Electric pump

Abstract

The electric pump comprises a heat dissipation piece and a circuit board assembly, the electric pump is provided with a rotor cavity and an electric control cavity, a working medium can circulate in the rotor cavity, the rotor cavity is not communicated with the electric control cavity, the circuit board assembly is located in the electric control cavity, the heat dissipation piece comprises a main body part and a contact part, and a wall part corresponding to the rotor cavity comprises the main body part. In the radial direction of the electric pump, the contact part is arranged on the radial outer side of the main body part, the electric pump comprises an auxiliary flow channel, the auxiliary flow channel extends in the radial direction of the electric pump and communicates with the rotor cavity, the wall part corresponding to the auxiliary flow channel comprises at least part of the contact part, and at least part of the circuit board assembly makes direct contact with the contact part. The thermal conductivity of the material of the contact part is greater than or equal to that of the metal material. In this way, the heat dissipation efficiency of the circuit board assembly can be improved.

Description

[Technical field]

[0001] The present application relates to the field of fluid control, and in particular to an electric pump. [Background technology]

[0002] The electric pump includes a circuit board assembly. When the circuit board assembly is working, heat will be generated. If the heat accumulates to a certain level and cannot be dissipated in time, it will affect the performance of the circuit board assembly, thereby reducing the service life of the electric pump. The circuit board assembly includes a substrate and heat-generating electronic components. At present, along the radial direction of the electric pump, the heat-generating electronic components in the circuit board assembly are usually arranged on the substrate close to the bottom of the rotor cavity. However, in some cases, the heat-generating components in the circuit board assembly may be arranged on the substrate far away from the bottom of the rotor cavity. How to dissipate the heat of this part of the heat-generating electronic components is a technical problem. [Summary of the invention]

[0004] The object of the present invention is to provide an electric pump which is conducive to heat dissipation of the part of the circuit board assembly away from the bottom of the rotor cavity.

[0005] To achieve the above-mentioned purpose, an embodiment provided in the present application adopts the following technical scheme: an electric pump, the electric pump includes a heat sink and a circuit board assembly, the electric pump has a rotor cavity and an electric control cavity, the working medium can flow in the rotor cavity, the rotor cavity is not connected to the electric control cavity, the circuit board assembly is located in the electric control cavity, the heat sink includes a main body and a contact portion, the wall portion corresponding to the rotor cavity includes the main body, and the contact portion is arranged radially outside the main body along the radial direction of the electric pump, the electric pump includes an auxiliary flow channel, the auxiliary flow channel is connected to the rotor cavity, the wall portion corresponding to the auxiliary flow channel includes at least part of the contact portion, and at least part of the circuit board assembly is in direct contact with the contact portion.

[0006] In one embodiment of the present application, the heat sink includes a contact portion, the wall portion corresponding to the auxiliary flow channel includes at least part of the contact portion, the auxiliary flow channel is connected to the rotor cavity, and when the electric pump is working, the working medium in the rotor cavity enters the auxiliary flow channel, at least part of the circuit board assembly is in direct contact with the contact portion, and the heat generated by the circuit board assembly is transferred to the working medium. In this way, it is beneficial to dissipate heat for the part of the circuit board assembly away from the bottom of the rotor cavity.

Brief Description of the Drawings

[0007] Figure 1 It is a three-dimensional structural schematic diagram of a first embodiment of the electric pump of the present application;

[0008] Figure 2 yes Figure 1 A schematic diagram of an exploded structure of an electric pump;

[0009] Figure 3 yes Figure 1A schematic diagram of the structure of the first embodiment of the electric pump along the XX section;

[0010] Figure 4 yes Figure 1 A schematic diagram of a three-dimensional structure of a stator winding of a first embodiment of an electric pump;

[0011] Figure 5 yes Figure 1 A schematic diagram of the three-dimensional structure of the stator assembly of the first embodiment of the electric pump;

[0012] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure of the stator assembly along YY;

[0013] Figure 7 yes Figure 1 A schematic diagram of the three-dimensional structure of a heat sink in one direction of the first embodiment of the electric pump;

[0014] Figure 8 yes Figure 1 A schematic diagram of the structure of the second embodiment of the electric pump along the XX section;

