Chip mounting device, chip mounting method and chip assembly

Abstract

The invention relates to a chip mounting device, a chip mounting method and a chip assembly. The chip mounting device comprises a mounting table and a stripping assembly, the mounting table is slidably arranged on the first guide rail; the mounting table comprises a vacuum chuck and a control mechanism; the silicon wafer is positioned on the vacuum chuck; wherein the silicon wafer comprises a plurality of chip sets, and the back surface of the silicon wafer is provided with a cutting film; the vacuum chuck is positioned on one side of the mounting table deviating from the first guide rail; vacuum adsorption holes which are arranged in an array are formed in the vacuum suction cup, and the vacuum adsorption holes are used for adsorbing or releasing the chip set; the stripping assembly is fixedly arranged above the mounting table; and the stripping assembly is used for bonding the film tearing adhesive tape with the cutting film of the chip set to be stripped, controlling the mounting table to drive the chip set to be stripped to move, and separating the chip set to be stripped from the corresponding cutting film. According to the chip packaging method and device, the cutting films of the chip sets of various different sizes can be stripped, the chip sets to be transferred can be released according to requirements, the stripping frequency and the picking frequency are reduced, and the packaging efficiency of chips is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a chip mounting device, a chip mounting method and a chip assembly. Background Art

[0002] During the chip packaging process, the chip needs to be mounted, that is, the chip is transferred to the corresponding carrier to complete the chip mounting, and then rewiring or plastic packaging can be performed. When mounting, the cut chip needs to be peeled off the cutting film first. Usually, the chip on the cutting film is lifted up by a pin structure to gradually separate the chip from the cutting film, and then the chip is picked up by the mounting head for transfer.

[0003] However, the contact area between the ejector pin structure and the cutting film is small, which is suitable for a single chip of a smaller size, but not for a chip or a chip group of a larger size. Therefore, the existing technology cannot peel off multiple chips at the same time. Only the cutting film of a single chip can be peeled off each time, and the single chip can be picked up. During the production process, multiple peeling and picking operations are required, resulting in poor overall production efficiency. Summary of the invention

[0004] In order to solve the above technical problems, the present disclosure provides a chip mounting device, a chip mounting method and a chip assembly.

[0005] In a first aspect, a chip mounting device includes: a mounting table and a stripping assembly;

[0006] The mounting platform is slidably arranged on the first guide rail;

[0007] The mounting platform includes a vacuum chuck and a control mechanism, and the silicon wafer is located on the vacuum chuck; wherein the silicon wafer includes a plurality of chip groups, and a cutting film is provided on the back of the silicon wafer;

[0008] The vacuum suction cup is located on a side of the mounting platform away from the first guide rail; the vacuum suction cup is provided with vacuum adsorption holes arranged in an array, and the vacuum adsorption holes are used to adsorb or release the chipset;

[0009] The control mechanism is located on a side of the vacuum suction cup close to the first guide rail; the control mechanism is used to control the number of vacuum adsorption holes on the vacuum suction cup that are turned on; the turned-on area of ​​the vacuum adsorption holes adsorbs the chipset, and the un-turned-on area of ​​the vacuum adsorption holes releases the chipset;

[0010] The stripping assembly is fixedly arranged above the mounting platform; the stripping assembly is used to bond the tearing tape to the cutting film of the chip group to be stripped, and control the mounting platform to drive the chip group to be stripped to move, so as to separate the chip group to be stripped from the corresponding cutting film.

[0011] In some embodiments, further comprising: a pickup assembly;

[0012] The pickup assembly is slidably disposed on a second guide rail above the mounting platform; the pickup assembly is used to pick up the chip group to be transferred after the cutting film is peeled off to a carrier board.

[0013] In some embodiments, the pick-up assembly includes: a mounter body, a mounter suction head, and a control valve;

[0014] The main body of the placement machine is connected to the suction head of the placement machine; the main body of the placement machine includes a driving mechanism for controlling the movement of the pickup component and the placement force; the suction head of the placement machine includes multiple vacuum channels for adsorbing the chip group to be transferred; the control valve is used to control the number of conduction channels of the suction head of the placement machine, so that the size of the suction head of the placement machine corresponds to the size of the chip group to be transferred.

[0015] In some embodiments, the control mechanism includes: a first control unit and a slider unit;

[0016] The first control unit is electrically connected to the slider unit; the first control unit is used to control the slider unit to move along the arrangement direction of the vacuum adsorption holes, and adjust the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup; wherein the vacuum adsorption holes in the normal pressure area release the chipset, and the vacuum adsorption holes in the vacuum area adsorb the chipset.

[0017] In some embodiments, the stripping assembly includes: a clamp, a heating unit, a tape placement unit, and a second control unit;

[0018] The clamp is used to clamp the tearing tape; the heating unit is located above the tearing tape; the heating unit is used to press the tearing tape down to contact with the cutting film of the chip group to be peeled off, and heat the contact area; the tape placement unit is used to place the tearing tape;

[0019] The second control unit is electrically connected to the mounting table, the clamp and the heating unit, respectively. The second control unit is used to control the clamp to clamp the tearing tape, control the heating unit to move and heat, and control the mounting table to drive the chip group to be peeled to move along the first guide rail after the tearing tape is bonded to the cutting film of the chip group to be peeled.

