Preparation method and bonding method of bonding glue for infrared detector

Abstract

The invention relates to the technical field of bonding glue for infrared detectors, and provides a preparation method and a bonding method of bonding glue for infrared detectors, and the preparation method comprises the following steps: mixing epoxy resin glue, a first organic solvent and a second organic solvent according to a mass ratio of 6: 3: 1; the method comprises the following steps: firstly, mixing a first organic solvent with a substrate adhesive to obtain a first adhesive, and then mixing a second organic solvent with the first adhesive to obtain a target adhesive; wherein the viscosity coefficient of the first organic solvent is smaller than that of the epoxy resin glue, and the organic mass fraction of the second organic solvent is 75%. The adhesive prepared on the basis of the preparation method has relatively high bonding strength and can bear the impact of cold and hot alternating stress; by adopting the bonding glue, bubbles can be reduced, and the shearing strength of the bonding surface of the chip module of the infrared detector and the shearing strength of the bonding surface of the thermal weight block of the test Dewar can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of infrared detector adhesive glue, and in particular to a preparation method and a bonding method of an adhesive glue used for an infrared detector. Background Art

[0002] Refrigerated infrared detectors use a refrigeration mechanism to keep the detection element at a low temperature, which can improve detection sensitivity and resolution accuracy. Therefore, refrigerated infrared detectors are mostly used in the military field, and often face complex and severe use environments, such as high vibration, high impact, and repeated cold and hot stress, which greatly tests the reliability of refrigerated infrared detectors.

[0003] In the manufacturing process of components for refrigerated infrared detectors, the bonding process is a crucial link, and preparing a suitable adhesive is an indispensable part of the bonding process. Epoxy low-temperature adhesive is an adhesive with good low-temperature resistance and excellent mechanical properties, which can play the role of bonding the chip module of the refrigerated infrared detector. However, since the chip module of the refrigerated infrared detector is often subjected to alternating hot and cold stress, stress concentration will occur at the bonding surface of the chip module. In this case, the epoxy low-temperature adhesive is prone to failure due to insufficient shear strength and cannot effectively fix the chip module, resulting in a significant reduction in the reliability of the refrigerated infrared detector.

[0004] Currently, no effective solution has been proposed to address the problem that the adhesive in the related art fails due to insufficient bonding strength, resulting in reduced reliability of the cooled infrared detector. Summary of the invention

[0005] The present invention provides a method for preparing an adhesive for an infrared detector and a bonding method, which at least solves the problem in the related art that the adhesive fails due to insufficient bonding strength, resulting in reduced reliability of the refrigerated infrared detector.

[0006] The present invention provides a method for preparing an adhesive for an infrared detector, comprising: using epoxy resin glue as a base glue; mixing a first organic solvent with the base glue to obtain a first adhesive, wherein the viscosity coefficient of the first organic solvent is less than the viscosity coefficient of the epoxy resin glue; mixing a second organic solvent with the first adhesive to obtain a target adhesive, wherein the organic mass fraction of the second organic solvent is 75%; wherein the mass ratio of the epoxy resin glue, the first organic solvent, and the second organic solvent is 6:3:1. Mixing the first organic solvent with the base glue can make the obtained first adhesive have better wettability in a vacuum curing environment; mixing the second organic solvent with the first adhesive can make the obtained target adhesive have higher shear strength.

[0007] The invention provides a method for preparing an adhesive for an infrared detector, wherein a first organic solvent is mixed with a base adhesive, comprising: adding the first organic solvent to the base adhesive; using a centrifugal stirrer to stir and mix the first organic solvent and the base adhesive and remove bubbles; wherein the stirring temperature is set to 26°C, the stirring speed is set to 400r / min, and the stirring time is set to 5-10min. By fully stirring and removing bubbles, it is beneficial to improve the sealing performance and thermal stability of the obtained first adhesive, thereby correspondingly improving the bonding strength of the target adhesive.

