Key module and electronic equipment

Abstract

The invention provides a key module and electronic equipment, and the key module comprises a supporting seat which is provided with a first supporting part, a connecting part and a second supporting part which are sequentially distributed at intervals in a first direction; the piezoelectric ceramic is arranged on the first side, in the second direction, of the supporting seat, and in the first direction, the piezoelectric ceramic is located between the first supporting part and the second supporting part; a containing cavity is defined by the conduction shell and the first side of the supporting base, the piezoelectric ceramic is located in the containing cavity, the conduction shell is connected with the connecting part, the conduction shell is used for transmitting acting force in the first direction to the supporting base through the connecting part, and the supporting base can deform after being stressed; therefore, the piezoelectric ceramic is triggered to vibrate.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and more specifically, to a key module and an electronic device including the key module. Background Art

[0002] With the development of science and technology and the improvement of living standards, the user experience requirements of electronic products are getting higher and higher. The vibration feedback provided by motors can no longer meet the refined and functional needs of users. In the related technology, the key module of electronic equipment uses piezoelectric ceramics to provide vibration feedback, but the piezoelectric ceramics of the above key module are easily damaged in the drop test and have poor reliability. Summary of the invention

[0003] The present application provides a new technical solution for a key module, which can at least solve the problem that the piezoelectric ceramics of the existing key module are easily damaged by falling and have poor reliability.

[0004] The present application also provides a new technical solution for electronic equipment.

[0005] According to a first aspect of the present application, a key module is provided, comprising: a support seat, the support seat being provided with a first support portion, a connecting portion and a second support portion which are sequentially spaced apart along a first direction; a piezoelectric ceramic, the piezoelectric ceramic being provided on a first side of the support seat in a second direction, and in the first direction, the piezoelectric ceramic being located between the first support portion and the second support portion; a conductive shell, the conductive shell and a first side of the support seat defining a receiving cavity, the piezoelectric ceramic being located in the receiving cavity, the conductive shell being connected to the connecting portion, the conductive shell being used to transmit a force in a first direction to the support seat through the connecting portion, the support seat being deformable under force to trigger the piezoelectric ceramic to vibrate.

[0006] Optionally, in the first direction, the connecting portion is located between the first end and the second end of the piezoelectric ceramic.

[0007] Optionally, in the first direction, the connecting portion is located between the first end and the second end of the piezoelectric ceramic.

[0008] Optionally, in a first direction, the first supporting portion and the second supporting portion protrude from the conductive housing.

[0009] Optionally, the support seat is provided with the connecting parts on both sides of the third direction respectively.

[0010] Optionally, the connecting portion and the conductive shell are fixed together by laser welding, gluing or snapping.

[0011] Optionally, the conductive shell includes: a first wall body, which is spaced apart from the support seat along the second direction; a second wall body and a third wall body, wherein the second wall body and the third wall body are arranged on a side of the first wall body close to the support seat, and in the third direction, the support seat is located between the second wall body and the third wall body.

[0012] Optionally, the conductive shell further includes: a fourth wall and a fifth wall, wherein the fourth wall and the fifth wall are arranged on a side of the first wall close to the support seat, and in the first direction, the support seat is located between the fourth wall and the fifth wall.

[0013] Optionally, the piezoelectric ceramic is bonded to the support seat at one side in the thickness direction thereof.

[0014] According to a second aspect of the present application, an electronic device is provided, comprising a key module as described in any one of the above items.

[0015] According to the key module of the present application, the piezoelectric ceramic is arranged in the installation cavity defined by the support seat and the conductive shell, so that the support seat and the conductive shell can protect the piezoelectric ceramic, which can effectively prevent the piezoelectric ceramic from being damaged due to falling, and the piezoelectric ceramic is arranged on the support seat, and the support seat and the conductive shell are connected by a connecting part, so that the piezoelectric ceramic can be quickly triggered by pressing the conductive shell, and the response speed is fast. At the same time, the support seat can provide sufficient rigid support for the piezoelectric ceramic, thereby effectively preventing the piezoelectric ceramic from breaking and failing due to excessive deformation, and effectively improving the reliability of the key module.