[0020] In a second aspect, the present disclosure further provides a chip mounting method, comprising:

[0021] Fixing a silicon wafer on a vacuum suction cup; wherein the silicon wafer includes a plurality of chip groups, and a cutting film is provided on the back of the silicon wafer; the vacuum suction cup is provided with vacuum adsorption holes arranged in an array, and the vacuum adsorption holes are used to adsorb or release the chip group; the control mechanism is used to control the number of the vacuum adsorption holes on the vacuum suction cup that are turned on; the conductive area of ​​the vacuum adsorption holes adsorbs the chip group, and the non-conductive area of ​​the vacuum adsorption holes releases the chip group;

[0022] The film-tearing tape is bonded to the cutting film of the chip group to be peeled off through the peeling component, and the mounting platform is controlled to drive the chip group to be peeled off to move, so as to separate the chip group to be peeled off from the corresponding cutting film.

[0023] In some embodiments, after separating the chipset to be peeled from the corresponding cutting film, the method further includes:

[0024] Obtaining the size of the chip group to be transferred after peeling off the cutting film;

[0025] Based on the size of the chipset to be transferred, adjusting the control valve to control the number of vacuum channels of the placement machine suction head that are turned on, so that the size of the placement machine suction head corresponds to the size of the chipset to be transferred;

[0026] The chipset to be transferred is adsorbed, and the movement and mounting force of the pick-up component are controlled by the main body of the chip mounter to pick up the chipset to be transferred to the carrier.

[0027] In some embodiments, after separating the chipset to be peeled from the corresponding cutting film, the method further includes:

[0028] Determining a chip group to be transferred after peeling off the cutting film;

[0029] The slider unit is controlled by the first control unit to move along the arrangement direction of the vacuum adsorption holes, and the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup is adjusted so that the chip group to be transferred is located in the normal pressure area; wherein the vacuum adsorption holes in the normal pressure area release the chips group, and the vacuum adsorption holes in the vacuum area adsorb the chips group.

[0030] In some embodiments, the peeling assembly is used to bond the tearing tape to the cutting film of the chipset, and the mounting table is controlled to drive the chipset to be peeled to move, so as to separate the chipset to be peeled from the corresponding cutting film, including:

[0031] Clamp the tear-off tape;

[0032] Pressing the film-tearing tape down until it contacts the cutting film of the chip group to be peeled off, and heating the contact area;

[0033] After the film-tearing tape is bonded to the cutting film of the chip group to be peeled off, the mounting platform is controlled to drive the chip group to be peeled off to move along the first guide rail.

[0034] In a third aspect, the present disclosure further provides a chip assembly, which is prepared by the chip mounting method as described in any embodiment of the second aspect.

[0035] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0036] The chip mounting device provided by the present disclosure includes a mounting table and a stripping component. A vacuum suction cup is arranged on the mounting table. The vacuum suction cup adsorbs the chipset, and the cutting film of the chipset is bonded and fixed with the film tearing tape. The chipset is driven to move by controlling the mounting table to move on the first guide rail. Since the cutting film and the film tearing tape of the chipset are in a fixed state and remain motionless, the cutting film can be separated from the chipset. And by controlling the vacuum suction cup, the required chipset can also be released for subsequent picking operations. Compared with the prior art, when stripping the cutting film, no ejector structure is required, and there is no need to consider the force and the size of the chipset. Moreover, the cutting films of chipsets of various sizes can be stripped. If the chipset includes multiple connected chips, the cutting films can also be stripped at the same time, reducing the number of stripping times and improving the adsorption transfer efficiency. The present disclosure can strip the cutting films of chipsets of various sizes, and can release the chipset to be transferred according to demand, reducing the number of stripping times and the number of picking times, and improving the packaging efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] Figure 1 A schematic structural diagram of a chip mounting device provided in an embodiment of the present disclosure;

[0040] Figure 2 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0041] Figure 3 A schematic top view of a mounting platform provided in an embodiment of the present disclosure;

[0042] Figure 4A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0043] Figure 5 A schematic diagram of the structure of a chipset provided in an embodiment of the present disclosure;

[0044] Figure 6 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0045] Figure 7 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0046] Figure 8 A schematic structural diagram of another chip mounting device provided in an embodiment of the present disclosure;

[0047] Fig. 9 A schematic diagram of a film peeling and cutting process provided by an embodiment of the present disclosure;

[0048] Fig.10 A schematic diagram of a film after peeling and cutting is completed according to an embodiment of the present disclosure;

[0049] Fig.11 A schematic flow chart of a chip mounting method provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0050] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0051] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0052] When mounting the chip, it is first necessary to peel the cut chip from the cutting film. Usually, a pin structure is used to lift the chip on the cutting film so that the chip and the cutting film are gradually separated, and then the chip is picked up by the mounting head for transfer. The pin structure has little contact with the cutting film and is only suitable for smaller chips. For larger chips or chipsets (chipsets include multiple chips), the pin structure cannot lift them evenly, and the chipset is subjected to uneven force, making it impossible to peel off the cutting film, which is more likely to damage the chipset and affect the yield. Therefore, in the prior art, only the cutting film of a single chip can be peeled off and the single chip can be picked up at a time, resulting in multiple peeling and picking operations during the production process, resulting in poor overall production efficiency.

