Device and process method for preventing conductive roller from electroplating metal

Abstract

The invention relates to a device and a process method for preventing a conductive roller from electroplating metal. The device comprises an electroplating bath body, and a front conductive roller assembly and a rear conductive roller assembly are arranged in the electroplating bath body in a mirroring manner; each of the front conductive roller assembly and the rear conductive roller assembly is at least provided with a positioning roller completely immersed in the electroplating liquid and a conductive roller component arranged above the electroplating bath body, and is in contact with the roller surfaces of the conductive roller components and the positioning rollers in the front conductive roller assembly and the rear conductive roller assembly in sequence through coating raw materials; the coating raw material also passes through a cleaning device between the rear conductive roller and the positioning roller; an electroplating anode is further arranged in the electroplating bath body and at least provided with an upper anode plate and a lower anode plate, and coating raw materials connected between the positioning rollers in the front conductive roller assembly and the positioning rollers in the rear conductive roller assembly pass through the space between the upper anode plate and the lower anode plate. Conductive roller components in the front conductive roller assembly and the rear conductive roller assembly are connected to a power supply cathode, and the lower anode plate and the upper anode plate are connected to a power supply anode.

Description

Technical Field

[0001] The present application relates to the field of electroplated metal film manufacturing, and in particular to a device and a process method for preventing a conductive roller from electroplating metal. Background Art

[0002] During the electroplating process of metal film, the surface of the film will carry a certain amount of plating solution. When the film passes by the conductive roller for electroplating, the film contacts the conductive roller, and the plating solution also contacts the conductive roller, which causes metal electrodeposition between the plating solution and the conductive roller, resulting in a large area of ​​metal deposited on the surface of the conductive roller. These metals will have a relatively large impact on the production of the film. For example, copper particles or copper thorns deposited at a certain point will puncture or scratch the film, affecting the quality of the plated product.

[0003] Chinese patent CN112663119A discloses a device and method for preventing copper plating of a conductive roller. The conductive roller and the electroplating anode are respectively connected to the negative output terminal and the positive output terminal of a first power supply. After the conductive roller and the electroplating anode are energized, the plated product flowing through the plating solution of the plating pool is electroplated. The conductive roller is connected to the positive output terminal of the second power supply, and cooperates with an auxiliary electrode connected to the negative output terminal of the second power supply to achieve electrolysis of the conductive roller, so that the conductive roller avoids copper deposition when electroplating the plated product.

[0004] Although the above scheme achieves a balance between the electroplating metal and the electrolytic copper process on the conductive roller by electrolyzing the plating solution near the conductive roller, thereby avoiding copper residue on the conductive roller and improving the quality of copper plating of the plated product, it is still impossible to completely eliminate the formation of all copper deposits when the contact area between the conductive roller and the plating solution is large or the electroplating rate is fast.

[0005] Therefore, in view of the above-mentioned shortcomings, the present invention provides a new solution. Summary of the invention

[0006] The main purpose of the present application is to provide a device and a process method for preventing the electroplating of metal on a conductive roller, so as to solve the problem in the prior art that metal deposition is easily generated on the conductive roller during the electroplating process, thereby ensuring the quality of the coated product and the production efficiency.

[0007] To achieve the above-mentioned purpose, the present application provides a device for preventing a conductive roller from electroplating metal, comprising: a plating tank body, a front conductive roller assembly and a rear conductive roller assembly are arranged in a mirror image in the plating tank body, each of the front conductive roller assembly and the rear conductive roller assembly has at least one positioning roller completely immersed in the plating solution and a conductive roller component arranged above the plating tank body, and the coating material contacts the roller surfaces of the conductive roller component and the positioning roller in the front conductive roller assembly and the rear conductive roller assembly in sequence, and the coating material also passes through a cleaning device between the rear conductive roller and the positioning roller, so that the roller surfaces of the conductive roller component and the positioning roller in the front conductive roller assembly and the rear conductive roller assembly are always kept parallel and equidistant.

[0008] An electroplating anode is also provided in the electroplating tank body. The electroplating anode has at least an upper anode plate and a lower anode plate. The upper anode plate and the lower anode plate are arranged with an upper and lower interval. The coating material connected between the positioning roller in the front conductive roller assembly and the positioning roller in the rear conductive roller assembly passes between the upper anode plate and the lower anode plate, and the conductive roller components in the front conductive roller assembly and the rear conductive roller assembly are connected to the negative pole of the power supply, and the lower anode plate and the upper anode plate are connected to the positive pole of the power supply. The conductive roller component is arranged above the positioning roller and is located outside the electroplating tank body.

