Silicon wafer transmission device, control method thereof and wafer inserting system

Abstract

The invention provides a silicon wafer transmission device, a control method thereof and a wafer inserting system, and relates to the field of photovoltaic technology. The device comprises a silicon wafer group transmission mechanism, a silicon wafer adsorption mechanism, a wafer feeding mechanism and a silicon wafer transportation mechanism which are connected in sequence, a height difference exists between the silicon wafer conveying mechanism and the silicon wafer group conveying mechanism in the direction perpendicular to the silicon wafer conveying direction. The silicon wafer conveying device further comprises a distance sensor, a wafer feeding speed detection device and a wafer separating mechanism. The wafer separating mechanism is arranged on the silicon wafer group conveying mechanism. The distance sensor is used for detecting whether silicon wafers exist in the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism; the wafer feeding speed detection device is used for detecting the interval duration of two adjacent silicon wafers passing through a preset position on the silicon wafer conveying mechanism. According to the silicon wafer conveying device, whether the silicon wafer exists in the adsorption area of the silicon wafer adsorption mechanism or not is automatically detected, the automation level of the silicon wafer conveying device is improved, the production efficiency is improved, and waste of human resources and energy is reduced.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular to a silicon wafer transmission device, a control method thereof and a wafer insertion system. Background Art

[0002] The silicon rods are cut into silicon wafers through the slicing process, and the silicon wafers are transferred to the cleaning and sorting process for degumming, inserting, cleaning, sorting and other operations.

[0003] Currently, during the wafer insertion process, a plurality of stacked silicon wafers are usually separated one by one by means of a silicon wafer transport device, and transported to a wafer insertion position, etc.

[0004] The monitoring of various states in the existing silicon wafer transport device is all done manually. The start and stop of each mechanism in the silicon wafer transport device basically relies on manual judgment and operation. The start and stop timing of each mechanism in the silicon wafer transport device basically relies on manual judgment. The degree of automation is low, which not only has low production efficiency, but also causes waste of human resources and energy. Summary of the invention

[0005] The present invention provides a silicon wafer transmission device and a control method thereof and a wafer inserting system, aiming to solve the problem of low automation level of the existing silicon wafer transmission device.

[0006] In a first aspect of the present invention, a silicon wafer transmission device is provided, comprising: a silicon wafer group transmission mechanism, a silicon wafer adsorption mechanism, a wafer loading mechanism and a silicon wafer transport mechanism arranged in sequence; a height difference is provided between the silicon wafer transport mechanism and the silicon wafer group transmission mechanism in a direction perpendicular to the silicon wafer transport direction;

[0007] The silicon wafer transmission device further comprises: a distance sensor, a wafer loading speed detection device and a wafer separation mechanism, wherein the wafer separation mechanism is arranged on the silicon wafer group transmission mechanism;

[0008] Wherein, the distance sensor is used to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism;

[0009] The wafer loading speed detection device is used to detect the interval time between two adjacent silicon wafers passing through a preset position on the silicon wafer transportation mechanism.

[0010] In the present application, by adding a distance sensor for detecting whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism in the silicon wafer transmission device, it is possible to realize automatic detection of whether there is a silicon wafer in the adsorption area of ​​the silicon wafer adsorption mechanism. Through the loading speed detection device, it can be automatically detected that there is no silicon wafer on the wafer or the silicon wafer is loaded slowly, or multiple silicon wafers may be squeezed, resulting in simultaneous loading, which can improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy. Moreover, the detection result can provide a certain basis for the automatic control of the start and stop of each mechanism in the silicon wafer transmission device, as well as the control timing, which can further improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy.

[0011] Optionally, the distance sensor is disposed in the silicon wafer adsorption mechanism, or the distance sensor is located on a side of the silicon wafer adsorption mechanism facing away from the silicon wafer group transmission mechanism.

[0012] Optionally, the silicon wafer adsorption mechanism includes: a first surface close to the silicon wafer group transmission mechanism; the silicon wafer on the silicon wafer group transmission mechanism includes: a second surface close to the silicon wafer adsorption mechanism; the size of the first surface is greater than the size of the second surface;

[0013] A through hole is provided in the silicon wafer adsorption mechanism, and the distance sensor is arranged in the through hole.

[0014] Optionally, the silicon wafer transmission device further includes: a silicon wafer detection sensor for detecting whether there are any silicon wafers on the silicon wafer group transmission mechanism.

[0015] Optionally, the wafer separation mechanism includes: a connection portion connected to the silicon wafer group transmission mechanism;

[0016] The silicon wafer detection sensor is arranged on the connecting portion of the slice structure.

[0017] Optionally, a plane perpendicular to the transport direction of the silicon wafer group is a first plane, and the silicon wafer detection sensor includes: a photoelectric beam sensor, and a beam beam direction of the photoelectric beam sensor has an angle with the first plane.

[0018] Optionally, the angle is 15° to 35°.

[0019] Optionally, the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism includes: an area on the silicon wafer group transmission mechanism within a distance of less than or equal to 5 mm from the silicon wafer adsorption mechanism; and / or,

[0020] The suction force of the silicon wafer adsorption mechanism within the adsorption range is 0.2 MPa to 0.5 MPa.

[0021] A second aspect of the present invention provides a wafer insertion system, comprising: any of the aforementioned silicon wafer transfer devices.