[0008] The invention provides a method for preparing an adhesive for an infrared detector, wherein the second organic solvent is mixed with the first adhesive, comprising: adding the second organic solvent to the first adhesive; stirring and mixing the second organic solvent and the first adhesive using a centrifugal stirrer; wherein the stirring temperature is set to 40-60°C, the stirring speed is set to 400r / min, and the stirring time is set to 3min. This is conducive to uniform mixing of the second organic solvent and the first adhesive.

[0009] The invention provides a method for preparing an adhesive for an infrared detector, wherein the epoxy resin adhesive is a heat sink epoxy resin adhesive, and the viscosity coefficient of the epoxy resin adhesive is 14000-20000cps; the first organic solvent is methanol or ethyl acetate, and the viscosity coefficient of the first organic solvent is 7000cps; the second organic solvent is ethylene glycol or diethylene glycol. The heat sink epoxy resin adhesive is a type of epoxy resin adhesive and has good high temperature resistance.

[0010] The method for preparing the adhesive provided by the embodiment of the invention is to mix the second organic solvent with the first adhesive to obtain the target adhesive, comprising: mixing the mixture of the second organic solvent and the first adhesive with silver powder to obtain the target adhesive; wherein the mass ratio of the mixture to the silver powder is 9:1. The target adhesive mixed with the silver powder has a stronger thermal conductivity and can more effectively withstand the impact of alternating cold and hot stress.

[0011] The method for preparing an adhesive for an infrared detector provided in an embodiment of the invention comprises mixing a mixture of a second organic solvent and a first adhesive with silver powder, and comprising: adding silver powder to the mixture and standing it for 30 minutes at 26° C. By standing it, bubbles that may be generated during the addition of silver powder can naturally float to the surface and burst, thereby reducing the pores in the obtained target adhesive.

[0012] The present invention provides a bonding method for a chip module of an infrared detector, which is based on any of the above-mentioned target adhesives for bonding, including: processing a first array groove and a second array groove on the two bonding surfaces of the target substrate respectively; cleaning and degassing the target substrate and the bonding component; applying the target adhesive in the first array groove until the target adhesive covers the groove surface of the first array groove; applying the target adhesive on the surface of the bonding component; placing the bonding component on the first array groove covered with the target adhesive, and pressing it with a tooling to obtain a first adhesive component; curing the first adhesive component to obtain a second adhesive component; applying the target adhesive in the second array groove of the second adhesive component until the target adhesive covers the groove surface of the second array groove; bonding the chip to the second array groove to obtain a third adhesive component; curing the third adhesive component to obtain the target adhesive component. The above-mentioned infrared detectors include but are not limited to refrigerated infrared detectors.

[0013] The bonding method of the chip module of the infrared detector provided by the embodiment of the invention includes the steps of curing treatment: baking at 0-40°C for 40 minutes; baking at 40-100°C for 20 minutes; curing at 120°C for 1 hour; waiting for natural cooling. By gradually heating, the thermal stress generated by the rapid temperature change inside the materials of the first adhesive and the third adhesive can be reduced.

[0014] In the bonding method of the chip module of the infrared detector provided by the embodiment of the invention, each of the first array grooves and the second array grooves is cylindrical, the diameter of the circular surface of the groove is 0.02 mm, and the depth of the groove is 0.01 mm. Determining the size of the groove is conducive to standardized production.

[0015] The invention provides a method for bonding a thermal load block of a test dewar, which is based on any of the above-mentioned target adhesives for bonding, and includes: processing a first array groove and a second array groove on the bonding surfaces of the target substrate, respectively, and processing a third array groove on the bonding surface of the thermal load block; cleaning and degassing the target substrate and the bonding component; applying the target adhesive to the first array groove until the target adhesive covers the groove surface of the first array groove; applying the target adhesive to the surface of the bonding component; placing the bonding component on the first array groove covered with the target adhesive, and using a tool Compress to obtain a first adhesive member; cure the first adhesive member to obtain a second adhesive member; apply the target adhesive to the second array groove of the second adhesive member until the target adhesive covers the groove surface of the second array groove; apply the target adhesive to the third array groove of the thermal load block until the target adhesive covers the groove surface of the third array groove; based on the second array groove covered with the target adhesive and the third array groove covered with the target adhesive, bond the thermal load block to the target substrate to obtain a fourth adhesive member; cure the fourth adhesive member to obtain the target adhesive member. The thermal load block is an important component of the test dewar, which can simulate the thermal load of the actual infrared detector under working conditions.

