Composite epoxy adhesive film for packaging SAW (Surface Acoustic Wave) filter chip and preparation method of composite epoxy adhesive film

Abstract

The invention discloses a composite epoxy adhesive film for packaging an SAW filter chip and a preparation method of the composite epoxy adhesive film. The composite epoxy adhesive film for packaging the SAW filter chip is composed of an acrylic acid curing system and an epoxy resin system, the acrylic acid curing system comprises the following raw materials in parts by mass: 10-50 parts of an acrylic acid prepolymer, 2-10 parts of an acrylic acid reactive diluent and 0.1-0.5 part of an initiator; the epoxy resin system comprises the following raw materials in parts by mass: 100 parts of epoxy resin prepolymer, 5-15 parts of latent curing agent, 0.1-1 part of accelerant, 200-800 parts of filler and 0-10 parts of assistant. The raw materials are scientifically matched, the raw materials of the composite epoxy adhesive film do not contain solvents, and the composite epoxy adhesive film has good adjustable rebound resilience and can meet packaging of SAW filter chips with complex structures.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy polymers, and in particular to a composite epoxy adhesive film for SAW filter chip packaging and a preparation method thereof. Background Art

[0002] With the development of science and technology, various electronic components are becoming more and more sophisticated and miniaturized, and electronic packaging technology has developed from SMD to CSP. Epoxy resin is a thermosetting resin with excellent comprehensive mechanical properties, good electrical insulation properties, good bonding properties with various materials, chemical corrosion resistance, small volume shrinkage after curing, and flexible use process. It is extremely suitable for electronic packaging. Due to its unique cavity structure, the SAW filter chip ensures that the sound wave can propagate on the crystal surface in the form of standing waves, thereby realizing the filtering function.

[0003] Nitto Denko Corporation, Shin-Etsu Chemical Co., Ltd., and Hitachi Chemical Co., Ltd. all first use solvent to dissolve thermoplastic elastomers, then add epoxy resin, curing agent, accelerator, filler, additives, etc., and finally prepare the whole into epoxy varnish, and use a film applicator to dry the solvent to prepare epoxy film. The weight average molecular weight of thermoplastic elastomer is basically around 1 million, and a large amount of solvent is required to fully dissolve it, resulting in solvent residue when the thickness of the epoxy film exceeds 100μm. Secondly, it does not conform to the concept of safe and green development, such as patents CN201480019057.4, CN201480065277.0, CN201580030702.7, CN201811036873.2, JP1992261448, and JP1996306031.

[0004] The domestic Institute of Aerospace Materials and Technology and the China Academy of Launch Vehicle Technology use liquid epoxy plus room temperature curing agent and latent curing agent, first use the room temperature curing agent for pre-curing, and then use the latent curing agent for post-curing. Qingdao Deju Adhesive Technology Co., Ltd. uses epoxy resin A and epoxy resin B, room temperature curing agent and latent curing agent, first use epoxy resin A and room temperature curing agent for curing, and then use epoxy resin B and latent curing agent for curing. Epoxy resin is a thermosetting resin with a high degree of cross-linking, poor flexibility, and no resilience. It cannot be used for SAW filter chip packaging with complex structures, and has poor stability, such as patents CN109321186A and CN111592849B. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a composite epoxy film for SAW filter chip packaging and a preparation method thereof. The raw material of the composite epoxy film for SAW filter chip packaging of the present invention does not contain solvent and has good adjustable resilience, which can meet the requirements of SAW filter chip packaging with complex structure.

[0006] The technical solution of the present invention is as follows:

[0007] A composite epoxy film for SAW filter chip packaging, the composite epoxy film for SAW filter chip packaging consisting of an acrylic curing system and an epoxy resin system;

[0008] The mass fractions of each raw material in the acrylic acid curing system are:

[0009] Acrylic prepolymer 10-50 parts

[0010] Acrylic acid reactive diluent 2-10 parts

[0011] Initiator 0.1~0.5 parts

[0012] The mass fractions of each raw material in the epoxy resin system are:

[0013]

[0014] Furthermore, the acrylic prepolymer includes one or more of epoxy acrylic prepolymer, polyurethane acrylic prepolymer, polyester acrylic prepolymer, and amine-modified acrylic prepolymer.

