Communication equipment

Abstract

The invention provides communication equipment, relates to the technical field of communication, and aims to solve the technical problem of poor heat dissipation effect of the communication equipment. The communication equipment provided by the invention can comprise a shell, a first heating assembly, a second heating assembly and an air guide pipe, the shell is provided with a heat dissipation air channel, an air inlet and an air outlet, wherein the air inlet and the air outlet are communicated with the heat dissipation air channel. The first heating assembly and the second heating assembly are located in the heat dissipation air channel. The air guide pipe is located in the heat dissipation air duct and provided with an air inlet end and an air outlet end, and the air inlet end communicates with the air inlet; the first heating assembly is located at the air outlet end of the air guide pipe. A part of air entering from the air inlet can dissipate heat of the second heating assembly, and the other part of air can cool the first heating assembly through the air guide pipe, so that the heat dissipation efficiency of the first heating assembly can be ensured.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a communication device. Background Art

[0002] With the rapid development of electronic technology, the integration of electronic equipment is getting higher and higher, and the heat density is also getting higher and higher. In order to ensure that electronic components have good performance and reliability, it is usually necessary to dissipate heat from electronic components. In current electronic equipment, air cooling is usually used to dissipate heat from electronic components. The heat of electronic components is reduced by air flowing through the surface of electronic components to control the electronic components to work within a reasonable temperature range. Existing indoor baseband processing units (building base band unit, BBU), radio HUB (radio HUB, RHUB) and other communication equipment are mainly used in scenes such as office buildings, shopping malls, subways, etc. to achieve functions such as signal encryption and blind spot filling. Such communication equipment has high requirements for heat dissipation and noise, and the heat dissipation requirements of different electronic components in communication equipment are also different. However, in order to meet the needs of electronic components with high heat dissipation requirements, the prior art usually achieves this by increasing the heat dissipation capacity of the entire communication equipment. For example, the air volume of the fan and the number of fans used are usually directly increased. This solution lacks research and optimization of actual application equipment. Increasing the number of fans will increase the volume and weight of the communication equipment, and increasing the fan air volume will bring about a larger noise problem. Therefore, how to improve the heat dissipation performance of some electronic components in communication equipment has become a technical problem that needs to be solved urgently. Summary of the invention

[0003] The present application provides a communication device with good heat dissipation performance.

[0004] The communication device may include a housing, a first heating component, a second heating component and an air duct. The housing has a heat dissipation air duct and an air inlet and an air outlet connected to the heat dissipation air duct, and the first heating component and the second heating component are both located in the heat dissipation air duct. The air duct is located in the heat dissipation air duct, and the air duct has an air inlet end and an air outlet end, and the air inlet end is connected to the air inlet. Among them, the first heating component is located at the air outlet end of the air duct. In actual application, the outside air can enter the heat dissipation air duct from the air inlet and be discharged from the air outlet. Among them, a part of the air entering from the air inlet flows through the second heating component to dissipate the heat of the second heating component and is finally discharged from the air outlet. In addition, the air inlet end of the air duct is connected to the air inlet, so that another part of the air entering from the air inlet enters the air duct from the air inlet end and is discharged from the air outlet end. The first heating component is located at the air outlet end of the air duct, so the air discharged from the air outlet end can cool the first heating component when flowing through the first heating component, thereby ensuring the heat dissipation efficiency of the first heating component.

[0005] In a specific configuration, the air duct may have a heat-insulating side wall, and the heat-insulating side wall is disposed toward the second heating component. The heat generated by the second heating component can be effectively blocked by the heat-insulating side wall, thereby preventing the heat generated by the second heating component from being transferred into the air duct, thereby preventing the temperature of the air in the air duct from increasing, thereby effectively ensuring the heat dissipation efficiency of the first heating component.

[0006] Alternatively, in a specific configuration, the entire air duct may also be made of a heat-insulating material, thereby improving the convenience during production and helping to reduce the volume of the heat-conducting pipe.

[0007] In one example, the air duct may have an air inlet end and multiple air outlet ends. The air duct may also have a guide plate, which is used to guide the flow in the air duct to each air outlet end. The guide plate may effectively distribute and guide the flow in the air duct, so that each air outlet end has sufficient flow, thereby ensuring the heat dissipation efficiency of the communication equipment.