[0015] Fig. 9 yes Figure 1 A schematic diagram of the structure of the third embodiment of the electric pump along the XX section;

[0016] Fig.10 yes Figure 1 A schematic diagram of the structure of the fourth embodiment of the electric pump along the XX section;

[0017] In the accompanying drawings: 100, electric pump;

[0018] 11. Pump cover; 111. Input port; 112. Output port;

[0019] 12. Rotating assembly; 121. Impeller assembly; 122. Rotor assembly;

[0020] 13. stator assembly; 131. stator winding; 1311. stator core; 1312. insulation frame; 1313. winding;

[0021] 132. Shell;

[0022] 14. Circuit board assembly; 141. Substrate; 1411. Front side; 1412. Back side; 142. Electronic components; 143. Thermal conductive column;

[0023] 15. pump shaft; 151. mounting portion; 152. connecting portion;

[0024] 17. heat sink; 171. main body; 172. contact portion; 173. fixing portion;

[0025] 18. Pump inner cavity; 181. Rotor cavity; 1811. Rotor cavity bottom; 182. Impeller cavity; 183. Electric control cavity; 19. Auxiliary flow channel;

[0026] 20. Inlet flow channel; 21. Inner groove; 22. Insert pin; 23. Seal; 25. Bottom cover. [Specific implementation method]

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0028] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings. First of all, it should be noted that the directional terms such as up, down, left, right, front, back, inside, outside, top, bottom, etc. mentioned or may be mentioned in the specification of the present invention are defined relative to the structure shown in the corresponding drawings. They are relative concepts, and therefore may change accordingly according to their different locations and different usage states. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0029] The electric pump in the following embodiments can provide flow power for the working medium of the automotive thermal management system. The working medium may be water or an aqueous solution, such as an aqueous solution including 50% ethylene glycol. Of course, the working medium may also be other substances.

[0030] See also Figures 1 to 4As shown, the present application provides an electric pump 100 including a pump cover 11, a rotating assembly 12, a stator assembly 13, a heat sink 17, a circuit board assembly 14, a pump shaft 15 and a bottom cover 25. The stator assembly 13 includes a stator winding 131 and a housing 132. The stator winding 131 is embedded in the housing 132. Specifically, the housing 132 is an injection molded part, and the housing 132 is formed by injection molding with at least the stator winding 131 as an insert; along the axial direction of the electric pump 100, the circuit board assembly 14 is electrically connected to the stator assembly, and specifically, the circuit board assembly 14 is electrically connected to the stator assembly 13 through a pin 22, and the pump cover 11 and the stator assembly 13 are sealed and fixed. It should be noted that the sealing and fixing here refers to a sealing and fixing method that prevents the working medium from leaking to the outside of the electric pump 100 when the electric pump 100 is working. The pump shaft 15 is fixedly connected to the heat sink 17. The electric pump 100 has a pump cavity 18, and the rotating assembly 12 is located in the pump cavity 18. The pump cavity 18 includes a rotor cavity 181 and an impeller cavity 182, and the rotor cavity 181 and the impeller cavity 182 are connected. The rotating assembly 12 includes a rotor assembly 122 and an impeller assembly 121, and the rotor assembly 122 includes a permanent magnet. At least part of the rotor assembly 122 is located in the rotor cavity 181, and the impeller assembly 121 is located in the impeller cavity 182, and the pump cavity 18 can have a working medium flowing through. In a specific embodiment, the other end of the pump shaft 15 is at least partially located in the rotor cavity 181, and at least part of the rotating assembly 12 is sleeved on the outer periphery of the pump shaft 15, and the rotating assembly 12 is connected to the pump shaft 15 in a transmission manner. Of course, as other embodiments, the rotating assembly 12 and the pump shaft 15 are fixedly connected, and the pump shaft 15 rotates with the rotor assembly 122. The circuit board assembly 14 includes a substrate 141 and electronic components 142. Of course, as another implementation method, the electric pump 100 may not include the pump cover 11, and the pump cover 11 is integrated into the external structure. Such a setting is more conducive to the integrated design of the electric pump 100, making the structure of the electric pump 100 more compact, and more conducive to the miniaturization and lightweight of the structure of the electric pump 100. When the electric pump 100 is working, the control circuit in the circuit board assembly 14 is connected to the external power supply, and the control circuit controls the current of the stator winding 131 and then controls the excitation magnetic field generated by the stator winding 131. The rotating component 12 rotates around the pump shaft 15 under the action of the excitation magnetic field, so that the working medium entering the pump cavity 18 rotates with the rotating component 12, and the working medium will leave the pump cavity 18 under the action of centrifugal force.