[0016] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0018] Figure 1 is a three-dimensional diagram of a key module according to an embodiment provided by the present application;

[0019] Figure 2 is a left view of a key module according to an embodiment provided by the present application;

[0020] Figure 3 yes Figure 2 Sectional view at midline AA;

[0021] Figure 4 It is a schematic diagram of the structure of a key module when a support base is under pressure according to an embodiment provided by the present application.

[0022] Reference numerals

[0023] 100. Button module;

[0024] 10. Support seat;

[0025] 11. First supporting portion; 12. Connecting portion; 13. Second supporting portion;

[0026] 20. piezoelectric ceramics; 30. conductive shell;

[0027] 31. first wall; 32. second wall; 33. third wall;

[0028] a. First support; b. Second support. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0031] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0032] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0033] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0034] The following first describes in detail the key module 100 according to the embodiment of the present application with reference to the accompanying drawings.

[0035] like Figures 1 to 4 As shown, the key module 100 according to the embodiment of the present application includes a support base 10 , a piezoelectric ceramic 20 and a conductive shell 30 .

[0036] Specifically, the support seat 10 is provided with a first support portion 11, a connecting portion 12 and a second support portion 13 which are spaced apart in sequence along a first direction. The piezoelectric ceramic 20 is provided on a first side of the support seat 10 in the second direction. In the first direction, the piezoelectric ceramic 20 is located between the first support portion 11 and the second support portion 13. The conductive shell 30 and the first side of the support seat 10 define an accommodating cavity. The piezoelectric ceramic 20 is located in the accommodating cavity. The conductive shell 30 is connected to the connecting portion 12. The conductive shell 30 is used to apply a force along the first direction to the connecting portion 12. The support seat 10 can be deformed by the force to trigger the piezoelectric ceramic 20 to vibrate.

[0037] In other words, if Figures 1 to 4 As shown, the key module 100 according to the embodiment of the present application is mainly composed of a support base 10, a piezoelectric ceramic 20 and a conductive shell 30, wherein the conductive shell 30 can be located on the first side of the support base 10 in the first direction, and an accommodating cavity can be defined by the inner wall surface of the conductive shell 30 and the first side of the support base 10, and the piezoelectric ceramic 20 can be installed in the accommodating cavity, so that the piezoelectric ceramic 20 can be protected by the support base 10 and the conductive shell 30. The support base 10 is provided with a first supporting portion 11, a connecting portion 12 and a second supporting portion 13 spaced apart along the first direction, and the connecting portion 12 is located between the first supporting portion 11 and the second supporting portion 13.

[0038] In this embodiment, if Figures 1 to 4 As shown, the connection portion 12 is fixedly connected to the conductive housing 30, and the piezoelectric ceramic 20 is fixedly connected to the first side of the support seat 10 in the second direction. In addition, the piezoelectric ceramic 20 is located between the first support portion 11 and the second support portion 13. When in use, the first support portion 11 is fixedly connected to the first support body a, and the second support portion 13 is fixedly connected to the second support body b, so that the area where the piezoelectric ceramic 20 is located forms a suspended area.

[0039] During the pressing or dropping test, the conductive shell 30 is subjected to pressure in the first direction, and the conductive shell 30 can transmit the force to the support seat 10 through the connecting portion 12, so that the support seat 10 bends and deforms with the connecting portion 12 as the center, and the bent and deformed support seat 10 squeezes the piezoelectric ceramic 20 inward, so that the piezoelectric ceramic 20 bends and deforms. This deformation triggers the piezoelectric ceramic 20, causing the piezoelectric ceramic 20 to vibrate, thereby driving the conductive shell 30 to vibrate, and then the user can feel the actual click feeling and sense of reality when pressing the operation, creating a delicate and excellent interactive experience; and while the support seat 10 drives the piezoelectric ceramic 20 to deform, it can also provide sufficient rigid support for the piezoelectric ceramic 20, thereby effectively preventing the piezoelectric ceramic 20 from breaking and failing due to excessive deformation.