[0022] A third aspect of the present invention provides a control method for a silicon wafer transmission device, which is applied to any of the aforementioned silicon wafer transmission devices; the method comprises:

[0023] Controlling the distance sensor to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism;

[0024] Control the wafer loading speed detection device to detect the interval time between two adjacent silicon wafers passing through a preset position on the silicon wafer transport mechanism;

[0025] When the interval time is longer than a first preset time and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transport mechanism, the silicon wafer group transport mechanism is controlled to pause.

[0026] In the present application, by automatically detecting whether there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transportation mechanism is automatically detected. If the interval time is greater than the first preset time, and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, that is, the aforementioned extrusion may have occurred, the silicon wafer group transmission mechanism is automatically controlled to pause, that is, the transportation of silicon wafers to the silicon wafer adsorption mechanism is automatically stopped to avoid further extrusion of silicon wafers, which can improve production efficiency and reduce waste of human resources and energy.

[0027] Optionally, the silicon wafer transmission device further includes: a silicon wafer detection sensor; and the method further includes:

[0028] Controlling the silicon wafer detection sensor to detect whether there are any silicon wafers on the silicon wafer group transmission mechanism;

[0029] When the interval time is longer than the second preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transport mechanism, and there is a silicon wafer on the silicon wafer group transport mechanism, controlling the silicon wafer group transport mechanism to drive the silicon wafer group to move toward the direction close to the silicon wafer adsorption mechanism;

[0030] When the interval time is greater than the third preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, and there is no silicon wafer on the silicon wafer group transmission mechanism, the silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism, the loading mechanism and the silicon wafer transportation mechanism are all controlled to be paused.

[0031] Optionally, the method further includes:

[0032] In the case of a failure or jam of the wafer inserting mechanism, the wafer group transmission mechanism, the wafer adsorption mechanism, the wafer loading mechanism and the wafer transport mechanism are all controlled to be suspended.

[0033] Optionally, the silicon wafer adsorption mechanism includes: a water absorption plate and a water absorption pump for providing adsorption force for the water absorption plate, and the method further includes:

[0034] After controlling the water absorption plate and the sheet loading mechanism to operate, the water absorption pump is controlled to resume operation.

[0035] In the present application, by setting a distance sensor and combining a loading speed detection device to detect the interval time between two adjacent silicon wafers passing through a preset position on a silicon wafer transport mechanism, it is possible to automatically determine the cause of abnormal silicon wafer loading, automatically adjust the action of the silicon wafer group transmission mechanism, reduce manual intervention, and ensure continuous loading. The working state of the inserter is determined by the silicon wafer detection sensor and the distance sensor. After all the inserts of the current batch of materials are completed, the silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism, the loading mechanism, and the silicon wafer transport mechanism are automatically stopped, and the loading of a new batch of silicon wafers is automatically completed, thereby improving production efficiency and reducing energy consumption. Moreover, in the present application, by controlling the timing of the action of the water suction pump, the probability of continuous wafers is reduced, production efficiency is improved, and energy consumption is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0037] Figure 1 A partial structural schematic diagram of a silicon wafer transfer device according to an embodiment of the present invention is shown;

[0038] Figure 2 A partial structural schematic diagram of a silicon wafer adsorption mechanism in an embodiment of the present invention is shown;

[0039] Figure 3 A schematic diagram of a connected piece in an embodiment of the present invention is shown;

[0040] Figure 4 A schematic diagram of the arrangement of a photoelectric beam sensor in an embodiment of the present invention is shown;

[0041] Figure 5 A structural schematic diagram of a slicing mechanism in an embodiment of the present invention is shown.

[0042] Description of the accompanying drawings:

[0043] 1-silicon wafer transport mechanism, 2-wafer loading speed detection device, 3-crescent-shaped rotating wafer loading structure, 4-silicon wafer adsorption mechanism, 4-1-water absorption plate, 4-2-bracket, 4-3-transmitting end of optical fiber sensor, 4-4-receiving end of optical fiber sensor, 4-5-through hole, 5-wafer loading belt, 6 or 6-3-right water jet, 6-1-connecting part, 6-2-photoelectric corresponding sensor, 7-wafer loading position swing rod detection switch, 8-right stepper motor, 9-right transmission belt, 10-bottom transmission belt, 11-left transmission belt, 12-left stepper motor, 13-bottom stepper motor, 14-left water jet. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] The present invention provides a silicon wafer transmission device, referring to Figure 1 As shown, the silicon wafer transmission device includes: a silicon wafer group transmission mechanism, a wafer separation mechanism, a silicon wafer adsorption mechanism 4, a wafer loading mechanism, a silicon wafer transport mechanism 1, a distance sensor and a wafer loading speed detection device 2. The silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism 4, the wafer loading mechanism and the silicon wafer transport mechanism 1 are arranged in sequence.

[0046] The silicon wafer group transmission mechanism is mainly used to transmit the silicon wafer group toward the direction close to the silicon wafer adsorption mechanism 4. The silicon wafer group is a plurality of stacked silicon wafers, or can be a cutter. The silicon wafer group transmission mechanism can include: a silicon wafer group bearing structure, and a power structure for driving the movement of the silicon wafer group bearing structure. Figure 1 In the embodiment, the power structure may include a right stepper motor 8, a left stepper motor 12 and a bottom stepper motor 13, and the silicon wafer group bearing structure may include: a right transmission belt 9, a left transmission belt 11 and a bottom transmission belt 10, wherein the right stepper motor 8 drives the right transmission belt 9 to move, the left stepper motor 12 drives the left transmission belt 11 to move, and the bottom stepper motor 13 drives the bottom transmission belt 10 to move. Normally, the right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13 move synchronously, thereby driving the right transmission belt 9, the left transmission belt 11 and the bottom transmission belt 10 to move synchronously, so that the silicon wafer group or silicon wafer moves smoothly on the silicon wafer group bearing structure.

