspection mechanism 10 determines whether the stacked silicon wafers are qualified by inspecting the effects around them.
[0070] In this embodiment, the working principle of the silicon wafer taking mechanism 5 and the paperboard suction mechanism 6 / the coordination between the various components are as follows: the first cylinder 41 extends to drive the clamping jaws 39 to open, the motor 34 rotates to drive the clamping jaws 39 to move to the box opening mechanism 3, the third servo module 35 drives the clamping jaws 39 to descend, the first cylinder 41 retracts to clamp the silicon wafer, the upper foam paperboard on the upper surface of the silicon wafer, and the lower foam paperboard on the lower surface of the silicon wafer out of the box opening mechanism 3, the third servo module 35 drives the clamping jaws 39 and the silicon wafer to rise, the motor 34 rotates, and moves the clamping jaws 39 and the silicon wafer, the upper foam paperboard, and the lower foam paperboard to the foam paperboard conveyor line 8, the first cylinder 41 releases the clamping jaws, and the silicon wafer and the upper foam paperboard and the lower foam paperboard are placed on the first positioning bracket on the foam paperboard conveyor line 8.
[0071] The third cylinder 45 of the paperboard suction mechanism 6 extends out, driving the suction cup assembly 46 to absorb the upper foam paperboard, the third cylinder 45 retracts and drives the upper foam paperboard to move upward, the second cylinder 42 extends out and drives the third cylinder 45 and the upper foam paperboard to move left, the third cylinder 45 descends again, and puts the upper foam paperboard on the foam paperboard conveyor line 8, and the foam paperboard conveyor line 8 conveys the upper foam paperboard to the manual workstation, and the upper foam paperboard is taken manually. The third rotating cylinder 40 turns the silicon wafer and the lower foam paperboard 180° until the lower foam paperboard is upward, and the same action is performed to place the lower foam paperboard on the foam paperboard conveyor line 8. After the lower foam paperboard is transported, the silicon wafer taking mechanism 5 moves the silicon wafer to the second positioning bracket of the silicon wafer conveyor line 9. The second positioning bracket is used to receive the silicon wafer and locate the silicon wafer position, which provides convenience for subsequent stacking and detection. The action of the silicon wafer taking mechanism 5 and the paperboard suction mechanism 6 is completed.
[0072] In this embodiment, the silicon wafer taking mechanism 5 and the paperboard suction mechanism 6 of the above-mentioned structural form are adopted. Through the automated design of the silicon wafer taking mechanism 5, the automatic taking out of the silicon wafer from the storage box is realized, and the efficiency and accuracy of taking out the silicon wafer are improved. Through the coordinated use of components such as the gear rack 31, the motor fixing plate 32, the module connecting plate 33, the motor 34, and the third servo module 35, the precise positioning and movement of the silicon wafer during the taking out process are ensured. The automated silicon wafer taking mechanism 5 reduces the need for manual operation, reduces the labor intensity and operation risk of the operator. The automated silicon wafer taking process reduces the time of taking and placing the silicon wafer, thereby further improving the overall production efficiency.
[0073] The foam cardboard can be automatically sucked and placed by the cardboard suction mechanism 6, which reduces manual operation and further improves production efficiency. By accurately controlling the actions of the suction cup assembly 46 and the cylinder, it can be ensured that the foam cardboard can be accurately taken out of the storage box and placed at the specified position. The automated suction and placement process reduces the possible damage of the foam cardboard during manual operation.
[0074] In this embodiment, the foam paperboard conveyor line 8, the silicon wafer conveyor line 9 and the silicon wafer clamping mechanism 7 can realize the automatic conveying of silicon wafers and foam paperboards, further reducing manual operations and improving production efficiency, and the first positioning bracket and the second positioning bracket can ensure the precise positioning of the silicon wafers during the conveying process, providing convenience for subsequent stacking and detection. The silicon wafer stacking visual inspection mechanism 10, the rotating mechanism 50, the silicon wafer chamfering inspection camera 51 and the silicon wafer side inspection camera 53 realize the automatic inspection of the silicon wafer stacking quality, ensure the product quality, and the automatic visual inspection reduces the need for manual inspection, reducing the labor intensity and the possibility of human error.
[0075] Furthermore, the silicon wafer stack visual inspection mechanism 10 of the present embodiment further includes a rotating mechanism 50, a silicon wafer chamfer inspection camera 51, a camera bracket 52, and a silicon wafer side inspection camera 53. The rotating mechanism 50 can drive the stacked silicon wafer product to rotate on the work surface, the silicon wafer chamfer inspection camera 51 is mounted on the camera bracket 52, and is used to inspect whether there are defects in the chamfer of the silicon wafer, and the silicon wafer side inspection camera 53 is mounted on the camera bracket 52, and is used to inspect whether there are defects on the side of the silicon wafer.
