Copper-phosphorus alloy target material and preparation method thereof

Abstract

The invention provides a copper-phosphorus alloy target and a preparation method thereof.The preparation method comprises the following steps that a copper-phosphorus alloy blank is sequentially subjected to hot forging treatment, forging stretching treatment, first water cooling treatment, first heat treatment, rolling treatment, second heat treatment and second water cooling treatment, and the copper-phosphorus alloy target is obtained; and the content of the phosphorus element in the copper-phosphorus alloy blank is 400-500 ppm. According to the preparation method provided by the invention, the internal defects of the copper-phosphorus alloy target material can be reduced, the abnormal phenomenon of a grain structure is avoided, internal grains are refined, the uniformity of the grains is improved, and the quality and the performance of the copper-phosphorus alloy target material are further improved.

Description

Technical Field

[0001] The invention belongs to the field of target material manufacturing, and specifically relates to a copper-phosphorus alloy target material and a preparation method thereof. Background Art

[0002] Copper-phosphorus alloy target is a special material that plays an important role in the metallization process of integrated circuits. Copper-phosphorus alloy target can be used for electroplating copper wires. The role of phosphorus is to form a black film on the surface of the copper anode during the electroplating process, allowing Cu atoms and ions to pass through while preventing other byproducts from passing through; when the grains of the copper-phosphorus alloy are small, it can also prevent fine copper particles from falling off the anode. In addition, when using high-quality phosphorus copper anodes, the phosphorus distribution is very uniform, the crystal particles are fine, the structure is tight, the "black phosphorus film" is neither thick nor thin, the bonding force is moderate, the quality is reliable, and the formation of monovalent copper ions is effectively suppressed. Due to the fine copper crystals, moderate and uniform distribution of phosphorus content, and little anode mud, the anode bags are usually cleaned for more than half a year, which not only improves the electroplating production efficiency, but also saves ancillary raw materials such as anode bags.

[0003] Therefore, the requirements and demands for copper-phosphorus alloy targets are relatively high. At present, the preparation method of copper-phosphorus alloy targets involves multiple steps and technologies, including high-purity metallurgical purification, melt casting, powder sintering, microstructure regulation, heterogeneous welding, and optimization design of target structure. CN 105506340A discloses a method for preparing a copper-phosphorus alloy anode, the preparation method comprising: placing pure copper in a non-vacuum furnace; heating the non-vacuum furnace to melt the pure copper; after the pure copper is melted, performing a first insulation treatment: after the first insulation treatment, adding phosphorus sealed with pure copper; after adding the phosphorus, performing a second insulation treatment. This preparation method improves production efficiency, but the phosphorus element needs to be supplemented at the end of the preparation process, and the internal structure uniformity of the obtained copper-phosphorus alloy anode cannot be guaranteed.

[0004] CN 113857402A discloses a method for preparing an alloy high-purity copper target material, the method comprising sequentially performing a first forging treatment, a first heat treatment, a second forging treatment, a second heat treatment, a third forging treatment, a fourth forging treatment, a static pressing treatment, a rolling treatment and a fourth heat treatment on a blank. Although the method can improve the grain uniformity of the alloy high-purity copper target material, it is not suitable for copper-phosphorus alloys.

[0005] In summary, how to provide a method for preparing a copper-phosphorus alloy target, reduce internal defects of the copper target, avoid abnormal grain structure, improve grain refinement, and thereby improve the quality and performance of the copper-phosphorus alloy target has become an urgent problem that technical personnel in this field need to solve. Summary of the invention

[0006] The object of the present invention is to provide a copper-phosphorus alloy target material and a preparation method thereof, wherein the preparation method can reduce internal defects of the copper-phosphorus alloy target material, avoid abnormal grain structure, refine internal grains, improve grain uniformity, and thereby improve the quality and performance of the copper-phosphorus alloy target material.