[0047] The slicing mechanism is arranged on the silicon wafer group transmission mechanism, and is used for separating the individual silicon wafers in the silicon wafer group one by one. Figure 1In the embodiment, the wafer separation mechanism includes: a right water knife 6 and a left water knife 14. The wafer adsorption mechanism 4 is used to adsorb the separated wafers one by one onto the wafer loading mechanism one by one. There is a height difference between the wafer transport mechanism 1 and the wafer group transport mechanism in a direction perpendicular to the wafer transport direction. Figure 1 The transport direction of the silicon wafer is from right to left. The loading mechanism is used to transport the silicon wafer adsorbed on the loading mechanism to the silicon wafer transport mechanism 1 to overcome the height difference. The loading mechanism may include: a loading belt 5, a traction structure of the loading belt 5 (not shown in the figure), a crescent-shaped rotating loading structure 3, and a traction structure of the crescent-shaped rotating loading structure 3 (not shown in the figure). The loading belt 5 is connected to the crescent-shaped rotating loading structure 3. The traction structure of the loading belt 5 can be a stepper motor, and the traction structure of the crescent-shaped rotating loading structure 3 can be a servo motor, etc., which is not specifically limited. Refer to Figure 2 The silicon wafer adsorption mechanism 4 here may include: a water absorption plate 4-1, on which a water hole is provided, and water drawn by a water absorption pump (not shown in the figure) passes through the water hole to provide adsorption force. Figure 1 The wafer transport mechanism 1 may be a conveyor belt, etc. The wafer loading speed detection device 2 may be a detection switch. When the wafer passes through the preset position on the wafer transport mechanism, the wafer loading speed detection device 2 may be in an off state. When no wafer passes through the preset position on the wafer transport mechanism, the wafer loading speed detection device 2 may be in an on state. By detecting the on-off frequency, etc., the interval between two adjacent wafers passing through the preset position on the wafer transport mechanism 1 may be detected.

[0048] Among them, the distance sensor is used to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism. If there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, it means that the silicon wafer is far away from the silicon wafer adsorption mechanism 4, and the suction force of the silicon wafer adsorption mechanism 4 cannot adsorb the silicon wafer. If there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, it means that the silicon wafer is close to the silicon wafer adsorption mechanism 4, and the suction force of the silicon wafer adsorption mechanism 4 can adsorb the silicon wafer, and the suction force is not too large to cause fragments. The adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism refers to: a partial area on the silicon wafer group transmission mechanism close to the silicon wafer adsorption mechanism 4, in which the silicon wafer adsorption mechanism 4 has sufficient adsorption force to adsorb the silicon wafers separated one by one to the upper belt 5 of the upper mechanism. Optionally, the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism may include: the area on the silicon wafer group transmission mechanism where the distance from the silicon wafer adsorption mechanism 4 is less than or equal to 5 mm, that is, the silicon wafer adsorption mechanism 4 has sufficient adsorption force to adsorb the silicon wafers separated piece by piece to the upper belt 5 of the upper mechanism within the area on the silicon wafer group transmission mechanism where the distance from the silicon wafer adsorption mechanism 4 is less than or equal to 5 mm, and the adsorption force is not too large to cause fragments. Specifically, the maximum adsorption force of the silicon wafer adsorption mechanism 4 is proportional to the distance, and the greater the maximum adsorption force of the silicon wafer adsorption mechanism 4, the greater the distance. In the present application, the adsorption range of the silicon wafer adsorption mechanism 4 is controlled more accurately, which can ensure that within the adsorption range, the adsorption force is sufficient to adsorb the silicon wafer to the upper belt 5 of the upper mechanism, and the adsorption force is not too large to cause fragments, etc.

[0049] Furthermore, the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism may include: the area on the silicon wafer group transmission mechanism that is 3mm to 5mm away from the silicon wafer adsorption mechanism 4, not only is the adsorption force sufficient to adsorb the silicon wafer to the upper belt 5 of the upper mechanism, but the adsorption force is not too large to cause fragments, and the space reserved for the adsorption operation is more appropriate, and the adsorption operation is smoother. Optionally, the suction force of the silicon wafer adsorption mechanism within the adsorption range is 0.2MPa (megapascals) to 0.5MPa, which is more appropriate, not only can the silicon wafer be adsorbed to the upper belt 5 of the upper mechanism within the adsorption range, but the adsorption force is not too large to cause fragments. Further, the suction force of the silicon wafer adsorption mechanism within the adsorption range is 0.3MPa to 0.4MPa, the control of the adsorption force is more precise, and a good balance is achieved between energy consumption and adsorption effect.

[0050] For example, the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transport mechanism may include: the distance from the silicon wafer adsorption mechanism 4 to the silicon wafer group transport mechanism may be 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm. For example, the suction force of the silicon wafer adsorption mechanism within the adsorption range may be 0.2MPa, 0.3MPa, 0.32MPa, 0.35MPa, 0.4MPa, 0.43MPa, 0.45MPa, 0.5MPa.