[0009] Preferably, the rear conductive roller assembly further comprises: a cleaning device, which is arranged between the positioning roller and the conductive roller component of the rear conductive roller assembly and is used to clean the coating raw material after the electroplating process to remove the electroplating liquid and impurities remaining on the surface.

[0010] Among them, the cleaning device includes: a device body and a water squeezing roller, the device body is fixedly installed on the inner wall of the plating tank body and partially extends axially to the outside of the plating tank body, the water squeezing roller is rotatably installed on the device body and is located between the positioning roller and the conductive roller component of the rear conductive roller assembly.

[0011] Preferably, the wrapping angle between the conductive roller component and the coating material is set at an angle of 50-180°, and the wrapping angle between the positioning roller and the coating material is set at an angle of 60-120°.

[0012] Preferably, the front conductive roller assembly and the rear conductive roller assembly are both provided with a passing roller, and the passing roller is arranged above the conductive roller component for guiding and stabilizing the running path of the coating raw material.

[0013] Preferably, the lower anode plate and the upper anode plate can be provided in the form of soluble anodes or in the form of insoluble anodes.

[0014] Preferably, both the lower anode plate and the upper anode plate have collector rods, and are electrically connected to the positive electrode of the power supply via the collector rods to ensure that the current can be evenly distributed on the anode plates.

[0015] To achieve the above purpose, the present application also provides a process method for preventing a conductive roller from electroplating metal. The device for preventing a conductive roller from electroplating metal based on the above scheme comprises the following steps: S1. The coating material passes through the conductive roller member in the front conductive roller assembly and enters the electroplating solution in the electroplating tank body; S2. The front conductive roller assembly and the rear conductive roller assembly are positioned so that the conductive roller assembly is continuously operated in a horizontal position parallel to the bottom of the electroplating tank, and during the transportation of the above-mentioned coating material, the conductive roller assembly electrically connected to the positive and negative electrodes of the power supply and the electroplating anode allow the copper ions in the electroplating solution to obtain electrons and be deposited on the surface of the coating material to form a copper film; S3. Then, the coating material after coating in step S2 is taken away from the plating solution in the plating tank body by the rear conductive roller assembly; S4. After the coating material leaves the surface of the plating solution after coating in the above step S3, it passes through the squeezing roller in the rear conductive roller assembly to squeeze out the corrosive plating solution on the surface of the coating material, and then passes through the cleaning device to rinse the residual plating solution on the surface of the polymer film; S5. Finally, the coating raw material is completely taken away from the electroplating tank body by the conductive roller component in the rear conductive roller assembly, and it is ensured that there is no electrolyte and impurities on the surface.

[0016] Preferably, in step S4, the contact surface between the squeezing roller and the surface of the electroplating liquid is located 25-150 mm above the surface of the electroplating liquid.

[0017] Preferably, in step S3, the inter-electrode distance range between the upper anode plate of the electroplating anode and the surface of the coating material is equal to the inter-electrode distance range between the lower anode plate and the surface of the coating material.

[0018] Preferably, the surface of the positioning roller is made of acid corrosion resistant material.

[0019] The beneficial effects of the technical solution of the present invention are: By setting a conductive roller outside the electroplating tank body, the coating raw materials can be more evenly contacted when passing through the conductive roller, preventing the conductive roller from electroplating metal while avoiding uneven electroplating due to uneven current density, so as to form a stable current field, improve the uniformity and adhesion of the electroplating layer, and reduce unstable factors caused by liquid fluctuations or flows.

[0020] By arranging the front conductive roller assembly and the rear conductive roller assembly, the coating material is always kept in contact with the conductive roller component and the roller surface of the positioning roller during the electroplating process, thereby ensuring that the coating surface is fully conductive and improving the electroplating efficiency.

[0021] At the same time, the conductive roller components in the front conductive roller assembly and the rear conductive roller assembly are connected to the negative pole of the power supply, and the lower anode plate and the upper anode plate are connected to the positive pole of the power supply, so that the current density during the electroplating process remains stable, which is beneficial to improving the uniformity and adhesion of the electroplating layer and realizing double-sided electroplating of the coating.