[0031] See also Figure 4As shown, the stator winding 131 includes a stator core 1311, an insulating frame 1312 and a winding 1313, the number of windings 1313 is at least three, the insulating frame 1312 is coated on at least part of the surface of the stator core 1311, and the insulating frame 1312 is used to isolate the winding 1313 and the stator core 1311, so that the winding 1313 and the stator core 1311 are electrically insulated. The insulating frame 1312 and the stator core 1311 can be an integrated structural member. Specifically, as an implementation method, the insulating frame 1312 is formed by injection molding with the stator core 1311 as an insert. Of course, as other implementation methods, the insulating frame 1312 and the stator core 1311 are separately set, and the "separate setting" here means that the insulating frame 1312 and the stator core 1311 are respectively processed into two separate parts and then assembled. The connection is limited or fixed by assembly. In this embodiment, the insulating frame 1312 is formed by injection molding with the stator core 1311 as an insert. It can be understood that the stator core 1311 and the insulating frame 1312 are an integrated structure. The winding 1313 is wound around the insulating frame 1312. As a specific embodiment, the winding 1313 includes nine windings 1313. Of course, as other embodiments, the winding 1313 can also include other numbers of windings 1313, such as three, six, twelve, or other numbers.

[0032] Please refer to Figures 1 to 7As shown, as an implementation, the electric pump 100 includes a heat sink 17 and a circuit board assembly 14, the electric pump 100 has a rotor cavity 181 and an electric control cavity 183, the working medium can flow in the rotor cavity 181, the rotor cavity 181 is not connected to the electric control cavity 183, the circuit board assembly 14 is located in the electric control cavity 183, the heat sink 17 includes a main body 171 and a contact portion 172, the wall portion corresponding to the rotor cavity 181 includes the main body 171, along the radial direction of the electric pump 100, the contact portion 172 is arranged on the radial outside of the main body 171, the electric pump 100 includes an auxiliary flow channel 19, the auxiliary flow channel 19 extends in the radial direction of the electric pump 100, the auxiliary flow channel 19 is connected to the rotor cavity 181, the wall portion corresponding to the auxiliary flow channel 19 includes at least part of the contact portion 172, at least part of the circuit board assembly 14 is in direct contact with the contact portion 172, and the thermal conductivity of the material of the contact portion 172 is greater than or equal to the thermal conductivity of the metal material. It should be noted that the metal material here refers to the material with the lowest thermal conductivity among metal materials. The heat generated by the circuit board assembly 14 is transferred to the working medium. In this way, first, the heat sink 17 part in contact with the working medium includes a main body 171 and a partial contact part 172. Compared with the working medium only contacting the main body 171 of the heat sink 17, the contact area between the working medium and the heat sink 17 is increased. Since the circuit board assembly 14 is in direct contact with the contact part 172, it is beneficial to improve the heat dissipation efficiency of the circuit board assembly 14; second, there is no need to set up other heat dissipation structures, which is beneficial to simplify the design of the electric pump 100, and while reducing the production cost of the electric pump 100, it is beneficial to achieve the miniaturization of the electric pump 100 structure in the axial direction. The circuit board assembly 14 includes a substrate 141 and electronic components 142, and the electronic components 142 include heat-generating electronic components, and the heat-generating electronic components include common electronic components that are easy to generate heat, such as diodes, MOS tubes, inductors, resistors, capacitors, etc. In this way, thirdly, the arrangement of electronic components on the substrate is no longer affected by the bottom 1811 of the rotor cavity, for example, the area of ​​the main body 171, and the arrangement space of the heat-prone electronic components is increased. In this way, the limited area of ​​the substrate can be used as much as possible, which is conducive to the miniaturization of the substrate, thereby making the design of the electric pump 100 more compact, and thus realizing the miniaturization of the electric pump 100 in the radial direction. Fourthly, the arrangement space of the electronic components is increased, which is more conducive to optimizing the control circuit inside the circuit board assembly, laying a certain foundation for reducing the production cost of the electric pump 100.

