Electrolytic capacitor, circuit board, remote controller, air conditioning system and circuit board preparation process

Abstract

The invention provides an electrolytic capacitor, a circuit board, a remote controller, an air conditioning system and a circuit board preparation technology, the electrolytic capacitor is used for being installed on the circuit board, and the circuit board is provided with an installation groove; the electrolytic capacitor comprises an extension pin, and the extension pin is mounted in the mounting groove; wherein the electrolytic capacitor is used for being identified and sucked by the chip mounter and is inversely erected on the circuit board. The electrolytic capacitor is inversely erected on the circuit board through the extension pins, the body height of the electrolytic capacitor on the front face of the circuit board is reduced, the electrolytic capacitor can be suitable for more application scenes, and the electrolytic capacitor can be identified and sucked by a chip mounter and is erected on the circuit board in a chip mounting mode, so that the chip mounting efficiency is improved. Compared with the prior art, full automation and manufacturability are improved, labor and maintenance cost is reduced, wave soldering procedures caused by plug-in electrolytic capacitors are reduced, resources can be saved, preparation procedures and process complexity are reduced, quality problems caused by welding are avoided, and the quality of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of air conditioners, and in particular to an electrolytic capacitor, a circuit board, a remote controller, an air conditioning system and a circuit board preparation process. Background Art

[0002] In the related art, conventional electrolytic capacitors mainly include SMD electrolytic capacitors and plug-in electrolytic capacitors. Among them, SMD electrolytic capacitors are usually installed upright on the circuit board, but due to the high body of the SMD electrolytic capacitor, some application scenarios are limited in structure. For example, the application of SMD electrolytic capacitors in remote controls may be space-constrained; in addition, for plug-in electrolytic capacitors, machines cannot be used to grab them during the preparation of the circuit board. Therefore, staff are currently required to manually insert the plug-in electrolytic capacitors into the circuit board, which has poor full automation and manufacturability; in addition, after the conventional plug-in electrolytic capacitors are inserted into the circuit board, they must be fixed by wave soldering, which wastes resources, has many preparation processes, and is complex in process. Quality problems such as continuous soldering and voids may also occur; and during wave soldering, the flux may vaporize and stick to the circuit board, causing the circuit board to be scrapped. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an electrolytic capacitor, a circuit board, a remote control, an air conditioning system and a circuit board preparation process, aiming to reduce the limitations of the electrolytic capacitor due to application scenarios, improve the full automation and manufacturability during the preparation of the circuit board, reduce labor costs, simplify the preparation process, and improve the quality of the circuit board.

[0004] In a first aspect, an embodiment of the present application provides an electrolytic capacitor for mounting on a circuit board, wherein the circuit board is provided with a mounting groove; the electrolytic capacitor comprises:

[0005] An extension pin, wherein the extension pin is installed in the installation slot;

[0006] The electrolytic capacitor is used to be identified and absorbed by a placement machine and is mounted upside down on the circuit board.

[0007] According to some embodiments of the present application, the extension pin is located at the bottom of the electrolytic capacitor, one end of the extension pin is connected to the inside of the electrolytic capacitor, and the other end protrudes from the edge of the bottom of the electrolytic capacitor, and the bottom of the electrolytic capacitor is used to be identified and absorbed by the placement machine.

[0008] In a second aspect, an embodiment of the present application provides a circuit board, comprising the electrolytic capacitor as described in the first aspect.

[0009] According to some embodiments of the present application, the circuit board also includes a spring, which includes a spring body and an auxiliary platform, the spring body is connected to the auxiliary platform, the auxiliary platform is installed on the circuit board, and the auxiliary platform is used to be identified and absorbed by a placement machine.

[0010] According to some embodiments of the present application, the spring body is provided with an extension portion, and the spring body is fixed to the auxiliary platform via the extension portion.

[0011] According to some embodiments of the present application, the auxiliary platform is a metal sheet or a Mylar sheet.

[0012] According to some embodiments of the present application, the spring body is formed by winding a wire, and the spring body is in a plane shape or a platform shape.

[0013] According to some embodiments of the present application, the circuit board is also provided with a surface-mount light-emitting diode and a separate backlight device.

[0014] In a third aspect, an embodiment of the present application provides a remote control comprising the circuit board as described in the second aspect.

[0015] In a fourth aspect, an embodiment of the present application provides an air-conditioning system, comprising an air-conditioning unit and a remote controller as described in the third aspect, wherein the remote controller is used to control the operation of the air-conditioning unit.