[0022] By keeping the upper and lower anode plates at an equal distance from the surface of the coating material, the current is evenly distributed on the surface of the coating material, thereby avoiding the situation where the local current density is too high or too low, ensuring the uniformity and adhesion of the electroplating layer, reducing the bubbles and impurities generated during the electroplating process, and improving the quality of the electroplating layer.

[0023] The inter-electrode spacing range is set to 2-15mm to optimize the current density and voltage so that it is neither too high to cause burning or excessive deposition, nor too low to cause insufficient electroplating, ensuring the effective deposition of metal ions during the electroplating process, improving the efficiency and quality of electroplating, and at the same time, enabling the device to adapt to coating materials of different thicknesses and widths and different electroplating process requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of a device for preventing a conductive roller from electroplating metal in one embodiment.

[0025] Figure 2 It is a schematic diagram of the structure of a device for preventing a conductive roller from electroplating metal in another embodiment.

[0026] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] In addition, if the descriptions of "first", "second", etc. are involved in this application, they are only used for descriptive purposes (such as for distinguishing the same or similar elements), and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0029] See also Figure 1-Figure 2 The present invention proposes a device for preventing a conductive roller from electroplating metal, comprising: a plating tank body 1, a front conductive roller assembly 2 and a rear conductive roller assembly 3 are arranged in a mirror image in the plating tank body 1, each of the front conductive roller assembly 2 and the rear conductive roller assembly 3 has at least one positioning roller 4 completely immersed in the plating solution and a conductive roller component 5 arranged above the plating tank body 1, and the conductive roller components 5 and the positioning roller 4 in the front conductive roller assembly 2 and the rear conductive roller assembly 3 are contacted in turn through a coating material 9, so that the roller surfaces of the conductive roller components 5 and the positioning roller 4 in the front conductive roller assembly 2 and the rear conductive roller assembly 3 are always kept parallel and equidistant.

[0030] An electroplating anode 6 is also provided in the electroplating tank body 1. The electroplating anode 6 has at least an upper anode plate 7 and a lower anode plate 8. The upper anode plate 7 and the lower anode plate 8 are arranged with an upper and lower interval. The coating material 9 connected between the positioning roller 4 in the front conductive roller assembly 2 and the positioning roller 4 in the rear conductive roller assembly 3 passes between the upper anode plate 7 and the lower anode plate 8, and the conductive roller components 5 in the front conductive roller assembly 2 and the rear conductive roller assembly 3 are connected to the negative pole of the power supply, and the lower anode plate 8 and the upper anode plate 7 are connected to the positive pole of the power supply. The conductive roller component 5 is arranged above the positioning roller 4 and is located outside the electroplating tank body 1.

[0031] The coating material 9 may be a polymer material or other flexible conductive materials.

[0032] In this solution, by setting the front conductive roller assembly 2 and the rear conductive roller assembly 3, the coating material 9 is always kept in contact with the roller surface of the conductive roller member 5 and the positioning roller 4 during the electroplating process, thereby ensuring the uniform distribution of the electroplating solution and the stability of the electroplating process, and improving the electroplating efficiency. At the same time, the conductive roller member 5 in the front conductive roller assembly 2 and the rear conductive roller assembly 3 is connected to the negative pole of the power supply, and the lower anode plate 8 and the upper anode plate 7 are connected to the positive pole of the power supply, so that the current density during the electroplating process remains stable, which is conducive to improving the uniformity and adhesion of the electroplating layer, thereby improving the electroplating quality, and compared with the conductive roller 10 in the prior art that is half placed in the electroplating solution in the electroplating tank / or immersed in the electroplating solution in the electroplating tank and is set in the air, the present solution is provided with the conductive roller 10 outside the electroplating tank body 1, so that the coating material 9 can be more evenly contacted when passing through the conductive roller 10, preventing the conductive roller 10 from electroplating metal while avoiding uneven current density, so as to form a stable current field, improve the uniformity and adhesion of the electroplating layer, and reduce the unstable factors caused by liquid fluctuation or flow.