[0033] It should be noted that the "radially outer side" mentioned here and below refers to the direction away from the axis of the electric pump shaft along the radial direction of the electric pump. The radial direction of the electric pump is perpendicular to the axial direction of the electric pump. The axial direction of the electric pump is the direction in which the axis of the electric pump extends.

[0034] Please refer to Figure 3As shown, due to processing or assembly reasons, there may be a gap between the main body 171 and the circuit board assembly 14. In order to speed up the heat transfer efficiency between the circuit board assembly 14 and the main body 171, thermal conductive silicone or thermal conductive silicone grease 26 is filled between the main body 171 and the circuit board assembly 14. Of course, if the processing accuracy of the heat sink 17 is sufficient to meet the direct contact between the main body 171 and the contact part 172 and different positions of the electric control board assembly at the same time, the main body 171 and the circuit board assembly 14 may not be coated with thermal conductive glue or thermal conductive silicone grease 26. For details, please refer to Fig.10 shown.

[0035] As an implementation, see Figures 1 to 7 As shown; the circuit board assembly 14 includes a substrate 141 and electronic components 142, the substrate 141 includes a front side 1411 and a back side 1412, in the axial direction of the electric pump 100, the front side 1411 is closer to the stator assembly 13 than the back side 1412; the electronic components 142 are installed on the back side 1412, and part of the front side 1411 is in direct contact with the contact portion 172. In this way, since the front side 1411 of the substrate 141 is not installed with the electronic components 142, while the lower surface of the contact portion 172 is not processed, it is beneficial to increase the contact area between the circuit board assembly 14 and the contact portion 172, which is beneficial to improve the heat dissipation of the electric control board assembly. Alternatively, please refer to Figure 8 As shown, some electronic components 142 are arranged on the front side 1411, and some electronic components 142 are in contact with the contact portion 172. In this way, the electronic components 142 can directly contact the contact portion 172, and the heat generated by the electronic components can directly contact the contact portion 172, which is conducive to heat dissipation of the electronic components.

[0036] As an implementation, see Figures 1 to 9 As shown, the material of the heat sink 17 is metal material, the main body 171 and the contact part 172 are integrated structural parts, specifically, the materials of the main body 171 and the contact part 172 are metal materials, the electric pump 100 includes a stator assembly 13, the stator assembly 13 includes a stator winding 131 and a shell 132, the shell 132 is an injection molded part, and the shell 132 is formed by injection molding with at least the stator winding 131 as an insert, and the stator assembly 13 is fixedly connected to the heat sink 17. The heat sink 17 and the stator assembly 13 are split parts, and the heat sink 17 is fixedly connected to the stator assembly 13. In this way, the working medium can directly contact the heat sink 17, and the heat generated by the circuit board assembly 14 can be directly transferred to the working medium through the heat sink 17. The heat generated by the circuit board assembly 14 leaves the electric pump 100 through the flow of the working medium, thereby dissipating the heat of the circuit board assembly 14. In this way, it is more conducive to simplifying the structure of the electric pump, reducing the parts of the electric pump, and laying a certain foundation for reducing the cost of the electric pump.