[0051] The loading speed detection device 2 is used to detect the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transportation mechanism 1. A longer interval time indicates that there is no silicon wafer being loaded or the silicon wafer loading is slow, which may indicate that multiple silicon wafers may be squeezed. More specifically, before the silicon wafer group enters the silicon wafer group transmission mechanism, it needs to undergo a debonding operation. During the production process, it is often possible that some silicon wafers cannot be completely detached due to insufficient debonding, resulting in uneven distribution of silicon wafers in the debonding rack and obvious gaps. This gap problem will easily lead to the silicon wafer being unable to be adsorbed due to being too far away from the silicon wafer adsorption mechanism 4 in the future. The specific manifestation is the aforementioned longer interval time, which in turn affects the continuity and stability of loading. Normally, only one silicon wafer is being loaded on the loading mechanism at the same time, so that subsequent insertion is relatively smooth. If multiple silicon wafers are loaded on the loading mechanism at the same time, subsequent insertion will cause failures. Refer to Figure 3 At the same time, the silicon wafer adsorption mechanism 4 simultaneously adsorbs two silicon wafers onto the wafer loading mechanism, which will cause multiple silicon wafers to be squeezed. Figure 3 The silicon wafer 1 and the silicon wafer 2 are squeezed at the position indicated by the arrow and are loaded at the same time, which is specifically reflected in the longer interval mentioned above. The preset position here can be any position on the silicon wafer transport mechanism 1. For example, the preset position can be a position on the silicon wafer transport mechanism 1 close to the loading mechanism. Then, the loading speed detection device 2 can be used to detect the interval between two adjacent silicon wafers passing through the position on the silicon wafer transport mechanism 1 close to the loading mechanism. There is no specific limitation on the specific position that the loading speed detection device 2 detects the two adjacent silicon wafers passing through. There is no specific limitation on the setting position of the loading speed detection device 2.

[0052] In summary, in this application, the distance sensor can automatically detect that there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, and the loading speed detection device 2 can automatically detect that there is no silicon wafer on the wafer or the silicon wafer is loaded slowly, and multiple silicon wafers may be squeezed, which can improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy. Moreover, the detection results can provide a certain basis for the automatic control of the start and stop of each mechanism in the silicon wafer transmission device, as well as the control timing, which can further improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy.

[0053] It should be noted that after the silicon wafer group enters the water tank, the first stage of movement toward the silicon wafer suction mechanism 4 is high-speed movement until it is detected by the upper wafer position swing rod detection switch 7, so as to improve production efficiency. When the silicon wafer group is detected by the upper wafer position swing rod detection switch 7, it means that the silicon wafer group is close to the wafer suction position, and the movement speed of the silicon wafer group is reduced to low-speed stepping, which is convenient for precise control.

[0054] Reference Figure 2 Optionally, the distance sensors (4-2 and 4-3) are arranged in the silicon wafer adsorption mechanism 4. Alternatively, the distance sensor is located at a side of the silicon wafer adsorption mechanism 4 away from the silicon wafer group transmission mechanism, and the arrangement position of the distance sensor is relatively flexible.

[0055] Reference Figure 2 Optionally, the silicon wafer adsorption mechanism 4 includes a first surface close to the silicon wafer group transmission mechanism, and the silicon wafer on the silicon wafer group transmission mechanism includes a second surface close to the silicon wafer adsorption mechanism 4, and the size of the first surface is larger than the size of the second surface, that is, in addition to the adsorption area, there is remaining space in the first surface of the silicon wafer adsorption mechanism 4 close to the silicon wafer group transmission mechanism, and a through hole 4-5 is opened in the silicon wafer adsorption mechanism 4, and the distance sensor is arranged in the through hole 4-5, which makes full use of the remaining space in the silicon wafer adsorption mechanism 4, and the structure of the silicon wafer transmission device is relatively compact and occupies less space.

[0056] For example, refer to Figure 2 The silicon wafer adsorption mechanism 4 may include: a water absorption plate 4-1, wherein the size of the first surface of the water absorption plate 4-1 close to the silicon wafer group transmission mechanism is larger than the size of the second surface of the silicon wafer, and a through hole 4-5 is provided on the water absorption plate 4-1, and the distance sensor is arranged in the through hole 4-5. The shape of the through hole 4-5 is not specifically limited, and may be a square through hole, a circular through hole, etc., and may be adjusted according to the shape of the distance sensor.

[0057] There is no limitation on the specific form of the distance sensor. For example, the distance sensor can be a sensor that uses light to measure distance. For example, the distance sensor is an optical fiber sensor. The optical fiber sensor includes: a transmitting end 4-3 and a receiving end 4-4, which can be installed in the through hole 4-5 through a bracket 4-2. There is an angle between the transmitting end 4-3 and the receiving end 4-4. The size of the angle is not limited and is set according to specific measurement accuracy and range. For example, the angle between the transmitting end 4-3 and the receiving end 4-4 can be 90°.

