Space optical camera focal plane and electric control assembly capable of preventing electronic assembly from causing molecular contamination to target surface of detector and assembly process method of space optical camera focal plane and electric control assembly

Abstract

The invention relates to a space optical camera focal plane and electric control assembly and an assembly process method thereof, in particular to a space optical camera focal plane and electric control assembly capable of preventing molecular contamination of an electronic assembly to a detector target surface and an assembly process method thereof. The problem that an existing assembly is difficult to meet the detector target surface molecular pollution protection requirement and the space load integration requirement at the same time is solved. The assembly comprises a focal plane assembly and an electric control assembly from front to back. The focal plane assembly comprises a front panel, a focal plane assembly shell which forms a cavity with the front panel, and a detector welding front assembly, a focal plane circuit board and a heat transfer plate which are arranged in the cavity from front to back; the detector welding front assembly comprises a detector base, a detector pressing plate and a detector arranged in an inner hole of the detector base from back to front; the rear end surface of the detector and the step surface of the inner hole of the detector base as well as the front end surface of the detector welding front assembly and the front panel are peripherally sealed; the electric control assembly shell and the focal plane assembly shell define a communicated cavity.

Description

Technical Field

[0001] The present invention relates to a focal plane and electric control component of a space optical camera and an assembly process method thereof, and in particular to a focal plane and electric control component of a space optical camera and an assembly process method thereof which can prevent electronic components from causing molecular contamination to a detector target surface. Background Art

[0002] The focal plane assembly is used for imaging in space optical cameras and is one of the important components of space optical cameras. The imaging devices in the focal plane assembly, such as CMOS, CCD detectors, etc., have very high requirements for contamination control on their target surfaces. In addition to the need to control large particle pollution such as dust, it is also necessary to control molecular contamination. Molecular contamination mainly refers to organic molecules and water molecules volatilized from organic materials in other external payloads and electronic components inside the space optical camera itself in the vacuum and low temperature environment on orbit. Since the operating temperature of the detector is usually lower than the temperature of the electronic components, molecular contamination is very easy to deposit on the target surface of the detector. If molecular contamination is deposited on the target surface of the detector, it will cause transmission energy loss, thereby affecting the use effect. This situation is more obvious in the ultraviolet band, and ultraviolet cameras are much more sensitive to molecular contamination than visible light cameras. In the ultraviolet band, when the molecular contamination level is 2.5mg / m 2 When the transmission energy loss in the ultraviolet band is about 10%, while in the visible light band with the same molecular contamination level, the transmission energy loss is usually 0.5% to 2%. Therefore, in the process of developing space optical cameras, it is particularly important to take into account how to prevent molecular contamination of the detector target surface in space optical cameras.

[0003] The closed configuration designed in the current relevant literature can prevent external molecular contamination of the space optical camera from entering the detector target surface to a certain extent, but it cannot prevent the molecular contamination volatilized by the electronic components of the focal plane assembly inside the space optical camera. In order to reduce the source of molecular contamination, the electronic components in the existing focal plane assembly usually only have the focal plane circuit board. The remaining electronic components and electronic control components in the traditional focal plane assembly except the focal plane circuit board are combined into an electronic control box, which is installed on the outside of the space optical camera, and the focal plane assembly is connected to the electronic control box through cables. However, the focal plane and electronic control components of this configuration are difficult to meet the increasingly stringent integrated and lightweight application requirements for space payloads. Summary of the invention

[0004] The purpose of the present invention is to solve the technical problem that the existing configuration of the focal plane and electronic control components of a space optical camera is difficult to simultaneously meet the requirements of molecular contamination protection of the detector target surface and the application requirements of integration and lightweight of space payloads, and to provide a space optical camera focal plane and electronic control components and an assembly process method thereof that can prevent electronic components from causing molecular contamination to the detector target surface.

[0005] See alsoFigure 1 The concept of the present invention is that a space optical camera generally includes an optical component, a focal plane component, and an electronic control component. The present invention completely isolates the target surface 1091 of the detector 109 in the focal plane component 01 from the rear circuit board, and the target surface 1091 of the detector 109 and the front optical component 03 in the space optical camera are located in the same front cavity (i.e. Figure 1 The front end cavity A1 shown in FIG. 1 ) and the rear end circuit board is located in another cavity at the rear end (i.e. Figure 1 The rear end cavity A2 is shown in the figure, and the rear end circuit board includes all the circuit boards in the traditional focal plane assembly including the focal plane circuit board 114 and the traditional electronic control assembly; then the focal plane circuit board 114 and the remaining circuit boards are connected through the circuit board connectors; in this way, not only the molecular contamination volatilized by the electronic components in the focal plane and the electronic control assembly in the vacuum low temperature environment cannot reach the target surface 1091 of the detector 109, and will not affect the imaging, but also the circuit boards required for the space optical camera are integrated into the whole machine, without the need for an external electronic control box, thereby improving the integration and lightweight of the whole machine.

[0006] In order to solve the above technical problems and complete the above inventive concept, the technical solution adopted by the present invention is:

[0007] A space optical camera focal plane and electric control assembly that can prevent electronic components from causing molecular contamination to the detector target surface, and its special features are:

[0008] It includes a focal plane assembly and an electric control assembly which are arranged in sequence from front to back;

[0009] The focal plane assembly comprises a front panel, a focal plane assembly housing, a detector welding front assembly, a focal plane circuit board and a heat transfer plate;

[0010] The front side of the front panel is used to connect the optical components in the space optical camera, and a light hole is arranged in the center of the panel surface; the focal plane component shell is arranged on the rear side of the front panel, and the two are detachably connected to form a cavity with a rear end opening; the detector welding front assembly, the focal plane circuit board and the heat transfer plate are arranged in sequence from front to back in the cavity surrounded by the front panel and the focal plane component shell;

[0011] The detector assembly before welding comprises a detector base and a detector pressure plate which are coaxially arranged from back to front, and a detector which is coaxially arranged in the stepped inner hole of the detector base; the detector pressure plate is detachably sealed and fixedly connected to the detector base, so that the rear end face of the detector is closely attached to the stepped surface of the stepped inner hole of the detector base, so that the two surfaces are circumferentially sealed and connected; a second light hole is arranged at the center of the detector pressure plate surface; the detector is a photoelectric detector after the target surface protection glass in front of the photoelectric detector itself is removed;

[0012] The detector pre-welding assembly is detachably fixedly connected to the focal plane circuit board and the front panel, and the pins on the rear end surface of the detector extend out of the rear end surface of the detector base and are electrically welded to the focal plane circuit board. The front end surface of the detector pre-welding assembly and the front panel are circumferentially sealed to isolate the target surface of the detector in the front end cavity surrounded by the detector pre-welding assembly, the front panel and the housing of the optical component.

[0013] The heat transfer boss on the plate surface on one side in front of the lower end of the heat transfer plate passes through the through slot provided on the focal plane circuit board and contacts the rear end surface of the detector to transfer heat; the upper end of the heat transfer plate extends out from the notch provided on the front end of the upper part of the focal plane component housing and is used for externally connecting a heat pipe; the heat transfer plate is detachably connected to the front panel;

[0014] The electronic control component includes an electronic control component housing and a plurality of electronic control component circuit boards stacked in the housing along the front-to-back direction; each adjacent two electronic control component circuit boards and the electronic control component circuit board at the front end and the focal surface circuit board are connected through a circuit board connector; the electronic control component housing and the focal surface component outer shell form an interconnected cavity.

