Electrodeposition device for recovering gold ions in copper ammonia thiosulfate leaching solution

Abstract

The invention belongs to the technical field of hydrometallurgy and precious metal recovery, and discloses an electro-deposition device for recovering gold ions in copper ammonia thiosulfate leachate, the electro-deposition device comprises a first reaction chamber containing a first solution and a second reaction chamber containing a second solution, and two ends of a reaction circuit are respectively immersed in the first solution and the second solution; the reaction circuit comprises a first electrode and a second electrode which are electrically connected, the first electrode is soaked in the first solution, and the second electrode is soaked in the second solution; the reaction circuit comprises a first auxiliary electrode and a second auxiliary electrode which are electrically connected, the first auxiliary electrode is soaked in the first solution, and the second auxiliary electrode is soaked in the second solution. The device is simple and compact in structure and convenient to use, use of an ion exchange membrane is avoided, the problems of low gold deposition rate, large zinc consumption and copper co-deposition in an existing method are solved, the device cost is reduced, and the gold deposition rate and the deposition purity are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of hydrometallurgy and precious metal recovery, and in particular relates to an electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate. Background Art

[0002] Gold is the most valuable precious metal for recycling, and the wet extraction process is usually used to recover gold ions from gold solutions.

[0003] The commonly used methods of the existing wet extraction process of gold include cyanidation, thiosulfate gold leaching process and displacement deposition method; wherein the cyanidation method is a method of using an aqueous solution of alkali metal cyanide as a solvent to leach gold and silver from gold and silver ores, and then extracting gold and silver from the solution containing gold and silver, but cyanide is highly toxic and will cause certain pollution to the environment, with high risk and inconvenient for promotion and application; the thiosulfate gold leaching process will not produce toxic substances during the reproduction process, is non-toxic and highly environmentally friendly, but the gold compound in this method is not convenient to adsorb and is not convenient to recover; and in the process of the displacement deposition method, copper ions, ammonia and thiosulfate ions in the leachate, and active metals also participate in the reaction, which increases the consumption of raw materials and is costly, and also leads to a high impurity content in the deposited gold, and the metal surface is easily passivated, affecting the reaction.

[0004] Therefore, the present application designs an electrodeposition device for recovering gold ions from copper ammonia thiosulfate leachate to solve the above technical problems. Summary of the invention

[0005] In order to solve the above technical problems, the present invention proposes an electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate.

[0006] To achieve the above object, the present invention provides an electrodeposition device for recovering gold ions from a copper ammonia thiosulfate leachate, comprising a first reaction chamber and a second reaction chamber that are independently arranged, wherein a reaction circuit is arranged between the first reaction chamber and the second reaction chamber;

[0007] The first reaction chamber is filled with a first solution, the second reaction chamber is filled with a second solution, and both ends of the reaction circuit are immersed in the first solution and the second solution respectively;

[0008] The reaction circuit comprises a first electrode and a second electrode which are electrically connected, wherein the first electrode is immersed in the first solution, and the second electrode is immersed in the second solution;

[0009] The reaction circuit includes a first auxiliary electrode and a second auxiliary electrode which are electrically connected. The first auxiliary electrode is immersed in the first solution, and the second auxiliary electrode is immersed in the second solution.

[0010] Preferably, a first circuit is provided between the first electrode and the second electrode.

[0011] Preferably, a reference electrode is soaked in the first solution, the reference electrode is arranged in parallel with the first electrode through the first circuit, and a potentiometer is arranged on the first circuit between the reference electrode and the first electrode.

[0012] Preferably, a second circuit is provided between the first auxiliary electrode and the second auxiliary electrode, a power supply is provided on the second circuit, a positive pole of the power supply is electrically connected to the second auxiliary electrode, and a negative pole of the power supply is electrically connected to the first auxiliary electrode.

[0013] Preferably, an ammeter and a controllable resistor are arranged in series on the second circuit, and the ammeter and the controllable resistor are arranged between the power supply and the first auxiliary electrode.

[0014] Preferably, a first stirring device for stirring the first solution is provided in the first reaction chamber, and a second stirring device for stirring the second solution is provided in the second reaction chamber.

