SMD upper cover tape gluing device with quantitative anti-overflow function

Abstract

The SMD upper cover tape gluing device with the quantitative anti-overflow function comprises a glue storage box, the middle of the top of the upper end of the glue storage box is connected with the middle of the lower end of a gluing frame through a rotating support, one side of the lower end of the gluing frame is connected with one end of a glue conveying pipe through a connecting pipe opening, and meanwhile the other end of the glue conveying pipe is connected with the lower end of one side of the front face of the glue storage box; universal seats are symmetrically arranged on the two sides of the lower end of the gluing frame, the two universal seats are connected with one side of the upper end of the glue storage box and the transmission assembly through telescopic rods and adjusting assemblies correspondingly, and a gluing assembly is arranged at the upper end of the gluing frame. According to the SMD upper cover tape gluing device with the quantitative anti-overflow function, a driving motor drives a transmission assembly to rotate, so that a stirring rod rotates through a connecting gear, glue in a glue storage box is stirred, a certain material in the glue is prevented from precipitating, meanwhile, a heating box is arranged, the temperature in the glue storage box is kept stable, and the quality of the glue is improved. Therefore, the glue has certain flowability and is convenient to glue.

Description

Technical Field

[0001] The invention relates to the technical field related to SMD upper cover processing, and in particular to an SMD upper cover tape gluing device with a quantitative anti-overflow function. Background Art

[0002] SMD cover tape is usually based on polyester or polypropylene film, and is compounded or coated with different functional layers (antistatic layer, adhesive layer, etc.). It can be sealed on the surface of the carrier tape under external force or heating to form a closed space to protect the electronic components in the carrier tape pocket. Among them, the SMD cover tape gluing device is a device dedicated to the gluing operation in the SMD component manufacturing process.

[0003] After searching, it is found that the typical gluing device in the prior art is disclosed in CN204769407U, which is a gluing device for the surface of an SMD cover tape, including a glue film traction roller, a glue tank, a glue pump, and a glue barrel. The glue film traction roller is installed in the glue tank and driven by a motor. The glue tank is divided into an upper rectangular section and a lower conical section. A guide groove is arranged in the rectangular section. The glue barrel is connected to the bottom of the conical section through a glue pump and a pipeline. The utility model improves the fluidity of the glue in the glue tank by changing the shape structure and feeding method of the glue tank.

[0004] To sum up, when the existing glue coating device is in use, the colloid contains certain materials that will produce flocculation when the temperature is low, causing the colloid to solidify easily, making it impossible to automatically glue. Secondly, when coating the glue, it is easy for excess colloid to overflow from both sides of the substrate, making the middle thick and the two sides thin, resulting in uneven colloid coating and uneven distribution of colloid on the substrate, affecting the processing quality. In view of the above problems, the existing equipment needs to be improved. Summary of the invention

[0005] The purpose of the present invention is to provide an SMD cover tape gluing device with a quantitative anti-overflow function to solve the problem that the existing gluing device proposed in the above background technology, when in use, due to the presence of a certain material in the colloid, will produce flocculation when the temperature is low, causing the colloid to easily solidify, thereby failing to automatically glue; secondly, when applying the glue, it is easy for excess colloid to overflow from both sides of the substrate, making the middle thick and the two sides thin, resulting in uneven colloid smearing and uneven distribution of the colloid on the substrate, affecting the processing quality.

[0006] To achieve the above object, the present invention provides the following technical solution: an SMD cover tape gluing device with quantitative anti-overflow function, comprising a glue storage box,

[0007] A partition plate is provided on one side of the glue storage box, and a plurality of stirring rods are provided on one side of the glue storage box, and one end of the plurality of stirring rods passes through the partition plate and is connected with the corresponding connecting gear, and the adjacent connecting gears are meshed and connected with each other, and the other end of the stirring rod arranged in the middle passes through the glue storage box and is connected with the driving motor through a transmission assembly. The middle of the top of the upper end of the glue storage box is connected to the middle of the lower end of the glue coating frame through a rotating bracket, and one side of the lower end of the glue coating frame is connected to one end of the glue delivery pipe through a connecting pipe mouth, and the other end of the glue delivery pipe is connected to the lower end of the front side of the glue storage box, and a glue delivery pump is provided on the glue delivery pipe, and universal seats are symmetrically provided on both sides of the lower end of the glue coating frame, and the universal seat provided on one side is connected to one side of the upper end of the glue storage box through a telescopic rod, and the universal seat provided on the other side is connected to the transmission assembly through an adjusting assembly, a glue coating assembly is provided on the upper end of the glue coating frame, and a leveling roller is provided on the side of the glue coating frame near the telescopic rod, a heating box is installed on the front of the glue storage box, and an air inlet is provided at the lower end of the front of the heating box, and a control panel is provided in the middle of the front of the heating box.