[0076] The working principle of the silicon wafer stack visual inspection mechanism 10 and the coordination between the components are as follows:
[0077] After the stacked silicon wafers are transported to the designated position through the silicon wafer conveyor line 9, the silicon wafer chamfer detection camera 51 and the silicon wafer side detection camera 53 respectively detect whether there are defects on the two side surfaces and the two chamfered surfaces of the silicon wafer. Then the rotating mechanism 50 drives the stacked silicon wafers to rotate, and then detects the other two side surfaces and the two chamfered surfaces. After that, if it is determined that the unqualified silicon wafers are unqualified, they are manually removed. If they are qualified, they are grabbed by the silicon wafer unloading clamp mechanism and put into the wafer launching machine to enter the next process.
[0078] The silicon wafer stack visual inspection mechanism 10 of the present embodiment rotates the silicon wafer on the work surface through the rotating mechanism 50. Combined with the silicon wafer chamfer inspection camera 51 and the silicon wafer side inspection camera 53, it can inspect multiple sides of the silicon wafer to ensure the comprehensiveness of the inspection. The use of special cameras and brackets for chamfering and side inspection can more accurately identify defects in the silicon wafer, such as cracks, impurities or other defects. Automated visual inspection reduces the need for manual inspection, reduces labor intensity and the possibility of human error.
[0079] Furthermore, in this embodiment, there are two sets of silicon wafer chamfer inspection cameras 51 and they are symmetrically installed on the camera bracket 52 .
[0080] In this embodiment, two sets of symmetrically installed chamfer detection cameras 51 can improve the reliability of detection and ensure that the chamfers of the silicon wafer are detected from different angles. The symmetrical camera layout helps to reduce blind spots in the detection process and ensure that all chamfer areas of the silicon wafer can be effectively detected.
[0081] Furthermore, in this embodiment, there are two sets of silicon wafer side inspection cameras 53 and camera brackets 52 , which are symmetrically installed above the silicon wafer conveyor line 9 .
[0082] Furthermore, in this embodiment, by symmetrically installing two sets of cameras above the silicon wafer conveyor line 9, it is possible to ensure that both sides of the silicon wafer are fully inspected to reduce omissions. The symmetrical camera layout allows both sides of the silicon wafer to be inspected at the same time, thereby improving the efficiency of the inspection process. The two sets of cameras can capture images from different angles, which helps to improve the accuracy of detecting defects on the side of the silicon wafer.
[0083] Furthermore, in this embodiment, the rotation angle of the rotating mechanism 50 is 0-90 degrees. The rotating mechanism 50 can accurately control the rotation angle within the range of 0-90 degrees to ensure the correct positioning and rotation of the silicon wafer during the detection process.
[0084] The automatic silicon wafer box unpacking and loading machine of this embodiment solves the problems of manual removal of storage boxes, improper operation of unpacking storage boxes, scratching of storage boxes or silicon wafers, and dangerous operations such as sharp blades and scratching of personnel, thereby improving production efficiency, reducing product defective rate, and saving production costs.
Claims
1. A silicon wafer automatic box unpacking and loading machine, characterized in that: It includes a frame and a robot loading and unloading mechanism, a box opening mechanism, a cover taking mechanism, a silicon wafer taking mechanism, a paperboard suction mechanism, a foam paperboard conveying line, a silicon wafer conveying line, a silicon wafer clamping mechanism and a silicon wafer stacking visual inspection mechanism installed on the frame; The robot loading and unloading mechanism is used to complete the loading action: grab the storage box to be opened from the storage area to the box opening area; The box opening mechanism is used to complete the separation action: after the robot loading and unloading mechanism completes the loading action, the storage box upper cover and the lower storage box of the storage box to be opened located in the box opening area are separated; The cover removal mechanism is used to complete the cover removal action: after the box opening mechanism completes the separation action, the upper cover of the storage box is removed from the lower storage box; The silicon wafer taking mechanism is used to complete the material taking action: after the cover taking mechanism completes the cover taking action, the silicon wafer in the lower storage box, the upper foam paperboard on the upper surface of the silicon wafer, and the lower foam paperboard on the lower surface of the silicon wafer are taken out and transported to the foam paperboard transportation line; The cover taking mechanism is also used to complete the cover closing action: after the silicon wafer taking mechanism completes the material taking action, the upper cover of the storage box is put back on the lower storage box and closed; The robot loading and unloading mechanism is also used to complete the unloading action: after the cover removal mechanism completes the cover closing action, the storage box upper cover and the lower storage box are transported to the storage area; The paperboard suction mechanism is used to complete the action of taking the upper paperboard: after the silicon wafer taking mechanism completes the material taking action, the upper foam paperboard is taken off the silicon wafer and transported to the foam paperboard conveying line; The silicon wafer taking mechanism is also used to complete the flipping action: after the paperboard suction mechanism completes the action of taking the upper paperboard, the silicon wafer and the lower foam paperboard are flipped over so that the lower foam paperboard faces upward; The paperboard suction mechanism is also used to complete the paperboard removal action: after the silicon wafer removal mechanism completes the flipping action, the lower foam paperboard is removed from the silicon wafer and transported to the foam paperboard conveying line; The silicon wafer clamping mechanism is used to complete the action of loading the silicon wafer: after the paperboard suction mechanism completes the action of removing the paperboard, the silicon wafer is transported from the foam paperboard conveying line to the silicon wafer conveying line; The silicon wafer stacking visual inspection mechanism is used to complete the visual inspection action: after the silicon wafer clamping mechanism completes the silicon wafer loading action, the effect of inspecting the surroundings of the stacked silicon wafer is determined to determine whether the silicon wafer is qualified; The silicon wafer clamping mechanism is also used to complete the silicon wafer unloading action: after the silicon wafer stacking visual inspection mechanism completes the visual inspection action, the qualified silicon wafers are transported to the next process.
2. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The box opening mechanism includes a first rotary cylinder, a first servo module, a slide cylinder fixing frame, a slide cylinder, a blade, a guide, a storage box placement plate, a second rotary cylinder, a rotating shaft, a support, a second servo module, and a camera; the blade is installed on the slide cylinder; the slide cylinder is installed on the first servo module through the slide cylinder fixing frame, the first servo module is installed on the frame, the guide is connected to the storage box placement plate, and the storage box placement plate is connected to the second rotary cylinder; the rotating shaft connects the storage box placement plate and the support is installed on the second servo module; the first rotary cylinder is connected to the storage box placement plate, and the camera is configured to detect the gap between the storage box upper cover and the lower storage box of the storage box to be removed located in the box opening area.
3. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The cap removal mechanism includes a suction cup fixing part, a vacuum adsorption component, a linear bearing, a guide shaft, a bracket, and a hydraulic cylinder. The vacuum adsorption component is installed on the suction cup fixing part, and the suction cup fixing part is connected to the bracket through the guide shaft and the linear bearing. The hydraulic cylinder is installed on the bracket, and the bracket is installed on the frame.
4. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The silicon wafer taking mechanism includes a gear rack, a motor fixing plate, a module connecting plate, a motor, a third servo module, a first module fixing plate, a guide rail fixing plate, a guide rail, a clamp, a third rotating cylinder, and a first cylinder. The clamp is connected to the guide rail and fixed to the guide rail fixing plate, the guide rail fixing plate is connected to the first module fixing plate, the first module fixing plate is fixed to the third servo module, the third servo module is fixed to the module connecting plate, the motor and the third servo module are fixed to the motor fixing plate, the motor fixing plate is connected to the gear rack, and the gear rack is fixed to the frame.
5. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The paper suction board mechanism includes a second cylinder, a fixed plate, a floating head, a third cylinder, a suction cup assembly, a suction cup fixing part, a cylinder fixing part, and a guide rail slider. The suction cup assembly is connected to the suction cup fixing part, the suction cup fixing part is fixed on the third cylinder, the third cylinder is fixed on the cylinder fixing part, the cylinder fixing part is connected to the guide rail slider, the third cylinder connects the floating head and the second cylinder, the second cylinder is fixed on the fixed plate, and the fixed plate is fixed on the silicon wafer taking mechanism.
6. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The foam paperboard conveying line comprises a first positioning bracket, and the first positioning bracket is used to receive silicon wafers and foam paperboards from the silicon wafer taking mechanism; And / or, the silicon wafer conveying line includes a second positioning bracket, and the second positioning bracket is used for receiving the silicon wafer.
7. The automatic silicon wafer unpacking and loading machine according to claim 6, characterized in that: The silicon wafer clamping mechanism includes an upper silicon wafer clamping mechanism for conveying the silicon wafer to the second positioning bracket for visual inspection of silicon wafer stacking and an unloading silicon wafer clamping mechanism for grabbing the silicon wafer that passes the visual inspection into the wafer launching machine to enter the next process.
8. The automatic silicon wafer unpacking and loading machine according to claim 1, characterized in that: The silicon wafer stacking visual inspection mechanism includes a rotating mechanism, a silicon wafer chamfer detection camera, a camera bracket and a silicon wafer side detection camera; the rotating mechanism drives the stacked silicon wafer products to rotate on the work surface, the silicon wafer chamfer detection camera is installed on the camera bracket, the silicon wafer chamfer detection camera is used to detect whether there are defects in the chamfer of the silicon wafer, the silicon wafer side detection camera is installed on the camera bracket, and the silicon wafer side detection camera is used to detect whether there are defects on the side of the silicon wafer.
9. The automatic silicon wafer unpacking and loading machine according to claim 8, characterized in that: There are two sets of silicon wafer chamfer detection cameras, which are symmetrically installed on the camera bracket; And / or, there are two sets of the silicon wafer side detection camera and the camera bracket, and they are symmetrically installed above the silicon wafer conveyor line.
10. The automatic silicon wafer unpacking and loading machine according to claim 8, characterized in that: The rotation angle of the rotating mechanism is 0-90 degrees.