Automatically-filled high-thermal-conductivity temperature probe and temperature measuring method

Abstract

The invention provides an automatic-filling high-thermal-conductivity temperature probe, which comprises at least one temperature sensor (3) and is characterized by at least further comprising a shell (4) arranged outside the temperature sensor (3), and the shell (4) is further filled with a thermal conductive material (2) in contact with the temperature sensor (3). And in a working state, the heat conduction material overflows out of the shell (4) and is in contact with a measured object (1). The invention also provides a corresponding temperature measurement method. The method can be used for conveniently and accurately measuring the temperature of the measured object in different application scenes, and is high in response speed, high in accuracy, low in implementation cost, easy to apply and easy to effectively popularize.

Description

Technical Field

[0001] The present invention belongs to the field of product manufacturing, and specifically, to the field of manufacturing high-speed products such as chips, and especially to instruments for measuring the temperature of production equipment and products during the manufacturing process of chips and other products, and more specifically to high-precision temperature measuring probes and corresponding temperature testing methods. Background Art

[0002] In the field of chip manufacturing, temperature measuring equipment is often needed to measure the internal production environment temperature, product temperature, etc. of the production equipment. During the measurement process, the temperature sensor is usually installed on the object to be measured. At this time, the shape of the temperature sensor is usually inconsistent with the object to be measured and the target to be measured, so that the temperature sensor and the object to be measured cannot fit tightly. Due to insufficient fit, the thermal conductivity is poor, the temperature measurement is inaccurate, and the temperature response is slow. In layman's terms, the temperature sensor needs to be in contact with the object to be measured as much as possible, which makes it easier to ensure the accuracy of temperature measurement and timely response.

[0003] Especially for armored temperature probes on the market, the shape of the top of the probe is usually round, and the object to be measured usually does not have a round groove to accommodate the temperature probe or to make the temperature probe and the object to be measured contact as closely as possible, so there will usually be a lot of gaps between the temperature probe and the object to be measured.

[0004] There is a large amount of air between the gaps. As a poor conductor of heat, air seriously affects the temperature measurement accuracy and temperature response of the temperature sensor.

[0005] An easy-to-think-of physical solution is to set a groove on the object to be measured as much as possible and place the temperature probe in the groove, but the object to be measured usually cannot change its shape, so the application of such a design is very narrow. Moreover, the shape of the temperature probe is also diverse. If the object to be measured is designed to be received in a specific way, then a temperature probe of a specific shape is required for each object to be measured, which is very inconvenient, affects production efficiency, and increases the burden of production management.

[0006] In the prior art, there is no universal technical solution for realizing a temperature probe with high thermal conductivity. Summary of the invention

[0007] In view of the technical defects existing in the prior art, the purpose of the present invention is to provide an automatically filling high thermal conductivity temperature probe, comprising at least one temperature sensor 3, characterized in that it also includes at least a shell 4 arranged outside the temperature sensor 3, and the shell 4 is also filled with a thermal conductive material 2 in contact with the temperature sensor 3. In the working state, the thermal conductive material overflows the shell 4 and contacts with the object 1 to be measured.

[0008] Preferably, in a working state, the temperature sensor 3 moves toward the measured object 1 to squeeze the thermal conductive material 2 out of the housing 4 .

[0009] Preferably, a pusher 9 is provided between the inner periphery of the housing 4 and the temperature sensor 3 , and in a working state, the pusher moves toward the direction of the measured object 1 to extrude the thermal conductive material 2 out of the housing 4 .

[0010] Preferably, a first opening is left at one end of the housing 4 facing the measured object 1 .

[0011] Preferably, it further comprises a protection cover 6 which is arranged outside the first opening.

[0012] Preferably, it further comprises a wire 5 , one end of which is fixedly connected to the temperature sensor 3 , and the other end of which extends out of the housing 4 .