[0015] Preferably, the first electrode comprises an active metal material, and the second electrode comprises a platinum-based inert metal material.

[0016] Preferably, the second auxiliary electrode comprises a non-metallic conductor material.

[0017] Preferably, the resistance of the controllable resistor causes the value of the ammeter to decrease from the starting value to 1 mA in a step-wise manner.

[0018] Compared with the prior art, the present invention has the following advantages and technical effects: the present invention discloses an electrodeposition device for recovering gold ions from a copper ammonia thiosulfate leachate solution, wherein a first solution is arranged in a first reaction chamber, a second solution is contained in a second reaction chamber, a reaction circuit is connected between the first solution and the second solution to form a closed-loop circuit, and the ion exchange membrane used in the early stage is replaced, so that electron transfer between the zinc oxidation reaction chamber and the gold ion reduction chamber is realized to complete the deposition and recovery of the gold ions, thereby improving the reaction rate, overcoming the problems of low gold deposition rate, large zinc consumption, and copper co-deposition in the prior method, and improving the gold ion deposition rate; at the same time, the ion exchange membrane is not used, and the first reaction chamber and the second reaction chamber are independently arranged, which simplifies the manufacturing process of the device, facilitates the on-site arrangement of the device, and reduces the device cost.

[0019] The invention has a simple and compact structure, is easy to use, avoids the use of ion exchange membranes, overcomes the problems of low gold deposition rate, large zinc consumption, and copper co-deposition in the prior art, reduces device costs, and improves gold deposition rate and deposition purity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0021] Figure 1 A schematic diagram of an electrodeposition device for recovering gold ions from a copper ammonia thiosulfate leachate according to the present invention;

[0022] In the figure: 100, first reaction chamber; 110, first electrode; 120, reference electrode; 130, first auxiliary electrode; 140, first stirring device; 200, second reaction chamber; 210, second electrode; 220, second auxiliary electrode; 230, second stirring device; 310, switch; 320, power supply; 330, ammeter; 340, potentiometer; 350, controllable resistor; 360, first circuit; 370, second circuit. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the existing patent technology, a device and method for replacing and recovering gold in a thiosulfate gold leaching system are disclosed, and a reduction chamber and an oxidation chamber device with physical space isolation are proposed, so that the reduction reaction of gold is only carried out in the reduction chamber, and only the oxidation reaction of active metal is carried out in the oxidation chamber. The two half reactions are connected by external wires to complete the gold replacement reaction; although this method can solve the problems of extra consumption and surface passivation of zinc powder, in actual application, it is found that the problem of copper co-deposition cannot be completely overcome, and it still affects the gold deposition grade. In addition, copper ions are catalysts in the gold leaching process, and the consumption of copper affects the recycling of the leaching solution back to the leaching stage. Therefore, it is very important to avoid the co-deposition of copper ions while replacing gold for the entire gold leaching process.

[0025] In the existing patent technology, a method for recovering gold from copper thiosulfate solution by spontaneous electrolysis is disclosed. In this method, copper is used as the anode, and the anode liquid is the cathode solution after gold ion extraction. The anode copper is continuously dissolved and returns to the leaching stage after reaching a certain requirement. However, in the anode solution containing ammonia, copper will self-corrode, which is also the main process of ammonia leaching in copper wet extraction. The reaction formula of this reaction process is as follows:

[0026] 2Cu+8NH3+2H2O+O2→2Cu(NH3)4 2+ +4OH - ,

[0027] This process greatly interferes with the discharge efficiency of the anode copper. Copper is continuously dissolved at the anode, while the reduction of gold ions at the cathode is very slow. The problems caused in the application not only prolong the gold deposition time and reduce production efficiency, but also increase the copper consumption and increase the economic cost.