[0008] In specific settings, the air duct can be long and strip-shaped, and multiple air outlet ends are sequentially arranged along the length direction of the air duct, so that the length dimension of the air duct can be efficiently utilized, so that the air duct can have more air outlet ends. In specific settings of the guide plate, multiple guide plates can be sequentially arranged along the length direction of the air duct, so that the airflow in the air duct can be effectively distributed and guided.

[0009] In a specific configuration, in the connection path between the air inlet end and the air outlet end of the air guide duct, the air guide duct may be in a straight line or in a curved line.

[0010] In one example, the diameter of the air inlet is larger than the diameter of the air inlet end, so that part of the air entering through the air inlet can dissipate heat for the second heating component, and the other part can dissipate heat for the first heating component through the air duct, thereby effectively taking into account the heat dissipation efficiency of the first heating component and the second heating component.

[0011] In a specific configuration, the communication device may further include a first fan, which is located at an air inlet or an air outlet of the housing; or, the first fan may be arranged at both the air inlet and the air outlet. The first fan is used to draw external air into the air inlet, thereby effectively dissipating heat for the first heat generating component and the second heat generating component.

[0012] In one example, the communication device further includes a second fan. The second fan is located at the air inlet or the air outlet, or the second fan is located in the air duct. The second fan can accelerate the circulation speed of air in the air duct, thereby improving the heat dissipation efficiency of the first heat generating component.

[0013] In one example, the outer surface of the air duct may have an avoidance groove, and at least a portion of the second heat-generating component is located in the avoidance groove to prevent position interference between the second heat-generating component and the air duct.

[0014] In one example, the communication device may further include a radiator, which is located in the heat dissipation duct and is in thermal contact with the second heat generating component. The radiator can effectively increase the heat dissipation area of ​​the second heat generating component, thereby improving the heat dissipation efficiency of the second heat generating component.

[0015] In a specific configuration, the heat sink may have heat dissipation teeth, and an air duct for air circulation may be formed between two adjacent heat dissipation teeth. In addition, the air duct may be located at the top of the heat dissipation teeth, so that the air duct and the heat dissipation teeth can form a relatively closed air duct together, thereby improving the air circulation efficiency and the heat dissipation efficiency of the second heating component.

[0016] In one example, the air duct may include a tube body and a heat dissipation portion disposed outside the tube body, the heat dissipation portion being in thermal contact with the second heating component. The heat generated by the second heating component can be transferred to the heat dissipation portion and effectively dissipated through the heat dissipation portion, thereby effectively improving the heat dissipation efficiency of the second heating component.

[0017] In one example, the air duct may have a heat insulating portion, which is located between the tube body and the heat dissipation portion. The heat insulating portion can effectively isolate the heat transfer between the tube body and the heat dissipation portion to prevent the heat of the heat dissipation portion from being transferred into the tube body, thereby ensuring the heat dissipation efficiency of the first heating component.

[0018] In specific configuration, the first heat generating component may include a plurality of optical modules, and the plurality of optical modules may be sequentially arranged along the length direction of the air duct, thereby realizing effective use of space. In addition, a greater number of air outlets may be arranged along the length direction of the air duct, thereby effectively dissipating heat for the plurality of optical film blocks.

[0019] In one example, the second heating component includes a circuit board and a plurality of electronic components on the circuit board, wherein the electronic components may specifically be chips, power conversion devices, etc. In specific applications, the number and type of electronic components may be reasonably set according to actual needs.

[0020] In specific applications, the communication equipment may be an indoor baseband processing unit or a radio frequency convergence unit. By equipping the air duct, the different electronic components in the communication equipment can be specifically cooled, thereby improving the overall heat dissipation performance of the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of an application architecture of a communication device provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of a planar structure of a conventional communication device provided in an embodiment of the present application;

[0023] Figure 3 A schematic diagram of the planar structure of a communication device provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of a planar structure of a communication device provided in an embodiment of the present application;

[0025] Figure 5 A schematic diagram of the three-dimensional structure of an air duct provided in an embodiment of the present application;

[0026] Figure 6 A schematic diagram of the cross-sectional structure of an air duct provided in an embodiment of the present application;

[0027] Figure 7 A schematic diagram of the planar structure of another communication device provided in an embodiment of the present application;

[0028] Figure 8 A partial cross-sectional structural diagram of another communication device provided in an embodiment of the present application;

[0029] Fig. 9 A schematic diagram of the three-dimensional structure of another air duct provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0031] In order to facilitate understanding of the communication device provided in the embodiment of the present application, its application scenario is first introduced below.