[0015] Furthermore, in order to facilitate thermal control, it also includes a heat transfer plate insulation pad 1, a heat transfer plate insulation pad 2 and a heat insulation plate;

[0016] The heat transfer plate insulation pad 1 and the heat transfer plate insulation pad 2 are respectively arranged on the front and rear sides of one side of the upper end of the heat transfer plate, and are used to separate the heat transfer plate from the front panel and the focal plane component shell, so as to reduce the heat transferred from the heat transfer plate to the front panel and the focal plane component shell;

[0017] The heat insulation plate is arranged on one side of the rear of the heat transfer plate and is located in the inner cavity of the focal plane assembly housing and is detachably fixedly connected to the focal plane assembly housing;

[0018] The heat insulation board is provided with a via hole through which a circuit board connector for connecting the front-end electronic control component circuit board and the focal surface circuit board passes.

[0019] Furthermore, in order to ensure the strength of the detector base while having a heat-insulating effect, the detector base is made of titanium alloy TC4 material; in order to enable the heat transfer plate to better export heat when the temperature of the detector is too high and to be able to remove molecular contamination deposited on the target surface of the detector by baking, the heat transfer plate is made of copper alloy or aluminum alloy; the gap where the heat transfer boss contacts the rear end surface of the detector is coated with thermal conductive silicone rubber; a heating plate is attached to the heat transfer plate to bake the detector and remove molecular contamination deposited on the target surface of the detector; in order to enable the heat insulation plate to have a better heat-insulating effect, the heat insulation plate is made of polyimide material.

[0020] Furthermore, in order to achieve better effects in different bands, the present invention provides preferred solutions for the visible light band and the ultraviolet band respectively:

[0021] For the visible light band, in order to achieve a better anti-molecular contamination effect when used in the visible light band, the detector pre-welding assembly further includes anti-contamination glass 2, an anti-contamination glass pressure plate and anti-contamination glass 1;

[0022] The material, structure and size of the second anti-pollution glass are the same as those of the target surface protection glass; the second anti-pollution glass is arranged in the second light hole and is glued and connected to the front end surface of the detector;

[0023] The outer peripheral surface and the inner hole of the anti-pollution glass pressing plate are both stepped in shape with a larger front and a smaller rear; the rear end of the anti-pollution glass pressing plate is inserted into the second light-through hole, and the front end flange of the anti-pollution glass pressing plate is detachably sealed and fixedly connected with the detector pressing plate, so that the rear end surface of the anti-pollution glass pressing plate is closely attached to the front surface of the second anti-pollution glass, thereby pressing the second anti-pollution glass tightly;

[0024] The anti-pollution glass is fixedly arranged at the front end of the inner hole of the anti-pollution glass pressing plate, and its rear end surface is in contact with the step surface in the inner hole.

[0025] Furthermore, for the visible light band, in order to ensure a certain coaxiality and to easily install the detector into the inner hole of the detector base, and to achieve a better sealing effect, the detector pre-welding assembly further includes a second sealing ring, a third sealing ring, and a fourth sealing ring;

[0026] The gap between the outer circumference of the detector and the inner circumference corresponding to the stepped inner hole of the detector base is 0.05 mm to 0.1 mm;

[0027] A second sealing ring groove is provided at a position where the front end surface of the detector pressure plate contacts the rear surface of the front end flange of the anti-pollution glass pressure plate; the second sealing ring is provided in the second sealing ring groove, and the front end flange of the anti-pollution glass pressure plate is sealed and connected to the detector pressure plate through the second sealing ring;

[0028] A sealing ring groove three is provided at a position where the front end surface of the detector base contacts the rear end surface of the detector pressing plate; the sealing ring three is arranged in the sealing ring groove three to seal and connect the detector pressing plate to the detector base;

[0029] A sealing ring groove 4 is provided on the step surface of the step-shaped inner hole of the detector base; the sealing ring 4 is arranged in the sealing ring groove 4, so that the rear end surface of the detector and the step surface of the step-shaped inner hole of the detector base are circumferentially sealed and connected;

[0030] The second, third and fourth sealing rings are all metal sealing rings. The second, third and fourth sealing rings are metal sealing rings, which can ensure the sealing effect while avoiding the vacuum aging and volatilization problems when using rubber sealing rings, thereby avoiding the problem of rubber sealing rings volatilizing and polluting the detector with vacuum organic matter.

[0031] For the ultraviolet band, in order to achieve better heat insulation effect when used in the ultraviolet band, especially the extreme ultraviolet band, and avoid excessive temperature affecting the performance of the detector, the detector assembly before welding also includes a first heat insulation pad; the first heat insulation pad is used to replace the above-mentioned anti-pollution glass 2, the anti-pollution glass pressure plate and the anti-pollution glass 1 as a whole;

[0032] The first thermal insulation pad is coaxially arranged on the front side of the detector pressure plate and is detachably sealed and fixedly connected to the detector pressure plate;

[0033] The first thermal insulation pad is provided with a light-through hole three.

[0034] Furthermore, for the ultraviolet band, the detector assembly before welding also includes a sealing ring 2, a sealing ring 3 and a sealing ring 4;

[0035] The gap between the outer circumference of the detector and the inner circumference corresponding to the stepped inner hole of the detector base is 0.05 mm to 0.1 mm;

[0036] A second sealing ring groove is provided at a position where the front end surface of the detector pressure plate contacts the rear end surface of the first thermal insulation pad; the second sealing ring is provided in the second sealing ring groove, and the first thermal insulation pad is sealed and connected to the detector pressure plate through the second sealing ring;

[0037] A sealing ring groove three is provided at a position where the front end surface of the detector base contacts the rear end surface of the detector pressing plate; the sealing ring three is arranged in the sealing ring groove three to seal and connect the detector pressing plate to the detector base;

[0038] A sealing ring groove 4 is provided on the step surface of the step-shaped inner hole of the detector base; the sealing ring 4 is arranged in the sealing ring groove 4, so that the rear end surface of the detector and the step surface of the step-shaped inner hole of the detector base are circumferentially sealed and connected;

[0039] The second sealing ring, the third sealing ring and the fourth sealing ring are all metal sealing rings.

[0040] Furthermore, it also includes a sealing ring 1;

[0041] The front panel is in the shape of a box cover with a first annular boss arranged around the upper edge of the rear side panel; the front and rear ends of the focal plane assembly housing are both open, and its front end is sleeved on the first annular boss and is detachably fixedly connected to the front panel to form a cavity with an opening at the rear end;

[0042] On a side panel surface behind the front panel, a second annular boss coaxial with the first annular boss is provided at a position inside the first annular boss, and the position and shape of the second annular boss match the position and shape of the front end face of the detector assembly before welding;

[0043] A sealing ring groove 1 is provided at a position where the rear end surface of the second annular boss contacts the front end surface of the detector assembly before welding; the sealing ring 1 is provided in the sealing ring groove 1 to circumferentially seal the front end surface of the detector assembly before welding and the front panel;

[0044] The first sealing ring is a metal sealing ring.

[0045] A second annular boss is arranged on the rear side of the front panel, which can ensure the size and shape tolerance during the processing. The sealing ring is a metal sealing ring. Similarly, while ensuring the sealing effect, it can avoid the vacuum aging and volatilization problems when using a rubber sealing ring, thereby avoiding the problem of the rubber sealing ring volatilizing and polluting the detector with vacuum organic matter.