[0033] Specifically, the positioning roller 4 is completely immersed in the electroplating solution and is kept parallel and equidistant from the conductive roller component 5 to ensure that the coating material 9 can be evenly contacted when passing through the conductive roller 10, avoiding uneven electroplating caused by uneven current density. The upper and lower intervals between the upper anode plate 7 and the lower anode plate 8 help to form a uniform electric field distribution, so that the coating material 9 can deposit the copper layer more evenly during the electroplating process, and ensure that the coating material 9 can directly pass between the above two anode plates during the electroplating process, thereby realizing the shortest path for current, reducing resistance loss, and improving energy utilization efficiency.

[0034] In summary, by connecting the front conductive roller assembly 2 and the conductive roller component 5 in the rear conductive roller assembly 3 to the negative pole of the power supply, and connecting the lower anode plate 8 and the upper anode plate 7 to the positive pole of the power supply, a complete electroplating circuit is formed, which not only ensures the stable flow of current, but also helps to control the current density during the electroplating process, avoiding the problem of uneven electroplating layer or insufficient adhesion due to excessive or insufficient current.

[0035] Furthermore, in actual operation, the positional relationship between the electroplating tank body 1, the conductive roller assembly and the electroplating anode 6 can be adjusted as needed to accommodate the different thicknesses and widths of the plating materials 9. For example, the contact area between the plating material 9 and the electroplating solution can be changed by increasing the number of positioning rollers 4 or adjusting the height of the conductive roller assembly 5, thereby affecting the electroplating speed and effect.

[0036] In one embodiment, the rear conductive roller assembly 3 also includes: a cleaning device 11, which is arranged between the positioning roller 4 and the conductive roller component 5 of the rear conductive roller assembly 3, and is used to clean the coating raw material 9 after the electroplating process to remove the electroplating liquid and impurities remaining on the surface.

[0037] Among them, the cleaning device 11 includes: a device body 12 and a water squeezing roller 13. The device body 12 is fixedly installed on the inner wall of the electroplating tank body 1 and partially extends axially to the outside of the electroplating tank body 1. The water squeezing roller 13 is rotatably installed on the device body 12 and is located between the positioning roller 4 of the rear conductive roller assembly 3 and the conductive roller component 5.

[0038] Specifically, the squeezing roller 13 effectively removes the moisture and residue on the surface of the coating raw material 9 by rotating and squeezing. Furthermore, the squeezing roller 13 can be made of rubber or polymer material, which has good elasticity and wear resistance. When the coating raw material 9 passes through the squeezing roller 13, the squeezing roller 13 will apply a certain pressure to it to squeeze out the moisture and residue on the surface.

[0039] In this solution, the electroplating solution and impurities on the surface of the coating material 9 can be efficiently removed by rotating the squeezing roller 13, thereby avoiding the phenomenon of copper ion reduction on the surface of the coating material 9 in subsequent processes due to the residual electroplating solution containing copper ions on the surface of the coating material 9, thereby affecting the coating quality. At the same time, the electroplating of metal on the surface of the conductive roller 10 is further prevented.

[0040] In one embodiment, the wrapping angle between the conductive roller 10 and the coating material 9 is set at an angle of 50-180°, and the wrapping angle between the positioning roller 4 and the coating material 9 is set at an angle of 60-120°.

[0041] Specifically, the wrap angle between the conductive roller 10 and the coating material 9 is set to 50-180°, which can ensure that the coating material 9 has sufficient contact area on the conductive roller 10, thereby ensuring uniform distribution of current and uniform deposition of the electroplating layer. At the same time, a larger wrap angle range also provides more adjustment space to accommodate coating materials 9 of different thicknesses and widths. The wrap angle between the positioning roller 4 and the coating material 9 is set to 60-120°, which helps to ensure the stable operation of the coating material 9 on the positioning roller 4 and avoid uneven electroplating caused by uneven contact.

[0042] In addition, proper wrap angle setting can also reduce the sliding resistance of the coating material 9 on the positioning roller 4, thereby reducing energy consumption and wear.

[0043] Preferably, the wrapping angle between the conductive roller 10 and the coating material 9 is set to be 110°, and the wrapping angle between the positioning roller 4 and the coating material 9 is set to be 125°.

[0044] In this solution, by reasonably setting the wrapping angles between the conductive roller 10 and the positioning roller 4 and the coating material 9, the uniformity and adhesion of the electroplating layer are improved while ensuring the electroplating efficiency, thereby further improving the electroplating quality.

