Double-liquid-cooling radiator of semiconductor refrigeration system

Abstract

The invention discloses a double liquid cooling radiator of a semiconductor refrigeration system, which comprises a semiconductor refrigeration assembly, a first liquid cooling radiator assembly, a second liquid cooling radiator assembly and a semiconductor refrigeration assembly, and is characterized in that the first liquid cooling radiator assembly comprises a first upper cold head module and a first lower cold head module; the first liquid cooling radiator assembly comprises a first cold head module, the second liquid cooling radiator assembly comprises a second cold head module, the semiconductor refrigeration assembly comprises a semiconductor refrigeration chip, the first lower cold head module is tightly attached to the CPU, and the liquid cooling temperature of the first liquid cooling radiator is reduced through conduction of the semiconductor refrigeration chip, so that the temperature of the CPU is reduced; heat generated by the semiconductor refrigeration chip is conducted through the second cold head module to reduce the temperature, the temperature regulation PCB is provided with a temperature regulation system, the cooling temperature of the semiconductor refrigeration chip can be regulated according to the computer temperature, and the temperature of the semiconductor refrigeration chip is regulated to be cold and hot balance; the first water inlet pipe, the first water outlet pipe, the second water inlet pipe and the second water outlet pipe are of quick disassembly and assembly structures facilitating product transportation and installation and use experience.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation equipment, in particular to a double liquid-cooled radiator of a semiconductor refrigeration system. Background Art

[0002] As the performance of computer systems gradually improves, the heat generated by electronic components such as CPUs will inevitably increase. In order to solve the heating problem, a cooling system is usually required to quickly dissipate the heat to prevent the electronic components from being overheated and shortening their life or being damaged.

[0003] The utility model application number CN219105445U proposes a high-efficiency water-cooled radiator, which includes a heat-conducting component, an air-cooling component and a water-cooling component. After the user attaches the heat sink to the electronic component that needs heat dissipation and installs it, the heat of the electronic component is transferred to the heat sink, and the liquid circulating in the water-cooling component enters the water outlet tank, and then sprays from the water outlet on the water channel cover plate to the middle of the micro-water channel, and flows to the surrounding of the micro-water channel, and then flows from the water inlet on the water channel cover plate into the water inlet tank, and finally flows from the water inlet tank into the water-cooling component for heat dissipation, thereby realizing water-cooled heat dissipation of the water electronic component, and the air-cooling fan is started. Afterwards, air enters from the air inlet and blows out from the air outlet. The air blown out from all around the air cooling hood dissipates the heat emitted from all around the electronic components, thereby solving the problem of heat dissipation around the electronic components. However, the heat transfer rate of this type of radiator is average, resulting in the heat dissipation efficiency of the CPU radiator being less than ideal. Therefore, it is urgent to design a radiator that can directly and quickly cool the heat sink through a semiconductor refrigeration chip, so that the cooled heat sink can quickly reduce the temperature of the motherboard CPU, and the heat generated by the semiconductor refrigeration chip due to refrigeration can be cooled down through a second liquid cooling radiator. Summary of the invention

[0004] In order to overcome the deficiencies of the prior art solutions, the present invention provides a dual liquid-cooled radiator of a semiconductor refrigeration system, which can effectively solve the technical problem that the heat dissipation efficiency of the CPU radiator is not ideal due to the general heat transfer rate of the radiator of the current water-cooled radiator.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a double liquid-cooled radiator of a semiconductor refrigeration system, comprising a semiconductor refrigeration component, a first liquid-cooled radiator component, a second liquid-cooled radiator component, a first water-cooled row, a second water-cooled row, a first water-cooled pipe and a second water-cooled pipe, the first liquid-cooled radiator component is connected to the first water-cooled row through the first water-cooled pipe, and the second liquid-cooled radiator component is connected to the second water-cooled row through the second water-cooled pipe;

[0006] The first liquid-cooled radiator assembly includes a front shell, a rear shell, a first upper cold head module and a first lower cold head module. The front shell and the rear shell are clamped with each other. The first upper cold head module is mounted on the front end of the front shell, and the first lower cold head module is mounted on the rear end of the rear shell. The second liquid-cooled radiator assembly includes an outer shell and a second cold head module. The second cold head module is mounted on the rear end of the outer shell. The semiconductor refrigeration assembly includes a semiconductor refrigeration chip mounted between the second cold head module and the first upper cold head module.

[0007] Furthermore, the semiconductor refrigeration component also includes a temperature control PCB board, and the temperature control PCB board is electrically connected to the semiconductor refrigeration chip to control the temperature of the semiconductor refrigeration chip.