[0058] Optional, see Figure 1 and Figure 4 The silicon wafer transmission device may also include: a silicon wafer detection sensor 6-2, which is used to detect whether there are silicon wafers on the silicon wafer group transmission mechanism. If there are silicon wafers on the silicon wafer group transmission mechanism, it means that there are silicon wafers on the blade material that need to be loaded. If there are no silicon wafers on the silicon wafer group transmission mechanism, it means that there are no silicon wafers on the blade material that need to be loaded, that is, all silicon wafers of the blade material have been loaded or adsorbed. By setting the silicon wafer detection sensor, it can automatically detect whether the blade material has been loaded or adsorbed, which can improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy. Moreover, the detection result can provide a certain basis for the automatic control of the start and stop of each mechanism in the silicon wafer transmission device, as well as the control timing, which can further improve the automation level of the silicon wafer transmission device, thereby improving production efficiency and reducing the waste of human resources and energy.

[0059] There is no limitation on the location of the silicon wafer detection sensor, as long as it can detect whether there are silicon wafers on the silicon wafer group transmission mechanism. Figure 5 This is the structural diagram of the water jet on the right, optional, refer to Figure 5 The wafer separation mechanism includes: a connection part 6-1 and a water knife 6-3 connected to the wafer group transmission mechanism. The wafer detection sensor 6-2 is arranged on the connection part 6-1 of the wafer separation structure, which makes full use of the idle part of the connection part 6-1 of the wafer separation structure. In addition, the structure of the wafer transmission device is relatively compact and occupies less space. It should be noted that 6-1 is the connection part of the right water knife. One of the transmitting end and the receiving end of the wafer detection sensor 6-2 can be installed on the connection part 6-1 of the right water knife, and the other of the transmitting end and the receiving end of the wafer detection sensor 6-2 can be installed on the connection part of the left water knife 14.

[0060] The specific form of the silicon chip detection sensor is not limited, and can be optionally referred to as Figure 4 and Figure 5 , the silicon wafer detection sensor can be a photoelectric beam sensor 6-2. In this scenario, the detection result of the photoelectric beam sensor 6-2 is relatively accurate and easy to set. Figure 4 , the photoelectric sensor 6-2 has a transmitting end and a receiving end ( Figure 4 In the figure, one of the two, 6-2 located on the right water jet and 6-2 located on the left water jet, is a transmitting end and the other is a receiving end). In the absence of obstruction, the light emitted by the transmitting end will be received by the receiving end. The emission direction of the light emitted by the transmitting end is the light beam opposing direction L1 of the photoelectric opposing sensor. The light beam opposing direction L1 of the photoelectric opposing sensor 6-2 has an angle a with the first plane M. The first plane M is perpendicular to the transportation direction L2 of the silicon wafer group. The transportation direction L2 of the silicon wafer group is toward the silicon wafer adsorption mechanism 4. The first plane M here is parallel or approximately parallel to the second surface of the silicon wafer in the silicon wafer group close to the silicon wafer adsorption mechanism 4. That is to say, the light beam opposing direction L1 of the photoelectric opposing sensor 6-2 is not parallel to the first plane M. In this way, as long as there are silicon wafers on the silicon wafer group transmission mechanism, the light emitted by the transmitting end will be blocked with a high probability, and then the photoelectric opposing sensor 6-2 will detect that there are silicon wafers, that is, it is more accurate to detect whether there are silicon wafers on the silicon wafer group transmission mechanism.

[0061] Optional, see Figure 4 , the angle a is 15° to 35°, and the size of the angle a is within this range. On the one hand, the installation positions of the transmitting end and the receiving end of the photoelectric matching sensor 6-2 are relatively matched with the spatial layout of the silicon wafer transmission device, and will not occupy more extra space. On the other hand, the size of the angle a is within this range. As long as there is a silicon wafer on the silicon wafer group transmission mechanism, it is highly likely that the photoelectric matching sensor 6-2 will detect that there is a silicon wafer. Moreover, in the case where the silicon wafer detection sensor 6-2 is arranged on the connection part 6-1 of the slicing structure, the size of the angle a is within this range, and the installation positions of the transmitting end and the receiving end of the photoelectric matching sensor 6-2 are relatively matched with the positions of the connection parts of the left water knife and the right water knife in the silicon wafer transmission device. The transmitting end and the receiving end of the photoelectric matching sensor 6-2 can be respectively installed on the connection parts of the left water knife and the right water knife to reduce the complexity of installation and reduce space occupation.

[0062] For example, the angle a may be 15°, 18°, 20°, 25°, 30°, 32°, 33.5°, or 35°.

[0063] The present application also provides a wafer insertion system, including: any of the aforementioned silicon wafer transmission devices, and the wafer insertion system may also include a wafer insertion machine located after the silicon wafer transmission device, etc., and the specific structure of the wafer insertion system is not limited.

[0064] The present application also provides a control method applied to any of the aforementioned silicon wafer transmission devices, and the control method may include the following steps.

[0065] Step 101 : controlling the distance sensor to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism.

[0066] The control method can be executed by an intelligent control logic module, etc. The intelligent control logic module can be set on the silicon wafer transmission device, or separated from the silicon wafer transmission device, and there is no specific limitation on this. This step is to control the distance sensor to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism. One detection result is that there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, and the other result is that there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism.

[0067] Step 102, controlling the wafer loading speed detection device to detect the interval time between two adjacent silicon wafers passing through a preset position on the silicon wafer transportation mechanism.

[0068] Step 103 : When the interval time is longer than a first preset time and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transport mechanism, control the silicon wafer group transport mechanism to pause.

