Display substrate and preparation method thereof, display panel and display device

Abstract

The invention discloses a display substrate and a preparation method thereof, a display panel and a display device. The display substrate comprises a substrate body which comprises a display area and a frame area located on the periphery of the display area; the frame area comprises a wiring area close to the display area, and the wiring area is provided with a conductive wire; the light-emitting film layer is arranged on the display area; the packaging layer is located on the light-emitting film layer and at least partially extends to the frame area; the packaging layer comprises an organic packaging layer; the light refraction layer is located on the edge of the organic packaging layer and located on the side, close to the display side, of the conductive wire; the orthographic projection of the light refraction layer on the substrate and the orthographic projection of the edge of the organic packaging layer on the substrate are at least partially overlapped; the refractive index of the light refraction layer is larger than that of the organic encapsulation layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, a display panel and a display device. Background Art

[0002] The black border of a conventional display device is mainly caused by the black ink pattern between the cover plate and the display substrate. The black ink pattern is generally set to cover the metal wiring in the display substrate to prevent the user from observing the metal wiring and thus affecting the display effect. The black border of the display device greatly affects the display effect of the display device. Therefore, the narrow border design can bring a better screen-to-body ratio, increase the display effect of the display device, and give consumers a more comfortable visual effect. It is one of the parameters that mobile phones, tablets and other display devices attach great importance to. Ultra-narrow borders are one of the optimization and improvement directions of display devices.

[0003] In the related art, the narrow bezel design is used to increase the display effect of the display device, generally by reducing the width of the bezel area by reducing the area occupied by metal routing or external isolation columns in the bezel area of ​​the display substrate. However, this will affect the reliability of the display substrate, making it impossible for the display substrate to meet the requirements of high reliability and good display effect. Summary of the invention

[0004] The present invention provides a display substrate and a preparation method thereof, a display panel and a display device, which are used to solve the problem that a narrow frame design cannot take into account both high reliability and good display effect.

[0005] In order to solve the above technical problems, the present invention provides a display substrate, comprising: a substrate, the substrate comprising a display area and a frame area located outside the display area; the frame area comprising a wiring area close to the display area, the wiring area being provided with a conductive line; a light-emitting film layer, arranged on the display area; a packaging layer, located on the light-emitting film layer and at least partially extending onto the frame area; the packaging layer comprising an organic packaging layer; a light-refracting layer, located at an edge of the organic packaging layer and at a side of the conductive line close to the display side; an orthographic projection of the light-refracting layer on the substrate at least partially overlaps with an orthographic projection of an edge of the organic packaging layer on the substrate; and a refractive index of the light-refracting layer is greater than that of the organic packaging layer.

[0006] Optionally, the display area includes a main display area and a transition display area located between the main display area and the frame area, and the pixel density of the luminous film layer on the transition display area is greater than the pixel density of the luminous film layer on the main display area; the light refraction layer also extends to the transition display area.

[0007] Optionally, the edge of the organic encapsulation layer includes a bonding portion that matches the light refraction layer, and the light refraction layer and the bonding portion are bonded to each other.

[0008] Optionally, in a direction away from the center of the display area, the distance between the bonding portion and the substrate decreases.

[0009] Optionally, the encapsulation layer also includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; a second inorganic encapsulation layer located on the organic encapsulation layer; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the entire display area and at least part of the frame area; the light refraction layer is located between the organic encapsulation layer and the second inorganic encapsulation layer, and the light refraction layer is in contact with and bonded to the bonding part of the organic encapsulation layer; or, the light refraction layer is located between the organic encapsulation layer and the second inorganic encapsulation layer and between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0010] Optionally, a surface of the light refraction layer facing away from the substrate and a surface of the organic encapsulation layer on the main display area facing away from the substrate are located in the same plane.

[0011] Optionally, the encapsulation layer also includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; a second inorganic encapsulation layer located on the organic encapsulation layer; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the entire display area and at least part of the frame area; the light refraction layer is arranged on the second inorganic encapsulation layer, and the second inorganic encapsulation layer and the light refraction layer are sequentially laminated on the laminating portion.

[0012] Optionally, a surface of the light refraction layer facing away from the substrate and a surface of the second inorganic encapsulation layer on the main display area facing away from the substrate are located in the same plane.

[0013] Optionally, the bonding portion extends from the routing area to the transition display area, or the bonding portion is located on the transition display area.

[0014] Optionally, it also includes: a blocking dam, which is located on a side of the organic encapsulation layer away from the display area along a direction parallel to the substrate surface; and a light refraction layer is located on a side of the blocking dam close to the display area along a direction parallel to the substrate surface.

[0015] The present invention also provides a method for preparing a display substrate, comprising: providing a substrate; the substrate comprising a display area and a frame area located outside the display area; the frame area comprising a wiring area close to the display area; forming a conductive line on the wiring area; forming a light-emitting film layer on the display area; forming a packaging layer on the light-emitting film layer, at least part of the packaging layer extends to the frame area; the packaging layer comprises an organic packaging layer; forming a light refraction layer at the edge of the organic packaging layer, the light refraction layer is located on a side of the conductive line close to the display side; the orthographic projection of the light refraction layer on the substrate at least partially overlaps with the orthographic projection of the edge of the organic packaging layer on the substrate; the refractive index of the light refraction layer is greater than the refractive index of the organic packaging layer.

[0016] Optionally, the step of forming an organic encapsulation layer on the light-emitting film layer includes: forming a bonding portion that matches the light refraction layer at an edge of the organic encapsulation layer, and the light refraction layer is bonded to the bonding portion.

[0017] Optionally, the encapsulation layer also includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; a second inorganic encapsulation layer located on the organic encapsulation layer; a light refraction layer is formed between the organic encapsulation layer and the second inorganic encapsulation layer; or, a light refraction layer is formed between the organic encapsulation layer and the second inorganic encapsulation layer and between the first inorganic encapsulation layer and the second inorganic encapsulation layer; or, a light refraction layer is formed on the second inorganic encapsulation layer.

[0018] Optionally, the display area includes a main display area and a transition display area located between the main display area and the frame area, and forming a light refraction layer at the edge of the organic encapsulation layer includes: after forming a bonding portion at the edge of the organic encapsulation layer, forming a sacrificial layer on the frame area near the edge of the organic encapsulation layer, the top surface of the sacrificial layer facing away from the substrate and the surface of the organic encapsulation layer on the main display area facing away from the substrate are located in the same plane; filling an optical material between the sacrificial layer and the bonding portion to form a light refraction layer; and removing the sacrificial layer.

[0019] Optionally, forming the bonding portion at the edge of the organic encapsulation layer includes: forming the bonding portion at the edge of the organic encapsulation layer by an etching process.