[0053] In order to solve the problem, the present disclosure provides a chip mounting device. Figure 1 A schematic diagram of the structure of a chip mounting device provided in an embodiment of the present disclosure is shown in FIG. Figure 2 A schematic diagram of the structure of another chip mounting device provided in an embodiment of the present disclosure is shown in FIG. Figure 3 A schematic top view of a mounting platform provided in an embodiment of the present disclosure, referring to Figure 1-Figure 3 The chip mounting device includes: a mounting platform 10 and a stripping component 20.

[0054] The mounting platform 10 is slidably disposed on the first guide rail 41 ; the mounting platform 10 includes a vacuum suction cup 60 and a control mechanism, and the silicon wafer 50 is located on the vacuum suction cup 60 ; wherein the silicon wafer 50 includes a plurality of chip groups 52 , and a cutting film 51 is provided on the back of the silicon wafer 50 .

[0055] The vacuum suction cup 60 is located on a side of the mounting platform 10 away from the first guide rail 41 ; the vacuum suction cup 60 is provided with vacuum adsorption holes 61 arranged in an array, and the vacuum adsorption holes 61 are used to adsorb or release the chipset 52 .

[0056] The control mechanism is located on one side of the vacuum suction cup 60 close to the first guide rail 41 ; the control mechanism is used to control the number of conductive vacuum adsorption holes 61 on the vacuum suction cup 60 ; the conductive area of ​​the vacuum adsorption holes 61 adsorbs the chip group 52 , and the non-conductive area of ​​the vacuum adsorption holes 61 releases the chip group 52 .

[0057] The stripping assembly 20 is fixedly arranged above the mounting table 10; the stripping assembly 20 is used to bond the tearing tape 21 to the cutting film 51 of the chip group to be stripped, and control the mounting table 10 to drive the chip group to be stripped to move, separating the chip group to be stripped from the corresponding cutting film 51.

[0058] For example, Figure 1-Figure 3 It is a partial structure of a chip mounting device. Among them, the mounting table 10 is slidably arranged on the first guide rail 41 through a slider 11, and a support ring 12 is arranged on the side of the mounting table 10 away from the first guide rail 41. There is a receiving ring 53 (Ring) for support at the edge of the cutting film 51, and the support ring 12 is used to support the receiving ring 53, so as to achieve the function of supporting the cutting film 51, and the vacuum table on the mounting table 10 is used to support the silicon wafer 50. Among them, the first guide rail 41 includes two rails, and the support ring 12 can be seen from the top view. The mounting table 10 is located on the side of the support ring 12 close to the first guide rail 41. Therefore, when observed from the top direction, the mounting table 10 is blocked by the support ring 12. Among them, the number of sliders 11 can be set according to actual needs, such as two sliders or four sliders, etc., and the embodiments of the present disclosure are not limited to this.

[0059] In addition, the vacuum table surface on the mounting platform 10 includes a vacuum suction cup 60, which is located on the side of the mounting platform 10 away from the first guide rail 41. The vacuum suction cup 60 is provided with vacuum adsorption holes 61 arranged in an array, and the vacuum adsorption holes 61 are used to adsorb or release the chipset 52.

[0060] The mounting table 10 also includes a control mechanism 62, which is located on one side of the vacuum suction cup 60 close to the first guide rail 41. By adjusting the position of the control mechanism 62, the normal pressure area and the vacuum area of ​​the vacuum suction cup 60 can be changed. Specifically, by adjusting the position of the control mechanism 62, the number of vacuum adsorption holes 61 on the vacuum suction cup 60 that are turned on is controlled. Among them, the conduction area of ​​the vacuum adsorption hole 61 is a vacuum area, which can adsorb the chipset 52; the conduction area of ​​the vacuum adsorption hole 61 is a normal pressure area, which can release the chipset 52. Therefore, according to actual needs, the state of different positions of the vacuum suction cup 60 can be controlled to absorb or release the chipset 52 in the corresponding area. Figure 4 A schematic diagram of the structure of another chip mounting device provided in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the control mechanism 62 moves along the first direction to adjust the distribution of the vacuum area and the normal pressure area in the X direction. Similarly, a control mechanism is also provided in the Y direction, and the control mechanism moves along the second direction to adjust the distribution of the vacuum area and the normal pressure area in the Y direction.

[0061] It should be noted that the embodiment of the present disclosure is only a simple illustration of the control mechanism and the vacuum suction cup, and the actual structure also includes a variety of auxiliary mechanisms, which are not specifically limited here.