[0028] Another patent disclosed in the prior art proposes to first regulate the existence form of copper ions before depositing gold, so that the Cu(NH3)4 2+ Converted to Cu(S2O3)3 which is difficult to deposit 5- , then gold is deposited. After the gold deposition is completed, the Cu(S2O3)3 in the solution is regulated by electrochemical methods. 5- Then it is restored to Cu(NH3)4 2+ After the gold ion deposition is completed, the solution can be returned to the leaching stage for recycling if the copper ion concentration is not disturbed. However, during the gold deposition process, the reaction rate is affected by the type and effective area of ​​the ion exchange membrane, which makes the reaction time too long. Under some conditions, it can reach more than 10 hours. In addition, the limited service life of the ion exchange membrane is also one of the defects of this method.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Reference Figure 1 As shown, this embodiment provides an electrodeposition device for recovering gold ions from a copper ammonium thiosulfate leachate solution, comprising a first reaction chamber 100 and a second reaction chamber 200 which are independently arranged, and a reaction circuit is arranged between the first reaction chamber 100 and the second reaction chamber 200;

[0031] The first reaction chamber 100 contains a first solution, the second reaction chamber 200 contains a second solution, and both ends of the reaction circuit are immersed in the first solution and the second solution respectively;

[0032] The reaction circuit includes a first electrode 110 and a second electrode 210 which are electrically connected, wherein the first electrode 110 is immersed in a first solution, and the second electrode 210 is immersed in a second solution;

[0033] The reaction circuit includes a first auxiliary electrode 130 and a second auxiliary electrode 220 which are electrically connected. The first auxiliary electrode 130 is immersed in a first solution, and the second auxiliary electrode 220 is immersed in a second solution.

[0034] The invention discloses an electrodeposition device for recovering gold ions from a copper ammonia thiosulfate leachate solution. A first solution is arranged in a first reaction chamber 100, a second solution is contained in a second reaction chamber 200, a reaction circuit is connected to form a closed-loop circuit between the first solution and the second solution, and an ion exchange membrane used in the early stage is replaced to realize electron transfer between a zinc oxidation reaction chamber and a gold ion reduction chamber, so as to complete the deposition and recovery of gold ions, improve the reaction rate, overcome the problems of low gold deposition rate, large zinc consumption, and copper co-deposition in the existing method, and improve the gold ion deposition purity; at the same time, the ion exchange membrane is not used, and the first reaction chamber 100 and the second reaction chamber 200 are independently arranged, which simplifies the manufacturing process of the device, facilitates the on-site arrangement of the device, and reduces the device cost; the invention has a simple and compact structure, is easy to use, avoids the use of an ion exchange membrane, overcomes the problems of low gold deposition rate, large zinc consumption, and copper co-deposition in the existing method, reduces the device cost, and improves the gold deposition rate and deposition purity.

[0035] In one embodiment of the present application, the first solution is a zinc sulfate solution; and the second solution is a gold leaching solution containing copper ammonium thiosulfate and a zinc sulfate solution.

[0036] In one embodiment of the present application, the first reaction chamber 100 and the second reaction chamber 200 are two independent reaction sites.

[0037] In a further optimized solution, a first circuit 360 is provided between the first electrode 110 and the second electrode 210. The first circuit 360 is connected between the first electrode 110 and the second electrode 210 to form a path that facilitates electron migration, facilitates the flow of electrons between the first electrode 110 and the second electrode 210, and generates a reaction.

[0038] In a further optimized solution, a reference electrode 120 is immersed in the first solution, the reference electrode 120 is arranged in parallel with the first electrode 110 through the first circuit 360, and a potentiometer 340 is arranged on the first circuit 360 between the reference electrode 120 and the first electrode 110. The reference electrode 120 is immersed in the first solution, and is arranged in parallel with the first electrode 110 through the first circuit 360, so as to provide a reference control for the reaction of the first electrode 110, and the potentiometer 340 is arranged on the first circuit 360 between the first electrode 110 and the reference electrode 120, so as to indicate the potential difference between the first electrode 110 and the reference electrode 120, and to determine the working potential of the first electrode 110.

[0039] In a further optimized solution, a second circuit 370 is provided between the first auxiliary electrode 130 and the second auxiliary electrode 220, a power source 320 is provided on the second circuit 370, a positive electrode of the power source 320 is electrically connected to the second auxiliary electrode 220, and a negative electrode of the power source 320 is electrically connected to the first auxiliary electrode 130. The second circuit 370 is provided between the first auxiliary electrode 130 and the second auxiliary electrode 220 for electron transfer, and forms a closed loop in combination with the first circuit 360 for convenient reaction.