[0069] The interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism 1 is greater than the first preset time, and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transport mechanism, indicating that the aforementioned extrusion may have occurred, and the silicon wafer group transport mechanism is controlled to pause, for example, the aforementioned right stepper motor 8, left stepper motor 12 and bottom stepper motor 13 are controlled to pause, and the transportation of silicon wafers to the silicon wafer adsorption mechanism 4 is stopped to avoid further extrusion of silicon wafers. When the interval time returns to the normal range, the right stepper motor 8, left stepper motor 12 and bottom stepper motor 13 are restored to be controlled by the wafer loading speed detection device 2.

[0070] The first preset time length here needs to be set according to the interval time length between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation, and the first preset time length may be greater than the interval time length between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation. The specific size of the first preset time length is not limited.

[0071] In the present application, by automatically detecting whether there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transportation mechanism is automatically detected. If the interval time is greater than the first preset time, and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, that is, the aforementioned extrusion may have occurred, the silicon wafer group transmission mechanism is automatically controlled to pause, that is, the transportation of silicon wafers to the silicon wafer adsorption mechanism 4 is automatically stopped to avoid further extrusion of silicon wafers, thereby improving production efficiency and reducing waste of human resources and energy.

[0072] Optionally, referring to the above description, the silicon wafer transmission device further includes: a silicon wafer detection sensor, and the control method may further include: steps S1 to S3.

[0073] Step S1, controlling the silicon wafer detection sensor to detect whether there are any silicon wafers on the silicon wafer group transmission mechanism.

[0074] Step S2, when the interval time is greater than the second preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, and there is a silicon wafer on the silicon wafer group transmission mechanism, control the silicon wafer group transmission mechanism to drive the silicon wafer group to move toward the direction close to the silicon wafer adsorption mechanism.

[0075] When the interval duration is greater than the second preset duration, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, and there is a silicon wafer on the silicon wafer group transmission mechanism, indicating that there are still silicon wafers on the silicon wafer group transmission mechanism, but the silicon wafers have not entered the adsorption range of the silicon wafer adsorption mechanism 4, and the silicon wafer group transmission mechanism is controlled to drive the silicon wafer group to move toward the direction close to the silicon wafer adsorption mechanism 4, for example, the aforementioned right stepper motor 8, left stepper motor 12 and bottom stepper motor 13 are controlled to operate, so that the silicon wafers on the silicon wafer group transmission mechanism continue to be transported to the silicon wafer adsorption mechanism 4, so that the silicon wafers on the silicon wafer group transmission mechanism enter the adsorption range of the silicon wafer adsorption mechanism 4, thereby realizing automatic and continuous wafer loading to improve production efficiency.

[0076] The second preset time length here needs to be set according to the interval time length between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation. The second preset time length may be greater than the interval time length between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation. The relative size of the second preset time length and the aforementioned first preset time length is not specifically limited, and the two may be equal or unequal. The specific size of the second preset time length is not limited.

[0077] Step S3, when the interval time is greater than the third preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, and there is no silicon wafer on the silicon wafer group transmission mechanism, control the silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism, the loading mechanism and the silicon wafer transportation mechanism to pause.

[0078] When the interval duration is greater than the third preset duration, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, and there is no silicon wafer on the silicon wafer group transmission mechanism, indicating that the silicon wafers on the silicon wafer group transmission mechanism have all been loaded or adsorbed, and this loading is all completed. The silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism 4, the loading mechanism and the silicon wafer transportation mechanism are all controlled to be paused, that is, the servo motor of the crescent-shaped rotating loading structure 3, the aforementioned right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13, and the water suction pump motor are automatically stopped, and the knife-cutting and next knife material transportation process are automatically started. Compared with the related art, after the previous knife material is loaded, the equipment will continue to run idly, and rely on manual operation to realize the switching of the front and rear knife materials. In the present application, the automatic switching of the front and rear knife materials is realized to ensure continuous and automatic loading, so as to improve production efficiency, reduce manual intervention and reduce energy consumption.

[0079] The third preset duration here needs to be set according to the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation. The third preset duration can be greater than the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism during normal operation. The relative size of the third preset duration and the aforementioned first preset duration and the aforementioned second preset duration is not specifically limited, and can be equal or unequal. The specific size of the third preset duration is not limited. The relative size of the third preset duration and the aforementioned second preset duration is not specifically limited, and can be equal or unequal.

[0080] Optionally, the control method may further include: in the case of a failure or jam of the wafer insertion mechanism, controlling the wafer group transmission mechanism, the wafer adsorption mechanism 4, the wafer loading mechanism and the wafer transport mechanism to be suspended, and the failure of the wafer insertion mechanism may include: the wafer insertion container of the wafer is full of wafers, there is no free space for inserting wafers, resulting in the inability to insert wafers, and the wafer insertion container of the wafer needs to be replaced before the wafer can be inserted, or the wafer insertion mechanism of the wafer has an operational failure, resulting in the inability to insert wafers. Automatically pausing in the case of a failure or jam of the wafer insertion mechanism reduces manual intervention, reduces energy consumption, and can reduce waste of human resources and energy.

[0081] Optionally, the silicon wafer adsorption mechanism 4 includes: a water absorption plate 4-1 and a water absorption pump that provides adsorption force for the water absorption plate 4-1. The method also includes: after controlling the water absorption plate 4-1 and the loading mechanism to operate, controlling the water absorption pump to resume operation, that is, first allowing the water absorption plate 4-1 and the loading mechanism to resume operation. When there are silicon wafers on the water absorption plate 4-1 and the loading mechanism, the existing silicon wafers can be loaded first, and then the water absorption pump is controlled to resume operation. In this case, multiple silicon wafers will not be adsorbed on the water absorption plate 4-1 at the same time to avoid squeezing. Here, by controlling the action timing of the water absorption pump, the probability of continuous wafers is reduced, production efficiency is improved, and energy consumption is reduced.