[0008] Furthermore, the first upper cold head module includes an upper water channel cover plate, an upper water channel rubber and an upper heat sink which are arranged in sequence from the inside to the outside. The middle of the front shell is a first water reservoir, and the front shell is closed by the upper water channel cover plate. The first water reservoir is separated by a first water inlet cavity and a first water outlet cavity. A first water spray trough is arranged in the middle of the upper water channel cover plate, and a first water channel is arranged in the middle of the upper water channel rubber. The upper heat sink is arranged with a first micro water channel, the first water inlet cavity is connected with the first water spray trough, and the outlet direction of the first water spray trough is facing the upper heat sink, and the upper and lower sides of the upper water channel cover plate are provided with first water outlets, and the first water outlet is connected with the first water outlet cavity.

[0009] Furthermore, the first lower cold head module includes a first lower water channel cover plate, a first lower water channel rubber and a first lower heat sink which are arranged in sequence from the inside to the outside. The middle of the rear shell is a second water reservoir, and the rear shell is closed by the first lower water channel cover plate. The second water reservoir is separated by a second water inlet cavity and a second water outlet cavity. A second water spray trough is arranged in the middle of the first lower water channel cover plate, a second water trough is arranged in the middle of the first lower water channel rubber, a second micro water channel is arranged in the first lower heat sink, the second water inlet cavity is connected with the second water spray trough, and the outlet direction of the second water spray trough is arranged facing the first lower heat sink, and second water outlets are arranged on the upper and lower sides of the first lower water channel cover plate, and the second water outlet is connected with the second water outlet cavity.

[0010] Furthermore, the front shell is provided with a first water inlet hole and a first water outlet hole, and the rear shell is provided with a first water inlet channel and a first water outlet channel. The first water inlet channel is connected with the first water inlet hole, and the first water inlet hole is connected with the first water inlet cavity. The first water outlet hole is respectively connected with the first water outlet cavity and the second water inlet cavity, and the second water outlet cavity is connected with the first water outlet channel.

[0011] Furthermore, the second cold head module includes a second lower water channel cover plate, a second lower water channel rubber and a second lower heat sink which are arranged in sequence from the inside to the outside. The third water reservoir is in the middle of the outer shell, and the outer shell is closed by the second lower water channel cover plate. The third water reservoir is formed with a third water inlet cavity and a third water outlet cavity. A third water spray trough is arranged in the middle of the second lower water channel cover plate, a third water trough is arranged in the middle of the second lower water channel rubber, and a third micro water channel is arranged on the second lower heat sink. The third water inlet cavity is connected with the third water spray trough, and the outlet direction of the third water spray trough is facing the second lower heat sink. The left and right sides of the second lower water channel cover plate are provided with third water outlets, and the third water outlet is connected with the third water outlet cavity.

[0012] Furthermore, the shell is provided with a second water inlet channel and a second water outlet channel, the second water inlet channel is communicated with the second water inlet cavity, and the second water outlet channel is communicated with the second water outlet cavity.

[0013] Furthermore, the front shell is provided with a first sealing groove, which is arranged around the outer periphery of the first water reservoir, and a first water channel sealing ring is installed in the first sealing groove, and the first water channel sealing ring is in contact with the inner surface of the upper heat sink; the rear shell is provided with a second sealing groove, which is arranged around the outer periphery of the second water reservoir, and a second water channel sealing ring is installed in the second sealing groove, and the second water channel sealing ring is in contact with the inner surface of the first lower heat sink; the outer shell is provided with a third sealing groove, which is arranged around the outer periphery of the third water reservoir, and a third water channel sealing ring is installed in the third sealing groove, and the third water channel sealing ring is in contact with the inner surface of the second lower heat sink.

[0014] Furthermore, the first water-cooling pipe includes a first water inlet pipe and a first water outlet pipe, one end of the first water inlet pipe is connected to the first water inlet channel, the other end of the first water inlet pipe is connected to the first water-cooling radiator, one end of the first water outlet pipe is connected to the first water outlet channel, the other end of the first water outlet pipe is connected to the first water-cooling radiator, and the first water-cooling radiator is also equipped with a first fan assembly, and the air inlet of the first fan assembly is arranged opposite to the first water-cooling radiator.

