Bonding alignment system, bonding process and bonding structure for semiconductor device

Abstract

The invention relates to a bonding alignment system for a semiconductor device. The bonding alignment system comprises an upper bearing table, a lower bearing table, a manipulator, at least one camera and a control module, wherein the upper bearing table and the lower bearing table are respectively used for receiving semiconductor devices and placing the semiconductor devices on the corresponding chucks, the manipulator is used for adsorbing the semiconductor devices and placing the semiconductor devices on the upper chuck and the lower chuck, the four cameras are used for shooting alignment mark images of the semiconductor devices, and the control module is used for controlling movement of the upper bearing table and the lower bearing table. Therefore, coaxial alignment and position recording of the semiconductor device are completed. According to the invention, the limitation of an alignment system in the prior art in the aspects of alignment precision and efficiency is solved, and particularly the technical problem that alignment deviation is easy to occur when a complex alignment task is faced is solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor bonding and alignment applications, and in particular to a bonding alignment system, a bonding process and a bonding structure thereof for semiconductor devices. Background Art

[0002] In modern semiconductor manufacturing, accurate bonding alignment of semiconductor devices is a key link to ensure product performance and quality. In the prior art, bonding alignment systems usually include components such as a carrier, a manipulator, and a camera, and the alignment of semiconductor devices is achieved through the collaborative work of these components. However, the existing system has certain limitations in alignment accuracy and efficiency, especially when faced with complex alignment tasks, alignment deviations are prone to occur, affecting the performance of the final product.

[0003] Specifically, existing alignment systems usually rely on a single type of camera for image acquisition, which has certain deficiencies in alignment mark recognition and position calculation, and easily leads to low alignment accuracy. In addition, the existing system lacks an effective control module to coordinate the movement of various components during the alignment process, making the alignment process less automated, cumbersome to operate, and inefficient. Summary of the invention

[0004] The object of the present invention is to provide a bonding alignment system for semiconductor devices and a bonding process thereof to solve the above-mentioned technical problems.

[0005] Technical solution: A bonding alignment system for semiconductor devices is provided, comprising: an upper carrier and a lower carrier; a manipulator; at least one camera; and a control module; wherein the upper carrier and the lower carrier are respectively used to receive semiconductor devices and place them on corresponding chucks, the manipulator is used to absorb the semiconductor devices and place them on the upper chuck and the lower chuck, four cameras are used to capture alignment mark images of semiconductor devices, and the control module is used to control the movement of the upper carrier and the lower carrier to complete the coaxial alignment and position recording of the semiconductor devices.

[0006] In a possible implementation manner, after the upper support platform and the lower support platform are aligned, they are moved to an alignment position to perform a rough alignment.

[0007] In a possible implementation, two cameras among the four cameras are used to photograph the alignment marks of the upper semiconductor device, and the other two cameras are used to photograph the alignment marks of the lower semiconductor device.

[0008] In a possible implementation, after the coaxial alignment is completed, the camera moves to the alignment position without relative displacement; the control module is used to record the Mark center coordinates of the upper semiconductor device and the lower semiconductor device, and calculate and correct the position deviation according to the recorded coordinates.

[0009] In a possible implementation, the manipulator is mounted on a base, and moves in the X, Y, and Z axis directions through a motion platform of the base. The upper and lower platforms are respectively mounted on the base, and vertical (Z axis) movement is achieved through a linear motor; the camera is mounted on the base through a bracket, and the optical axis of the camera is perpendicular to the surface of the upper and lower platforms; the control module is electrically connected to the camera, the manipulator, the upper and lower platforms, and the motion platform of the base, and is used to receive image signals from the camera, and control the movement of the manipulator and the platform according to the image signals. The upper and lower platforms are slidably connected to the base through guide rails, and the guide rails are used to guide the vertical movement of the platform and ensure the stability of its movement; a grating ruler is also provided on the base to detect the movement position of the upper and lower platforms, and to feed back the position to the control module for position correction.