[0062] The chipset 52 mentioned in the embodiment of the present disclosure is obtained by cutting the silicon wafer 50. The silicon wafer 50 includes a plurality of chips arranged in an array, where the chip refers to a single chip, and the chipset 52 may include a plurality of chips, and adjacent chips are connected to each other, so the silicon wafer 50 includes a plurality of chipsets 52. The back of the silicon wafer 50 has a cutting film 51, and the surface (front) of the silicon wafer has a circuit connection layer. Figure 5 A schematic diagram of the structure of a chipset provided in an embodiment of the present disclosure, referring to Figure 5 , A1 shows 8 chipsets 52, each of which includes multiple chips, so the size of the chipset 52 is relatively large, and the length of the chipset 52 is the sum of the lengths of the chips in the group. A2 only shows part of the chipset 52, and the length of the chipset 52 is less than the length of the chipset 52 in A1. The ejector pin structure in the prior art cannot peel off the cutting film 51 of the chipset 52, and can only peel off the cutting film of a single small-sized chip. Therefore, the embodiment of the present disclosure provides a peeling component 20, through which the peeling component 20 peels off the cutting film 51 of the large-sized chipset 52.

[0063] Furthermore, the stripping assembly 20 is fixed above the mounting table 10 to perform the stripping operation. For example, if there are walls or baffles around, the stripping assembly 20 can be fixed on the above structure, but it needs to be located above the mounting table 10. The specific fixing method and the specific location of the setting can be designed according to actual needs, and the embodiment of the present disclosure does not limit this. The stripping assembly 20 includes a film tearing tape 21, and the film tearing tape 21 is bonded to the cutting film 51 of the chipset to be stripped located on the mounting table 10. At this time, the film tearing tape 21 is fixedly connected to the cutting film 51, and the mounting table 10 can move. When the mounting table 10 is controlled to move, the chipset 52 on the mounting table 10 will also move accordingly, but the cutting film 51 is fixed to the film tearing tape 21 and will not move with the chipset 52. Therefore, the cutting film 51 is separated from the chipset 52. The size of the chipset 52 is relatively long, and the group includes multiple chips. The current structure can be used to strip all the cutting films 51 corresponding to the chips in the group, and there is no need to strip multiple times, which reduces the number of stripping times and greatly improves the stripping rate.

[0064] It is worth noting that before peeling the film, the vacuum suction cup needs to be controlled to open the vacuum adsorption holes corresponding to the chipset to be peeled off to prevent the chipset from moving when peeling the film. After peeling the film, the vacuum adsorption holes corresponding to the chipset can be closed to separate it from the vacuum suction cup for subsequent picking operations, which can also reduce the number of picking operations.

[0065] It should be noted that in the embodiment of the present disclosure, a control mechanism is provided on the mounting table, and a control unit is also provided on the stripping component. In some optional embodiments, the control can be performed by the same control module or by different control sub-modules. The embodiment of the present disclosure does not impose specific restrictions on this, and the above is only for example.

[0066] The chip mounting device provided by the present invention is provided with a vacuum suction cup on the mounting table. The vacuum suction cup adsorbs the chipset, and the cutting film of the chipset is bonded and fixed with the tearing tape. The chipset is driven to move by controlling the mounting table to move on the first guide rail. Since the cutting film and the tearing tape of the chipset are in a fixed state and remain motionless, the cutting film can be separated from the chipset. And by controlling the vacuum suction cup, the required chipset can also be released for subsequent picking operations. Compared with the prior art, no ejector pin structure is required when peeling off the cutting film, and there is no need to consider the force and the size of the chipset. Moreover, the cutting films of chipsets of various sizes can be peeled off. If the chipset includes multiple connected chips, the cutting films can also be peeled off at the same time, reducing the number of peeling times and improving the adsorption transfer efficiency. The present invention can peel off the cutting films of chipsets of various sizes, and can release the chipset to be transferred according to demand, reducing the number of peeling times and the number of picking times, and improving the chip packaging efficiency.

[0067] In some embodiments, Figure 6A schematic diagram of the structure of another chip mounting device provided in the embodiment of the present disclosure, referring to Figure 6 The chip mounting device further includes: a pickup component 30 .

[0068] The pick-up assembly 30 is slidably disposed on the second guide rail 42 above the mounting platform 10 ; the pick-up assembly 30 is used to pick up the chip group to be transferred after the cutting film is peeled off to the carrier board.

[0069] For example, Figure 6 Part of the structure of the chip mounting device. Figure 6 A mounting table 10 and a pick-up assembly 30 are provided. The disclosed embodiment is also provided with a pick-up assembly 30, which is also arranged on a second guide rail 42 above the mounting table 10 through a slider, so that the pick-up assembly 30 can slide on the second guide rail 42. The mounting table 10 can also adjust its position on the first guide rail 41, so the position of the stripping assembly 20 does not affect the pick-up operation of the pick-up assembly 30. The pick-up assembly 30 is used to pick up the chip group 52 after the stripping film 51 is stripped to the carrier board to complete the mounting operation.

[0070] In some embodiments, Figure 7 A schematic diagram of the structure of another chip mounting device provided in the embodiment of the present disclosure, referring to Figure 7 The picking component 30 includes: a placement machine body 31 , a placement machine suction head 32 and a control valve 33 .