[0032] The communication device provided in the embodiment of the present application can be applied in a digital indoor system (DIS) to achieve effective coverage of indoor communication signals.

[0033] For example, Figure 1As shown, in the digital indoor system (DIS), a pico remote radio unit (pRRU), a radio HUB (RHUB) and a building base band unit (BBU) may be included. Among them, the radio HUB can be connected to the pico remote radio unit and the indoor base band processing unit through an optoelectronic hybrid cable or a network cable. The pico remote radio unit, also known as a pico base station, is a miniaturized, low-power, low-power micro-cellular base station. It is mainly to solve the problem of indoor wireless signal coverage in a specific area. As a network element in the indoor coverage solution, the radio HUB needs to be used in conjunction with the pico remote radio unit and the indoor base band processing unit. The radio HUB is used to receive the downlink baseband data sent by the indoor base band processing unit, transmit it to the pico remote radio unit after branching processing, and send the uplink baseband data of the pico remote radio unit to the indoor base band processing unit after certain combining processing.

[0034] In actual application, the communication equipment proposed in this application can specifically be the above-mentioned indoor baseband processing unit (building base band unit, BBU), radio frequency convergence unit (radio HUB, RHUB) and other box-type communication equipment. The communication equipment can be used in scenes such as office buildings, shopping malls, subways, etc. to realize encryption and blind spot filling of communication signals. In actual application, the communication equipment can be installed in relatively closed environments such as indoor weak current wells and stairwells to facilitate good integration with the external environment. Therefore, there are high requirements for the heat dissipation performance and operating noise of the communication equipment.

[0035] In a box-type communication device, a variety of different types of electronic components are usually installed in a housing, and the heat dissipation requirements of different electronic components are also different. However, in order to meet the needs of electronic components with higher heat dissipation requirements, the prior art usually increases the heat dissipation capacity of the entire communication device. For example, the air volume of the fan and the number of fans used can be directly increased. This solution lacks research and optimization of actual application equipment. Increasing the number of fans will increase the volume and weight of the communication equipment and will bring about a larger fan noise problem.

[0036] For example, Figure 2 As shown, a radio frequency convergence unit 01 is taken as an example. The radio frequency convergence unit 01 may include a housing 011 and a fan 012, a circuit board assembly 013, an optical module 014, a power supply unit (PSU) 015 and other components arranged in the housing 011. Figure 2 The solid arrows in the figure indicate the air flow path. Figure 2It can be clearly seen that most of the air will flow through the circuit board assembly 013 and the power supply 015. Only a small amount of air can flow through the optical module 014. Among them, electronic components such as the circuit board assembly 013 and the power supply 015 have lower temperature requirements, while the optical module 014 has higher temperature requirements. In the industry, the temperature specification of the outer shell of the optical module 014 should generally be below 85°C. For some optical modules 014, in order to meet higher working performance, higher requirements are placed on heat dissipation. Therefore, in the RF convergence unit 01, the optical module 014 becomes the heat dissipation bottleneck of the entire RF convergence unit 01. It can be understood that in actual applications, multiple other types of electronic components may also be included in the RF convergence unit 01, which will not be elaborated here.

[0037] In the current scheme, a plurality of fans 012 are usually provided, and the air flow between the inside of the housing 011 and the external environment is increased by increasing the air volume of the fans 012, so as to improve the heat dissipation performance of the entire RF convergence unit 01. However, a large number of fans 012 will increase the manufacturing cost and use cost of the RF convergence unit 01, and is not conducive to reducing the volume and weight of the RF convergence unit 01. In addition, when the air volume generated by the fans 012 is large, the noise and energy consumption of the RF convergence unit 01 during operation will be significantly increased, which is not conducive to the wide application of the RF convergence unit 01. In addition, in actual applications, the circuit board assembly 013 and the power supply 015 will also generate more heat. Since the distance between the optical module 014 and the circuit board assembly 013 and the power supply 015 is relatively close, the heat generated by the circuit board assembly 013 and the power supply 015 will also be transferred to the optical module 014, which is not conducive to ensuring the heat dissipation efficiency of the optical module 014.

