Portable radiation heat transfer sensing test system

Abstract

A portable radiation heat flow sensing test system provided by the present invention comprises a radiation heat flow sensor, the radiation heat flow sensor comprises a copper heat sink, a constantan wire, a copper column and a base, a flow channel is arranged in the copper heat sink, two ends of the flow channel are provided with a water inlet and a water outlet, the copper column is arranged in the flow channel in a penetrating manner, and the constantan wire is arranged in the copper column through a glass tube in an isolated manner. The base penetrates out of the base; the cooling water circulation control system comprises a water inlet pipe, a control box body and a water outlet pipe which are connected in sequence, the water inlet pipe and the water outlet pipe are connected with the water inlet and the water outlet respectively, and refrigeration semiconductors are laid on the water inlet pipe and the water outlet pipe. The radiation heat flow sensor and the cooling device are integrally designed, the product portability is improved, the product application scene is expanded, an external water cooling system does not need to be placed on a test site, and the radiation heat flow sensor has better stability, reliability and high temperature resistance.

Description

Technical Field

[0001] The invention relates to the technical field of radiation high temperature measurement, in particular to a portable radiation heat flow sensing test system. Background Art

[0002] With the continuous breakthroughs in my country's aerospace technology, the application scenarios of advanced weapons and equipment have become increasingly complex and extreme. In these extreme environments, how to accurately evaluate the thermal parameters of equipment has become an important part of ensuring the performance and safety of weapon systems. In particular, the measurement of radiation heat flux is directly related to the thermal management and temperature control of the system, which is crucial to the reliability of equipment under high temperature and high speed conditions. In this process, radiation heat flux sensors play an important role. The radiation heat flux sensor senses the radiation temperature through its temperature sensing surface, and uses a reasonable structural design to generate a temperature gradient from the center to the surrounding of the temperature sensing surface. The output result is expressed as radiation heat flux. This technology provides a more accurate means for measuring heat flux and also provides key data support for the thermal management system of equipment. However, many current radiation heat flux sensors are still independent of the water cooling system and lack effective fusion and collaboration. The water cooling system is often used to dissipate heat to maintain the stability of the equipment temperature, but due to the inconsistent temperature of the water cooling system, the compatibility issues between the water pipe and the heat flux sensor, and the leakage and seepage caused by the aging of the water pipe, the accuracy and long-term stability of the sensor are seriously affected. These problems not only affect the accurate measurement of radiation heat flux, but also reduce the portability of the equipment. Especially in some complex environments, the maintenance and operation of the system become more cumbersome.

[0003] In order to improve the working accuracy of the radiation heat flux sensor and the overall reliability of the system, it is necessary to optimize and improve the existing technology. On the one hand, the temperature consistency and stability of the water cooling system can be ensured by improving the temperature control design of the water cooling system; on the other hand, the compatibility issues between the heat flux sensor and the water cooling system can be eliminated by combining the design of the heat flux sensor and the water cooling system to improve the overall performance of the system. In addition, the selection of water pipe materials and structures also needs to pay more attention to their durability and anti-leakage to improve the long-term stability of the system. Through these technical improvements, not only can the measurement accuracy of the radiation heat flux sensor be improved, but also the performance of the equipment in extreme environments can be enhanced, laying a solid foundation for the further development of my country's aerospace technology. Disadvantages of the existing technology: 1. The radiation heat flux sensor needs to be water-cooled when in use, and the external water cooling equipment is large and inconvenient to carry. 2. The radiation heat flux sensor and the water cooling equipment are often connected with non-metallic pipes, and there are problems such as aging and leakage after long-term use. Summary of the invention

[0004] In order to solve the above technical problems existing in the prior art, the present invention proposes a portable radiation heat flow sensing test system to solve the above technical problems.