[0016] In a fifth aspect, an embodiment of the present application provides a circuit board manufacturing process, including:

[0017] Apply solder paste on the circuit board;

[0018] The patch material is sucked onto the circuit board by a patch machine, wherein the patch material includes the electrolytic capacitor as described in the first aspect, and the circuit board is provided with a mounting groove for mounting the electrolytic capacitor;

[0019] The circuit board is subjected to reflow soldering in a reflow furnace so that the patch material is fixed to the circuit board through the solder paste.

[0020] According to some embodiments of the present application, the step of sucking the patch material onto the circuit board by a patch machine includes:

[0021] The bottom of the electrolytic capacitor is sucked by a chip mounter and the extension pin is placed in the mounting groove, so that the electrolytic capacitor is mounted upside down on the circuit board.

[0022] According to some embodiments of the present application, the patch material further includes a spring, the spring includes a spring body and an auxiliary platform, the spring body is connected to the auxiliary platform, the auxiliary platform is mounted on the circuit board, and the auxiliary platform is used to be identified and sucked by the patch machine; the patch material is sucked onto the circuit board by the patch machine, and further includes:

[0023] The auxiliary platform of the spring is sucked by a placement machine, and the spring is placed on the circuit board.

[0024] According to some embodiments of the present application, after the circuit board is reflow soldered in a reflow oven, the circuit board preparation process further includes: performing optical inspection processing, glue dispensing processing, burning processing, assembly processing and testing processing on the circuit board.

[0025] According to the technical solution of the embodiment of the present application, it includes but is not limited to the following technical effects: the electrolytic capacitor of the embodiment of the present application includes an extended pin, wherein the extended pin is installed in the mounting groove of the circuit board, and the electrolytic capacitor is used to be identified and absorbed by the placement machine, and is inverted and mounted on the circuit board. Since the electrolytic capacitor of the embodiment of the present application is embedded in the mounting groove of the circuit board through an extended pin card, the electrolytic capacitor can be mounted inverted on the circuit board, thereby reducing the height of the electrolytic capacitor at the front of the circuit board, and making the electrolytic capacitor suitable for more application scenarios; secondly, since the electrolytic capacitor of the embodiment of the present application can be identified and absorbed by the placement machine and mounted on the circuit board, the full automation and manufacturability are improved; secondly, manual operation can be reduced, and labor and maintenance costs can be reduced; in addition, since the electrolytic capacitor of the embodiment of the present application is installed on the circuit board by patch method like other patch materials, the wave soldering process generated by the plug-in electrolytic capacitor can be reduced, thereby saving resources and reducing the complexity of the preparation process and process; in addition, since there is no need to go through the wave soldering process during the preparation of the circuit board, the occurrence of quality problems such as continuous soldering and voids can be avoided, thereby improving the quality of the circuit board.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide further understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0028] Figure 1 is a schematic diagram of the structure of an electrolytic capacitor provided by an embodiment of the present application;

[0029] Figure 2 It is a schematic diagram of the structure of an electrolytic capacitor provided in another embodiment of the present application.

[0030] Figure 3 is a partial front view of an electrolytic capacitor provided by an embodiment of the present application installed on a circuit board;

[0031] Figure 4 is a top view of an electrolytic capacitor provided by an embodiment of the present application installed on a circuit board;

[0032] Figure 5 is a partial front view of an electrolytic capacitor installed on a circuit board provided by another embodiment of the present application;

[0033] Figure 6 is a bottom view schematic diagram of the structure of an electrolytic capacitor provided by an embodiment of the present application;

[0034] Figure 7 is a bottom view schematic diagram of the structure of an electrolytic capacitor provided by another embodiment of the present application;

[0035] Figure 8 is a schematic diagram of the structure of a spring in a circuit board provided by an embodiment of the present application;

[0036] Fig. 9 is a schematic structural diagram of a spring in a circuit board provided by another embodiment of the present application;

[0037] Fig.10 is a schematic structural diagram of a spring in a circuit board provided by another embodiment of the present application;

[0038] Fig.11 It is a schematic diagram of a process flow of a circuit board preparation process provided by an embodiment of the present application;

[0039] Fig.12 is a schematic flow chart of a circuit board manufacturing process provided by another embodiment of the present application;

[0040] Fig.13 is a schematic flow chart of a circuit board manufacturing process provided by another embodiment of the present application;

[0041] Fig.14 It is a schematic diagram of the process flow of a circuit board preparation process provided by another embodiment of the present application. DETAILED DESCRIPTION