[0016] The preparation method and bonding method of the adhesive for infrared detectors provided in the embodiments of the present invention solve the problem that the adhesive in the related art fails due to insufficient bonding strength, resulting in reduced reliability of the refrigerated infrared detector. The adhesive prepared based on the above preparation method has strong bonding strength and can withstand the impact of alternating hot and cold stresses. The use of the above adhesive in conjunction with the array grooves can save the amount of adhesive and reduce bubbles, while significantly improving the shear strength of the bonding surface of the chip module of the infrared detector and the bonding surface of the thermal load block of the test dewar, thereby meeting the use requirements of the infrared detector in complex application environments and the use requirements of the test dewar in harsh experimental environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other embodiments can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a flow chart of the steps of a method for preparing an adhesive for an infrared detector in an embodiment of the invention.

[0019] Figure 2 It is a schematic diagram of experimental results in an embodiment of the present invention.

[0020] Figure 3 It is a flow chart of the steps of a bonding method for a chip module of an infrared detector in an embodiment of the present invention.

[0021] Figure 4 It is a schematic diagram of the structure of the first array groove in the embodiment of the invention.

[0022] Figure 5 It is a schematic diagram of the structure of the second array groove in the embodiment of the invention.

[0023] Figure 6 It is a flow chart of the steps of a method for bonding a thermal load block for testing a Dewar in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0025] In the manufacturing process of components for refrigerated infrared detectors, the bonding process is a crucial link, and preparing a suitable adhesive is an indispensable part of the bonding process. Epoxy low-temperature adhesive is an adhesive with good low-temperature resistance and excellent mechanical properties, which can play the role of bonding the chip module of the refrigerated infrared detector. However, since the chip module of the refrigerated infrared detector is often subjected to alternating hot and cold stress, stress concentration will occur at the bonding surface of the chip module. In this case, the epoxy low-temperature adhesive is prone to failure and cannot effectively fix the chip module, resulting in a significant reduction in the reliability of the refrigerated infrared detector.

[0026] To this end, the present invention provides an embodiment of a method for preparing an adhesive for an infrared detector and a bonding method.

[0027] Please refer to Figure 1 The invention embodiment shown in the figure provides a method for preparing an adhesive for an infrared detector, comprising:

[0028] Step S101, using epoxy resin glue as base glue.

[0029] Step S102 , mixing a first organic solvent with a base glue to obtain a first adhesive glue, wherein the viscosity coefficient of the first organic solvent is smaller than the viscosity coefficient of the epoxy resin glue.

[0030] Step S103, mixing the second organic solvent with the first adhesive to obtain a target adhesive, wherein the organic mass fraction of the second organic solvent is 75%.

[0031] Wherein, the mass ratio of epoxy resin glue, the first organic solvent and the second organic solvent is 6:3:1.

[0032] Epoxy resin glue is an adhesive made of epoxy resin as the main body, usually including epoxy resin and curing agent. The above-mentioned epoxy resin glue as the base glue is an existing adhesive glue, which can be directly applied to the field of infrared detectors, but it cannot solve the technical problems that can be solved by the embodiments of the invention.

[0033] Mixing the first organic solvent with the base glue can make the obtained first adhesive glue have better wettability in a vacuum curing environment. The target adhesive glue obtained by mixing the first adhesive glue and the second organic solvent has corresponding wettability. When the target adhesive glue contacts the adhesive, the target adhesive glue can spread well on the bonding surface of the adhesive, which is conducive to forming a uniform liquid film on the bonding surface of the adhesive.

