Resin binder cutting blade and preparation method thereof

Abstract

The invention discloses a resin binder cutting blade and a preparation method thereof, the resin binder cutting blade comprises a cutting blade body, the upper and lower surfaces of the cutting blade body are provided with annular mounting grooves, a connecting through hole is arranged between the upper and lower layers of annular mounting grooves, the surfaces of the annular mounting grooves and the connecting through hole are evaporated with a heat conduction material I, and the annular mounting grooves and the connecting through hole are filled with a heat conduction material II. The annular grooves are formed in the front face and the back face of the cutting piece, the cutting piece is filled with the heat conduction material, the heat dissipation performance of the cutting piece is improved, the first heat conduction material is graphene, the graphene is evaporated in the annular grooves in an evaporation mode, the heat conduction performance is provided, meanwhile, the using amount of the graphene is reduced, and therefore the production cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of cutting blades, and in particular to a resin bond cutting blade and a preparation method thereof. Background Art

[0002] Ultra-thin resin cutting blades use resin as a binder and combine multiple materials. They have particularly remarkable cutting performance for difficult-to-cut materials such as alloy steel and stainless steel. Dry and wet cutting methods make the cutting accuracy more stable. At the same time, the choice of material and hardness of the cutting blade can greatly improve the cutting efficiency of the precision cutting machine and save your production costs.

[0003] The cutting knife generates friction when in high-speed cutting motion, which causes the cutting knife base to heat up rapidly. As the temperature rises, the motion state of the cutting knife itself will change, which may affect the processing effect of the material.

[0004] In the prior art, the heat dissipation of the cutting blade can be achieved by processing heat dissipation grooves or heat dissipation holes on the blade body of the cutting blade. For example, a noise-reducing and heat-dissipating blade with application number 201710357069.3 helps the blade to cool down through the heat dissipation holes, but its cooling effect is limited to the vicinity of the heat dissipation holes; another example is a diamond sintered saw blade material with stable cutting performance and its preparation process with application number 202111635909.0, which has a heat dissipation groove located on the edge of the saw blade, which can achieve rapid heat dissipation of the cutting part, which will also affect the processing effect.

[0005] Therefore, how to provide a resin bond cutting sheet and a preparation method thereof to solve the problems existing in the prior art is of great significance to its application. Summary of the invention

[0006] In view of this, the purpose of the present application is to provide a resin bond cutting sheet and a preparation method thereof to solve the problem.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A resin bond cutting blade comprises a cutting blade body, wherein the upper and lower surfaces of the cutting blade body are provided with annular grooves, a connecting through hole is provided between the upper and lower layers of the annular grooves, a thermally conductive material 1 is vapor-deposited on the surfaces of the annular grooves and the connecting through holes, and the annular grooves and the connecting through holes are filled with a thermally conductive material 2; wherein the cutting blade body comprises 80-100 parts of matrix metal powder and 10-20 parts of abrasive by weight, the thermally conductive material 1 is graphene, the thermally conductive material 2 is a composite material of graphene and copper, the thermally conductive material has a weight of 1-2 parts, and the thermally conductive material 2 has a weight of 5-10 parts.

[0009] Preferably, the annular grooves on the upper and lower sides are symmetrically arranged, and the connecting through holes are evenly distributed at equal distances.

[0010] Preferably, the thickness of the tool body in the vertical section where the upper ring groove, the connecting through hole and the lower ring groove are located is 1:1:1.

[0011] Preferably, the matrix metal powder comprises 65-80 parts of copper powder, 10-20 parts of tin powder and 5-10 parts of cobalt powder by weight.

[0012] Preferably, the abrasive is one or both of diamond and silicon carbide.

[0013] Preferably, the abrasive is a mixture of diamond and CBN, and the mass ratio of the two is 1:(0.8-1.2).

[0014] The method for preparing a resin bond cutting sheet comprises the following steps:

[0015] S1. Accurately weigh each component;

[0016] S2, adding abrasive to the matrix metal powder and mixing evenly;

[0017] S3, preparing an embryo body by forming the mixture in a molding die;

[0018] S4, shielding the embryo body except the ring groove and the connecting through hole;

[0019] S5, evaporating a thermal conductive material 1 on the surface of the shielded embryo;

[0020] S6, filling the second thermal conductive material on the surface of the ring groove and the connecting through hole;

[0021] S7, cold pressing;

[0022] S8, hot pressing sintering;

[0023] S9, machining.

[0024] Preferably, in S7, the pressure is 80-100 MPa, and the holding time is 10-30 s; in S8, the temperature is increased to 650°C at a heating rate of 30-50°C / min, and the temperature is kept for 10-20min.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The front and back sides of the cutting blade of the present invention are both provided with annular grooves and filled with heat-conducting materials to improve the heat dissipation of the cutting blade.

[0027] 2. In the present invention, the first thermally conductive material is graphene, which is evaporated in the annular groove by evaporation, thereby providing thermal conductivity while reducing the amount of graphene used, thereby reducing production costs.

[0028] 3. In the present invention, the second thermal conductive material is a composite material of graphene and copper powder, and the second thermal conductive materials in the two annular grooves are connected by connecting through holes, so that the connectivity between the two thermal conductive materials is better, the cutting piece is more stable to use, and the service life is improved.

[0029] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0030] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0032] Figure 1 It is a structural schematic diagram of the present invention;

[0033] Figure 2 It is a cross-sectional view of the present invention.