[0010] In one possible implementation, a bonding alignment process for semiconductor devices is provided, comprising the following steps: placing an upper semiconductor device and a lower semiconductor device on an alignment machine; performing coaxial alignment using four cameras; recording the positions of the upper and lower semiconductor devices; performing position deviation adjustment; and pre-bonding the semiconductor device.

[0011] In a possible implementation, during the process of recording the position, the upper camera first photographs the Mark of the lower semiconductor device and calculates and records its center coordinates, and then the lower camera photographs the Mark of the upper semiconductor device and calculates and records its center coordinates.

[0012] In a possible implementation, the position deviation adjustment includes calculating the relative displacement between the upper and lower semiconductor devices according to the recorded Mark center coordinates, and performing deviation correction through a motion system.

[0013] In a possible implementation, a bonding structure for a semiconductor device is provided, including the following: a first solder joint and a second solder joint, wherein the second solder joint is a connecting pin solder joint; and an angle between the first solder joint and the second solder joint is 165 degrees.

[0014] In summary, the present application has the following beneficial technical effects: the present invention proposes an improved bonding alignment system for semiconductor devices, which includes an upper carrier and a lower carrier, a manipulator, four cameras and a control module, and can improve alignment accuracy while simplifying the alignment operation process and improving alignment efficiency. This improvement not only solves the alignment deviation problem in the prior art, but also significantly improves the production efficiency and product quality of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a top view of the bonding alignment system of the present invention (during the process of receiving a semiconductor device);

[0016] Figure 2 is a top view of the structure of the bonding alignment system of the present invention;

[0017] Figure 3 It is the conventional bonding pad layout of the present invention;

[0018] Figure 4 is the bonding pad layout of the present invention;

[0019] Figure 5 It is a data comparison diagram of the long solder joint RDS(on) and EAS MAX ID of the present invention;

[0020] Figure 6 It is a diagram of solder joint parameters and specifications of aluminum wire (Al) according to the present invention.

[0021] In the figure: 1. upper carrying platform; 2. lower carrying platform; 3. manipulator; 4. camera; 5. base; 6. grating ruler; 7. control module. DETAILED DESCRIPTION

[0022] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0023] Reference Figure 1 The bonding alignment system for semiconductor devices of the present application includes: an upper carrier 1 and a lower carrier 2; a manipulator 3; at least one camera 4; and a control module 7; wherein the upper carrier 1 and the lower carrier 2 are respectively used to receive semiconductor devices and place them on corresponding chucks, the manipulator 3 is used to absorb semiconductor devices and place them on the upper chuck and the lower chuck, the four cameras 4 are used to shoot alignment mark images of semiconductor devices, and the control module 7 is used to control the movement of the upper carrier 1 and the lower carrier 2 to complete the coaxial alignment and position recording of semiconductor devices. The system uses the upper carrier 1 and the lower carrier 2 to carry the upper semiconductor device and the lower semiconductor device respectively. The manipulator 3 moves the semiconductor device from the feeding position to the upper carrier 1 and the lower carrier 2, and shoots the alignment mark images of the semiconductor device through the four cameras 4. The control module 7 controls the movement of the upper carrier 1 and the lower carrier 2 according to the image information shot by the camera 4 to achieve the coaxial alignment and accurate position recording of the semiconductor device. By using four cameras 4 and a control module 7, high-precision alignment of semiconductor devices is achieved, the alignment efficiency and accuracy are improved, and manual operation errors are reduced. The application of the robot 3 enables the system to operate automatically and improves production efficiency.

[0024] The number of cameras 4 of the present application can be adjusted according to specific needs, for example, two cameras are used to achieve basic alignment functions. The manipulator 3 can also use different types of adsorption devices, such as vacuum adsorption or mechanical clamping, to adapt to semiconductor devices of different sizes and shapes.

