Method and device for measuring width of laminating adhesive of photomask protective film

Abstract

The invention relates to the technical field of photoetching, in particular to a method and a device for measuring the width of a laminating adhesive of a photomask protective film, and the method comprises the following steps: step 1, fixing a photomask to be measured; step 2, acquiring a wide infrared scanning image of the laminating glue of the optical mask to be measured; step 3, carrying out image analysis on the obtained wide infrared scanning image of the laminating glue; and 4, according to an image analysis result, calculating a measured value of the width of the laminating adhesive, finding out a maximum value or a minimum value, and judging whether the width of the laminating adhesive is qualified or not. According to the method and the device for measuring the width of the laminating adhesive of the photomask protective film, whether the width of the laminating adhesive is qualified or not can be quickly judged, and the measured value is accurate.

Description

Technical Field

[0001] The invention relates to the technical field of photolithography, and in particular to a method and device for measuring the width of a photomask protective film adhesive. Background Art

[0002] A photomask, also known as a photomask, photolithography mask, or mask plate, is a graphic transfer master plate that forms complex geometric figures on a glass substrate (or resin substrate) containing metal films such as chromium. It is the "printing film" for copying the photoresist masking layer in the photolithography process.

[0003] The photomask protective film is a transparent film pasted on the aluminum alloy frame. Its main function is to prevent dust or other tiny particles from falling on the side of the photomask with patterns. The measurement of the photomask protective film lamination width is extremely important in the semiconductor manufacturing process, mainly in: 1. Ensure photolithography accuracy; 2. Prevent contaminants from entering; 3. Extend the service life of the photomask; 4. Improve production efficiency and yield rate; 5. Promote technological progress and innovation.

[0004] The existing method for measuring the glue width of the photomask protective film is generally to use a strong light or an optical microscope to check the glue width. This measurement method has the following problems: 1. The detection speed is slow, and the abnormal glue width cannot be clearly detected; 2. The maximum wire diameter and minimum wire diameter glue width of the protective film cannot be automatically and correctly detected using an optical microscope for visual inspection and scanning; 3. The overflow of the mask adhesive or the poor adhesion cannot be automatically detected, which can easily lead to misjudgment, resulting in irregular contamination of the mask pattern area during chip factory exposure, resulting in chip scrapping and yield loss. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a method and device for measuring the width of the adhesive for laminating a photomask protective film. The minimum and maximum adhesive widths are measured by automatic image scanning, and a qualified or unqualified judgment is made. This can avoid errors in judgment caused by the difficulty of finding the minimum and maximum adhesive widths during visual inspection by personnel, and more quickly obtain the judgment results of normal and abnormal quality.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a method and device for measuring the width of a photomask protective film bonding adhesive.

[0007] A technical solution of the present invention provides a method for measuring the width of a photomask protective film adhesive, comprising the following steps:

[0008] Step 1: Fix the photomask to be tested;

[0009] Step 2: Obtain a wide infrared scanning image of the bonding adhesive of the photomask to be tested;

[0010] Step 3: Perform image analysis on the acquired wide infrared scanning image of the bonding adhesive;

[0011] Step 4: Based on the image analysis results, calculate the measured value of the bonding adhesive width and find the maximum and minimum values ​​to determine whether the bonding adhesive width is qualified.

[0012] Furthermore, in step 1, the specific method of fixing the photomask to be tested is: embedding the photomask to be tested into a groove of a mask moving unit, the mask moving unit is provided with an X-axis slide rail and a Y-axis slide rail which are perpendicular to each other in a horizontal plane, and the groove in which the photomask to be tested is embedded moves along the X-axis slide rail or the Y-axis slide rail, so as to adjust the photomask to be tested to a required position in the infrared scanning area.

[0013] Furthermore, the specific method of step 2 is: using an infrared light source to irradiate the surface of the photomask to be tested, the infrared light source irradiated on the photomask to be tested is reflected by the surface of the photomask to be tested and captured by a reflection unit, and the image is focused onto a photosensitive coupling element to obtain an infrared scanning image.