[0005] The present invention proposes a portable radiation heat flow sensing test system, comprising: The radiation heat flow sensor comprises a copper heat sink, a constantan wire, a copper column and a base. A flow channel is arranged in the copper heat sink and a water inlet and a water outlet are arranged at both ends of the flow channel. The copper column is arranged through the flow channel. The constantan wire is installed in the copper column through a glass tube isolation and passes through the base. The cooling water circulation control system includes an inlet pipe, a control box and an outlet pipe connected in sequence, the inlet pipe and the outlet pipe are connected to the water inlet and the water outlet respectively, and refrigeration semiconductors are laid on the inlet pipe and the outlet pipe. By organically combining the radiation heat flux sensor with the cooling water circulation control system, the two are structurally coordinated to ensure that the system can continue to work stably in a high temperature environment, avoid sensor performance degradation or damage due to overheating, thereby extending the service life of the system and improving the reliability and long-term stability of the system.

[0006] In some specific embodiments, a constantan film is applied to the upper surface of the probe of the radiation heat flux sensor, and a carbon black layer is printed on the surface of the constantan film. The application of the constantan film helps to form a more stable temperature field on the upper surface of the probe of the radiation heat flux sensor, and cooperates with the copper heat sink and the internal structure to enable the probe to more accurately generate a temperature gradient from the center to the surroundings when it is subjected to radiation heat flux. The precise formation of this temperature gradient is crucial for accurately measuring the radiation heat flux, because the radiation heat flux sensor works based on this principle, and calculates the radiation heat flux by measuring the temperature gradient, thereby improving the accuracy and reliability of the measurement results.

[0007] In some specific embodiments, the carbon black layer covers the temperature-sensing surface of the radiation heat flux sensor, and the carbon black layer includes high-temperature resistant black paint and carbon black colloid. The carbon black layer has good light absorption and heat generation characteristics. After covering the surface of the constantan film, it can absorb the radiation heat flux more efficiently and convert it into heat to transfer to the constantan film and the copper heat sink, thereby improving the conversion efficiency of the entire sensor to the radiation heat flux. This enables the sensor to more sensitively sense changes in the radiation heat flux, and can produce obvious temperature changes even at lower radiation heat flux intensities, thereby improving the sensitivity and measurement lower limit of the sensor and broadening the application range of the sensor.

[0008] In some specific embodiments, the diameter of the probe is not less than 10 mm, the diameter of the constantan film is not less than 2 mm, and the heat flux expression of the radiation heat flux sensor is: ,in, It represents the temperature difference determined by the radiation temperature curve of the copper-constantan thermocouple, γ is the thermal conductivity of the constantan film, R is the radius of the constantan film, and L is the thickness of the constantan film. The size or material of the constantan film can be adjusted according to actual needs to optimize the performance indicators of the sensor such as sensitivity, response speed and measurement range.

[0009] In some specific embodiments, the water inlet, the water inlet pipe, the control box, the water outlet pipe, and the connection between the water outlet are coated with high temperature resistant resin, and the water inlet pipe and the water outlet pipe are made of aluminum alloy. With this arrangement, the firmness and sealing of the connection between the components are effectively enhanced. In a high temperature environment, the high temperature resistant resin can prevent the connection from loosening or leaking due to thermal expansion and contraction, ensure the normal operation of the cooling water circulation system, avoid system failures and safety hazards caused by water leakage, and improve the overall reliability and stability of the system.

[0010] In some specific embodiments, the water inlet pipe and the water outlet pipe are U-shaped structures, and the copper heat sink, the water inlet pipe, the control box and the water outlet pipe are connected in sequence to form a ring structure. With this arrangement, the spatial layout of the entire test system is more reasonable and compact. The effective connection and layout of each component is achieved in a limited space, the volume and floor space of the system are reduced, the portability of the system is improved, and it is convenient to install and use in different test environments, especially suitable for occasions with limited space or requirements for the volume of the equipment.

[0011] In some specific embodiments, the bottom of the U-shaped structure of the water inlet pipe and the water outlet pipe has a larger size than the two sides, and the refrigeration semiconductor is laid on the bottom surface of the U-shaped structure of the water inlet pipe and the water outlet pipe. With this setting, a wider installation space is provided for the refrigeration semiconductor, which is conducive to increasing the contact area between the refrigeration semiconductor and the water pipe. In this way, the cold energy generated by the refrigeration semiconductor can be more effectively transferred to the cooling water in the water pipe, the refrigeration efficiency is improved, the cooling effect on the radiation heat flux sensor is enhanced, and the sensor can be ensured to work normally in a high temperature environment, thereby improving the heat dissipation performance and stability of the system.