[0037] As for the fixing method of the heat sink 17 and the stator assembly 13, as an implementation method, please refer to Figures 1 to 7 As shown, the heat sink 17 includes a fixing portion 173, and the fixing portion 173 is arranged on the radial outer side of the contact portion 172 along the radial direction of the electric pump 100. A plurality of through holes are arranged on the fixing portion 173, and a plurality of threaded holes are formed on the stator assembly 13, and the threaded holes are arranged in a circumferential array. The through holes and the threaded holes are arranged correspondingly, and the heat sink 17 is fixedly connected with the stator assembly 13 by screws or bolts. In this way, first, while ensuring the heat dissipation of the circuit board assembly 14, it is conducive to simplifying the structure of the electric pump 100. Second, the heat sink 17 and the stator assembly 13 are split structures, which is conducive to simplifying the structure of the electric pump 100, for example, it is conducive to reducing the difficulty of processing the auxiliary flow channel 19, and lays a certain foundation for simplifying the process route of the electric pump 100. Third, the heat sink 17 is made of metal material, which can ensure the flatness of the heat sink 17 processing, which is conducive to ensuring that the heat sink 17 is fully in contact with the contact portion of the circuit board assembly 14, and thus is conducive to heat transfer between the circuit board assembly 14 and the heat sink 17. Of course, the fixing method of the heat sink 17 and the stator assembly can also be other implementation methods. As an implementation method, please refer to Figures 1 to 4 , Fig.10 As shown, the housing 132 is formed by at least injection molding with the heat sink 17 and the stator winding 131 as inserts. It can be understood that the heat sink 17 and the stator assembly 13 are fixed by injection molding.

[0038] For further information, please refer to Figures 1 to 7 As shown, in order to increase the sealing performance of the rotor cavity 181 and reduce the working medium in the rotor cavity 181 from entering the electric control cavity through the contact gap between the heat sink 17 and the stator assembly 13 and contacting the circuit board assembly 14, as an implementation method, the electric pump 100 includes a seal 23, one of the stator assembly or the heat sink 17 is provided with an inner groove 21, the seal 23 is arranged in the inner groove 21, and the heat sink 17 is sealed and connected to one end of the stator assembly through the seal 23. In this way, it is helpful to reduce the working medium in the rotor cavity 181 from contacting the circuit board assembly 14 through the gap between the stator assembly 13 and the heat sink 17, which is helpful to improve the service life of the circuit board assembly 14.

[0039] As an implementation method, please refer to 1 to Fig. 9As shown, the material of the heat sink 17 is a non-metallic material, and the main body 171 and the contact part 172 are an integrated structural part. Specifically, the material of the main body 171 and the contact part 172 is a non-metallic material, or the material of the contact part 172 is a non-metallic material. The electric pump 100 includes a stator assembly 13, and the stator assembly 13 includes a stator winding 131 and a shell 132. The shell 132 is an injection molded part. The shell 132 is formed by injection molding with at least the stator winding 131 as an insert, and the stator assembly 13 is fixedly connected to the heat sink 17. The material of the heat sink 17 is a non-metallic material. Specifically, as an implementation method, the material of the heat sink 17 is a material with high thermal conductivity. It should be noted that the material with high thermal conductivity here means that the thermal conductivity of the heat sink 17 is greater than or equal to the thermal conductivity of the metal material. As an implementation method, the material with high thermal conductivity can be a plastic material with high thermal conductivity; in this way, there can be a variety of choices for the material of the heat sink 17, which increases the adaptability of the electric pump 100. At the same time, it lays a certain foundation for the lightweight design of the electric pump 100.

[0040] As an implementation, see Fig. 9 As shown, the circuit board assembly 14 includes a substrate 141 and a heat-conducting column 143, one end of the heat-conducting column 143 is fixedly connected to the substrate 141, and the other end of the heat-conducting column 143 is in contact with the contact portion 172. More specifically, the heat-generating electronic component 142 can be arranged close to the heat-conducting column 143. In this way, the heat-generating electronic component 142 can be arranged close to the heat-conducting column 143, and the heat generated by the heat-generating electronic component 142 is transferred to the contact portion 172 through the heat-conducting column 143. Since the contact portion 172 can contact the working medium in the rotor cavity, the heat generated by the heat-generating electronic component is taken away to the electric pump through the flow of the working medium. In this way, the phenomenon of short circuit caused by the contact between the circuit board assembly and the heat sink can be reduced, laying a certain foundation for improving the life of the electric pump.

