Wafer carrying device

Abstract

The invention relates to the technical field of semiconductor manufacturing, and particularly discloses a wafer carrying device which comprises a carrying track, a device base is arranged on the carrying track, a round base is installed on the lower side of the device base, a pneumatic suction cup is installed below the round base, and a plurality of clamping blocks are arranged on the peripheral side of the round base. The lower side of the clamping block is rotatably connected with left and right strip clamping blocks, and the lower sides of the outer ends of the strip clamping blocks are provided with rubber contacts. According to the wafer carrying device, the pneumatic suction cups are adopted, stability and flexibility are enhanced, a pneumatic system rapidly adjusts the adsorption force, wafer damage is avoided through the design of rubber contacts, a triangular frame ensures stable placement and reduces the falling risk, clamping block springs provide clamping force and have the buffering function, and the rubber contacts at the outer ends of clamping strip blocks ensure safe contact; the outer gear ring and the straight gear achieve synchronous movement, the clamping precision is enhanced, the overall coordination is improved through the design of the sliding sleeve base and the connecting rod, it is ensured that the device stably moves, the device adapts to wafers of different sizes, and the protection function is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer transport device. Background Art

[0002] Semiconductors are materials with electrical conductivity properties between conductors and insulators. They play a vital role in modern electronic technology and are widely used in various electronic devices, such as computers, mobile phones, televisions, sensors and more. During the transportation of semiconductor wafers, there may be equipment failures and unexpected power outages, which may cause the pneumatic suction cup to fail, and the handling device to lose the adsorption effect on the wafer chip, causing the wafer to fall off during the transportation process. In addition, existing semiconductor wafer handling devices lack the ability to cope with external vibrations, and the wafers slip during the transportation process, which can easily cause damage to the wafers and affect the accurate placement of the wafer chips. Therefore, the present invention proposes a wafer handling device to solve the problems mentioned in the above background technology. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a wafer transport device.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A wafer handling device comprises a handling track, a device seat is arranged on the handling track, a round seat is arranged on the lower side of the device seat, a pneumatic suction cup is arranged under the round seat, a plurality of clamping blocks are arranged on the circumference of the round seat, the lower side of the clamping block is rotatably connected with two left and right clamping strip blocks, a rubber contact is arranged on the lower side of the outer end of the clamping strip block, a toothed roller is rotatably connected to the rear side of the clamping block, a torsion spring is arranged at the toothed roller transition, an end face toothed ring is arranged on the upper side of the plurality of toothed rollers, the end face toothed ring is rotatably connected to the round seat, the pneumatic suction cup is responsible for adsorbing and handling the wafer, the rubber contact can protect the wafer surface, and the combination of the toothed roller and the torsion spring provides an effective rotation mechanism;

[0006] A number of support rods are evenly arranged on the upper side of the round seat, and the support rods are rotatably connected to the upper side of the round seat. Balance rings are arranged on the upper ends of the support rods, and sliders are rotatably connected to the upper ends of the support rods, and the sliders slide inward and outward on the lower side of the balance rings. A tripod is arranged on the upper side of the balance ring, and the tripod is located on the lower side of the transport track. The design of the support rods and the balance rings enhances the stability of the entire device, and the tripod is located on the lower side of the transport track, which may play a role in further supporting and stabilizing the wafer.

[0007] Preferably, an external toothed ring rotatably connected to the round seat is provided on the upper side of several of the clamping blocks, a spur gear meshing with the external toothed ring is provided on the outer side of the external toothed ring, the spur gear is rotatably connected to the round seat, and a tooth groove meshing with the spur gear is provided on one side of the clamping block, and a driving device fixedly connected to the external toothed ring is installed inside the round seat. The combination of the external toothed ring and the spur gear can achieve more efficient transmission and ensure that the clamping block can move in a synchronous manner.

[0008] Preferably, a number of slide grooves corresponding to the clamping block are evenly opened inside the round seat, and a spring is arranged in the slide groove, and one end of the spring is fixedly connected to the clamping block. The arrangement of the slide groove and the spring ensures that the clamping block can move freely within a certain range, and at the same time, the clamping force is provided by the spring to ensure the safety of the wafer.

[0009] Preferably, an external tooth surface is provided on the outside of the clamping block transition point, and an end face gear connected to the clamping block is provided on the outside of the external tooth surface. The end face gear is meshed with both the upper and lower external tooth surfaces on the front side, and the end face gear is fixedly connected to the corresponding gear roller on the rear side.