[0046] Furthermore, in order to reduce the installation stress borne by the focal plane circuit board when installing, a plurality of trimming pads are also included;

[0047] The plurality of trimming pads are evenly distributed between the focal surface circuit board and the front panel along the four sides of the front side panel surface of the focal surface circuit board, the height of the trimming pads along the front-to-back direction is equal to the size of the gap between the focal surface circuit board and the front panel, and the focal surface circuit board, the trimming pads and the front panel are detachably fixedly connected; the trimming pads are used to reduce the installation stress borne by the focal surface circuit board when the focal surface circuit board is connected to the front panel.

[0048] At the same time, the present invention also provides a method for assembling the focal plane of a space optical camera and an electric control component, which can prevent the electronic component from causing molecular contamination to the detector target surface. The method is special in that it includes the following steps:

[0049] Step 1: All the parts to be assembled except the detector are subjected to vacuum degassing treatment;

[0050] Step 2: Assembling the detector and the parts to be assembled contained in the detector pre-welding assembly after the vacuum degassing treatment in step 1, thereby completing the assembly of the detector pre-welding assembly;

[0051] During the assembly process, the detector pressing plate is continuously polished until the rear end surface of the detector can be closely attached to the step surface of the step-shaped inner hole of the detector base;

[0052] Step 3: The detector pre-welding assembly assembled in step 2 is detachably fixedly mounted on the focal plane circuit board after the vacuum degassing treatment in step 1, and the pins on the rear end surface of the detector are electrically welded to the focal plane circuit board;

[0053] Step 4: The detector pre-welding assembly, which is detachably fixedly mounted on the focal plane circuit board and is completed by electrically welding the pins on the rear end face of the detector in step 3, is detachably fixedly connected to the front panel after the vacuum degassing treatment in step 1, and when connected, the front end face of the detector pre-welding assembly is circumferentially sealed to the front panel;

[0054] Step 5: Pass the heat transfer boss on the plate surface on the front side of the lower end of the heat transfer plate after the vacuum degassing treatment in step 1 through the through groove provided on the focal plane circuit board detachably fixedly connected to the front panel in step 4, so that the heat transfer boss contacts the rear end surface of the detector; then detachably fix the heat transfer plate to the front panel to complete the installation of the heat transfer plate;

[0055] Step 6: The focal plane assembly housing after the vacuum degassing treatment in step 1 is mounted on the heat transfer plate, the focal plane circuit board and the detector assembly before welding which are connected to the front panel in step 5, wherein the lower end of the heat transfer plate, the focal plane circuit board and the detector assembly before welding are located inside the focal plane assembly housing, and the upper end of the heat transfer plate extends out of the notch set at the front end of the upper part of the focal plane assembly housing for externally connecting the heat pipe; then the focal plane assembly housing is detachably fixedly connected to the front panel to complete the assembly of the focal plane assembly;

[0056] Step 7: Assemble the components to be assembled in the electronic control assembly after the vacuum degassing treatment in step 1 with the focal plane assembly assembled in step 6, specifically:

[0057] First, the electronic control component circuit boards to be assembled after the vacuum degassing treatment in step 1 and the focal surface circuit boards in the focal surface assembly assembled in step 6 are positioned through stoppers to form a stacked arrangement along the front-to-back direction;

[0058] Then, each adjacent two stacked electronic control component circuit boards and the electronic control component circuit board at the front end and the focal surface circuit board are connected through circuit board connectors, and each layer of electronic control component circuit boards and the focal surface circuit board are connected through studs;

[0059] Finally, the electronic control component housing after the vacuum degassing treatment in step 1 is mounted on the outside of the connected electronic control component circuit board, and the electronic control component housing is connected to the focal surface component housing in the focal surface component assembled in step 6;

[0060] Complete the assembly of the focal plane and electronic control components.

[0061] The beneficial effects of the present invention are:

[0062] (1) The focal plane and electronic control assembly of the space optical camera of the present invention can prevent the electronic assembly from causing molecular contamination to the detector target surface. On the one hand, the detector pressure plate and the detector base are detachably sealed and fixedly connected, the rear end face of the detector and the step face of the step-shaped inner hole of the detector base are circumferentially sealed, and the front end face of the detector pre-welding assembly and the front panel are circumferentially sealed. In this way, the target surface of the detector is isolated in the front end cavity surrounded by the detector pre-welding assembly, the front panel and the shell of the optical assembly, so that the target surface of the detector is located in a cavity different from the cavity where the focal plane circuit board and the electronic control assembly circuit board are located, so that the molecular contamination volatilized from the electronic components in the focal plane and the electronic control assembly in a vacuum low temperature environment cannot reach The detector target surface can be avoided to affect the imaging; on the other hand, in the present invention, each adjacent two electric control component circuit boards and the electric control component circuit board at the front end and the focal plane circuit board are connected through the circuit board connector, so that the circuit boards required for the space optical camera are integrated into the whole machine, and no external electric control box is required, thereby improving the integration and lightweight degree of the whole machine; therefore, the present invention simultaneously meets the requirements of molecular contamination protection of the detector target surface and the application requirements of integration and lightweight of space payloads; therefore, the present invention solves the technical problem that the existing configuration of the focal plane and the electric control component of the space optical camera is difficult to simultaneously meet the requirements of molecular contamination protection of the detector target surface and the application requirements of integration and lightweight of space payloads.

[0063] (2) The isolation structure design of the focal plane assembly in the present invention can effectively prevent internal and external molecular contamination from entering the front end cavity where the detector target surface is located from the rear end cavity where electronic components such as the focal plane circuit board and the electronic control component circuit board are located, and can effectively prevent molecular contamination from being deposited on the detector target surface.

[0064] (3) The present invention provides two preferred schemes for the focal plane and electronic control components of a space optical camera that can prevent electronic components from causing molecular contamination to the detector target surface. In the first preferred scheme, the detector assembly before welding preferably includes, in addition to the detector base, the detector pressure plate and the detector, anti-pollution glass 2, anti-pollution glass pressure plate and anti-pollution glass 1; the first preferred scheme is applicable to the visible light band, and when used in the visible light band, it has a better effect of preventing molecular contamination. In the second preferred scheme, the detector assembly before welding preferably includes, in addition to the detector base, the detector pressure plate and the detector, a first thermal insulation pad; the second preferred scheme is not only applicable to the visible light band, but also to the ultraviolet band, especially to the extreme ultraviolet band; the second preferred scheme has a better thermal insulation effect, and can better avoid excessive temperature and the impact on detector performance.

[0065] (4) In the present invention, metal sealing rings are preferably used for sealing, which can ensure the sealing effect while avoiding the vacuum aging and volatilization problems when using rubber sealing rings, and further avoid the problem of rubber sealing rings volatilizing and contaminating the detector in the vacuum.

[0066] (5) The present invention is provided with a heat transfer plate, and preferably also provided with a heat transfer plate insulation pad 1, a heat transfer plate insulation pad 2 and a heat insulation plate, so that the working temperature of the detector can be ensured more conveniently, better and more effectively; in addition, the present invention is preferably also provided with a heating plate pasted on the heat transfer plate, and the detector can be actively heated by the heating plate to remove molecular contamination attached to the target surface of the detector, thereby achieving a better anti-molecular contamination effect.