[0012] In some specific embodiments, the control box is provided with a power supply, a control module, a drive module and a micro water pump which are electrically connected to each other, the electrode leads of the refrigeration semiconductor are connected to the drive module in the control box, and the gaps between the power supply, the control module, the drive module and the micro water pump are filled with epoxy resin. The gaps between the power supply, the control module, the drive module and the micro water pump are filled with epoxy resin, which plays a good role in shockproof, heat insulation and fixing. Epoxy resin can effectively reduce the mutual interference of each component caused by vibration during operation, and protect the internal circuit and components from damage; at the same time, the heat insulation performance helps to maintain the stable working temperature of each component, avoid the performance being affected by excessively high or low temperature, further improve the reliability and stability of the system, and extend the service life of each component.

[0013] In some specific embodiments, constantan leads and copper leads are also included, which are connected to constantan wires and copper heat sinks respectively, and both pass through the base, which is filled with epoxy resin. This connection method ensures that the electrical signal generated by the sensor measurement can be stably and accurately transmitted to the external measuring device. Filling the base with epoxy resin fixes and protects the leads, prevents the leads from being pulled, worn or short-circuited during use, ensures the integrity and stability of signal transmission, and thus improves the accuracy and reliability of the measurement results.

[0014] In some specific embodiments, the upper limit of the long-term radiation temperature of the portable radiation heat flow sensing test system is 1200°C, and the laying density is 5MW / ㎡; it can withstand a short-term radiation temperature of 1700°C, a radiation heat flux density of 20MW / ㎡, and a transient temperature resistance of more than 2000°C. The portable radiation heat flow sensing test system has excellent high temperature resistance, which enables the system to work normally in an environment of extremely high temperature and strong radiation heat flux. It is suitable for high temperature testing needs in many fields such as aerospace, energy, and materials, such as aircraft engine hot component testing, radiation heat flux measurement in high temperature furnaces, etc., which greatly broadens the application scope of the system.

[0015] The portable radiation heat flow sensing test system proposed by the present invention has the following technical effects: 1. The integrated design of the radiation heat flux sensor and the cooling device improves the portability of the product and expands the product application scenarios. There is no need to place an external water cooling system at the test site, which greatly reduces the safety hazards of the test process.

[0016] 2. The surface heat absorption layer is made of carbon black material, which has a long-term temperature resistance of up to 1200°C and a transient temperature resistance of over 2000°C. This material can improve the conversion efficiency of the radiation heat flow on the sensor surface and effectively improve the sensor test accuracy. 3. Using refrigeration semiconductor as the cooling source, the refrigeration effect is good. The upper limit of radiation temperature in long-term use can reach 1200℃, and the radiation heat flux density can reach 5MW / ㎡. It can withstand short-term (no more than 10s) radiation temperature of 1700℃, and the radiation heat flux density can reach 20MW / ㎡. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate the embodiments and together with the description are used to explain the principles of the present invention. Other embodiments and many of the expected advantages of the embodiments will be readily appreciated as they become better understood by reference to the following detailed description. Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of the non-limiting embodiments made with reference to the following drawings: Figure 1is a structural schematic diagram of a portable radiation heat flow sensing test system according to an embodiment of the invention; Figure 2 is a schematic diagram of the overall cross-sectional structure of a radiation heat flux sensor according to a specific embodiment of the invention; Figure 3 is a detailed diagram of a temperature sensing surface of a radiation heat flux sensor according to a specific embodiment of the invention; Figure 4 It is a schematic diagram of the internal modules of a control box of a cooling water circulation control system according to a specific embodiment of the invention; Figure 5 It is a comparative data diagram of ordinary water cooling according to a specific embodiment of the present invention and the cooling water circulation control system in this application. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the relevant invention are shown in the accompanying drawings.