[0007] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a method for preparing a copper-phosphorus alloy target, the preparation method comprising the following steps:

[0009] The copper-phosphorus alloy billet is subjected to hot forging treatment, forging and stretching treatment, first water cooling treatment, first heat treatment, rolling treatment, second heat treatment and second water cooling treatment in sequence to obtain the copper-phosphorus alloy target;

[0010] The phosphorus content in the copper-phosphorus alloy billet is 400-500 ppm.

[0011] The present invention processes the original copper-phosphorus alloy billet into a high-quality copper-phosphorus alloy target material through a series of processes such as hot forging, forging and stretching, double heat treatment and rolling. The forging and stretching process breaks the original coarse dendritic grains and columnar grains into fine grains, and compacts and welds the segregation, looseness, pores, slag inclusions, etc. inside the copper-phosphorus alloy billet, thereby making the organizational structure more compact; the heat treatment process can eliminate the residual stress caused by extrusion inside the copper-phosphorus alloy billet, appropriately reduce the hardness and brittleness of the obtained copper target material, increase plasticity, reduce the deformation and crack tendency of the copper-phosphorus alloy target material in subsequent processes, and further improve the uniformity of grain size.

[0012] In addition, the present invention arranges a calendering treatment between the first heat treatment and the second heat treatment, not only for pressing the raw materials into a target material of a specific shape, but placing the calendering treatment between the first heat treatment and the second heat treatment can be more conducive to pressing after the first heat treatment initially refines the grains, thereby avoiding the overall cracking of the target blank caused by pressing before the first heat treatment. Pressing before the second heat treatment can effectively prevent the situation where the grains are further refined after the second heat treatment and it is difficult to control the pressed shape. Moreover, the pressing step can effectively fill the new pores and cracks that appear due to grain refinement and organizational adjustment after the first heat treatment, which is also beneficial for optimizing the target material performance.

[0013] As a preferred technical solution of the present invention, the temperature of the hot forging treatment is 480-520°C, for example, it can be 480°C, 485°C, 490°C, 495°C, 500°C, 505°C, 510°C, 515°C or 520°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0014] Preferably, the holding time of the hot forging treatment is 50 to 80 min, for example, it can be 50 min, 55 min, 60 min, 65 min, 70 min, 75 min or 80 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0015] In the present invention, the role of the hot forging treatment is: hot forging at a certain temperature not only changes the shape of the ingot, destroys the original coarse grains, but also makes the copper-phosphorus alloy less likely to crack; if the temperature is too high, the grains after forging will be too large, and the grain structure cannot be effectively controlled, resulting in the grains becoming larger when they are re-formed during heat treatment; if the temperature is too low, the copper-phosphorus alloy will crack due to deformation during forging, or the deformation amount is insufficient, and the requirement for grain crushing cannot be met.

[0016] As a preferred technical solution of the present invention, the forging and stretching treatment includes sequentially performing lengthening and upsetting.

[0017] Preferably, the drawing length is 180-200% of the original copper-phosphorus alloy billet length, for example, it can be 180%, 184%, 188%, 192%, 196% or 200%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0018] Preferably, the upsetting is to 80-100% of the length of the original copper-phosphorus alloy billet, for example, it can be 80%, 84%, 88%, 92%, 96% or 100%, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0019] In the present invention, the purpose of the forging treatment is to break the original coarse dendritic grains and columnar grains into fine grains.

[0020] As a preferred technical solution of the present invention, the temperature of the first heat treatment is 335-365°C, for example, it can be 335°C, 340°C, 345°C, 350°C, 355°C, 360°C or 365°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0021] Preferably, the holding time of the first heat treatment is 110 to 130 min, for example, 110 min, 114 min, 118 min, 122 min, 126 min or 130 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0022] As a preferred technical solution of the present invention, the temperature of the calendering treatment is 20-30°C, for example, it can be 20°C, 22°C, 24°C, 26°C, 28°C or 30°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0023] Preferably, the deformation amount of the calendering treatment is 60-70%, for example, it can be 60%, 62%, 64%, 66%, 68% or 70%, but it is not limited to the listed values, and other values ​​not listed in the numerical range are also applicable.