[0025] Specifically, after the upper carrier 1 and the lower carrier 2 are aligned, they are moved to the alignment position for rough alignment. After the upper carrier 1 and the lower carrier 2 are coaxially aligned, they are further moved to the alignment position for rough alignment. This step ensures the position accuracy of the upper and lower carriers and provides higher alignment accuracy. By adding the rough alignment step, the alignment accuracy of the semiconductor device is further improved, the position error in subsequent processing is reduced, and the quality of the final product is improved.

[0026] In the present application, one or more alignment steps may be added to further improve the alignment accuracy. For example, after completing the coarse alignment, a fine alignment may be performed to ensure the best alignment effect of the semiconductor device.

[0027] Specifically, two of the four cameras 4 are used to photograph the alignment marks of the upper semiconductor device, and the other two cameras are used to photograph the alignment marks of the lower semiconductor device. The four cameras 4 are divided into two groups, which are used to photograph the alignment marks of the upper semiconductor device and the lower semiconductor device, respectively. In this way, each camera 4 focuses on the alignment mark of a semiconductor device, which improves the stability and accuracy of image acquisition. By using the cameras in groups, the speed and accuracy of image acquisition can be improved, the alignment time can be reduced, and the production efficiency can be improved. In addition, the interference between the cameras 4 can be reduced, and the accuracy of image processing can be improved.

[0028] The layout of the camera 4 of the present application can be adjusted according to specific needs. For example, the camera 4 can be installed in different positions to accommodate semiconductor devices of different sizes and shapes. In addition, a high-resolution camera can be used or the number of cameras 4 can be increased to further improve the alignment accuracy.

[0029] Specifically, after the coaxial alignment is completed, the camera 4 moves to the alignment position without relative displacement; the control module 7 shown is used to record the Mark center coordinates of the upper semiconductor device and the lower semiconductor device, and according to the recorded coordinates, the camera 4 moves to the alignment position without relative displacement after completing the coaxial alignment, ensuring the continuity of the image and the alignment accuracy. The control module 7 records the Mark center coordinates of the upper and lower semiconductor devices, and calculates and corrects the position deviation based on these records, thereby achieving high-precision alignment. The continuity and high precision of the alignment process improve the stability and reliability of the system. The automatic calculation and correction of position deviations reduce manual intervention and improve production efficiency.

[0030] In the present application, the position of the camera 4 can be adjusted according to specific needs, or a combination of multiple cameras can be used to further improve the alignment accuracy. In addition, different types of sensors can also be used to assist in position recording and deviation correction, such as a laser rangefinder or a grating ruler 6.

[0031] As a preferred case, the manipulator 3 is mounted on the base 5, and moves in the X, Y, and Z axis directions through the motion platform of the base 5. The upper platform 1 and the lower platform 2 are respectively mounted on the base 5, and the vertical direction (Z axis) movement is realized by the linear motor; the camera 4 is mounted on the base 5 through a bracket, and the optical axis of the camera 4 is perpendicular to the surface of the upper platform 1 and the lower platform 2; the control module 7 is electrically connected with the camera 4, the manipulator 3, the upper platform 1, the lower platform 2 and the motion platform of the base 5, and is used to receive the image signal from the camera 4, and control the movement of the manipulator 3 and the platform according to the image signal. The upper platform 1 and the lower platform 2 are slidably connected to the base 5 through a guide rail, and the guide rail is used to guide the vertical movement of the platform and ensure the stability of its movement; the base 5 is also provided with a grating ruler 6, which is used to detect the movement position of the upper platform 1 and the lower platform 2, and feedback the position to the control module 7 for position correction. The manipulator 3 moves in the X, Y, and Z axis directions through the motion platform of the base 5, and realizes flexible operation of semiconductor devices. The upper carrier 1 and the lower carrier 2 are moved in the vertical direction by a linear motor, ensuring the alignment and positioning of the semiconductor device. The camera 4 is mounted on the base 5 through a bracket, and the optical axis is perpendicular to the surface of the carrier, ensuring the accuracy of image acquisition. The control module 7 receives the image signal through electrical connection and controls the movement of the manipulator 3 and the carrier to ensure the coordinated operation of the system. The application of the guide rail and the grating ruler 6 improves the stability and accuracy of the carrier movement. High-precision alignment and positioning of semiconductor devices are achieved, the complexity of the system is reduced, and the production efficiency is improved. The application of the guide rail and the grating ruler 6 further improves the stability and reliability of the system and ensures the alignment accuracy.