[0019] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0020] Figure 1 FIG. 4 shows a schematic structural diagram of a portable radiation heat flow sensing test system according to an embodiment of the invention. Figure 1 As shown in the figure, the portable radiation heat flow sensing test system mainly includes two main parts: radiation heat flow sensor and cooling water circulation control system. Figure 2The schematic diagram of the overall cross-sectional structure of a radiation heat flux sensor according to a specific embodiment of the invention is shown. The inside of the radiation heat flux sensor 1, the copper heat sink 11 is a key component, and a flow channel is set inside it. The two ends of the flow channel are precisely equipped with a water inlet (such as the water inlet 2 of the copper heat sink) and a water outlet (such as the water outlet 7 of the copper heat sink) to form a complete water circulation channel. The copper column 12 cleverly runs through the flow channel, and the copper wire 14 is installed in the copper column 12 through a glass tube 13 to ensure good insulation performance, and the copper wire 14 passes through the base 17 to prepare for subsequent signal transmission. In the cooling water circulation control system, the water inlet pipe 4, the control box 6 and the water outlet pipe 8 are connected in sequence, and the water inlet pipe 4 and the water outlet pipe 8 are tightly connected to the water inlet 2 and the water outlet 7 of the copper heat sink 11 of the radiation heat flux sensor, respectively, and the connection is coated with a high temperature resistant resin to ensure the firmness and sealing of the connection and effectively prevent water leakage. The water inlet pipe 4 and the water outlet pipe 8 are made of aluminum alloy, which has good heat dissipation performance and can quickly dissipate heat to ensure stable operation of the system. At the same time, the water inlet pipe 4 and the water outlet pipe 8 are both provided with refrigeration semiconductors (such as Figure 1 The refrigeration semiconductor 5 of the water inlet pipe and the refrigeration semiconductor 9 of the water outlet pipe shown in the figure are precisely controlled by the control box 6 to achieve efficient cooling of the system.

[0021] In a specific embodiment, the temperature sensing probe of the radiation heat flux sensor 11 is designed with a thread 20 structure to facilitate the installation and fixation of the entire system. The radiation heat flux sensor temperature sensing surface 10 is provided on the upper surface 19 of the copper heat sink of the radiation heat flux sensor, and a layer of constantan film 22 (such as Figure 2 , Figure 3 As shown in FIG. 1 , this film plays an important role in improving the performance of the sensor. A carbon black layer 21 is printed on the surface of the constantan film 22, and the carbon black layer 21 fully covers the temperature sensing surface 10 of the radiation heat flux sensor, and the carbon black layer 21 is composed of special materials such as high-temperature resistant black paint and carbon black colloid. When the radiation heat flux acts on the sensor, the carbon black layer 21 can efficiently absorb the radiation heat flux by virtue of its excellent light absorption and heat generation characteristics, and quickly convert it into heat and transfer it to the constantan film 22 and the copper heat sink 11. For example, in actual tests, when the radiation heat flux intensity is low, the carbon black layer 21 can make the sensor more sensitive to temperature changes, improve the sensitivity of the sensor, reduce the lower limit of measurement, and thus broaden the application range of the sensor. At the same time, the constantan film 22 cooperates with the copper heat sink 11 and the internal structure, and when subjected to the radiation heat flux, it can more accurately generate a temperature gradient from the center to the surroundings, which is crucial for sensors that measure radiation heat flux based on temperature gradients, and greatly improves the accuracy and reliability of the measurement results.

[0022] Figure 3 FIG. 4 shows a detailed diagram of the temperature sensing surface of a radiation heat flux sensor according to a specific embodiment of the invention. Figure 3As shown, the diameter of the probe of the radiation heat flux sensor 1 (the part where the radiation heat flux sensor temperature sensing surface 10 is located) is designed to be no less than 10 mm, and the diameter of the constantan film 22 is no less than 2 mm. The heat flux expression is ,in, Represents the temperature difference determined by the radiation temperature curve of the copper-constantan thermocouple, γ is the thermal conductivity of the constantan film 22, R is the radius of the constantan film 22, and L is the thickness of the constantan film 22. This expression provides a solid theoretical basis for accurately calculating the radiation heat flux. In practical applications, users can accurately calculate the magnitude of the radiation heat flux based on the measured and known parameters of the constantan film 22, γ, R, and L. For example, when testing the hot parts of the engine in the aerospace field, by accurately measuring the temperature difference and combining the structural parameters of the sensor, the distribution of the radiation heat flux on the surface of the hot parts can be accurately obtained, providing key data support for the thermal management and performance optimization of the engine. At the same time, according to different test requirements, the size or material of the constantan film 22 can be flexibly adjusted to further optimize the performance indicators such as the sensitivity, response speed, and measurement range of the sensor to adapt to diverse test environments and requirements.

