Silver paste printing dispensing method and photon counter
By using silver paste printing dispensing method during photon counter packaging, and using the scraping technology of a substrate with windows and scraper or printing press, the problems of low dispensing efficiency and poor consistency in the existing technology are solved, and the problem of low dispensing efficiency and poor consistency is realized. More efficient and even dispensing effect.
Patent Information
- Application Number
- CN202411429698.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-02-18
AI Technical Summary
In the prior art, the dispensing efficiency and poor consistency during the packaging process of photon counters, resulting in problems such as changes in glue flow and needle clogging.
Using silver paste printing dispensing method, by obtaining the coordination between the fixing plate and the adhesive part to be dispensed, a substrate with a window is set up, and glue liquid is applied on the edge of the window, and the glue liquid is scraped into the window using a scraper or a printing machine. , evenly apply to the area to be dispensed in the glued part to be dispensed.
The speed and consistency of dispensing are improved, the dispensing quality and preparation efficiency of the parts to be dispensed are improved, and the problems of uneven thickness and poor consistency of the glue liquid are avoided.
Smart Images
Figure CN119456350A_ABST
Abstract
Description
Technical Field
[0001] The present application is applied to the technical field of photon counting CT detector packaging, and in particular relates to a silver paste printing and dispensing method and a photon counter. Background Art
[0002] With the rapid development of the electronics industry, electronic products have made rapid progress in miniaturization and integration, which has put forward higher requirements for the design of electronic devices. Among them, photon counters have the advantages of rich specifications, small size, and convenient assembly. In the process of preparing photon counters, it is necessary to dispense glue on the devices in the photon counter so as to encapsulate them in the photon counter. Dispensing glue is a process of accurately distributing fluids in a controlled manner. It is one of the key technologies in the microelectronics packaging industry.
[0003] However, in the prior art, during the packaging process of products such as photon counters, a large area of thermally conductive silver glue needs to be covered on the surface of the part to be dispensed. During such a large-area dispensing process, traditional dispensing machines may experience unexpected situations such as clogging of the dispensing needle and changes in the glue flow rate. The glue type will also change over time, resulting in poor dispensing consistency and low efficiency of dispensing through the dispensing needle. Summary of the invention
[0004] The present application provides a printing and dispensing method for silver paste to solve the problems of low efficiency and poor consistency of existing dispensing.
[0005] In order to solve the above-mentioned technical problems, the first aspect of the present application provides a method for printing and dispensing silver paste, comprising: obtaining a fixed plate, placing a part to be dispensed on the fixed plate; placing a substrate with a window corresponding to the part to be dispensed on the part to be dispensed; coating the glue on the end face of the substrate on the side away from the fixed plate at the edge of the window; scraping the glue into the window to coat the glue on the area to be dispensed of the part to be dispensed; and removing the part to be dispensed from the fixed plate.
[0006] Among them, the steps of obtaining a fixing plate and placing the part to be dispensed on the fixing plate include: providing at least one slot on the fixing plate; and placing the part to be dispensed inside the slot with the bottom surface facing the substrate.
[0007] Among them, the step of placing a substrate with a window corresponding to the part to be glued on the part to be glued includes: drilling a hole on the substrate to form a window; opening a blind hole connected to the window on one end face of the substrate; placing the blind hole on the surface of the part to be glued facing the part to be glued; wherein the window corresponds to the area to be glued of the part to be glued.
[0008] Among them, the step of scraping the glue into the window to coat the glue on the area to be glued of the part to be glued includes: using a scraper or a printer to scrape along the length or width direction of the window to evenly coat the glue on the area to be glued of the part to be glued.
[0009] The step of removing the part to be dispensed from the fixed plate includes: lifting the substrate perpendicularly to the fixed plate; and removing the part to be dispensed from the fixed plate.
[0010] The thickness of the substrate is the same as the thickness of the glue on the part to be dispensed.
[0011] The substrate is composed of glass fiber cloth and epoxy resin matrix.
[0012] The glue is one or more combinations of silver paste, solder paste, indium and alloy materials.
[0013] Wherein, a resistor is arranged on the bottom surface of the part to be dispensed, and the resistor is located in the blind hole.
[0014] In order to solve the above problems, the present application also provides a photon counter, wherein the photon counter is prepared by the printing and dispensing method of silver paste as described in any of the above items.