[0032] In the present application, different types of motion systems, such as pneumatic drive or magnetic suspension system, can be used to improve the accuracy and speed of motion. In addition, the structure and drive mode of the manipulator 3 can be adjusted according to specific needs to adapt to semiconductor devices of different sizes and shapes.

[0033] Specifically, a bonding alignment process for semiconductor devices is characterized in that the process includes the following steps: connecting the upper semiconductor device and the lower semiconductor device to an alignment machine; using four cameras 4 for coaxial alignment; recording the positions of the upper and lower semiconductor devices; adjusting the position deviation; and pre-bonding the semiconductor device. First, the upper semiconductor device and the lower semiconductor device are connected to the alignment machine and coaxially aligned by four cameras 4. Then, the positions of the upper and lower semiconductor devices are recorded, and the position deviation is adjusted. Finally, a pre-bonding operation is performed to ensure accurate alignment of the semiconductor device. Through a series of steps, this process achieves high-precision alignment and pre-bonding of semiconductor devices, thereby improving product quality and production efficiency.

[0034] In this application, the alignment steps can be increased or decreased to meet different process requirements. For example, a fine alignment step can be added after the coaxial alignment to further improve the alignment accuracy. In addition, different types of sensors or visual systems can be used to assist the alignment process to meet different application scenarios and requirements;

[0035] In the process of recording the position, the upper camera 4 first photographs the Mark of the lower semiconductor device and calculates and records its center coordinates, and then the lower camera 4 photographs the Mark of the upper semiconductor device and calculates and records its center coordinates.

[0036] In the above scheme, in the process of recording the position, the upper camera 4 first photographs the Mark of the lower semiconductor device, calculates its center coordinates, and records them. Then the lower camera 4 photographs the Mark of the upper semiconductor device, calculates its center coordinates, and records them. Through this sequential image acquisition and coordinate calculation, the accuracy and consistency of the position recording are ensured. By successively photographing and recording the center coordinates of the Marks of the upper and lower semiconductor devices, the accuracy of the position recording can be ensured, the accuracy of the position deviation adjustment can be improved, and thus the overall alignment effect can be improved.

[0037] The present application can use a multi-camera system to simultaneously photograph the Marks of the upper and lower semiconductor devices to reduce recording time and improve efficiency. In addition, a high-precision image processing algorithm can be used to further improve the calculation accuracy of the Mark center coordinates.

[0038] Specifically, the position deviation adjustment includes calculating the relative displacement between the upper and lower semiconductor devices according to the recorded Mark center coordinates, and performing deviation correction through the motion system. The step of position deviation adjustment includes calculating the relative displacement between the upper and lower semiconductor devices according to the previously recorded Mark center coordinates. Then, by controlling the motion system, the deviation correction is performed according to the calculated relative displacement to ensure the accurate alignment of the upper and lower semiconductor devices. This position deviation adjustment method can effectively correct the relative displacement between the upper and lower semiconductor devices, ensure alignment accuracy, reduce errors in subsequent processes, and improve the quality of the final product.

[0039] Specifically, different motion control algorithms can be used to correct the deviation, such as PID control, fuzzy control, etc., to improve the accuracy and response speed of the correction. In addition, higher-precision sensors can be used to assist in position recording and deviation calculation to improve the alignment accuracy of the overall system.