[0034] Mixing the second organic solvent with the first adhesive can make the target adhesive have a higher shear strength, wherein the shear strength is also called shear strength, which refers to the ability of a material to resist damage when subjected to shear force. When an object is subjected to a pair of external forces (i.e., shear forces) of equal magnitude, opposite direction, and close action lines, shear deformation will occur in the action plane of the pair of forces. Shear strength is used to measure the ultimate ability of a material to resist being sheared under such circumstances, and the unit is Pascal (Pa) or Megapascal (MPa).

[0035] The viscosity coefficient, which can be referred to as viscosity, is a physical quantity that describes the internal resistance of a fluid (liquid or gas) when it flows. The larger the viscosity coefficient, the worse the fluidity of the fluid, that is, the greater the internal friction between the fluids. cps is the abbreviation of centipoise, which can also be written as cP. It is a relatively small unit of viscosity coefficient. 1 centipoise is equal to 1 milliPascal second (mPas), that is, 1 cps = 1 mPas.

[0036] Organic mass fraction refers to the proportion of the mass of organic components in a substance to the total mass of the substance, usually expressed as a percentage.

[0037] The method for preparing the adhesive for the infrared detector provided by the embodiment of the invention can prepare an adhesive with strong bonding strength. The bonding surface using the adhesive can significantly improve the shear strength, thereby effectively withstanding the impact of alternating hot and cold stress.

[0038] It can be understood that the target adhesive prepared based on the above preparation method is an epoxy low-temperature adhesive. While having the advantages of epoxy low-temperature adhesive, the target adhesive can better withstand the impact of hot and cold alternating stress.

[0039] Exemplarily, in the preparation method provided by the embodiment of the present invention, the epoxy resin glue used is a heat sink epoxy resin glue with a viscosity coefficient of 14000-20000cps; the first organic solvent used is methanol or ethyl acetate with a viscosity coefficient of 7000cps; the second organic solvent used is ethylene glycol or diethylene glycol.

[0040] Among them, heat sink epoxy resin glue is a type of epoxy resin glue and has good high temperature resistance.

[0041] Methanol, also known as hydroxymethane, wood alcohol or wood spirit. Ethyl acetate, also known as ethyl acetate. Ethylene glycol, also known as glycol or 1,2-ethylene glycol. Diethylene glycol, also known as diethylene glycol.

[0042] Exemplarily, the heat sink epoxy resin adhesive is EP21TDCht-lo adhesive, or one of the Scotch-Weld series of low-temperature adhesives, such as 2216NS and DP420.

[0043] Optionally, in step S102, mixing the first organic solvent with the base glue comprises:

[0044] A first organic solvent is added to the base gel.

[0045] A centrifugal mixer is used to stir and mix the first organic solvent and the base glue and remove bubbles.

[0046] The stirring temperature was set at 26°C, the stirring speed was set at 400 r / min, and the stirring time was set at 5-10 min.

[0047] It is understandable that the first organic solvent and the base glue can be fully and evenly stirred by a centrifugal mixer, and bubbles can be removed during stirring, which is beneficial to improving the sealing performance and thermal stability of the obtained first adhesive, and correspondingly improving the bonding strength of the target adhesive.

[0048] Optionally, in step S103, mixing the second organic solvent with the first adhesive includes:

[0049] A second organic solvent is added to the first adhesive.

[0050] The second organic solvent and the first adhesive are stirred and mixed using a centrifugal mixer.

[0051] The stirring temperature was set at 40-60°C, the stirring speed was set at 400 r / min, and the stirring time was set at 3 min.

[0052] It is understandable that the second organic solvent and the first adhesive can be fully and evenly mixed by a centrifugal mixer.