[0015] The beneficial effect of the present application is as follows: different from the prior art, the present application opens a window corresponding to the part to be glued on the substrate, and applies glue on the end face of the substrate on the side away from the fixed plate at the edge of the window, and then scrapes the glue into the window, so that the glue is glued on the area to be glued of the part to be glued, and the glue can be evenly coated and printed on the area to be glued of the part to be glued by scraping and printing. When a large area of glue is required on the part to be glued, the speed of glue dispensing can be effectively improved, the consistency of glue on the part to be glued is ensured, and the glue dispensing quality and preparation efficiency of the part to be glued are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of a process of an embodiment of a printing and dispensing method of silver paste of the present application;
[0017] Figure 2 This application Figure 1 A schematic diagram of the process of an embodiment of S12;
[0018] Figure 3 It is a structural schematic diagram of a top view of the fixing plate of the present application;
[0019] Figure 4 It is a structural schematic diagram of the cross section of the fixed plate of the present application;
[0020] Figure 5 It is a schematic diagram of a top view of a structure in which a window is opened on the substrate of the present application;
[0021] Figure 6 It is a schematic diagram of a top view of a structure in which a blind hole is opened on a substrate of the present application;
[0022] Figure 7 It is a structural schematic diagram of a top view of the part to be dispensed in this application;
[0023] Figure 8 This application Figure 1 A schematic diagram of the top view of the structure after step S11 is completed;
[0024] Fig. 9 This application Figure 1 A schematic diagram of the cross-sectional structure after step S11 is completed;
[0025] Fig.10 This application Figure 1 A schematic diagram of the cross-sectional structure after step S12 is completed;
[0026] Fig.11 This application Figure 1 A schematic diagram of the top view of the structure after step S13 is completed;
[0027] Fig.12 This application Figure 1 A schematic diagram of the cross-sectional structure after step S13 is completed;
[0028] Fig.13 This application Figure 1 Schematic diagram of the top view structure after step S14 is completed. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0030] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0032] See also Figure 1 , Figure 1 1 is a schematic diagram of a process flow of an embodiment of a printing and dispensing method of silver paste provided in the present application. It should be noted that if there is substantially the same result, the method of the present invention is not limited to Figure 1 The process sequence shown is limited. Figure 1 As shown, the method comprises the following steps:
[0033] S11: Obtain a fixing plate 10 and place the part to be glued 20 on the fixing plate 10 .
[0034] In this embodiment, if Figure 8 As shown, Figure 8 yes Figure 1 The schematic diagram of the top view of the structure after step S11 is completed, and combined with Fig. 9 As shown, Fig. 9 yes Figure 1 The cross-sectional structure diagram after step S11 is completed, the fixing plate 10 is obtained, and then the glue-dispensing part is placed on the fixing plate 10, so as to facilitate the subsequent glue dispensing on the part 20 to be glued. When the part 20 to be glued is placed on the fixing plate 10, the part 20 to be glued is arranged parallel to the plate surface of the fixing plate 10, so as to fix the part 20 to be glued, and prevent the part 20 to be glued from shaking or slipping when the glue is dispensed on the part 20 to be glued, thereby causing the glue dispensing of the part 20 to be glued to be misplaced. Figure 7 As shown, Figure 7 2 is a schematic diagram of the top view of the part to be glued in the present application, that is, the glue area 201 is located in the middle of the part to be glued 20. In other embodiments, the glue area 201 can be located at any position of the part to be glued 20, and the fixing plate 10 can be set according to the glue area 201 of the part to be glued 20, which is not specifically limited in the present application.
[0035] The fixing plate 10 is a hard fixing plate 10, so as to ensure the structural strength of the fixing plate 10. For example, the fixing plate 10 can be set as a metal fixing plate 10, or other hard materials can be used, which is not specifically limited in this application. The part to be glued 20 has a relative front surface and a bottom surface. The bottom surface is where glue is dispensed on the part to be glued 20, and the end surface on the side that does not need glue dispensing is the front surface.