[0067] (6) The focal plane and electronic control components of the space optical camera of the present invention can prevent the electronic components from causing molecular contamination to the detector target surface, realize the physical isolation of the circuit board and the optical element, and can integrate all the circuit boards required for the space optical camera into the whole machine, without the need for an external electronic control box, thereby improving the integration and lightweight of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a schematic diagram of the inventive concept of the present invention;

[0069] Figure 2 is an exploded view of the focal plane assembly in Embodiment 1 of the present invention;

[0070] Figure 3 is an assembly diagram of the focal plane assembly in Embodiment 1 of the present invention;

[0071] Figure 4 This is a front view of the detector assembly before welding in Example 1 of the present invention;

[0072] Figure 5 is along Figure 4 Section view along line AA.

[0073] The descriptions of the numbers in the figure are as follows:

[0074] 01-focal plane assembly, 101-front panel, 102-sealing ring 1, 103-anti-pollution glass 1, 104-anti-pollution glass pressure plate, 105-sealing ring 2, 106-detector pressure plate, 107-anti-pollution glass 2, 108-sealing ring 3, 109-detector, 1091-target surface, 110-sealing ring 4, 111-detector base, 112-heat transfer plate insulation pad 1, 113-trimming pad, 114-focal plane circuit board, 115-heat transfer plate, 116-heat transfer plate insulation pad 2, 117-focal plane assembly housing, 118-thermal insulation board, 02-electric control assembly, 03-optical assembly, A1-front end cavity, A2-rear end cavity. DETAILED DESCRIPTION

[0075] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0076] See also Figure 1 The present invention discloses a focal plane and electric control component of a space optical camera capable of preventing electronic components from causing molecular contamination to a detector target surface, comprising a focal plane component 01 and an electric control component 02 arranged in sequence from front to back.

[0077] See also Figure 2 and Figure 3 , the focal plane assembly 01 includes a front panel 101, a focal plane assembly housing 117, a detector pre-welding assembly, a focal plane circuit board 114 and a heat transfer plate 115. The front side of the front panel 101 is used to connect the optical assembly 03 in the space optical camera, and a light through hole 1 is arranged in the center of the panel surface; the front panel 101 and the optical assembly 03 are also connected in a sealed manner, and the sealing groove can be arranged on the front panel 101 or the optical assembly 03. The focal plane assembly housing 117 is arranged on the rear side of the front panel 101, and the two are detachably connected to form a cavity with a rear end opening; the detector pre-welding assembly, the focal plane circuit board 114 and the heat transfer plate 115 are arranged in the cavity surrounded by the front panel 101 and the focal plane assembly housing 117 from front to back. See. Figure 4 and Figure 5 The detector assembly before welding includes a detector base 111 and a detector pressing plate 106 coaxially arranged from back to front, and a detector 109 coaxially arranged in the stepped inner hole of the detector base 111. The detector base 111 is used to place the detector 109 therein, and fix the detector 109 together with the detector pressure plate 106; in order to ensure a certain coaxiality and to easily install the detector 109 into the inner hole of the detector base 111, preferably, the gap between the outer circumference of the detector 109 and the inner circumference corresponding to the stepped inner hole of the detector base 111 is 0.05mm to 0.1mm; the detector pressure plate 106 is used to press and fix the detector 109, that is, by detachably sealingly connecting the detector pressure plate 106 and the detector base 111, the rear end face of the detector 109 is closely attached to the step surface of the stepped inner hole of the detector base 111, so that the two surfaces are circumferentially sealed and connected; a second light hole is provided in the center of the detector pressure plate 106; the above-mentioned detector 109 is a photoelectric detector after the target surface protection glass in front of its own target surface is removed. Figure 3 and Figure 1The detector assembly before welding is detachably connected to the focal plane circuit board 114 and the front panel 101, and the pins on the rear end surface of the detector 109 are extended out of the rear end surface of the detector base 111, and are electrically welded to the focal plane circuit board 114. The front end surface of the detector assembly before welding is circumferentially sealed with the front panel 101, which is used to isolate the target surface 1091 of the detector 109 in the front end cavity A1 surrounded by the detector assembly before welding, the front panel 101 and the shell of the optical component 03; the heat transfer boss on the side plate surface in front of the lower end of the heat transfer plate 115 passes through the through groove provided on the focal plane circuit board 114 and contacts with the rear end surface of the detector 109 to transfer heat; the upper end of the heat transfer plate 115 is extended out of the notch provided at the front end above the focal plane component shell 117, and is used to connect to an external heat pipe, which can export heat when the temperature of the detector 109 is too high; the heat transfer plate 115 is detachably connected to the front panel 101.

[0078] See also Figure 1 The above-mentioned electric control component 02 includes an electric control component shell and a plurality of electric control component circuit boards stacked in the electric control component shell along the front-to-back direction; each adjacent two electric control component circuit boards and the electric control component circuit board at the front end and the focal surface circuit board 114 are connected through circuit board connectors; the above-mentioned electric control component shell, the focal surface component shell 117, the front panel 101 and the detector welding front assembly form an interconnected rear end cavity A2.

[0079] The focal plane and the electronic control component of the space optical camera that can prevent the electronic components from causing molecular contamination to the detector target surface of the above-mentioned invention are suitable for space optical cameras of all bands, and because the ultraviolet band is more sensitive to organic molecular contamination than other bands, the focal plane and the electronic control component of the space optical camera that can prevent the electronic components from causing molecular contamination to the detector target surface of the present invention are particularly suitable for ultraviolet band imaging cameras. In order to make the focal plane and the electronic control component of the space optical camera that can prevent the electronic components from causing molecular contamination to the detector target surface of the present invention have better application effects when applied under different band conditions, the present invention has two preferred schemes, namely, corresponding to two embodiments, embodiment 1 and embodiment 2. The preferred scheme corresponding to embodiment 1 is applicable to the visible light band, and when it is used in the visible light band, it has a better effect of preventing molecular contamination. The preferred scheme corresponding to embodiment 2 is not only applicable to the visible light band, but also to the ultraviolet band, especially the extreme ultraviolet band; the preferred scheme corresponding to embodiment 2 has a better thermal insulation effect, which can better avoid excessive temperature and affect the performance of the detector. The difference between the above-mentioned embodiment 1 and embodiment 2 in the present invention is only that the structure of the assembly before the detector is welded is different.