[0071] The mount machine body 31 is connected to the mount machine suction head 32; the mount machine body 31 includes a driving mechanism for controlling the movement of the pickup component 30 and the mounting force; the mount machine suction head 32 includes a plurality of vacuum channels 320 for adsorbing the chip group to be transferred; the control valve 33 is used to control the number of conduction of the vacuum channels 320 of the mount machine suction head 32, so that the size of the mount machine suction head 32 corresponds to the size of the chip group to be transferred.

[0072] In the prior art, the pickup assembly 30 is usually only able to absorb chips of smaller size, and the size of the placement machine suction head is fixed, which cannot be applied to chipsets of different sizes. However, the stripping assembly provided in the embodiment of the present disclosure can strip the cutting film of chipsets of different sizes. After stripping the cutting film, the chipset needs to be adsorbed to transfer it. Therefore, the pickup assembly 30 provided in the embodiment of the present disclosure includes a size-variable placement machine suction head 32 to adapt to chipsets 52 of different sizes.

[0073] Exemplarily, the pick-up assembly 30 includes a mounter body 31, a mounter suction head 32, and a control valve 33. The mounter body 31 is connected to the second guide rail 42 via a slider, and the mounter body 31 includes a driving mechanism for controlling the movement of the pick-up assembly 30 in different directions and the mounting force, etc. The mounter suction head 32 is connected to the mounter body 31, and the mounter suction head 32 includes a plurality of vacuum channels 320. For example, 8 vacuum channels 320 are provided in the figure, and each vacuum channel 320 is connected to the control valve 33 through a pipeline. By adjusting the control valve 33, it is possible to control whether there is normal pressure or vacuum in the pipeline, thereby controlling the number of conduction of the vacuum channels 320 of the mounter suction head 32, so that the size of the mounter suction head corresponds to the size of the chip group to be transferred. Among them, the vacuum channel 320 is in a conducting state when it is vacuum.

[0074] When the size of the chipset 52 is large, the number of the vacuum channels 320 of the mounter suction head 32 is increased by controlling the valve 33, which is equivalent to increasing the size of the chipset 52 that the mounter suction head 32 can absorb. When the size of the chipset 52 is small, the number of the vacuum channels 320 of the mounter suction head 32 can be reduced by controlling the valve 33. It should be noted that when the control valve 33 is used to control the number of the vacuum channels 320 of the mounter suction head 32, the position of the vacuum channels 320 should correspond to the position of the chipset 52 so that the chipset 52 can be absorbed.

[0075] Therefore, combining the pickup assembly with the stripping assembly and the mounting platform in the above-mentioned embodiment can reduce both the number of stripping operations and the number of mounting operations, thereby greatly improving the chip packaging efficiency.

[0076] In some optional embodiments, the pickup assembly further includes a control unit and a vacuum storage unit, the control unit is used to adjust the control valve, and the vacuum storage unit is used to supply vacuum, and the embodiments of the present disclosure do not impose specific limitations on this.

[0077] In some embodiments, the control mechanism includes: a first control unit and a slider unit.

[0078] The first control unit is electrically connected to the slider unit; the first control unit is used to control the slider unit to move along the arrangement direction of the vacuum adsorption holes, and adjust the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup; wherein the vacuum adsorption holes in the normal pressure area release the chip group, and the vacuum adsorption holes in the vacuum area adsorb the chip group.

[0079] Figure 4An exemplary control mechanism 62 is provided, and the control mechanism 62 includes a first control unit and a slider unit, wherein the first control unit is used to control the slider unit to move along the arrangement direction of the vacuum adsorption holes 61, thereby being able to control the number of conduction of the vacuum adsorption holes 61 on the vacuum suction cup 60, wherein the conduction area of ​​the vacuum adsorption holes 61 is a vacuum area, which can adsorb the chipset 52; the conduction area of ​​the vacuum adsorption holes 61 is a normal pressure area, which can release the chipset 52. For example, the first control unit is used to control the slider unit to move along the first direction, and the distribution of the vacuum area and the normal pressure area in the X direction can be adjusted. Similarly, a control mechanism is also provided in the Y direction, and the control mechanism moves along the second direction, and the distribution of the vacuum area and the normal pressure area in the Y direction can be adjusted.

[0080] In some embodiments, Figure 8 A schematic diagram of the structure of another chip mounting device provided in an embodiment of the present disclosure is shown in FIG. Fig. 9 A schematic diagram of another process of peeling and cutting a film provided in an embodiment of the present disclosure is shown in FIG. Fig.10 This is a schematic diagram of a peeling and cutting film provided in an embodiment of the present disclosure, with reference to Figure 8-Figure 10 The stripping assembly 20 includes: a clamp 22, a heating unit 23, a tape placement unit 24 and a second control unit.

[0081] The clamp 22 is used to clamp the tearing tape 21; the heating unit 23 is located above the tearing tape 21; the heating unit 23 is used to press the tearing tape 21 down to contact the cutting film 51 of the chip group to be peeled off, and heat the contact area; the tape placement unit 24 is used to place the tearing tape 21.