[0015] Furthermore, the acrylic reactive diluent is a monofunctional acrylic reactive diluent or a multifunctional acrylic reactive diluent; the monofunctional acrylic reactive diluent is selected from at least one of β-hydroxyethyl methacrylate, isoborneol methacrylate, β-hydroxyethyl acrylate, and 2-phenoxyethyl acrylate; the multifunctional acrylic reactive diluent is selected from at least one of dipropylene glycol diacrylate, tripropylene glycol diacrylate, polyethylene glycol (200) dimethacrylate, and polyethylene glycol (400) dimethacrylate.

[0016] Furthermore, the initiator includes at least one of an azo initiator and a peroxide initiator; the azo initiator is selected from at least one of azobisisobutyronitrile, azobisisoheptanenitrile, and dimethyl azobisisobutyrate; the peroxide initiator is selected from at least one of benzoyl peroxide, tert-butyl benzoyl peroxide, and methyl ethyl ketone peroxide.

[0017] Furthermore, the epoxy resin prepolymer includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, brominated epoxy resin, naphthalene-containing epoxy resin, biphenyl epoxy resin, o-cresol epoxy resin, polyether modified epoxy resin, dicyclopentadiene epoxy resin, flexible block epoxy resin, phenolic epoxy resin, and dimer acid modified epoxy resin.

[0018] Furthermore, the latent curing agent includes at least one of a microcapsule-encapsulated curing agent, an amine curing agent, an imidazole curing agent, a phenolic curing agent, an organic acid anhydride curing agent, an organic hydrazide curing agent, and a Lewis acid curing agent, wherein the microcapsule-encapsulated curing agent includes at least one of a microcapsule-encapsulated modified aliphatic amine curing agent and a microcapsule-encapsulated aromatic diamine curing agent.

[0019] Furthermore, the accelerator includes at least one of an imidazole accelerator, an amine accelerator, an organic phosphine curing accelerator, and a metal compound accelerator.

[0020] Furthermore, the filler includes at least one of titanium dioxide, aluminum oxide, silicon dioxide, talc, glass beads, montmorillonite, aluminum nitride, boron nitride, silicon nitride, calcium carbonate, calcium hydroxide, magnesium hydroxide, barium sulfate, and calcium sulfate.

[0021] Furthermore, the auxiliary agent includes at least one of a color powder, an antistatic agent, a leveling agent, a defoaming agent, and a thermal conductive agent.

[0022] A method for preparing the composite epoxy film for SAW filter chip packaging, the preparation method is as follows:

[0023] (1) At room temperature, add the required amount of epoxy resin prepolymer, acrylic prepolymer, acrylic reactive diluent and additive into a reaction kettle, the speed of the stirring paddle is 500-1000 rpm, stir for 5-10 minutes, evacuate, add initiator, continue stirring for 5-10 minutes, then slowly add filler, continue stirring for 5-10 minutes, finally add latent curing agent and accelerator, continue stirring for 10-30 minutes, and obtain a resin composite for composite epoxy film.

[0024] (2) casting the resin composite into a film by a casting machine, coating the film on the surface of the support film, pre-curing at 80-100° C. for 10-60 min, and then cooling to room temperature to obtain a composite epoxy film for SAW filter chip packaging;

[0025] The support film is a polyester film, and the surface of the support film is pre-coated with a surface treatment agent, and the surface treatment agent includes at least one of a silicone oil surface treatment agent, a non-silicon surface treatment agent, and a fluorine surface treatment agent;

[0026] The thickness of the composite epoxy film for SAW filter chip packaging is 1-1000 μm.