[0042] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0043] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0045] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0046] In the related art, conventional electrolytic capacitors mainly include SMD electrolytic capacitors and plug-in electrolytic capacitors. Among them, SMD electrolytic capacitors are usually installed upright on the circuit board, but due to the high body of the SMD electrolytic capacitor, some application scenarios are limited in structure. For example, the application of SMD electrolytic capacitors in remote controls may be space-constrained; in addition, for plug-in electrolytic capacitors, machines cannot be used to grab them during the preparation of the circuit board. Therefore, staff are currently required to manually insert the plug-in electrolytic capacitors into the circuit board, which has poor full automation and manufacturability; in addition, after the conventional plug-in electrolytic capacitors are inserted into the circuit board, they must be fixed by wave soldering, which wastes resources, has many preparation processes, and is complex in process. Quality problems such as continuous soldering and voids may also occur; and during wave soldering, the flux may vaporize and stick to the circuit board, causing the circuit board to be scrapped.

[0047] Based on the above situation, the embodiments of the present application propose an electrolytic capacitor, a circuit board, a remote control, an air-conditioning system and a circuit board preparation process, aiming to reduce the limitations of the electrolytic capacitor due to application scenarios, improve the full automation and manufacturability during circuit board preparation, reduce labor costs, simplify the preparation process, and improve the quality of circuit boards.

[0048] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0049] like Figure 1 As shown, Figure 11 is a schematic diagram of the structure of an electrolytic capacitor provided by an embodiment of the present application. In one embodiment, the electrolytic capacitor 1 of the embodiment of the present application is used to be installed on a circuit board 2, and the circuit board 2 is provided with a mounting groove 21.

[0050] The electrolytic capacitor 1 includes but is not limited to an extension pin 11 , and the extension pin 11 is installed in the installation slot 21 .

[0051] It should be understood that the electrolytic capacitor 1 is used to be identified and sucked by a placement machine, and is clamped upside down on the circuit board 2 .

[0052] It should be understood that the mounting slot 21 provided on the circuit board 2 actually includes a pad in contact with the extended pin 11 . Since the extended pin 11 is essentially a pin of the electrolytic capacitor 1 , it needs to have conductive ability to enable the electrolytic capacitor to participate in the normal operation of the circuit board 2 .

[0053] When installing the electrolytic capacitor 1, the chip suction machine will identify the bottom of the electrolytic capacitor 1, suck up the electrolytic capacitor 1 by sucking the bottom of the electrolytic capacitor 1, align the extended pin 11 on the electrolytic capacitor 1 with the position of the installation groove 21, and place it on the circuit board 2 like other surface-mount devices to complete the installation of the electrolytic capacitor 1.

[0054] It should be noted that the size of the pad provided in the mounting groove 21 is varied and may be the following embodiments or other embodiments, and the embodiments of the present application are not limited thereto.

[0055] In one embodiment, a solder pad is integrally disposed inside the mounting groove 21 .

[0056] In one embodiment, a solder pad is disposed in a partial area inside the mounting groove 21 .

[0057] It should be understood that the number of the extension pins 11 here is various, and can be as follows: Figure 1 As shown, two extension pins 11 are provided, and the following embodiments may also be used, which is not limited in the embodiments of the present application.

[0058] like Figure 2 As shown, Figure 2It is a structural schematic diagram of an electrolytic capacitor provided by another embodiment of the present application. In one embodiment, the electrolytic capacitor also includes but is not limited to ordinary pins 12. In this embodiment, one of the two pins of the electrolytic capacitor 1 is an extension pin 11, and the other pin is an ordinary pin 12. Since the extension pin 11 is longer than the ordinary pin 12, the extension pin 11 can be mounted on the mounting slot 21 of the circuit board 2, providing a certain support capacity for the electrolytic capacitor 1, so that the electrolytic capacitor 1 can be stably inverted, and a small part of the ordinary pin 12 will extend out of the bottom 13 of the electrolytic capacitor 1, so that when the electrolytic capacitor 1 is inverted by the extension pin 11, the ordinary pin 12 will be stuck on the pad, and a certain support force is provided by the clamping, so that the ordinary pin 12 can assist the extension pin 11 in supporting, thereby improving the stability of the inversion of the electrolytic capacitor 1 and reducing the cost of the electrolytic capacitor 1.

[0059] like Figure 3 and Figure 4 As shown, Figure 3 is a partial front view of an electrolytic capacitor provided by an embodiment of the present application installed on a circuit board, Figure 4 is a top view of an electrolytic capacitor provided by an embodiment of the present application installed on a circuit board, Figure 3 The uppermost rectangle in the figure is used to indicate other patch materials. In one embodiment, the circuit board 2 is further provided with a through hole matching the electrolytic capacitor 1. When the electrolytic capacitor 1 is inverted, the body of the electrolytic capacitor 1 is passed through the matching through hole on the circuit board.