[0015] Furthermore, the second water-cooling pipe includes a second water inlet pipe and a second water outlet pipe, one end of the second water inlet pipe is connected to the second water inlet channel, the other end of the second water inlet pipe is connected to the second water-cooling radiator, one end of the second water outlet pipe is connected to the second water outlet channel, the other end of the second water outlet pipe is connected to the second water-cooling radiator, and the second water-cooling radiator is also equipped with a second fan assembly, and the air inlet of the second fan assembly is arranged directly opposite to the second water-cooling radiator.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The first liquid-cooled radiator assembly is connected to the first water-cooling row through the first water-cooling pipe, and the second liquid-cooled radiator assembly is connected to the second water-cooling row through the second water-cooling pipe. The first upper cold head module is mounted on the front end of the front shell, the first lower cold head module is mounted on the rear end of the rear shell, and the second cold head module is mounted on the rear end of the shell. The semiconductor refrigeration chip is mounted between the second cold head module and the first upper cold head module, and the first lower cold head module is arranged close to the outer end surface of the CPU. The liquid cooling temperature of the first liquid-cooled radiator is reduced by conduction through the semiconductor refrigeration chip, thereby reducing the CPU temperature. The heat generated by the semiconductor refrigeration chip due to refrigeration is conducted through the second cold head module to reduce its temperature. On the one hand, the second cold head module cools the heating surface of the semiconductor refrigeration chip, which can solve the problem that water droplets will be generated around the heat sink due to heat imbalance during the refrigeration process of the semiconductor refrigeration chip, thereby burning various computer devices. On the other hand, this structural method of cooling the motherboard CPU temperature exceeds the traditional original cooling system and other cooling system methods, and can truly and effectively reduce the motherboard CPU temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of a double liquid cooling radiator of a semiconductor refrigeration system of the present invention;

[0019] Figure 2 It is a structural explosion diagram of a double liquid cooling radiator of a semiconductor refrigeration system of the present invention;

[0020] Figure 3 It is a structural explosion diagram of a first liquid-cooled radiator and a second liquid-cooled radiator in a double liquid-cooled radiator of a semiconductor refrigeration system of the present invention;

[0021] Figure 4 It is a structural schematic diagram of a front shell in a double liquid cooling radiator of a semiconductor refrigeration system of the present invention;

[0022] Figure 5 It is a schematic diagram of the assembly structure of the upper heat sink and the upper water channel cover plate in a double liquid cooling radiator of a semiconductor refrigeration system of the present invention;

[0023] Figure 6 It is a schematic structural diagram of a rear shell in a double liquid-cooled radiator of a semiconductor refrigeration system of the present invention;

[0024] Figure 7 It is a schematic diagram of the assembly structure of a first lower heat sink and a first lower water channel cover plate in a double liquid cooling radiator of a semiconductor refrigeration system of the present invention;

[0025] Figure 8 It is a structural explosion diagram of the second liquid-cooled radiator in the double liquid-cooled radiator of a semiconductor refrigeration system of the present invention from a front view angle;

[0026] Fig. 9 It is a structural explosion diagram of the second liquid-cooled radiator in the double liquid-cooled radiator of the semiconductor refrigeration system of the present invention from a rear view angle;

[0027] Fig.10 A schematic diagram of the flow direction of the coolant in the first liquid-cooled radiator of the double liquid-cooled radiator of the semiconductor refrigeration system of the present invention;

[0028] Fig.11 A schematic diagram of the flow direction of the coolant in the second liquid-cooled radiator of a double liquid-cooled radiator of a semiconductor refrigeration system of the present invention;

[0029] Fig.12 It is a schematic diagram of the assembly structure of a first water pump, a first water inlet pipe, a second water pump, and a second water inlet pipe in a double liquid-cooled radiator of a semiconductor refrigeration system of the present invention;

[0030] Fig.13 for Fig.11 A magnified view of the structure of part A;

[0031] Fig.14 It is a schematic structural diagram of a first water inlet pipe or a first water outlet pipe or a second water inlet pipe or a second water outlet pipe in a double liquid-cooled radiator of a semiconductor refrigeration system of the present invention.

[0032] Numbers in the figure:

[0033] 100-first liquid cooling radiator; 101-first water inlet channel; 102-first water outlet channel; 103-first water inlet pipe; 104-first water outlet pipe; 105-first water cooling radiator; 106-first fan assembly; 107-front shell; 108-first water outlet; 109-first water spraying slot; 110-upper water channel rubber; 111-upper heat sink; 112-first water channel sealing ring; 113-first water channel; 115-upper water channel cover plate; 116-first sealing slot; 11 7-rear shell; 118-second water outlet; 119-second water channel; 120-second micro-water channel; 121-first lower heat sink; 122-second water channel sealing ring; 123-first lower water channel rubber; 124-first lower water channel cover plate; 125-second water spray trough; 127-first water inlet hole; 128-first water inlet cavity; 129-first water outlet hole; 130-first water outlet cavity; 133-first micro-water channel; 134-second water outlet cavity; 135-second water inlet cavity;