[0082] The second control unit is electrically connected to the mounting table 10, the clamp 22 and the heating unit 23 respectively. The second control unit is used to control the clamp 22 to clamp the tearing tape 21, control the movement and heating of the heating unit 23, and control the mounting table 10 to drive the chip group to be peeled to move along the first guide rail 41 after the tearing tape 21 is bonded to the cutting film 51 of the chip group to be peeled.

[0083] Wherein, the tearing tape 21 is located at the tape placement unit 24. When the cutting film 51 needs to be peeled off, the clamp 22 clamps the tearing tape 21, and the heating unit 23 is located above the tearing tape 21. The heating unit 23 moves downward, that is, moves in the direction of the first guide rail 41. After the heating unit 23 contacts the tearing tape 21, it continues to move downward until the tearing tape 21 contacts the cutting film 51 to be peeled off. At this time, the heating unit 23 will heat the contact area to make the tearing tape 21 bonded and fixed to the cutting film 51. Wherein, the peeling component 20 can also include rollers 25, for example, two groups of rollers 25 are provided, and the tearing tape 21 passes between the two groups of rollers 25 to better convey the tearing tape 21. It should be noted that the embodiment of the present disclosure does not specifically limit the relative position and fixing method of the internal structure of the peeling component 20, which can be selected according to actual needs. The above embodiment is only an optional implementation.

[0084] The stripping assembly 20 also includes a second control unit, which is electrically connected to the clamp 22, controls the clamp 22 to clamp the film-tearing tape 21, and pulls the film-tearing tape 21 to a desired position, for example, in a direction perpendicular to the silicon wafer 50, the film-tearing tape 21 overlaps with the cutting film to be stripped. The second control unit is also electrically connected to the heating unit 23, and after clamping the film-tearing tape 21 so that the film-tearing tape 21 overlaps with the cutting film to be stripped in a direction perpendicular to the silicon wafer, controls the heating unit 23 to move downward, and the heating unit 23 presses the film-tearing tape 21 downward until it contacts the cutting film 51 of the chip group to be stripped, and heats the contact area at this time, so that the film-tearing tape 21 is bonded to the cutting film 51 of the chip group. The second control unit is also connected to the mounting table 10, and the second control unit mentioned here is connected to the mounting table 10, which can be understood as the second control unit being electrically connected to the drive motor of the mounting table 10, and the second control unit controls the drive motor to rotate, thereby driving the mounting table 10 to move, and driving the chip group to be stripped to move along the first guide rail 41. Further, the chip group to be peeled is separated from the cutting film on the back side thereof, and the peeling operation is completed.

[0085] The present disclosure also provides a chip mounting method. Fig.11 A schematic diagram of a chip mounting method according to an embodiment of the present disclosure is provided. Fig.11 , chip mounting methods include S110-S120:

[0086] S110, fixing a silicon wafer on a vacuum suction cup; wherein the silicon wafer includes a plurality of chip groups and a cutting film is provided on the back of the silicon wafer; the vacuum suction cup is provided with vacuum adsorption holes arranged in an array, and the vacuum adsorption holes are used to adsorb or release the chip groups; a control mechanism is used to control the number of the vacuum adsorption holes on the vacuum suction cup that are turned on; the conductive area of ​​the vacuum adsorption holes adsorbs the chip groups, and the non-conductive area of ​​the vacuum adsorption holes releases the chip groups.

[0087] S120, bonding the film-tearing tape to the cutting film of the chipset to be peeled by means of a peeling assembly, and controlling the mounting table to drive the chipset to be peeled to move, so as to separate the chipset to be peeled from the corresponding cutting film.

[0088] Specifically, when mounting, the tearing tape must first be bonded to the cutting film of the chipset to be peeled off through a peeling assembly, and the mounting table must be controlled to move the chipset. The tearing tape is bonded to the cutting film of the chipset on the mounting table through a peeling assembly. At this time, the tearing tape is fixedly connected to the cutting film, and the mounting table can move. When the mounting table is controlled to move, the chipset on the mounting table will also move with it, but the cutting film is fixed to the tearing tape and will not move with the chipset. Therefore, the cutting film is separated from the chipset. Since the chipset includes multiple chips, the current method can be used to peel off all the cutting films corresponding to the chips in the chipset at one time, which can reduce the number of peeling times and increase the peeling rate.

[0089] Before film stripping, the vacuum suction cup needs to be controlled to open the vacuum adsorption holes corresponding to the chip group to be stripped to prevent the chip group to be stripped from moving when the film is peeled. After film stripping, the vacuum adsorption holes corresponding to the chip group can be closed to separate it from the vacuum suction cup for subsequent picking operations, which can also reduce the number of picking operations.

[0090] Therefore, the embodiment of the present disclosure can peel off the cutting films of chip groups of various sizes, and can release the chip groups to be transferred according to needs, thereby reducing the number of peeling and picking times and improving the chip packaging efficiency.

[0091] In some embodiments, after separating the chipset to be peeled from the corresponding cutting film, the method further includes:

[0092] Obtain the size of the chip group to be transferred after peeling off the dicing film.