[0036] In an optional embodiment, if Figure 3 As shown, Figure 3 It is a top view of the fixed plate of the present application, and combined with Figure 4 As shown, Figure 4 It is a schematic diagram of the cross-sectional structure of the fixing plate of the present application. When the part to be glued 20 is placed on the fixing plate 10, at least one card slot 101 is set on the fixing plate 10. Specifically, three card slots 101 can be set on one side end face of the fixing plate 10. When fixing the part to be glued 20, the part to be glued 20 is placed inside the card slot 101, so as to fix the part to be glued 20. Specifically, the card slot 101 protrudes from the plate surface of the fixing plate 10. Taking the three card slots 101 provided on one end face of the fixing plate 10 as an example, the three card slots 101 can be coaxially provided on one end face of the fixing plate 10, wherein the card slots 101 at both ends are symmetrically provided on the fixing plate 10, and the card slots 101 at both ends can be bosses provided on the end face of the fixing plate 10, which are used to support the glue-dispensing part 20, so that the glue-dispensing part 20 is spaced apart from the fixing plate 10, and the middle card slot 101 is provided with a boss of the same height as the bosses of the card slots 101 at both ends, and a limiting member is provided on both sides of the boss, that is, the limiting member is provided on the boss On both sides of the axis of the card slots 101 at both ends, that is, after the part to be glued 20 is placed in the card slots 101, the part to be glued 20 is supported by the three card slots 101, and the part to be glued 20 is limited by the limiter to prevent the part to be glued 20 from slipping, and the three card slots 101 are all provided with bosses, which can support the part to be glued 20 when glue is subsequently dispensed, and can effectively ensure the consistency of the thickness of the glue liquid 40 during the subsequent gluing, and ensure that the glue liquid 40 is evenly attached to the glue area 201 of the part to be glued 20.
[0037] In this embodiment, when the part to be glued 20 is placed in the slot 101, the front side of the part to be glued 20 is placed inside the slot 101 toward the side of the fixed plate 10, that is, the area to be glued 201 is located on the relative bottom surface of the part to be glued 20. When the bottom surface of the part to be glued 20 is facing upward and attached to the slot 101 of the fixed plate 10, it is convenient for subsequent glue dispensing in the area to be glued 201 on the bottom surface of the part to be glued 20.
[0038] S12: placing the substrate 30 with the window 301 corresponding to the part 20 to be glued 20 .
[0039] In an optional embodiment, if Fig.10 As shown, Fig.10 yes Figure 1 The schematic diagram of the cross-sectional structure after the step S12 is completed, after the part to be glued 20 is placed on the fixed plate 10, the substrate 30 is set on the part to be glued 20, the substrate 30 is set parallel to the part to be glued 20 and the fixed plate 10, in order to facilitate the glue dispensing in the area to be glued 201 on the part to be glued 20, a window 301 is opened on the substrate 30, and the window 301 is adapted to the shape of the area to be glued 201, that is, when the substrate 30 is installed on the part to be glued 20, the substrate 30 is fitted on the part to be glued 20, and the window 301 is set corresponding to the area to be glued 201, so that when the part to be glued 20 is subsequently glued, the glue 40 can be attached to the area to be glued 201 of the part to be glued 20 through the window 301.
[0040] In this embodiment, when opening a window 301 on the substrate 30, a CAD (Computer Aided Drafting, drawing software) drawing tool can be used to draw the required window 301 graphics on the substrate 30, thereby improving the speed of drawing the window 301 graphics, accelerating the speed of graphic design, and effectively ensuring the accuracy of the window opening graphics, ensuring the quality of the window 301 of the substrate 30, so that the glue 40 is just attached to the to-be-glued area 201 of the to-be-glued part 20 during subsequent gluing.
[0041] Optionally, when opening the window 301 on the substrate 30, a laser opening method can be used to open the window 301 on the substrate 30, or other cutting methods can be used, such as ion cutting or water jet cutting, etc., which are not specifically limited in the present application.
[0042] The thickness of the substrate 30 is set according to the thickness of the glue dispensed on the glue dispensing area 201 of the glue dispensing part 20 as needed, that is, the glue dispensed thickness on the glue dispensing area 201 of the glue dispensing part 20 is the same as the thickness of the substrate 30, and the size and shape of the window 301 are set according to the glue dispensing needs. The substrate 30 is composited with glass fiber cloth and epoxy resin matrix, that is, the substrate 30 is a hard substrate 30, so as to ensure the structural strength of the substrate 30, and prevent the substrate 30 from bending when dispensing the glue on the glue dispensing area 201 of the glue dispensing part 20, so that the glue dispensing thickness on the glue dispensing part 20 is uneven, and the consistency of the glue 40 on the glue dispensing area 201 is poor, that is, the substrate 30 has a certain structural strength, and when dispensing the glue on the glue dispensing part 20 through the substrate 30, the consistency of the colloid dispensing is effectively guaranteed.
[0043] S13 : applying the glue 40 on the end surface of the substrate 30 at the edge of the window 301 away from the fixing plate 10 .
