Manufacturing method of large-current-carrying flexible circuit board

Abstract

The invention discloses a method for manufacturing a large current-carrying flexible circuit board, which comprises the following steps of: splicing a plurality of independent large current-carrying flexible circuit boards on a spliced board, designing that one independent large current-carrying flexible circuit board forms an acute angle relative to the board edge and an independent board adjacent to the independent large current-carrying flexible circuit board forms a negative equal angle with the board edge, and taking a thick copper layer, manufacturing a circuit pattern for part of the thickness, forming a first half-circuit pattern, pressing and covering one surface of the half-circuit pattern with a first windowing covering film, manufacturing a circuit pattern for the rest of the thickness of the thick copper layer, forming a second half-circuit pattern, forming a thick copper single-surface pattern plate, pressing and covering one surface of the second half-circuit pattern with a second windowing covering film, and pressing; forming a large current-carrying flexible circuit board; the non-parallel jointed board design is adopted, the gummosis filling capacity of the covering film is improved, the thick copper layer is manufactured twice to form a complete circuit pattern, and lateral erosion is reduced; the whole manufacturing method forms a design and processing process which is matched with each other, and an effective and feasible whole technical effect is formed.

Description

Technical Field

[0001] The invention relates to the field of flexible circuit board processing, and in particular to a method for manufacturing a large current-carrying flexible circuit board. Background Art

[0002] The development of fields such as intelligent connected vehicles and low-altitude aircraft has promoted the continuous improvement of flexible circuit board technology capabilities. For some electronic modules that need to carry large currents and require flexible installation, large-current-carrying flexible circuit board designs with thick copper lines have emerged.

[0003] The copper thickness of high current-carrying flexible circuit boards is relatively thick, and they are generally designed as single-layer circuits. The processing process generally starts with taking a single-sided thick copper flexible copper-clad board, processing the circuit pattern to form a single-sided graphic board, and then pressing and laminating one side of the covering film to form a high current-carrying flexible circuit board.

[0004] During the graphics processing of the circuit board, side etching will occur when the circuit pattern is etched. Generally, the thicker the copper, the greater the side etching. Excessive side etching affects the line width and line spacing. In severe cases, burrs, excessively large rounded corners, and even line disconnection will form, resulting in reduced circuit board reliability and working performance. For high-current-carrying flexible circuit boards, large side etching will also occur during the etching process. In addition, since the insulating dielectric layer of the single-sided flexible copper-clad laminate is relatively soft, the irregular side etching produced during etching is even greater.

[0005] When laminating one side of the covering film, due to the thickness of the thick copper circuit is thick, the circuit gap depth is large, and the thickness of the covering film is limited, there is a problem that the covering film is difficult to effectively cover and fill the circuit gap during the lamination process. Currently, increasing pressure and raising temperature are used to improve the reliability of laminating the covering film, but it is easy to cause the covering film to be crushed or the circuit to deform.

[0006] Therefore, based on the above background and technology, it is necessary to provide a method for effectively improving the circuit pattern etching process and the cover film lamination process of a large current-carrying flexible circuit board. Summary of the invention

[0007] The present invention aims to solve the problem that a large current-carrying flexible circuit board with a thick copper circuit design has excessive circuit side etching during processing, and a pressed cover film is difficult to effectively cover the thick copper circuit and fill the circuit gap. A method for manufacturing a large current-carrying flexible circuit board is proposed, and the manufacturing method comprises the following steps: S10: Assembling a plurality of independent high-current-carrying flexible circuit boards on the panel, wherein one independent high-current-carrying flexible circuit board is designed to be at an acute angle relative to the panel edge of the panel, and an adjacent independent high-current-carrying flexible circuit board is designed to be at an equal negative angle relative to the panel edge of the panel, to form a panel design; S20: taking the thick copper layer, making a circuit pattern on a part of the thickness to form a first half circuit pattern, pressing a first window cover film on one side of the half circuit pattern, and then making a circuit pattern on the remaining part of the thickness of the thick copper layer to form a second half circuit pattern, thereby forming a thick copper single-sided pattern board; S30: pressing a second window cover film onto one side of the second half circuit pattern, performing lamination, and then performing post-processing to form the large current-carrying flexible circuit board.