[0040] In one embodiment of the present application, the power supply 320 is not directly used for electrolytic deposition of gold, but is only used to drive the movement of electrons in the entire deposition device, only to replace the role of the ion exchange method and accelerate the deposition rate of gold.

[0041] Further optimizing the scheme, the second circuit 370 is provided with an ammeter 330 and a controllable resistor 350 in series, and the ammeter 330 and the controllable resistor 350 are provided between the power supply 320 and the first auxiliary electrode 130. The ammeter 330 and the controllable resistor 350 are provided on the second circuit 370, wherein the ammeter 330 is used to detect the current change in the circuit, and the controllable resistor 350 adjusts the current size in the circuit by adjusting the resistance connected to the circuit; at the same time, the second circuit 370 is provided with a switch 310, which can conveniently control the on and off of the circuit loop and control the progress of the reaction.

[0042] In one embodiment of the present application, the current in the deposition process should mainly reflect the deposition-reduction process of gold. Therefore, the current provided by the external power supply 320 must not exceed the current value corresponding to this process. Otherwise, other side reactions will occur on the working second electrode 210 in the second reaction chamber 200, such as the co-deposition of copper, causing excessive consumption of zinc. Therefore, regulating the current value in the circuit by the controllable resistor 350 is the key to achieving the purpose of this invention.

[0043] Further optimizing the scheme, a first stirring device 140 for stirring the first solution is provided in the first reaction chamber 100, and a second stirring device 230 for stirring the second solution is provided in the second reaction chamber 200. The first stirring device 140 is provided in the first reaction chamber 100 for stirring the first solution; the second stirring device 230 is provided in the second reaction chamber 200 for stirring the second solution, so that the first solution and the second solution are mixed, so that the components therein can evenly contact the internal electrodes, and avoid the uneven solution caused by the reaction affecting the efficiency of the reaction.

[0044] In a further optimized solution, the first electrode 110 includes an active metal material, and the second electrode 210 includes a platinum-based inert metal material. The first electrode 110 is made of an active metal, and the second electrode 210 is made of a platinum-based inert metal material. During the reaction, the gold element in the second solution is replaced, and at the same time, driven by the auxiliary current of the power supply 320, the copper ions in the second solution are not replaced, thereby improving the replacement efficiency of the gold element and the purity of the obtained gold element.

[0045] In one embodiment of the present application, the material of the first electrode 110 is selected from common active metals such as zinc, iron, and aluminum. Different current sizes can be selected according to different materials to improve the replacement efficiency and avoid the corresponding active metal from replacing copper ions in the second solution.

[0046] In a further optimized solution, the second auxiliary electrode 220 includes a non-metallic conductor material. The first auxiliary electrode 130 is connected to the negative electrode of the power source 320 and can be made of materials such as zinc, graphite, and glassy carbon; while the second auxiliary electrode 220 is connected to the positive electrode of the power source 320 and can be made of non-metallic conductors such as graphite and glassy carbon, which will not react in the second solution.

[0047] In one embodiment of the present application, in order to further accelerate the deposition rate of gold, multiple groups of first electrodes 110 and first auxiliary electrodes 130 can be set in the first reaction chamber 100, and the number of second electrodes 210 and second auxiliary electrodes 220 in the second reaction chamber 200 matches the number of first electrodes 110 and first auxiliary electrodes 130 in the first reaction chamber 100.

[0048] Usage process:

[0049] Assembling the electrodeposition device for recovering gold ions from a copper ammonia thiosulfate leachate disclosed in this embodiment;

[0050] Pour a first solution into the first reaction chamber 100 so that the first solution soaks the first electrode 110 and the first auxiliary electrode 130;

[0051] Pour the second solution into the second reaction chamber 200, so that the second solution soaks the second electrode 210 and the second auxiliary electrode 220;

[0052] The reaction circuit is turned on and energized, and the first stirring device 140 and the second stirring device 230 are started to stir the first solution and the second solution;

[0053] Adjust the current of the reaction circuit to make the current reach the set value. According to the actual concentration of gold ions in the solution, the current value is controlled at 5-10mA. Every 10-20 minutes, the current value is gradually reduced to 1mA by adjusting the controllable resistor.