[0044] In an optional embodiment, if Fig.11 As shown, Fig.11 yes Figure 1 The schematic diagram of the top view of the structure after step S13 is completed, and combined with Fig.12 As shown, Fig.12 yes Figure 1 The schematic diagram of the cross-sectional structure after the completion of step S13 is shown. When dispensing glue on the part 20 to be dispensed, the glue 40 can be coated on the substrate 30. Specifically, when the glue 40 is coated on the substrate 30, the glue 40 is coated on the edge of the window 301 of the substrate 30. The glue 40 can be in the shape of a long strip, and its length is longer than the edge length of the window 301. The amount of glue 40 dispensed is greater than the capacity of the window 301 formed in the substrate 30, so that when the glue 40 is subsequently dispensed on the part 20 to be dispensed, the consistency of the glue 40 in the area 201 to be dispensed of the part 20 to be dispensed is ensured, so as to avoid the problem of insufficient amount of glue 40 and insufficient consistency when dispensing glue on the dispensed part.
[0045] In this embodiment, the glue 40 can be dispensed at the edge of the window 301 in the width direction of the substrate 30, that is, coated on the substrate 30 where the edge of the window 301 is away from the fixing plate 10. The glue 40 coated on the substrate 30 can be coated multiple times to ensure the consistency of subsequent dispensing on the to-be-dispensed area 201 of the to-be-dispensed part 20. The glue 40 is a combination of one or more of silver paste, solder paste, indium and alloy materials.
[0046] S14 : scraping the glue 40 into the window 301 to coat the glue 40 on the glue-dispensing area 201 of the glue-dispensing part 20 .
[0047] In an optional embodiment, if Fig.13 As shown, Fig.13 yes Figure 1 The schematic diagram of the top view of the structure after the completion of step S14, after the glue 40 is coated on the end face of the substrate 30 at the edge of the window 301 away from the fixed plate 10, the glue 40 is scraped into the interior of the window 301 by bonding the end face of the substrate 30, so as to coat the glue 40 on the area 201 to be glued of the part 20 to be glued.
[0048] In this embodiment, taking the coating of the glue 40 on the width direction of the window 301 on the substrate 30 as an example, when coating the glue 40, the amount of the glue 40 is not less than the capacity of the first window 301, and then the substrate 30 is attached and scraped along the length direction of the window 301 on the substrate 30, so that the glue 40 enters the window 301 along the length direction of the window 301, so that the glue 40 completely enters the window 301, at this time, the end face of the glue 40 is flush with the end face of the substrate 30 away from the fixed plate 10, thereby ensuring the consistency of the glue 40 on the to-be-dispensed area 201 of the to-be-dispensed part 20, and ensuring the packaging quality of the to-be-dispensed part 20. Among them, the amount of glue 40 coated on the substrate 30 may also be smaller than the capacity of the window 301. It can be scraped into the window 301 along the length direction of the window 301 when the end face of the substrate 30 is attached for the first time. After the first scraping of the glue 40, the glue 40 is applied again at the edge of the window 301 in the width direction of the substrate 30, and then the glue 40 is scraped into the window 301 along the length direction of the window 301, and the above steps are repeated until the glue 40 in the window 301 is flush with the end face of the substrate 30.
[0049] In this embodiment, when scraping the glue 40 into the window 301, a scraper can be used to fit the end surface of the substrate 30, and the glue 40 can be scraped into the window 301 along the length direction of the window 301, wherein a certain gap exists between the scraper and the substrate 30 during scraping, thereby ensuring that the glue 40 is scraped into the window 301. A printer can also be used to scrape along the length direction of the window 301, thereby uniformly coating the glue 40 on the to-be-glued area 201 of the to-be-glued part 20, which is not specifically limited in this application.
[0050] In other embodiments, when the glue 40 is coated on the end surface of the substrate 30 away from the fixed plate 10, the glue 40 can be coated on the edge of the window 301 in the length direction of the substrate 30. When scraping the glue 40, a scraper or a printer is used to scrape the glue 40 into the window 301 along the width direction of the window 301, and the glue 40 is leveled in the window 301, so that the glue 40 in the window 301 is parallel to the end surface of the substrate 30, thereby ensuring the consistency of the glue 40.
[0051] S15: removing the object 20 to be dispensed from the fixing plate 10 .