[0053] Preferably, in step S103, mixing the second organic solvent with the first adhesive to obtain the target adhesive comprises:

[0054] The mixture of the second organic solvent and the first adhesive is mixed with silver powder to obtain a target adhesive.

[0055] The mass ratio of the mixture to the silver powder is 9:1.

[0056] The target adhesive mixed with silver powder has stronger thermal conductivity and can more effectively withstand the impact of alternating hot and cold stress.

[0057] Specifically, the mixture of the second organic solvent and the first adhesive is mixed with silver powder, comprising:

[0058] Silver powder was added to the above mixture and allowed to stand at 26°C for 30 min.

[0059] By standing still, on the one hand, bubbles that may be generated during the addition of silver powder can naturally float to the surface and burst, thereby reducing the pores in the resulting target adhesive; on the other hand, the silver powder can be mixed with the above mixture more evenly.

[0060] Exemplarily, the present invention also provides experimental data of the above solution to verify its technical effect, as follows:

[0061] exist Figure 2 The old glue refers to the Scotch-Weld series 2216NS resin glue with a viscosity coefficient of 20,000 cps.

[0062] The new glue refers to the target adhesive glue prepared by using the above-mentioned preparation method provided by the embodiment of the invention, using the above-mentioned 2216NS resin glue as the base glue, ethyl acetate with a viscosity coefficient of 7000cps as the first organic solvent, and ethylene glycol with an organic mass fraction of 75% as the second organic solvent, and mixing the above-mentioned 2216NS resin glue, the above-mentioned ethyl acetate, and the above-mentioned ethylene glycol in a mass ratio of 6:3:1.

[0063] This experiment used 10 ceramic structural parts as samples, numbered 1 to 10.

[0064] Specifically, a ceramic structural member with two bonding surfaces is used as a substrate, old glue is used to bond the cuttable component on the first bonding surface, and new glue is used to bond the same cuttable component on the second bonding surface, and the shear strength of the first bonding surface and the second bonding surface is tested.

[0065] The first bonding surface and the second bonding surface are consistent in size and shape; the same cuttable component means that the cuttable component bonded to the second bonding surface is consistent in size and shape with the cuttable component bonded to the first bonding surface. It can be understood that the consistency of size and shape means that the process error does not exceed the specified standard threshold.

[0066] Combination Figure 2 The experimental results shown show that, in the 10 samples, the shear strength of the second bonding surface using the new glue is greater than the shear strength of the first bonding surface using the old glue, indicating that the preparation method of the adhesive for infrared detectors provided by the embodiment of the invention can improve the bonding strength of the prepared adhesive, thereby better withstanding the impact of alternating hot and cold stresses.

[0067] Please refer to Figure 3 The present invention provides a method for bonding a chip module of an infrared detector according to an embodiment of the present invention, which is based on the above-mentioned target adhesive for bonding, and includes:

[0068] Step S201 , processing a first array of grooves and a second array of grooves on two bonding surfaces of a target substrate respectively.

[0069] Step S202, cleaning and degassing the target substrate and the adhesive components.

[0070] Step S203, applying the target adhesive in the first array grooves until the target adhesive covers the groove surfaces of the first array grooves; applying the target adhesive on the surface of the adhesive component.

[0071] Step S204 , placing the adhesive component on the first array groove covered with the target adhesive, and pressing it with a tool to obtain a first adhesive piece.

[0072] Step S205 , curing the first adhesive component to obtain a second adhesive component.

[0073] Step S206 , applying the target adhesive to the second array grooves of the second adhesive member until the target adhesive covers the groove surfaces of the second array grooves.

[0074] Step S207 , bonding the chip to the second array groove to obtain a third bonding member.

[0075] Step S208, curing the third adhesive component to obtain a target adhesive component.

[0076] It can be understood that the above-mentioned infrared detectors include but are not limited to refrigerated infrared detectors.

[0077] The chip module of the infrared detector includes but is not limited to the above-mentioned chip, the above-mentioned target substrate and the above-mentioned adhesive component, wherein the above-mentioned chip and the above-mentioned adhesive component both need to be adhered to the above-mentioned target substrate.