[0024] As a preferred technical solution of the present invention, the temperature of the second heat treatment is 580-620°C, for example, it can be 580°C, 585°C, 590°C, 595°C, 600°C, 605°C, 610°C, 615°C or 620°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0025] Preferably, the holding time of the second heat treatment is 50 to 70 min, for example, 50 min, 54 min, 58 min, 62 min, 66 min or 70 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0026] As a preferred technical solution of the present invention, between the first heat treatment and the calendering treatment, the process further includes: removing edge material.

[0027] It is worth noting that the edge material removal described in the present invention refers to: removing defective parts at both ends of the blank.

[0028] As a preferred technical solution of the present invention, the temperature of the first water cooling treatment is 20-30°C, for example, it can be 20°C, 22°C, 24°C, 26°C, 28°C or 30°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0029] Preferably, the time of the first water cooling treatment is 15-20 min, for example, it can be 15 min, 16 min, 17 min, 18 min, 19 min or 20 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0030] Preferably, the temperature of the second water cooling treatment is 20-30°C, for example, 20°C, 22°C, 24°C, 26°C, 28°C or 30°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0031] Preferably, the time of the second water cooling treatment is 15-20 min, for example, it can be 15 min, 16 min, 17 min, 18 min, 19 min or 20 min, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0032] The preparation method of the present invention further comprises: sampling the target material after the second water cooling treatment to perform metallographic analysis, and then performing mechanical processing such as rolling to obtain the target target material.

[0033] As a preferred technical solution of the present invention, the method for preparing the copper-phosphorus alloy target provided in the first aspect of the present invention comprises sequentially performing the following steps on a copper-phosphorus alloy billet having a phosphorus content of 400 to 500 ppm:

[0034] Hot forging treatment: The temperature of the hot forging treatment is 480-520°C, and the holding time is 50-80min;

[0035] Forging and stretching treatment: the forging and stretching treatment is to first stretch the copper-phosphorus alloy billet to 180-200% of the length of the original copper-phosphorus alloy billet, and then to roughen the copper-phosphorus alloy billet to 80-100% of the length of the original copper-phosphorus alloy billet;

[0036] First water cooling treatment: The temperature of the first water cooling treatment is 20-30°C and the time is 15-20min;

[0037] First heat treatment: The temperature of the first heat treatment is 335-365°C, and the holding time is 110-130 minutes;

[0038] Calendering treatment: The deformation amount of the calendering treatment is 60-70%;

[0039] Second heat treatment: The temperature of the second heat treatment is 580-620°C, and the holding time is 50-70 minutes;

[0040] Second water cooling treatment: The temperature of the second water cooling treatment is 20-30°C and the time is 15-20 minutes.

[0041] In a second aspect, the present invention provides a copper-phosphorus alloy target material, which is prepared by the method for preparing the copper-phosphorus alloy target material provided in the first aspect.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] (1) The preparation method provided by the present invention can reduce the internal defects of the copper-phosphorus alloy target, avoid abnormal grain structure, refine the internal grains, improve the grain uniformity, and thus improve the quality and performance of the copper-phosphorus alloy target;

[0044] (2) The preparation method provided by the present invention has simple process and low cost. DETAILED DESCRIPTION

[0045] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0046] Example 1

[0047] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material comprises sequentially performing the following steps on a copper-phosphorus alloy blank having a phosphorus content of 450 ppm:

[0048] Hot forging treatment: The hot forging treatment temperature is 500°C and the holding time is 60 minutes;

[0049] Forging and stretching treatment: the forging and stretching treatment is to first stretch the billet to 190% of the length of the original copper-phosphorus alloy billet, and then to roughen it to 90% of the length of the original copper-phosphorus alloy billet;

[0050] First water cooling treatment: The temperature of the first water cooling treatment is 25°C and the time is 17.5 minutes;

[0051] First heat treatment: The temperature of the first heat treatment is 350°C and the holding time is 120 minutes;

[0052] Calendering treatment: The deformation amount of the calendering treatment is 65%;

[0053] Second heat treatment: The temperature of the second heat treatment is 600°C and the holding time is 60 minutes;

[0054] Second water cooling treatment: The temperature of the second water cooling treatment is 25°C and the time is 17.5 minutes.