[0013] Preferably, a sealing plate is provided at one end of the housing away from the measured object 1 , and a guide hole is provided on the sealing plate. The wire 5 extends into the housing 4 through the guide hole and is connected to the temperature sensor 3 .

[0014] Preferably, it also includes a spring 8 arranged on the inner side of the shell 4, the spring 8 is fixed to the wire 5, and the outer side of the spring 8 is connected to the clamping ring 7. In the working state, the clamping ring 7 moves or applies pressure in the direction of the spring 8, and the spring 8 drives the wire 5 to move.

[0015] Preferably, the housing 4 further includes a micro motor, which is attached to a side of the temperature sensor 3 away from the object 1 to be measured, and pushes the temperature sensor 3 to move toward the object 1 to be measured when the micro motor is working.

[0016] Preferably, a range mark of the moving size of the wire is set on the wire 5, for example, preferably the moving size is 3 mm to 3 cm.

[0017] Preferably, the temperature sensor 3 is attached to the inside of the housing 4 .

[0018] Preferably, the temperature sensor 3 is any one of the following components:

[0019] - Thermocouples;

[0020] - thermal resistors;

[0021] - Thermistor;

[0022] - Fiber optic temperature probe; or

[0023] -Electronic temperature measurement chip.

[0024] Preferably, the thermally conductive material 2 is any one of the following materials:

[0025] -Thermal grease;

[0026] -Thermal conductive adhesive;

[0027] -Thermal conductive resin;

[0028] - graphite powder;

[0029] -High thermal conductivity ceramic powder; or

[0030] -High temperature ceramic glue containing thermally conductive ingredients.

[0031] According to another aspect of the present invention, a temperature measurement method using the above-mentioned automatic filling high thermal conductivity temperature probe for temperature measurement is also provided, which is used to measure the temperature of the object to be measured 1 using the automatic filling high thermal conductivity temperature probe, and at least comprises the following steps:

[0032] a. Bring the automatic filling high thermal conductivity temperature probe close to or in contact with the object to be measured 1;

[0033] b. Pushing the temperature sensor 3 to move toward the object 1 to be measured, thereby driving the thermally conductive material 2 to contact the object 1 to be measured;

[0034] c. Obtaining the measurement information of the temperature sensor 3, thereby obtaining the temperature of the measured object 1.

[0035] Preferably, before step a, the method further comprises the following steps:

[0036] i. Remove the protective cover 6.

[0037] Preferably, in the step b, the temperature sensor 3 is pushed toward the measured object 1 by pushing the wire 5 .

[0038] The automatic filling high thermal conductivity temperature probe provided by the present invention can conveniently and accurately measure the temperature of the measured object in different application scenarios, and has a fast response speed, high accuracy, low implementation cost, easy application, and easy and effective promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0040] Figure 1 A cross-sectional schematic diagram of an automatic filling high thermal conductivity temperature probe in an unused state is shown in accordance with a first embodiment of the present invention;

[0041] Figure 2 A cross-sectional schematic diagram showing an initial state of an automatic filling high thermal conductivity temperature probe in use according to a first embodiment of the present invention is shown;

[0042] Figure 3 A cross-sectional schematic diagram of an automatic filling high thermal conductivity temperature probe in use is shown in accordance with a first embodiment of the present invention;

[0043] Figure 4 A schematic cross-sectional view of an automatic filling high thermal conductivity temperature probe according to a second embodiment of the present invention is shown; and

[0044] Figure 5 A cross-sectional schematic diagram of an automatic filling high thermal conductivity temperature probe according to a third embodiment of the present invention is shown.