[0014] Furthermore, the specific method of step 3 is: the image processing unit receives the infrared scanning image from the photosensitive coupling element, the infrared wave light source will form light and dark images at the edge of the photomask protective film bonding glue, and form an image light and dark dividing line on both sides of the width direction of the bonding glue. When measuring the glue width, glue width marking points are made on these two image light and dark dividing lines respectively, and the straight-line distance between the two glue width marking points on the two dividing lines is measured.

[0015] Furthermore, the specific method of step 4 is: summarizing the straight-line distances between the two glue width marking points on the two dividing lines measured in step 3, calculating the minimum and maximum values ​​in the straight-line distances, that is, obtaining the minimum glue width value and the maximum glue width value, and judging whether the calculated minimum glue width value and the maximum glue width value are within the qualified value range by a glue width judgment unit.

[0016] The present invention also provides another technical solution: a device for measuring the glue width of a photomask protective film is provided, comprising an infrared light source unit, a mask moving unit, a reflection unit, a photosensitive coupling element, an image processing unit, an image display and a glue width judgment unit, wherein the mask moving unit is used to carry the photomask to be measured, the reflection unit is placed directly above the photomask to be measured, the infrared light source unit is arranged on the lower surface of the emission unit, the reflection unit, the photosensitive coupling element, the image processing unit and the image display are connected in sequence by signals, the image processing unit is connected by signals to the glue width judgment unit, and the glue width judgment unit is connected by signals to the image display;

[0017] The infrared wave light source unit is used to emit infrared light to the surface of the mask to be tested;

[0018] The reflection unit is used to receive the infrared light source reflected by the surface of the photomask to be tested and transmit the infrared image to the photosensitive coupling element for image focusing;

[0019] The photosensitive coupling element is used to focus and scan the laminating adhesive width image acquired by the reflecting unit;

[0020] The image processing unit is used to analyze the laminating glue width image and generate glue width marking points;

[0021] The image display is used to present the image analysis diagram of the image processing unit and display the glue width marking point;

[0022] The glue width judgment unit is used to receive the image analysis chart and glue width marking points of the image processing unit or receive the image analysis chart and glue width marking points displayed by the image display, calculate the glue width measurement value and find the maximum and minimum values ​​of the bonding glue width, and determine whether the bonding glue width is qualified.

[0023] Furthermore, the reflecting unit includes a first cylinder and a second cylinder connected up and down, and the first cylinder and the second cylinder are connected by a thread. The height of the reflecting unit is adjusted up and down by rotating the second cylinder to adjust the distance between the reflecting unit and the photomask to be measured, thereby adjusting the reflection distance of the infrared light source to obtain a clear image.

[0024] Furthermore, the mask moving unit is provided with slide rails in the X-axis and Y-axis directions, and the X-axis and Y-axis are perpendicular to each other in the same horizontal plane.

[0025] Furthermore, a groove is provided on the mask moving unit, and the groove is used to embed the photomask to be tested. The mask moving unit is provided with an X-axis slide rail and a Y-axis slide rail that are perpendicular to each other in a horizontal plane. The groove in which the photomask to be tested is embedded moves along the X-axis slide rail or the Y-axis slide rail to facilitate adjusting the photomask to be tested to a required position within the infrared scanning area. The surface of the groove is provided with a Teflon coating, and the surface of the mask moving unit is treated with stainless steel anodizing.

[0026] Furthermore, the photosensitive coupling element is a CCD photosensitive coupling element image sensor, and the image processing unit is a PCI image processing unit.

[0027] The technical solution of the present invention has the following advantages:

[0028] 1. The present invention enables the photomask factory to quickly and correctly measure and determine the mask protective film bonding glue width (bonding glue mask bonding line diameter) to detect the maximum line diameter and the minimum line diameter glue width value and position to determine the adhesion quality of the mask and the protective film to avoid bonding glue overflow causing mask contamination or bonding glue shrinkage, debonding, and breaking causing pollutants to enter the mask pattern area and cause serious loss of chip factory yield.

[0029] 2. In the semiconductor manufacturing process, any slight deviation may lead to product defects or scrap. The measurement of the width of the photomask protective film bonding glue as part of quality control helps to timely discover and correct possible problems in the production process, thereby improving production efficiency and yield. By accurately controlling the bonding glue width, it can ensure that each photomask can achieve optimal performance during the lithography process and reduce the scrap rate caused by insufficient lithography accuracy or contamination.