[0034] 200-second liquid cooling radiator; 201-second water inlet channel; 202-second water outlet channel; 203-second lower heat sink; 204-third water channel sealing ring; 205-second lower water channel rubber; 206-third micro-water channel; 207-third water channel; 208-third water outlet; 209-third water spraying trough; 210-second water inlet pipe; 211-second water outlet pipe; 212-third water outlet cavity; 213-third sealing groove; 214-third water inlet cavity; 215-housing; 216-second water cooling row; 217-second fan assembly; 218-second lower water channel cover plate;

[0035] 300-semiconductor refrigeration component; 301-semiconductor refrigeration chip; 302-temperature control PCB board; 303-first water pump; 304-second water pump; 305-pipe sleeve; 306-adapter; 307-second connecting pipe; 308-connector; 309-butt joint; 310-first connecting pipe. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] like Figure 1-14 As shown, the present invention provides a dual liquid-cooled radiator of a semiconductor refrigeration system, comprising a semiconductor refrigeration component 300, a first liquid-cooled radiator 100 component, a second liquid-cooled radiator 200 component, a first water-cooled row 105, a second water-cooled row 216, a first water-cooled pipe and a second water-cooled pipe, wherein the first liquid-cooled radiator 100 component is connected to the first water-cooled row 105 via the first water-cooled pipe, and the second liquid-cooled radiator 200 component is connected to the second water-cooled row 216 via the second water-cooled pipe;

[0038] The first liquid-cooled radiator 100 assembly includes a front shell 107, a rear shell 117, a first upper cold head module and a first lower cold head module. The front shell 107 and the rear shell 117 are mutually clamped. The first upper cold head module is mounted at the front end of the front shell 107, and the first lower cold head module is mounted at the rear end of the rear shell 117. The second liquid-cooled radiator 200 assembly includes a shell 215 and a second cold head module. The second cold head module is mounted at the rear end of the shell 215. The semiconductor refrigeration assembly 300 includes a semiconductor refrigeration chip 301 and a temperature control PCB board 302. The temperature control PCB board 302 is provided with a temperature control system. The temperature control system adopts traditional technology. The semiconductor refrigeration chip 301 is mounted between the second cold head module and the first upper cold head module. The semiconductor refrigeration assembly 300 also includes a temperature control PCB board 302, a temperature sensor and an execution unit. The temperature control PCB board 302 and the semiconductor refrigeration chip 301 Electrically connected to control the temperature of the semiconductor refrigeration chip 301, the temperature sensor is used to monitor the temperature of the computer in real time and convert it into an electrical signal, the temperature control PCB board 302 receives the temperature signal from the sensor and compares it with the preset temperature, according to the comparison result, the controller will send a corresponding control signal, the actuator adjusts the temperature according to the instruction of the controller, so that the temperature control PCB board 302 adjusts the cooling temperature of the semiconductor refrigeration chip 301 according to the temperature of the computer, when the computer is in standby mode, or when the power consumption generated by the computer is relatively small, the power of the semiconductor refrigeration chip 301 is also relatively low, and the temperature can be adjusted to a cold and hot balance through the temperature sensor and the temperature control PCB board 302, therefore, it can effectively avoid the problem of the semiconductor refrigeration chip 301 causing the cooling liquid inside the first liquid cooling radiator and the second liquid cooling radiator to freeze when the semiconductor refrigeration chip 301 works continuously and at high power;

[0039] The first upper cold head module includes an upper waterway cover plate 115, an upper waterway rubber 110 and an upper heat sink 111 which are arranged in sequence from the inside to the outside. The front shell 107 is provided with a first sealing groove 116, which is arranged around the outer periphery of the first water reservoir, and a first waterway sealing ring 112 is installed in the first sealing groove 116. The first waterway sealing ring 112 is in contact with the inner surface of the upper heat sink 111. The middle of the front shell 107 is the first water reservoir, and the front shell 107 is closed by the upper waterway cover plate 115. The first water reservoir is separated by a first water inlet cavity 128 and a first The water outlet cavity 130, the first water spraying groove 109 is arranged in the middle of the upper water channel cover plate 115, the first water through groove 113 is arranged in the middle of the upper water channel rubber 110, the first water spraying groove 109 is communicated with the first water through groove 113, the upper heat sink 111 is arranged with a first micro water channel 133, the first water inlet cavity 128 is communicated with the first water spraying groove 109, and the outlet direction of the first water spraying groove 109 is arranged directly opposite to the upper heat sink 111, the upper and lower sides of the upper water channel cover plate 115 are provided with first water outlets 108, and the first water outlet 108 is communicated with the first water outlet cavity 130;