[0045] Description of symbols

[0046] 1. Object to be measured (temperature measuring hole);

[0047] 2. Thermally conductive materials;

[0048] 3. Temperature sensor;

[0049] 4. Sleeve;

[0050] 5. Wire;

[0051] 6. Protective cover;

[0052] 7. Snap ring;

[0053] 8. Spring;

[0054] 9. Pusher. DETAILED DESCRIPTION

[0055] In order to better illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0056] Figure 1 The cross-sectional schematic diagram of a first embodiment of the present invention, an automatic filling high thermal conductivity temperature probe in an unused state is shown. Specifically, those skilled in the art will understand that the automatic filling high thermal conductivity temperature probe provided by the present invention includes at least one temperature sensor 3, characterized in that it also includes at least a housing 4 arranged outside the temperature sensor 3, and the housing 4 is also filled with a thermal conductive material 2 in contact with the temperature sensor 3, and in the working state, the thermal conductive material overflows the housing 4 and contacts the object 1 to be measured. And in Figure 1 In the embodiment shown, the housing 4 faces one end of the object 1 to be measured (i.e. Figure 1A first opening is left (in the left side), indicated by the dotted line on the left side, and the thermal conductive material is squeezed out of the housing 4 from the first opening in the working state, thereby contacting the measured object 1, for example Figure 3 Status of the illustrated embodiment.

[0057] exist Figure 1 In the illustrated embodiment, the automatic filling high thermal conductivity temperature probe further includes a protective cover 6, which is disposed on the outside of the first opening. The protective cover may be adhered to the first opening by means of double-sided tape, or may be screwed to the first opening by means of threads. Correspondingly, the outer or inner tube wall of the shell at the location of the first opening is provided with threads adapted to the threads of the protective cover. These variations are all within the protection scope of the present invention.

[0058] Further, refer to Figures 1 to 3 In the embodiment shown, those skilled in the art will appreciate that the left side of the housing 4 is an opening, i.e. Figure 1 The first opening has a Figure 1 The protective cover 6 shown. Preferably, the first opening is a full opening, that is, it is open along the inner circumference of the shell 4. In a preferred variation, the first opening is a partial opening, for example, half of the inner circumference along the shell 4 is closed, and half of the area along the central axis of the shell 4 is open, and the thermal conductive material overflows and is squeezed out from the partial opening accordingly. Furthermore, the partial opening can be set at a position about 5 mm inward from the left edge of the shell 4, etc. Such variations are all within the protection scope of the present invention.

[0059] Correspondingly, the other end of the housing 4 ( Figure 1) is provided with a sealing plate, indicated by a dotted line on the right side, and a guide hole is provided on the sealing plate, through which the wire 5 extends into the housing 4 and is connected to the temperature sensor 3. In this embodiment, the right side of the housing 4 is basically closed, leaving only a guide hole for the wire 5 to pass through. Specifically, those skilled in the art understand that in the production process, after the temperature sensor 3 is connected to the wire 5, the wire 5 is then inserted into the housing 4 from the first opening, and then passed through the guide hole, and then the temperature sensor 3 is pulled into the housing 4 through the wire 5, and then filled with the thermal conductive material. Or in another embodiment, the temperature sensor 3 is first connected to the wire 5, and then the temperature sensor 3 is placed into the housing 4 from the right side of the housing 4 (i.e., the distal side corresponding to the first opening), and then the guide hole is inserted into the sealing plate, and then the sealing plate is pressed into the right side of the housing 4 and basically fixed. Correspondingly, in order to better fix the sealing plate, a circle of protrusions may be provided on the inner side of the right side of the housing 4, so that the sealing plate can be abutted against the protrusions and fixed relatively stably. These changes are all within the protection scope of the present invention.

[0060] exist Figure 1 On the basis of Figure 2 The cross-sectional schematic diagram of the initial state of an automatic filling high thermal conductivity temperature probe in the use state of the first embodiment of the present invention is shown. It is understood by those skilled in the art that the automatic filling high thermal conductivity temperature probe is preferably cylindrical. In the use state, the protective cover is removed and the automatic filling high thermal conductivity temperature probe is brought close to the object to be measured 1. The object to be measured 1 can be in various shapes, such as a hole, and the automatic filling high thermal conductivity temperature probe extends into the hole and is basically close to the bottom of the hole. In the working state, for example Figure 3-Figure 5 In the embodiment shown, the thermally conductive material is pushed out of the housing 4 and contacts the object to be measured 1, so that the temperature sensor 3 can measure the temperature of the object to be measured 1 through the contact of the thermally conductive material. In another embodiment, the object to be measured 1 can also be a concave surface, a flat surface, or a convex surface, and the automatic filling high thermal conductivity temperature probe provided by the present invention can be used in a similar manner as described above and measure the corresponding temperature.