[0060] like Figure 5 As shown, Figure 5 is a partial front view of an electrolytic capacitor installed on a circuit board provided by another embodiment of the present application. Figure 5 The rectangle in the figure is used to indicate other patch materials. In one embodiment, the extension pin 11 is bent, and when the electrolytic capacitor 1 is mounted upside down, the electrolytic capacitor 1 will bulge a portion of its height. The bulge of the electrolytic capacitor 1 allows the thickness of the circuit board 2 to be effectively utilized, thereby effectively reducing the overall height of the circuit board after mounting the device.

[0061] It should be understood that the specific configuration of the extension pin 11 is various and can be as follows: Figure 6 and Figure 7 The embodiment may also be other settings, which is not limited in the embodiments of the present application.

[0062] like Figure 6 As shown, Figure 61 is a schematic diagram of the structure of an electrolytic capacitor provided by an embodiment of the present application. In one embodiment, the extension pin 11 is located at the bottom 13 of the electrolytic capacitor 1, one end of the extension pin 11 is connected to the inside of the electrolytic capacitor 1, and the other end protrudes from the edge of the bottom 13 of the electrolytic capacitor 1, and the bottom 13 of the electrolytic capacitor 1 is used to be recognized and sucked by the placement machine.

[0063] like Figure 7 As shown, Figure 7 In one embodiment, one end of the extension pin 11 that contacts the electrolytic capacitor 1 body is located inside the bottom 13 of the electrolytic capacitor 1 , and the other end extends from the bottom 13 and protrudes from the bottom 13 .

[0064] In one embodiment, both pins of the electrolytic capacitor 1 are extended pins 11, one of the extended pins 11 is located at the bottom 13 of the electrolytic capacitor 1, one end of the extended pin 11 is connected to the inside of the electrolytic capacitor 1, and the other end protrudes from the edge of the bottom 13 of the electrolytic capacitor 1; the other extended pin 11 has one end in contact with the body of the electrolytic capacitor 1 and is located inside the bottom 13 of the electrolytic capacitor 1, and the other end extends from the bottom 13 and protrudes from the bottom 13.

[0065] The electrolytic capacitor of the embodiment of the present application is embedded in the mounting groove of the circuit board through an extended pin card, so that the electrolytic capacitor can be mounted inverted on the circuit board, thereby reducing the height of the electrolytic capacitor at the front of the circuit board, and making the electrolytic capacitor suitable for more application scenarios; secondly, since the electrolytic capacitor of the embodiment of the present application can be identified and absorbed by the placement machine and mounted on the circuit board, the full automation and manufacturability are improved; secondly, it can also reduce manual operations and reduce labor and maintenance costs; in addition, since the electrolytic capacitor of the embodiment of the present application is installed on the circuit board by patch method like other patch materials, the wave soldering process generated by the plug-in electrolytic capacitor can be reduced, thereby saving resources and reducing the complexity of the preparation process and process; in addition, since there is no need to go through the wave soldering process during the preparation of the circuit board, the occurrence of quality problems such as continuous soldering and voids can also be avoided, thereby improving the quality of the circuit board.

[0066] Based on the structures of the electrolytic capacitors in the above-mentioned embodiments, multiple embodiments of the circuit board provided by the present application are respectively proposed below.

[0067] In one embodiment, if Figure 2 As shown, the circuit board 2 includes the electrolytic capacitor 1 as provided in the first aspect, and is provided with a mounting groove 21 for inverted mounting of the extended pin 11 .

[0068] like Figure 8 As shown, Figure 81 is a schematic diagram of the structure of a spring in a circuit board provided by an embodiment of the present application. In one embodiment, the circuit board 2 further includes a spring 22, the spring 22 includes but is not limited to a spring body 221 and an auxiliary platform 222, the spring body 221 is connected to the auxiliary platform 222, the auxiliary platform 222 is installed on the circuit board 2, and the auxiliary platform 222 is used to be recognized and sucked by the placement machine.

[0069] The spring of the embodiment of the present application is provided with an auxiliary platform so that the spring can be identified and absorbed by the placement machine and installed on the circuit board, thereby improving full automation and manufacturability; secondly, it can also reduce manual operations and reduce labor and maintenance costs; in addition, since the spring of the embodiment of the present application can be installed on the circuit board by placement through the auxiliary platform like other patch materials, the wave soldering process caused by manual installation of the spring can be reduced, thereby saving resources and reducing the complexity of the preparation process and process; in addition, since there is no need to go through the wave soldering process during the preparation of the circuit board, it can also avoid the occurrence of quality problems such as continuous soldering and voids, thereby improving the quality of the circuit board.