[0020] Optionally, it also includes: before forming the encapsulation layer, forming a blocking dam on the side of the wiring area away from the display area in a direction parallel to the surface of the substrate; the step of forming the organic encapsulation layer includes: printing the encapsulation material on the main display area through a printing process; after the encapsulation material is cured, an organic encapsulation layer is formed, and the edge of the organic encapsulation layer is located on the transition display area, or the edge of the organic encapsulation layer extends to the wiring area; wherein the blocking dam is located on the side of the organic encapsulation layer away from the display area.

[0021] The present invention further provides a display panel, comprising: the display substrate described in the present invention.

[0022] The present invention further provides a display device, comprising: the display panel described in the present invention.

[0023] The technical solution of the present invention has the following technical effects:

[0024] The display substrate provided by the technical solution of the present invention has a light refraction layer arranged at the edge of the organic encapsulation layer and on the side of the conductive line close to the display side, so that the light reflected by the conductive line in the wiring area is projected onto the light refraction layer and is scattered after being refracted by the light refraction layer; the orthographic projection of the light refraction layer on the substrate is at least partially overlapped with the orthographic projection of the edge of the organic encapsulation layer on the substrate, and the refractive index of the light refraction layer is greater than the refractive index of the organic encapsulation layer, so that the light reflected by the conductive line is greatly deflected out of the field of view under the action of the light refraction layer, and the intensity of the light reflected by the conductive line is relatively small, and the intensity of the light scattered after being refracted by the light refraction layer will be further weakened, so that the conductive line cannot be seen in the field of view of normal human eyes. It is observed that the visual impact of the conductive wire is eliminated without setting a black ink pattern, the probability of the outside world observing the black area is reduced, and the display effect is improved; further, in the application of curved display, the visual impact of the conductive wire can be avoided without bending the display substrate, thereby avoiding the undesirable problem of damage to the display substrate caused by stress generated during the bending of the rear end of the display substrate, and improving the reliability of the display substrate; secondly, the reflective light path of the conductive wire is changed by using the light refraction layer, and the area of ​​the displayable area can be expanded without reducing the setting of the conductive wire. Correspondingly, the area of ​​the border area observed by the outside world is reduced, which optimizes the display effect while ensuring the reliability of the display substrate. In summary, the display substrate can take into account the requirements of high reliability and good display effect while realizing a narrow border design.

[0025] The display panel provided by the present invention can meet the requirements of both high reliability and good display effect based on the display substrate. The display panel can meet the requirements of both high reliability and good display effect.

[0026] The display device provided by the present invention is based on the requirement that the display panel can meet both the requirements of high reliability and good display effect. The display device can meet both the requirements of high reliability and good display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic plan view of a display substrate provided for some embodiments of the present invention;

[0029] Figure 2 for Figure 1 A schematic cross-sectional view taken along the cutting line PP';

[0030] Figure 3 for Figure 1 Another cross-sectional schematic diagram obtained along the cutting line PP';

[0031] Figure 4 for Figure 1 Another cross-sectional schematic diagram obtained along the cutting line PP';

[0032] Figure 5 for Figure 1 Another cross-sectional schematic diagram obtained along the cutting line PP';

[0033] Figure 6 A schematic diagram of the distribution of the light-emitting film layer on the display area and the frame area provided in some embodiments of the present invention;

[0034] Figure 7 A schematic flow chart of a method for preparing a display substrate provided in some embodiments of the present invention;

[0035] Figures 8 to 19 A schematic diagram of the structure of a display substrate during preparation provided by some embodiments of the present invention;

[0036] Fig. 20 A schematic diagram of the structure of a display panel provided in some embodiments of the present invention. DETAILED DESCRIPTION

[0037] The technical solution of the present application will be described clearly and in detail below in conjunction with the drawings of the embodiments of the present application. Obviously, the embodiments described below are part of the embodiments of the present application rather than all of the embodiments, and are only used to more clearly illustrate the technical solution of the present application. Therefore, they are only used as examples, and the protection scope of the present application cannot be limited by this. Based on the described embodiments of the present application, all other embodiments that can be obtained by those skilled in the art without creative work belong to the scope of protection of the present application.

[0038] Unless otherwise defined, all technical and scientific terms used herein shall have the meanings commonly understood by technicians in the technical field of this application; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the embodiments of this application and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the embodiments of this application are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the embodiments of this application, unless otherwise stated, "multiple" means more than two.

[0039] In the embodiments of the present application, the orientations or positional relationships indicated by “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0040] In the embodiments of the present application, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0041] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] Some embodiments of the present invention provide a display substrate, in combination with reference Figures 1 to 5 , Figure 1 To show the plan view of the substrate, Figures 2 to 5 for Figure 1 Schematic cross-sectional view taken along cutting line PP' in FIG. The display substrate comprises: a substrate 100, and a light-emitting film layer 300, a packaging layer 400 and a light-refracting layer 500 arranged on the substrate 100. The substrate 100 comprises a display area A and a frame area B located outside the display area A; the frame area B comprises a wiring area B' close to the display area A, and the wiring area B' is provided with a conductive line 200; the light-emitting film layer 300 is arranged on the display area A; the packaging layer 400 is located on the light-emitting film layer 300 and at least partially extends to the frame area B; the packaging layer 400 comprises an organic packaging layer 410; the light-refracting layer 500 is located at an edge 411 of the organic packaging layer 410 and at a side of the conductive line 200 close to the display side; the orthographic projection of the light-refracting layer 500 on the substrate 100 at least partially overlaps with the orthographic projection of the edge 411 of the organic packaging layer 410 on the substrate 100; the refractive index of the light-refracting layer 500 is greater than the refractive index of the organic packaging layer 410. Figure 1 The area within the middle dotted frame is the display area A, and the area between the dotted frame and the outermost solid frame is the border area B.

[0043] In this embodiment, a light refraction layer is disposed at an edge 411 of the organic encapsulation layer 410 and at a side of the conductive line 200 close to the display side, so that the light reflected by the conductive line 200 in the wiring area B' is projected to the light refraction layer 500, and is scattered after being refracted by the light refraction layer 500; the orthographic projection of the light refraction layer 500 on the substrate 100 is at least partially overlapped with the orthographic projection of the edge 411 of the organic encapsulation layer 410 on the substrate 100, and the refractive index of the light refraction layer 500 is greater than the refractive index of the organic encapsulation layer 410, so that the light reflected by the conductive line 200 is greatly deflected out of the field of view under the action of the light refraction layer 500, and the intensity of the light reflected by the conductive line 200 is small, and the intensity of the light scattered after refraction by the light refraction layer 500 will be further weakened, which The conductive wire 200 cannot be observed under the normal human eye field, thereby eliminating the visual impact of the conductive wire 200 without setting the black ink pattern, reducing the probability of the outside world observing the conductive wire 200, and improving the display effect; further, in the application of curved display, the visual impact of the conductive wire can be avoided without bending the display substrate, thereby avoiding the undesirable problem of damage to the display substrate caused by stress generated during the bending process of the rear end of the display substrate, and improving the reliability of the display substrate; secondly, the reflective light path of the conductive wire is changed by using the light refraction layer 500, and the area of ​​the displayable area can be expanded without reducing the setting of the conductive wire 200. Accordingly, the area of ​​the frame area B observed by the outside world is reduced, and the reliability of the display substrate is guaranteed while optimizing the display effect. In summary, the display substrate can achieve a narrow frame design while taking into account the requirements of high reliability and good display effect.