[0027] The beneficial technical effects of the present invention are:

[0028] The system of the present invention does not contain solvents. During the film-forming process, there is no need to worry about solvent residues in the system, thereby achieving films of different thicknesses. Compared with the foreign multi-layer film stacking process, the system of the present invention can form films in one step, and the process is simpler. In addition, the shortcomings of organic solvents such as being flammable, explosive, toxic, and polluting the environment can be avoided.

[0029] The present invention uses a dual curing system of acrylic acid and epoxy resin, uses an acrylic acid system for pre-curing to form a film, and then uses an epoxy system for curing to meet performance requirements. The pre-curing of the acrylic acid system is to use a low-viscosity acrylic acid prepolymer under the action of an initiator to initiate the opening of carbon-carbon double bonds at both ends through free radicals, and a Michael addition reaction occurs, thereby forming an acrylic elastic network structure; compared with foreign patents that use solvents to dissolve thermoplastic elastomers to form films, the present invention can completely eliminate the use of solvents; compared with domestic patents that use epoxy resins for pre-curing to form films, it is difficult to control the degree of epoxy resin reaction and the stability is poor. The composite epoxy film of the present invention uses a dual curing system of acrylic acid and epoxy resin, and has better elongation, thermoplasticity and stability than a single epoxy resin and curing system. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of the reaction mechanism of the present invention.

[0031] Figure 2 This is an infrared spectrum of the composite epoxy film for SAW filter chip packaging prepared in Example 5 of the present invention.

[0032] Figure 3 This is a diagram showing the DSC heat release test results of the composite epoxy film for SAW filter chip packaging prepared in Example 5 of the present invention.

[0033] Figure 4 This is a DSC heat release test result diagram of the composite epoxy film for SAW filter chip packaging prepared in Comparative Example 2 of the present invention. DETAILED DESCRIPTION

[0034] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0035] The acrylic prepolymer described in the present invention includes one or more of epoxy acrylic prepolymer, polyurethane acrylic prepolymer, polyester acrylic prepolymer, and amine-modified acrylic prepolymer; wherein the epoxy acrylic prepolymer is selected from at least one of Sartomer CN104 NS, Sartomer CN120 NS, Sartomer CN2003 NS, and Sartomer CE208 NS; the polyurethane acrylic prepolymer is selected from Sartomer CN964 NS, Sartomer CN8888 NS, Sartomer CN8891 NS, and Sartomer CN9178 NS, Guojing Chemical DFJG101, Guojing Chemical DFJG111, Guojing Chemical DFJG301, Guojing Chemical DFJG502; the polyester acrylic prepolymer is selected from at least one of Changxing EM221-TF, Changxing EM222-TF, Changxing EM223-TF, Changxing EM231-TF, Changxing EM2216-TF, Changxing EM2251-TF, Changxing EM2380-TF, Changxing EM2387-TF; the amine-modified acrylic prepolymer is selected from at least one of Guojing Chemical DFJG201, Guojing Chemical DFJG202, Guojing Chemical DFJG602, Guojing Chemical DFJG803.

[0036] The acrylic reactive diluent described in the present invention is a monofunctional acrylic reactive diluent or a multifunctional acrylic reactive diluent; wherein the monofunctional acrylic reactive diluent is selected from at least one of β-hydroxyethyl methacrylate, isobornyl acrylate, β-hydroxyethyl acrylate, and 2-phenoxyethyl acrylate; and the multifunctional acrylic reactive diluent is selected from at least one of dipropylene glycol diacrylate, tripropylene glycol diacrylate, polyethylene glycol (200) dimethacrylate, and polyethylene glycol (400) dimethacrylate.