[0055] Example 2

[0056] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material comprises sequentially performing the following steps on a copper-phosphorus alloy blank having a phosphorus content of 500 ppm:

[0057] Hot forging treatment: The temperature of the hot forging treatment is 480°C and the holding time is 80 minutes;

[0058] Forging and stretching treatment: the forging and stretching treatment is to first stretch the billet to 180% of the length of the original copper-phosphorus alloy billet, and then to roughen it to 80% of the length of the original copper-phosphorus alloy billet;

[0059] First water cooling treatment: The temperature of the first water cooling treatment is 20°C and the time is 20 minutes;

[0060] First heat treatment: The temperature of the first heat treatment is 335°C and the holding time is 130 minutes;

[0061] Calendering treatment: The deformation amount of the calendering treatment is 60%;

[0062] Second heat treatment: The temperature of the second heat treatment is 580°C and the holding time is 70 minutes;

[0063] Second water cooling treatment: The temperature of the second water cooling treatment is 20°C and the time is 20 minutes.

[0064] Example 3

[0065] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material comprises sequentially performing the following steps on a copper-phosphorus alloy blank having a phosphorus content of 400 ppm:

[0066] Hot forging treatment: The temperature of the hot forging treatment is 520°C and the holding time is 50 minutes;

[0067] Forging and stretching treatment: the forging and stretching treatment is to first stretch the billet to 200% of the length of the original copper-phosphorus alloy billet, and then to roughen the billet to 100% of the length of the original copper-phosphorus alloy billet;

[0068] First water cooling treatment: The temperature of the first water cooling treatment is 30°C and the time is 15 minutes;

[0069] First heat treatment: The temperature of the first heat treatment is 365°C and the holding time is 110 minutes;

[0070] Calendering treatment: The deformation amount of the calendering treatment is 70%;

[0071] Second heat treatment: The temperature of the second heat treatment is 620°C and the holding time is 50 minutes;

[0072] Second water cooling treatment: The temperature of the second water cooling treatment is 30°C and the time is 15 minutes.

[0073] Example 4

[0074] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0075] In this embodiment, the temperature of the hot forging treatment is adjusted to 450°C.

[0076] Example 5

[0077] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0078] In this embodiment, the temperature of the hot forging treatment is adjusted to 550°C.

[0079] Example 6

[0080] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0081] In this embodiment, the forging and stretching treatment is adjusted as follows: firstly drawing to 150% of the length of the original copper-phosphorus alloy billet, and then roughening to 50% of the length of the original copper-phosphorus alloy billet.

[0082] Example 7

[0083] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0084] In this embodiment, the forging and stretching treatment is adjusted as follows: firstly drawing to 200% of the length of the original copper-phosphorus alloy billet, and then roughening to 150% of the length of the original copper-phosphorus alloy billet.

[0085] Example 8

[0086] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0087] In this embodiment, the temperature of the first heat treatment is adjusted to 300°C.

[0088] Example 9

[0089] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0090] In this embodiment, the temperature of the first heat treatment is adjusted to 400°C.

[0091] Example 10

[0092] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0093] In this embodiment, the temperature of the second heat treatment is adjusted to 520°C.

[0094] Embodiment 11

[0095] This embodiment provides a copper-phosphorus alloy target material. The preparation method of the copper-phosphorus alloy target material is different from that of Embodiment 1 only in that:

[0096] In this embodiment, the temperature of the second heat treatment is adjusted to 660°C.

[0097] Comparative Example 1

[0098] This comparative example provides a copper-phosphorus alloy target material, and the preparation method of the copper-phosphorus alloy target material is different from that of Example 1 only in that:

[0099] The second heat treatment process was omitted in this comparative example.