[0010] Preferably, the gear roller is meshed with the upper end face gear ring, and a slide block is rotatably connected to the rear end of the gear roller, and the slide block slides inside and outside the round seat.

[0011] Preferably, a spur gear 1 rotatably connected to the round seat is provided on the upper side of the several support rods, a spur gear 2 is fixed on one side of the support rod transition, and the spur gear 1 is meshed with the spur gear 2 on the lower side, and a driving device fixedly connected to the several spur gears 1 is installed on the round seat.

[0012] Preferably, a plurality of inclined blocks are fixed on the upper side of the end face gear ring, and a lever is fixed on one end of the spur gear, the lever corresponds to the inclined surfaces of the plurality of inclined blocks, and the cooperation between the lever and the inclined blocks can realize precise clamping and releasing actions.

[0013] Preferably, a plurality of arc rods penetrating the support rods are fixed on the upper side of the round seat, and a second spring located between the support rod and the round seat is sleeved around the arc rods. The upper and lower ends of the second spring are respectively fixedly connected to the round seat and the support rod. The arc rods can improve the stability of the entire device and play a certain buffering role during transportation.

[0014] Preferably, the tripod is composed of a plurality of bars, the ends of the bars are rotatably connected to each other, and a torsion spring is provided at the transition between the ends of the bars, and a plurality of sliding sleeve seats sliding on the transport track are provided on both sides of the device seat, and connecting rods are rotatably connected to the left and right sides of the lower sides of the sliding sleeve seats, and the lower ends of the connecting rods are connected to a sliding shaft sliding inside the tripod bars, and a torsion spring is provided at the transition between the connecting rod and the sliding sleeve seat and the sliding shaft. The setting of the sliding sleeve seat and the connecting rod enhances the overall movement coordination, so that the entire device can move smoothly on the track.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention adopts pneumatic suction cup as the main adsorption element to ensure the stability and flexibility of the wafer during the handling process. The pneumatic system can quickly adjust the adsorption force to adapt to different handling conditions. The rubber contact design under the clamp block can effectively disperse the contact pressure to avoid scratching or damage to the wafer surface, thereby improving dynamic stability. At the same time, the combination of the gear roller and the torsion spring forms an effective rotation mechanism, which keeps the clamp block stable and reduces vibration during dynamic handling. In addition, the design of the support rod and the balance ring provides additional support, adapts to the change of the center of gravity of the wafer through the sliding of the slider, and enhances the balance of the overall device;

[0017] 2. The tripod design of the present invention provides additional support for the wafer, ensuring that it does not tilt or slide during placement, reducing the risk of accidental falling off. At the same time, the spring 1 inside the clamp block provides a clamping force, ensuring that the clamp block has a certain elasticity when clamping the wafer to adapt to the slight movement of the wafer. In addition, the arc rod and spring 2 arranged on the round seat have a buffering function, which can reduce the impact when placing the wafer and ensure the stability of the wafer;

[0018] 3. The rubber contact design at the outer end of the clamping block of the present invention ensures safe contact with the edge of the wafer during clamping, reducing the risk of accidental falling off of the wafer chip. The combination of the outer gear ring and the spur gear realizes the synchronous movement of the clamping block, ensuring the accuracy of the clamping and releasing operations, and further ensuring the safety of the wafer during transportation and placement. The sliding sleeve and connecting rod design on both sides of the device seat enhance the overall movement coordination, allowing the entire device to move smoothly on the track, effectively preventing wafer instability caused by uneven force distribution. The free movement design of the clamping block and the efficient transmission mechanism of the gear roller ensure that the clamping block can adapt to wafers of different sizes, enhancing the protection function during transportation and placement.

[0019] In summary, the wafer handling device uses pneumatic suction cups to improve stability and flexibility during the handling process. The pneumatic system quickly adjusts the adsorption force. The rubber contact design effectively disperses the contact pressure, avoids damage to the wafer surface, and enhances dynamic stability. The tripod design ensures that it does not tilt during placement, reducing the risk of accidental falling off. At the same time, the internal spring of the clamp block provides the necessary clamping force, and the buffering function further ensures the stability of the wafer. The rubber contacts at the outer ends of the clamp block ensure safe contact and reduce the risk of chip falling off. The external tooth ring is combined with the spur gear to achieve synchronous movement of the clamp block, ensuring precise clamping and release. The sliding sleeve and connecting rod design enhance the overall movement coordination, ensure smooth movement of the device, adapt to wafers of different sizes, and enhance the protection function of handling and placement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a wafer handling device proposed by the present invention Figure 1 ;