[0040] Therefore, according to the key module 100 provided in this embodiment, by setting the piezoelectric ceramic 20 in the installation cavity defined by the support seat 10 and the conductive shell 30, the piezoelectric ceramic 20 can be effectively prevented from being damaged due to falling, and the piezoelectric ceramic 20 is set on the support seat 10, and the support seat 10 and the conductive shell 30 are connected by the connecting part 12, so that the piezoelectric ceramic 20 can be quickly triggered by pressing the conductive shell 30, and the response speed is fast. At the same time, the support seat 10 can provide sufficient rigid support for the piezoelectric ceramic 20, which can effectively prevent the piezoelectric ceramic 20 from breaking and failing due to excessive deformation, thereby effectively improving the reliability of the key module 100.

[0041] In some embodiments of the present application, in the first direction, the connecting portion 12 is located between the first end and the second end of the piezoelectric ceramic 20 .

[0042] That is to say, Figure 3 As shown, the connection part 12 has a first end and a second end that are arranged opposite to each other in the first direction. In the first direction, the size of the connection part 12 is smaller than the size of the piezoelectric ceramic 20, and the connection part 12 is located between the first end of the piezoelectric ceramic 20 and the second end of the piezoelectric ceramic 20, so as to ensure that the piezoelectric ceramic 20 can be effectively bent and deformed; the connection between the connection part 12 and the conductive housing 30 not only transmits the externally applied pressure, but also limits the bending degree of the piezoelectric ceramic 20 and the support seat 10. This limiting effect can effectively prevent the piezoelectric ceramic 20 from being broken and failing due to excessive deformation, thereby improving the reliability and durability of the key module 100.

[0043] Furthermore, if Figure 3 As shown, in the first direction, the connecting portion 12 is located in the middle position between the first end and the second end of the piezoelectric ceramic 20, so that the connection between the connecting portion 12 and the conductive shell 30 can limit the bending in the area where the piezoelectric ceramic 20 bends most significantly, thereby effectively preventing the piezoelectric ceramic 20 from breaking and failing due to excessive deformation.

[0044] According to an embodiment of the present application, in the first direction, the first support portion 11 and the second support portion 13 protrude from the conductive housing 30 .

[0045] Specifically, Figure 1 and Figure 3 As shown, the support base 10 has a first end and a second end that are relatively arranged in a first direction. The first end of the support base 10 is provided with a first extension section extending along the first direction, and the first extension section protrudes from the conductive shell 30 to form a first support portion 11. The second end of the support base 10 is provided with a second extension section extending along the first direction, and the second extension section protrudes from the conductive shell 30 to form a second support portion 13.

[0046] In this embodiment, the first support portion 11 and the second support portion 13 protrude from the conductive shell 30, so that the distance between the first support portion 11 and the second support portion 13 relative to the connecting portion 12 is longer, which effectively increases the length of the force arm, so that the piezoelectric ceramic 20 can respond to external pressure more sensitively, thereby improving the response speed of the button module 100.

[0047] In some embodiments of the present application, the support base 10 is provided with connecting parts 12 on both sides of the third direction.

[0048] That is to say, Figure 2 and Figure 3 As shown, the support base 10 is provided with a connecting portion 12 on the first side and the second side in a third direction (for example, the width direction of the support base 10). The connecting portions 12 on both sides of the support base 10 are connected to the conductive shell 30, which can provide reliable rigid support for the piezoelectric ceramic 20 and effectively improve the reliability of the button module 100.

[0049] According to an embodiment of the present application, the connection portion 12 and the conductive housing 30 are fixed together by laser welding, gluing or snapping.