[0061] Further, refer to Figure 1 to Figure 2 In the illustrated embodiment, the temperature sensor 3 is not attached to the inner wall of the outer shell 4 , but in a preferred embodiment, the temperature sensor 3 is attached to the inside of the outer shell 4 , that is, the inside of the outer shell 4 is filled with the temperature sensor 3 .

[0062] Figure 3The cross-sectional schematic diagram of a first embodiment of the present invention, an automatic filling high thermal conductivity temperature probe in the use state. Preferably, in the use state, by gradually pushing the wire 5 to the left side, the position at the first opening, the wire 5 drives the temperature sensor 3 to move to the left side, that is, to the direction of the object 1 to be measured, and then the temperature sensor 3 drives the thermal conductive material to overflow the housing 4, thereby gradually contacting the object 1 to be measured. Preferably, according to the judgment of the reaction force pushed by the wire 5, the technician can know whether the thermal conductive material has fully contacted the object 1 to be measured, or the reading read by the host computer can determine whether the thermal conductive material has fully contacted the object 1 to be measured, so that the wire 5 can be stopped. In a variation, a red line can be set on the wire 5, which indicates the maximum value of the wire push, or in another variation, a range of pushing size can be marked on the wire to guide the technician to push the length and force of the wire. These variations are all within the scope of protection of the present invention.

[0063] Figure 4 The cross-sectional schematic diagram of a second embodiment of the present invention, which is an automatic filling high thermal conductivity temperature probe, is shown. In this embodiment, a spring 8 is provided on the inner side of the housing 4, the spring 8 is fixed to the wire 5, and the outer side of the spring 8 is connected to a snap ring 7, and in the working state, the snap ring 7 moves or applies pressure in the direction of the spring 8, and the spring 8 drives the wire 5 to move. Preferably, the snap ring 7 is connected to the inner side of the housing 4 by a thread, and in the use state, the snap ring 7 can be rotated inwardly, thereby applying a thrust to the spring 8, and the spring 8 drives the wire 5 to move to the left. In another variation, the snap ring 7 moves into the housing 4 based on the thrust from the right side, thereby applying a thrust to the spring 8, and the spring 8 drives the wire 5 to move to the left. These variations are all within the protection scope of the present invention.

[0064] Figure 5 FIG. 2 shows a cross-sectional schematic diagram of an automatic filling high thermal conductivity temperature probe according to a third embodiment of the present invention. In this embodiment, a pusher 9 is provided between the inner periphery of the housing 4 and the temperature sensor 3. In a working state, the pusher 9 moves toward the direction of the object to be measured 1 to extrude the thermal conductive material 2 from the housing 4. Specifically, in a preferred embodiment, the pusher 9 includes a push connector 91 on the left side, which is used to place the temperature sensor 3. The push connector 91 is connected to the housing 4 by a sliding member 92 ( Figure 5The push member 93 (indicated by the upper and lower dotted lines in the shell 4) is connected to the push member 93 arranged at the right opening of the shell 4. When the push member 93 moves to the left, it drives the sliding member 92 to move, thereby driving the push connector 91 to drive the temperature sensor 3 to move. Since the push connector 91 basically fills the inner wall of the shell 4, the push connector 91 squeezes the thermal conductive material out of the shell 4. Preferably, the shape of the push connector 91 is adapted to the shape of the inner wall of the shell 4, and two guide holes are provided in the middle of the push connector 91, so that the wire 5 passes through the guide holes and is transmitted from the other side of the shell 4. Correspondingly, the push member 93 can be a hollow structure or a closed structure with two guide holes or multiple guide holes. These changes are within the protection scope of the present invention.