[0038] It is understandable that other types of communication devices also have the same problems as those of the above-mentioned RF convergence unit 01, which will not be elaborated here.

[0039] Based on this, the embodiment of the present application provides a communication device with good heat dissipation performance, so as to avoid the problem that too many fans are provided, which leads to an increase in the volume and weight of the communication device, and a large noise is generated when multiple fans are running at the same time.

[0040] In order to make the objectives, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0041] like Figure 3As shown, in an example provided in the present application, the communication device 10 may include a housing 11, a first heat generating component 12, a second heat generating component 13 and an air duct 14. The housing 11 has a heat dissipation duct 111 and an air inlet 112 and an air outlet 113 connected to the heat dissipation duct 111, and the first heat generating component 12 and the second heat generating component 13 are both located in the heat dissipation duct 111. The air duct 14 is located in the heat dissipation duct 111, and the air duct 14 has an air inlet end 141 and an air outlet end 142, and the air inlet end 141 is connected to the air inlet 112. Among them, the first heat generating component 12 is located at the air outlet end 142 of the air duct 14. In actual application, the outside air can enter the heat dissipation duct 111 from the air inlet 112 and be discharged from the air outlet 113. Among them, a part of the air entering from the air inlet 112 flows through the second heat generating component 13 to dissipate the heat of the second heat generating component 13, and finally discharged from the air outlet 113. In addition, the air inlet end 141 of the air duct 14 is connected to the air inlet 112, so another part of the air entering from the air inlet 112 enters the air duct 14 from the air inlet end 141 and is then discharged from the air outlet end 142. The first heating component 12 is located at the air outlet end 142 of the air duct 14, so the air discharged from the air outlet end 142 can cool the first heating component 12 when flowing through the first heating component 12, thereby ensuring the heat dissipation efficiency of the first heating component 12.

[0042] In the communication device 10 provided in the present application, the air flowing in from the air inlet 112 can be separated and guided by being equipped with the air guide 14. A part of the air can cool the second heating component 13, thereby ensuring the heat dissipation performance of the second heating component 13. Another part of the air can be accurately guided to the first heating component 12 through the air guide 14, thereby ensuring the heat dissipation performance of the first heating component 12. It can prevent the hot air flowing through the second heating component 13 from affecting the first heating component 12.

[0043] Or it can be understood that, in the case where the air duct 14 is not provided, the heat generated by the first heating component 12 and the second heating component 13 will be gathered in the heat dissipation duct 111, and the heat generated by the second heating component 13 will be transferred to the vicinity of the first heating component 12, thereby making the temperature near the first heating component 12 higher. After the cold air from the outside enters the heat dissipation duct 111 from the air inlet 112 of the housing 11, it is easy to generate turbulence in the heat dissipation duct 111, which is not conducive to the effective dissipation of heat. In addition, in practical applications, there are also high requirements for the layout of the first heating component 12 and the second heating component 13. For example, in order to ensure that the first heating component 12 is at a lower temperature, in the heat dissipation duct 111, the first heating component 12 needs to be located at the upper wind port of the second heating component 13. However, under the miniaturized and compact layout conditions of the communication device 10, it is difficult to achieve the above layout requirements, so there are great limitations.

[0044] In the example provided in the present application, by equipping the air duct 14, the cold air entering from the air inlet 112 can be effectively transferred to the first heating component 12, which can avoid adverse effects between the first heating component 12 and the second heating component 13. Therefore, in the entire heat dissipation duct 111, the position layout between the first heating component 12 and the second heating component 13 has good flexibility. It is helpful to achieve the miniaturization and compact setting of the communication equipment 10. For example, under the same working conditions, before and after the air duct 14 is equipped, the temperature of the first heating component 12 can drop by about 5°C, which can significantly improve the heat dissipation efficiency of the first heating component 12.

[0045] It should be noted that the first heating component 12 and the second heating component 13 mentioned above refer to two different heating components in the communication device 10. Among them, the first heating component 12 may include one electronic component or multiple electronic components. Correspondingly, the second heating component 13 may include one electronic component or multiple electronic components. Of course, in actual application, the communication device 10 may also include more heating components, and the number and type of electronic components included in each heating component may be diverse.