[0052] In an optional embodiment, after the glue liquid 40 is applied to the glue dispensing area 201 of the part 20 to be glued, the part 20 to be glued needs to be taken out. When taking out the part 20 to be glued, the substrate 30 is first taken out from the part 20 to be glued, and then the part 20 to be glued is taken out from the card slot 101 of the fixed plate 10. In this embodiment, after the glue is completed on the glue dispensing area 201 of the part 20 to be glued, that is, after the glue liquid 40 is set on the part 20 to be glued, the substrate 30 is vertically lifted from the fixed plate 10, so that the substrate 30 is separated from the part 20 to be glued, so that the part 20 to be glued is exposed, and then the part 20 to be glued with the glue liquid 40 is taken out from the card slot 101 on the fixed plate 10, so as to complete the glue dispensing of the part 20 to be glued.
[0053] Through the above method, a window 301 corresponding to the part to be glued 20 is opened on the substrate 30, and glue 40 is coated on the end face of the substrate 30 on the side away from the fixed plate 10 at the edge of the window 301, and then the glue 40 is scraped into the window 301, so that the glue 40 is glued on the area to be glued 201 of the part to be glued 20. When a large area of glue is required to be glued on the part to be glued 20, the glue dispensing speed can be increased, and the glue 40 can be evenly coated and printed in the area to be glued 201 of the part to be glued 20 by scraping and printing, which effectively ensures the consistency of the glue 40 on the part to be glued 20, and improves the glue dispensing quality and preparation efficiency of the part to be glued 20.
[0054] Please refer to Figure 2 , Figure 2 yes Figure 1 Specifically, the above S12 may further include the following steps:
[0055] S121 : drilling a hole in the substrate 30 to form a window 301 .
[0056] In an optional embodiment, if Figure 5 As shown, after obtaining the substrate 30, the desired window 301 pattern is drawn on the end face of the substrate 30 by using CAD drawing software, and according to the drawn window 301 pattern, holes are drilled on the substrate 30 by laser drilling, thereby forming a window 301 that penetrates the substrate 30 on the substrate 30.
[0057] In this embodiment, the shape of the window 301 on the substrate 30 can be set according to the pattern that needs to be glued on the part 20 to be glued. Specifically, auxiliary grooves can be opened at the four corners of the window 301 to facilitate glue dispensing on the part 20 to be glued, and prevent the glue 40 from not covering the four corners of the glue dispensing area 201 of the part 20 to be glued after glue is dispensed on the part 20 to be glued, effectively ensuring that the glue 40 is completely covered on the glue dispensing area 201 of the part 20 to be glued. When glue is required to be dispensed on different parts 20 to be glued, the required window opening pattern can be drawn on another substrate 30 through CAD drawing software, so that it is convenient to drill holes according to the drawn pattern by laser drilling later, so as to complete the opening of different windows 301.
[0058] S122: A blind hole 302 communicating with the window 301 is opened on one end surface of the substrate 30 .
[0059] In an optional embodiment, if Figure 6 As shown, after the required window 301 is opened on the substrate 30, a blind hole 302 may be opened on one end face of the substrate 30, or a through hole penetrating the substrate 30 and connected to the window 301 may be opened on the substrate 30, which is not specifically limited in the present application. Specifically, when opening the blind hole 302 on the substrate 30, a blind hole 302 pattern connected to the window 301 is drawn on one end face of the substrate 30 using CAD drawing software, and the blind hole 302 may be opened on the substrate 30 according to the drawn blind hole 302 pattern by grinding.
[0060] S123 : placing the blind hole 302 on the surface of the object 20 to be glued, facing the object 20 to be glued.
[0061] In an optional embodiment, a resistor is arranged on the bottom surface of the part to be glued 20, that is, a resistor is arranged in an area other than the area to be glued 201 of the part to be glued 20. After the bottom surface of the part to be glued 20 is placed on the slot of the fixing plate 10 facing the direction of the substrate 30, the area to be glued 201 of the part to be glued 20 and the resistor are both arranged toward the substrate 30 and exposed to the slot 101 of the fixing plate 10. After the part to be glued 20 is fixed, the substrate 30 is fitted on the part to be glued 20. Specifically, the end surface of one side of the substrate 30 with the blind hole 302 is placed on the surface of the part to be glued 20 facing the part to be glued 20, that is, The window 301 of the substrate 30 corresponds to the area 201 to be glued on the part 20 to be glued. When the substrate 30 is attached to the part 20 to be glued, the blind hole 302 on the substrate 30 corresponds to the resistor on the part 20 to be glued, that is, the resistor on the part 20 to be glued is located in the blind hole 302 of the substrate 30. Therefore, when the substrate 30 is attached to the part 20 to be glued, the window 301 is limited and fixed by the resistor, thereby ensuring that the window 301 of the substrate 30 corresponds to the area 201 to be glued on the part 20 to be glued, thereby preventing the glue 40 and the area 201 to be glued from being misaligned when glue is subsequently dispensed on the part 20 to be glued.