[0021] Figure 2 A schematic diagram of the structure of a wafer handling device proposed by the present invention Figure 2 ;

[0022] Figure 3 A schematic diagram of the connection structure of a device seat in a wafer handling device proposed by the present invention Figure 1 ;

[0023] Figure 4 This is a schematic diagram of the bottom structure of a device seat in a wafer handling device proposed by the present invention;

[0024] Figure 5 A schematic diagram of the side structure of a device seat in a wafer handling device proposed by the present invention;

[0025] Figure 6 A schematic diagram of the connection structure of a device seat in a wafer handling device proposed by the present invention Figure 2 ;

[0026] Figure 7 A schematic diagram of the connection structure of a clamping block in a wafer handling device proposed by the present invention;

[0027] Figure 8 The present invention is a schematic structural diagram of an end face gear ring in a wafer handling device.

[0028] In the figure: 1. transport track; 101. sliding seat; 102. connecting rod; 2. device seat; 3. round seat; 4. pneumatic suction cup; 5. balance ring; 6. tripod; 7. end face gear ring; 8. slide block; 9. gear roller; 10. clamping block; 11. clamping block; 12. external tooth surface; 13. end face gear; 14. oblique block; 15. support rod; 16. spur gear one; 17. arc rod; 18. spring one; 19. spring two; 20. rubber contact; 21. external gear ring; 22. slider; 23. spur gear two; 24. lever; 25. spur gear. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] Reference Figure 1-8A wafer handling device comprises a handling track 1, a device seat 2 is arranged on the handling track 1, a round seat 3 is arranged on the lower side of the device seat 2, a pneumatic suction cup 4 is arranged under the round seat 3, a plurality of clamping blocks 10 are arranged on the circumference of the round seat 3, and two left and right clamping strips 11 are rotatably connected to the lower side of the clamping block 10, and a rubber contact 20 is arranged on the lower side of the outer end of the clamping strip 11. After the wafer chip is initially adsorbed and fixed by the pneumatic suction cup 4, the rubber contact 20 at the outer end of the clamping strip 11 is close to the side of the wafer by unfolding the clamping blocks 10 on both sides, so as to assist in fixing the wafer chip and avoid the wafer from being separated due to accidental power failure or equipment failure during the wafer handling process;

[0031] Furthermore, referring to Figure 3 , 6 , an outer toothed ring 21 rotatably connected to the round seat 3 is arranged on the upper side of the plurality of clamping blocks 10, a spur gear 25 meshing with the outer toothed ring 21 is arranged on the outer side thereof, the spur gear 25 is rotatably connected to the round seat 3, and a tooth groove meshing with the spur gear 25 is arranged on one side of the clamping block 10, and a driving device fixedly connected to the outer toothed ring 21 is installed inside the round seat 3. The clamping range of the rubber contact 20 can be adjusted according to the size of the wafer chip being transported, which can be achieved by adjusting the inner and outer positions of the clamping block 10. The specific implementation method is to start the driving device inside the round seat 3, the driving device drives the connected outer toothed ring 21 to rotate, the outer toothed ring 21 drives the outer meshing spur gear 25 to rotate, and the spur gear 25 meshes with the tooth groove, so that the clamping block 10 moves outward. Or move inward, a number of slide grooves corresponding to the clamping block 10 are evenly opened inside the round seat 3, and a spring 18 is arranged in the slide groove, and one end of the spring 18 is fixedly connected to the clamping block 10. Due to the continuous elastic force of the spring 18, the clamping block 10 always maintains the tendency of the inner center, and the rear side of the clamping block 10 is rotatably connected with a gear roller 9, and a torsion spring is arranged at the transition of the gear roller 9. An end face gear ring 7 is arranged on the upper side of a number of gear rollers 9, and the end face gear ring 7 is rotatably connected to the round seat 3, and the gear roller 9 is meshed with the upper side end face gear ring 7, and the rear end of the gear roller 9 is rotatably connected with a slide block 8, and the slide block 8 slides inside and outside the round seat 3, and the gear roller 9 and the upper side end face gear ring 7 are always kept in meshing state, and the slide block 8 connected with the gear roller 9 slides inside and outside the round seat 3;