[0037] The initiator in the present invention includes at least one of an azo initiator and a peroxide initiator. The azo initiator is selected from at least one of azobisisobutyronitrile, azobisisoheptanenitrile and dimethyl azobisisobutyrate; the peroxide initiator is selected from at least one of benzoyl peroxide, tert-butyl benzoyl peroxide and methyl ethyl ketone peroxide.

[0038] When the initiator in the comparative example of the present invention is an ionic initiator, it is selected from Xibo Chemical SI-60L, Xibo Chemical SI-100L or Xibo Chemical SI-150L.

[0039] The epoxy resin prepolymer described in the present invention includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, brominated epoxy resin, naphthalene-containing epoxy resin, biphenyl epoxy resin, o-cresol epoxy resin, polyether-modified epoxy resin, dicyclopentadiene epoxy resin, flexible block epoxy resin, phenolic epoxy resin, and dimer acid-modified epoxy resin. Among them, the bisphenol A type epoxy resin is selected from at least one of Nanya NPEL-127E, Nanya NPEL-128E, and Nanya NPEL-134; the bisphenol F type epoxy resin is selected from at least one of Nanya NPEL-175, Nanya NPEL-180, and Nanya NPEL-185; the alicyclic epoxy resin is selected from at least one of Daicel's 2021P, Synasia's S-06E, Tytel's TTA21P, and Dongrun DR-126A; the brominated epoxy resin is selected from at least one of Nanya NPEB-340, Nanya NPEB-428, and Nanya NPEB-462; the naphthalene-containing epoxy resin is selected from Mitsubishi Chemical 828EL , Mitsubishi Chemical 825, Mitsubishi Chemical YL980; dicyclopentadiene epoxy resin is selected from at least one of Shengquan SH-7090, Shengquan SH-7110, and Shengquan SH-7130; flexible block epoxy resin is selected from at least one of Nanya NPER-133, Nanya NPER-133L, and Nanya NPER-450; phenolic epoxy resin is selected from at least one of Nanya NPPN-631, Nanya NPCN-701, and Nanya NPCN-702; dimer acid modified epoxy resin is selected from at least one of Nanya NPER-172, Nanya NPER-173R, and Nanya NPER-174X90. The latent curing agent in the present invention includes at least one of microcapsule-encapsulated curing agent, amine curing agent, imidazole curing agent, phenolic curing agent, organic acid anhydride curing agent, organic hydrazide curing agent, and Lewis acid curing agent.The microcapsule-encapsulated curing agent is selected from at least one of HX-3921HP of Asahi Chemical, HXA3922HP of Asahi Chemical, Huntsman 2844, Huntsman 3123, and Huntsman 9664-1; the amine curing agent is selected from DICYANEX 1400F of Air Chemical, Dyhard 100S, at least one of Ajinomoto AH-154, Ajinomoto AH-162, and Halo High-tech HAA-1020; the imidazole curing agent is selected from at least one of 2MA-OK of Shikoku Chemical, 2PHZ of Shikoku Chemical, Ajinomoto PN-40, Ajinomoto PN-50, and Ajinomoto PN-H; the phenolic curing agent is selected from at least one of the imidazole curing agents of the same type of structure of Meiwa Chemical H series, HF series, DL series, 7500 series, 7600 series, 7800 series, 7851 series or other manufacturers; the organic acid anhydride curing agent is selected from at least one of methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hydrogenated trimellitic anhydride, and methyl nadic anhydride; the organic hydrazide curing agent is selected from at least one of Ajinomoto ADH, Ajinomoto VDH, and Ajinomoto UDH; the Lewis acid curing agent is selected from at least one of stannous chloride, boron trifluoride complex, and aluminum chloride.

[0040] The accelerator described in the present invention includes at least one of imidazole accelerators, amine accelerators, organic phosphine curing accelerators, and metal compound accelerators. Among them, the imidazole accelerator is selected from at least one of 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and 1-cyanoethyl-2-phenylimidazole; the amine accelerator is selected from at least one of triethanolamine, tripropylamine, and o-hydroxybenzyldimethylamine; the organic phosphine curing accelerator is selected from at least one of tetraphenylphosphine dihydroxynaphthalene, diphenylphosphine, and tributylphosphine; the metal compound accelerator is selected from at least one of tetrabutylammonium hydroxide, tetrabutylammonium bromide, and acetylacetone metal complex.

