Multi-stage polishing device of automatic polishing line for wafer cutting blade
By designing a multi-stage polishing device to perform multi-stage polishing on the wafer cutting blade, the problem that first-stage polishing in the prior art cannot completely remove defects, and the cutting accuracy and chip quality are improved.
Patent Information
- Application Number
- CN202411659803.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-02-18
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the prior art, the polishing equipment for wafer cutting blades mostly stays in the first-level polishing stage, and cannot completely remove defects and unevenness on the blade surface, affecting the cutting quality and subsequent processes.
Design a multi-stage polishing device for automatic polishing of wafer cutting blades, including an operating table, a guide mechanism, a clamping mechanism, a polishing mechanism one and two, and a vacuum cleaner mechanism. Through the cooperation of a multi-stage polishing device, multi-stage polishing of the wafer cutting blade is realized, including mechanical polishing and electrolytic polishing.
Through multi-stage polishing, the polishing effect of the wafer cutting blade is significantly improved, miniature cracks and film peeling during the cutting process are reduced, and the quality and cutting accuracy of the chip are improved.
Smart Images
Figure CN119458109A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of wafer cutting blade polishing, and in particular relates to a multi-stage polishing device for an automatic polishing line of a wafer cutting blade. Background Art
[0002] Wafer cutting blades are tools that use diamond blades to cut wafers. They are a purely physical cutting method. Wafer cutting blades are mainly divided into hard blades and soft blades. Hard blades use metal or electroplated binders and are suitable for cutting hard materials; soft blades use resin binders and have good flexibility, making them suitable for cutting hard and brittle materials.
[0003] The main purpose of wafer polishing is to meet the flattening requirements in production. In processes such as photolithography, the wafer surface must be extremely flat to ensure that the image is clear and not out of focus. As the chip process shrinks, the photolithography machine needs to achieve nanometer-level imaging resolution, which requires the wafer surface to be flatter. Multi-level polishing can help reduce the ups and downs of the wafer surface so that it falls within the focal depth range. Multi-level polishing of wafer cutting blades can improve their cutting accuracy and effect, reduce the tiny cracks and film peeling generated during the cutting process, and thus improve the quality of the chip.
[0004] In current technology, most of the polishing equipment for wafer cutting blades remains at the primary polishing stage. This level of polishing may not completely remove all defects and unevenness on the blade surface, resulting in mechanical damage during use, affecting the wafer cutting quality and subsequent processes, and the polishing effect is poor.
[0005] Therefore, a multi-stage polishing device for an automatic polishing line of a wafer cutting blade is proposed. Summary of the invention
[0006] The purpose of the present invention is to perform multi-stage polishing on a wafer cutting blade and improve the polishing effect. The present application provides a multi-stage polishing device for an automatic polishing line for a wafer cutting blade.
[0007] The technical solution adopted by the present invention is as follows: A multi-stage polishing device for an automatic polishing line for wafer cutting blades comprises an operating table, the upper surfaces of both ends of the operating table are fixedly connected with side plates, a guide mechanism is installed between the side surfaces of the two side plates that are close to each other, a clamping mechanism is arranged on the lower surface of the middle part of the guide mechanism, and a polishing mechanism 1, a polishing mechanism 2 and a dust collecting mechanism are arranged in sequence from left to right on the upper surface of the operating table between the two side plates; The guide mechanism includes an upper motor and a sliding rod, the upper motor is fixedly connected to the left side surface of the side plate at the right end, the output end of the upper motor is fixedly connected to a screw rod, the end of the screw rod away from the upper motor is rotatably connected to the right side surface of the side plate at the left end through a bearing, the outer surface of the screw rod is threadedly connected to a threaded block, the sliding rod is fixedly connected between the side surfaces of the two side plates, the outer surface of the sliding rod is slidably connected to a slider, and a connecting rod is fixedly connected between the outer surface of the slider and the outer surface of the threaded block; The clamping mechanism includes a hydraulic cylinder, which is fixedly connected to the lower surface of the threaded block, a lifting column is installed on the lower surface of the hydraulic cylinder, an end of the lifting column away from the hydraulic cylinder is fixedly connected to a double-rod electric cylinder, upper piston rods are installed on both side surfaces of the double-rod electric cylinder, an end of the upper piston rod away from the double-rod electric cylinder is fixedly connected to a polypropylene connecting block, an end of the polypropylene connecting block away from the upper piston rod is fixedly connected to a stainless steel vertical rod, there are two stainless steel vertical rods, and a stainless steel clamping rod is fixedly connected to a side surface close to the lower ends of the two stainless steel vertical rods.