[0032] Furthermore, referring to Figure 3, a number of struts 15 are evenly arranged on the upper side of the round seat 3, the struts 15 are rotatably connected to the upper side of the round seat 3, a balance ring 5 is arranged on the upper ends of the struts 15, a slider 22 is rotatably connected to the upper ends of the struts 15, and the slider 22 slides inside and outside on the lower side of the balance ring 5, and a spur gear 16 rotatably connected to the round seat 3 is arranged on the upper sides of the struts 15, a number of inclined blocks 14 are fixed on the upper side of the end face gear ring 7, a lever 24 is fixed at one end of the spur gear 16, and the lever 24 corresponds to the inclined surfaces of the several inclined blocks 14, and a driving device fixedly connected to the several spur gears 16 is installed on the round seat 3, and the spur gear 16 connected to the round seat 3 is driven to rotate, and the spur gear 16 drives the lever 24 connected to one side to rotate, and the lever 24 squeezes the corresponding inclined block 14 through the inclined surface, so that the end face gear ring 7 on the round seat 3 is squeezed and deviated to rotate, and the rotating end face gear ring 7 drives the gear roller 9 meshing on the lower side to rotate;

[0033] Furthermore, referring to Figure 6 , an outer tooth surface 12 is arranged on the outer side of the clamping strip block 11 at the transition point, and an end face gear 13 connected to the clamping block 10 is arranged on the outer side of the outer tooth surface 12, and the end face gear 13 is meshed with the upper and lower outer tooth surfaces 12 on the front side, and the end face gear 13 is fixedly connected to the corresponding gear roller 9 on the rear side, and the above-mentioned driven gear roller 9 drives the end face gear 13 connected to the front end to rotate, and the end face gear 13 rotates toward the two centers through the meshing outer tooth surface 12, and the rubber contact 20 releases the contact with the edge of the wafer chip. Due to the action of the torsion spring at the transition point of the gear roller 9, the two clamping strip blocks 11 are in an unfolded state, that is, the rubber contact 20 at the outer end of the clamping strip block 11 always keeps close to the edge of the wafer chip;

[0034] Furthermore, referring to Figure 5 , a spur gear 23 is fixed on one side of the connecting part of the support rod 15, and the spur gear 16 is meshed with the spur gear 23 on the lower side, and a plurality of arc rods 17 penetrating the support rod 15 are fixed on the upper side of the round seat 3, and a spring 29 is sleeved on the circumference of the arc rod 17 and located between the support rod 15 and the round seat 3, and the upper and lower ends of the spring 29 are respectively fixedly connected to the round seat 3 and the support rod 15. When the above-mentioned spur gear 16 rotates, the spur gear 16 drives the spur gear 23 meshed on the lower side, and the spur gear 23 drives the connected support rod 15 to rotate, and the support rod 15 deflects toward the above, thereby supporting the upper balance ring 5, and the tripod 6 on the balance ring 5 contacts the lower side of the upper transport track 1, so that the wafer transport device is in close contact with the transport track 1 at this time. At this time, because the above-mentioned rubber contact 20 releases the contact with the edge of the wafer, the wafer transport structure is stable at this time, and the pneumatic suction cup 4 is closed to achieve stable placement of the wafer after transport;

[0035] Furthermore, referring to Figure 1-3A tripod 6 is arranged on the upper side of the balance ring 5, and the tripod 6 is located on the lower side of the transport track 1. The tripod 6 is composed of a plurality of bars, and the ends of the plurality of bars are rotatably connected to each other, and a torsion spring is arranged at the transition of the ends of the bars. A plurality of sliding sleeve seats 101 sliding on the transport track 1 are arranged on both sides of the device seat 2, and the lower side of the sliding sleeve seat 101 is rotatably connected to the left and right sides of the connecting rod 102, and the lower end of the connecting rod 102 is transferred to a sliding shaft sliding inside the tripod 6 bar, and a torsion spring is arranged at the transition between the connecting rod 102, the sliding sleeve seat 101 and the sliding shaft, and the above-mentioned support rod During the upward rotation of 15, the balance ring 5 is squeezed and moved upward. At this time, the sliding sleeve seat 101 and the connecting rod 102 structure between the balance ring 5 and the conveying track 1 are also squeezed and stabilized, keeping the height between the conveying structure and the semicircular track close to ensure the stable placement of the conveyed wafer. When conveying the wafer chip, the pneumatic suction cup 4 always maintains the adsorption of the wafer chip below. At the same time, several rubber contacts 20 on the peripheral side are close to the edge of the wafer chip, the upper balance ring 5, the lower support rod 15 structure, and the upper tripod 6 structure to ensure the dynamic stability of the wafer during conveying.