[0065] refer to Figure 3 , Figure 4 , Figure 5 Those skilled in the art will understand that in another variation, the housing 4 further includes a micro motor, which is attached to the side of the temperature sensor 3 away from the object 1 to be measured, and pushes the temperature sensor 3 toward the object 1 to be measured when the micro motor is working. The micro motor is preferably wirelessly controlled and driven by a micro battery, and the micro motor can be started or stopped, or even moved forward or reversed, etc., by a wireless control signal.

[0066] Furthermore, those skilled in the art understand that Figures 1 to 5 The structural schematic diagrams of the present invention are shown from different angles. The temperature sensor 3 and its wire 5 and the heat-conducting material 2 are installed in a sleeve 4, and a protective cover 6 is provided at the front end for sealing protection.

[0067] The temperature sensor 3 may be an armored probe or a bare probe, and may be a thermocouple, a thermal resistor, a thermistor, an optical fiber temperature measuring probe or an electronic temperature measuring chip, etc.

[0068] The thermal conductive material 2 can select different types of materials according to the temperature measurement range, such as thermal grease, thermal adhesive, thermal resin, etc. for low temperature environment, graphite powder, AlN, SiC, SiN and other high thermal conductivity ceramic powders for high temperature environment, or high temperature ceramic adhesive containing thermal conductive components.

[0069] The thermal conductive material 2 should preferably be a soft material with low viscosity, so as to be in full contact with the sensor and penetrate into the tiny gap between the sensor and the object being measured.

[0070] The sleeve 4 is the outer shell of the sensor and the heat-conducting material, and can be made into a form with both ends open, or one end open and the other end welded to the fixed end of the sensor tail.

[0071] The protective cover 6 is used to cover the front end of the sleeve 4 to seal and protect the heat-conducting material, and can be removed before installation.

[0072] Figure 2 and Figure 3 The schematic diagram of the present invention being installed on the object to be measured is a temperature measuring hole 1, the bottom of the hole is uneven, and has a large difference in shape from the sensor. Figure 2 As shown, after the sleeve 2 with the sensor and the heat-conducting material is inserted into the temperature measuring hole 1, the temperature sensor 3 in the sleeve 2 is pushed to squeeze the heat-conducting material 2 at the front end of the sensor 3 into the temperature measuring hole 1, as shown in FIG. Figure 3 The heat conductive material 2 is filled between the temperature sensor 3 and the temperature measuring hole 1, filling the original gap, so that the sensor and the temperature measuring hole achieve a good heat transfer effect.

[0073] Further references Figures 1 to 5 Those skilled in the art will appreciate that the automatic filling high thermal conductivity temperature probe provided by the present invention can measure the temperature through the following steps:

[0074] Step i. removing the protective cover 6;

[0075] Step a. Bring the automatic filling high thermal conductivity temperature probe close to or in contact with the object to be measured 1;

[0076] Step b. pushing the temperature sensor 3 toward the object to be measured 1, thereby driving the thermally conductive material 2 to contact the object to be measured 1;

[0077] Step c. Acquire the measurement information of the temperature sensor 3 to obtain the temperature of the measured object 1.

[0078] Those skilled in the art will appreciate that the present invention proposes a temperature sensor with a sleeve at the front end in order to solve the above problems. The sleeve is filled with heat-conducting material, and the temperature sensor acts as a push rod thereafter to squeeze the heat-conducting material out of the sleeve and fill it into the gap between the object to be measured and the temperature sensor.

[0079] After adopting the above technical solution, the obvious beneficial effect is: after the thermal conductive material is squeezed out of the sleeve by the temperature sensor, it not only covers the temperature sensor, but also fills the gap between the object being measured and the temperature sensor, squeezes out the original gap, and improves the thermal conductivity between the temperature sensor and the object being measured, so that the temperature sensor can obtain more accurate temperature values ​​and faster temperature response.