[0054] In one embodiment of the present application, the current value can be adjusted according to the composition and ratio of the first solution and the second solution. This is a common choice for those skilled in the art and will not be described in detail here.

[0055] Specific examples:

[0056] Example 1

[0057] 1. Adoption Figure 1 The gold ion recovery device shown will contain 5mmol / LCu 2+ 、0.5mol / LNH3 / NH4 + 100 mL of leaching solution with 0.1 mol / L Na2S2O3, pH of 10, and Au concentration of 10 mg / L is added to the second reaction chamber 200, the second electrode 210 is made of inert platinum material, and the second auxiliary electrode 220 is made of carbon fiber;

[0058] 2. 100 mL of 0.1 mol / L ZnSO4 solution is added to the first reaction chamber 100, a zinc sheet is used as the first electrode 110, and a zinc sheet is used as the first auxiliary electrode 130;

[0059] 3. Connect the external power supply 320 and turn on the switch 310; control the initial value of the current to 5 mA through the controllable resistor 350, and reduce the current value by 1 mA every 10 minutes. After 50 minutes, the gold deposition rate can reach 99.2%.

[0060] Example 2

[0061] 1. Adoption Figure 1 The gold ion recovery device shown will contain 5mmol / LCu 2+ 、0.5mol / LNH3 / NH4 + 100 mL of leaching solution with 0.1 mol / L Na2S2O3, pH of 10, and Au concentration of 20 mg / L is added to the second reaction chamber 200, the second electrode 210 is made of inert platinum material, and the second auxiliary electrode 220 is made of carbon fiber;

[0062] 2. 100 mL of 0.1 mol / L ZnSO4 solution is added to the first reaction chamber 100, the first electrode 110 is made of zinc sheet, and the first auxiliary electrode 130 is made of graphite;

[0063] 3. Connect the external power supply 320 and turn on the switch 310; control the initial value of the current to 8 mA through the controllable resistor 350, and reduce the current value by 1.5 mA every 10 minutes. After 60 minutes, the gold deposition rate can reach 99.4%.

[0064] Example 3

[0065] 1. Adoption Figure 1The gold ion recovery device shown in the figure will contain 5mmol / LCu2+, 0.5mol / LNH3 / NH4 + 100 mL of leaching solution with 0.1 mol / L Na2S2O3, pH of 10, and Au concentration of 40 mg / L is added to the second reaction chamber 200, the second electrode 210 is made of inert platinum material, and the second auxiliary electrode 220 is made of glassy carbon;

[0066] 2. 100 mL of 0.1 mol / L ZnSO4 solution is added to the first reaction chamber 100, the first electrode 110 is made of zinc sheet, and the first auxiliary electrode 130 is made of graphite;

[0067] 3. Connect the external power supply 320 and turn on the switch 310; control the initial value of the current to 10 mA through the controllable resistor 350, and reduce the current value by 1.5 mA every 10 minutes. After 60 minutes, the gold deposition rate can reach 99.2%.

[0068] Example 4

[0069] 1. Adoption Figure 1 The gold ion recovery device shown will contain 5mmol / LCu 2+ 、0.5mol / LNH3 / NH4 + 100 mL of leaching solution with 0.1 mol / L Na2S2O3, pH of 10, and Au concentration of 100 mg / L is added to the second reaction chamber 200, the second electrode 210 is made of inert platinum material, and the second auxiliary electrode 220 is made of glassy carbon;

[0070] 2. 100 mL of 0.1 mol / L ZnSO4 solution is added to the first reaction chamber 100, the first electrode 110 is made of zinc sheet, and the first auxiliary electrode 130 is made of graphite;

[0071] 3. Connect the external power supply 320 and turn on the switch 310; control the initial value of the current to 10 mA through the controllable resistor 350, and reduce the current value by 2 mA every 15 minutes. After 60 minutes, the gold deposition rate can reach 99.3%.