[0008] Preferably, a glue filling port is provided on one side of the stirring rod arranged above the front side of the glue storage box, and a rubber plug is threadedly connected to the inside of the glue filling port, and the stirring rods are staggered.

[0009] Preferably, the transmission assembly includes a first transmission gear, a second transmission gear, a third transmission gear, a positioning shaft and an eccentric disk, the first transmission gear is connected to the output end of the driving motor, and the upper end of the first transmission gear is meshedly connected to the second transmission gear, and the second transmission gear is connected to a stirring rod arranged in the middle, the upper end of the second transmission gear is meshedly connected to the third transmission gear, and the third transmission gear is connected to the upper end of one side of the glue storage box through the positioning shaft, and an eccentric disk is arranged on the outer side of the other end of the positioning shaft.

[0010] Preferably, limiting cross bars are provided in the grooves opened on both sides of the upper end of the glue coating frame, and the two limiting cross bars are connected to guide blocks installed on the side edges of the movable side panels symmetrically arranged inside the glue coating frame. At the same time, the movable side panel close to the inner wall of the glue coating frame is connected to the rotating threaded rod through a symmetrically arranged pushing rod.

[0011] Preferably, the interior of the lower end of the glue coating frame is hollow, and a heat conduction port is provided at the lower end of the lower end of the glue coating frame away from the telescopic rod, and the heat conduction port is connected to one side of the upper end of the heating box through a heat conduction component.

[0012] Preferably, the heat conduction component includes a two-position three-way solenoid valve, an exhaust fan and a heat conduction pipe, the two-position three-way solenoid valve is provided with a first air inlet and a second air inlet, and the first air inlet is connected to the upper end of the heating box, while the air outlet provided at the upper end of the two-position three-way solenoid valve is connected to the exhaust fan, and the other end of the exhaust fan is connected to the heat conduction port through the heat conduction pipe.

[0013] Preferably, the adjustment component includes a limit frame, a limit slide, a connecting column and a buffer spring. The limit frame is arranged at the upper end of one side of the glue storage box, and a limit slide is arranged inside the limit frame at the upper end of the eccentric disk. At the same time, a connecting column is arranged in the middle of the upper end of the limit slide. The top of the connecting column passes through the buffer spring and the limit frame and is connected to the corresponding universal seat.

[0014] Preferably, the glue coating assembly includes a ball screw assembly, a movable seat, a connecting seat, an electric push rod, a lifting frame, a mounting frame and a glue coating roller. Two ball screw assemblies are provided, and both ball screw assemblies are provided with a movable seat. At the same time, a connecting seat is provided between the two movable seats. Electric push rods are symmetrically provided on the upper end of the connecting seat, and the output end of the electric push rod is connected to the inner side of the upper end of the lifting frame. At the same time, the lower end of the lifting frame passes through the connecting seat and is connected to the mounting frame. The glue coating roller is rotatably connected to the inner side of the lower end of the mounting frame.

[0015] Preferably, one side of the heat conduction pipe is connected to one end of a connecting pipe through a connector, and a switch valve is installed on the connecting pipe. At the same time, the other end of the connecting pipe is connected to an exhaust device, and the exhaust device is installed above the side of the glue coating frame close to the leveling roller.

[0016] Compared with the prior art, the invention has the following beneficial effects: the SMD cover tape gluing device with quantitative anti-overflow function is

[0017] (1) In order to solve the problem that the existing glue coating device cannot be automatically glued because the colloid contains a certain material that will produce flocculation when the temperature is low, causing the colloid to solidify easily, thereby failing to automatically glue, the present application drives the transmission component to rotate by a driving motor, so that the stirring rod rotates through the connecting gear to stir the colloid inside the glue storage box to prevent the precipitation of a certain material in the colloid. At the same time, a heating box is provided to keep the temperature inside the glue storage box stable, so that the colloid has a certain fluidity, which is convenient for gluing;