[0008] Furthermore, the polishing mechanism 1 includes an electrolytic cell body, which is fixedly connected to the upper surface of the operating table, an anode column is installed on the left inner wall of the electrolytic cell body, and a cathode plate is installed on the right inner wall of the electrolytic cell body.
[0009] Furthermore, the anode column is electrically connected to the positive electrode of the external power supply through the anode, and the cathode plate is electrically connected to the negative electrode of the external power supply through the cathode.
[0010] Furthermore, the second polishing mechanism includes a polishing trough body, which is fixedly connected to the upper surface of the operating table, and a lower electric cylinder is fixedly connected between the inner side walls adjacent to the upper end of the polishing trough body. The number of the lower electric cylinders is two, and a lower piston rod is installed between the side surfaces adjacent to the two lower electric cylinders.
[0011] Furthermore, a side of the lower piston rod away from the lower electric cylinder is fixedly connected to a lower motor, an output end of the lower motor is fixedly connected to a rotating rod, and a polishing wheel is installed at one end of the rotating rod away from the lower motor.
[0012] Furthermore, the dust collection mechanism includes a collection box, which is fixedly connected to the upper surface of the operating table. A filter is fixedly connected to the middle of the inner wall of the collection box, and the filter divides the internal volume of the collection box into two upper and lower parts.
[0013] Furthermore, a horn cover is installed on the inner side wall of the lower end of the polishing tank, and the horn cover is connected with the inner volume cavity at the lower end of the collection box through an exhaust pipe.
[0014] Furthermore, a sealing door is hingedly connected to the front side of the collection box close to the filter screen, and a handle is fixedly connected to the front outer surface of the sealing door.
[0015] Furthermore, a fan is fixedly mounted on the outer surface of one side of the collection box away from the handle, and an air inlet of the fan is communicated with the internal volume cavity at the upper end of the operating table.
[0016] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. In the present invention, when polishing the wafer cutting blade, the wafer cutting blade is first placed between two stainless steel clamping rods, and then the double-rod electric cylinder is started to make the upper piston rod drive the two stainless steel clamping rods to approach each other through the polypropylene connecting block and the stainless steel vertical rod until the two stainless steel clamping rods clamp and fix the wafer cutting blade, and then the hydraulic cylinder is started to make the lifting column drive the double-rod electric cylinder to move downward, so as to drive the clamped wafer cutting blade to move downward to the inside of the second polishing mechanism for initial polishing; after the initial polishing is completed, the upper motor can be started to rotate the screw rod, at this time the thread block will move laterally under the rotation of the screw rod, and the thread block that moves laterally will drive the clamping mechanism to move laterally until the clamping mechanism moves to a place of the polishing mechanism for secondary electrolytic polishing, and the cooperation of the above structures can perform multi-stage polishing on the wafer cutting blade to improve the polishing effect.
[0017] 2. In the present invention, the wafer cutting blade after mechanical polishing is placed in the electrolyte inside the electrolytic cell body, and the stainless steel vertical rod on the left is made to fit the anode column. The wafer cutting blade is connected to the power supply through the stainless steel vertical rod, the stainless steel clamping rod and the anode column, so that the wafer cutting blade is connected to the positive electrode of the DC power supply. The polypropylene connecting block has excellent corrosion resistance, insulation, high temperature resistance and high strength and rigidity, which can reduce the influence of the stainless steel vertical rod on the upper piston rod during conduction. At the same time, the cathode plate is connected to the negative electrode of the DC power supply through the cathode. Since the current density at the protrusions on the surface of the wafer cutting blade is relatively high, the dissolution rate is relatively fast, so that the surface of the wafer cutting blade gradually becomes smooth, thereby realizing the secondary electrolytic polishing of the wafer cutting blade; through the cooperation of the above structure, the wafer cutting blade can be polished in multiple stages to improve the polishing effect.