[0072] Comparative Example 1

[0073] According to the method of patent 202210486249.2, zinc was used as the anode, 100mL of 0.1mol / L ZnSO4 solution was added to the anode chamber, platinum was used as the cathode, and 5mmol / L Cu was added to the cathode chamber. 2+ 、0.5mol / LNH3 / NH4 + In 100mL of leaching solution with 0.1mol / LNa2S2O3, pH of 10 and Au concentration of 10mg / L, the stirring speeds of the cathode and anode chambers were both 200 rpm. After 4 hours, the gold recovery rate was equivalent to that in Example 1.

[0074] Comparative Example 2

[0075] Based on the method of patent CN103842557A, copper was used as the anode and 0.5 mol / L NH3 / NH4 was added to the anode chamber. + , 0.1mol / LNa2S2O3, pH 10 solution, platinum as cathode, 5mmol / LCu 2+ 、0.5mol / LNH3 / NH4 + In 100mL of leaching solution with 0.1mol / LNa2S2O3, pH of 10 and Au concentration of 10mg / L, the stirring speeds of the cathode and anode chambers were both 200 rpm. After 4 hours, the gold recovery rate was only about 10%. Even if it was extended to 10 hours, the gold recovery rate was only 30%.

[0076] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0077] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. An electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate, characterized in that: It comprises a first reaction chamber (100) and a second reaction chamber (200) which are independently arranged, and a reaction circuit is arranged between the first reaction chamber (100) and the second reaction chamber (200); The first reaction chamber (100) contains a first solution, the second reaction chamber (200) contains a second solution, and two ends of the reaction circuit are immersed in the first solution and the second solution respectively; The reaction circuit comprises a first electrode (110) and a second electrode (210) which are electrically connected, wherein the first electrode (110) is immersed in the first solution, and the second electrode (210) is immersed in the second solution; The reaction circuit comprises a first auxiliary electrode (130) and a second auxiliary electrode (220) which are electrically connected, wherein the first auxiliary electrode (130) is immersed in the first solution, and the second auxiliary electrode (220) is immersed in the second solution.

2. The electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate according to claim 1, characterized in that: A first circuit (360) is provided between the first electrode (110) and the second electrode (210).

3. The electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate according to claim 2, characterized in that: A reference electrode (120) is immersed in the first solution. The reference electrode (120) is arranged in parallel with the first electrode (110) through the first circuit (360). A potentiometer (340) is arranged on the first circuit (360) between the reference electrode (120) and the first electrode (110).

4. The electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate according to claim 1, characterized in that: A second circuit (370) is provided between the first auxiliary electrode (130) and the second auxiliary electrode (220), a power supply (320) is provided on the second circuit (370), a positive pole of the power supply (320) is electrically connected to the second auxiliary electrode (220), and a negative pole of the power supply (320) is electrically connected to the first auxiliary electrode (130).

5. The electrodeposition device for recovering gold ions from copper ammonia thiosulfate leachate according to claim 4, characterized in that: An ammeter (330) and a controllable resistor (350) are arranged in series on the second circuit (370); the ammeter (330) and the controllable resistor (350) are arranged between the power source (320) and the first auxiliary electrode (130).

6. The electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate according to claim 1, characterized in that: The first reaction chamber (100) is provided with a first stirring device (140) for stirring the first solution, and the second reaction chamber (200) is provided with a second stirring device (230) for stirring the second solution.

7. The electrodeposition device for recovering gold ions from copper ammonia thiosulfate leachate according to claim 1, characterized in that: The first electrode (110) comprises an active metal material, and the second electrode (210) comprises a platinum-based inert metal material.

8. The electrodeposition device for recovering gold ions from copper ammonia thiosulfate leachate according to claim 1, characterized in that: The second auxiliary electrode (220) comprises a non-metallic conductor material.

9. The electrodeposition device for recovering gold ions from a cuprammonia thiosulfate leachate according to claim 5, characterized in that: The resistance value of the controllable resistor (350) causes the value of the ammeter (330) to decrease in steps from the initial value to 1 mA.

Images