[0044] The display substrate can be applied to both straight-surface display scenarios and curved-surface display scenarios. The display substrate has a wide range of applications.

[0045] In addition, setting the light refraction layer 500 in the display substrate is a more appropriate choice than setting the light refraction layer 500 at the rear end of the display substrate. By integrating the light refraction layer 500 in the display substrate, the light emitted by the light emitting film layer 300 and the light reflected by the conductive wire 200 are projected closer to the light refraction layer 500, and the light refraction layer 500 can deflect the light in time and scatter it out.

[0046] In some embodiments, the refractive index of the light refraction layer 500 is 1.6 to 1.7, for example, 1.6 or 1.7; the refractive index of the organic encapsulation layer 410 is a conventional setting in the related art. In other embodiments, the refractive index of the light refraction layer 500 is not limited thereto, and the refractive index of the light refraction layer 500 and the refractive index of the organic encapsulation layer 410 can be selected according to actual needs, and the refractive index of the light refraction layer can be ensured to be greater than the refractive index of the organic encapsulation layer.

[0047] In some embodiments, reference Figure 6The display area A includes a main display area A1 and a transitional display area A2 located between the main display area A1 and the frame area B. The pixel density of the light-emitting film layer 300 on the transitional display area A2 is greater than that of the light-emitting film layer 300 on the main display area A1. The light-refracting layer 500 also extends to the transitional display area A2. In a display substrate of the same size, setting the transitional display area A2 between the main display area A1 and the frame area B is equivalent to increasing the overall area of ​​the display area A, and the area of ​​the corresponding frame area B is reduced, thereby realizing a narrow frame design and improving the screen-to-body ratio of the display substrate. The light emitted by the light-emitting film layer 300 on the transitional display area A2 is projected onto the light-refracting layer 500, and is scattered after being refracted by the light-refracting layer 500. The light emitted by the light-emitting film layer 500 on the transitional display area A2 close to the frame area B will be deflected to the display side of the frame area B under the action of the light-refracting layer 500. The light emitted by the light-emitting film layer 500 on the transitional display area A2 The display sides of the transition display area A2 and part of the border area B can be seen by the outside world, and accordingly, the area of ​​the border area B observed by the outside world is reduced, further realizing the narrow border display, which can further enhance the display effect; in addition, the pixel density of the light-emitting film layer 500 on the transition display area A2 is greater than the pixel density of the light-emitting film layer 500 on the main display area A1, which can make up for the relatively small number of light-emitting film layers 500 on the transition display area A2, so that the light emitted by the light-emitting film layer 500 on the transition display area A2 received by the outside world is close to the light emitted by the light-emitting film layer 500 on the main display area A1, thereby improving the consistency of the display effect.

[0048] Further, the light refraction layer 500 extending to the transition display area A2 means that the light refraction layer 500 extends to any position on the boundary between the transition display area A2 and the frame area B to the boundary between the transition display area A2 and the main display area A1, and the light refraction layer 500 does not extend to the main display area A1. In some embodiments, preferably, the light refraction layer 500 extends to the boundary between the transition display area A2 and the main display area A1, and the light refraction layer 500 can better refract and scatter the light emitted by the light-emitting film layer 500 on the transition display area A2, thereby enhancing the effect of narrow frame display and further enhancing the display effect.

[0049] In other embodiments, the transition display area may not be set, and the light refraction layer is located on the side of the conductive line close to the display side. The light refraction layer may be located on the frame area and directly opposite the conductive line. Alternatively, the light refraction layer may be located on the frame area and extend to the junction of the frame area and the main display area.

[0050] In some embodiments, reference Figures 2 to 5The edge 411 of the organic encapsulation layer 410 includes a bonding portion 410a that cooperates with the light refraction layer 500, and the light refraction layer 500 is bonded to the bonding portion 410a. The loss of the light reflected by the conductive wire 200 and the light emitted by the light emitting film layer 300 at the interface between the light refraction layer 500 and the organic encapsulation layer 410 is reduced, and the light passing through the organic encapsulation layer 410 is deflected at the interface between the light refraction layer 500 and the organic encapsulation layer 410, which has a better divergence effect on the light reflected by the conductive wire 200 and the light emitted by the light emitting film layer 300, thereby enhancing the display effect.

[0051] The fitting part 410a cooperates with the light refraction layer 500, which may refer to the shape and size of the fitting part 410a cooperating with the light refraction layer 500 so that the fitting part 410a and the light refraction layer 500 can be fitted. In the embodiment of the present application, the two structural fitting arrangements may refer to the shape and size of the interface between the fitting part 410a and the light refraction layer 500 that contacts each other to achieve close fitting.

[0052] In some embodiments, the encapsulation layer 400 further includes: a first inorganic encapsulation layer 420 located between the organic encapsulation layer 410 and the light-emitting film layer 300; and a second inorganic encapsulation layer 430 located on the organic encapsulation layer 410; the first inorganic encapsulation layer 420 and the second inorganic encapsulation layer 430 cover the entire display area A and at least a portion of the frame area B. The organic encapsulation layer 4 has better flow characteristics than the inorganic encapsulation layer, and the organic encapsulation layer is more likely to form a bonding portion due to the process leveling factor.

[0053] In other embodiments, a bonding portion is provided at an edge of the first inorganic encapsulation layer, or a bonding portion is provided at an edge of the second inorganic encapsulation layer.

[0054] In some embodiments, the distance between the laminating portion 410a and the substrate 100 decreases in the direction away from the center of the display area A. This avoids the formation of a gap between the light refraction layer 500 and the laminating portion 410a, so that the light refraction layer 500 can be closely attached to the laminating portion 410a, thereby improving the divergence effect of the light refraction layer 500 on the light reflected by the conductive wire 200 and the light emitted by the light emitting film layer 300.