[0040] The first lower cold head module includes a first lower water channel cover plate 124, a first lower water channel rubber 123 and a first lower heat sink 121 which are arranged in sequence from the inside to the outside. The rear shell 117 is provided with a second sealing groove, which is arranged around the outer periphery of the second water reservoir, and a second water channel sealing ring 122 is installed in the second sealing groove. The second water channel sealing ring 122 is in contact with the inner surface of the first lower heat sink 121. The middle of the rear shell 117 is a second water reservoir, and the rear shell 117 is closed by the first lower water channel cover plate 124. The second water reservoir is separated by a second water inlet cavity 135 and a second water outlet cavity. The first lower water channel cover plate 124 is provided with a second water spraying groove 125 in the middle, the first lower water channel rubber 123 is provided with a second water through groove 119 in the middle, the second water spraying groove 125 is communicated with the second water through groove 119, the first lower heat sink 121 is arranged with a second micro water channel 120, the first lower heat sink 121 is arranged close to the outer end surface of the CPU, the first lower heat sink 121 conducts through the semiconductor refrigeration chip 301 to reduce the liquid cooling temperature of the first liquid cooling radiator, thereby reducing the CPU temperature, the second water inlet cavity 135 is communicated with the second water spraying groove 125, and the second water spraying groove 120 is communicated with the second water through groove 119. The outlet direction is arranged directly facing the first lower heat sink 121, the upper and lower sides of the first lower water channel cover plate 124 are both provided with second water outlets 118, the second water outlets 118 are connected with the second water outlet cavity 134, the front shell 107 is provided with a first water inlet hole 127 and a first water outlet hole 129, the rear shell 117 is provided with a first water inlet channel 101 and a first water outlet channel 102, the first water inlet channel 101 is connected with the first water inlet hole 127, the first water inlet hole 127 is connected with the first water inlet cavity 128, the first water outlet hole 129 is respectively connected with the first water outlet cavity 130 and the second water inlet cavity 132. 5 is connected, the second water outlet cavity 134 is connected with the first water outlet channel 102, the first water cooling pipe includes a first water inlet pipe 103 and a first water outlet pipe 104, one end of the first water inlet pipe 103 is connected with the first water inlet channel 101, the other end of the first water inlet pipe 103 is connected with the first water cooling row 105, one end of the first water outlet pipe 104 is connected with the first water outlet channel 102, the other end of the first water outlet pipe 104 is connected with the first water cooling row 105, and the first water cooling row 105 is also equipped with a first fan assembly 106, and the air inlet of the first fan assembly 106 is arranged directly facing the first water cooling row 105;

[0041] The cooling liquid enters the rear shell 117 through the first water inlet pipe 103 and the first water inlet channel 101, and then flows into the first water inlet cavity 128 from the first water inlet hole 127. The cooling liquid passes through the first water spraying groove 109 and the first water groove 113 in turn, and flows into the upper and lower sides of the first micro-water channel 133 in a jet manner, and then flows into the first water outlet cavity 130 from the direction of the first water outlet 108, and then flows into the second water inlet cavity 135 from the first water outlet hole 129. The cooling liquid passes through the second water spraying groove 125 and the second water groove 119 in turn, and flows into the upper and lower sides of the second micro-water channel 120 in a jet manner, and then flows into the second water outlet cavity 134 from the direction of the second water outlet 118. The cooling liquid finally flows out from the first water outlet channel 102 along the first water outlet pipe 104. The cooling liquid is fully in contact with the first micro-water channel 133 and the second micro-water channel 120 in turn, so that the heat dissipation is more uniform and the effect is better.