[0093] Based on the size of the chip set to be transferred, the control valve is adjusted to control the number of conduction of the vacuum channel of the placement machine suction head, so that the size of the placement machine suction head corresponds to the size of the chip set to be transferred.

[0094] The chipset to be transferred is adsorbed, and the movement and placement force of the pick-up component are controlled by the main body of the placement machine to pick up the chipset to be transferred to the carrier.

[0095] Specifically, after the film stripping is completed, the cut film needs to be transferred. First, the size of the chip group to be transferred after the cut film is stripped should be obtained, and the number of conduction channels of the mounter suction head should be determined according to its size. The number of conduction channels of the mounter suction head corresponds to the size of the chip to be transferred so that the chip group can be completely adsorbed. The number of conduction channels of the mounter suction head can be adjusted by the control valve.

[0096] For example, when the size of the chipset is large, the number of conduction channels of the vacuum channel of the mounter suction head is increased by controlling the valve, which is equivalent to increasing the size of the chipset that the mounter suction head can absorb. When the size of the chipset is small, the number of conduction channels of the vacuum channel of the mounter suction head can be reduced by controlling the valve. It should be noted that when the control valve is used to control the number of conduction channels of the vacuum channel of the mounter suction head, the position of the vacuum channel should correspond to the position of the chipset to be transferred so that the chipset to be transferred can be absorbed. Furthermore, the movement of the pickup component and the mounting force can be controlled by the mounter body to pick up the chipset to be transferred to the carrier.

[0097] In some embodiments, after separating the chipset to be peeled from the corresponding cutting film, the method further includes:

[0098] Determine the chip group to be transferred after peeling off the dicing film.

[0099] The slider unit is controlled by the first control unit to move along the arrangement direction of the vacuum adsorption holes, and the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup is adjusted so that the chip group to be transferred is located in the normal pressure area; wherein the vacuum adsorption holes in the normal pressure area release the chip group, and the vacuum adsorption holes in the vacuum area adsorb the chip group.

[0100] Specifically, after the film stripping is completed, the chipset to be transferred needs to be released from the vacuum suction cup, and the chipset to be transferred and the vacuum suction cup are separated so as to be picked up later. The slider unit is controlled by the first control unit to move along the arrangement direction of the vacuum adsorption holes, and the position of the slider unit is adjusted so that the chipset to be transferred is located in the normal pressure area, and the chipset to be transferred is released.

[0101] Optionally, if the vacuum suction cup is required to absorb the chipset, the position of the control slider unit needs to be adjusted by the first control unit so that the chipset to be transferred is located in the vacuum area.

[0102] In some embodiments, the peeling assembly is used to bond the tearing tape to the cutting film of the chipset, and the mounting table is controlled to drive the chipset to be peeled to move, so as to separate the chipset to be peeled from the corresponding cutting film, including:

[0103] Clip the tear-off tape.

[0104] The tear-off tape is pressed down until it contacts the dicing film of the chipset to be peeled off, and the contact area is heated.

[0105] After the film-tearing tape is bonded to the cutting film of the chip group to be peeled off, the control mounting platform drives the chip group to be peeled off to move along the first guide rail.

[0106] Specifically, the clamp clamps the tearing tape and pulls the tearing tape to the desired position. For example, in the direction perpendicular to the silicon wafer, there is an overlapping portion between the tearing tape and the cutting film of the chipset to be stripped. The heating unit is controlled to move downward, and the heating unit will press the tearing tape downward until it contacts the cutting film of the chipset to be stripped, at which time the contact area is heated to allow the tearing tape to bond to the cutting film of the chipset to be stripped. After the tearing tape is bonded to the cutting film of the chipset to be stripped, the mounting table is controlled to drive the chipset to be stripped to move along the direction of the first guide rail, while the cutting film is fixed to the tearing tape, so that the chipset to be stripped and the cutting film will gradually separate until the cutting film is completely stripped. In some optional embodiments, the mounting table is electrically connected to the drive motor, and the drive motor runs to drive the mounting table to move, thereby driving the chipset to move along the first guide rail.

[0107] The embodiment of the present disclosure further provides a chip assembly, which is prepared by the chip mounting method described in any of the above embodiments.

[0108] When the chip assembly is prepared in the above manner, the dicing films of chip groups of various sizes can be peeled off. If the chip group includes multiple connected chips, the dicing films can also be peeled off at the same time, reducing the number of peeling times and the number of transfers. Therefore, the size range of the chip assembly prepared in this manner is relatively wide, which can meet the needs of different products, and can improve the preparation efficiency, which is beneficial to actual production.

[0109] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0110] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip mounting device, characterized in that: include: mounting table and stripping assembly; The mounting platform is slidably arranged on the first guide rail; The mounting platform includes a vacuum chuck and a control mechanism, and the silicon wafer is located on the vacuum chuck; wherein the silicon wafer includes a plurality of chip groups, and a cutting film is provided on the back of the silicon wafer; The vacuum suction cup is located on a side of the mounting platform away from the first guide rail; the vacuum suction cup is provided with vacuum adsorption holes arranged in an array, and the vacuum adsorption holes are used to adsorb or release the chipset; The control mechanism is located on a side of the vacuum suction cup close to the first guide rail; the control mechanism is used to control the number of vacuum adsorption holes on the vacuum suction cup that are turned on; the turned-on area of ​​the vacuum adsorption holes adsorbs the chipset, and the un-turned-on area of ​​the vacuum adsorption holes releases the chipset; The stripping assembly is fixedly arranged above the mounting platform; the stripping assembly is used to bond the tearing tape to the cutting film of the chip group to be stripped, and control the mounting platform to drive the chip group to be stripped to move, so as to separate the chip group to be stripped from the corresponding cutting film.