[0078] The second array grooves of the second adhesive component and the second array grooves of the target substrate are the same array grooves.

[0079] The bonding component is a metal component, which is bonded to the target substrate as a cold platform, wherein the cold platform is also called a cold shield. The cold platform can provide a low temperature environment and play a role of structural support while providing a mechanical installation connection reference.

[0080] The bonding method of the chip module of the infrared detector provided in the embodiment of the invention adopts the above-mentioned target adhesive. Therefore, the bonding method of the chip module includes all the technical effects of the above-mentioned target adhesive, and the corresponding technical effects will not be repeated here.

[0081] Optionally, the target substrate is a ceramic structural component, and the bonding component is Kovar or Invar.

[0082] Kovar is an iron-nickel-cobalt alloy suitable for matching seals with glass or ceramics.

[0083] Invar is a nickel-iron alloy that maintains a fixed length over a wide temperature range.

[0084] Optionally, both step S205 and step S208 include a step of performing a curing process, and the step of performing the curing process includes:

[0085] Bake at 0-40℃ for 40min.

[0086] Bake at 40-100℃ for 20min.

[0087] Curing was carried out at 120°C for 1 hour.

[0088] Wait for natural cooling.

[0089] By gradually heating, the thermal stress generated by rapid temperature change inside the materials of the first adhesive and the third adhesive can be reduced, and the molecules in the first adhesive and the third adhesive can have enough time to rearrange and penetrate each other, thereby improving the bonding strength.

[0090] Exemplarily, each groove in the first array of grooves and the second array of grooves is cylindrical, the diameter of the circular surface of the groove is 0.02 mm, and the depth of the groove is 0.01 mm.

[0091] It will be appreciated that determining the size of the grooves facilitates standardized production.

[0092] For example, please refer to Figure 4 As shown in the structural schematic diagram of the first array groove, a circle of grooves located at the outer edge of the first array grooves forms a circle, and the other grooves in the first array grooves are arranged radially around the center point to adapt to the shape of the bonding component.

[0093] For example, please refer to Figure 5 The structural schematic diagram of the second array groove is shown, and the second array groove is rectangular as a whole to adapt to the shape of the chip.

[0094] It is understandable that technicians can adjust the shapes and groove arrangements of the first array grooves and the second array grooves according to actual needs.

[0095] Please refer to Figure 6 The present invention provides a method for bonding a thermal load block of a test dewar, which is bonded based on the above-mentioned target adhesive, and includes:

[0096] Step S301 , processing a first array of grooves and a second array of grooves on both bonding surfaces of the target substrate, respectively, and processing a third array of grooves on the bonding surface of the thermal load block.

[0097] Step S302, cleaning and degassing the target substrate and the bonding components.

[0098] Step S303, applying the target adhesive in the first array grooves until the target adhesive covers the groove surfaces of the first array grooves; applying the target adhesive on the surface of the adhesive component.

[0099] Step S304 , placing the adhesive component on the first array groove covered with the target adhesive, and pressing it with a tool to obtain a first adhesive piece.

[0100] Step S305 , curing the first adhesive component to obtain a second adhesive component.

[0101] Step S306, apply the target adhesive in the second array groove of the second adhesive member until the target adhesive covers the groove surface of the second array groove; apply the target adhesive in the third array groove of the thermal load block until the target adhesive covers the groove surface of the third array groove.

[0102] Step S307 , based on the second array grooves covered with the target adhesive and the third array grooves covered with the target adhesive, the thermal weight block is bonded to the target substrate to obtain a fourth adhesive member.

[0103] Step S308, curing the fourth adhesive component to obtain a target adhesive component.

[0104] The infrared detector includes but is not limited to a chip module, a dewar and a refrigerator. Usually, the chip module is integrated inside the dewar, and the dewar is coupled to the cold finger of the refrigerator through a cooling interface on its shell.