[0045] In one embodiment, both the front conductive roller assembly 2 and the rear conductive roller assembly 3 are provided with a passing roller, which is arranged above the conductive roller component 5 and is used to guide and stabilize the running path of the coating raw material 9.

[0046] In one embodiment, the lower anode plate 8 and the upper anode plate 7 can be provided in the form of soluble anodes or in the form of insoluble anodes.

[0047] Specifically, the soluble anode is a copper anode plate, and the insoluble anode is a titanium-based ruthenium oxide-coated anode.

[0048] In this solution, by adopting a soluble anode, that is, using a copper anode plate, a stable supply of copper ions can be provided during the electroplating process, which helps to improve the uniformity and adhesion of the electroplated layer. At the same time, since the copper anode plate will gradually dissolve during the electroplating process, it needs to be replaced regularly to ensure the stability and efficiency of the electroplating process.

[0049] On the other hand, the use of an insoluble anode, that is, a titanium-based ruthenium oxide-coated anode, can avoid the problem of anode material dissolution, reduce the contamination of the electroplating solution, and also reduce the consumption and maintenance costs of anode materials. In addition, the titanium-based ruthenium oxide-coated anode has high corrosion resistance and stability, and can maintain good performance during long-term use.

[0050] In one embodiment, both the lower anode plate 8 and the upper anode plate 7 have a collector rod 14, and are electrically connected to the positive electrode of the power source through the collector rod 14 to ensure that the current can be evenly distributed on the anode plates.

[0051] In this solution, the current can be effectively guided to the anode plate by connecting the collector rod 14 to the positive electrode of the power supply, so that the current is more evenly distributed on the anode plate, avoiding the situation where the local current density is too high or too low during the electroplating process, thereby ensuring the uniformity and adhesion of the electroplating layer. At the same time, the uniform current distribution also helps to reduce the bubbles and impurities generated during the electroplating process, further improving the electroplating quality.

[0052] In addition, the present invention also proposes a process method for preventing the conductive roller 10 from being electroplated with metal, based on the device for preventing the conductive roller from being electroplated with metal in the above embodiment, comprising the following steps: S1. The coating material 9 passes through the conductive roller member 5 in the front conductive roller assembly 2 and enters the plating solution in the plating tank body 1; S2. The positioning rollers 4 in the front conductive roller assembly 2 and the rear conductive roller assembly 3 are used to continuously run in a horizontal position parallel to the bottom of the electroplating tank, and during the transportation of the above-mentioned coating material 9, the conductive roller member 5 and the electroplating anode 6, which are electrically connected to the positive and negative electrodes of the power supply, allow the copper ions in the electroplating solution to obtain electrons and be deposited on the surface of the coating material 9 to form a copper film; S3. Then, the coating material 9 after coating in the above step S2 is taken away from the plating solution in the plating tank body 1 by the rear conductive roller assembly 3; S4. After the coating material 9 leaves the surface of the electroplating solution after coating in the above step S3, the corrosive electroplating solution on the surface of the coating material 9 is squeezed out by the squeezing roller 13 in the rear conductive roller assembly 3, and the residual electroplating solution on the surface of the polymer film is rinsed clean by the cleaning device 11; S5. Finally, the conductive roller component 5 in the rear conductive roller assembly 3 completely removes the coating material 9 from the electroplating tank body 1 and ensures that its surface is dry and clean.

[0053] In this solution, the design of the front conductive roller assembly 2 and the rear conductive roller assembly 3 ensures uniform contact between the coating material 9 and the electroplating solution during the electroplating process, as well as a stable distribution of the current density, thereby avoiding unstable factors caused by liquid fluctuations or flows, improving the uniformity and adhesion of the electroplating layer, and after the coating material 9 leaves the electroplating tank body 1, the squeezing roller 13 and the cleaning device 11 in the rear conductive roller assembly 3 effectively remove the corrosive electroplating solution and residual electroplating solution on the surface of the polymer film, thereby avoiding the copper ion reduction phenomenon on the surface of the coating material 9 in the subsequent process due to the residual electroplating solution with copper ions on the surface of the coating material 9, thereby affecting the coating quality, and further preventing the conductive roller 10 from electroplating metal.