[0030] It should be appreciated that all combinations of the foregoing concepts, as well as additional concepts described in greater detail below, may be considered to be part of the inventive subject matter of the present disclosure, provided such concepts are not mutually inconsistent.

[0031] The foregoing and other aspects, embodiments and features of the present invention can be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the present invention, such as the features and / or beneficial effects of the exemplary embodiments, will be apparent from the following description or learned from the practice of the specific embodiments according to the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are not drawn to scale according to actual reference objects. In the accompanying drawings, each identical or nearly identical component shown in various figures may be represented by the same reference numeral. For the sake of clarity, not every component is labeled in each figure. Now, embodiments of various aspects of the present invention will be described by way of example and with reference to the accompanying drawings, in which:

[0033] Figure 1 This is a structural block diagram of the device for measuring the width of the photomask protective film laminating adhesive of the present invention.

[0034] Figure 2 The present invention is a flow chart of the method for measuring the laminating adhesive width of a photomask protective film.

[0035] Figure 3 This is an image analysis diagram obtained by the device for measuring the adhesive width of the photomask protective film of the present invention.

[0036] Description of Figure Numbers:

[0037] 100-mask moving unit; 200-infrared wave light source unit; 300-reflection unit; 400-photosensitive coupling element; 500-image processing unit; 600-glue width judgment unit; 700-image display. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meaning understood by people with general skills in the field to which the present invention belongs.

[0039] The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, unless the context clearly indicates otherwise, the singular forms of "a", "an" or "the" and other similar words do not indicate a quantitative limitation, but indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before "include" or "comprise" cover the features, wholes, steps, operations, elements and / or components listed after "include" or "comprise", and do not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components and / or their collections. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] See also Figure 2 As shown, an embodiment of the present invention provides a method for measuring the width of a photomask protective film adhesive, comprising the following steps:

[0041] Step 1: Fix the photomask to be tested;

[0042] Step 2: Obtain a wide infrared scanning image of the bonding adhesive of the photomask to be tested;

[0043] Step 3: Perform image analysis on the acquired wide infrared scanning image of the bonding adhesive;

[0044] Step 4: Based on the image analysis results, calculate the measured value of the bonding adhesive width and find the maximum and minimum values ​​to determine whether the bonding adhesive width is qualified.

[0045] In some embodiments of the present invention, in step 1, the specific method of fixing the photomask to be tested is: embedding the photomask to be tested into a groove of a mask moving unit, the mask moving unit is provided with an X-axis slide rail and a Y-axis slide rail which are perpendicular to each other in a horizontal plane, and the groove in which the photomask to be tested is embedded moves along the X-axis slide rail or the Y-axis slide rail, so as to adjust the photomask to be tested to a desired position within the infrared scanning area.

[0046] In some embodiments of the present invention, the specific method of step 2 is: using an infrared wave light source to irradiate the surface of the photomask to be tested, the infrared wave light source irradiated on the photomask to be tested is reflected by the surface of the photomask to be tested and then captured by a reflection unit, and the image is focused onto a photosensitive coupling element to obtain an infrared scanning image.

[0047] In some embodiments of the present invention, the specific method of step 3 is: the image processing unit receives the infrared scanning image from the photosensitive coupling element, the infrared wave light source will form light and dark images at the edge of the photomask protective film bonding glue, and form an image light and dark dividing line on both sides of the width direction of the bonding glue. When measuring the glue width, glue width marking points are respectively made on the two image light and dark dividing lines, and the straight-line distance between the two glue width marking points on the two dividing lines is measured.

[0048] In some embodiments of the present invention, the specific method of step 4 is: summarizing the straight-line distances between the two glue width marking points on the two dividing lines measured in step 3, calculating the minimum and maximum values ​​in the straight-line distances, that is, obtaining the minimum glue width value and the maximum glue width value, and judging whether the calculated minimum glue width value and the maximum glue width value are within the qualified value range by a glue width judgment unit.