[0105] The test dewar is used to test the performance of the refrigerator, such as the temperature characteristics, thermal response, thermal load, and thermal mass of the refrigerator. Compared with the dewar, the test dewar has more components, such as thermal weight blocks, test interfaces, and calibration devices. Among them, the thermal weight block is an important part of the test dewar, which can simulate the thermal load of the actual infrared detector under working conditions.

[0106] It is understandable that the bonding surface of the thermal weight block will be subjected to greater alternating hot and cold stress, and the weight of the thermal weight block is greater than the weight of the chip in the above-mentioned chip module. Therefore, the bonding surface of the thermal weight block needs to have a stronger bonding strength. Therefore, based on the bonding of the above-mentioned target adhesive provided by the embodiment of the invention, a third array groove is processed on the bonding surface of the thermal weight block to enhance the bonding strength between the thermal weight block and the above-mentioned target substrate.

[0107] The bonding method for the thermal load block of the test dewar provided in the embodiment of the present invention adopts the above-mentioned target adhesive. Therefore, the bonding method for the thermal load block includes all the technical effects of the above-mentioned target adhesive, and the corresponding technical effects will not be repeated here.

[0108] It can be understood that the bonding method of the thermal load block of the above-mentioned test dewar provided in the embodiment of the invention is similar to the bonding method of the chip module of the above-mentioned infrared detector provided in the embodiment of the invention, the difference being that the chip used in the bonding method of the chip module of the above-mentioned infrared detector needs to be replaced with a thermal load block. For the target substrate, bonding component, first array groove, and second array groove used in the bonding method of the thermal load block of the above-mentioned test dewar, technicians can refer to the target substrate, bonding component, first array groove, and second array groove used in the bonding method of the chip module of the above-mentioned infrared detector, and can also make adjustments according to actual conditions, which will not be repeated here.

[0109] Optionally, the thermal load block is a copper block.

[0110] The copper block has good thermal conductivity and is suitable as a thermal load block for testing the Dewar.

[0111] Optionally, the shape of the third array groove is consistent with the shape of the second array groove, for example, the shape of the third array groove and the shape of the second array groove are both rectangular. Of course, technicians can determine the shape of the third array groove according to actual conditions.

[0112] It should be noted that the term "including" and its variations used in the embodiments of the present invention are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "multiple" mentioned in the embodiments of the present invention are illustrative and not restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, they should be understood as "one or more". The descriptions of the terms "first", "second", etc. are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.

[0113] The user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in the embodiments of the present invention are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0114] The various steps described in the method implementation methods provided by the embodiments of the present invention can be performed in different orders and / or in parallel. In addition, the method implementation methods may include additional steps and / or omit the steps shown. The scope of protection of the present invention is not limited in this respect.

[0115] The term "embodiment" in this specification refers to specific features, structures or characteristics described in conjunction with the embodiment that can be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. The various embodiments in this specification are described in a related manner, and the same and similar parts between the various embodiments refer to each other. In particular, for the device, equipment, and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts refer to the partial description of the method embodiment.

[0116] The above-described embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of protection. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing an adhesive for an infrared detector, characterized in that: include: Epoxy resin glue is used as the base glue; Mixing a first organic solvent with the base glue to obtain a first adhesive glue, wherein the viscosity coefficient of the first organic solvent is smaller than the viscosity coefficient of the epoxy resin glue; Mixing a second organic solvent with the first adhesive to obtain a target adhesive, wherein the organic mass fraction of the second organic solvent is 75%; Wherein, the mass ratio of the epoxy resin glue, the first organic solvent and the second organic solvent is 6:3:

1.

2. The method for preparing the adhesive for infrared detector according to claim 1, characterized in that: Mixing the first organic solvent with the base glue comprises: adding the first organic solvent to the base glue; Using a centrifugal mixer to stir and mix the first organic solvent and the base glue and remove bubbles; The stirring temperature was set at 26°C, the stirring speed was set at 400 r / min, and the stirring time was set at 5-10 min.