[0100] Comparative Example 2

[0101] This comparative example provides a copper-phosphorus alloy target material, and the preparation method of the copper-phosphorus alloy target material is different from that of Example 1 only in that:

[0102] In this comparative example, a forging and stretching treatment is added before the second heat treatment. The forging and stretching treatment includes: firstly stretching to 200% of the length of the original copper-phosphorus alloy billet, and then roughening to 100% of the length of the original copper-phosphorus alloy billet.

[0103] Comparative Example 3

[0104] This comparative example provides a copper-phosphorus alloy target material, and the preparation method of the copper-phosphorus alloy target material is different from that of Example 1 only in that:

[0105] The calendering process was omitted in this comparative example.

[0106] Comparative Example 4

[0107] This comparative example provides a copper-phosphorus alloy target material, and the preparation method of the copper-phosphorus alloy target material is different from that of Example 1 only in that:

[0108] The phosphorus content in the copper-phosphorus alloy billet of this comparative example was adjusted to 800 ppm.

[0109] Comparative Example 5

[0110] This comparative example provides a copper-phosphorus alloy target material, and the preparation method of the copper-phosphorus alloy target material is different from that of Example 1 only in that:

[0111] In this comparative example, the phosphorus content in the copper-phosphorus alloy billet was adjusted to 200 ppm.

[0112] The copper-phosphorus alloy targets provided in the above embodiments and comparative examples were tested for performance, and the results are shown in Table 1:

[0113] The method for detecting the uniformity of the structure includes: using a conductivity meter to characterize the uniformity of the internal structure of the copper-phosphorus alloy target. The greater the fluctuation of the conductivity, the worse the uniformity of the target. Generally, if the fluctuation exceeds ±10%, the target is considered to have an uneven structure. If the fluctuation does not exceed ±10%, the target is considered to have a uniform structure. Testing the conductivity fluctuation of N targets, uniformity = (number of uniform targets / N) × 100%. Using C-SCAN to determine whether there are defects, the ultrasonic flaw detection principle is adopted to achieve qualitative, localized, quantitative and non-destructive evaluation of defects.

[0114] Table 1

[0115] Average grain size / μm Tissue homogeneity / % Is there a defect? Example 1 65.7 99 none Example 2 68.2 99 none Example 3 67.3 99 none Example 4 105.0 90 none Example 5 120.2 93 none Example 6 130.5 90 exist Example 7 111.3 5 none Example 8 120.2 90 none Example 9 150.5 88 none Example 10 210.2 89 none Embodiment 11 270.5 85 none Comparative Example 1 420.5 20 exist Comparative Example 2 - - - Comparative Example 3 505.2 0 exist Comparative Example 4 50 80 none Comparative Example 5 130 80 none

[0116] According to Table 1, the following points can be made:

[0117] (1) Comprehensive analysis of Examples 1-3 shows that the copper-phosphorus alloy target material obtained by the preparation method provided by the present invention has a smaller microscopic grain size, a more uniform internal structure of the target material, and no internal defects;

[0118] (2) Comprehensive analysis of Example 1 and Examples 4-11 shows that changes in the process parameters of each step in the preparation method of the present invention will affect the structural uniformity or grain size of the target material;

[0119] When the temperature of the hot forging treatment is too high, the grain size will become larger, and when the temperature is too low, the uniformity will be poor.

[0120] When the elongation or roughening ratio is reduced during the forging process, the grains will not be broken enough and the grains will be too large; if the roughening ratio is increased, defects will occur in the alloy.

[0121] If the temperature of the first heat treatment is too high, the grains will be too large; if the temperature is too low, the grains will not be fully crystallized.

[0122] When the temperature of the second heat treatment is too high, the grains will be too large, and when the temperature is too low, the grains will be incompletely crystallized.

[0123] (3) Comprehensive analysis of Example 1 and Comparative Examples 1-3 shows that adjusting the steps in the preparation method of the present invention will affect the structural uniformity or grain size of the target material obtained;

[0124] When the second heat treatment process is omitted, the grains will not be crystallized; if the rolling process is omitted, defects will exist; if the secondary forging process is added, the alloy will be broken;

[0125] (4) Comprehensive analysis of Example 1 and Comparative Examples 4-5 shows that the determination of the process parameters in the preparation method provided by the present invention is only applicable to copper-phosphorus alloys with a phosphorus content of 400 to 500 ppm;

[0126] When the phosphorus content is too high, the grains will be too small; when the phosphorus content is too low, the grains will be too large.