[0042] The second cold head module includes a second lower water channel cover plate 218, a second lower water channel rubber 205 and a second lower heat sink 203 which are arranged in sequence from the inside to the outside. The outer shell 215 is provided with a third sealing groove 213 which is arranged around the outer periphery of the third water reservoir. A third water channel sealing ring 204 is arranged in the third sealing groove 213. The third water channel sealing ring 204 contacts the inner surface of the second lower heat sink 203. The middle of the outer shell 215 is the third water reservoir. The outer shell 215 is sealed by the second lower water channel cover plate 218. The third water reservoir is provided with a third water inlet channel 214 and a third water outlet channel 212, a third water spraying groove 209 is provided in the middle of the second lower water channel cover plate 218, a third water channel 207 is provided in the middle of the second lower water channel rubber 205, the third water spraying groove 209 is communicated with the third water channel 207, the second lower heat sink 203 is provided with a third micro water channel 206, the second lower heat sink 203 is provided in close contact with the semiconductor refrigeration chip 301, and the semiconductor refrigeration chip 301 transmits heat through the second lower heat sink 203. The temperature of the water is reduced, the third water inlet cavity 214 is connected to the third water spray trough 209, and the outlet direction of the third water spray trough 209 is arranged opposite to the second lower heat sink 203, the left and right sides of the second lower water channel cover 218 are provided with third water outlets 208, the third water outlets 208 are connected to the third water outlet cavity 212, the housing 215 is provided with a second water inlet channel 201 and a second water outlet channel 202, the second water inlet channel 201 is connected to the second water inlet cavity 135, and the second water outlet channel 202 is connected to the second water outlet cavity 13 4 is connected, the second water cooling pipe includes a second water inlet pipe 210 and a second water outlet pipe 211, one end of the second water inlet pipe 210 is connected to the second water inlet channel 201, the other end of the second water inlet pipe 210 is connected to the second water cooling row 216, one end of the second water outlet pipe 211 is connected to the second water outlet channel 202, the other end of the second water outlet pipe 211 is connected to the second water cooling row 216, and the second water cooling row 216 is also equipped with a second fan assembly 217, and the air inlet of the second fan assembly 217 is arranged directly opposite to the second water cooling row 216;

[0043] The coolant enters the housing 215 through the second water inlet pipe 210 and the second water inlet channel 201, and then flows into the second water inlet cavity 135. The coolant passes through the third water spraying groove 209 and the third water-passing groove 207 in sequence, and flows into the left and right sides of the third micro-water channel 206 in a jetting manner, and then flows from the direction of the third water outlet 208 to the third water outlet cavity 212. The coolant finally flows out from the third water outlet cavity 212 along the second water outlet pipe 211. The coolant is in full contact with the third micro-water channel 206, and the heat dissipation is uniform, with a better effect.

[0044] The first water-cooling row 105 and the second water-cooling row 216 have the same structure. The first water-cooling row 105 is provided with a first water pump 303 component, and the second water-cooling row 216 is provided with a second water pump 304 component. The first water pump 303 component includes a first water pump 303 and a first control circuit board, and the first control circuit board is electrically connected to the first water pump 303. The first water pump 303 is installed at the connection end of the first water inlet pipe 103 and the first water-cooling row 105, and the first water pump 303 is connected to the first water inlet pipe 103. The second water pump 304 component includes a second water pump 304 and a second control circuit board, and the second control circuit board is electrically connected to the second water pump 304. The second water pump 304 is installed at the connection end of the second water inlet pipe 210 and the second water-cooling row 216, and the second water pump 304 is connected to the second water inlet pipe 210;

[0045] The first water inlet pipe 103 and the first water outlet pipe 104 are connected to the rear shell 117 or the first water cooling radiator 105 through the adapter 306, and the connection between the first water inlet pipe 103, the first water outlet pipe 104 and the adapter 306 is provided with a pipe sleeve 305, so that the connection structure of the first water inlet pipe 103 and the first water outlet pipe 104 is more reliable, thereby reducing the risk of leakage. The second water inlet pipe 210 and the second water outlet pipe 211 are connected to the housing 215 or the second water cooling radiator 216 through the adapter 306, and the connection between the second water inlet pipe 210, the second water outlet pipe 211 and the adapter 306 is provided with a pipe sleeve 305, so that the connection structure of the second water inlet pipe 210 and the second water outlet pipe 211 is more reliable, thereby reducing the risk of leakage. Low leakage risk. The first water inlet pipe 103, the first water outlet pipe 104, the second water inlet pipe 210 and the second water outlet pipe 211 have the same structure and all adopt a convenient quick-disassembly structure. Taking the first water inlet pipe 103 as an example, the first water inlet pipe 103 includes a first connecting pipe 310 and a second connecting pipe 307. A docking joint 309 is provided at one end of the first connecting pipe 310 close to the second connecting pipe 307. A connector 308 is provided at one end of the second connecting pipe 307 close to the first connecting pipe 310. The connector 308 and the docking joint 309 are plugged into each other to realize the connection between the first connecting pipe 310 and the second connecting pipe 307. The design of the quick-disassembly structure can facilitate the transportation, installation and use experience of the product.

[0046] The first fan assembly 106 and the second fan assembly 217 have the same structure. The first fan assembly 106 is used to dissipate heat for the first water-cooling radiator 105 , and the second fan assembly 217 is used to dissipate heat for the second water-cooling radiator 216 . Both the first fan assembly 106 and the second fan assembly 217 include a plurality of cooling fans.