[0082] It should be noted that the time between when the water suction pump resumes operation and when the water suction plate 4-1 and the loading mechanism resume operation can be set according to the specific action rhythm, based on not achieving continuous or squeezing, and there is no limitation on the specific size.

[0083] In summary, in the present application, by setting a distance sensor and combining a loading speed detection device to detect the interval time between two adjacent silicon wafers passing through a preset position on a silicon wafer transport mechanism, it is possible to automatically determine the cause of abnormal silicon wafer loading, automatically adjust the action of the silicon wafer group transmission mechanism, reduce manual intervention, and ensure continuous loading. The working state of the wafer inserter is determined by the silicon wafer detection sensor and the distance sensor. After all the wafers of the current batch are inserted, the silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism, the loading mechanism and the silicon wafer transport mechanism are automatically stopped, and the loading of a new batch of silicon wafers is automatically completed, thereby improving production efficiency and reducing energy consumption. Moreover, in the present application, by controlling the timing of the action of the water suction pump, the probability of continuous wafers is reduced, production efficiency is improved, and energy consumption is reduced.

[0084] Refer to the following Figures 1 to 5 , combined with specific embodiments, the present application is further explained.

[0085] The silicon wafer transmission device includes a distance sensor, a wafer loading speed detection device 2 and a silicon wafer detection sensor. The distance sensor is arranged in the through hole 4-5 of the water absorption plate 4-1. The silicon wafer detection sensor is a photoelectric beam sensor. The beam beam direction of the photoelectric beam sensor has an angle a with the first plane. The first plane is perpendicular to the transportation direction of the silicon wafer group. The angle a is 30°. The silicon wafer detection sensor is arranged on the connecting part of the slicing structure. The adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism is: in the area of ​​3mm to 5mm from the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, the suction force of the silicon wafer adsorption mechanism within the adsorption range is 0.3MPa to 0.4MPa.

[0086] During the normal operation of the silicon wafer transmission device, the interval between two adjacent silicon wafers passing through the preset position on the silicon wafer transportation mechanism is 1 second. When the loading speed detection device 2 at the upper end of the crescent-shaped rotating loading structure 3 fails to detect the passing of a silicon wafer for 10 seconds, and at the same time, the distance sensor detects that there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism 4 on the silicon wafer group transmission mechanism, but the light beam of the photoelectric corresponding sensor 6-2 is blocked, indicating that there are still silicon wafers on the silicon wafer group transmission mechanism, but the silicon wafers have not entered the adsorption area of ​​the silicon wafer adsorption mechanism 4. At this time, the right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13 are automatically started, and the silicon wafer group transmission mechanism drives the silicon wafer to be transported to the water absorption plate 4-1. When the silicon wafer enters the adsorption range of the silicon wafer adsorption mechanism 4, the right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13 are restored to be controlled by the loading speed detection device 2 to start and stop.

[0087] The interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism is calculated by the on-off frequency of the wafer loading speed detection device 2. When the distance sensor detects the silicon wafer, but the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism is greater than 2 seconds, it is determined that the silicon wafer in front of the water absorption plate 4-1 may be squeezed, and the right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13 are automatically suspended, and the transportation of the silicon wafer to the water absorption plate 4-1 is stopped to avoid further squeezing of the silicon wafer. When the interval time between two adjacent silicon wafers passing through the preset position on the silicon wafer transport mechanism returns to the normal range, the right stepper motor 8, the left stepper motor 12 and the bottom stepper motor 13 are restored to be controlled by the wafer loading speed detection device 2.

[0088] When the loading speed detection device 2 at the upper end of the crescent-shaped rotating loading structure 3 does not detect the passing of the silicon wafer for 10 seconds, and the distance sensor does not detect the silicon wafer, and the light beam of the photoelectric corresponding sensor 6-2 is not blocked, it is judged that all the silicon wafers on the silicon wafer group transmission mechanism have been loaded or adsorbed, and it is judged that the loading is completed, and the servo motor, the right stepper motor 8, the left stepper motor 12, the bottom stepper motor 13 and the water suction pump motor of the crescent-shaped rotating loading structure 3 are automatically stopped, and the knife-cutting and next knife material transportation process is automatically started.

[0089] When the crescent-shaped rotating wafer loading structure 3 and the water absorption plate 4-1 stop conveying silicon wafers due to replacing the flower basket or connecting wafers, cards, etc., the water absorption pump automatically stops running and the water absorption plate 4-1 stops sucking wafers. When the flower basket is replaced or the abnormality is restored, the crescent-shaped rotating wafer loading structure 3 and the water absorption plate 4-1 resume rotation, and the water absorption pump delay timer is activated. The friction between the water absorption plate and the crescent-shaped belt will drive the silicon wafers staying on the upper end of the water absorption plate to complete the loading. When the delay time reaches the set 300ms, the water absorption pump is automatically started, and the water absorption plate 4-1 resumes sucking wafers, which can reduce the number of connected wafers and improve the continuity of wafer loading.