[0018] 3. In the present invention, when the wafer cutting blade is mechanically polished, the fan can be started to draw the air inside the collection box, thereby generating an air pressure difference between the inside and outside of the collection box. At this time, the external air will drive the debris generated by mechanical polishing from the polishing trough through the horn cover and the exhaust pipe into the lower internal cavity of the collection box, and the filter will intercept the debris to prevent the debris from being discharged from the air outlet of the fan. The intercepted debris will be left inside the bottom of the collection box for subsequent centralized processing by the staff. Through the cooperation of the above structure, the surrounding working environment can be improved when the wafer cutting blade is mechanically polished. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 A perspective view of the present invention; Figure 2 is a three-dimensional diagram of the clamping mechanism of the present invention; Figure 3 It is a three-dimensional diagram of the polishing mechanism 1 in the present invention; Figure 4 is a cross-sectional view of the polishing mechanism 2 in the present invention; Figure 5 It is a cross-sectional view of the dust collection mechanism in the present invention.
[0020] Markings in the figure: 1-operating table, 2-guiding mechanism, 3-clamping mechanism, 4-polishing mechanism one, 5-polishing mechanism two, 6-dust suction mechanism, 11-side panel, 21-upper motor, 22-sliding rod, 23-screw rod, 24-threaded block, 25-sliding block, 26-connecting rod, 31-hydraulic cylinder, 32-lifting column, 33-double-rod electric cylinder, 34-upper piston rod, 35-polypropylene connecting block, 36-stainless steel vertical rod, 37-stainless steel clamping rod, 41-electrolytic cell body, 42-anode column, 43-cathode plate, 51-polishing cell body, 52-lower electric cylinder, 53-lower piston rod, 54-lower motor, 55-rotating rod, 56-polishing grinding wheel, 61-collection box, 62-fan, 63-filter, 64-speaker cover, 65-exhaust pipe, 66-sealed door, 67-handle. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example
[0022] Reference Figure 1-Figure 5A multi-stage polishing device for an automatic polishing line for wafer cutting blades comprises an operating table 1, the upper surfaces of both ends of the operating table 1 are fixedly connected with side panels 11, a guide mechanism 2 is installed between the side surfaces where the two side panels 11 are close to each other, a clamping mechanism 3 is arranged on the lower surface of the middle part of the guide mechanism 2, and a polishing mechanism 1 4, a polishing mechanism 2 5 and a dust collecting mechanism 6 are arranged on the upper surface of the operating table 1 between the two side panels 11 from left to right in sequence; the clamping mechanism 3 comprises a hydraulic cylinder 31, the hydraulic cylinder 31 is fixedly connected to the lower surface of the threaded block 24, a lifting column 32 is installed on the lower surface of the hydraulic cylinder 31, a double-rod electric cylinder 33 is fixedly connected to the end of the lifting column 32 away from the hydraulic cylinder 31, upper piston rods 34 are installed on both sides of the double-rod electric cylinder 33, and a polypropylene connecting rod is fixedly connected to the end of the upper piston rod 34 away from the double-rod electric cylinder 33 The connecting block 35, the polypropylene connecting block 35 is fixedly connected to a stainless steel vertical rod 36 at one end away from the upper piston rod 34, the number of the stainless steel vertical rods 36 is two, and the lower ends of the two stainless steel vertical rods 36 are fixedly connected to a stainless steel clamping rod 37 on one side thereof; specifically, when polishing the wafer cutting blade, the wafer cutting blade is first placed between the two stainless steel clamping rods 37, and then the double-rod electric cylinder 33 is started to make the upper piston rod 34 drive the two stainless steel clamping rods 37 to approach each other through the polypropylene connecting block 35 and the stainless steel vertical rod 36, until the two stainless steel clamping rods 37 clamp and fix the wafer cutting blade, and then the hydraulic cylinder 31 is started to make the lifting column 32 drive the double-rod electric cylinder 33 to move downward, so as to drive the clamped wafer cutting blade to move downward to the inside of the polishing mechanism 25 for initial polishing.