[0070] The following is an application scenario of the spring embodiment in practice.

[0071] In one embodiment, when the spring 22 needs to be mounted on the circuit board 2, the placement machine identifies the auxiliary platform 222 on the spring, and absorbs the auxiliary platform 222 to absorb the entire spring 22, and places the entire auxiliary platform 222 on the corresponding pad in the circuit board 2 to complete the device placement work, and solders the auxiliary platform 222 and the pad together by soldering, thereby completing the installation of the spring 22.

[0072] In one embodiment, when the spring needs to be clamped on the circuit board 2, the placement machine identifies the auxiliary platform 222 on the spring, and absorbs the auxiliary platform 222 to absorb the entire spring 22, and clamps the auxiliary platform 222 in the corresponding clamping slot on the circuit board 2 to complete the clamping installation of the spring 22.

[0073] It should be understood that the specific form of the auxiliary platform 222 here is diverse, and can be the following embodiments or other embodiments, and the embodiments of the present application are not limited to this.

[0074] In one embodiment, when the spring 22 is used as a battery spring, the auxiliary platform 222 is a metal sheet. The spring 22 presses the battery in the battery compartment of the remote control so that the battery can be in close contact with the corresponding battery connecting sheet to form a stable power circuit, thereby ensuring normal power supply of the remote control.

[0075] It should be understood that when the spring 22 is used as a battery spring, the auxiliary platform 222 can be used as a battery positive terminal contact or a battery negative terminal contact. Those skilled in the art can determine the specific contact purpose of the auxiliary platform 222 when the spring 22 is used as a battery spring based on the actual shape of the spring body 221, and the embodiments of the present application do not limit this.

[0076] In one embodiment, the auxiliary platform 222 is a Mylar sheet.

[0077] It should be understood that the Mylar sheets here are divided into metal Mylar sheets and non-metal Mylar sheets, and those skilled in the art can determine the specific form of the Mylar sheets according to the specific purpose of the spring body 221.

[0078] In one embodiment, when the spring 22 is used as a buffer spring, the auxiliary platform 222 is a non-metallic Mylar sheet, which is installed on the circuit board 2. At this time, the spring 22 can absorb the kinetic energy generated by external impact or sudden displacement, preventing the circuit board 2 from being displaced and collided, causing damage to the circuit board 2.

[0079] In one embodiment, when the spring 22 is used as a battery spring, the auxiliary platform 222 is a metal Mylar sheet, and the spring 22 presses the battery in the battery compartment of the remote control so that the battery can be in close contact with the corresponding battery connecting sheet to form a stable power circuit.

[0080] In one embodiment, the spring body 221 includes but is not limited to an extension portion 2211 , and the spring body 221 is fixed to the auxiliary platform 222 via the extension portion 2211 .

[0081] Since the spring body 221 is extended by the extension portion 2211 , the spring 22 will not hinder the SMT machine from sucking the auxiliary platform 222 when the SMT machine sucks it.

[0082] It should be understood that the specific manner in which the spring body 221 is fixed to the auxiliary platform 222 via the extension portion 2211 is varied, and the present application does not limit this.

[0083] The following takes the spring 22 used as a negative electrode spring of a battery as an example to describe a specific embodiment in which the extension portion 2211 is fixed to the auxiliary platform 222 .

[0084] In one embodiment, if Figure 8 As shown, the portion of the extension portion 2211 fixed to the auxiliary platform 222 is placed flat on the auxiliary platform 222 and is bent so that the extension portion 2211 is more closely attached to the auxiliary platform 222 to enhance the fixing effect.

[0085] like Fig. 9 As shown, Fig. 92 is a schematic diagram of the structure of a spring in a circuit board provided by another embodiment of the present application. In one embodiment, the portion of the extension portion 2211 fixed to the auxiliary platform 222 forms a protrusion 2212, and the protrusion 2212 is used to snap into a preset insertion hole of the circuit board 2 through its own elastic force, thereby fixing the spring 22 in the circuit board 2.

[0086] It should be understood that the specific shape of the protrusion 2212 is various, for example, Fig. 9 As shown, the raised portion 2212 is in a U-shaped bend or an Ω-shaped bend; or in a rectangular shape, etc. Those skilled in the art can determine the specific shape of the raised portion 2212 according to actual conditions, and the embodiments of the present application are not limited to this.