[0047] Compared with traditional technology:

[0048] 1. The first liquid cooling radiator 100 component is connected to the first water cooling row 105 through the first water cooling pipe, the second liquid cooling radiator 200 component is connected to the second water cooling row 216 through the second water cooling pipe, the first upper cold head module is mounted on the front end of the front shell 107, the first lower cold head module is mounted on the rear end of the rear shell 117, the second cold head module is mounted on the rear end of the shell 215, the semiconductor refrigeration chip 301 is mounted between the second cold head module and the first upper cold head module, the first lower cold head module is arranged close to the outer end surface of the CPU, the first lower heat sink 121 is arranged close to the outer end surface of the CPU, and the first lower heat sink 121 is connected to the semiconductor refrigeration chip 301. The liquid cooling temperature of the first liquid cooling radiator is reduced by conduction, thereby reducing the CPU temperature. The heat generated by the semiconductor cooling chip 301 due to cooling is conducted through the second cold head module to reduce its temperature. On the one hand, the second cold head module cools the heating surface of the semiconductor cooling chip 301, which can solve the problem that water droplets will be generated around the heat sink due to the imbalance of cold and heat during the cooling process of the semiconductor cooling chip 301, thus burning various computer devices. On the other hand, this structural method of cooling the motherboard CPU temperature exceeds the traditional original cooling system and other cooling system methods, and can truly and effectively reduce the motherboard CPU temperature.

[0049] 2. The first water inlet pipe 103, the first water outlet pipe 104, the second water inlet pipe 210 and the second water outlet pipe 211 have the same structure, including a first connecting pipe 310 and a second connecting pipe 307. A docking joint 309 is provided at one end of the first connecting pipe 310 close to the second connecting pipe 307, and a connector 308 is provided at one end of the second connecting pipe 307 close to the first connecting pipe 310. The connector 308 and the docking joint 309 are plugged into each other to achieve the connection between the first connecting pipe 310 and the second connecting pipe 307. The design of the quick disassembly structure can facilitate the transportation, installation and use experience of the product;

[0050] 3. The temperature control PCB board 302 is provided with a temperature control system. The temperature control PCB board 302 is electrically connected to the semiconductor refrigeration chip 301 to control the temperature of the semiconductor refrigeration chip 301. The temperature sensor is used to monitor the temperature of the computer in real time and feed back the temperature information to the temperature control system. The temperature control PCB board 302 adjusts the cooling temperature of the semiconductor refrigeration chip 301 according to the temperature of the computer. When the computer is in standby mode, or the power consumption generated by the computer is relatively small, the power of the semiconductor refrigeration chip 301 is also relatively low. The temperature can be adjusted to a cold and hot balance through the temperature sensor and the temperature control PCB board 302. Therefore, it can effectively avoid the problem of cooling liquid freezing inside the first liquid-cooled radiator and the second liquid-cooled radiator when the semiconductor refrigeration chip 301 works continuously and at high power.

[0051] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A dual liquid cooling radiator for a semiconductor refrigeration system, characterized in that: It includes a semiconductor refrigeration component, a first liquid-cooled radiator component, a second liquid-cooled radiator component, a first water-cooled row, a second water-cooled row, a first water-cooled pipe and a second water-cooled pipe, wherein the first liquid-cooled radiator component is connected to the first water-cooled row through the first water-cooled pipe, and the second liquid-cooled radiator component is connected to the second water-cooled row through the second water-cooled pipe; The first liquid-cooled radiator assembly includes a front shell, a rear shell, a first upper cold head module and a first lower cold head module. The front shell and the rear shell are clamped with each other. The first upper cold head module is mounted on the front end of the front shell, and the first lower cold head module is mounted on the rear end of the rear shell. The second liquid-cooled radiator assembly includes an outer shell and a second cold head module. The second cold head module is mounted on the rear end of the outer shell. The semiconductor refrigeration assembly includes a semiconductor refrigeration chip mounted between the second cold head module and the first upper cold head module.

2. The double liquid cooling radiator of a semiconductor refrigeration system according to claim 1, characterized in that: The semiconductor refrigeration component also includes a temperature control PCB board, which is electrically connected to the semiconductor refrigeration chip to control the temperature of the semiconductor refrigeration chip.