[0008] Furthermore, the forming of the thick copper single-sided graphic board also includes: laminating a first window cover film on one side of the half-circuit pattern, then forming a wet film layer on the surface of the first window cover film, attaching a first dry film layer to the surface of the wet film layer, attaching a second dry film layer to the surface of the remaining thickness of the thick copper layer, then forming a circuit pattern on the remaining thickness of the thick copper layer to form a second half-circuit pattern, and then stripping the film to form a thick copper single-sided graphic board.

[0009] Furthermore, a first dry film protective film layer is attached to the surface of the first dry film layer, and a second dry film protective film layer is attached to the surface of the second dry film layer; the process of making a circuit pattern on the remaining thickness of the thick copper layer includes: exposing the first dry film layer and the second dry film layer, tearing off the second dry film protective film layer, and then performing development and etching in sequence, and then tearing off the first dry film protective film layer, and then stripping the film.

[0010] Furthermore, the forming of the high current-carrying flexible circuit board further comprises: S310: Take a single-sided copper-clad laminate and make a mesh pattern to form a mesh pattern clad laminate; S320: taking a second window cover film, and stacking the second window cover film on one side of the second half circuit pattern to form a flexible board stacking structure; S330: taking a plurality of release layers and a plurality of coating films, sequentially placing the mesh pattern coating plate and the coating film outwardly on both sides of the flexible board stacking structure, and placing release layers between the flexible board stacking structure and the mesh pattern coating plate, and between the mesh pattern coating plate and the coating film. Then, a release layer is provided on the outer surface to form a laminated structure; The mesh patterns are all arranged away from the flexible board stacking structure; S340: placing the laminated stacked structure in a press for lamination, and then performing post-processing to form the large current-carrying flexible circuit board.

[0011] Furthermore, the mesh pattern is produced by: the size of one side of the single-sided copper clad laminate is larger than the flexible board stacking structure, and the mesh pattern is produced on the entire copper layer of the single-sided copper clad laminate.

[0012] Optionally, the mesh pattern is produced as follows: the size of the single-sided copper clad laminate is larger on one side than the flexible board stacking structure, and a plurality of mesh patterns are produced toward the copper layer of the single-sided copper clad laminate, referring to the distribution of each of the large current-carrying flexible circuit boards in the panel design, each of the mesh patterns corresponds to the distribution of each of the large current-carrying flexible circuit boards, and the size of each of the mesh patterns is larger on one side than each of the large current-carrying flexible circuit boards.

[0013] Furthermore, the mesh number of the mesh pattern is 10 to 80, and the line width of the mesh pattern is 50 μm to 125 μm.

[0014] Furthermore, the glue content of the dielectric layer of the single-sided copper clad laminate is 60% to 68%.

[0015] Furthermore, the thickness of the thick copper layer is greater than or equal to 105 μm.

[0016] Furthermore, the acute angle is an angle of 0.5° to 5°.

[0017] The technical solution of the present invention adopts a panel design that forms a certain angle between two adjacent separate large current-carrying flexible circuit boards, so that the colloid forms a certain obstacle to the flow of glue in the long direction during the pressing process, provides more flow glue filling effect for the longitudinal direction, and improves the covering, bonding, and filling capabilities of the subsequent pressed window covering film; the thick copper layer is etched from different sides twice to form a complete circuit pattern, and at the same time, the method of making wet film and sticking dry film is combined to effectively improve the ability to make thick copper circuit patterns, and reduce the side etching or incomplete etching of thick copper circuits. Problems; further, a mesh pattern covering plate is formed by making a grid pattern, and used as a covering buffer layer during the pressing process, effectively improving the directional covering ability of the pressed window covering film, and improving the effect of the covering film glue layer in filling the circuit gap, preventing pressing voids, delamination, and even bursting of the board; the overall production method forms a design and processing process that cooperates with each other, forming an effective and feasible overall technical effect, which not only improves the ability of the thick copper layer to make circuit patterns, but also improves the ability of the covering film and the thick copper circuit to combine with each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 The overall process flow chart of the flexible circuit board according to the embodiment of the present invention; Figure 2 It is a schematic diagram of the planar structure of the overall jigsaw puzzle according to the embodiment of the present invention; Figure 3 A schematic diagram of the cross-sectional structure of a separate half-circuit graphic board according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the cross-sectional structure of a separate film-sticking board according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of a separate complete etched circuit board according to an embodiment of the present invention; Figure 6 A schematic diagram of the cross-sectional structure of a single thick copper single-sided graphic board according to an embodiment of the present invention; Figure 7 A specific process flow chart for manufacturing a flexible circuit board according to an embodiment of the present invention; Figure 8 It is a schematic cross-sectional structure diagram of the overall pressed and stacked structure of an embodiment of the present invention; Fig. 9 It is a schematic diagram of the planar structure of the mesh pattern cover plate as a whole according to the embodiment of the present invention; Fig.10 It is a schematic diagram of the planar structure of another integral mesh pattern cover plate according to an embodiment of the present invention; Fig.11 It is a schematic diagram of the cross-sectional structure of a single large current-carrying flexible circuit board according to an embodiment of the present invention; Fig.12 This is a physical slice diagram of a high current-carrying flexible circuit board manufactured according to an embodiment of the present invention.