[0023] In a specific embodiment, in the cooling water circulation system, the connection poles between the water inlet (the water inlet 2 of the copper heat sink), the water inlet pipe 4, the control box 6, the water outlet pipe 8, and the water outlet (the water outlet 7 of the copper heat sink) are coated with high temperature resistant resin, which performs well in high temperature environments and can effectively cope with thermal expansion and contraction, ensuring that the connection is always firm and will not loosen or leak due to temperature changes. The water inlet pipe 4 and the water outlet pipe 8 are made of aluminum alloy, which not only has good heat dissipation performance, but can quickly dissipate the heat absorbed by the refrigeration semiconductor (the refrigeration semiconductor 5 of the water inlet pipe and the refrigeration semiconductor 9 of the water outlet pipe) to improve the cooling efficiency, and the aluminum alloy material has strong corrosion resistance, can adapt to complex working environments, and extend the service life of the water pipe. Preferably, the water inlet pipe 4 and the water outlet pipe 8 are designed as a U-shaped structure, and the copper heat sink 11, the water inlet pipe 4, the control box 6 and the water outlet pipe 8 are connected in sequence to form an annular integrated structure. The annular structure design allows the cooling water to circulate evenly in the system to ensure that all parts of the copper heat sink 11 can be fully cooled. In the actual operation process, cooling water flows in from the water inlet pipe 4, enters the copper heat sink 11 after being cooled by the refrigeration semiconductor, takes away the heat and then flows out through the water outlet pipe 8. The whole process circulates smoothly, ensuring the stable operation of the system. Further preferably, the bottom of the U-shaped structure of the water inlet pipe 4 and the water outlet pipe 8 has a larger size than the two sides, and the refrigeration semiconductor (the refrigeration semiconductor 5 of the water inlet pipe and the refrigeration semiconductor 9 of the water outlet pipe) is laid on the bottom surface of the U-shaped structure. This setting provides a wider installation space for the refrigeration semiconductor, greatly increasing the contact area between the refrigeration semiconductor and the water pipe. When working, the cold energy generated by the refrigeration semiconductor can be more efficiently transferred to the cooling water in the water pipe. For example, when the system is running in a high temperature environment, the refrigeration semiconductor starts quickly, and the cold energy is quickly transferred through the large area of ​​contact at the bottom, so that the temperature of the cooling water is rapidly reduced, and then the cooling water enters the copper heat sink 11 to absorb heat, thereby achieving effective cooling of the radiation heat flux sensor, ensuring that the sensor can work normally in a high temperature environment, and significantly improving the heat dissipation performance and stability of the system. At the same time, the reasonable structural design also improves the working efficiency of the refrigeration semiconductor, extends its service life, and reduces the maintenance cost of the system.

[0024] Continue to refer Figure 4 , Figure 4 FIG. 1 shows a schematic diagram of the internal modules of a control box of a cooling water circulation control system according to a specific embodiment of the invention. Figure 4As shown, the control box 6 is provided with a power supply 23, a power management module 26, a control module 27, a drive module 28 and a micro water pump 25 which are electrically connected to each other. The power management module 26 is used to manage the power supply 23 to ensure that the output current, voltage and power of the power supply 23 meet the requirements of each module. The power management module 26 provides the required power to the micro water pump 25, the control module 27 and the drive module 28. The control module 27 is used to control the drive module 28. The drive module 28 is connected to the micro water pump 25, and the control module 27 controls the working state of the micro water pump 25. The modules work together to achieve precise control of the entire cooling water circulation control system. The electrode leads of the refrigeration semiconductor (the refrigeration semiconductor 5 of the water inlet pipe and the refrigeration semiconductor 9 of the water outlet pipe) are connected to the drive module 28 in the control box 6, and the working state of the refrigeration semiconductor is precisely regulated by the drive module 28. The gaps between the power supply 23, the power management module 26, the control module 27, the drive module 28 and the micro water pump 25 are filled with epoxy resin, which plays multiple roles: on the one hand, it has good shockproof performance, which can effectively reduce the mutual interference of the components caused by vibration during operation, and protect the internal circuits and components from damage. For example, when the system encounters bumps or vibrations during transportation or operation, epoxy resin can ensure that the components remain stable and work normally; on the other hand, the heat insulation performance of epoxy resin helps to maintain the stable working temperature of each component, avoiding the impact of excessively high or low temperatures on its performance. In a high temperature environment, it can prevent external heat from entering the control box 6 and protect the internal components; in a low temperature environment, it can reduce internal heat loss and ensure that each component works within a suitable temperature range, further improving the reliability and stability of the system and extending the service life of each component.