[0062] Different from the prior art, the silver paste printing and dispensing method in the present application includes: obtaining a fixed plate 10, placing the front side of the part to be dispensed 20 facing the fixed plate 10 in the card slot 101 of the fixed plate 10, placing a substrate 30 with a window 301 corresponding to the part to be dispensed 20 on the part to be dispensed 20, and then applying glue 40 at the edge position of the window 301 of the substrate 30, and scraping the glue 40 into the window 301 of the substrate 30 by means of a scraper or a printing machine along the length direction of the window 301 or the width direction of the window 301, so that the glue 40 passes through the window 301 and adheres to the to-be-dispensed area 201 of the part to be dispensed 20. After the dispensing is completed on the part to be dispensed 20, the substrate 30 is lifted perpendicular to the end face of the fixed plate 10, and then the part to be dispensed 20 is taken out of the card slot 101 of the fixed plate 10. The glue liquid 40 can be scraped and applied to the glue-dispensing area 201 of the part 20 to be glued by a scraper or a printer, and the glue dispensing speed can be increased when a large area of glue is required on the part 20 to be glued. The glue liquid 40 can be evenly coated and printed in the glue-dispensing area 201 of the part 20 to be glued by scraping and printing, thereby effectively ensuring the consistency of the glue liquid 40 on the part 20 to be glued.
[0063] Based on the general inventive concept, the present application also provides a photon counter, wherein the photon counter is prepared by the printing and dispensing method of silver paste as described in any one of the above items.
[0064] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A printing and dispensing method of silver paste, characterized in that: The printing and dispensing method of the silver paste comprises: Obtain a fixed plate, and place the part to be dispensed on the fixed plate; Placing a substrate with a window on the part to be dispensed corresponding to the part to be dispensed; Applying glue on the end surface of the substrate at the edge of the window away from the fixed plate; Scrape the glue liquid into the window to coat the glue liquid on the glue dispensing area of the glue dispensing part; Remove the part to be dispensed from the fixing plate.
2. The printing and dispensing method of silver paste according to claim 1, characterized in that: The step of obtaining a fixed plate and placing the part to be dispensed on the fixed plate comprises: At least one card slot is provided on the fixing plate; Place the part to be dispensed with its bottom surface facing the substrate inside the card slot.
3. The printing and dispensing method of silver paste according to claim 1, characterized in that: The step of placing the substrate with the window on the part to be dispensed corresponding to the part to be dispensed comprises: Drilling a hole in the substrate to form the window; A blind hole communicating with the window is provided on one end surface of the substrate; Placing the blind hole on the surface of the part to be dispensed, facing the part to be dispensed; Wherein, the window corresponds to the area to be glued of the part to be glued.
4. The printing and dispensing method of silver paste according to claim 1, characterized in that: The step of scraping the glue into the window to coat the glue on the glue-dispensing area of the glue-dispensing part comprises: The glue liquid is evenly coated on the glue-dispensing area of the glue-dispensing part by scraping along the length direction or width direction of the window using a scraper or a printer.
5. The printing and dispensing method of silver paste according to claim 1, characterized in that: The step of removing the part to be dispensed from the fixing plate comprises: Lifting the base plate perpendicularly to the fixing plate; The part to be dispensed is taken out from the fixing plate.
6. The printing and dispensing method of silver paste according to claim 1, characterized in that: The thickness of the substrate is the same as the thickness of the glue on the part to be glued.
7. The printing and dispensing method of silver paste according to claim 1, characterized in that: The substrate is composited from glass fiber cloth and epoxy resin matrix.
8. The printing and dispensing method of silver paste according to claim 1, characterized in that: The glue liquid is one or more combinations of silver paste, solder paste, indium and alloy materials.
9. The printing and dispensing method of silver paste according to claim 3, characterized in that: A resistor is arranged on the bottom surface of the part to be dispensed, and the resistor is located in the blind hole.
10. A photon counter, characterized in that: The photon counter is prepared by the printing and dispensing method of silver paste as described in any one of claims 1 to 9.