[0018] (2) In order to solve the problem that in the existing glue coating device, excess colloid is prone to overflow from both sides of the substrate during glue coating, making the substrate thick in the middle and thin on both sides, resulting in uneven colloid coating and uneven distribution of colloid on the substrate, affecting the processing quality, the present application drives the transmission component to rotate through a driving motor, so that under the action of the eccentric disk, the adjustment component drives the glue coating frame to shake, so that the colloid inside the glue coating frame and the SMD cover tape are fully and evenly coated, and then under the action of the glue coating component and the leveling roller, the colloid is evenly coated to improve the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the front cross-sectional structure of the present invention;

[0020] Figure 2 For the present invention Figure 1The enlarged structural diagram at A in the middle;

[0021] Figure 3 For the present invention Figure 1 The enlarged structural diagram at B in the middle;

[0022] Figure 4 It is a front view structural schematic diagram of the present invention;

[0023] Figure 5 For the present invention Figure 4 The enlarged structural diagram at C in the middle;

[0024] Figure 6 It is a schematic diagram of the top view of the glue coating frame of the present invention.

[0025] In the figure: 1. glue storage box; 101. glue filling port; 2. partition plate; 3. stirring rod; 4. connecting gear; 5. transmission assembly; 501. first transmission gear; 502. second transmission gear; 503. third transmission gear; 504. positioning shaft; 505. eccentric disk; 6. driving motor; 7. glue delivery hose; 8. glue delivery pump; 9. glue coating frame; 901. connecting pipe port; 902. limit cross bar; 903. heat conduction port; 10. rotating bracket; 11. universal seat; 12. telescopic rod; 13. adjustment assembly; 1301. limit frame; 1302. limit slide plate; 1303. connecting column; 1304. buffer spring Spring; 14, moving side plate; 1401, guide block; 1402, pushing rod; 1403, rotating threaded rod; 15, gluing assembly; 1501, ball screw assembly; 1502, moving seat; 1503, connecting seat; 1504, electric push rod; 1505, lifting frame; 1506, mounting frame; 1507, gluing roller; 16, leveling roller; 17, heating box; 18, air inlet; 19, control panel; 20, two-position three-way solenoid valve; 21, first air inlet; 22, second air inlet; 23, exhaust fan; 24, heat pipe; 25, connecting pipe; 26, exhaust device; 27, switch valve. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-6 The present invention provides a technical solution: a SMD cover tape gluing device with quantitative anti-overflow function, according to Figure 1 , Figure 4 and Figure 5As shown, a partition plate 2 is provided on one side of the inside of the glue storage box 1, and a plurality of stirring rods 3 are provided on one side of the inside of the glue storage box 1. The stirring rods 3 are staggered, and one end of the plurality of stirring rods 3 passes through the partition plate 2 and is connected to the corresponding connecting gear 4. The adjacent connecting gears 4 are meshed and connected with each other. The other end of the stirring rod 3 arranged in the middle passes through the glue storage box 1 and is connected to the driving motor 6 through a transmission assembly 5. The transmission assembly 5 is driven to rotate by the driving motor 6, so that the stirring rod 3 rotates synchronously under the drive of the connecting gear 4, thereby improving the stirring effect. The transmission assembly 5 includes a first transmission gear 501, a second transmission gear 502, a third transmission gear 503, a positioning shaft 504 and an eccentric disk 505. The first transmission gear 501 is connected to the driving motor 6. The output end of the machine 6 is connected, and the upper end of the first transmission gear 501 is meshedly connected with the second transmission gear 502, and the second transmission gear 502 is connected to the stirring rod 3 arranged in the middle, the upper end of the second transmission gear 502 is meshedly connected with the third transmission gear 503, and the third transmission gear 503 is connected to the upper end of one side of the glue storage box 1 through a positioning shaft 504, and an eccentric disk 505 is arranged on the outer side of the other end of the positioning shaft 504, a heating box 17 is installed on the front of the glue storage box 1, and an air inlet hole 18 is opened at the lower end of the front of the heating box 17, and a control panel 19 is arranged in the middle of the front of the heating box 17, a glue adding port 101 is arranged on one side of the stirring rod 3 arranged above the front of the glue storage box 1, and the glue adding port 101 is internally threaded with a rubber plug.