[0046] For example, Figure 4 As shown, in the example provided in the present application, the first heating component 12 specifically includes a plurality of optical modules 120 arranged in sequence. The second heating component 13 specifically includes a circuit board 131 and a plurality of electronic components 132 located on the circuit board 131. In practical applications, the electronic components in the second heating component 13 can specifically be chips, power conversion devices, etc., and the present application does not limit the specific types and quantities of the electronic components. In addition, the heating component in the communication device 10 can also include a power supply 15.

[0047] Of course, in actual applications, the communication device 10 may further include more heat generating components, which will not be described in detail here.

[0048] In order to facilitate understanding of the technical solution of the present application, a detailed description will be given below by taking the first heating component 12 as an optical module 120 and the second heating component 13 as a circuit board component optical module as an example.

[0049] like Figure 4 As shown, in the example provided in this application, the housing 11 is roughly rectangular, and the air inlet 112 and the air outlet 113 of the housing 11 are arranged opposite to each other, so as to have good air circulation efficiency. Figure 4 Five fans 16 are shown in the figure. The fans 16 can accelerate the circulation speed of air, so that the external air can enter the heat dissipation duct 111 from the air inlet 112 at a faster speed and be discharged from the air outlet 113.

[0050] In specific settings, the number of fans 16 may be one, two or more. In practical applications, the number of fans 16 may be flexibly adjusted according to actual needs. In addition, in some examples, the fans 16 may also be arranged at the air outlet 113, or the fans 16 may be arranged at both the air inlet 112 and the air outlet 113.

[0051] In addition, if Figure 4 As shown, the second heating component 13 is located in the heat dissipation duct 111, and the second heating component 13 has a large area. The power supply 15 has a low requirement for heat dissipation and can be arranged at the lower wind port of the second heating component 13. The air flows through the second heating component 13 from the air inlet 112 and then flows through the power supply 15, thereby cooling the second heating component 13 and the power supply 15, and finally discharged from the air outlet 113.

[0052] The plurality of optical modules 120 are arranged in sequence from the air inlet 112 to the air outlet 113, and one end (eg Figure 4 The upper end of each optical module 120 is connected to the conductive circuit in the circuit board 131. The other end of each optical module 120 can be connected to an external cable through a port in the housing 11.

[0053] In practical applications, the shape and structure of the air guide duct 14 can be various.

[0054] For example, Figures 4 to 6 As shown, in an example provided in the present application. The air duct 14 is a roughly rectangular tube structure, having an air inlet end 141 and three air outlet ends. Among them, the three air outlet ends are respectively an air outlet end 142a, an air outlet end 142b and an air outlet end 142c. The air inlet end 141 is located at one end in the length direction of the air duct 14, and the three air outlet ends are arranged in sequence along the length direction of the air duct 14, so as to achieve the side outlet effect of the air flow. In addition, through the arrangement of multiple air outlet ends, the air duct 14 can effectively dissipate heat at different positions of the first heating component 12, which can effectively improve the heat dissipation effect of the first heating component 12.

[0055] In addition, if Figure 6 As shown, in the example provided in the present application, the air duct 14 also has two guide plates, namely, guide plate 143a and guide plate 143b. The guide plate is used to guide the flow in the air duct 14 to each air outlet. Specifically, after the air enters the air duct 14 from the air inlet end 141, when it flows through the guide plate 143a, a part of the air flow can be effectively guided to the air outlet end 142a. When it flows through the guide plate 143b, a part of the air flow can be effectively guided to the air outlet end 142b. The remaining air flow can be discharged from the air outlet end 142c.

[0056] In specific configuration, the guide plate may have various structural types.

[0057] For example, Figure 6 As shown, in the example provided in the present application, each guide plate is a straight plate. Among them, the guide plate 143a and the guide plate 143b are both inclined toward the air inlet end 141, so that the airflow can be effectively guided to the corresponding air outlet end. In addition, the length of the guide plate 143a is slightly smaller than the length of the guide plate 143b, so as to achieve the average distribution of the airflow. Specifically, about 1 / 3 of the airflow entering the air guide duct 14 from the air inlet end 141 is blocked by the guide plate 143a and guided to the air outlet end 142a. In addition, about 1 / 3 is blocked by the guide plate 143b and guided to the air outlet end 142b. The remaining about 1 / 3 of the airflow flows to the air outlet end 142c.