[0080] Figure 4 and Figure 5The structure of the detector assembly before welding in Example 1 is shown in FIG. In Example 1, the detector assembly before welding includes a detector base 111 and a detector pressure plate 106 coaxially arranged from back to front, and a detector 109 coaxially arranged in the stepped inner hole of the detector base 111, and also includes an anti-pollution glass 2 107, an anti-pollution glass pressure plate 104, and an anti-pollution glass 1 103. The material, structure and size of the anti-pollution glass 107 are the same as those of the target surface protection glass of the photodetector itself, and the target surface protection glass of the photodetector itself is usually used instead; the anti-pollution glass 107 is arranged in the above-mentioned light-through hole 2 and is glued and connected to the front end surface of the detector 109; the anti-pollution glass pressure plate 104 is used to press the anti-pollution glass 107; the outer peripheral surface and the inner hole of the anti-pollution glass pressure plate 104 are both stepped, with the front end larger and the rear end smaller; the rear end of the anti-pollution glass pressure plate 104 is inserted into the above-mentioned light-through hole 2, and the front end flange of the anti-pollution glass pressure plate 104 is detachably sealed and fixedly connected with the detector pressure plate 106, so that the rear end surface of the anti-pollution glass pressure plate 104 is closely attached to the front surface of the anti-pollution glass 107, and the anti-pollution glass 107 is pressed; the anti-pollution glass 1 103 is fixedly arranged at the front end of the inner hole of the anti-pollution glass pressure plate 104, and its rear end surface is attached to the step surface in the inner hole, which is used to strengthen the protection against external pollutants during the circuit debugging stage. In the present embodiment 1, in order to achieve a better sealing effect, the detector pre-welding assembly further includes a sealing ring 2 105, a sealing ring 3 108 and a sealing ring 4 110. A sealing ring groove 2 is provided at a position on the front end surface of the detector pressure plate 106 that contacts the rear surface of the front end flange of the anti-pollution glass pressure plate 104; the sealing ring 2 105 is provided in the sealing ring groove 2, and the front end flange of the anti-pollution glass pressure plate 104 is sealed and connected to the detector pressure plate 106 through the sealing ring 2 105; a sealing ring groove 3 is provided at a position on the front end surface of the detector base 111 that contacts the rear end surface of the detector pressure plate 106; the sealing ring 3 108 is provided in the sealing ring groove 3, and the detector pressure plate 106 is sealed and connected to the detector base 111; A sealing ring groove four is provided on the step surface of the stepped inner hole of the detector base 111; the sealing ring four 110 is arranged in the sealing ring groove four, so that the rear end surface of the detector 109 and the step surface of the stepped inner hole of the detector base 111 are circumferentially sealed and connected; and in this embodiment 1, the sealing ring two 105, the sealing ring three 108 and the sealing ring four 110 are all metal sealing rings, so that while ensuring the sealing effect, the vacuum aging and volatilization problems when using rubber sealing rings can be avoided, and thus the occurrence of the problem of rubber sealing rings volatilizing and polluting the detector with vacuum organic matter can be avoided. Figure 2 and Figure 3 The structure of the focal plane assembly in Embodiment 1 is shown.

[0081] The difference between the second embodiment of the present invention and the first embodiment of the present invention is that the second anti-pollution glass 107, the anti-pollution glass plate 104 and the first anti-pollution glass 103 in the detector assembly before welding in the first embodiment are replaced by the first thermal insulation pad as a whole (since the structure of the second embodiment is similar to that of the first embodiment, the difference is only this point, so the relevant drawings of the second embodiment are not provided in the present invention), and then the first thermal insulation pad is coaxially arranged on the front side of the detector plate 106, and is detachably sealed and fixedly connected to the detector plate 106; the first thermal insulation pad is provided with a light hole 3. At this time, the second sealing ring groove is arranged at a position on the front end surface of the detector plate 106 that contacts the rear end surface of the first thermal insulation pad, and the second sealing ring 105 is arranged in the second sealing ring groove, and the first thermal insulation pad is sealed and connected to the detector plate 106 through the second sealing ring 105. In order to achieve a better thermal insulation effect, it is preferred that the thermal conductivity of the first thermal insulation pad is <1W / (m·K). In the second embodiment of the present invention, the first thermal insulation pad is made of polyimide material.

[0082] For convenient thermal control, see Figure 2 and Figure 3 The focal plane and electric control components of the space optical camera that can prevent the electronic components from causing molecular contamination to the detector target surface according to the first and second embodiments of the present invention preferably also include a heat transfer plate insulation pad 112, a heat transfer plate insulation pad 116 and a heat insulation board 118. The heat transfer plate insulation pad 112 and the heat transfer plate insulation pad 116 are respectively arranged on the front and rear sides of one side of the upper end of the heat transfer plate 115, and are used to separate the heat transfer plate 115 from the front panel 101 and the focal plane component housing 117, so as to reduce the heat transferred from the heat transfer plate 115 to the front panel 101 and the focal plane component housing 117; the heat insulation board 118 is arranged on the rear side of the heat transfer plate 115, and is located in the inner cavity of the focal plane component housing 117, and is detachably fixedly connected to the focal plane component housing 117; and a through hole is arranged on the heat insulation board 118, through which the circuit board connector for connecting the frontmost electric control component circuit board and the focal plane circuit board 114 passes. In the present embodiment 1 and embodiment 2, in order to ensure that the detector base 111 has strength and heat insulation function at the same time, the detector base 111 is made of titanium alloy TC4 material; in order to make the heat transfer plate 115 more effective in extracting heat when the temperature of the detector 109 is too high, the heat transfer plate 115 is made of copper alloy or aluminum alloy, and the gap between the above-mentioned heat transfer boss and the rear end surface of the detector 109 is coated with thermal conductive silicone rubber; in order to remove molecular contamination deposited on the target surface 1091 of the detector 109 by baking, a heating plate is attached to the heat transfer plate 115; in order to make the heat insulation plate 118 have better heat insulation effect, the heat insulation plate 118 is made of polyimide material.

[0083] See also Figure 2 and Figure 3In order to achieve a better circumferential sealing effect between the front end face of the above-mentioned detector assembly before welding and the front panel 101, the focal plane and electronic control components of the space optical camera that can prevent electronic components from causing molecular contamination to the detector target surface in Examples 1 and 2 of the present invention preferably also include a sealing ring 102. The front panel 101 is in the shape of a box cover with a first annular boss arranged around the upper edge of the rear side panel; the front and rear ends of the focal plane assembly housing 117 are both open, and its front end is mounted on the first annular boss and is detachably connected to the front panel 101 to form a cavity with an opening at the rear end; on the rear side panel of the front panel 101, a second annular boss coaxial with the first annular boss is arranged at a position inside the first annular boss, and the position and shape of the second annular boss match the position and shape of the front end face of the detector assembly before welding; a sealing ring groove 1 is arranged at a position on the rear end face of the second annular boss that contacts the front end face of the detector assembly before welding; the sealing ring 102 is arranged in the sealing ring groove 1 to circumferentially seal the front end face of the detector assembly before welding and the front panel 101; the second annular boss is arranged on the rear side panel of the front panel, which can make it easy to ensure the size and shape tolerances during the processing. In the present embodiment 1 and embodiment 2, the above-mentioned sealing ring 102 is a metal sealing ring; the sealing ring 102 adopts a metal sealing ring, which can also ensure the sealing effect while avoiding the vacuum aging and volatilization problems when using a rubber sealing ring, thereby avoiding the occurrence of the problem of the rubber sealing ring vacuum organic matter volatilization contaminating the detector. In the present embodiment 1 and embodiment 2, the above-mentioned sealing ring 102, sealing ring 2 105, sealing ring 3 108 and sealing ring 4 110 are all indium wire sealing rings; the width and depth of the above-mentioned sealing ring groove 1, sealing ring groove 2, sealing ring groove 3 and sealing ring groove 4 need to be designed according to the size of the corresponding sealing ring; the above-mentioned sealing ring 102, sealing ring 2 105 and sealing ring 3 108 are used for the circumferential sealing of the detector 109 to prevent organic pollutants generated by the circuit board from entering the front end cavity A1 where the target surface 1091 of the detector 109 is located from all sides; the sealing ring 4 110 is used for the back sealing of the detector 109 to prevent organic pollutants generated by the circuit board from entering the front end cavity A1 where the target surface 1091 of the detector 109 is located from the back of the detector 109.

[0084] In order to reduce the installation stress of the focal plane circuit board 114 during installation, see Figure 2 and Figure 3The focal plane and electric control components of the space optical camera that can prevent electronic components from causing molecular contamination to the detector target surface according to embodiments 1 and 2 of the present invention preferably also include a plurality of trimming pads 113. The plurality of trimming pads 113 are evenly distributed between the focal plane circuit board 114 and the front panel 101 along the four sides of the front side panel surface of the focal plane circuit board 114. The height of the trimming pads 113 along the front-to-back direction is equal to the size of the gap between the focal plane circuit board 114 and the front panel 101. The focal plane circuit board 114, the trimming pads 113 and the front panel 101 are detachably fixedly connected. After the trimming pads 113 are used, the installation stress borne by the focal plane circuit board 114 when the focal plane circuit board 114 is connected to the front panel 101 can be reduced.