[0055] In some embodiments, reference Figures 2 to 5 , the bonding portion 410a is a convex arc surface facing the side away from the substrate 100, and the bonding surface of the light refraction layer 500 that is bonded to the bonding portion 410a is a concave arc surface facing the side away from the substrate 100. The light refraction layer 500 is a concave lens-like structure, and the light refraction layer 500 enhances the divergence effect of the light reflected from the conductive wire 200 and the light emitted by the light-emitting film layer 300, so that the effect of improving the display effect is enhanced. The curvature of the arc surface can be set according to actual needs and is not limited here.

[0056] In other embodiments, the laminating portion is a plane, and the laminating surface of the light refractive layer that is in contact with the laminating portion is a plane. The slope of the laminating portion can be set according to actual needs and is not limited here.

[0057] In some embodiments, reference Figure 2 and Figure 4 , the bonding portion 410a extends from the wiring area B' to the transition display area A2. The bonding portion 410a extending from the wiring area B' to the transition display area A2 means that the bonding portion 410a extends from the wiring area B' to any position on the junction of the transition display area A2 and the frame area B to the junction of the transition display area A2 and the main display area A1. In some embodiments, the bonding portion 410a extends from the wiring area B' to any position on the junction of the transition display area A2 and the main display area A1, which can improve the consistency of the bonding surface of the bonding portion 410a and the light refraction layer 500; the light refraction layer 500 can more effectively diverge the light reflected from the conductive wire 200 and the light emitted by the light-emitting film layer 300, thereby enhancing the effect of improving the display effect.

[0058] Figure 2 and Figure 3 In the figure, the light refraction layer 500 is located between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430, and the light refraction layer 500 is in contact with the bonding portion 410a of the organic encapsulation layer 410. Further, the surface of the light refraction layer 500 facing away from the substrate 100 and the surface of the organic encapsulation layer 410 on the main display area A1 facing away from the substrate 100 are located in the same plane. This avoids the generation of steps between the light refraction layer 500, the organic encapsulation layer 410 and the subsequent second inorganic encapsulation layer 430, increases the flatness of the surfaces of the light refraction layer 500 and the organic encapsulation layer 410, facilitates the arrangement of the second inorganic encapsulation layer 430, and improves the flatness of the second inorganic encapsulation layer 430.

[0059] Figure 2 and Figure 3 The difference is that: the curvature of the arc surface of the fitting portion 410a is different; Figure 2 The refractive index of the medium light refraction layer 500 is less than Figure 3 The refractive index of the medium light refraction layer. Figure 2 After the organic encapsulation layer 410 is formed, an etching process is performed on the edge 411 of the organic encapsulation layer 410 to form a bonding portion 410a having a specific curvature. Figure 3 After the organic encapsulation layer 410 is formed, no etching process is performed on the edge 411 of the organic encapsulation layer 410. The specific formation process is described in detail in the following method for preparing the display substrate.

[0060] Figure 4In the figure, the light refraction layer is arranged on the second inorganic encapsulation layer 430, and the second inorganic encapsulation layer 430 and the light refraction layer 500 are sequentially laminated and arranged on the laminating portion 410a as an illustration. Furthermore, the surface of the light refraction layer 500 facing away from the substrate 100 and the surface of the second inorganic encapsulation layer 430 on the main display area A1 facing away from the substrate 100 are located in the same plane. Avoiding the generation of steps between the light refraction layer 500, the second inorganic encapsulation layer 430 and the subsequent film layer (such as the touch function layer) increases the flatness of the surface of the light refraction layer 500 and the second inorganic encapsulation layer 430, thus providing a larger flat area for the setting of the touch function layer, which is more conducive to ensuring the touch sensitivity of the touch function layer on the frame area.

[0061] Since the thickness of the inorganic encapsulation layer is relatively thin, the second inorganic encapsulation layer 430 and the light refraction layer 500 are sequentially laminated and arranged on the laminating portion 410a, so that the interface between the light refraction layer 500 and the second inorganic encapsulation layer 430 can be matched with the shape and size of the laminating portion 410a. In other words, the light refraction layer 500 with the required interface parameters can be realized by setting the shape and size of the laminating portion 410a. For example, by setting the laminating portion 410a as a convex arc surface facing away from the substrate 100, the laminating surface of the light refraction layer 500 that is laminated with the laminating portion 410a is a concave arc surface facing away from the substrate 100.

[0062] The position of the bonding portion 410a can be adjusted according to the process conditions. In other embodiments, the bonding portion is located on the wiring area and does not extend to the transition display area and the main display area.

[0063] In other embodiments, reference Figure 5 , the bonding portion 410a is located on the transition display area A2. Figure 5 In the embodiment, the light refraction layer 500 is located between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430 and between the first inorganic encapsulation layer 420 and the second inorganic encapsulation layer 430, and the light refraction layer 500 is in contact with the bonding portion 410a of the organic encapsulation layer 410. In other embodiments, the light refraction layer is disposed on the second inorganic encapsulation layer, and the second inorganic encapsulation layer and the light refraction layer are sequentially bonded to the bonding portion.

[0064] In some embodiments, reference Figures 2 to 5 The display substrate further includes: a pixel definition layer 600 located between the substrate 100 and the encapsulation layer 400, the pixel definition layer 600 is located on the display area A and extends to a portion of the frame area B, and the pixel definition layer 600 has a pixel opening located on the display area A; the light-emitting film layer 300 is located in the pixel opening. In some embodiments, the pixel definition layer 600 is located between the first inorganic encapsulation layer 420 and the substrate 100.

[0065] In some embodiments, the display substrate further includes: a first electrode layer 700 and a second electrode layer 800, the first electrode layer 700 is located between the light-emitting film layer 300 and the substrate 100; the second electrode layer 800 is located between the light-emitting film layer 300 and the encapsulation layer 400 and between the pixel definition layer 600 and the encapsulation layer 400 on the display area A. The pixel definition layer 600 may also cover part of the first electrode layer 700. The second electrode layer 800 is located between the light-emitting film layer 300 and the first inorganic encapsulation layer 420 and between the pixel definition layer 600 and the first inorganic encapsulation layer 420 on the display area A. In this embodiment, the first electrode layer 700 is an anode layer, and the second electrode layer 800 is a cathode layer.

[0066] In some embodiments, the substrate 100 includes: a base layer 110; a thin film transistor located between the base layer 110 and the light-emitting film layer 300; the thin film transistor includes: an active layer 120 located on the base layer 110, the active layer 120 includes a channel region and a source region and a drain region located on both sides of the channel region; a gate layer 130 located on a side of the active layer 120 away from the base layer 110; a gate insulating layer 140 located between the gate layer 130 and the active layer 120; a source electrode 150 and a drain electrode 160, the source electrode 150 is connected to the source region, and the drain electrode 160 is connected to the drain region. The gate insulating layer 140 is disposed in the entire area of ​​the display area A and the frame area B.