[0020] Description of Figure Numbers:

[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0026] See also Figure 1 ; Figure 1 The process flow chart of the flexible circuit board according to the embodiment of the present invention is shown in FIG.

[0027] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0028] See also Figure 2 ; Figure 2 A schematic diagram of the planar structure of the overall panel design of an embodiment of the present invention.

[0029] Step S10: A plurality of independent high-current-carrying flexible circuit boards 110 are assembled on the panel 10, wherein one of the independent high-current-carrying flexible circuit boards 110 is designed to be at an acute angle relative to the edge of the panel 10, and the adjacent independent high-current-carrying flexible circuit boards 110 are designed to be at an equal negative angle to the edge of the panel 10, thereby forming a panel 10 design.

[0030] Generally, a single large current-carrying flexible circuit board 110 is relatively small in size, and multiple single flexible circuit boards 110 need to be assembled on a large-sized board for processing, that is, processed by a panel 10 to improve processing efficiency; due to existing processing requirements, the shape of the panel 10 is generally designed to be rectangular, so the separate sub-boards distributed on its board surface are generally arranged in a direction parallel or perpendicular to the board body.

[0031] In the present embodiment, since the copper thickness of the large current-carrying flexible circuit board is relatively thick and it carries large current and plays a simple connection role, it is generally designed as an independent circuit layer of a single-layer copper. During pressing, a large pressure is required to allow the colloid of the insulating dielectric layer to fully fill the circuit gap. If the existing sub-board is arranged in a direction parallel or perpendicular to the board body, it is easy for the colloid filled between the layers to flow more along the long direction of the circuit distribution during pressing, and the flow along the longitudinal direction of the circuit distribution is blocked by the line and the glue flow is smaller. It is easy for the glue to flow too much along the long direction, making it difficult to effectively fill the circuit gap, resulting in problems such as poor glue filling and pressing voids.

[0032] Therefore, a design method of forming a certain angle between two adjacent independent large current-carrying flexible circuit boards 110 is adopted, so that the colloid can form a certain obstacle to the flow of glue in the long direction during the pressing process, providing more glue filling effect in the longitudinal direction.

[0033] Optionally, a compensating copper pattern (not shown in the drawings) is designed for the ineffective area of ​​the panel 10 where the large current-carrying flexible circuit board is not distributed. That is, a uniformly distributed copper mesh, copper wire and other patterns are designed on the copper layer at this position. This can further balance the glue flow and pressing thickness control effects during the pressing process and prevent problems such as pressing slide plates and displacement.

[0034] In this embodiment, the acute angle is 0.5° to 5°; since the area of ​​the panel 10 is limited, it is necessary to effectively utilize the area of ​​the panel 10, and the angle design can satisfy the condition of forming a certain angle between two adjacent separate large current-carrying flexible circuit boards 110.

[0035] See also Figures 3 to 6 ; Figure 3 It is a schematic cross-sectional structure diagram of a separate first half circuit graphic board according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the cross-sectional structure of a separate film-sticking board according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the cross-sectional structure of a separate complete etched circuit board according to an embodiment of the present invention; Figure 6 It is a schematic diagram of the cross-sectional structure of a single thick copper single-sided graphic board according to an embodiment of the present invention.

[0036] Step S20: A thick copper layer is taken, and a circuit pattern is made for a part of the thickness to form a first half circuit pattern 210. A first window cover film 220 is pressed onto one side of the half circuit pattern to form a first half circuit pattern board 20A on the entire board. Then, a circuit pattern is made for the remaining thickness of the thick copper layer to form a second half circuit pattern 230. The circuit board 20C is completely etched to form a thick copper single-sided pattern board 20.