2. The chip mounting device according to claim 1, characterized in that: Also included: a pickup assembly; The pickup assembly is slidably disposed on a second guide rail above the mounting platform; the pickup assembly is used to pick up the chip group to be transferred after the cutting film is peeled off to a carrier board.

3. The chip mounting device according to claim 2, characterized in that: The pickup assembly includes: a mounter body, a mounter suction head and a control valve; The main body of the placement machine is connected to the suction head of the placement machine; the main body of the placement machine includes a driving mechanism for controlling the movement of the pickup component and the placement force; the suction head of the placement machine includes multiple vacuum channels for adsorbing the chip group to be transferred; the control valve is used to control the number of conduction channels of the suction head of the placement machine, so that the size of the suction head of the placement machine corresponds to the size of the chip group to be transferred.

4. The chip mounting device according to claim 1, characterized in that: The control mechanism comprises: a first control unit and a slider unit; The first control unit is electrically connected to the slider unit; the first control unit is used to control the slider unit to move along the arrangement direction of the vacuum adsorption holes, and adjust the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup; wherein the vacuum adsorption holes in the normal pressure area release the chipset, and the vacuum adsorption holes in the vacuum area adsorb the chipset.

5. The chip mounting device according to claim 1, characterized in that: The stripping assembly includes: a clamp, a heating unit, a tape placement unit and a second control unit; The clamp is used to clamp the tearing tape; the heating unit is located above the tearing tape; the heating unit is used to press the tearing tape down to contact with the cutting film of the chip group to be peeled off, and heat the contact area; the tape placement unit is used to place the tearing tape; The second control unit is electrically connected to the mounting table, the clamp and the heating unit, respectively. The second control unit is used to control the clamp to clamp the tearing tape, control the heating unit to move and heat, and control the mounting table to drive the chip group to be peeled to move along the first guide rail after the tearing tape is bonded to the cutting film of the chip group to be peeled.

6. A chip mounting method, characterized in that: include: Fixing a silicon wafer on a vacuum suction cup; wherein the silicon wafer includes a plurality of chip groups, and a cutting film is provided on the back of the silicon wafer; the vacuum suction cup is provided with vacuum adsorption holes arranged in an array, and the vacuum adsorption holes are used to adsorb or release the chip group; the control mechanism is used to control the number of the vacuum adsorption holes on the vacuum suction cup that are turned on; the conductive area of ​​the vacuum adsorption holes adsorbs the chip group, and the non-conductive area of ​​the vacuum adsorption holes releases the chip group; The film-tearing tape is bonded to the cutting film of the chip group to be peeled off through the peeling component, and the mounting platform is controlled to drive the chip group to be peeled off to move, so as to separate the chip group to be peeled off from the corresponding cutting film.

7. The chip mounting method according to claim 6, characterized in that: After separating the chipset to be peeled from the corresponding cutting film, the method includes: Obtaining the size of the chip group to be transferred after peeling off the cutting film; Based on the size of the chipset to be transferred, adjusting the control valve to control the number of vacuum channels of the placement machine suction head that are turned on, so that the size of the placement machine suction head corresponds to the size of the chipset to be transferred; The chipset to be transferred is adsorbed, and the movement and mounting force of the pick-up component are controlled by the main body of the chip mounter to pick up the chipset to be transferred to the carrier.

8. The chip mounting method according to claim 6, characterized in that: After separating the chipset to be peeled from the corresponding cutting film, the method further includes: Determining a chip group to be transferred after peeling off the cutting film; The slider unit is controlled by the first control unit to move along the arrangement direction of the vacuum adsorption holes, and the distribution of the normal pressure area and the vacuum area corresponding to the vacuum suction cup is adjusted so that the chip group to be transferred is located in the normal pressure area; wherein the vacuum adsorption holes in the normal pressure area release the chips group, and the vacuum adsorption holes in the vacuum area adsorb the chips group.

9. The chip mounting method according to claim 6, characterized in that: The peeling assembly is used to bond the tearing tape to the cutting film of the chipset, and the mounting table is controlled to drive the chipset to be peeled to move, so as to separate the chipset to be peeled from the corresponding cutting film, including: Clamp the tear-off tape; Pressing the film-tearing tape down until it contacts the cutting film of the chip group to be peeled off, and heating the contact area; After the film-tearing tape is bonded to the cutting film of the chip group to be peeled off, the mounting platform is controlled to drive the chip group to be peeled off to move along the first guide rail.

10. A chip assembly, characterized in that: The chip assembly is prepared by the chip mounting method as described in any one of claims 6 to 9.

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