3. The method for preparing the adhesive for infrared detector according to claim 1, characterized in that: Mixing the second organic solvent with the first adhesive comprises: adding the second organic solvent to the first adhesive; Using a centrifugal mixer to stir and mix the second organic solvent and the first adhesive; The stirring temperature was set at 40-60°C, the stirring speed was set at 400 r / min, and the stirring time was set at 3 min.

4. The method for preparing the adhesive for infrared detector according to claim 1, characterized in that: The epoxy resin glue is heat sink epoxy resin glue, and the viscosity coefficient of the epoxy resin glue is 14000-20000cps; the first organic solvent is methanol or ethyl acetate, and the viscosity coefficient of the first organic solvent is 7000cps; the second organic solvent is ethylene glycol or diethylene glycol.

5. The method for preparing the adhesive for infrared detector according to claim 1, characterized in that: The second organic solvent is mixed with the first adhesive to obtain a target adhesive, comprising: Mixing the mixture of the second organic solvent and the first adhesive with silver powder to obtain the target adhesive; Wherein, the mass ratio of the mixture to the silver powder is 9:

1.

6. The method for preparing the adhesive for infrared detector according to claim 5, characterized in that: The step of mixing the mixture of the second organic solvent and the first adhesive with silver powder comprises: Silver powder was added to the mixture, and the mixture was allowed to stand at 26° C. for 30 min.

7. A method for bonding a chip module of an infrared detector, characterized in that: Bonding based on the target adhesive according to any one of claims 1 to 6 comprises: Processing a first array groove and a second array groove on two bonding surfaces of the target substrate respectively; Performing cleaning and degassing treatment on the target substrate and the bonding components; Applying the target adhesive glue in the first array groove until the target adhesive glue covers the groove surface of the first array groove; applying the target adhesive glue on the surface of the adhesive component; Placing the adhesive component on the first array groove covered with the target adhesive and pressing it with a tool to obtain a first adhesive piece; Curing the first adhesive component to obtain a second adhesive component; Applying the target adhesive into the second array groove of the second adhesive member until the target adhesive covers the groove surface of the second array groove; Bonding the chip to the second array groove to obtain a third bonding member; The third adhesive is cured to obtain a target adhesive.

8. The bonding method of the chip module of the infrared detector according to claim 7, characterized in that: The steps of performing the curing treatment include: Bake at 0-40℃ for 40min; Bake at 40-100℃ for 20min; Curing at 120°C for 1h; Wait for natural cooling.

9. The bonding method of the chip module of the infrared detector according to claim 7, characterized in that: Each groove in the first array groove and the second array groove is cylindrical, the diameter of the circular surface of the groove is 0.02 mm, and the depth of the groove is 0.01 mm.

10. A method for bonding a thermal load block of a test dewar, characterized in that: Bonding based on the target adhesive according to any one of claims 1 to 6 comprises: A first array of grooves and a second array of grooves are respectively processed on the two bonding surfaces of the target substrate, and a third array of grooves is processed on the bonding surface of the thermal load block; Performing cleaning and degassing treatment on the target substrate and the bonding components; Applying the target adhesive glue in the first array groove until the target adhesive glue covers the groove surface of the first array groove; applying the target adhesive glue on the surface of the adhesive component; Placing the adhesive component on the first array groove covered with the target adhesive and pressing it with a tool to obtain a first adhesive piece; Curing the first adhesive component to obtain a second adhesive component; Applying the target adhesive in the second array groove of the second adhesive member until the target adhesive covers the groove surface of the second array groove; applying the target adhesive in the third array groove of the thermal load block until the target adhesive covers the groove surface of the third array groove; Based on the second array grooves covered with the target adhesive and the third array grooves covered with the target adhesive, the thermal weight block is bonded to the target substrate to obtain a fourth adhesive member; The fourth adhesive component is cured to obtain a target adhesive component.

Images