[0058] It is understandable that the guide plates 143a and 143b are only exemplary. In actual application, the number, shape and position of the guide plates can be flexibly adjusted according to actual needs. In addition, the flow rate of air discharged from each air outlet can be the same or different, which will not be described in detail here.

[0059] In addition, in a specific implementation, the air duct 14 is in a straight line or a curved line in the connection path between the air inlet end 141 and the air outlet end of the air duct 14. Alternatively, it can be understood that the overall shape of the air duct 14 can be a straight line or a curved line, etc. In actual application, the shape of the air duct 14 can be reasonably set according to actual needs, which will not be elaborated here.

[0060] When the air outlet end 142 is provided, the air guide duct 14 may include one, two or more air outlet ends.

[0061] When the air duct 14 includes multiple air outlets, the multiple air outlets can be sequentially arranged along the length direction of the air duct 14. In addition, when the first heating component 12 includes multiple optical modules 120, the multiple optical modules 120 can be sequentially arranged along the length direction of the air duct 14 to achieve better heat dissipation effect.

[0062] For example, Figure 4 As shown, in the example provided in the present application, the first heat generating component 12 includes a plurality of optical modules 120. The plurality of optical modules 120 can be sequentially arranged along the length direction of the air duct 14, so that each optical module 120 can be effectively cooled.

[0063] Some optical modules 120 may be cooled by air discharged from the air outlet 142a, others may be cooled by air discharged from the air outlet 142b, and others may be cooled by air discharged from the air outlet 142c, which will not be described in detail here.

[0064] In addition, in specific configuration, the shape of the air inlet end 141 of the air guide duct 14 can be various.

[0065] For example, Figure 4 As shown, in an example provided in the present application, the air inlet end 141 may be a trumpet-shaped structure so that more air can enter the air duct 14 through the air inlet end 141 .

[0066] In addition, the diameter of the air inlet 112 may be larger than the diameter of the air inlet end 141 to ensure that there is enough air to dissipate the heat of the second heating component 13 .

[0067] In specific settings, the size and shape of the air inlet 112 and the air inlet end 141 can be reasonably set according to actual needs, and will not be elaborated here.

[0068] In addition, if Figure 4 As shown, in order to ensure the air circulation efficiency, in the example provided in this application, a row of fans 16 are provided at the air inlet 112. The fans 16 can effectively draw the outside air into the heat dissipation duct 111, thereby improving the heat dissipation performance of the entire communication device 10.

[0069] like Figure 4 As shown, among the multiple fans 16 , there is a fan 16 arranged corresponding to the air inlet end 141 , through which a sufficient amount of air can be sucked into the air duct 14 , thereby ensuring the heat dissipation performance of the first heating component 12 .

[0070] In the specific configuration, an additional fan may also be provided in the air duct 14. Alternatively, a fan may also be provided at each air outlet 142 to increase the air circulation speed, thereby ensuring the heat dissipation performance of the first heating component 12.

[0071] In addition, if Figure 5 As shown, in the example provided in the present application, the outer surface of the air duct 14 also has an avoidance groove 144 , and some electronic devices in the second heating component 13 can be located in the avoidance groove 144 to prevent position interference between the second heating component 13 and the air duct 14 .

[0072] In specific settings, the number, position and shape of the avoidance grooves 144 can be reasonably set according to actual needs, and this application does not impose any restrictions on this.

[0073] In addition, please refer to Figure 4 and Figure 7 In an example provided in the present application, in order to improve the heat dissipation performance of the second heating component 13. The second heating component 13 also includes one or more radiators 17. One side of the radiator 17 is in thermal contact with some or all of the electronic components 132 on the circuit board 131, so that the heat of the corresponding electronic components 132 can be transferred to the radiator 17 for dissipation. In addition, the radiator 17 is also provided with heat dissipation teeth 171, and an air duct 172 for air circulation is formed between two adjacent heat dissipation teeth 171. When the air flows through the air duct 172 between the heat dissipation teeth 171, the heat in the heat dissipation teeth 171 can be quickly taken away, thereby effectively improving the heat dissipation performance of the second heating component 13.