[0041] Please refer to Figures 1 to 9As shown, in order to speed up the flow of the working medium in the rotor cavity 181 and speed up the heat dissipation of the circuit board assembly, the auxiliary flow channel 19 can be connected to the outside, and a certain working medium is input into the auxiliary flow channel 19 from the outside to accelerate the circulation of the working medium in the auxiliary flow channel 19 and the rotor cavity 181. Of course, the auxiliary flow channel 19 may not be connected to the outside, and the working medium in the auxiliary flow channel 19 and the rotor cavity 181 is accelerated to circulate through the internal structure of the electric pump 100. As an implementation method, the electric pump 100 includes a stator assembly 13, a stator assembly 13 includes a stator winding 131 and a housing 132, the housing 132 is an injection molded part, the stator winding 131 is embedded in the housing 132, the electric pump 100 has an inlet flow channel 20, along the axial direction of the electric pump 100, the inlet flow channel 20 runs through the stator assembly 13, the electric pump 100 includes an impeller cavity 182, the impeller cavity 182 is connected to the rotor cavity 181, along the radial direction of the electric pump 100, the inlet flow channel 20 is arranged on the radial outside of the rotor cavity 181, in this embodiment, the inlet flow channel 20 is arranged in the housing 132 part between adjacent windings 1313. One end of the inlet flow channel 20 is connected to the impeller cavity 182, and the other end of the inlet flow channel 20 is connected to the auxiliary flow channel 19. Specifically, the pin 22 can be fixed to the stator assembly 13 by injection molding. Of course, as other implementations, the pin 22 can also be plugged into the stator assembly 13. Specifically, the stator assembly 13 includes a slot, at least part of the connection end of the stator winding 131 is located in the slot, and one end of the pin 22 is set with the slot. As a specific implementation, one end of the pin 22 is embedded in the housing 132. Specifically, the pin 22 is fixed to the stator assembly by injection molding. One end of the pin 22 is electrically connected to the stator winding 131, and the other end of the pin 22 is electrically connected to the circuit board assembly 14. It can be understood that the housing 132 is formed by injection molding with at least the pin 22 and the stator winding 131 as inserts. It should be noted that the radial outer side here and in the following is the direction away from the central axis of the electric pump 100 relative to the central axis of the electric pump 100. In this way, while simplifying the structure of the electric pump 100, it is beneficial to accelerate the heat dissipation of the circuit board assembly, thereby helping to increase the life of the electric pump 100. Heat dissipation flow path S1 of the electric pump 100: the working medium of the impeller chamber 182 enters the auxiliary flow channel 19 through the inlet flow channel 20, the auxiliary flow channel 19 is connected with the rotor chamber 181, the working medium enters the rotor chamber 181 through the auxiliary flow channel 19, the rotor chamber 181 is connected with the impeller chamber 182, and the working medium leaves the electric pump 100 under the action of the centrifugal force of the impeller assembly 121, thereby completing a heat exchange. For the specific heat dissipation flow path of the electric pump 100, please refer to Figure 3 shown.

[0042] Please refer to Figure 1 and Fig.10As shown, the pump cover 11 has an input port 111 and an output port 112, the input port 111 is used for the inflow of the working medium, and the output port 112 is used for the outflow of the working medium. The working pressure of the output port 112 is greater than the working pressure of the input port 111. In order to speed up the heat dissipation speed of the circuit board assembly 14, the electric pump 100 includes a rotating assembly 12, and the rotating assembly 12 includes an impeller assembly 121. The impeller assembly 121 is located in the impeller cavity 182. Along the radial direction of the electric pump 100, the inlet flow channel 20 is arranged on the radial outer side of the impeller assembly 121. The inlet flow channel 20 is arranged on the radial outer side of the impeller assembly 121. It can be understood that the working pressure of the area connected to the inlet flow channel 20 is the same as the pressure of the output port 112. In the radial direction of the electric pump, the closer the inlet flow channel 20 is to the output port 112, the greater the pressure difference between the inlet flow channel 20 and the rotor cavity 181, which is conducive to speeding up the heat dissipation speed of the circuit board assembly 14.