[0054] In one embodiment, in step S4, the contact surface between the squeezing roller 13 and the surface of the electroplating solution is located 25-150 mm above the surface of the electroplating solution.

[0055] In this solution, by setting the water squeezing roller 13 at a certain height of 25-150mm above the plating liquid surface, it can be ensured that the electrolyte of the coating material 9 is efficiently removed immediately after leaving the plating tank body 1, thereby avoiding secondary contamination or corrosion caused by the coating material 9 staying in the plating tank for too long, thereby improving the overall cleaning efficiency and quality.

[0056] Preferably, the contact surface between the squeezing roller 13 and the plating liquid surface is located 50 mm above the plating liquid surface. When the coating moves at a certain linear speed, a plating liquid film with a certain thickness on the surface of the coating leaves the liquid surface. The squeezing roller squeezes the liquid film on the surface of the coating in time to thin it to prevent the corrosive electrolyte from accelerating the oxidation of the coating in the air.

[0057] In one embodiment, in step S3 , the inter-electrode distance range between the upper anode plate 7 of the electroplating anode 6 and the surface of the coating material 9 is equal to the inter-electrode distance range between the lower anode plate 8 and the surface of the coating material 9 .

[0058] In this solution, by keeping the upper and lower anode plates 8 at equal distances from the surface of the coating material 9, uniform distribution of current on the surface of the coating material 9 is achieved, thereby avoiding the situation where the local current density is too high or too low, and ensuring the uniformity and adhesion of the electroplating layer.

[0059] Preferably, the inter-electrode distance range between the upper anode plate 7 and the surface of the coating material 9, or the inter-electrode distance range between the lower anode plate 8 and the surface of the coating material 9 is 2-15 mm, which can optimize the current density and voltage so that they are neither too high to cause burning or excessive deposition, nor too low to cause insufficient electroplating. At the same time, the bubbles and impurities generated during the electroplating process are reduced. Furthermore, the inter-electrode distance range between the upper anode plate 7 and the surface of the coating material 9, or the inter-electrode distance range between the lower anode plate 8 and the surface of the coating material 9 is 8 mm, which can maximize the use of current for electroplating reaction, improve electroplating efficiency, reduce energy waste, shorten electroplating time, and improve production efficiency.

[0060] In one embodiment, the surface of the positioning roller 4 is made of acid corrosion resistant material, such as fluoroplastic, rubber, and ceramic.

[0061] In one embodiment, the conductive roller 10 is made of stainless steel, pure titanium or conductive rubber.

[0062] It should be noted that, in this article, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, device, article or device for preventing the electroplating of metal on a conductive roller that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements inherent to such process, device, article or device for preventing the electroplating of metal on a conductive roller. In the absence of more restrictions, an element defined by the sentence "includes one..." does not exclude the existence of other identical elements in the process, device, article or device for preventing the electroplating of metal on a conductive roller that includes the element.

[0063] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A device for preventing a conductive roller from being electroplated with metal, characterized in that: include: An electroplating tank body (1), wherein a front conductive roller assembly (2) and a rear conductive roller assembly (3) are arranged in a mirror image in the electroplating tank body (1), wherein each of the front conductive roller assembly (2) and the rear conductive roller assembly (3) has at least one positioning roller (4) completely immersed in the electroplating solution and a conductive roller component (5) arranged above the electroplating tank body (1), and the conductive roller components (5) and the positioning roller (4) in the front conductive roller assembly (2) and the rear conductive roller assembly (3) are contacted in sequence through a coating material (9), so that the roller surfaces of the conductive roller components (5) and the positioning roller (4) in the front conductive roller assembly (2) and the rear conductive roller assembly (3) are always kept parallel and equidistant; The electroplating tank body (1) is also provided with an electroplating anode (6), wherein the electroplating anode (6) has at least one upper anode plate (7) and one lower anode plate (8), wherein the upper anode plate (7) and the lower anode plate (8) are arranged with a vertical interval, and the coating material (9) connected between the positioning roller (4) in the front conductive roller assembly (2) and the positioning roller (4) in the rear conductive roller assembly (3) passes between the upper anode plate (7) and the lower anode plate (8), and connects the conductive roller components (5) in the front conductive roller assembly (2) and the rear conductive roller assembly (3) to the negative pole of the power supply, and the lower anode plate (8) and the upper anode plate (7) are connected to the positive pole of the power supply, and the conductive roller component (5) is arranged above the positioning roller (4) and is located outside the electroplating tank body (1).