[0067] In some embodiments, the substrate further includes: a first insulating layer 170, which is located on the gate layer 130 and the gate insulating layer 140. The source electrode 150 extends from the first insulating layer 170, in the first insulating layer 170 and the gate insulating layer 140, to the source region of the active layer 120; the drain electrode 160 extends from the first insulating layer 170, in the first insulating layer 170 and the gate insulating layer 140, to the drain region of the active layer 120. The conductive line 200 is located on the first insulating layer 170 in the border region B.

[0068] In some embodiments, the substrate further includes: a second insulating layer 180, located between the light-emitting film layer 300 and the first insulating layer 170. Specifically, the second insulating layer 180 is located between the first electrode layer 700 and the thin film transistor and between the first electrode layer 700 and the first insulating layer 170. The second insulating layer 180 extends to a portion of the frame area B, and the second insulating layer 180 located in the frame area B exposes a portion of the conductive line 200. The first electrode layer 700 on the frame area B is connected to the exposed conductive line 200. The first electrode layer 700 on the display area extends in the second insulating layer 180 to connect to the source 150 or the drain 160 of the thin film transistor.

[0069] In one embodiment, the substrate further includes: a buffer layer 190 located between the base layer 110 and the thin film transistor. In other embodiments, the buffer layer may not be provided.

[0070] In some embodiments, the display substrate further includes: a barrier dam 900, which is located on a side of the organic encapsulation layer 410 away from the display area A along a direction parallel to the surface of the substrate 100; and a light refraction layer 500 is located on a side of the barrier dam 900 close to the display area A along a direction parallel to the surface of the substrate 100. The barrier dam 900 is used to block the flow of the organic encapsulation layer 410 and the light refraction layer 500 during the process of forming the organic encapsulation layer 410 and the light refraction layer 500, so as to prevent the materials of the organic encapsulation layer 410 and the light refraction layer 500 on the frame area B from overflowing to the side of the barrier dam 900 away from the display area A, thereby reducing the probability of encapsulation failure.

[0071] In some embodiments, the barrier dam 900 includes: a plurality of sub-barrier layers arranged in a direction perpendicular to the surface of the substrate 100, and the material of some sub-barrier layers is the same as that of the second insulating layer 180. The number of the barrier dam 900 may be one or more. Figures 2 to 5 The number of the barrier dams 900 is multiple as an example. The multiple barrier dams 900 include a first barrier dam 910 and a second barrier dam 920 located between the organic encapsulation layer 410 and the first barrier dam 910. The first barrier dam 910 includes multiple sub-barrier layers arranged in a direction perpendicular to the surface of the substrate 100, and the material of some of the sub-barrier layers is the same as the material of the second insulating layer 180; the second barrier dam 920 includes multiple sub-barrier layers arranged in a direction perpendicular to the surface of the substrate 100, and the material of some of the sub-barrier layers is the same as the material of the second insulating layer 180.

[0072] In some embodiments, the conductive line 200 extends to a portion of the surface of the sub-blocking layer of the same material as the second insulating layer 180 facing the substrate 100. Specifically, the conductive line 200 extends to a portion of the surface of the sub-blocking layer of the same material as the second insulating layer 180 in the second blocking dam 920 facing the substrate 100. The blocking dam 900 can shield part of the conductive line 200 to prevent the conductive line from being observed by the outside world and affecting the display effect. The orthographic projection of the blocking dam 900 on the substrate 100 covers part of the routing area B', and the orthographic projection of the light refraction layer 500 on the substrate 100 covers part of the routing area B'.

[0073] In other embodiments, the conductive line does not extend to the side of the second barrier dam that faces the substrate and is made of the same material as the second insulating layer. The orthographic projection of the light refraction layer 500 on the substrate 100 covers the entire wiring area B'.

[0074] In some embodiments, the first blocking dam 910 includes a first sub-blocking layer, a second sub-blocking layer, a third sub-blocking layer, and a fourth sub-blocking layer stacked in sequence. Along the direction parallel to the surface of the substrate 100, the first sub-blocking layer is located on the side of the organic encapsulation layer 410 away from the display area A, the second sub-blocking layer is located on the side of the first sub-blocking layer away from the substrate 100, the third sub-blocking layer is located on the side of the second sub-blocking layer away from the substrate 100, and the fourth sub-blocking layer is located on the side of the third sub-blocking layer away from the substrate 100. The first sub-blocking layer is made of the same material as the second insulating layer 180, the second sub-blocking layer is made of the same material as the pixel definition layer 600, the third sub-blocking layer is made of the same material as the first inorganic encapsulation layer 420, and the fourth sub-blocking layer is made of the same material as the second inorganic encapsulation layer 430. The second blocking dam 920 includes a first sub-blocking layer, a second sub-blocking layer, a third sub-blocking layer, and a fourth sub-blocking layer stacked in sequence. Along the direction parallel to the surface of the substrate 100, the first sub-barrier layer is located on the side of the organic encapsulation layer 410 away from the display area A and between the organic encapsulation layer 410 and the first barrier dam 910, the second sub-barrier layer is located on the side of the first sub-barrier layer away from the substrate 100, the third sub-barrier layer is located on the side of the second sub-barrier layer away from the substrate 100, and the fourth sub-barrier layer is located on the side of the third sub-barrier layer away from the substrate 100. The first sub-barrier layer is made of the same material as the second insulating layer 180, the second sub-barrier layer is made of the same material as the pixel definition layer 600, the third sub-barrier layer is made of the same material as the first inorganic encapsulation layer 420, and the fourth sub-barrier layer is made of the same material as the second inorganic encapsulation layer 430.

[0075] In some embodiments, the base layer 110 includes a flexible base layer or a rigid base layer.

[0076] In one embodiment, the display substrate includes an OLED display substrate. In other embodiments, the display substrate includes, but is not limited to, a liquid crystal display substrate.

[0077] Another embodiment of the present invention provides a method for preparing a display substrate, referring to Figure 7 ,include:

[0078] Step S1: providing a substrate; the substrate comprises a display area and a frame area located outside the display area; the frame area comprises a wiring area close to the display area;

[0079] Step S2: forming a conductive line on the routing area;

[0080] Step S3: forming a light-emitting film layer on the display area;

[0081] Step S4: forming an encapsulation layer on the light-emitting film layer, wherein at least a portion of the encapsulation layer extends onto the frame area; the encapsulation layer includes an organic encapsulation layer;

[0082] Step S5: forming a light refraction layer at the edge of the organic encapsulation layer, the light refraction layer being located on the side of the conductive line close to the display side; the orthographic projection of the light refraction layer on the substrate at least partially overlaps with the orthographic projection of the edge of the organic encapsulation layer on the substrate; the refractive index of the light refraction layer is greater than the refractive index of the organic encapsulation layer.