[0087] like Fig.10 As shown, Fig.10 2 is a schematic diagram of the structure of a spring in a circuit board provided by another embodiment of the present application. In one embodiment, the auxiliary platform 222 is provided with a fixing portion 2221, and the extension portion 2211 passes through a hollow portion formed between the fixing portion 2221 and the auxiliary platform 222, and the fixing portion 2221 rivets the passing extension portion 2211 to the auxiliary platform 222.

[0088] It should be understood that the specific number of the fixing parts 2221 here is various, and can be one, or can be the following embodiments, or can be other embodiments, and the embodiments of the present application are not limited to this.

[0089] In one embodiment, three fixing portions 2221 are provided, and the three fixing portions 2221 are arranged rotationally symmetrically. The extending portion 2211 passes through the hollow portion of each fixing portion 2221 and is riveted to the auxiliary platform 222 .

[0090] It should be understood that the specific form of the spring body 221 here is diverse, and can be the following embodiments or other embodiments, and the embodiments of the present application are not limited to this.

[0091] In one embodiment, the spring body 221 is formed by winding a wire, and the spring body 221 is planar. In this case, the spring 22 can be used as a positive electrode spring of a battery.

[0092] In one embodiment, the spring body 221 is formed by winding a wire, and the spring body 221 is in a conical spiral shape. In this case, the spring 22 can be used as a negative electrode spring of a battery.

[0093] In one embodiment, the circuit board 2 is further provided with a surface-mount light emitting diode and a separate backlight device, so that the circuit board 2 can emit a light signal to the outside or display information to the outside.

[0094] In addition, based on the structure of the circuit boards of the above-mentioned embodiments, an embodiment of the present application further provides a remote control, comprising the circuit boards of the above-mentioned embodiments.

[0095] It should be understood that since the remote control of the embodiment of the present application includes the circuit board of the above-mentioned embodiment, and the circuit board of the above-mentioned embodiment includes the electrolytic capacitor and the spring of the above-mentioned embodiment, the degree of fully automated manufacturing and the manufacturability of the remote control of the embodiment of the present application can be improved by the electrolytic capacitor and the spring; secondly, it can also reduce manual operations and reduce labor and maintenance costs; in addition, since the electrolytic capacitor and the spring of the embodiment of the present application are installed on the circuit board by patch method like other patch materials, the wave soldering process caused by the manual installation of the electrolytic capacitor and the spring can be reduced, thereby saving resources and reducing the complexity of the preparation process and process; in addition, since there is no need to go through the wave soldering process during the preparation of the circuit board, it can also avoid the occurrence of quality problems such as solder joints and voids, thereby improving the quality and manufacturing efficiency of the remote control.

[0096] In addition, based on the structure of the remote controller of the above embodiment, an embodiment of the present application further provides an air-conditioning system, including an air-conditioning unit and the remote controller of the above embodiment, wherein the remote controller of the above embodiment is used to control the operation of the air-conditioning unit.

[0097] It should be understood that since the air-conditioning system of the embodiment of the present application includes the remote control of the above-mentioned embodiment, the remote control of the above-mentioned embodiment includes the circuit board of the above-mentioned embodiment, and the circuit board of the above-mentioned embodiment includes the electrolytic capacitor and the spring of the above-mentioned embodiment, therefore, the degree of full automation manufacturing and manufacturability of the remote control of the embodiment of the present application can be improved by the electrolytic capacitor and the spring; secondly, it can also reduce manual operation and reduce labor and maintenance costs; in addition, since the electrolytic capacitor and the spring of the embodiment of the present application are installed on the circuit board by patch method like other patch materials, the wave soldering process caused by the manual installation of the electrolytic capacitor and the spring can be reduced, thereby saving resources and reducing the complexity of the preparation process and process; in addition, since there is no need to go through the wave soldering process during the preparation of the circuit board, it can also avoid the occurrence of quality problems such as continuous soldering and voids, thereby improving the quality and manufacturing efficiency of the remote control, thereby ensuring that the air-conditioning unit can be controlled normally.

[0098] In addition, based on the circuit boards of the above-mentioned various embodiments, an embodiment of the present application further provides a circuit board preparation process.

[0099] like Fig.11 As shown, Fig.11 1 is a schematic diagram of a process for preparing a circuit board provided by an embodiment of the present application. In one embodiment, the process for preparing a circuit board includes but is not limited to the following steps.

[0100] Step S1110, applying solder paste on the circuit board.