[0080] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art may make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. An automatic filling high thermal conductivity temperature probe, comprising at least one temperature sensor (3), characterized in that: At least one of the components comprises a housing (4) arranged outside the temperature sensor (3); the housing (4) is filled with a heat-conducting material (2) in contact with the temperature sensor (3); in a working state, the heat-conducting material overflows the housing (4) and contacts the object (1) to be measured.

2. The probe according to claim 1, characterized in that: In a working state, the temperature sensor (3) moves towards the object to be measured (1), and squeezes the heat-conducting material (2) out of the housing (4).

3. The probe according to claim 1 or 2, characterized in that: A pusher (9) is provided between the inner periphery of the outer shell (4) and the temperature sensor (3); in a working state, the pusher moves toward the direction of the object to be measured (1) to extrude the heat conductive material (2) out of the outer shell (4).

4. The probe according to any one of claims 1 to 3, characterized in that: A first opening is left at one end of the housing (4) facing the object to be measured (1).

5. The probe according to claim 4, characterized in that: It also includes a protection cover (6) which is arranged outside the first opening.

6. The probe according to any one of claims 1 to 5, characterized in that: It also comprises a wire (5), one end of which is fixedly connected to the temperature sensor (3) and the other end of which extends out of the housing (4).

7. The probe according to claim 6, characterized in that: A sealing plate is provided at one end of the housing away from the object to be measured (1), and a guide hole is provided on the sealing plate. The wire (5) extends into the housing (4) through the guide hole and is connected to the temperature sensor (3).

8. The probe according to claim 6 or 7, characterized in that: It also includes a spring (8) arranged on the inner side of the housing (4), the spring (8) being fixed to the wire (5), and the outer side of the spring (8) being connected to a snap ring (7), and in a working state, the snap ring (7) moves or applies pressure in the direction of the spring (8), and the spring (8) drives the wire (5) to move.

9. The probe according to any one of claims 1 to 5, characterized in that: The housing (4) also includes a micro motor, which is attached to a side of the temperature sensor (3) away from the object to be measured (1), and pushes the temperature sensor (3) to move toward the object to be measured (1) when the micro motor is in operation.

10. The probe according to any one of claims 1 to 9, characterized in that: The temperature sensor (3) is fitted inside the housing (4).

11. The probe according to any one of claims 1 to 10, characterized in that: The temperature sensor (3) is any one of the following components: – Thermocouples; – thermal resistors; – Thermistor; – Fiber optic temperature probe; or –Electronic temperature measurement chip.

12. The probe according to any one of claims 1 to 11, characterized in that The thermally conductive material (2) is any one of the following materials: – Thermal grease; – Thermally conductive adhesive; – Thermally conductive resin; – graphite powder; –High thermal conductivity ceramic powder; – High temperature ceramic glue containing thermally conductive ingredients.

13. A temperature measurement method using the automatic filling high thermal conductivity temperature probe according to any one of claims 1 to 12, which is used to measure the temperature of a measured object (1) using the automatic filling high thermal conductivity temperature probe, and at least comprises the following steps: a. Bring the automatically filled high thermal conductivity temperature probe close to or in contact with the object to be measured (1); b. pushing the temperature sensor (3) toward the object to be measured (1), thereby driving the thermal conductive material (2) to contact the object to be measured (1); c. Obtaining measurement information of the temperature sensor (3), thereby obtaining the temperature of the measured object (1).

14. The temperature measurement method according to claim 13, characterized in that: Before step a, the method further comprises the following steps: i. Remove the protective cover (6).

15. The temperature measurement method according to claim 13 or 14, characterized in that: In the step b, the temperature sensor (3) is pushed toward the object to be measured (1) by pushing the wire (5).

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