[0028] When in use, the first transmission gear 501 is driven to rotate by the driving motor 6, so that the first transmission gear 501 drives the second transmission gear 502 and the stirring rod 3 set in the middle to rotate, and then the connecting gear 4 set at the other end of the stirring rod 3 set in the middle drives the adjacent connecting gear 4 and the stirring rods 3 set on both sides to rotate, so as to stir the colloid stored in the glue storage box 1, so that it is not easy to precipitate and solidify. At the same time, the colloid stored in the glue storage box 1 is heated by the heating box 17, so that the colloid is not easily affected by cold precipitation, thereby improving the fluidity of the colloid when it is in the hole. At the same time, the rotation of the second transmission gear 502 drives the third transmission gear 503, the positioning shaft 504 and the eccentric disk 505 to rotate synchronously, so that the eccentric disk 505 raises and lowers the position of the adjustment component 13, so that the glue coating frame 9 is tilted, which is convenient for the colloid to fully contact with the SMD cover.

[0029] according to Figure 1 , Figure 3 , Figure 4 and Figure 5As shown, the middle of the top of the upper end of the glue storage box 1 is connected to the middle of the lower end of the glue coating frame 9 through a rotating bracket 10, and one side of the lower end of the glue coating frame 9 is connected to one end of the glue delivery pipe 7 through a connecting pipe opening 901, and the other end of the glue delivery pipe 7 is connected to the lower end of the front side of the glue storage box 1. A glue delivery pump 8 is provided on the glue delivery pipe 7. Through the glue delivery pump 8, the colloid inside the glue storage box 1 is easily transported to the inside of the glue coating frame 9 to load the colloid. Universal seats 11 are symmetrically provided on both sides of the lower end of the glue coating frame 9, and the universal seat 11 provided on one side is connected to one side of the upper end of the glue storage box 1 through a telescopic rod 12, and the universal seat 11 provided on the other side is connected to one side of the upper end of the glue storage box 1 through a telescopic rod 12. The universal seat 11 is connected to the transmission assembly 5 through the adjustment assembly 13, and the adjustment assembly 13 includes a limit frame 1301, a limit slide 1302, a connecting column 1303 and a buffer spring 1304. The limit frame 1301 is arranged at the upper end of one side of the glue storage box 1, and the limit slide 1302 is arranged at the upper end of the eccentric disk 505 inside the limit frame 1301. At the same time, a connecting column 1303 is arranged in the middle of the upper end of the limit slide 1302. The top of the connecting column 1303 passes through the buffer spring 1304 and the limit frame 1301 and is connected to the corresponding universal seat 11, and the eccentric disk 505 rotates. , so that the limiting slide plate 1302 drives the connecting column 1303 to move downward under the action of the eccentric disk 505, and the buffer spring 1304 is extended, and then the upper end of the connecting column 1303 pulls the glue coating frame 9 to tilt, so that the colloid inside the glue coating frame 9 is evenly spread on the surface of the SMD cover tape, improving the glue coating effect and quality. The lower end of the glue coating frame 9 is hollow, and the lower end of the glue coating frame 9 is away from the telescopic rod 12. The lower end is provided with a heat conduction port 903, and the heat conduction port 903 is connected to one side of the upper end of the heating box 17 through a heat conduction component. The heat conduction component includes a two-position three-way solenoid valve 20 and an exhaust fan 23 and a heat conduction pipe 24, a first air inlet 21 and a second air inlet 22 are provided on the two-position three-way solenoid valve 20, and the first air inlet 21 is connected to the upper end of the heating box 17, and at the same time, an air outlet arranged on the upper end of the two-position three-way solenoid valve 20 is connected to the exhaust fan 23, and the other end of the exhaust fan 23 is connected to the heat conduction port 903 through the heat conduction pipe 24, one side of the heat conduction pipe 24 is connected to one end of a connecting pipe 25 through a connector, and a switch valve 27 is installed on the connecting pipe 25, and at the same time, the other end of the connecting pipe 25 is connected to an exhaust device 26, and the exhaust device 26 is installed above the side of the glue coating frame 9 close to the leveling roller 16.

[0030] When in use, the two-position three-way solenoid valve 20 and the exhaust fan 23 are used in combination to facilitate the external air to enter the heating box 17 through the air inlet hole 18, so that the hot gas is transported to the lower end cavity inside the glue coating frame 9 through the first air inlet 21 and the heat pipe 24, so that the heat is transferred to the glue coating frame 9, thereby ensuring that the colloid temperature inside the glue coating frame 9 is not easy to decrease, so that the colloid has better fluidity, improves the uniformity of glue coating and improves the heat utilization rate. At the same time, through the second air inlet 22, the external air is transported to the exhaust device 26 through the connecting pipe 25 for discharge, thereby cooling and condensing the colloid on the surface of the SMD cover tape after glue coating, so that the colloid adheres to the outside of the SMD cover tape.