[0101] In an embodiment used to prepare the circuit boards of the above-mentioned embodiments, solder paste is applied to the circuit board. Since the solder paste has a certain viscosity, when the pads on the circuit board are coated with solder paste, various patch materials on the circuit board are temporarily adhered to the pads by the solder paste, thereby improving the accuracy of the installation of the patch materials.

[0102] Step S1120, using a placement machine to absorb the placement material onto the circuit board.

[0103] It should be understood that the patch material here includes the electrolytic capacitor 1 of the above-mentioned embodiments, and the circuit board is provided with a mounting groove 21 for mounting the electrolytic capacitor 1.

[0104] It should be understood that since the pads on the circuit board are coated with solder paste, the SMT machine will suck and place the material on the pads. The solder paste on the pads will adhere to the SMT material to a certain extent. Before the solder paste is heated and melted to form solder, the connection degree of the SMT material is limited. When a certain external force is applied, the SMT material will detach from the pad.

[0105] Step S1130, performing reflow soldering on the circuit board in a reflow furnace so that the patch material is fixed to the circuit board through solder paste.

[0106] The reflow oven will generate high temperature, causing some flux and other additives in the solder paste to volatilize, and the tin powder in the solder paste will melt to form liquid solder. During the cooling process of the reflow oven, the liquid tin solidifies to form tin blocks that stick to the pads on the circuit board, so that the pins and pads of the patch material are fixedly connected, so that the patch material can be fixed to the circuit board.

[0107] In one embodiment, the reflow furnace heats the installation slot 21 where the extension pin 11 of the electrolytic capacitor 1 is located to liquefy the solder paste in the installation slot 21. During the cooling process of the reflow furnace, the liquid tin solidifies to form a tin block to fix the extension pin 11 on the solder pad in the installation slot 21, thereby completing the installation of the electrolytic capacitor 1.

[0108] like Fig.12 As shown, Fig.12 FIG. 1 is a flow chart of a circuit board manufacturing process provided by another embodiment of the present application. In one embodiment, step S1120 includes but is not limited to the following sub-steps.

[0109] Step S1210, using a chip mounter to absorb the bottom of the electrolytic capacitor and place the extended pins in the mounting groove, so that the electrolytic capacitor is mounted upside down on the circuit board.

[0110] The electrolytic capacitor 1 has an extended pin 11. The placement machine identifies and absorbs the bottom of the electrolytic capacitor 1, and inverts the electrolytic capacitor 1 on the mounting groove 21 of the circuit board. There is a solder pad on the mounting groove 21. The solder pad is coated with solder paste with a certain viscosity through step S1110, so that the electrolytic capacitor 1 can be stably mounted on the circuit board 2 and wait for subsequent welding.

[0111] like Fig.13 As shown, Fig.13 It is a flow chart of a circuit board preparation process provided by another embodiment of the present application. In one embodiment, the patch material used for processing the circuit board also includes but is not limited to the spring 22 in the above embodiments, including but not limited to the spring body 221 and the auxiliary platform 222, the spring body 221 is connected to the auxiliary platform 222, the auxiliary platform 222 is installed on the circuit board 2, and the auxiliary platform 222 is used to be recognized and sucked by the patch machine. Based on the spring 22, step S1120 includes but is not limited to the following sub-steps.

[0112] Step S1310, using the placement machine to suck the auxiliary platform of the spring and place the spring on the circuit board.

[0113] The auxiliary platform 222 is identified by the placement machine, so that the spring 22 can be sucked by the placement machine and placed at a corresponding position on the circuit board.

[0114] It should be understood that the specific content of the placement here is diverse and can be the following embodiments.

[0115] In one embodiment, the spring 22 is mounted on the circuit board by means of a clamping method. At this time, the mounting machine places the auxiliary platform 222 of the spring 22 at a corresponding clamping position on the circuit board to complete the installation process of the spring 22.

[0116] In one embodiment, the spring 22 is installed on the circuit board by welding. At this time, the placement machine places the auxiliary platform 222 of the spring 22 at the corresponding pad position on the circuit board, and the auxiliary platform 222 is temporarily fixed by the solder paste on the pad, and then fixed in the reflow oven.

[0117] like Fig.14 As shown, Fig.14 FIG. 1 is a flow chart of a circuit board manufacturing process provided by another embodiment of the present application. In one embodiment, after step S1130, the circuit board manufacturing process further includes but is not limited to the following steps.

[0118] Step S1410, performing optical inspection, glue dispensing, burning, assembly and testing on the circuit board.

[0119] In one embodiment, the quality of solder on the pads on the surface of the circuit board is detected by optical detection processing to ensure that the patch material is soldered in place.