[0083] In some embodiments, before forming the encapsulation layer, a blocking dam 900 is formed on the side of the routing area away from the display area in a direction parallel to the surface of the substrate. The blocking dam 900 is used to block the flow of the organic encapsulation layer 410 and the light refraction layer 500 during the process of forming the organic encapsulation layer 410 and the light refraction layer 500, so as to prevent the materials of the organic encapsulation layer 410 and the light refraction layer 500 on the frame area B from overflowing to the side of the blocking dam 900 away from the display area A, thereby reducing the probability of encapsulation failure.

[0084] In some embodiments, the step of forming an organic encapsulation layer on the light-emitting film layer includes: forming a bonding portion that matches the light-refracting layer 500 at the edge of the organic encapsulation layer 410, and the light-refracting layer 500 is bonded to the bonding portion. The loss of the light reflected by the conductive wire 200 and the light emitted by the light-emitting film layer 300 at the interface between the light-refracting layer 500 and the organic encapsulation layer 410 is reduced, and the light passing through the organic encapsulation layer 410 is deflected when reaching the interface between the light-refracting layer 500 and the organic encapsulation layer 410, so that the divergence effect of the light reflected by the conductive wire 200 and the light emitted by the light-emitting film layer 300 is better, and the effect of improving the display effect is enhanced.

[0085] In step S1, refer to Figure 8 The step of providing the substrate 100 includes: forming a thin film transistor on the display area of ​​the base layer 110.

[0086] In some embodiments, the process of forming a thin film transistor includes: forming an active layer 120 on the display area of ​​the substrate layer 110, the active layer 120 including a channel region and a source region and a drain region located on both sides of the channel region; forming a gate insulating layer 140 on the active layer 120, the gate insulating layer 140 extending to the frame region B; forming a gate layer 130 on the gate insulating layer 140 of the display area A; forming a source electrode 150 connected to the source region and forming a drain electrode 160 connected to the drain region.

[0087] In some embodiments, after forming the gate layer 130 on the gate insulating layer 140 of the display area A, a first insulating layer 170 is formed on the gate insulating layer 140 and the gate layer 140, and a source electrode 150 and a drain electrode 160 are formed on the first insulating layer 170. The source electrode 150 extends from the first insulating layer 170 in the first insulating layer 170 and the gate insulating layer 140 to the source region of the active layer 120; the drain electrode 160 extends from the first insulating layer 170 in the first insulating layer 170 and the gate insulating layer 140 to the drain region of the active layer 120.

[0088] In some embodiments, the step of providing the substrate 100 further includes: forming a second insulating layer 180 on a portion of the first insulating layer 170, the source electrode 150 and the drain electrode 160. The second insulating layer 180 is located in the display area A and a portion of the frame area B.

[0089] In some embodiments, the step of providing the substrate 100 further includes: before forming the thin film transistor, forming a buffer layer 190 on the base layer 110. In other embodiments, the buffer layer may not be formed.

[0090] In step S2, continue to refer to Figure 8 The step of forming the conductive line 200 on the routing area B′ includes: after forming the first insulating layer 170 , forming the conductive line 200 on the first insulating layer 170 in the frame area B. After forming the second insulating layer 180 , the second insulating layer 180 in the frame area B exposes a portion of the conductive line 200 .

[0091] After step S2 , a pixel definition layer 600 is formed on the display area A and a portion of the frame area B of the substrate 100 ; and a pixel opening (not shown) is formed in the pixel definition layer 600 on the display area.

[0092] In some embodiments, before forming the pixel definition layer 600 , a first electrode layer 700 is formed on the display area A and a portion of the frame area B of the substrate 100 . The first electrode layer 700 is an anode layer, and the pixel opening exposes a portion of the first electrode layer 700 .

[0093] In step S3, continue to refer to Figure 8 The step of forming the light-emitting film layer 300 on the display area A includes: forming the light-emitting film layer 300 in the pixel opening.

[0094] In some embodiments, the method for preparing a display substrate further includes: after forming the light-emitting film layer 300 on the display area A, forming a second electrode layer 800 on the light-emitting film layer 300 and the pixel definition layer 600. The second electrode layer 800 is a cathode layer.

[0095] In step S4, the encapsulation layer 400 further includes: a first inorganic encapsulation layer 420 located between the organic encapsulation layer 410 and the light-emitting film layer 300; and a second inorganic encapsulation layer 430 located on the organic encapsulation layer 410. The first inorganic encapsulation layer 420 is located between the second electrode layer 800 and the organic encapsulation layer 410. In step S5, a light refraction layer 500 is formed between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430; or, a light refraction layer 500 is formed between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430 and between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430; or, a light refraction layer 500 is formed on the second inorganic encapsulation layer 430.

[0096] In some embodiments, in conjunction with reference Figures 9 to 17 The step of forming the encapsulation layer 400 on the light-emitting film layer 300 includes: forming a first inorganic encapsulation layer 420 on the second electrode layer 800 ; forming an organic encapsulation layer 410 on the first inorganic encapsulation layer 420 ; and forming a second inorganic encapsulation layer 430 on the organic encapsulation layer 410 .

[0097] In some embodiments, the step of forming the organic encapsulation layer 410 on the first inorganic encapsulation layer 420 includes: forming a bonding portion 410a at an edge 411 of the organic encapsulation layer 410. The shape of the bonding portion 410a is described with reference to the description of the previous embodiment.

[0098] In some embodiments, before forming the encapsulation layer 400, a blocking dam 900 is formed on a side of the wiring area B' away from the display area A in a direction parallel to the surface of the substrate 100. The blocking dam 900 includes multiple sub-blocking layers arranged in a direction perpendicular to the surface of the substrate 100. In some embodiments, the step of forming the blocking dam 900 includes: forming a first blocking dam 910 on a side of the wiring area B' away from the display area A; forming a second blocking dam 920 between the second insulating layer 180 and the first blocking dam 910. The first blocking dam 910 includes multiple sub-blocking layers arranged in a direction perpendicular to the surface of the substrate 100, and the second blocking dam 920 includes multiple sub-blocking layers arranged in a direction perpendicular to the surface of the substrate.

[0099] For the structural description and material description of the first barrier dam 910 and the second barrier dam 920 , reference is made to the description of the aforementioned embodiment.

[0100] In one embodiment, the conductive line 200 extends to a portion of the surface of the second barrier dam 920 that is made of the same material as the second insulating layer 180 and that faces the substrate 100. In other embodiments, the conductive line does not extend to a side of the second barrier dam that is made of the same material as the second insulating layer and that faces the substrate.

[0101] In some embodiments, continue to refer to Fig. 9 and Fig.10 A first inorganic encapsulation layer 420 is formed on the second electrode layer 800, and an organic encapsulation layer 410 is formed on the first inorganic encapsulation layer 420. An edge 411 of the organic encapsulation layer 410 has a pasting portion 410a.