[0037] Since the thick copper layer is thick, one-time etching is prone to problems such as excessive side etching and incomplete etching, so the method of etching in batches is adopted; according to the thickness of the specific thick copper layer, the thickness of the part of the circuit pattern made for the first time can be determined to be 1 / 2 to 1 / 3 of the overall thickness.

[0038] In this embodiment, the forming of the thick copper single-sided pattern board further includes: pressing a first window cover film 220 (see Figure 3 ), then, a wet film layer 240 is formed on the surface of the first window cover film 220, a first dry film layer 250 is attached to the surface of the wet film layer 240, and a second dry film layer 260 is attached to the surface of the remaining thickness of the thick copper layer (see Figure 4 ), forming a film board 20B, and then making a circuit pattern for the remaining thickness of the thick copper layer to form a second half circuit pattern 230 (see Figure 5 ), and then strip the film to form a thick copper single-sided graphic board 20 (see Figure 6 ).

[0039] The first half circuit pattern 210 and the second half circuit pattern 230 form a complete circuit pattern 270 .

[0040] Since the thick copper is thick, the first half circuit pattern 210 forms a certain height difference, and the cover film is a window cover film. After the lamination is completed, there is a window area between the first half circuit pattern 210 and the first half circuit pattern 210. If the dry film is directly attached to make the subsequent circuit pattern, it is easy to form a loose film and voids in the height difference and the window area, which affects the subsequent exposure and development of the dry film. Therefore, this embodiment adopts a manufacturing method of first making a wet film layer 240 on the surface of the first window cover film 220, and attaching the first dry film layer 250 to the surface of the wet film layer 240. A wet film is used to fill the depressions with high and low differences and the height difference of the window area to improve the flatness of the board surface, and then a dry film layer is attached to form a good dry film attachment; it is worth noting that since the side that has been covered with the first window cover film 220 does not need to make the first half circuit pattern 210, the wet film layer 260 is made and then the first dry film layer 250 is attached, and there will be no processing impact due to the excessive thickness of the photosensitive film; the thick copper layer of the remaining thickness on the other side, since the surface itself is relatively flat, adopts the normal processing flow of attaching the second dry film layer 260 to make the circuit pattern.

[0041] Since the covering film needs to expose the positions of the circuit patterns such as the plug circuit, the welding circuit, and the connecting circuit, the covering film of this embodiment adopts a window covering film; the wet film layer can be made by coating or silk screen printing.

[0042] In this embodiment, a first dry film protective film layer 2520 is attached to the surface of the first photosensitive layer 2510 of the first dry film layer 250, and a second dry film protective film layer 2620 is attached to the surface of the second photosensitive layer 2610 of the second dry film layer; the process of making a circuit pattern on the remaining thickness of the thick copper layer includes: exposing the first dry film layer 250 and the second dry film layer 260, tearing off the second dry film protective film layer 2620, then performing development and etching in sequence, then tearing off the first dry film protective film layer 2520, and then stripping the film.

[0043] Since there is no need to make a circuit pattern on one side of the first window cover film 220, when making the circuit pattern of the thick copper layer of the remaining thickness on the other side, the first dry film layer 250 may be physically or chemically affected during the processing, and the first dry film layer 250 itself has the first dry film protective film layer 2520. Therefore, during processing, the first dry film protective film layer 2520 is retained first and torn off before the film is removed, which can effectively reduce the processing risk and effectively improve the support of the board during the processing.

[0044] In this embodiment, the thickness of the thick copper layer is greater than or equal to 105 μm; this embodiment produces a large current-carrying thick copper flexible circuit board, so the copper thickness needs to be thicker to be suitable for the technical process of this embodiment.

[0045] See also Figures 7 to 12 ; Figure 7 A specific process flow chart for manufacturing a flexible circuit board according to an embodiment of the present invention; Figure 8 It is a schematic cross-sectional structure diagram of the overall pressed and stacked structure of an embodiment of the present invention; Fig. 9 It is a schematic diagram of the planar structure of the mesh pattern cover plate as a whole according to the embodiment of the present invention; Fig.10 It is a schematic diagram of the planar structure of another integral mesh pattern cover plate according to an embodiment of the present invention; Fig.11 It is a schematic diagram of the cross-sectional structure of a single large current-carrying flexible circuit board according to an embodiment of the present invention; Fig.12 This is a physical slice diagram of a high current-carrying flexible circuit board manufactured according to an embodiment of the present invention.

[0046] Step S30: A second window cover film 280 is pressed onto one side of the second half circuit pattern 230 , and then pressed and processed in a post-processing step to form the high current-carrying flexible circuit board 40 .