[0023] Reference Figure 1-Figure 5 The polishing mechanism 2 5 includes a polishing trough 51, which is fixedly connected to the upper surface of the operating table 1, and a lower electric cylinder 52 is fixedly connected between the inner side walls close to the upper end of the polishing trough 51. There are two lower electric cylinders 52, and a lower piston rod 53 is installed between the side surfaces close to each other of the two lower electric cylinders 52. A lower motor 54 is fixedly connected to the side of the lower piston rod 53 away from the lower electric cylinder 52, and a rotating rod 55 is fixedly connected to the output end of the lower motor 54. A polishing wheel 56 is installed at the end of the rotating rod 55 away from the lower motor 54; specifically, the two lower electric cylinders 52 are started so that the lower piston rod 53 drives the two polishing wheels 56 to approach the two sides of the wafer cutting blade through the lower motor 54 and the rotating rod 55, and then the lower motor 54 is started so that the rotating rod 55 drives the polishing wheel 56 to rotate, so as to mechanically polish the two sides of the wafer cutting blade.
[0024] Reference Figure 1-Figure 5The guide mechanism 2 includes an upper motor 21 and a slide bar 22. The upper motor 21 is fixedly connected to the left side surface of the right end side plate 11. The output end of the upper motor 21 is fixedly connected to a screw rod 23. The end of the screw rod 23 away from the upper motor 21 is rotatably connected to the right side surface of the left end side plate 11 through a bearing. The outer surface of the screw rod 23 is threadedly connected to a threaded block 24. The slide bar 22 is fixedly connected between the two side surfaces close to the side plates 11. The outer surface of the slide bar 22 is slidably connected to a slider 25. A connecting rod 26 is fixedly connected between the outer surface of the slider 25 and the outer surface of the threaded block 24. Specifically, when the initial polishing is completed, the upper motor 21 can be started to rotate the screw rod 23. At this time, the threaded block 24 will move laterally under the rotation of the screw rod 23. The threaded block 24 that moves laterally will drive the clamping mechanism 3 to move laterally until the clamping mechanism 3 moves to the polishing mechanism 14 for secondary electrolytic polishing. Through the cooperation of the above structure, the wafer cutting blade can be polished in multiple stages to improve the polishing effect.
[0025] Reference Figure 1-Figure 5 The polishing mechanism 14 includes an electrolytic cell body 41, which is fixedly connected to the upper surface of the operating table 1. An anode column 42 is installed on the left inner wall of the electrolytic cell body 41, and a cathode plate 43 is installed on the right inner wall of the electrolytic cell body 41. The anode column 42 is electrically connected to the positive pole of the external power supply through the anode, and the cathode plate 43 is electrically connected to the negative pole of the external power supply through the cathode; specifically, the wafer cutting blade after mechanical polishing is placed in the electrolyte inside the electrolytic cell body 41, and the stainless steel vertical rod 36 on the left is attached to the anode column 42, and the wafer cutting blade is connected to the anode column 42 through the stainless steel vertical rod 36, the stainless steel clamping rod 37 and the anode column 42. The power supply is connected so that the wafer cutting blade is connected to the positive pole of the DC power supply, and the polypropylene connecting block 35 has excellent corrosion resistance, insulation, high temperature resistance and high strength and rigidity, which can reduce the influence of the stainless steel vertical rod 36 on the upper piston rod 34 during conduction. At the same time, the cathode plate 43 is connected to the negative pole of the DC power supply through the cathode. Since the current density at the protrusions on the surface of the wafer cutting blade is relatively high, the dissolution rate is relatively fast, and the surface of the wafer cutting blade gradually becomes smooth, thereby realizing the secondary electrolytic polishing of the wafer cutting blade; through the cooperation of the above structures, the wafer cutting blade can be polished in multiple stages to improve the polishing effect.
[0026] Reference Figure 1-Figure 5The dust collection mechanism 6 includes a collection box 61, which is fixedly connected to the upper surface of the operating table 1. A filter screen 63 is fixedly connected to the middle of the inner wall of the collection box 61. The filter screen 63 divides the internal volume of the collection box 61 into two parts, an upper and a lower part. A horn cover 64 is installed on the inner wall of the lower end of the polishing tank 51. The horn cover 64 is connected to the lower internal volume of the collection box 61 through an exhaust pipe 65. A sealing door 66 is hinged on the front side of the collection box 61 near the filter screen 63, and a handle 67 is fixedly connected to the front outer surface of the sealing door 66. Specifically, when the wafer cutting blade is mechanically polished, the fan 62 can be started to purify the air inside the collection box 61. The air is pumped, thereby generating an air pressure difference between the inside and outside of the collecting box 61. At this time, the external air will drive the debris generated by mechanical polishing from the polishing tank 51 through the horn cover 64 and the exhaust pipe 65 into the lower internal cavity of the collecting box 61, and the filter 63 will intercept these debris to prevent the debris from being discharged from the air outlet of the fan 62. The intercepted debris will be retained inside the bottom end of the collecting box 61, so that subsequent staff can hold the handle 67 to open the sealing door 66, which is convenient for centralized processing and cleaning of the debris on the filter 63. Through the cooperation of the above structure, the surrounding working environment can be improved when the wafer cutting blade is mechanically polished.