[0041] The filler in the present invention includes at least one of titanium dioxide, aluminum oxide, silicon dioxide, talc, glass beads, montmorillonite, aluminum nitride, boron nitride, silicon nitride, calcium carbonate, calcium hydroxide, magnesium hydroxide, barium sulfate, and calcium sulfate. The silicon dioxide is selected from at least one of spherical fused silica powder NQ2040GE with an average particle size of 5 μm and spherical fused silica powder NQ2130CE with an average particle size of 20 μm.

[0042] The polyester film used in the following examples is a polyester film pre-coated with a silicone oil surface treatment agent, purchased from Jiangsu Stdick New Materials Technology Co., Ltd., with a product number of SDKLX0916.

[0043] Figure 1Schematic diagram of the reaction mechanism of the present invention, wherein a is a schematic diagram of the reaction mechanism of the acrylic system, in which the carbon-carbon double bonds form a long-chain network structure through the Michael reaction, thereby having good elongation and resilience; b is a schematic diagram of the reaction mechanism of the epoxy resin system, in which the epoxy group is opened by the epoxy resin curing agent, and the epoxy group and the terminal hydroxyl group generated by the reaction continue to react to form a highly cross-linked network structure, thereby having excellent performance.

[0044] Table 1 Material list of each component of composite epoxy film for SAW filter chip packaging

[0045]

[0046]

[0047]

[0048] Example 1

[0049] A composite epoxy film for SAW filter chip packaging, the components and contents of which are shown in Table 1 by weight.

[0050] A method for preparing a composite epoxy film for SAW filter chip packaging, comprising the following steps

[0051] (1) At room temperature, epoxy resin prepolymer, acrylic prepolymer, acrylic reactive diluent and additives were added to a reaction kettle according to the amounts of raw materials in Table 1. The speed of the stirring paddle was 800 rpm. After stirring for 5 minutes, vacuum was evacuated, an initiator was added, and stirring was continued for 5 minutes. Then, fillers were slowly added and stirring was continued for 5 minutes. Finally, a latent curing agent and an accelerator were added and stirring was continued for 30 minutes to obtain a resin composite for a composite epoxy film.

[0052] (2) The resin composite was cast into a film by a casting machine, coated on the surface of the polyester film, pre-cured at 80° C. for 30 minutes, and then cooled at room temperature to obtain a composite epoxy film for 300 μm SAW filter chip packaging.

[0053] Embodiment 2-6

[0054] Examples 2-6 respectively prepare composite epoxy films for SAW filter chip packaging. The components and contents of Examples 2-6 are shown in Table 1 in terms of mass fraction.

[0055] The preparation method of the composite epoxy film for SAW filter chip packaging in Example 2-6 is the same as that in Example 1.

[0056] Comparative Examples 1-6

[0057] Comparative Examples 1-6 respectively prepare composite epoxy films for SAW filter chip packaging. The components and contents of Comparative Examples 1-6 are shown in Table 1 in terms of mass fraction.

[0058] The preparation method of the composite epoxy film for SAW filter chip packaging in Comparative Example 1-6 is the same as that in Example 1.

[0059] Test Case

[0060] 1. Composite epoxy film performance test

[0061] The following tests were performed on Examples 1-6 and Comparative Examples 1-3 of the present invention:

[0062] (1) Elongation: Tested using a universal testing machine in accordance with GB / T 18173.1-2000.

[0063] (2) Tensile strength: tested using a universal testing machine in accordance with GB / T13022-1991.