[0047] In this embodiment, the forming of the high current-carrying flexible circuit board 40 further includes: S310: Take a single-sided copper clad laminate and make a mesh pattern 3210, wherein the insulating dielectric layer of the single-sided copper clad laminate forms a coating layer 3220 to form a mesh pattern coating board 320.

[0048] S320: Take the second window cover film 280 and stack the second window cover film 280 on one side of the second half circuit pattern 230. Figure 8 The middle stack is formed on the thick copper single-sided pattern board 20 to form a flexible board stack structure 310 .

[0049] S330: taking a plurality of release layers 330 and a plurality of coating films 340, sequentially placing the mesh pattern coating plate 320 and the coating film 340 outwardly on both sides of the flexible board stacking structure 310, and placing release layers 330 between the flexible board stacking structure 310 and the mesh pattern coating plate 320, and between the mesh pattern coating plate 320 and the coating film 340, and then placing release layers 330 on the outer surface to form a pressed stacking structure 30; The mesh patterns 3210 are all arranged away from the flexible board stacking structure 310 .

[0050] S340: placing the laminated stacked structure 30 on a press table 350 of a press for lamination, and then performing post-processing to form the high current-carrying flexible circuit board 40.

[0051] Since the first half circuit pattern 210 and the second half circuit pattern 230 form a complete circuit pattern 270, and the second window covering film 280 is pressed and covered, it is not only necessary for the second window covering film 280 to be able to cover the second half circuit pattern 230, but also necessary to complete the processing under the support and buffering effect of the first window covering film 220, that is, it is essentially a process of simultaneously pressing and filling the first window covering film 220 and the second window covering film 280 to cover the complete circuit pattern.

[0052] In this embodiment, a mesh patterned coating plate 320 is set as the first buffer coating layer. In this embodiment, the glue content of the dielectric layer of the single-sided copper clad laminate is 60% to 68%; and a coating film 340 is set as the second buffer coating layer, which can effectively ensure the coating property during the lamination process.

[0053] In this embodiment, the mesh pattern 3210 is made by: the size of the single-sided copper clad board is larger than the flexible board stacking structure 310 on one side, and the mesh pattern 3210 is made on the entire copper layer of the single-sided copper clad board, such as Fig. 9 As shown, a first mesh pattern cover plate 320A is produced.

[0054] The mesh pattern 3210 can improve the ability of directional glue flow, prevent the glue from excessively flowing along the length direction of the complete circuit pattern 270, and make the glue flow more effectively in the thickness direction.

[0055] In an optional embodiment, the mesh pattern 3210 is made as follows: the size of the single-sided copper clad laminate is larger than the flexible board stacking structure 310 on one side, and the copper layer of the single-sided copper clad laminate is made with reference to the distribution of each individual large current-carrying flexible circuit board 110 in the design of the panel 10 to make a plurality of mesh patterns 3210, each mesh pattern 3210 corresponds to the distribution of each individual large current-carrying flexible circuit board 110, and the size of each mesh pattern 3210 is larger than each individual large current-carrying flexible circuit board 110 on one side, such as Fig.10 As shown, a second mesh pattern cover plate 320B is produced.

[0056] The grid pattern 3210 is designed and manufactured to match each individual high-current-carrying flexible circuit board 110 to form a precise coating on each individual high-current-carrying flexible circuit board 110, and other colloids used to make the mesh pattern 3210 can flow more fully to prevent the coating ability from being weakened.

[0057] In this embodiment, the mesh number of the mesh pattern 3210 is 10 to 80 meshes, and the line width of the mesh pattern 3210 is 50 μm to 125 μm.

[0058] According to the actual application requirements, the mesh size should not be too large, otherwise the coating buffering capacity of the coating layer will be greatly reduced. Similarly, the line width should not be too wide.

[0059] In this embodiment, the release layer 330 plays a role in releasing the mold during and after the lamination process. The material of the release layer 330 can be PI, PTFE or TPX, etc.

[0060] In this embodiment, the pressing can be performed by rapid pressing, with the maximum pressure being 15kg / cm² to 25kg / cm² and the maximum temperature being 120℃ to 160℃ for 15 to 30 minutes; or a traditional pressing machine can be used for pressing, with the maximum pressure being 220PSI to 280PSI and the maximum temperature being 150℃ to 180℃ for 10 to 20 minutes.