[0027] The implementation principle of the multi-stage polishing device of the wafer cutting blade automatic polishing line embodiment of the present application is: When using the device, first connect the external power supply. When polishing the wafer cutting blade, first place the wafer cutting blade between the two stainless steel clamping rods 37, then start the double-rod electric cylinder 33 to make the upper piston rod 34 drive the two stainless steel clamping rods 37 to approach each other through the polypropylene connecting block 35 and the stainless steel vertical rod 36, until the two stainless steel clamping rods 37 clamp and fix the wafer cutting blade, then start the hydraulic cylinder 31 to make the lifting column 32 drive the double-rod electric cylinder 33 to move downward, so as to drive the clamped wafer cutting blade to move downward to the inside of the polishing mechanism 2 5 for initial polishing; after the initial polishing is completed, the upper motor 21 can be started to rotate the screw rod 23, at this time, the thread block 24 will move laterally under the rotation of the screw rod 23, and the thread block 24 moving laterally will drive the clamping mechanism 3 to move laterally until the clamping mechanism 3 moves to the polishing mechanism 1 4 for secondary electrolytic polishing. Through the cooperation of the above structure, the wafer cutting blade can be polished in multiple stages to improve the polishing effect.
[0028] Among them, when the wafer cutting blade is polished by the polishing mechanism 2 5, the two lower electric cylinders 52 can be started so that the lower piston rod 53 drives the two polishing grinding wheels 56 to approach the two sides of the wafer cutting blade through the lower motor 54 and the rotating rod 55, and then the lower motor 54 is started so that the rotating rod 55 drives the polishing grinding wheel 56 to rotate, so as to mechanically polish the two sides of the wafer cutting blade; then the wafer cutting blade after mechanical polishing is placed in the electrolyte inside the electrolytic cell body 41, and the stainless steel vertical rod 36 on the left is made to fit the anode column 42, and the wafer cutting blade is connected to the power supply through the stainless steel vertical rod 36, the stainless steel clamping rod 37 and the anode column 42, so that the wafer cutting blade is connected to the positive pole of the DC power supply, and the cathode plate 43 is connected to the negative pole of the DC power supply through the cathode. Since the current density at the protrusions on the surface of the wafer cutting blade is relatively high, the dissolution speed is relatively fast, so that the surface of the wafer cutting blade gradually becomes smooth, and the secondary electrolytic polishing of the wafer cutting blade is achieved; through the cooperation of the above structure, the wafer cutting blade can be polished in multiple stages to improve the polishing effect.