[0034] In the figure: 1. Cutting disc body; 2. Annular groove; 3. Connecting through hole; 4. Thermal conductive material 2; 5. Thermal conductive material 1. DETAILED DESCRIPTION

[0035] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0036] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0037] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0038] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0039] See also Figure 1-2 The present invention provides a technical solution for a resin bond cutting sheet and a preparation method thereof:

[0040] Embodiment 1:

[0041] Firstly, each component is accurately weighed, 80 parts of matrix metal powder, 10 parts of abrasive, 2 parts by weight of thermal conductive material 1, and 8 parts by weight of thermal conductive material 2; then, diamond is added to copper powder, tin powder and cobalt powder to be uniformly mixed to form a matrix powder; the abrasive is added to the matrix metal powder to be uniformly mixed; the mixture is prepared into an embryo body in a forming mold; the embryo body is shielded except for the ring groove and the connecting through hole; the shielded embryo body surface is evaporated with thermal conductive material 1; the surface of the ring groove and the connecting through hole is filled with thermal conductive material 2; cold pressing is performed, the cold pressing condition pressure is 80MPa, and the pressure holding time is 10s; hot pressing sintering is performed, heating to 650℃ at a heating rate of 50℃ / min, and keeping the temperature for 10min; machining is performed.

[0042] Embodiment 2:

[0043] Firstly, each component is accurately weighed, 80 parts of matrix metal powder, 10 parts of abrasive, 0 parts by weight of thermal conductive material 1, and 10 parts by weight of thermal conductive material 2; then, diamond is added to copper powder, tin powder and cobalt powder and mixed evenly to form matrix powder; abrasive is added to matrix metal powder and mixed evenly; the mixture is prepared into a blank in a forming mold; thermal conductive material 2 is filled on the surface of the ring groove and the connecting through hole; cold pressing is performed, the cold pressing pressure is 80MPa, and the holding time is 10s; hot pressing and sintering is performed, heating to 650℃ at a heating rate of 50℃ / min, and keeping the temperature for 10min; machining is performed.

[0044] Embodiment three:

[0045] Firstly, each component is accurately weighed, 80 parts of matrix metal powder, 10 parts of abrasive, 10 parts by weight of thermal conductive material 1, and 0 parts by weight of thermal conductive material 2; then, diamond is added to copper powder, tin powder and cobalt powder to be uniformly mixed to form matrix powder; abrasive is added to matrix metal powder to be uniformly mixed; the mixture is prepared into an embryo in a forming mold; thermal conductive material 1 is filled on the surface of the ring groove and the connecting through hole; cold pressing is performed, the cold pressing condition pressure is 80MPa, and the pressure holding time is 10s; hot pressing and sintering is performed, heating to 650℃ at a heating rate of 50℃ / min, and keeping the temperature for 10min; machining is performed.

[0046] In the above three embodiments:

[0047] The heat dissipation effects are:

[0048] Example 3 > Example 1 > Example 2;

[0049] The production material costs are:

[0050] Example 3 > Example 1 > Example 2;

[0051] In summary, the heat dissipation effect of the first embodiment is slightly inferior to that of the third embodiment, but its production material cost is much lower than that of the first embodiment.

[0052] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. Resin bond cutting disc, characterized by: It comprises a cutting blade body, wherein the upper and lower surfaces of the cutting blade body are provided with annular grooves, a connecting through hole is provided between the upper and lower layers of the annular grooves, a thermally conductive material 1 is vapor-deposited on the surfaces of the annular grooves and the connecting through holes, and the annular grooves and the connecting through holes are filled with a thermally conductive material 2; wherein the cutting blade body comprises 70-90 parts of matrix metal powder and 10-20 parts of abrasive by weight, the thermally conductive material 1 is graphene, the thermally conductive material 2 is a composite material of graphene and copper, the thermally conductive material 2 has a weight of 1-2 parts, and the thermally conductive material 2 has a weight of 5-10 parts.

2. The resin bond cutting sheet according to claim 1, wherein: The annular grooves on the upper and lower sides are symmetrically arranged, and the connecting through holes are evenly distributed at equal distances.

3. The resin bond cutting sheet according to claim 2, characterized in that: The thickness of the cutter body in the vertical section where the upper ring groove, the connecting through hole and the lower ring groove are located is 1:1:

1.

4. The resin bond cutting sheet according to claim 3, characterized in that: The matrix metal powder comprises 65-80 parts of copper powder, 10-20 parts of tin powder and 5-10 parts of cobalt powder by weight.

5. The resin bond cutting sheet according to claim 4, characterized in that: The abrasive is one or both of diamond and silicon carbide.

6. The resin bond cutting sheet according to claim 5, characterized in that: The abrasive is a mixture of diamond and CBN, and the mass ratio of the two is 1:(0.8-1.2).

7. A method for preparing a resin bond cutting sheet, characterized in that: The following steps are included: S1. Accurately weigh each component; S2, adding abrasive to the matrix metal powder and mixing evenly; S3, preparing an embryo body by forming the mixture in a molding die; S4, shielding the embryo body except the ring groove and the connecting through hole; S5, evaporating a thermal conductive material 1 on the surface of the shielded embryo; S6, filling the second thermal conductive material on the surface of the ring groove and the connecting through hole; S7, cold pressing; S8, hot pressing and sintering; S9, machining.

8. The method for preparing a resin bond cutting sheet according to claim 7, characterized in that: In S7, the pressure is 80-100 MPa, and the holding time is 10-30 s; in S8, the temperature is heated to 650°C at a heating rate of 30-50°C / min and kept at this temperature for 10-20 min.

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