[0061] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a large current-carrying flexible circuit board, characterized in that: The production method comprises the following steps: S10: Assembling a plurality of independent high-current-carrying flexible circuit boards on the panel, wherein one independent high-current-carrying flexible circuit board is designed to be at an acute angle relative to the panel edge of the panel, and an adjacent independent high-current-carrying flexible circuit board is designed to be at an equal negative angle relative to the panel edge of the panel, to form a panel design; S20: taking the thick copper layer, making a circuit pattern on a part of the thickness to form a first half circuit pattern, pressing a first window cover film on one side of the half circuit pattern, and then making a circuit pattern on the remaining part of the thickness of the thick copper layer to form a second half circuit pattern, thereby forming a thick copper single-sided pattern board; S30: pressing a second window cover film onto one side of the second half circuit pattern, performing lamination, and then performing post-processing to form the large current-carrying flexible circuit board.

2. The method for manufacturing a large current-carrying flexible circuit board according to claim 1, characterized in that: The forming of the thick copper single-sided pattern board also includes: laminating a first window cover film on one side of the half-circuit pattern, then forming a wet film layer on the surface of the first window cover film, attaching a first dry film layer to the surface of the wet film layer, attaching a second dry film layer to the surface of the remaining thickness of the thick copper layer, then forming a circuit pattern on the remaining thickness of the thick copper layer to form a second half-circuit pattern, and then stripping the film to form a thick copper single-sided pattern board.

3. A method for manufacturing a high current-carrying flexible circuit board as claimed in claim 1 or 2, characterized in that: A first dry film protective film layer is attached to the surface of the first dry film layer, and a second dry film protective film layer is attached to the surface of the second dry film layer; The step of producing a circuit pattern on the remaining portion of the thick copper layer comprises: The first dry film layer and the second dry film layer are exposed, the second dry film protective film layer is torn off, and then development and etching are performed in sequence, and then the first dry film protective film layer is torn off and then the film is stripped.

4. The method for manufacturing a high current-carrying flexible circuit board according to claim 1, characterized in that: The forming of the large current-carrying flexible circuit board also includes: S310: Take a single-sided copper-clad laminate and make a mesh pattern to form a mesh pattern clad laminate; S320: taking a second window cover film, and stacking the second window cover film on one side of the second half circuit pattern to form a flexible board stacking structure; S330: taking a plurality of release layers and a plurality of coating films, sequentially placing the mesh pattern coating plate and the coating film outwardly on both sides of the flexible board stacking structure, and placing release layers between the flexible board stacking structure and the mesh pattern coating plate, and between the mesh pattern coating plate and the coating film. Then, a release layer is provided on the outer surface to form a laminated structure; The mesh patterns are all arranged away from the flexible board stacking structure; S340: placing the laminated stacked structure in a press for lamination, and then performing post-processing to form the large current-carrying flexible circuit board.

5. The method for manufacturing a high current-carrying flexible circuit board according to claim 4, characterized in that: The mesh graphics are made as follows: The size of the single-sided copper-clad laminate is larger on one side than the flexible board stacking structure, and the mesh pattern is made on the entire copper layer of the single-sided copper-clad laminate.

6. The method for manufacturing a high current-carrying flexible circuit board according to claim 4, characterized in that: The mesh graphics are made as follows: The size of the single-sided copper-clad laminate is larger than that of the flexible board stacking structure. To the copper layer of the single-sided copper clad laminate, referring to the distribution of each of the large current-carrying flexible circuit boards in the panel design, a plurality of mesh patterns are made, each of the mesh patterns corresponding to the distribution of each of the large current-carrying flexible circuit boards, The size of each mesh pattern is larger than that of each large current-carrying flexible circuit board.

7. A method for manufacturing a high current-carrying flexible circuit board as claimed in claim 5 or 6, characterized in that: The mesh number of the mesh pattern is 10 to 80, and the line width of the mesh pattern is 50 μm to 125 μm.

8. The method for manufacturing a high current-carrying flexible circuit board according to claim 4, characterized in that: The glue content of the dielectric layer of the single-sided copper clad laminate is 60% to 68%.

9. The method for manufacturing a high current-carrying flexible circuit board according to claim 1, characterized in that: The thickness of the thick copper layer is greater than or equal to 105 μm.

10. The method for manufacturing a high current-carrying flexible circuit board according to claim 1, characterized in that: The acute angle is an angle of 0.5° to 5°.

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