[0040] As a preferred case, a bonding structure for a semiconductor device includes the following: a first solder joint and a second solder joint, wherein the second solder joint is a solder joint for connecting the pins; the angle between the first solder joint and the second solder joint is 165 degrees. The bonding structure includes a first solder joint and a second solder joint, wherein the second solder joint is used to connect the pins of the semiconductor device. The angle between the two solder joints is 165 degrees. This special angle design helps to optimize the welding effect and ensure the stability and reliability of the electrical connection. The design improves the quality and reliability of welding by setting a specific solder joint angle and reduces the stress and deformation generated during the welding process. At the same time, it also optimizes the electrical performance and ensures the stable operation of the semiconductor device. In some alternative embodiments, the number and angle of the solder joints can be adjusted according to specific needs. For example, the number of solder joints can be increased to enhance the connection strength, or the solder joint angle can be adjusted to adapt to different device structures. In addition, different welding materials and processes can be used to further improve the welding quality and performance.

[0041] according to Figures 2 to 6As shown, the bonding structure for semiconductor devices adopts long solder joint design, solder joint layout optimization, chip window bonding strategy adjustment, and material and process parameter optimization. Through the improvement of the above structure, the on-resistance RDS(on) is reduced, and the avalanche capability and heat dissipation performance are improved. The design reduces the solder joint resistance and improves the conductive performance by increasing the solder joint length; optimizes the solder joint layout, reduces the bending angle of the solder wire to meet the design requirements of the long solder joint, and improves the mechanical strength and thermal stability of the solder joint; adjusts the chip window bonding strategy, and adjusts the process of the chip window with a double solder joint design to achieve a long solder joint, reduce costs and improve circulation efficiency; introduces a long solder joint to the chip window with a single solder joint design to improve performance. At the same time, the comprehensive performance of semiconductor devices is further improved by optimizing materials and process parameters. Through the long solder joint design and layout optimization, the on-resistance RDS(on) can be reduced, and the conductive performance and mechanical strength of the device can be improved. Through the adjustment of the chip window bonding strategy and the optimization of material process parameters, the avalanche capability and heat dissipation performance can be improved, and the reliability and service life of the device can be improved. These improvements help to reduce production costs and improve product consistency and market competitiveness.

[0042] In this embodiment, if Figure 3 As shown in the figure, the length and shape of the long solder joint design can be adjusted according to the specific application requirements; the solder joint layout can be optimized according to the actual circuit design requirements, such as adjusting the solder joint position or increasing the number of solder joints; the chip window bonding strategy can be adjusted in combination with different process conditions, such as using different welding temperatures or pressures. The optimization of materials and process parameters can also be adjusted according to specific application requirements, such as selecting different welding materials or adjusting the welding time to achieve the best results.

[0043] In one possible implementation, the long solder joint design includes increasing the length of the solder joint to reduce the solder joint resistance and improve the conductive performance; the solder joint layout optimization includes reducing the bending angle of the solder joint to adapt to the design requirements of the long solder joint and improve the mechanical strength and thermal stability of the solder joint; the chip window bonding strategy adjustment includes adjusting the process of the chip window with a double solder joint design to achieve a long solder joint to reduce costs and improve circulation efficiency, and introducing a long solder joint to the chip window with a single solder joint design to improve performance. By increasing the solder joint length, the resistance when the current passes through the solder joint can be reduced and the conductive performance can be improved. Optimizing the solder joint layout and reducing the bending angle of the solder joint can reduce the fatigue of the solder joint under thermal cycling and mechanical stress, and improve the mechanical strength and thermal stability of the solder joint. Adjusting the chip window bonding strategy and achieving the long solder joint design through process adjustment can reduce production costs and improve circulation efficiency; introducing a long solder joint to the chip window with a single solder joint design can improve the performance of the device.

[0044] Increase the length of solder joints and optimize solder joint layout. Through experimental comparison, long solder joint design has obvious advantages in reducing RDS(on) and improving EAS MAX ID, such as Figure 5 As shown, the electrical conductivity and mechanical strength of the device can be improved and the risk of solder joint failure can be reduced. Adjusting the chip window bonding strategy can improve production efficiency, reduce costs, and improve device performance and reliability. These improvements help to enhance the market competitiveness of products and user satisfaction.