2. A device for preventing a conductive roller from being electroplated with metal according to claim 1, characterized in that: The rear conductive roller assembly (3) further comprises: a cleaning device (11), the cleaning device (11) being arranged between the positioning roller (4) and the conductive roller component (5) of the rear conductive roller assembly (3), and being used for cleaning the coating raw material (9) after the electroplating process, and removing the electroplating liquid and impurities remaining on the surface; wherein the cleaning device (11) comprises: a device body (12) and a water squeezing roller (13), the device body (12) being fixedly mounted on the inner side wall of the electroplating tank body (1), and partially extending axially to the outside of the electroplating tank body (1), the water squeezing roller (13) being rotatably mounted on the device body (12), and being located between the positioning roller (4) and the conductive roller component (5) of the rear conductive roller assembly (3).

3. A device for preventing a conductive roller from being electroplated with metal according to claim 2, characterized in that: The wrapping angle between the conductive roller (10) in the conductive roller component (5) and the coating material (9) is set at an angle of 50-180°, and the wrapping angle between the positioning roller (4) and the coating material (9) is set at an angle of 60-120°.

4. The device for preventing the conductive roller from being electroplated with metal according to claim 2, characterized in that: The front conductive roller assembly (2) and the rear conductive roller assembly (3) are both provided with a passing roller, and the passing roller is arranged above the conductive roller component (5) and is used to guide and stabilize the running path of the coating raw material (9).

5. The device for preventing the conductive roller from being electroplated with metal according to claim 2, characterized in that: The lower anode plate (8) and the upper anode plate (7) may be provided in the form of soluble anodes or in the form of insoluble anodes.

6. The device for preventing the conductive roller from being electroplated with metal according to claim 1, characterized in that: The lower anode plate (8) and the upper anode plate (7) both have a collector rod (14), and are electrically connected to the positive electrode of the power supply via the collector rod (14) to ensure that the current can be evenly distributed on the anode plates.

7. A process method for preventing a conductive roller 10 from being electroplated with metal, based on the device for preventing a conductive roller from being electroplated with metal as claimed in any one of claims 1 to 6, comprising the following steps: S1. The coating material (9) passes through the conductive roller component (5) in the front conductive roller assembly (2) and enters the electroplating solution in the electroplating tank body (1); S2. The positioning rollers (4) in the front conductive roller assembly (2) and the rear conductive roller assembly (3) are used to continuously run in a horizontal position parallel to the bottom of the electroplating tank, and during the transportation of the above-mentioned coating material (9), the conductive roller assembly (5) electrically connected to the positive and negative electrodes of the power source and the electroplating anode (6) are used to allow the copper ions in the electroplating solution to obtain electrons and be deposited on the surface of the coating material (9) to form a copper film; S3. Then, the coating material 9 after coating in the above step S2 is taken away from the plating solution in the electroplating tank body (1) through the rear conductive roller assembly (3); S4. After the coating material (9) leaves the surface of the electroplating solution after coating in the above step S3, the corrosive electroplating solution on the surface of the coating material (9) is squeezed out by the squeezing roller (13) in the cleaning device (11), and the residual electroplating solution on the surface of the polymer film is rinsed clean by the device body (12); S5. Finally, the conductive roller component (5) in the rear conductive roller assembly (3) completely removes the coating material (9) from the electroplating tank body (1), and ensures that no electrolyte and impurities are removed from the surface.

8. A process method for preventing a conductive roller from electroplating metal according to claim 7, characterized in that: In step S4, the contact surface between the squeezing roller (13) and the surface of the electroplating liquid is located 25-150 mm above the surface of the electroplating liquid.

9. A process method for preventing a conductive roller from electroplating metal according to claim 7, characterized in that: In the step S3, the inter-electrode distance range between the upper anode plate (7) of the electroplating anode (6) and the surface of the coating material (9) is equal to the inter-electrode distance range between the lower anode plate (8) and the surface of the coating material (9).

10. A process method for preventing a conductive roller from electroplating metal according to claim 9, characterized in that: The surface of the positioning roller (4) is made of acid corrosion resistant material.

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