[0043] As an implementation, see Figures 1 to 7 As shown, a portion of the wall corresponding to the auxiliary flow channel 19 is located at the stator assembly 13, and another portion of the wall corresponding to the auxiliary flow channel 19 is located at the contact portion 172; or all of the wall corresponding to the auxiliary flow channel 19 is located at the contact portion 172. In this embodiment, a portion of the wall corresponding to the auxiliary flow channel 19 is located at the stator assembly 13, and another portion of the wall corresponding to the auxiliary flow channel 19 is located at the contact portion 172. In this way, the processing flow of the auxiliary flow channel 19 can be simplified. For example, a portion of the wall corresponding to the auxiliary flow channel 19 can be formed by injection molding with the stator winding 131 as an insert, so that there is no need to perform mechanical processing on this structure separately.

[0044] Further, as mentioned above, please refer to Figures 1 to 7 As shown, in order to fully dissipate the heat of the heat-prone electronic components 142, the radial dimension of the heat sink 17 is much larger than the shaft diameter of the pump shaft 15. In order to reduce the production cost of the electric pump 100, the pump shaft 15 and the heat sink are separate components. It should be noted that the separate components here and below are two separate components that are fixedly installed by assembly. As an implementation method, please refer to the figure, the electric pump 100 includes a pump shaft 15, and the pump shaft 15 and the heat sink 17 are a separate structure. The pump shaft 15 includes a mounting portion 151 and a connecting portion 152. The mounting portion 151 and the heat sink 17 are fixedly arranged, and at least part of the connecting portion 152 is located in the rotor cavity 181. In this way, it is beneficial to further reduce the production cost of the electric pump 100.

[0045] Please refer to Figures 1 to 10As shown, the shell 132 includes a first sealing part, and the pump cover 1111 includes a second sealing part. The first sealing part and the second sealing part are sealed and fixed. The fixing methods include welding, bonding, etc. The welding methods include laser welding, friction welding and ultrasonic welding, which will not be described in detail here.

[0046] It should be noted that the above embodiments are only used to illustrate the present application and are not intended to limit the technical solutions described in the present application. Although the present application has been described in detail in this specification with reference to the above embodiments, a person of ordinary skill in the art should understand that a person of ordinary skill in the art can still modify or make equivalent substitutions to the present application, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present application should be included in the scope of the claims of the present application.

Claims

1. An electric pump (100), characterized in that: The electric pump (100) comprises a heat sink (17) and a circuit board assembly (14). The electric pump (100) has a rotor cavity (181) and an electric control cavity (183). A working medium can flow through the rotor cavity (181). The rotor cavity (181) is not connected to the electric control cavity (183). The circuit board assembly (14) is located in the electric control cavity (183). The heat sink (17) comprises a main body (171) and a contact portion (172). The wall portion corresponding to the rotor cavity (181) comprises the main body (171). Along the radial direction of the electric pump (100), the contact portion (172) is arranged on the radial outside of the main body (171), the electric pump (100) includes an auxiliary flow channel (19), the auxiliary flow channel (19) is connected to the rotor cavity (181), the wall portion corresponding to the auxiliary flow channel (19) includes at least part of the contact portion (172), at least part of the circuit board assembly (14) is in direct contact with the contact portion (172), and the thermal conductivity of the material of the contact portion (172) is greater than or equal to the thermal conductivity of the metal material.

2. An electric pump (100), characterized in that: The electric pump (100) comprises a heat sink (17) and a circuit board assembly (14). The electric pump (100) has a rotor cavity (181) and an electric control cavity (183). Working medium can flow through the rotor cavity (181). The rotor cavity (181) is not connected to the electric control cavity (183). The circuit board assembly (14) is located in the electric control cavity (183). The heat sink (17) comprises a main body (171) and a contact portion (172). The rotor cavity (181) corresponds to The wall portion includes the main body portion (171), and the contact portion (172) is arranged on the radial outside of the main body portion (171) along the radial direction of the electric pump (100). The electric pump (100) includes an auxiliary flow channel (19), and the auxiliary flow channel (19) is connected to the rotor cavity (181). The wall portion corresponding to the auxiliary flow channel (19) includes at least part of the contact portion (172), and at least part of the circuit board assembly (14) is in direct contact with the contact portion (172).