[0025] In a specific embodiment, the radiation heat flow sensing test system also includes positive and negative electrode leads 3, specifically including a constantan lead 16 and a copper lead 15, the constantan lead 16 and the copper lead 15 are respectively connected to the constantan wire 14 and the copper heat sink 11, and both pass through the base 17. This connection method ensures that the electrical signal generated by the sensor measurement can be stably and accurately transmitted to the external measuring device. The base 17 is filled with epoxy resin 18, and the epoxy resin 18 plays an all-round fixing and protective role on the leads. In daily use, the epoxy resin 18 prevents the leads from shifting or loosening when slightly pulled or shaken, avoiding signal transmission interruption or instability caused by poor contact of the leads. At the same time, the epoxy resin 18 fills the gaps in the base 17, enhances the structural integrity of the entire radiation heat flow sensor, and makes the connection between the components tighter and more stable. In different working environments, such as high temperature, humidity or certain mechanical vibration, the epoxy resin 18 in the base 17 can effectively protect the leads and other internal components, reduce performance degradation or failures caused by environmental factors, ensure the integrity and stability of signal transmission, and thus improve the accuracy and reliability of the measurement results.

[0026] In a specific embodiment, when the power is turned on, the cooling water circulation control system starts to work, that is, the power supply 23, the power management module 26, the micro water pump 25, the control module 27, and the drive module 28 start to work, the water in the water pipe starts to flow, and the refrigeration semiconductor cools the water in the water pipe. The carbon black of the radiation heat flux sensor 1 is used as a radiation absorption material to effectively improve the thermal radiation conversion efficiency. Because the temperature of the carbon black rises sharply at high temperature, the temperature of the copper heat sink 11 and the constantan film 22 in contact with it also rises sharply. The existence of a temperature gradient between the center of the film and the edge of the constantan is a prerequisite for ensuring accurate measurement of the radiation heat flux. Therefore, a means of rapid cooling is required to ensure that the temperature of the constantan edge is maintained at a relatively low temperature. The copper heat sink 11 is made of copper material and has good thermal conductivity. It can quickly transfer heat to the cooling water. At this time, the cooling water temperature will rise sharply. The role of the micro water pump 25 can realize the rapid flow of hot water to the refrigeration semiconductor area. The role of the refrigeration semiconductor is to quickly reduce the temperature of the cooling water, thereby ensuring that the temperature of the constantan edge is maintained at a relatively low temperature, and finally ensuring the heat flux test result of the radiation heat flux sensor.

[0027] Figure 5 A comparative data diagram of a common water cooling system according to a specific embodiment of the present invention and a cooling water circulation control system in the present application is shown, as shown in FIG. Figure 5As shown, compared with the radiation heat flux sensor with traditional ordinary water cooling, the use of refrigeration semiconductor cooling as the cooling method of the radiation heat flux sensor improves the sensor stability by 267.1%. This is attributed to the higher cooling efficiency of refrigeration semiconductor cooling, which ensures the temperature stability around the constantan film in the radiation heat flux sensor, thereby ensuring that the radiation heat flux sensor has higher stability.