[0031] according to Figure 1 , Figure 2 , Figure 4 and Figure 6 As shown, limit cross bars 902 are provided in the grooves opened on both sides of the upper end of the glue coating frame 9, and the two limit cross bars 902 are connected to the guide blocks 1401 installed on the sides of the movable side plates 14 symmetrically arranged inside the glue coating frame 9. At the same time, the movable side plate 14 is connected to the rotating threaded rod 1403 through a symmetrically arranged pushing rotating rod 1402 on one side close to the inner wall of the glue coating frame 9. The pushing rotating rod 1402 is slidably connected to the movable side plate 14 through a sliding seat at one end close to the movable side plate 14. By rotating the rotating threaded rod 1403, the pushing rotating rod 1402 connected to the outer side of the rotating threaded rod 1403 is rotated, while the other end of the pushing rotating rod 1402 moves and pushes the corresponding movable side plate 14 to move inside the glue coating frame 9, so that the distance between the movable side plates 14 is the same as the size of the SMD cover tape, so that the space for storing the colloid inside the glue coating frame 9 is the same as the area of ​​the SMD cover tape glue coating, thereby avoiding In order to avoid wasting the colloid inside the gluing frame 9, a gluing assembly 15 is arranged at the upper end of the gluing frame 9, and the gluing assembly 15 comprises a ball screw assembly 1501, a moving seat 1502, a connecting seat 1503, an electric push rod 1504, a lifting frame 1505, a mounting frame 1506 and a gluing roller 1507. Two ball screw assemblies 1501 are arranged, and the two ball screw assemblies 1501 are both provided with a moving seat 1502. At the same time, the two moving seats A connecting seat 1503 is arranged between 1502, and an electric push rod 1504 is symmetrically arranged on the upper end of the connecting seat 1503, and the output end of the electric push rod 1504 is connected to the inner side of the upper end of the lifting frame 1505. At the same time, the lower end of the lifting frame 1505 passes through the connecting seat 1503 and is connected to the mounting frame 1506. The inner side of the lower end of the mounting frame 1506 is rotatably connected with a glue coating roller 1507, and a leveling roller 16 is arranged on the inside of the glue coating frame 9 near the telescopic rod 12.

[0032] When in use, the lifting frame 1505 is driven downward by the electric push rod 1504, so that the glue coating roller 1507 contacts the surface of the SMD upper cover tape, so that the SMD upper cover tape is located in the colloid stored inside the glue coating frame 9, and then the ball screw assembly 1501 is started to drive the moving seat 1502 and the connecting seat 1503 to move horizontally synchronously, so that under the action of the glue coating roller 1507, the colloid is evenly coated on the upper outer surface of the SMD upper cover tape, and under the action of the leveling roller 16, it is convenient to evenly coat the colloid on the lower outer surface of the SMD upper cover tape, thereby improving the uniformity of the glue coating and improving the processing quality.

[0033] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the protection content of the present invention.

[0034] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A SMD cover tape gluing device with quantitative anti-overflow function, comprising a glue storage box (1), characterized in that: A partition plate (2) is provided on one side of the interior of the glue storage box (1), and a plurality of stirring rods (3) are provided on one side of the interior of the glue storage box (1). At the same time, one end of the plurality of stirring rods (3) passes through the partition plate (2) and is connected to a correspondingly arranged connecting gear (4). The adjacently arranged connecting gears (4) are meshed and connected to each other. The other end of the stirring rod (3) arranged in the middle passes through the glue storage box (1) and is connected to a driving motor (6) through a transmission assembly (5). The middle of the top of the upper end of the glue storage box (1) is connected to the middle of the lower end of the glue coating frame (9) through a rotating bracket (10), and one side of the lower end of the glue coating frame (9) is connected to one end of a glue delivery pipe (7) through a connecting pipe opening (901). At the same time, the other end of the glue delivery pipe (7) is connected to the lower end of the front side of the glue storage box (1). The glue delivery pipe (7) is connected to the end, and a glue delivery pump (8) is arranged on the glue delivery pipe (7). Universal seats (11) are symmetrically arranged on both sides of the lower end of the glue coating frame (9), and the universal seat (11) arranged on one side is connected to one side of the upper end of the glue storage box (1) through a telescopic rod (12), and the universal seat (11) arranged on the other side is connected to the transmission assembly (5) through an adjustment assembly (13). A glue coating assembly (15) is arranged on the upper end of the glue coating frame (9), and a leveling roller (16) is arranged inside the glue coating frame (9) near the telescopic rod (12). A heating box (17) is installed on the front of the glue storage box (1), and an air inlet hole (18) is opened at the lower end of the front of the heating box (17). At the same time, a control panel (19) is arranged in the middle of the front of the heating box (17).

2. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: A glue filling port (101) is provided on one side of the stirring rod (3) arranged above the front of the glue storage box (1), and a rubber plug is threadedly connected to the inside of the glue filling port (101), and the stirring rods (3) are arranged in a staggered manner.

3. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: The transmission assembly (5) comprises a first transmission gear (501), a second transmission gear (502), a third transmission gear (503), a positioning shaft (504) and an eccentric disk (505); the first transmission gear (501) is connected to the output end of the driving motor (6); the upper end of the first transmission gear (501) is meshedly connected to the second transmission gear (502); the second transmission gear (502) is connected to a stirring rod (3) arranged in the middle; the upper end of the second transmission gear (502) is meshedly connected to the third transmission gear (503); the third transmission gear (503) is connected to the upper end of one side of the glue storage box (1) through the positioning shaft (504); and an eccentric disk (505) is arranged on the outer side of the other end of the positioning shaft (504).

4. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: Limiting cross bars (902) are arranged in the grooves opened on both sides of the upper end of the glue coating frame (9), and the two limiting cross bars (902) are connected to the guide blocks (1401) installed on the side of the movable side plate (14) symmetrically arranged inside the glue coating frame (9), and at the same time, the side of the movable side plate (14) close to the inner wall of the glue coating frame (9) is connected to the rotating threaded rod (1403) through the symmetrically arranged pushing rotating rod (1402).

5. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: The interior of the lower end of the glue coating frame (9) is hollow, and a heat conduction port (903) is provided at the lower end of the glue coating frame (9) away from the telescopic rod (12), and the heat conduction port (903) is connected to one side of the upper end of the heating box (17) through a heat conduction component.

6. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 5, characterized in that: The heat conduction component comprises a two-position three-way solenoid valve (20), an exhaust fan (23) and a heat conduction pipe (24); the two-position three-way solenoid valve (20) is provided with a first air inlet (21) and a second air inlet (22), and the first air inlet (21) is connected to the upper end of the heating box (17); the air outlet provided at the upper end of the two-position three-way solenoid valve (20) is connected to the exhaust fan (23); and the other end of the exhaust fan (23) is connected to the heat conduction port (903) via the heat conduction pipe (24).

7. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: The adjustment component (13) comprises a limit frame (1301), a limit slide (1302), a connecting column (1303) and a buffer spring (1304); the limit frame (1301) is arranged at the upper end of one side of the glue storage box (1), and a limit slide (1302) is arranged inside the limit frame (1301) at the upper end of the eccentric disk (505); and a connecting column (1303) is arranged in the middle of the upper end of the limit slide (1302); the top of the connecting column (1303) passes through the buffer spring (1304) and the limit frame (1301) and is connected to a correspondingly arranged universal seat (11).

8. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 1, characterized in that: The glue coating component (15) comprises a ball screw component (1501), a movable seat (1502), a connecting seat (1503), an electric push rod (1504), a lifting frame (1505), a mounting frame (1506) and a glue coating roller (1507). Two ball screw components (1501) are provided, and the two ball screw components (1501) are both provided with a movable seat (1502). Meanwhile, a connecting seat (1503) is provided between the two movable seats (1502). The upper end of the connecting seat (1503) is symmetrically provided with an electric push rod (1504), and the output end of the electric push rod (1504) is connected to the inner side of the upper end of the lifting frame (1505). Meanwhile, the lower end of the lifting frame (1505) passes through the connecting seat (1503) and is connected to the mounting frame (1506). The inner side of the lower end of the mounting frame (1506) is rotatably connected to the glue coating roller (1507).

9. The SMD cover tape gluing device with quantitative anti-overflow function as claimed in claim 6, characterized in that: One side of the heat-conducting pipe (24) is connected to one end of a connecting pipe (25) through a connector, and a switch valve (27) is installed on the connecting pipe (25). At the same time, the other end of the connecting pipe (25) is connected to an exhaust device (26), and the exhaust device (26) is installed above the side of the gluing frame (9) close to the leveling roller (16).

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