[0064] (3) Glass transition temperature Tg: measured using a differential scanning calorimeter in accordance with GB / T 19466.2-2004.

[0065] (4) Coefficient of thermal expansion CTE: tested using a thermomechanical analyzer in accordance with GB / T 36800.2-2018.

[0066] (5) Shear bond strength: tested using a universal testing machine in accordance with GB / T 7124-2008.

[0067] The performance test results are shown in Table 2.

[0068] Table 2 Performance test table of embodiments and comparative examples

[0069]

[0070] Note: The elongation in the performance of composite epoxy film refers to the elongation of the composite epoxy film before storage.

[0071] From the above test results, it can be known that the composite epoxy film prepared by the present invention has a large elongation, an adjustable glass transition temperature, a low thermal linear expansion coefficient and excellent shear bonding performance. The structure of the acrylic acid reactive diluent will have a great influence on the elongation of the composite epoxy film. When a monofunctional acrylate reactive diluent or a multifunctional acrylate reactive diluent is used, the elongation is large, and when 1,6-hexanediol diacrylate is used, the elongation of the composite epoxy film is significantly reduced, and the chip packaging requirements of the SAW filter cannot be met. The initiator in the present invention can be an azo initiator or a peroxide initiator, which is significantly better than an ionic initiator in terms of elongation and can meet the chip packaging requirements of the SAW filter. When the initiator is an azo initiator, the effect is better; the composite epoxy film of the present invention has good storage stability, and the elongation after being stored at -40°C for 30 days is not much different from the elongation of the composite epoxy film before storage. Therefore, the present invention optimizes the raw material components to obtain a composite epoxy film for SAW filter chip packaging with excellent performance after curing, which can meet the requirements of chip packaging of SAW filters with complex structures.

[0072] 2. FTIR analysis

[0073] The composite epoxy film prepared in Example 5 of the present invention, the epoxy resin prepolymer (NPEL-127E) in Example 5 of the present invention, and the composite epoxy film prepared in Example 5 of the present invention after curing at 150° C. for 3 h were analyzed by FTIR using a Thermo Fisher IS20 Fourier transform infrared spectrometer (FTIR). The results are as follows: Figure 2 As shown. Figure 2 As can be seen from the results, the infrared characteristic spectra of the epoxy resin prepolymer (NPEL-127E) of Example 5 and the composite epoxy film of Example 5 show that at the wave number of 1753 cm -1 Nearby, the characteristic peak disappears obviously, indicating that Michael addition reaction occurs on the carbon-carbon double bond. In addition, the wave number 914cm -1 The intensity of the characteristic peak near 914 cm-1 did not change, indicating that the epoxy group was basically unreacted; the infrared characteristic spectra of the composite epoxy film of Example 5 and the composite epoxy film of Example 5 after curing at 150°C for 3h were compared. -1 Nearby, it can be clearly seen that the characteristic peak disappears, indicating that the epoxy group has reacted.

[0074] 3.DSC exothermic test

[0075] The composite epoxy films prepared in Example 5 and Comparative Example 2 were tested for heat release using a Netzsch DSC300 differential scanning calorimeter. The results were as follows: Figure 3 , Figure 4 As shown. Figure 3 The results show that the acrylic curing system and epoxy curing system of the composite epoxy film prepared by the present invention are independent of each other. Therefore, the stability of the composite epoxy film can be improved by regulating the reaction activity of each system. Figure 4 The results show that there is a cross-relationship between the acrylic curing system and the epoxy curing system of the composite epoxy film prepared in Comparative Example 2, resulting in poor stability of the composite epoxy film.

[0076] The above is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.

Claims

1. A composite epoxy film for SAW filter chip packaging, characterized in that: The composite epoxy film for SAW filter chip packaging is composed of an acrylic curing system and an epoxy resin system; The mass fractions of each raw material in the acrylic acid curing system are: Acrylic prepolymer 10-50 parts Acrylic acid reactive diluent 2-10 parts Initiator 0.1~0.5 parts The mass fractions of each raw material in the epoxy resin system are:

2. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The acrylic prepolymer includes one or more of epoxy acrylic prepolymer, polyurethane acrylic prepolymer, polyester acrylic prepolymer and amine-modified acrylic prepolymer.

3. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The acrylic reactive diluent is a monofunctional acrylic reactive diluent or a multifunctional acrylic reactive diluent; the monofunctional acrylic reactive diluent is selected from at least one of β-hydroxyethyl methacrylate, isoborneol methacrylate, β-hydroxyethyl acrylate, and 2-phenoxyethyl acrylate; the multifunctional acrylic reactive diluent is selected from at least one of dipropylene glycol diacrylate, tripropylene glycol diacrylate, polyethylene glycol (200) dimethacrylate, and polyethylene glycol (400) dimethacrylate.

4. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The initiator comprises at least one of an azo initiator and a peroxide initiator; the azo initiator is selected from at least one of azobisisobutyronitrile, azobisisoheptanenitrile and dimethyl azobisisobutyrate; the peroxide initiator is selected from at least one of benzoyl peroxide, tert-butyl benzoyl peroxide and methyl ethyl ketone peroxide.

5. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The epoxy resin prepolymer includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, brominated epoxy resin, naphthalene-containing epoxy resin, biphenyl epoxy resin, o-cresol epoxy resin, polyether modified epoxy resin, dicyclopentadiene epoxy resin, flexible block epoxy resin, phenolic epoxy resin, and dimer acid modified epoxy resin.

6. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The latent curing agent includes at least one of a microcapsule-encapsulated curing agent, an amine curing agent, an imidazole curing agent, a phenolic curing agent, an organic acid anhydride curing agent, an organic hydrazide curing agent, and a Lewis acid curing agent, wherein the microcapsule-encapsulated curing agent includes at least one of a microcapsule-encapsulated modified aliphatic amine curing agent and a microcapsule-encapsulated aromatic diamine curing agent.

7. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The accelerator includes at least one of an imidazole accelerator, an amine accelerator, an organic phosphine curing accelerator, and a metal compound accelerator.

8. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The filler includes at least one of titanium dioxide, aluminum oxide, silicon dioxide, talc, glass beads, montmorillonite, aluminum nitride, boron nitride, silicon nitride, calcium carbonate, calcium hydroxide, magnesium hydroxide, barium sulfate, and calcium sulfate.

9. The composite epoxy film for SAW filter chip packaging according to claim 1, characterized in that: The auxiliary agent includes at least one of a color powder, an antistatic agent, a leveling agent, a defoaming agent, and a thermal conductive agent.

10. A method for preparing the composite epoxy film for SAW filter chip packaging according to any one of claims 1 to 9, characterized in that: The preparation method is specifically as follows: (1) At room temperature, adding the required amount of epoxy resin prepolymer, acrylic prepolymer, acrylic reactive diluent and auxiliary agent into a reaction kettle, the speed of the stirring paddle is 500-1000 rpm, stirring for 5-10 minutes, evacuating, adding the initiator, continuing to stir for 5-10 minutes, then slowly adding the filler, continuing to stir for 5-10 minutes, and finally adding the latent curing agent and accelerator, continuing to stir for 10-30 minutes, to obtain a resin composite for composite epoxy film; (2) casting the resin composite into a film by a casting machine, coating the film on the surface of the support film, pre-curing at 80-100° C. for 10-60 min, and then cooling to room temperature to obtain a composite epoxy film for SAW filter chip packaging; The support film is a polyester film, and the surface of the support film is pre-coated with a surface treatment agent, and the surface treatment agent includes at least one of a silicone oil surface treatment agent, a non-silicon surface treatment agent, and a fluorine surface treatment agent; The thickness of the composite epoxy film for SAW filter chip packaging is 1-1000 μm.

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