[0050] Specifically, the connection portion 12 may be formed as a protrusion provided on the side wall of the base, and the connection method between the connection portion 12 and the conductive housing 30 includes but is not limited to the following:

[0051] Case 1: The connection portion 12 and the conductive housing 30 are fixed together by laser welding. In this case, the support base 10 and the conductive housing 30 do not need to be provided with a complex connection structure, which is convenient for production and manufacturing;

[0052] Case 2: The connection portion 12 and the conductive housing 30 are fixed together by gluing. In this case, the support base 10 and the conductive housing 30 do not need to be provided with a complex connection structure, which is convenient for production and manufacturing;

[0053] Case 3: The connection portion 12 and the conductive housing 30 are fixed together by snapping together. For example, the inner wall surface of the conductive housing 30 is provided with a slot, and the connection portion 12 can be snapped into the slot, which is convenient for assembly and has sufficient connection strength.

[0054] In some optional examples of the present application, the conductive housing 30 is an integrally formed injection molded part.

[0055] In some embodiments of the present application, the conductive shell 30 includes: a first wall 31, the first wall 31 is separated from the support seat 10 along the second direction; a second wall 32 and a third wall 33, the second wall 32 and the third wall 33 are arranged on the side of the first wall 31 close to the support seat 10, and in the third direction, the support seat 10 is located between the second wall 32 and the third wall 33.

[0056] That is to say, Figure 1 and Figure 3 As shown, the conductive shell 30 mainly includes a first wall body 31, which is located on the first side of the support seat 10 in the second direction, and the first wall body 31 is spaced apart from the support seat 10, and a second wall body 32 and a third wall body 33 are provided on the side of the first wall body 31 close to the support seat 10, the second wall body 32 and the third wall body 33 are spaced apart along the third direction, and the distance between the second wall body 32 and the third wall body 33 is not less than the size of the support seat 10 in the third direction, so that the support seat 10 can be located between the second wall body 32 and the third wall body 33, and the inner wall surfaces of the second wall body 32 and the third wall body 33 are fixedly connected to the connecting part 12 on the support seat 10.

[0057] In this embodiment, the two ends of the conductive shell 30 in the first direction are open ends, and the conductive shell 30 will not affect the bending deformation of the support base 10 in the third direction. It is also beneficial for the support base 10 to protrude from the two ends of the conductive shell 30 in the first direction, thereby facilitating improving the response speed of the key module 100.

[0058] According to one embodiment of the present application, the conductive shell 30 further includes: a fourth wall and a fifth wall, which are arranged on a side of the first wall 31 close to the support seat 10, and in the first direction, the support seat 10 is located between the fourth wall and the fifth wall.

[0059] Specifically, a fourth wall and a fifth wall are provided on the side of the first wall 31 close to the support seat 10. The fourth wall and the fifth wall are spaced apart along the first direction, and the distance between the fourth wall and the fifth wall is greater than the size of the support seat 10 in the first direction, so that the support seat 10 can be located between the fourth wall and the fifth wall.

[0060] In this embodiment, the opening of the conductive housing 30 in the first direction can be blocked by the fourth wall and the fifth wall, which can effectively improve the protective effect of the conductive housing 30 on the piezoelectric ceramic 20 .

[0061] like Figure 3 As shown, in some embodiments of the present application, the wall surface of the support seat 10 where the connection portion 12 is not provided is separated from the inner wall surface of the conductive shell 30, so that the support seat 10 will not be subject to unnecessary obstruction from the inner wall surface of the conductive shell 30 when bending and deforming, thereby ensuring that the support seat 10 can freely perform necessary bending deformation when subjected to external force, thereby effectively transmitting the force to the piezoelectric ceramic 20.

[0062] According to an embodiment of the present application, the piezoelectric ceramic 20 is bonded to the support base 10 at one side in the thickness direction thereof.