[0085] At the same time, the present invention also provides a method for assembling the focal plane of a space optical camera and an electric control component, which can prevent the electronic component from causing molecular contamination to the detector target surface, and comprises the following steps:

[0086] Step 1: All the components to be assembled except the detector 109 are subjected to vacuum degassing treatment;

[0087] Step 2: Assembling the detector 109 and the parts to be assembled contained in the above detector pre-welding assembly after the vacuum degassing treatment in step 1, thereby completing the assembly of the detector pre-welding assembly;

[0088] During the assembly process, the detector pressing plate 106 is continuously polished until the rear end surface of the detector 109 can be closely attached to the step surface of the step-shaped inner hole of the detector base 111;

[0089] For this embodiment 1, the step 2 is specifically as follows: first, the anti-pollution glass 103 is bonded to the anti-pollution glass pressing plate 104 with epoxy glue and cured for 12 hours; then, the sealing ring 4 110 and the detector 109 with the target surface protection glass, i.e., the anti-pollution glass 2 107, are sequentially installed into the detector base 111; then, the sealing ring 3 108 is installed into the sealing ring groove 3; then, the detector pressing plate 106 is placed on the sealing ring 3 108, and the detector pressing plate 106 is connected to the detector base 111 with screws, and during the connection process, the detector pressing plate 106 is continuously repaired. 6, until the rear end face of the detector 109 can be closely attached to the step surface of the step-shaped inner hole of the detector base 111; then put the sealing ring 105 into the sealing ring groove 2; finally, insert the rear end of the anti-pollution glass pressing plate 104 with the anti-pollution glass 103 installed after curing for 12 hours into the detector pressing plate 106, and connect the anti-pollution glass pressing plate 104 with the detector pressing plate 106 with screws. During the connection process, the anti-pollution glass pressing plate 104 is continuously polished to ensure that it can compact the anti-pollution glass 107, and the assembly of the detector assembly before welding in Example 1 is completed;

[0090] For the present embodiment 2, the step 2 is specifically as follows: install the sealing ring 4 110 and the detector 109 into the detector base 111 in sequence; then install the sealing ring 3 108 into the sealing ring groove 3; then place the detector pressing plate 106 on the sealing ring 3 108, connect the detector pressing plate 106 with the detector base 111 with screws, and during the connection process, continuously grind the detector pressing plate 106 until it can make the rear end face of the detector 109 close to the step surface of the step-shaped inner hole of the detector base 111; then place the sealing ring 2 105 into the sealing ring groove 2; finally, place the first thermal insulation pad on the sealing ring 2 105, and connect the first thermal insulation pad with the detector pressing plate 106 with screws;

[0091] Step 3: The detector pre-welding assembly assembled in step 2 is detachably fixedly mounted on the focal surface circuit board 114 after the vacuum degassing treatment in step 1, and the pins on the rear end surface of the detector 109 are electrically welded to the focal surface circuit board 114; in the present embodiment 1 and embodiment 2, the detector pre-welding assembly assembled in step 2 is detachably fixedly mounted on the focal surface circuit board 114 after the vacuum degassing treatment in step 1 by screws and nuts; after the detector pre-welding assembly is fixedly mounted on the focal surface circuit board 114, the pins on the rear end surface of the detector 109 are electrically welded to the focal surface circuit board 114, which can prevent pollutants generated by welding from falling onto the target surface 1091 of the detector 109 during electrical welding, and at the same time reduce the environmental mirror requirements during welding;

[0092] Step 4: The detector pre-welding assembly, which is completed by electrically welding the pins on the rear end face of the detector 109 in step 3 to the focal surface circuit board 114 and is detachably fixedly mounted on the focal surface circuit board 114, is detachably fixedly connected to the front panel 101 after the vacuum degassing treatment in step 1, and when connected, the front end face of the detector pre-welding assembly is circumferentially sealed to the front panel 101; in this embodiment 1 and embodiment 2, the sealing ring 102 is installed into the above-mentioned sealing ring groove 1, and then the pins on the rear end face of the detector 109 in step 3 are electrically welded to the focal surface circuit board 114 and is detachably fixedly mounted on the focal surface The detector pre-welding assembly on the circuit board 114 is placed on the sealing ring 102, and then the detector pre-welding assembly is connected to the front panel 101 with screws; since the present embodiment 1 and embodiment 2 preferably also include a trimming pad 113, therefore, in step 4, it is also necessary to trim the height of the trimming pad 113 along the front-to-back direction to make it equal to the measured size of the gap between the focal surface circuit board 114 and the front panel 101, and then put the trimmed trimming pad 113 into the above gap, and connect the focal surface circuit board 114 to the front panel 101 with screws, so as to ensure that the installation stress on the focal surface circuit board 114 is small;

[0093] Step 5: The heat transfer boss on the plate surface on the front side of the lower end of the heat transfer plate 115 after the vacuum degassing treatment in step 1 is passed through the through groove provided on the focal plane circuit board 114 detachably fixedly connected to the front panel 101 in step 4, so that the heat transfer boss contacts the rear end surface of the detector 109; then the heat transfer plate 115 is detachably fixedly connected to the front panel 101 to complete the installation of the heat transfer plate 115; since in this embodiment 1 and embodiment 2, it is preferred to further include the heat transfer plate The heat transfer plate 115 is detachably fixed to the front panel 101 in step 5. The guide rods provided on the front panel of the heat transfer plate 116 are passed through the heat transfer plate 115 and the heat transfer plate 112 in sequence, and then detachably fixed to the front panel 101. The heat transfer plate 115 is isolated from the rest of the structure by the heat transfer plate 115 and the heat transfer plate 112.

[0094] Step 6: The focal plane assembly housing 117 after the vacuum degassing treatment in step 1 is mounted on the heat transfer plate 115, the focal plane circuit board 114 and the detector assembly before welding which are connected to the front panel 101 in step 5, wherein the lower end of the heat transfer plate 115, the focal plane circuit board 114 and the detector assembly before welding are located inside the focal plane assembly housing 117, and the upper end of the heat transfer plate 115 extends out from the notch set at the front end of the upper part of the focal plane assembly housing 117 for externally connecting a heat pipe; then the focal plane assembly housing 117 is detachably fixedly connected to the front panel 101 to complete the assembly of the focal plane assembly 01; in the present embodiment 1 and embodiment 2, the focal plane assembly housing 117 is detachably fixedly connected to the front panel 101 by screws; since the present embodiment 1 and embodiment 2 preferably also include a heat insulation plate 118, therefore, in step 6, the heat insulation plate 118 is also required to be connected to the focal plane assembly housing 117 by screws to complete the assembly of the focal plane assembly 01 in the embodiments 1 and 2;

[0095] Step 7: Assemble the components to be assembled in the above-mentioned electronic control assembly 02 after the vacuum degassing treatment in step 1 with the focal plane assembly 01 assembled in step 6, specifically:

[0096] First, the above-mentioned electronic control component circuit boards to be assembled after the vacuum degassing treatment in step 1 and the focal surface circuit board 114 in the focal surface component 01 assembled in step 6 are positioned through the stopper to form a stacked arrangement along the front-to-back direction;

[0097] Then, each adjacent two stacked and arranged electronic control component circuit boards and the electronic control component circuit board at the front end and the focal surface circuit board 114 are connected through circuit board connectors, and each layer of electronic control component circuit boards and the focal surface circuit board 114 are connected through studs; in the first and second embodiments, when the front end electronic control component circuit board and the focal surface circuit board 114 are connected through the circuit board connector, the circuit board connector passes through the above-mentioned via hole provided on the heat insulation board 18;

[0098] Finally, the electronic control component housing after the vacuum degassing treatment in step 1 is mounted on the outside of the connected electronic control component circuit board, and the electronic control component housing is connected to the focal surface component housing 117 in the focal surface component 01 assembled in step 6;

[0099] Complete the assembly of the focal plane and electronic control components.