[0029] On the other hand, when the wafer cutting blade is mechanically polished, the fan 62 can be started to draw the air inside the collection box 61, thereby creating an air pressure difference between the inside and outside of the collection box 61. At this time, the external air will drive the debris generated by mechanical polishing from the polishing tank 51 through the horn cover 64 and the exhaust pipe 65 into the lower internal cavity of the collection box 61, and the filter 63 will intercept these debris to prevent the debris from being discharged from the air outlet of the fan 62. The intercepted debris will be left inside the bottom end of the collection box 61 for subsequent centralized processing by the staff. Through the cooperation of the above structure, the surrounding working environment can be improved when the wafer cutting blade is mechanically polished.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0031] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A multi-stage polishing device for an automatic polishing line for wafer cutting blades, comprising an operating table (1), characterized in that: The upper surfaces of both ends of the operating table (1) are fixedly connected to side panels (11); a guide mechanism (2) is installed between the adjacent side surfaces of the two side panels (11); a clamping mechanism (3) is arranged on the middle lower surface of the guide mechanism (2); and a polishing mechanism 1 (4), a polishing mechanism 2 (5) and a dust collecting mechanism (6) are arranged in sequence from left to right on the upper surface of the operating table (1) between the two side panels (11); The guide mechanism (2) comprises an upper motor (21) and a slide rod (22), wherein the upper motor (21) is fixedly connected to the left side surface of the right side plate (11), the output end of the upper motor (21) is fixedly connected to a lead screw (23), the end of the lead screw (23) away from the upper motor (21) is rotatably connected to the right side surface of the left side plate (11) via a bearing, the outer surface of the lead screw (23) is threadedly connected to a thread block (24), the slide rod (22) is fixedly connected between the adjacent side surfaces of the two side plates (11), the outer surface of the slide rod (22) is slidably connected to a slider (25), and a connecting rod (26) is fixedly connected between the outer surface of the slider (25) and the outer surface of the thread block (24); The clamping mechanism (3) comprises a hydraulic cylinder (31), wherein the hydraulic cylinder (31) is fixedly connected to the lower surface of the threaded block (24), a lifting column (32) is installed on the lower surface of the hydraulic cylinder (31), an end of the lifting column (32) away from the hydraulic cylinder (31) is fixedly connected to a double-rod electric cylinder (33), upper piston rods (34) are installed on both side surfaces of the double-rod electric cylinder (33), an end of the upper piston rod (34) away from the double-rod electric cylinder (33) is fixedly connected to a polypropylene connecting block (35), an end of the polypropylene connecting block (35) away from the upper piston rod (34) is fixedly connected to a stainless steel vertical rod (36), the number of the stainless steel vertical rods (36) is two, and a stainless steel clamping rod (37) is fixedly connected to a side surface close to the lower ends of the two stainless steel vertical rods (36).
2. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 1, characterized in that: The polishing mechanism 1 (4) comprises an electrolytic cell body (41), wherein the electrolytic cell body (41) is fixedly connected to the upper surface of the operating table (1), an anode column (42) is installed on the left inner wall of the electrolytic cell body (41), and a cathode plate (43) is installed on the right inner wall of the electrolytic cell body (41).
3. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 2, characterized in that: The anode column (42) is electrically connected to the positive electrode of an external power source via an anode, and the cathode plate (43) is electrically connected to the negative electrode of the external power source via a cathode.
4. The multi-stage polishing device of the wafer cutting blade automatic polishing line according to claim 1, characterized in that: The second polishing mechanism (5) comprises a polishing trough (51), wherein the polishing trough (51) is fixedly connected to the upper surface of the operating table (1), and a lower electric cylinder (52) is fixedly connected between the inner side walls adjacent to the upper end of the polishing trough (51), wherein the number of the lower electric cylinders (52) is two, and a lower piston rod (53) is installed between the adjacent side surfaces of the two lower electric cylinders (52).
5. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 4, characterized in that: A lower motor (54) is fixedly connected to a side of the lower piston rod (53) away from the lower electric cylinder (52), a rotating rod (55) is fixedly connected to an output end of the lower motor (54), and a polishing grinding wheel (56) is mounted on an end of the rotating rod (55) away from the lower motor (54).
6. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 5, characterized in that: The dust collection mechanism (6) comprises a collection box (61), the collection box (61) being fixedly connected to the upper surface of the operating table (1), a filter screen (63) being fixedly connected to the middle of the inner side wall of the collection box (61), the filter screen (63) dividing the internal volume of the collection box (61) into two upper and lower parts.
7. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 6, characterized in that: A horn cover (64) is installed on the inner side wall of the lower end of the polishing tank (51), and the horn cover (64) is connected to the inner volume cavity at the lower end of the collection box (61) through an exhaust pipe (65).
8. The multi-stage polishing device of the wafer cutting blade automatic polishing line according to claim 6, characterized in that: A sealing door (66) is hingedly connected to the front side of the collection box (61) close to the filter screen (63), and a handle (67) is fixedly connected to the front outer surface of the sealing door (66).
9. A multi-stage polishing device for an automatic polishing line for wafer cutting blades as claimed in claim 8, characterized in that: A fan (62) is fixedly mounted on the outer surface of one side of the collection box (61) away from the handle (67), and an air inlet of the fan (62) is in communication with the internal cavity at the upper end of the operating table (1).