[0049] See also Figure 3 As shown in the figure, the glue width marking points shown in the figure are point A and point B, point A is the endpoint on the light-dark dividing line on one side in the width direction of the bonding glue, and point B is the endpoint on the light-dark dividing line on the other side in the width direction of the bonding glue. The straight line AB coincides with the width direction of the bonding glue. The glue width measurement value is obtained by measuring the length of AB. As long as the glue width measurement value is continuously obtained in the length direction of the bonding glue, the minimum and maximum values ​​of the AB length can be obtained, which correspond to the minimum and maximum values ​​of the glue width respectively. By comparing the minimum and maximum values ​​of the glue width with the qualified value, it is possible to quickly determine whether the glue width is qualified.

[0050] See also Figure 1As shown, the embodiment of the present invention also provides another technical solution: a device for measuring the adhesive width of a photomask protective film is provided, comprising an infrared light source unit 200, a mask moving unit 100, a reflection unit 300, a photosensitive coupling element 400, an image processing unit 500, an image display 700 and an adhesive width judgment unit 600, wherein the mask moving unit 100 is used to carry the photomask to be measured, the reflection unit 300 is placed directly above the photomask to be measured, the infrared light source unit 200 is arranged on the lower surface of the emission unit, the reflection unit 300, the photosensitive coupling element 400, the image processing unit 500 and the image display 700 are connected in sequence by signals, the image processing unit 500 is connected in signal with the adhesive width judgment unit 600, and the adhesive width judgment unit 600 is connected in signal with the image display 700;

[0051] The infrared wave light source unit 200 is used to emit infrared light to the surface of the mask to be tested; the infrared light source is a ring-shaped light source to increase the black-and-white contrast during imaging.

[0052] The reflection unit 300 is used to receive the infrared light source reflected by the surface of the photomask to be tested and transmit the infrared image to the photosensitive coupling element 400 for image focusing;

[0053] The photosensitive coupling element 400 is used to focus and scan the laminating adhesive width image acquired by the reflecting unit 300;

[0054] The image processing unit 500 is used to perform laminating glue width image analysis and generate glue width marking points;

[0055] The image display 700 is used to present the image analysis diagram of the image processing unit 500 and display the glue width marking point;

[0056] The glue width judging unit 600 is used to receive the image analysis diagram and glue width marking points of the image processing unit 500 or receive the image analysis diagram and glue width marking points displayed by the image display 700, calculate the glue width measurement value and find the maximum and minimum values ​​of the bonding glue width to determine whether the bonding glue width is qualified.

[0057] In some embodiments of the present invention, the surface of the mask moving unit 100 is treated by anodizing to be black and non-reflective, so as to facilitate focusing the image range.

[0058] In some embodiments of the present invention, the reflecting unit 300 includes a first cylinder and a second cylinder connected up and down, and the first cylinder and the second cylinder are connected by a thread. The height of the reflecting unit 300 is adjusted up and down by rotating the second cylinder to adjust the distance between the reflecting unit 300 and the photomask to be measured, thereby adjusting the reflection distance of the infrared light source to obtain a clear image.

[0059] In some embodiments of the present invention, the mask moving unit 100 is provided with slide rails in the X-axis and Y-axis directions, and the X-axis and the Y-axis are perpendicular to each other in the same horizontal plane.

[0060] In some embodiments of the present invention, the mask moving unit 100 is provided with a groove, and the groove is used to embed the photomask to be tested. The mask moving unit 100 is provided with an X-axis slide rail and a Y-axis slide rail that are perpendicular to each other in a horizontal plane. The groove embedded with the photomask to be tested moves along the X-axis slide rail or the Y-axis slide rail to facilitate adjusting the photomask to be tested to a required position within the infrared scanning area. The surface of the groove is provided with a Teflon coating, and the surface of the mask moving unit 100 is treated with stainless steel anodizing to be black, which is non-reflective and convenient for focusing the imaging range.

[0061] In some embodiments of the present invention, the photosensitive coupling device 400 is a CCD photosensitive coupling device 400 image sensor, and the image processing unit 500 is a PCI image processing unit.

[0062] In the photolithography process, the photomask plays the role of transferring the design drawings to the product substrate. A qualified laminating glue width can ensure that the mask and the photoresist fit tightly, avoiding deviation or distortion of the pattern during the transfer process, thereby ensuring the quality and performance of the final product. The photolithography process has high requirements for the integrity, dimensional accuracy, and registration accuracy of the pattern. A photomask with a qualified laminating glue width can ensure the stability and reliability of the photolithography process, reduce process problems caused by poor mask lamination, and improve production efficiency and yield rate.