[0074] like Figure 7 As shown, the air duct 14 can be arranged between the radiator 17 and the first heating component 12, and can effectively isolate the heat of the radiator 17 to prevent the heat of the radiator 17 from being transferred to the first heating component 12, thereby preventing the radiator 17 from reducing the heat dissipation performance of the first heating component 12.

[0075] In a specific configuration, the air duct 14 may have a heat-insulating side wall (not shown in the figure), and the heat-insulating side wall may be arranged toward the radiator 17 of the second heating component 13. The heat-insulating side wall can prevent the heat of the radiator 17 from being transferred to the air duct 14, thereby preventing the air temperature in the air duct 14 from increasing, thereby facilitating the heat dissipation performance of the first heating component 12.

[0076] A heat insulating layer may be provided on the side wall of the air duct 14 facing the radiator 17. Alternatively, the entire air duct 14 may also be made of a heat insulating material. In practical applications, the specific material of the air duct 14 may be reasonably set according to actual needs.

[0077] Or, if Figure 8As shown, the communication device 10 may include two second heating components and two radiators. Among them, the two second heating components are respectively a second heating component 13a and a second heating component 13b. The two radiators are respectively a radiator 17a and a radiator 17b. The second heating component 13a includes a circuit board 131a and an electronic component 132a arranged on the circuit board 131a. The electronic component 132a is in thermal contact with the radiator 17a, so that the heat of the electronic component 132a can be transferred to the radiator 17a for dissipation. The second heating component 13b includes a circuit board 131b and an electronic component 132b arranged on the circuit board 131b. The electronic component 132b is in thermal contact with the radiator 17b, so that the heat of the electronic component 132b can be transferred to the radiator 17b for dissipation. The air duct 14 can be located at the top of the tooth plate 171a of the radiator 17a and the top of the tooth plate 171b of the radiator 17b. The outer wall of the air duct 14 and the top of the tooth piece 171a can together form a relatively closed air duct 172a, thereby improving the circulation efficiency of the airflow, which is beneficial to improving the heat dissipation efficiency of the second heating component 13a. The outer wall of the air duct 14 and the top of the tooth piece 171b can together form a relatively closed air duct 172b, thereby improving the circulation efficiency of the airflow, which is beneficial to improving the heat dissipation efficiency of the second heating component 13b.

[0078] In addition, the air duct 14 is located between the radiator 17a and the radiator 17b, which can effectively isolate the radiator 17a and the radiator 17b and prevent the heat transfer between the radiator 17a and the radiator 17b. Therefore, the heat dissipation efficiency of the second heating component 13a and the second heating component 13b can be effectively guaranteed.

[0079] In addition, if Fig. 9 As shown, in some examples, a heat dissipation portion 145 may be further provided on a side of the air duct 14 close to the second heating component 13 , and the heat dissipation performance of the second heating component 13 may be improved by the heat dissipation portion 145 .

[0080] Specifically, please refer to Figure 7 and Fig. 9 . In the example provided in the present application, the air duct 14 may specifically include a tube body 140, a heat dissipation portion 145 and a heat insulation portion 146. The heat dissipation portion 145 may be made of a material with good thermal conductivity such as copper and aluminum. The heat insulation portion 146 may be made of a material with good thermal insulation such as plastic and foam board. In specific applications, the heat dissipation portion 145 may be in thermal contact with the electronic components in the second heating component 13, so that the heat of the second heating component 13 can be transferred to the heat dissipation portion 145 for dissipation, which can effectively improve the heat dissipation efficiency of the second heating component 13.

[0081] The heat insulating portion 146 can effectively insulate the heat dissipating portion 145 and the tube body 140 , and can effectively block the heat of the heat dissipating portion 145 from being transferred to the tube body 140 , thereby ensuring the heat dissipation efficiency of the first heat generating component 12 .

[0082] Alternatively, it is understandable that the heat dissipation unit 145 may replace the above-mentioned heat sink 17 , which can effectively improve the integrated design of the communication device 10 .