[0127] In summary, the preparation method provided by the present invention can reduce the internal defects of the copper-phosphorus alloy target, avoid abnormal grain structure, refine the internal grains, improve grain uniformity, and thus improve the quality and performance of the copper-phosphorus alloy target.

[0128] The applicant declares that the present invention illustrates the detailed process equipment and process flow of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, that is, it does not mean that the present invention must rely on the above-mentioned detailed process equipment and process flow to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for preparing a copper-phosphorus alloy target, characterized in that: The preparation method comprises the following steps: The copper-phosphorus alloy billet is subjected to hot forging treatment, forging and stretching treatment, first water cooling treatment, first heat treatment, rolling treatment, second heat treatment and second water cooling treatment in sequence to obtain the copper-phosphorus alloy target; The phosphorus content in the copper-phosphorus alloy billet is 400-500 ppm.

2. The preparation method according to claim 1, characterized in that: The temperature of the hot forging treatment is 480-520°C; Preferably, the holding time of the hot forging treatment is 50 to 80 minutes.

3. The preparation method according to claim 1 or 2, characterized in that: The forging and stretching treatment includes sequentially performing stretching and upsetting; Preferably, the drawing is performed to 180-200% of the length of the original copper-phosphorus alloy billet; Preferably, the upsetting is performed to 80-100% of the length of the original copper-phosphorus alloy billet.

4. The preparation method according to any one of claims 1 to 3, characterized in that The temperature of the first heat treatment is 335-365°C; Preferably, the holding time of the first heat treatment is 110 to 130 minutes.

5. The preparation method according to any one of claims 1 to 4, characterized in that: The temperature of the calendering treatment is 20-30°C; Preferably, the deformation amount of the calendering treatment is 60-70%.

6. The preparation method according to any one of claims 1 to 5, characterized in that: The temperature of the second heat treatment is 580-620°C; Preferably, the holding time of the second heat treatment is 50 to 70 minutes.

7. The preparation method according to any one of claims 1 to 6, characterized in that: Between the first heat treatment and the calendering treatment, the method further includes: removing edge material.

8. The preparation method according to any one of claims 1 to 7, characterized in that: The temperature of the first water cooling treatment is 20-30°C; Preferably, the first water cooling treatment lasts for 15 to 20 minutes; Preferably, the temperature of the second water cooling treatment is 20-30°C; Preferably, the second water cooling treatment lasts for 15 to 20 minutes.

9. The preparation method according to any one of claims 1 to 8, characterized in that: The preparation method comprises sequentially performing the following steps on a copper-phosphorus alloy blank having a phosphorus content of 400 to 500 ppm: Hot forging treatment: The temperature of the hot forging treatment is 480-520°C, and the holding time is 50-80min; Forging and stretching treatment: the forging and stretching treatment is to first stretch the copper-phosphorus alloy billet to 180-200% of the length of the original copper-phosphorus alloy billet, and then to roughen the copper-phosphorus alloy billet to 80-100% of the length of the original copper-phosphorus alloy billet; First water cooling treatment: The temperature of the first water cooling treatment is 20-30°C and the time is 15-20min; First heat treatment: The temperature of the first heat treatment is 335-365°C, and the holding time is 110-130 minutes; Calendering treatment: The deformation amount of the calendering treatment is 60-70%; Second heat treatment: The temperature of the second heat treatment is 580-620°C, and the holding time is 50-70 minutes; Second water cooling treatment: The temperature of the second water cooling treatment is 20-30°C and the time is 15-20 minutes.

10. A copper-phosphorus alloy target, characterized in that: The copper-phosphorus alloy target is prepared by the method for preparing the copper-phosphorus alloy target according to any one of claims 1 to 9.