[0045] Adjust the chip window bonding strategy. For 20mil aluminum wire welding, single solder joints with pad X axis above 2600um can be switched to long solder joints to achieve the optimization of improving performance and reliability. All products with double solder joints can be switched to long solder joints to achieve the effect of reducing costs and increasing efficiency (such as Figure 6 shown).

[0046] In this embodiment, the design of the solder joint length and layout can be adjusted according to the specific application requirements, such as selecting different soldering materials or process parameters. The adjustment of the chip window bonding strategy can also be optimized in combination with different process conditions, such as using different soldering temperatures or pressures. The optimization of materials and process parameters can be adjusted according to the specific application requirements to achieve the best results.

[0047] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A bonding alignment system for a semiconductor device, characterized in that: The system includes: An upper loading platform and a lower loading platform; Manipulator; At least one camera; Control module; Among them, the upper carrier and the lower carrier are respectively used to receive the semiconductor device and place it on the corresponding chuck, the manipulator is used to adsorb the semiconductor device and place it on the upper chuck and the lower chuck, the camera is used to capture the alignment mark image of the semiconductor device, and the control module is used to control the movement of the upper carrier and the lower carrier to complete the coaxial alignment and position recording of the semiconductor device.

2. The bonding alignment system according to claim 1, characterized in that: After the alignment is completed, the upper and lower carriers shown are moved to the alignment position for rough alignment.

3. The bonding alignment system according to claim 2, characterized in that: Two cameras among the four cameras are used to photograph the alignment marks of the upper semiconductor device, and the other two cameras are used to photograph the alignment marks of the lower semiconductor device.

4. The bonding alignment system according to claim 3, characterized in that: After the coaxial alignment is completed, the camera moves to the alignment position without relative displacement; The control module shown is used to record the Mark center coordinates of the upper semiconductor device and the lower semiconductor device, and calculate and correct the position deviation according to the recorded coordinates.

5. The bonding alignment system according to claim 4, characterized in that: The manipulator is mounted on a base, and moves in the X, Y, and Z axis directions through a motion table of the base. The upper bearing platform and the lower bearing platform are respectively mounted on the base, and move in the vertical direction (Z axis) through a linear motor; The camera is mounted on the base through a bracket, and the optical axis of the camera is perpendicular to the surfaces of the upper and lower platforms; The control module is electrically connected to the camera, the manipulator, the upper supporting platform, the lower supporting platform and the motion platform of the base, and is used to receive the image signal from the camera and control the movement of the manipulator and the supporting platform according to the image signal. The upper and lower platforms are slidably connected to the base via guide rails, and the guide rails are used to guide the vertical movement of the platforms and ensure the stability of their movement; The base is also provided with a grating ruler for detecting the moving positions of the upper and lower bearing platforms and feeding back the positions to the control module for position correction.

6. A bonding alignment process for a semiconductor device, characterized in that: The process includes the following steps: The upper semiconductor device and the lower semiconductor device are placed on an alignment machine; Coaxial alignment using four cameras; Record the positions of upper and lower semiconductor devices; Perform position deviation adjustment; Pre-bonding semiconductor devices.

7. The bonding alignment process according to claim 6, characterized in that: In the process of recording the position, the upper camera first photographs the Mark of the lower semiconductor device and calculates and records its center coordinates, and then the lower camera photographs the Mark of the upper semiconductor device and calculates and records its center coordinates.

8. The bonding process according to claim 7, characterized in that: Position deviation adjustment includes calculating the relative displacement between the upper and lower semiconductor devices based on the recorded Mark center coordinates, and correcting the deviation through the motion system.

9. A bonding structure for a semiconductor device, characterized in that: The structure includes the following: A first welding point and a second welding point, wherein the second welding point is a welding point of a pipe foot; The angle between the first welding point and the second welding point is 165 degrees.

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