[0083] Alternatively, in some examples, the heat dissipation portion 145 and the heat sink 17 may also exist at the same time. The heat dissipation portion 145 and the heat sink 17 may both be in thermal contact with the second heating component 13. The heat dissipation area of ​​the second heating component 13 may be effectively increased by the heat dissipation portion 145. Alternatively, the heat dissipation portion 145 may also be in thermal contact with the heat sink 17, thereby increasing the heat dissipation area of ​​the heat sink 17.

[0084] During the specific configuration, the specific shape and location of the air guide 14 can be flexibly adjusted according to actual needs, which will not be elaborated herein.

[0085] In addition, in actual application, the communication device 10 may specifically be a radio frequency convergence unit or an indoor baseband processing unit, and the present application does not limit the specific type of the communication device 10 .

[0086] In the various embodiments of the present application, unless otherwise specified or provided for in any logical conflict, the terms and / or descriptions between the different embodiments are consistent and may be referenced to each other, and the technical features in the different embodiments may be combined to form new embodiments according to their inherent logical relationships.

[0087] In this application, "multiple" means two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.

[0088] It is understood that the various numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application. The size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic.

Claims

1. A communication device, characterized in that: It includes a housing, a first heating component, a second heating component and an air duct; The housing has a heat dissipation duct and an air inlet and an air outlet communicated with the heat dissipation duct, and the first heat generating component and the second heat generating component are both located in the heat dissipation duct; The air guide pipe is located in the heat dissipation air duct, and the air guide pipe has an air inlet end and an air outlet end, and the air inlet end is connected to the air inlet; Wherein, the first heating component is located at the air outlet end of the air duct.

2. The communication device according to claim 1, characterized in that The air duct has a heat-insulating side wall, and the heat-insulating side wall is arranged toward the second heating component.

3. The communication device according to claim 1 or 2, characterized in that: The air guide duct is made of heat insulating material.

4. The communication device according to any one of claims 1 to 3, characterized in that: The air guide duct has one air inlet end and a plurality of air outlet ends; The air guide duct is further provided with a guide plate, and the guide plate is used to guide the flow in the air guide duct to each of the air outlet ends.

5. The communication device according to claim 4, characterized in that The air guide pipe is in the shape of an elongated strip, and the plurality of air outlet ends are arranged in sequence along the length direction of the air guide pipe; The air guide duct is provided with a plurality of guide plates, and the plurality of guide plates are sequentially arranged along the length direction of the air guide duct.

6. The communication device according to any one of claims 1 to 5, characterized in that: In the connection path between the air inlet end and the air outlet end of the air guide duct, the air guide duct is in a straight line or a curve shape.

7. The communication device according to any one of claims 1 to 6, characterized in that: The diameter of the air inlet is larger than the diameter of the air inlet end; The communication device further includes a first fan, which is located at the air inlet and / or the air outlet of the housing.

8. The communication device according to any one of claims 1 to 7, characterized in that: The communication device also includes a second fan; The second fan is located at the air inlet end or the air outlet end, or the second fan is located in the air duct.

9. The communication device according to any one of claims 1 to 8, characterized in that: The outer surface of the air guide duct has an avoidance groove, and at least a part of the electronic components included in the second heating component is located in the avoidance groove.

10. The communication device according to any one of claims 1 to 9, characterized in that: The communication device further comprises a heat sink, which is located in the heat dissipation air duct and is in thermal contact with the second heat generating component.

11. The communication device according to claim 10, characterized in that The radiator has heat dissipation teeth, and the air guide pipe is located at the top of the heat dissipation teeth.

12. The communication device according to any one of claims 1 to 11, characterized in that: The air duct comprises a tube body and a heat dissipation portion arranged on the outer side of the tube body, and the heat dissipation portion is in thermal contact with the second heating component.

13. The communication device according to claim 12, characterized in that The air guide pipe has a heat insulation portion, and the heat insulation portion is located between the pipe body and the heat dissipation portion.

14. The communication device according to any one of claims 1 to 13, characterized in that: The first heat generating component includes a plurality of optical modules, and the plurality of optical modules are sequentially arranged along the length direction of the air duct.

15. The communication device according to any one of claims 1 to 14, characterized in that: The second heat generating assembly includes a circuit board and a plurality of electronic components located on the circuit board.

16. The communication device according to any one of claims 1 to 15, characterized in that: The communication device is an indoor baseband processing unit or a radio frequency convergence unit.

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