3. The double liquid cooling radiator of a semiconductor refrigeration system according to claim 2, characterized in that: The first upper cold head module includes an upper water channel cover plate, an upper water channel rubber and an upper heat sink which are arranged in sequence from the inside to the outside. The middle of the front shell is a first water reservoir, and the front shell is closed by the upper water channel cover plate. The first water reservoir is separated to form a first water inlet cavity and a first water outlet cavity. A first water spray trough is arranged in the middle of the upper water channel cover plate, a first water channel is arranged in the middle of the upper water channel rubber, and a first micro water channel is arranged on the upper heat sink. The first water inlet cavity is connected with the first water spray trough, and the outlet direction of the first water spray trough is arranged opposite to the upper heat sink. The upper and lower sides of the upper water channel cover plate are provided with first water outlets, and the first water outlet is connected with the first water outlet cavity.

4. The double liquid cooling radiator of a semiconductor refrigeration system according to claim 3, characterized in that: The first lower cold head module includes a first lower water channel cover plate, a first lower water channel rubber and a first lower heat sink, which are arranged in sequence from the inside to the outside. The middle of the rear shell is a second water reservoir, and the rear shell is closed by the first lower water channel cover plate. The second water reservoir is separated to form a second water inlet cavity and a second water outlet cavity. A second water spray trough is arranged in the middle of the first lower water channel cover plate, a second water trough is arranged in the middle of the first lower water channel rubber, and a second micro water channel is arranged on the first lower heat sink. The second water inlet cavity is connected with the second water spray trough, and the outlet direction of the second water spray trough is arranged opposite to the first lower heat sink. Second water outlets are arranged on the upper and lower sides of the first lower water channel cover plate, and the second water outlet is connected with the second water outlet cavity.

5. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 4, characterized in that: The front shell is provided with a first water inlet hole and a first water outlet hole, and the rear shell is provided with a first water inlet channel and a first water outlet channel. The first water inlet channel is connected with the first water inlet hole, and the first water inlet hole is connected with the first water inlet cavity. The first water outlet hole is connected with the first water outlet cavity and the second water inlet cavity respectively, and the second water outlet cavity is connected with the first water outlet channel.

6. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 5, characterized in that: The second cold head module includes a second lower water channel cover plate, a second lower water channel rubber and a second lower heat sink, which are arranged in sequence from the inside to the outside. The third water reservoir is in the middle of the outer shell, and the outer shell is closed by the second lower water channel cover plate. The third water reservoir is formed with a third water inlet cavity and a third water outlet cavity. A third water spray trough is arranged in the middle of the second lower water channel cover plate, a third water trough is arranged in the middle of the second lower water channel rubber, and a third micro water channel is arranged on the second lower heat sink. The third water inlet cavity is connected with the third water spray trough, and the outlet direction of the third water spray trough is facing the second lower heat sink. The left and right sides of the second lower water channel cover plate are provided with third water outlets, and the third water outlet is connected with the third water outlet cavity.

7. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 6, characterized in that: The shell is provided with a second water inlet channel and a second water outlet channel. The second water inlet channel is communicated with the second water inlet cavity, and the second water outlet channel is communicated with the second water outlet cavity.

8. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 7, characterized in that: The front shell is provided with a first sealing groove, which is arranged around the outer periphery of the first water reservoir, and a first water channel sealing ring is installed in the first sealing groove, and the first water channel sealing ring is in contact with the inner surface of the upper heat sink; the rear shell is provided with a second sealing groove, which is arranged around the outer periphery of the second water reservoir, and a second water channel sealing ring is installed in the second sealing groove, and the second water channel sealing ring is in contact with the inner surface of the first lower heat sink; the outer shell is provided with a third sealing groove, which is arranged around the outer periphery of the third water reservoir, and a third water channel sealing ring is installed in the third sealing groove, and the third water channel sealing ring is in contact with the inner surface of the second lower heat sink.

9. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 8, characterized in that: The first water-cooling pipe includes a first water inlet pipe and a first water outlet pipe, one end of the first water inlet pipe is connected to the first water inlet channel, the other end of the first water inlet pipe is connected to the first water-cooling radiator, one end of the first water outlet pipe is connected to the first water outlet channel, the other end of the first water outlet pipe is connected to the first water-cooling radiator, and the first water-cooling radiator is also equipped with a first fan assembly, and the air inlet of the first fan assembly is arranged opposite to the first water-cooling radiator.

10. The double liquid cooling radiator of the semiconductor refrigeration system according to claim 9, characterized in that: The second water-cooling pipe includes a second water inlet pipe and a second water outlet pipe, one end of the second water inlet pipe is connected to the second water inlet channel, the other end of the second water inlet pipe is connected to the second water-cooling radiator, one end of the second water outlet pipe is connected to the second water outlet channel, the other end of the second water outlet pipe is connected to the second water-cooling radiator, and the second water-cooling radiator is also equipped with a second fan assembly, and the air inlet of the second fan assembly is arranged opposite to the second water-cooling radiator.

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