[0063] A qualified bonding glue width means that the mask is not prone to falling off or damage during use, thereby extending the service life of the mask, which is of great significance for reducing production costs and improving production efficiency.

[0064] Therefore, it is particularly important to detect the qualified glue width. If the traditional judgment method is used, for example: 1. Using a strong light or optical microscope to inspect and observe the glue width, there is a problem of slow speed and inability to clearly detect the position of abnormal glue width. 2. Using an optical microscope to visually scan cannot automatically and correctly detect the maximum wire diameter and minimum wire diameter glue width of the protective film. 3. The mask adhesive overflow or poor adhesion cannot be automatically detected, which can easily lead to misjudgment, resulting in irregular contamination of the mask pattern area during chip factory exposure, resulting in chip scrapping and yield loss.

[0065] Unqualified bonding glue width may cause uneven distribution of photoresist during the coating process, which in turn affects the integrity of the photolithography pattern and causes problems such as pattern distortion and deformation. The mask and photoresist need to be precisely aligned during the photolithography process. Unqualified bonding glue width may make the alignment process difficult, resulting in reduced alignment accuracy and affecting the performance of the final product. Photomasks with unqualified bonding glue width may fall off, shift, and other problems during use, resulting in unstable photolithography quality and increasing the defective rate in the production process. Unqualified bonding glue width may lead to multiple rework and repairs in the photolithography process, which will directly affect production efficiency and increase production costs.

[0066] Therefore, in the photolithography process, ensuring the conformity of the bonding glue width is of great significance for ensuring the accuracy of the photolithography pattern, improving production efficiency and reducing production costs.

[0067] The photomask protective film bonding adhesive width measurement method in the embodiment of the present invention replaces the traditional adhesive width measurement method, overcomes the problems of the traditional adhesive width detection method, and uses infrared scanning to form an image of the non-contact measurement method, which can avoid the errors that may be introduced in the traditional contact measurement, such as the wear of the measuring head, the change of the measuring force, etc. At the same time, infrared rays have a high propagation speed and strong penetrating power, and can penetrate the photoresist layer to a certain extent, measure the bonding adhesive width more accurately, and improve the measurement accuracy. By scanning the entire photomask surface, the distribution of the bonding adhesive width can be quickly obtained, without the need for manual measurement of each measuring point, and the detection is fast.

[0068] By setting up the glue width judgment unit to calculate the glue width measurement value and find the maximum and minimum values ​​of the glue width, it is determined whether the glue width is qualified, that is, the measurement data can be output in digital form, which is convenient for subsequent data analysis and processing. Using automatic image scanning to measure and detect the minimum and maximum glue widths and complete the qualified or unqualified judgment can avoid the judgment errors caused by the difficulty of visual inspection by personnel to find the minimum and maximum glue widths, and save time to obtain the normal and abnormal quality judgment of the photomask and protective film glue lamination mask.

[0069] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A method for measuring the width of a photomask protective film adhesive, characterized in that: The following steps are involved: Step 1: Fix the photomask to be tested; Step 2: Obtain a wide infrared scanning image of the bonding adhesive of the photomask to be tested; Step 3: Perform image analysis on the acquired wide infrared scanning image of the bonding adhesive; Step 4: Based on the image analysis results, calculate the measured value of the bonding adhesive width and find the maximum and minimum values ​​to determine whether the bonding adhesive width is qualified.

2. The method for measuring the width of the photomask protective film adhesive bonding according to claim 1, characterized in that: In step 1, the specific fixing method of the photomask to be tested is: embedding the photomask to be tested into a groove of a mask moving unit, the mask moving unit is provided with an X-axis slide rail and a Y-axis slide rail which are perpendicular to each other in a horizontal plane, and the groove in which the photomask to be tested is embedded moves along the X-axis slide rail or the Y-axis slide rail, so as to adjust the photomask to be tested to a required position in the infrared scanning area.