[0036] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer transport device, comprising a transport track (1), characterized in that: The transport track (1) is provided with a device seat (2), a round seat (3) is installed on the lower side of the device seat (2), a pneumatic suction cup (4) is installed below the round seat (3), a plurality of clamping blocks (10) are arranged on the circumference of the round seat (3), the lower side of the clamping block (10) is rotatably connected to two left and right clamping strip blocks (11), the lower side of the outer end of the clamping strip block (11) is provided with a rubber contact (20), the rear side of the clamping block (10) is rotatably connected to a toothed roller (9), the upper side of the plurality of toothed rollers (9) is provided with an end face toothed ring (7), and the end face toothed ring (7) is rotatably connected to the round seat (3); A plurality of support rods (15) are evenly arranged on the upper side of the round seat (3), and the support rods (15) are rotatably connected to the upper side of the round seat (3). A balance ring (5) is arranged on the upper ends of the plurality of support rods (15). A slider (22) is rotatably connected to the upper ends of the support rods (15), and the slider (22) slides inward and outward on the lower side of the balance ring (5). A tripod (6) is arranged on the upper side of the balance ring (5), and the tripod (6) is located on the lower side of the transport track (1).

2. The wafer transport device according to claim 1, characterized in that: An outer toothed ring (21) rotatably connected to the round seat (3) is arranged on the upper side of the plurality of clamping blocks (10); a spur gear (25) meshing with the outer toothed ring (21) is arranged on the outer side; the spur gear (25) is rotatably connected to the round seat (3); and a tooth groove meshing with the spur gear (25) is arranged on one side of the clamping block (10).

3. The wafer transport device according to claim 1, characterized in that: A plurality of slide grooves corresponding to the clamping block (10) are evenly arranged inside the round seat (3), a spring (18) is arranged in the slide groove, and the outer end of the spring (18) is fixedly connected to the clamping block (10).

4. The wafer transport device according to claim 1, characterized in that: An external tooth surface (12) is arranged on the outside of the connecting part of the clamping bar block (11), and an end face gear (13) connected to the clamping block (10) is arranged on the outside of the external tooth surface (12). The end face gear (13) is meshed with both the upper and lower external tooth surfaces (12) on the front side, and the end face gear (13) is fixedly connected to the corresponding tooth roller (9) on the rear side.

5. The wafer transport device according to claim 1, characterized in that: The toothed roller (9) is meshed with the upper end face toothed ring (7), and the rear end of the toothed roller (9) is rotatably connected to a slide block (8), which slides inside and outside the round seat (3).

6. The wafer transport device according to claim 1, characterized in that: The upper sides of the plurality of support rods (15) are all provided with a spur gear 1 (16) rotatably connected to the round seat (3), and a spur gear 2 (23) is fixed on one side of the connecting part of the support rod (15), and the spur gear 1 (16) is meshed with the spur gear 2 (23) on the lower side.

7. The wafer transport device according to claim 1 or 6, characterized in that: A plurality of inclined blocks (14) are fixed on the upper side of the end face gear ring (7), and a shifting rod (24) is fixed on one end of the spur gear (16), wherein the shifting rod (24) corresponds to the inclined surfaces of the plurality of inclined blocks (14).

8. The wafer transport device according to claim 1, characterized in that: A plurality of arc rods (17) penetrating the support rod (15) are fixed on the upper side of the round seat (3); a second spring (19) located between the support rod (15) and the round seat (3) is sleeved around the arc rod (17); the upper and lower ends of the second spring (19) are respectively fixedly connected to the round seat (3) and the support rod (15).

9. The wafer transport device according to claim 1, characterized in that: The tripod (6) is composed of a plurality of bars, the ends of the plurality of bars are rotatably connected to each other, and a torsion spring is provided at the transition point of the bar ends. A plurality of sliding sleeve seats (101) sliding on the transport track (1) are provided on both sides of the device seat (2), and the lower side of the sliding sleeve seat (101) is rotatably connected to the left and right sides thereof. The lower end of the connecting rod (102) is connected to a sliding shaft sliding inside the bars of the tripod (6), and a torsion spring is provided at the transition point between the connecting rod (102), the sliding sleeve seat (101) and the sliding shaft.

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