[0102] In some embodiments, the display area includes a main display area and a transitional display area between the main display area and the frame area. The step of forming the organic encapsulation layer 410 includes: printing an encapsulation material on the main display area by a printing process; after the encapsulation material is cured, the organic encapsulation layer 410 is formed, and the edge 411 of the organic encapsulation layer 410 is located on the transitional display area, or the edge of the organic encapsulation layer 410 extends to the wiring area. Fig. 9 The edge 411 of the organic encapsulation layer 410 is located on the transition display area, and the edge 411 of the organic encapsulation layer 410 extends to the wiring area as an example; Fig.10 In the figure, the edge 411 of the organic encapsulation layer 410 is located on the transition display area as an illustration. Since the material of the organic encapsulation layer 410 is fluid, affected by the process leveling factor, after the leveled organic encapsulation layer 410 is cured, a bonding portion 410a will be formed at the edge; thus, the bonding portion 410a can be formed without an additional etching process, which reduces the production process and improves production efficiency.

[0103] In some embodiments, the process of forming the organic encapsulation layer 410 includes an inkjet printing process or a direct write printing process.

[0104] In another embodiment, reference Fig.11 , Fig.11 for Fig. 9 The structural diagram of the base. Forming the bonding portion 410a at the edge 411 of the organic encapsulation layer 410 includes: forming the bonding portion 410a at the edge 411 of the organic encapsulation layer 410 by an etching process. The curvature of the bonding portion 410a actually required can be obtained by the etching process to improve the production quality.

[0105] Regardless of whether the edge 411 of the organic encapsulation layer 410 is located on the transition display area, or the edge 411 of the organic encapsulation layer 410 extends to the wiring area, a bonding portion 410 a may be formed on the edge 411 of the organic encapsulation layer 410 by an etching process.

[0106] refer to Figure 12 to Figure 14 , Fig.12 for Fig. 9 The structural diagram of the foundation, Fig.13 For Fig.10 The structural diagram of the foundation, Fig.14 for Fig.11 Schematic diagram of the structure based on. A sacrificial layer 1000 is formed on the frame area near the edge 411 of the organic encapsulation layer 410, and a light refraction layer 500 is formed on the edge 411 of the organic encapsulation layer 410. A sacrificial layer 1000 is formed on the second blocking dam 920, and a light refraction layer 500 is formed between the sacrificial layer 1000 and the bonding portion 410a. The light refraction layer 500 is contacted and bonded with the bonding portion 410a of the organic encapsulation layer 410.

[0107] After the bonding portion 410a is formed at the edge 411 of the organic encapsulation layer 410, a sacrificial layer 1000 is formed on the second blocking dam 920, and the top surface of the sacrificial layer 1000 facing away from the substrate 100 and the surface of the organic encapsulation layer 410 on the main display area facing away from the substrate 100 are located in the same plane; an optical material is filled between the sacrificial layer 1000 and the bonding portion 410a to form a light refraction layer 500. The flatness of the surface of the light refraction layer 500 and the organic encapsulation layer 410 is increased, which is beneficial to the subsequent arrangement of the second inorganic encapsulation layer 430 and improves the flatness of the subsequent second inorganic encapsulation layer 430.

[0108] In some embodiments, the process of forming the light refraction layer 500 includes an inkjet printing process or a direct writing printing process.

[0109] refer to Fig.15 After the light refraction layer 500 is formed, the sacrificial layer is removed. Fig.15 For Fig.12 Schematic diagram of the structure on the basis.

[0110] Fig.13 and Fig.14 The sacrificial layer in the embodiment also needs to be removed after the light refraction layer 500 is formed. Fig.13 and Fig.14 The step of removing the sacrificial layer in FIG. 5 after forming the light refraction layer 500 is not shown in the figure.

[0111] refer to Fig.16 , Fig.16 for Fig.15 A second inorganic encapsulation layer 430 is formed on the organic encapsulation layer 410 . At the same time, a second inorganic encapsulation layer 430 is formed on the light refraction layer 500 .

[0112] Fig.16 As an example, the light refraction layer 500 is formed between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430 .

[0113] In other embodiments, the light refraction layer 500 is formed between the organic encapsulation layer 410 and the second inorganic encapsulation layer 430 and between the first inorganic encapsulation layer 420 and the second inorganic encapsulation layer 430 .

[0114] In other embodiments, reference Fig.17 , Fig.17 for Fig. 9 A second inorganic encapsulation layer 430 is formed on the organic encapsulation layer 410. The edge of the second inorganic encapsulation layer 430 is laminated on the laminating portion 410a.

[0115] refer to Fig.18 , Fig.18 for Fig.17A schematic diagram of a structure based on the invention. A sacrificial layer 1000 is formed on the frame area near the edge 411 of the organic encapsulation layer 410, and a light refraction layer 500 is formed on the edge 411 of the organic encapsulation layer 410. Specifically, a sacrificial layer 1000 is formed on the second blocking dam 920, and a light refraction layer 500 is formed between the sacrificial layer 1000 and the second inorganic encapsulation layer 430. The second inorganic encapsulation layer 430 and the light refraction layer 500 are sequentially laminated on the laminating portion 410a.

[0116] After the second inorganic encapsulation layer 430 is formed on the organic encapsulation layer 410, a sacrificial layer 1000 is formed on the second blocking dam 920, and the top surface of the sacrificial layer 1000 facing away from the substrate 100 and the surface of the second inorganic encapsulation layer 430 on the main display area facing away from the substrate 100 are located in the same plane; an optical material is filled between the sacrificial layer 1000 and the second inorganic encapsulation layer 430 to form a light refraction layer 500. The flatness of the surface of the light refraction layer 500 and the second inorganic encapsulation layer 430 is increased, so that a larger flat area is provided for the subsequent film layer (such as the touch function layer), which is more conducive to ensuring the touch sensitivity of the touch function layer on the frame area.

[0117] In some embodiments, the process of forming the light refraction layer 500 includes an inkjet printing process or a direct writing printing process.

[0118] refer to Fig.19 , Fig.19 for Fig.18 Schematic diagram of the structure on the foundation. Removal of the sacrificial layer.

[0119] Fig.19 The light refraction layer 500 is formed on the second inorganic encapsulation layer 430 as an example.

[0120] Another embodiment of the present invention further provides a display panel, comprising: the display substrate of the above embodiment.

[0121] In some embodiments, reference Fig. 20 The display panel further includes: a touch function layer 210, located on the display substrate 100; an optical function layer 220, located on the touch function layer 210; and a cover plate 230, located on the optical function layer 220. When the display panel is bent, the light refraction layer in the display substrate eliminates the visual impact of the conductive line, so there is no need to bend the display substrate, thereby avoiding the problem of damage to the display substrate caused by stress generated during the bending process of the rear end of the display substrate, improving the reliability of the display substrate, and thus improving the reliability of the display panel.