3. The method for measuring the width of the photomask protective film adhesive bonding according to claim 1, characterized in that: The specific method of step 2 is: using an infrared light source to irradiate the surface of the photomask to be tested, the infrared light source irradiated on the photomask to be tested is reflected by the surface of the photomask to be tested and then captured by a reflection unit, and the image is focused onto a photosensitive coupling element to obtain an infrared scanning image.

4. The method for measuring the width of the adhesive bonding adhesive of the photomask protective film according to claim 1, characterized in that: The specific method of step 3 is: the image processing unit receives the infrared scanning image from the photosensitive coupling element, the infrared wave light source will form a light and dark image at the edge of the photomask protective film bonding glue, and form an image light and dark dividing line on both sides of the width direction of the bonding glue. When measuring the glue width, glue width marking points are made on the two image light and dark dividing lines respectively, and the straight-line distance between the two glue width marking points on the two dividing lines is measured.

5. The method for measuring the width of the adhesive bonding adhesive of the photomask protective film according to claim 1, characterized in that: The specific method of step 4 is: summing up the straight-line distances between the two glue width marking points on the two dividing lines measured in step 3, calculating the minimum and maximum values ​​in the straight-line distances, that is, obtaining the minimum glue width value and the maximum glue width value, and judging whether the calculated minimum glue width value and the maximum glue width value are within the qualified value range through the glue width judgment unit.

6. The device for measuring the width of adhesive bonding of a photomask protective film according to claim 1, characterized in that: It includes an infrared light source unit, a mask moving unit, a reflection unit, a photosensitive coupling element, an image processing unit, an image display and a glue width judgment unit. The mask moving unit is used to carry the mask to be measured. The reflection unit is placed directly above the mask to be measured. The infrared light source unit is arranged on the lower surface of the emitting unit. The reflection unit, the photosensitive coupling element, the image processing unit and the image display are connected in sequence by signals. The image processing unit is connected by signals to the glue width judgment unit, and the glue width judgment unit is connected by signals to the image display. The infrared wave light source unit is used to emit infrared light to the surface of the mask to be tested; The reflection unit is used to receive the infrared light source reflected by the surface of the photomask to be tested and transmit the infrared image to the photosensitive coupling element for image focusing; The photosensitive coupling element is used to focus and scan the laminating adhesive width image acquired by the reflecting unit; The image processing unit is used to analyze the laminating glue width image and generate glue width marking points; The image display is used to present the image analysis diagram of the image processing unit and display the glue width marking point; The glue width judgment unit is used to receive the image analysis chart and glue width marking points of the image processing unit or receive the image analysis chart and glue width marking points displayed by the image display, calculate the glue width measurement value and find the maximum and minimum values ​​of the bonding glue width, and determine whether the bonding glue width is qualified.

7. The device for measuring the width of adhesive for laminating a photomask protective film according to claim 6, characterized in that: The reflecting unit includes a first cylinder and a second cylinder connected up and down. The first cylinder and the second cylinder are connected by a thread. The height of the reflecting unit is adjusted up and down by rotating the second cylinder to adjust the distance between the reflecting unit and the photomask to be measured, thereby adjusting the reflection distance of the infrared light source to obtain a clear image.

8. The device for measuring the width of adhesive bonding of a photomask protective film according to claim 6, characterized in that: The mask moving unit is provided with slide rails in the X-axis and Y-axis directions, and the X-axis and the Y-axis are perpendicular to each other in the same horizontal plane.

9. The device for measuring the width of adhesive bonding of a photomask protective film according to claim 6, characterized in that: The mask moving unit is provided with a groove, and the groove is used to embed the photomask to be tested. The mask moving unit is provided with an X-axis slide rail and a Y-axis slide rail which are perpendicular to each other in a horizontal plane. The groove in which the photomask to be tested is embedded moves along the X-axis slide rail or the Y-axis slide rail, so as to adjust the photomask to be tested to a required position in the infrared scanning area. The surface of the groove is provided with a Teflon coating, and the surface of the mask moving unit is treated with stainless steel anodizing.

10. The device for measuring the width of adhesive for laminating a photomask protective film according to claim 6, characterized in that: The photosensitive coupling element is a CCD photosensitive coupling element image sensor, and the image processing unit is a PCI image processing unit.

Images