[0063] That is to say, the piezoelectric ceramic 20 is fixed to the surface of the support base 10 by glue on one side surface in the thickness direction, thereby ensuring that the support base 10 can evenly transfer the force to the piezoelectric ceramic 20 at various positions, thereby effectively avoiding the piezoelectric ceramic 20 from being broken or damaged due to uneven force or local excessive force, thereby effectively improving the reliability of the button module 100.

[0064] In summary, according to the key module 100 provided in this embodiment, by setting the piezoelectric ceramic 20 in the installation cavity defined by the support seat 10 and the conductive shell 30, the piezoelectric ceramic 20 can be effectively prevented from being damaged due to falling, and the piezoelectric ceramic 20 is set on the support seat 10, and the support seat 10 and the conductive shell 30 are connected by the connecting part 12, so that the piezoelectric ceramic 20 can be quickly triggered by pressing the conductive shell 30, and the response speed is fast. At the same time, the support seat 10 can provide sufficient rigid support for the piezoelectric ceramic 20, thereby effectively preventing the piezoelectric ceramic 20 from breaking and failing due to excessive deformation, thereby effectively improving the reliability of the key module 100.

[0065] An embodiment of the present application also provides an electronic device, including the electronic device described in any of the above embodiments. Since the key module 100 according to the embodiment of the present application has the above technical effects, the electronic device according to the embodiment of the present application also has the corresponding technical effects, which will not be repeated in this embodiment.

[0066] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A key module, characterized in that: include: A support seat (10), wherein the support seat (10) is provided with a first support portion (11), a connecting portion (12), and a second support portion (13) which are sequentially spaced and distributed along a first direction; A piezoelectric ceramic (20), wherein the piezoelectric ceramic (20) is disposed on a first side of the support seat (10) in a second direction, and in the first direction, the piezoelectric ceramic (20) is located between the first support portion (11) and the second support portion (13); A conductive shell (30), wherein the conductive shell (30) and the first side of the support seat (10) define a receiving cavity, the piezoelectric ceramic (20) is located in the receiving cavity, and the conductive shell (30) is connected to the connecting portion (12). The conductive shell (30) is used to transmit a force in a first direction to the support seat (10) through the connecting portion (12); the support seat (10) is deformable when subjected to the force, so as to trigger the piezoelectric ceramic (20) to vibrate.

2. The key module according to claim 1, characterized in that: In a first direction, the connecting portion (12) is located between a first end and a second end of the piezoelectric ceramic (20).

3. The key module according to claim 2, characterized in that: In the first direction, the connecting portion (12) is located between the first end and the second end of the piezoelectric ceramic (20).

4. The key module according to claim 1, characterized in that: In a first direction, the first supporting portion (11) and the second supporting portion (13) protrude from the conductive housing (30).

5. The key module according to claim 1, characterized in that: The support seat (10) is provided with the connecting parts (12) on both sides of the third direction.

6. The key module according to claim 1, characterized in that: The connecting portion (12) and the conductive housing (30) are fixed together by means of laser welding, gluing or snapping.

7. The key module according to claim 1, characterized in that: The conductive housing (30) comprises: A first wall (31), the first wall (31) and the support seat (10) are spaced apart along a second direction; A second wall body (32) and a third wall body (33), wherein the second wall body (32) and the third wall body (33) are arranged on a side of the first wall body (31) close to the support seat (10), and in the third direction, the support seat (10) is located between the second wall body (32) and the third wall body (33).

8. The key module according to claim 7, characterized in that: The conductive housing (30) further comprises: A fourth wall body and a fifth wall body, wherein the fourth wall body and the fifth wall body are arranged on a side of the first wall body (31) close to the support seat (10), and in a first direction, the support seat (10) is located between the fourth wall body and the fifth wall body.

9. The key module according to claim 1, characterized in that: The piezoelectric ceramic (20) is bonded to the support seat (10) on one side in the thickness direction thereof.

10. An electronic device, characterized in that: A key module comprising any one of claims 1 to 9.

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