[0120] In one embodiment, the anti-interference degree of the solder joints on the circuit board is improved through glue dispensing treatment, the solder joints are prevented from loosening when the circuit board is subjected to shock, moisture-proof insulation is achieved, and the reliability of the circuit board is improved.

[0121] In one embodiment, the control program is burned into the relevant controller through a burning process, so that the circuit board has certain control functions.

[0122] In one embodiment, a circuit board with certain control functions is assembled into the remote controller in each of the above embodiments through an assembly process.

[0123] In one embodiment, the reliability of the remote controller is ensured by testing whether the assembled remote controller has abnormal control phenomenon.

[0124] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connection", "direct connection", "indirect connection", "fixed connection", "installation", and "assembly" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; the terms "installation", "connection", and "fixed connection" can be a direct connection, or an indirect connection through an intermediate medium, or the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0125] Although the implementation methods disclosed in this application are as above, the contents are only implementation methods adopted to facilitate understanding of this application, and are not intended to limit this application. Any technician in the field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of patent protection of this application shall still be defined by the attached claims.

[0126] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above implementation mode. Technical personnel familiar with the field can also make various equivalent modifications or substitutions under the shared conditions without violating the spirit of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. An electrolytic capacitor, characterized in that: Used to be installed on a circuit board, the circuit board is provided with a mounting groove; the electrolytic capacitor comprises: An extension pin, wherein the extension pin is installed in the installation slot; The electrolytic capacitor is used to be identified and absorbed by a chip mounter and is mounted upside down on the circuit board.

2. The electrolytic capacitor according to claim 1, characterized in that: The extension pin is located at the bottom of the electrolytic capacitor, one end of the extension pin is connected to the inside of the electrolytic capacitor, and the other end protrudes from the edge of the bottom of the electrolytic capacitor. The bottom of the electrolytic capacitor is used to be identified and sucked by a placement machine.

3. A circuit board, characterized in that: Comprising the electrolytic capacitor as claimed in claim 1 or 2.

4. The circuit board according to claim 3, characterized in that: The circuit board also includes a spring, which includes a spring body and an auxiliary platform. The spring body is connected to the auxiliary platform, and the auxiliary platform is installed on the circuit board. The auxiliary platform is used to be identified and sucked by a placement machine.

5. The circuit board according to claim 4, characterized in that: The spring body is provided with an extension portion, and the spring body is fixed to the auxiliary platform through the extension portion.

6. The circuit board according to claim 4, characterized in that: The auxiliary platform is a metal sheet or a Mylar sheet.

7. The circuit board according to claim 4, characterized in that: The spring body is formed by winding a wire and is in a plane shape.

8. The circuit board according to claim 5, characterized in that: The circuit board is also provided with a chip light emitting diode and a separate backlight device.

9. A remote controller, characterized in that: Comprising a circuit board as claimed in any one of claims 3 to 8.

10. An air conditioning system, characterized in that: It comprises an air conditioning unit and a remote controller as claimed in claim 9, wherein the remote controller is used to control the operation of the air conditioning unit.

11. A circuit board manufacturing process, characterized in that: include: Apply solder paste on the circuit board; The patch material is sucked onto the circuit board by a patch machine, wherein the patch material includes the electrolytic capacitor according to claim 1 or 2, and the circuit board is provided with a mounting groove for mounting the electrolytic capacitor; The circuit board is subjected to reflow soldering in a reflow furnace so that the patch material is fixed to the circuit board through the solder paste.

12. The circuit board preparation process according to claim 11, characterized in that: The step of sucking the patch material onto the circuit board by using a patch machine includes: The bottom of the electrolytic capacitor is sucked by a chip mounter and the extension pin is placed in the mounting groove, so that the electrolytic capacitor is mounted upside down on the circuit board.

13. The circuit board preparation process according to claim 11, characterized in that: The patch material further includes a spring, the spring includes a spring body and an auxiliary platform, the spring body is connected to the auxiliary platform, the auxiliary platform is mounted on the circuit board, and the auxiliary platform is used to be identified and sucked by the patch machine; The step of sucking the patch material onto the circuit board by the patch machine also includes: The auxiliary platform of the spring is sucked by a placement machine, and the spring is placed on the circuit board.

14. The circuit board preparation process according to claim 11, characterized in that: After the circuit board is subjected to reflow soldering in a reflow furnace, the circuit board preparation process further includes: performing optical inspection processing, glue dispensing processing, burning processing, assembly processing and testing processing on the circuit board.

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