[0090] This embodiment realizes automatic adjustment of silicon wafer stepping, water absorption pump action and automatic switching of front and rear cutters, realizes detection and automatic adjustment of the distance between the silicon wafer and the water absorption plate, optimizes the adsorption timing of the silicon wafer, ensures that the silicon wafer can be smoothly adsorbed and transferred by the water absorption plate, and automatically completes the switching of the front and rear cutters, thereby improving production efficiency, reducing manual intervention and reducing energy consumption.

[0091] It should be noted that, in the present application, the related parts among the silicon wafer transmission device, the wafer insertion system and the control method of the silicon wafer transmission device can be referenced to each other. In order to avoid repetition, the related parts are briefly described.

[0092] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0093] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A silicon wafer transfer device, characterized in that: include: A silicon wafer group transmission mechanism, a silicon wafer adsorption mechanism, a wafer loading mechanism and a silicon wafer transportation mechanism are arranged in sequence; There is a height difference between the silicon wafer transport mechanism and the silicon wafer group transport mechanism in a direction perpendicular to the silicon wafer transport direction; The silicon wafer transmission device further comprises: a distance sensor, a wafer loading speed detection device and a wafer separation mechanism, wherein the wafer separation mechanism is arranged on the silicon wafer group transmission mechanism; Wherein, the distance sensor is used to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism; The wafer loading speed detection device is used to detect the interval time between two adjacent silicon wafers passing through a preset position on the silicon wafer transportation mechanism.

2. The silicon wafer transfer device according to claim 1, characterized in that: The distance sensor is arranged in the silicon wafer adsorption mechanism, or the distance sensor is located at a side of the silicon wafer adsorption mechanism away from the silicon wafer group transmission mechanism.

3. The silicon wafer transfer device according to claim 1, characterized in that: The silicon wafer adsorption mechanism comprises: a first surface close to the silicon wafer group transmission mechanism; the silicon wafer on the silicon wafer group transmission mechanism comprises: a second surface close to the silicon wafer adsorption mechanism; the size of the first surface is greater than the size of the second surface; A through hole is provided in the silicon wafer adsorption mechanism, and the distance sensor is arranged in the through hole.

4. The silicon wafer transfer device according to claim 1, characterized in that: Also includes: The silicon wafer detection sensor is used to detect whether there are any silicon wafers on the silicon wafer group transmission mechanism.

5. The silicon wafer transfer device according to claim 4, characterized in that: The wafer separation mechanism includes: a connection portion connected to the silicon wafer group transmission mechanism; The silicon wafer detection sensor is arranged on the connecting portion of the slice structure.

6. The silicon wafer transfer device according to claim 4, characterized in that: The plane perpendicular to the transport direction of the silicon wafer group is the first plane, and the silicon wafer detection sensor includes: a photoelectric beam sensor, and the beam beam direction of the photoelectric beam sensor has an angle with the first plane.

7. The silicon wafer transfer device according to claim 6, characterized in that: The angle is 15° to 35°.

8. The silicon wafer transfer device according to any one of claims 1 to 7, characterized in that: The adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism includes: an area on the silicon wafer group transmission mechanism within a distance of less than or equal to 5 mm from the silicon wafer adsorption mechanism; and / or, The suction force of the silicon wafer adsorption mechanism within the adsorption range is 0.2 MPa to 0.5 MPa.

9. A sheet inserting system, characterized in that: include: The silicon wafer transfer device according to any one of claims 1 to 8.

10. A control method for a silicon wafer transmission device, characterized in that: Applicable to the silicon wafer transfer device according to any one of claims 1 to 8; the method comprises: Controlling the distance sensor to detect whether there is a silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism; Control the wafer loading speed detection device to detect the interval time between two adjacent silicon wafers passing through a preset position on the silicon wafer transport mechanism; When the interval time is longer than a first preset time and there are silicon wafers within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transport mechanism, the silicon wafer group transport mechanism is controlled to pause.

11. The control method of the silicon wafer transmission device according to claim 10, characterized in that: The silicon wafer transmission device further includes: a silicon wafer detection sensor; the method further includes: Controlling the silicon wafer detection sensor to detect whether there are any silicon wafers on the silicon wafer group transmission mechanism; When the interval time is longer than the second preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transport mechanism, and there is a silicon wafer on the silicon wafer group transport mechanism, controlling the silicon wafer group transport mechanism to drive the silicon wafer group to move toward the direction close to the silicon wafer adsorption mechanism; When the interval time is greater than the third preset time, there is no silicon wafer within the adsorption range of the silicon wafer adsorption mechanism on the silicon wafer group transmission mechanism, and there is no silicon wafer on the silicon wafer group transmission mechanism, the silicon wafer group transmission mechanism, the silicon wafer adsorption mechanism, the loading mechanism and the silicon wafer transportation mechanism are all controlled to be paused.

12. The control method of the silicon wafer transmission device according to claim 10 or 11, characterized in that: Also includes: In the case of a failure or jam of the wafer inserting mechanism, the wafer group transmission mechanism, the wafer adsorption mechanism, the wafer loading mechanism and the wafer transport mechanism are all controlled to be suspended.

13. The control method of the silicon wafer transmission device according to claim 10 or 11, characterized in that: The silicon wafer adsorption mechanism comprises: a water absorption plate and a water absorption pump providing adsorption force for the water absorption plate, and the method further comprises: After controlling the water absorption plate and the sheet loading mechanism to operate, the water absorption pump is controlled to resume operation.

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