[0122] In other embodiments, a light refraction layer may be disposed on the display substrate.

[0123] Another embodiment of the present invention further provides a display device, comprising the display panel of the above embodiment.

[0124] The display device is, for example, any product or component with a display function, such as a display module, various displays, a vehicle-mounted display terminal, a mobile phone, a tablet computer, a notebook computer, etc. Other essential components of the display device are well understood by those skilled in the art, and are not described in detail here, nor should they be used as limitations on the present invention.

[0125] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A display substrate, characterized in that: include: A substrate, the substrate comprising a display area and a frame area located outside the display area; the frame area comprises a wiring area close to the display area, and the wiring area is provided with a conductive line; A luminous film layer is disposed on the display area; An encapsulation layer, located on the light-emitting film layer and at least partially extending onto the frame area; the encapsulation layer comprises an organic encapsulation layer; A light refraction layer is located at an edge of the organic encapsulation layer and at a side of the conductive line close to the display side; an orthographic projection of the light refraction layer on the substrate at least partially overlaps with an orthographic projection of the edge of the organic encapsulation layer on the substrate; and a refractive index of the light refraction layer is greater than a refractive index of the organic encapsulation layer.

2. The display substrate according to claim 1, characterized in that: The display area includes a main display area and a transitional display area between the main display area and the frame area, and the pixel density of the luminous film layer on the transitional display area is greater than the pixel density of the luminous film layer on the main display area; The light refraction layer also extends onto the transition display area.

3. The display substrate according to claim 2, characterized in that: The edge of the organic encapsulation layer includes a bonding portion matched with the light refraction layer, and the light refraction layer is bonded to the bonding portion.

4. The display substrate according to claim 3, characterized in that: In a direction away from the center of the display area, the distance between the bonding portion and the substrate decreases.

5. The display substrate according to claim 3, characterized in that: The encapsulation layer further includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; a second inorganic encapsulation layer located on the organic encapsulation layer; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the entire display area and at least a portion of the frame area; The light refraction layer is located between the organic encapsulation layer and the second inorganic encapsulation layer, and the light refraction layer is in contact with and adhered to the adhesion portion of the organic encapsulation layer; Alternatively, the light refraction layer is located between the organic encapsulation layer and the second inorganic encapsulation layer and between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

6. The display substrate according to claim 5, characterized in that: A surface of the light refraction layer facing away from the substrate and a surface of the organic encapsulation layer on the main display area facing away from the substrate are located in the same plane.

7. The display substrate according to claim 3, characterized in that: The encapsulation layer further includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; a second inorganic encapsulation layer located on the organic encapsulation layer; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the entire display area and at least a portion of the frame area; The light refraction layer is disposed on the second inorganic encapsulation layer, and the second inorganic encapsulation layer and the light refraction layer are sequentially laminated on the laminating portion.

8. The display substrate according to claim 7, characterized in that: A surface of the light refraction layer facing away from the substrate and a surface of the second inorganic encapsulation layer on the main display area facing away from the substrate are located in the same plane.

9. The display substrate according to any one of claims 3 to 8, characterized in that: The bonding portion extends from the routing area to the transition display area, or the bonding portion is located on the transition display area.

10. The display substrate according to claim 1, characterized in that: Also includes: a barrier dam, along a direction parallel to the surface of the substrate, the barrier dam being located on a side of the organic encapsulation layer away from the display area; Along a direction parallel to the surface of the substrate, the light refraction layer is located on a side of the blocking dam close to the display area.

11. A method for preparing a display substrate, characterized in that: include: A substrate is provided; the substrate comprises a display area and a frame area located outside the display area; the frame area comprises a wiring area close to the display area; forming a conductive line on the routing area; forming a light-emitting film layer on the display area; forming an encapsulation layer on the light-emitting film layer, wherein at least a portion of the encapsulation layer extends onto the frame area; the encapsulation layer comprises an organic encapsulation layer; A light refraction layer is formed at the edge of the organic encapsulation layer, and the light refraction layer is located on the side of the conductive line close to the display side; the orthographic projection of the light refraction layer on the substrate at least partially overlaps with the orthographic projection of the edge of the organic encapsulation layer on the substrate; and the refractive index of the light refraction layer is greater than the refractive index of the organic encapsulation layer.

12. The preparation method according to claim 11, characterized in that: The step of forming the organic encapsulation layer on the light-emitting film layer comprises: A bonding portion matched with the light refraction layer is formed at the edge of the organic encapsulation layer, and the light refraction layer is bonded to the bonding portion.

13. The preparation method according to claim 12, characterized in that: The encapsulation layer further includes: a first inorganic encapsulation layer located between the organic encapsulation layer and the light-emitting film layer; and a second inorganic encapsulation layer located on the organic encapsulation layer; The light refraction layer is formed between the organic encapsulation layer and the second inorganic encapsulation layer; or, the light refraction layer is formed between the organic encapsulation layer and the second inorganic encapsulation layer and between the first inorganic encapsulation layer and the second inorganic encapsulation layer; or, the light refraction layer is formed on the second inorganic encapsulation layer.

14. The preparation method according to claim 13, characterized in that: The display area includes a main display area and a transition display area between the main display area and the frame area, and forming a light refraction layer at the edge of the organic encapsulation layer includes: After forming the bonding portion at the edge of the organic encapsulation layer, forming a sacrificial layer on the frame area near the edge of the organic encapsulation layer, wherein the top surface of the sacrificial layer facing away from the substrate and the surface of the organic encapsulation layer on the main display area facing away from the substrate are located in the same plane; Filling an optical material between the sacrificial layer and the bonding portion to form the light refraction layer; and The sacrificial layer is removed.

15. The preparation method according to any one of claims 12 to 14, characterized in that: Forming the bonding portion at the edge of the organic encapsulation layer comprises: The bonding portion is formed at the edge of the organic encapsulation layer by an etching process.

16. The preparation method according to claim 14, characterized in that: Also includes: Before forming the encapsulation layer, forming a blocking dam on a side of the wiring area away from the display area in a direction parallel to the surface of the substrate; The step of forming the organic encapsulation layer comprises: Printing packaging material on the main display area by a printing process; The encapsulation material forms an organic encapsulation layer after solidification, and the edge of the organic encapsulation layer is located on the transition display area, or the edge of the organic encapsulation layer extends to the wiring area; Wherein, the blocking dam is located on a side of the organic encapsulation layer away from the display area.

17. A display panel, characterized in that: include: The display substrate according to any one of claims 1 to 10.

18. A display device, characterized in that: include: The display panel as claimed in claim 17.

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