3. The electric pump (100) according to claim 1 or 2, characterized in that: The circuit board assembly (14) comprises a substrate (141) and electronic components (142); the substrate (141) comprises a front side (1411) and a back side (1412); in the axial direction of the electric pump (100), the front side (1411) is closer to the stator assembly (13) than the back side (1412); The electronic component (142) is mounted on the reverse side (1412), and a portion of the front side (1411) is in direct contact with the contact portion (172); Alternatively, part of the electronic components (142) are arranged on the front side (1411), and part of the electronic components (142) are in contact with the contact portion (172).

4. The electric pump (100) according to any one of claims 1 to 3, characterized in that: The heat sink (17) is made of metal material; the main body (171) and the contact portion (172) are integrated structural components; the electric pump (100) comprises a stator assembly (13); the stator assembly (13) comprises a stator winding (131) and a housing (132); the housing (132) is an injection molded component; the housing (132) is formed by at least injection molding the stator winding (131) as an insert; and the stator assembly (13) is fixedly connected to the heat sink (17).

5. The electric pump (100) according to claim 4, characterized in that: The heat sink (17) comprises a fixing portion (173), which is arranged radially outside the contact portion (172) along the radial direction of the electric pump (100), and a plurality of through holes are arranged on the fixing portion (173). The stator assembly (13) is formed with a plurality of threaded holes, which are distributed in a circular array, and the through holes are arranged corresponding to the threaded holes. The heat sink (17) is fixedly connected to the stator assembly (13) by screws or bolts.

6. The electric pump (100) according to claim 5, characterized in that: The electric pump (100) comprises a sealing member (23); one of the stator assembly (13) or the heat sink (17) is provided with an inner groove (21); the sealing member (23) is arranged in the inner groove (21); and the heat sink (17) is sealed and connected to the stator assembly via the sealing member (23).

7. The electric pump (100) according to claim 4, characterized in that: The housing (132) is formed by at least using the heat sink (17) and the stator winding (131) as inserts through injection molding.

8. The electric pump (100) according to any one of claims 1 to 3, characterized in that: The heat sink (17) is made of a non-metallic material; the main body (171) and the contact portion (172) are integrated structural components; the electric pump (100) comprises a stator assembly (13); the stator assembly (13) comprises a stator winding (131) and a housing (132); the housing (132) is an injection molded component; the housing (132) is formed by at least injection molding the stator winding (131) as an insert; and the stator assembly (13) is fixedly connected to the heat sink (17).

9. The electric pump (100) according to any one of claims 1 to 3, characterized in that: The circuit board assembly (14) comprises a base plate (141) and a heat-conducting column (143); one end of the heat-conducting column (143) is fixedly connected to the base plate (141), and the other end of the heat-conducting column abuts against the contact portion (172).

10. The electric pump (100) according to any one of claims 1 to 9, characterized in that: The electric pump (100) comprises a stator assembly (13), wherein the stator assembly (13) comprises a stator winding (131) and a housing (132), wherein the housing (132) is an injection molded part, wherein the stator winding (131) is embedded in the housing (132), wherein the electric pump (100) comprises an inlet flow channel (20), wherein the inlet flow channel (20) penetrates the stator assembly (13) along the axial direction of the electric pump (100), wherein the electric pump (100) comprises an impeller cavity (182), wherein the impeller cavity (182) is communicated with the rotor cavity (181), wherein the inlet flow channel (20) is arranged radially outside the rotor cavity (181) along the radial direction of the electric pump (100), wherein one end of the inlet flow channel (20) is communicated with the impeller cavity (182), and the other end of the inlet flow channel (20) is communicated with the auxiliary flow channel (19).

11. The electric pump (100) according to claim 10, characterized in that: The electric pump (100) comprises a rotating assembly (12), the rotating assembly (12) comprises an impeller assembly (121), the impeller assembly (121) is located in the impeller chamber (182), and along the radial direction of the electric pump (100), the inlet flow channel (20) is arranged on the radial outside of the impeller assembly (121).

12. The electric pump (100) according to any one of claims 1 to 11, characterized in that: A portion of the wall corresponding to the auxiliary flow channel (19) is located at the stator assembly (13), and another portion of the wall corresponding to the auxiliary flow channel (19) is located at the contact portion (172); or all of the wall corresponding to the auxiliary flow channel (19) is located at the contact portion (172).

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