[0028] In a specific embodiment, the portable radiation heat flow sensing test system has excellent high temperature resistance. Its long-term radiation temperature limit can reach 1200℃, and the radiation heat flux density can reach 5MW / ㎡; it can withstand a short-term radiation temperature of 1700℃ and a radiation heat flux density of 20MW / ㎡; and the transient temperature resistance is as high as 2000℃ or more. This excellent high temperature resistance makes the system play an important role in many high temperature testing fields. In the aerospace field, it can be used to test the thermal components of aviation engines, accurately measure the radiation heat flux of the engine under high temperature operation, and provide key data for engine research and development, performance evaluation and optimization. In the energy field, such as measuring the radiation heat flux in a high-temperature furnace, it helps engineers understand the heat distribution in the furnace and optimize energy utilization efficiency. In the field of material research, it can be used to test the thermal properties of new high-temperature materials in extreme high temperature environments and evaluate the heat resistance and thermal stability of materials. Its wide range of applications fully reflects the high performance and high adaptability of the system, and provides strong support for technological development and innovation in related fields.

[0029] The above description is only a preferred embodiment of the present invention and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present invention is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above inventive concept. For example, the above features are replaced with the technical features with similar functions disclosed in the present invention (but not limited to) to form a technical solution.

Claims

1. A portable radiation heat flow sensing test system, characterized in that: include: A radiation heat flux sensor, comprising a copper heat sink, a constantan wire, a copper column and a base, wherein a flow channel is arranged in the copper heat sink and a water inlet and a water outlet are arranged at both ends of the flow channel, the copper column is arranged through the flow channel, the constantan wire is installed in the copper column through a glass tube isolation, and passes through the base; The cooling water circulation control system comprises a water inlet pipe, a control box and a water outlet pipe which are connected in sequence, wherein the water inlet pipe and the water outlet pipe are respectively connected to the water inlet and the water outlet, and refrigeration semiconductors are laid on the water inlet pipe and the water outlet pipe.

2. The portable radiation heat flow sensing test system according to claim 1, characterized in that: A constantan film is applied on the upper surface of the probe of the radiation heat flux sensor, and a carbon black layer is printed on the surface of the constantan film.

3. The portable radiation heat flow sensing test system according to claim 2, characterized in that: The carbon black layer covers the temperature sensing surface of the radiation heat flux sensor, and the carbon black layer includes high temperature resistant black paint and carbon black colloid.

4. The portable radiation heat flow sensing test system according to claim 2, characterized in that: The diameter of the probe is not less than 10 mm, the diameter of the constantan film is not less than 2 mm, and the heat flow expression of the radiation heat flow sensor is: ,in, It represents the temperature difference determined by the radiation temperature curve of the copper-constantan thermocouple, γ is the thermal conductivity of the constantan film, R is the radius of the constantan film, and L is the thickness of the constantan film.

5. The portable radiation heat flow sensing test system according to claim 1, characterized in that: The water inlet, the water inlet pipe, the control box, the water outlet pipe, and the connection between the water outlet are coated with high temperature resistant resin, and the water inlet pipe and the water outlet pipe are made of aluminum alloy.

6. The portable radiation heat flow sensing test system according to claim 1 or 5, characterized in that: The water inlet pipe and the water outlet pipe are U-shaped structures, and the copper heat sink, the water inlet pipe, the control box and the water outlet pipe are sequentially connected to form a ring structure.

7. The portable radiation heat flow sensing test system according to claim 6, characterized in that: The bottom of the U-shaped structure of the water inlet pipe and the water outlet pipe has a larger size than the two sides, and the refrigeration semiconductor is laid on the bottom surface of the U-shaped structure of the water inlet pipe and the water outlet pipe.

8. The portable radiation heat flow sensing test system according to claim 1, characterized in that: The control box is provided with a power supply, a control module, a driving module and a micro water pump which are electrically connected to each other. The electrode leads of the refrigeration semiconductor are connected to the driving module in the control box, and the gaps between the power supply, the control module, the driving module and the micro water pump are filled with epoxy resin.

9. The portable radiation heat flow sensing test system according to claim 1, characterized in that: It also includes a constantan lead and a copper lead, wherein the constantan lead and the copper lead are respectively connected to the constantan wire and the copper heat sink, and both pass through the base, and the base is filled with epoxy resin.

10. The portable radiation heat flow sensing test system according to claim 1, characterized in that: The portable radiation heat flow sensing test system has an upper limit of long-term radiation temperature of 1200°C and a laying density of 5MW / ㎡; it can withstand a short-term radiation temperature of 1700°C and a radiation heat flux density of 20MW / ㎡; and a transient temperature resistance of more than 2000°C.

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