[0100] When assembling the focal plane and electronic control components of the space optical camera of the above-mentioned embodiment 2 which is suitable for the ultraviolet band, especially the extreme ultraviolet band and can prevent the electronic components from causing molecular contamination to the detector target surface, the structure of embodiment 1 can also be used to firstly assemble and debug during the electronic debugging process. After the debugging is completed, the anti-pollution glass 2 107, the anti-pollution glass pressure plate 104 and the anti-pollution glass 1 103 in the assembly before the detector welding are removed, and the anti-pollution glass 2 107, the anti-pollution glass pressure plate 104 and the anti-pollution glass 1 103 are replaced as a whole with the first thermal insulation pad, and then assembled according to the corresponding assembly method of the above-mentioned embodiment 2, so as to reduce the molecular contamination in the debugging process.

[0101] In summary, the focal plane and electronic control components of the space optical camera of the present invention, which can prevent electronic components from causing molecular contamination to the detector target surface, not only realize the physical isolation of circuit boards and optical elements, which can effectively prevent molecular contamination, but also integrate all circuit boards required for the space optical camera into the whole machine, without the need for an external electronic control box, thereby improving the integration and lightweight of the whole machine.

Claims

1. A space optical camera focal plane and electronic control assembly capable of preventing electronic components from causing molecular contamination to the detector target surface, characterized in that: It comprises a focal plane component (01) and an electric control component (02) which are arranged in sequence from front to back; The focal plane assembly (01) comprises a front panel (101), a focal plane assembly housing (117), a detector front welding assembly, a focal plane circuit board (114) and a heat transfer plate (115); The front side of the front panel (101) is used to connect the optical component (03) in the space optical camera, and a light hole is arranged at the center of the panel surface; the focal plane component housing (117) is arranged at the rear side of the front panel (101), and the two are detachably connected to form a cavity with a rear end opening; the detector welding front assembly, the focal plane circuit board (114) and the heat transfer plate (115) are arranged in sequence from front to back in the cavity surrounded by the front panel (101) and the focal plane component housing (117); The detector assembly before welding comprises a detector base (111) and a detector pressure plate (106) coaxially arranged in sequence from back to front, and a detector (109) coaxially arranged in the stepped inner hole of the detector base (111); the detector pressure plate (106) and the detector base (111) are detachably sealed and fixedly connected, so that the rear end surface of the detector (109) is closely attached to the stepped surface of the stepped inner hole of the detector base (111), so that the two surfaces are circumferentially sealed and connected; a second light hole is arranged at the center of the plate surface of the detector pressure plate (106); the detector (109) is a photoelectric detector with the target surface protection glass in front of its own target surface removed; The detector pre-welding assembly is detachably fixedly connected to the focal plane circuit board (114) and the front panel (101), and the pins on the rear end surface of the detector (109) are electrically welded to the focal plane circuit board (114) after extending out of the rear end surface of the detector base (111). The front end surface of the detector pre-welding assembly and the front panel (101) are circumferentially sealed to isolate the target surface (1091) of the detector (109) in a front end cavity (A1) surrounded by the detector pre-welding assembly, the front panel (101) and the housing of the optical component (03); The heat transfer boss on the plate surface on one side in front of the lower end of the heat transfer plate (115) passes through a through slot provided on the focal plane circuit board (114) and contacts the rear end surface of the detector (109) to transfer heat; the upper end of the heat transfer plate (115) extends out from a notch provided on the front end of the upper part of the focal plane assembly housing (117) and is used for externally connecting a heat pipe; the heat transfer plate (115) is detachably fixedly connected to the front panel (101); The electric control component (02) comprises an electric control component housing and a plurality of electric control component circuit boards stacked in the electric control component housing in a front-to-back direction; each adjacent two of the electric control component circuit boards and the electric control component circuit board at the front end and the focal surface circuit board (114) are connected via an inter-circuit board connector; the electric control component housing and the focal surface component outer shell (117) form an interconnected cavity.

2. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 1, characterized in that: It also includes a heat transfer plate insulation pad 1 (112), a heat transfer plate insulation pad 2 (116) and a heat insulation plate (118); The heat transfer plate insulation pad 1 (112) and the heat transfer plate insulation pad 2 (116) are respectively arranged on the front and rear sides of one side of the upper end of the heat transfer plate (115), and are used to separate the heat transfer plate (115) from the front panel (101) and the focal plane assembly housing (117), so as to reduce the amount of heat transferred from the heat transfer plate (115) to the front panel (101) and the focal plane assembly housing (117); The heat insulation plate (118) is arranged on one side behind the heat transfer plate (115) and is located in the inner cavity of the focal plane assembly housing (117), and is detachably fixedly connected to the focal plane assembly housing (117); The heat insulation board (118) is provided with a via hole through which a circuit board connector for connecting the front-end electric control component circuit board and the focal surface circuit board (114) passes.

3. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 2, characterized in that: The detector base (111) is made of titanium alloy TC4 material; The heat transfer plate (115) is made of copper alloy or aluminum alloy; a gap where the heat transfer boss contacts the rear end surface of the detector (109) is coated with heat-conducting silicone rubber; a heating plate is attached to the heat transfer plate (115) to bake the detector (109) and remove molecular contamination deposited on the target surface (1091) of the detector (109); The heat insulation board (118) is made of polyimide material.

4. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 2, characterized in that: The detector pre-welding assembly also includes anti-pollution glass 2 (107), an anti-pollution glass pressing plate (104) and anti-pollution glass 1 (103); The material, structure and size of the second anti-pollution glass (107) are the same as those of the target surface protection glass; the second anti-pollution glass (107) is arranged in the second light hole and is bonded to the front end surface of the detector (109); The outer peripheral surface and the inner hole of the anti-pollution glass pressing plate (104) are both stepped in shape, with the front being larger and the rear being smaller; the rear end of the anti-pollution glass pressing plate (104) is inserted into the second light-through hole, and the front end flange of the anti-pollution glass pressing plate (104) is detachably sealed and fixedly connected to the detector pressing plate (106), so that the rear end surface of the anti-pollution glass pressing plate (104) is closely attached to the front surface of the second anti-pollution glass (107), thereby pressing the second anti-pollution glass (107); The anti-pollution glass 1 (103) is fixedly arranged at the front end of the inner hole of the anti-pollution glass pressing plate (104), and its rear end surface is in contact with the step surface in the inner hole.

5. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 4, characterized in that: The detector pre-welding assembly also includes a sealing ring 2 (105), a sealing ring 3 (108) and a sealing ring 4 (110); The gap between the outer circumference of the detector (109) and the inner circumference corresponding to the stepped inner hole of the detector base (111) is 0.05 mm to 0.1 mm; A second sealing ring groove is provided at a position on the front end surface of the detector pressing plate (106) that contacts the rear surface of the front end flange of the anti-pollution glass pressing plate (104); the second sealing ring (105) is provided in the second sealing ring groove, and the front end flange of the anti-pollution glass pressing plate (104) and the detector pressing plate (106) are sealed and connected via the second sealing ring (105); A sealing ring groove three is provided at a position on the front end surface of the detector base (111) that contacts the rear end surface of the detector pressure plate (106); the sealing ring three (108) is arranged in the sealing ring groove three to seal and connect the detector pressure plate (106) and the detector base (111); A sealing ring groove 4 is provided on the step surface of the step-shaped inner hole of the detector base (111); the sealing ring 4 (110) is arranged in the sealing ring groove 4, so that the rear end surface of the detector (109) and the step surface of the step-shaped inner hole of the detector base (111) are circumferentially sealed and connected; The sealing ring 2 (105), the sealing ring 3 (108) and the sealing ring 4 (110) are all metal sealing rings.

6. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 2, characterized in that: The detector pre-welding assembly also includes a first thermal insulation pad; The first thermal insulation pad is coaxially arranged on a front side of the detector pressure plate (106) and is detachably sealed and fixedly connected to the detector pressure plate (106); The first thermal insulation pad is provided with a light-through hole three.

7. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 6, characterized in that: The detector pre-welding assembly also includes a sealing ring 2 (105), a sealing ring 3 (108) and a sealing ring 4 (110); The gap between the outer circumference of the detector (109) and the inner circumference corresponding to the stepped inner hole of the detector base (111) is 0.05 mm to 0.1 mm; A second sealing ring groove is provided at a position on the front end surface of the detector pressing plate (106) that contacts the rear end surface of the first thermal insulation pad; the second sealing ring (105) is provided in the second sealing ring groove, and the first thermal insulation pad and the detector pressing plate (106) are sealed and connected via the second sealing ring (105); A sealing ring groove three is provided at a position on the front end surface of the detector base (111) that contacts the rear end surface of the detector pressure plate (106); the sealing ring three (108) is arranged in the sealing ring groove three to seal and connect the detector pressure plate (106) and the detector base (111); A sealing ring groove 4 is provided on the step surface of the step-shaped inner hole of the detector base (111); the sealing ring 4 (110) is arranged in the sealing ring groove 4, so that the rear end surface of the detector (109) and the step surface of the step-shaped inner hole of the detector base (111) are circumferentially sealed and connected; The sealing ring 2 (105), the sealing ring 3 (108) and the sealing ring 4 (110) are all metal sealing rings.

8. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to any one of claims 1 to 7, characterized in that: Also includes a sealing ring 1 (102); The front panel (101) is in the shape of a box cover with a first annular boss arranged around the upper edge of the rear side panel surface; the front and rear ends of the focal plane assembly housing (117) are both open, and its front end is sleeved on the first annular boss and is detachably fixedly connected to the front panel (101) to form a cavity with an opening at the rear end; A second annular boss coaxial with the first annular boss is provided on a rear side panel of the front panel (101) and located inside the first annular boss, and the position and shape of the second annular boss match the position and shape of the front end face of the detector assembly before welding; A sealing ring groove 1 is provided at a position on the rear end surface of the second annular boss that contacts the front end surface of the detector assembly before welding; the sealing ring 1 (102) is arranged in the sealing ring groove 1 to circumferentially seal the front end surface of the detector assembly before welding and the front panel (101); The sealing ring 1 (102) is a metal sealing ring.

9. The focal plane and electronic control assembly of a space optical camera capable of preventing electronic components from causing molecular contamination to the detector target surface according to claim 8, characterized in that: Also included are a plurality of trimming pads (113); A plurality of trimming pads (113) are evenly distributed between the focal surface circuit board (114) and the front panel (101) along the four sides of the front side panel surface of the focal surface circuit board (114); the height of the trimming pads (113) along the front-to-back direction is equal to the size of the gap between the focal surface circuit board (114) and the front panel (101); the focal surface circuit board (114), the trimming pads (113) and the front panel (101) are detachably fixedly connected; the trimming pads (113) are used to reduce the installation stress borne by the focal surface circuit board (114) when the focal surface circuit board (114) is connected to the front panel (101).

10. An assembly process for a focal plane of a space optical camera and an electronic control component capable of preventing electronic components from causing molecular contamination to a detector target surface as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: subjecting all the components to be assembled except the detector (109) to vacuum degassing treatment; Step 2: Assembling the detector (109) and the parts to be assembled contained in the detector pre-welding assembly after the vacuum degassing treatment in step 1, thereby completing the assembly of the detector pre-welding assembly; During the assembly process, the detector pressing plate (106) is continuously polished until the rear end surface of the detector (109) can be closely attached to the step surface of the step-shaped inner hole of the detector base (111); Step 3: The detector assembly before welding assembled in step 2 is detachably fixedly mounted on the focal plane circuit board (114) after the vacuum degassing treatment in step 1, and the pins on the rear end surface of the detector (109) are electrically connected to the focal plane circuit board (114) by welding; Step 4: The detector pre-welding assembly, which is completed by electrically welding the pins on the rear end surface of the detector (109) and the focal surface circuit board (114) in step 3 and is detachably fixedly mounted on the focal surface circuit board (114), is detachably fixedly connected to the front panel (101) after the vacuum degassing treatment in step 1, and when connected, the front end surface of the detector pre-welding assembly is circumferentially sealed to the front panel (101); Step 5: the heat transfer boss on the plate surface on the front side of the lower end of the heat transfer plate (115) after the vacuum degassing treatment in step 1 is passed through the through groove provided on the focal plane circuit board (114) detachably fixedly connected to the front panel (101) in step 4, so that the heat transfer boss contacts the rear end surface of the detector (109); then the heat transfer plate (115) is detachably fixedly connected to the front panel (101), and the installation of the heat transfer plate (115) is completed; Step 6: The focal plane assembly housing (117) after the vacuum degassing treatment in step 1 is mounted on the heat transfer plate (115), the focal plane circuit board (114) and the detector assembly before welding which are connected as a whole with the front panel (101) in step 5, wherein the lower end of the heat transfer plate (115), the focal plane circuit board (114) and the detector assembly before welding are located inside the focal plane assembly housing (117), and the upper end of the heat transfer plate (115) protrudes from a notch provided at the front end of the upper part of the focal plane assembly housing (117) for external connection to a heat pipe; then the focal plane assembly housing (117) and the front panel (101) are detachably fixedly connected to complete the assembly of the focal plane assembly (01); Step 7: Assemble the components to be assembled in the electric control assembly (02) after the vacuum degassing treatment in step 1 with the focal plane assembly (01) assembled in step 6, specifically: First, the electronic control component circuit boards to be assembled after the vacuum degassing treatment in step 1 and the focal surface circuit boards (114) in the focal surface component (01) assembled in step 6 are positioned through stoppers to form a stacked arrangement along the front-to-back direction; Then, each adjacent two stacked and arranged electric control component circuit boards and the electric control component circuit board at the front end and the focal surface circuit board (114) are connected via circuit board connectors, and each layer of electric control component circuit boards and the focal surface circuit board (114) are connected via studs; Finally, the electronic control component housing after the vacuum degassing treatment in step 1 is mounted on the outside of the connected electronic control component circuit board, and the electronic control component housing is connected to the focal surface component housing (117) in the focal surface component (01) assembled in step 6; Complete the assembly of the focal plane and electronic control components.

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