Lead frame of photoelectric coupler, laminated structure and photoelectric coupler

Abstract

The invention discloses a lead frame of a photoelectric coupler, a laminated structure and the photoelectric coupler, the lead frame of the photoelectric coupler comprises a first lead support and a second lead support, a first connecting strip is arranged between the two lead supports, a first frame module is arranged on the first connecting strip, and a second frame module is arranged on the second lead support. Comprising a plurality of first frame units in mirror image distribution; the first frame unit comprises a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge and a third connecting bridge; fourth connecting bridges are connected between the first base islands of the adjacent first frame units in the first frame module, fifth connecting bridges are connected between the fourth connecting bridges and the first connecting strips, and the fourth connecting bridges and the fifth connecting bridges are arranged in a T shape. According to the lead frame, the T-shaped connecting bridges are arranged between the adjacent frame units, so that the stability of the lead frame is effectively improved, the drainage glue channels between the adjacent frame units are narrowed, the glue consumption of an inner-layer packaging body is reduced, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of photoelectric couplers, and in particular to a lead frame, a stacked structure and a photoelectric coupler of a photoelectric coupler. Background Art

[0002] As a safety device for electric-optical-electric conversion isolation, photocouplers have a wide range of market applications and environments. Generally, the types of photocouplers mainly include contrast type and reflective type. The structure of the contrast type photocoupler is that the light-emitting chip and the photosensitive chip are encapsulated by packaging glue in the same package and arranged oppositely. Its production process is to perform die bonding and wire bonding on two metal lead frames respectively, flip one of the metal lead frames, overlap the two metal lead frames, cut the ribs into shape, and finally package them. In the frame units of the existing metal lead frames, since there is only a single connecting bridge connection between each base island in the functional area and the connecting strip, if jitter, tremor and other phenomena occur in the production process, it is easy to cause the die-bonding wire to bend or collapse, affecting the production efficiency and quality of the optocoupler products. In dual-channel or multi-channel optocouplers, there is no connecting structure support between adjacent frame units, resulting in a larger width of the drainage glue channel. During packaging, a large amount of glue is used for the inner layer package. The inner layer package uses light-transmitting and high-insulation voltage-resistant functional materials, which are more expensive, thereby resulting in a higher overall production cost of the optocoupler products. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a lead frame, a stacked structure and a photoelectric coupler of an optocoupler. A T-shaped connecting bridge is arranged between adjacent frame units in the lead frame, which effectively improves the stability of the lead frame, and at the same time narrows the drainage glue channel between adjacent frame units, reduces the amount of glue used in the inner layer package, and reduces the manufacturing cost.

[0004] The present invention provides a lead frame of a photoelectric coupler, the lead frame of the photoelectric coupler comprises a first lead support and a second lead support, a plurality of mutually parallel first connecting strips are arranged between the first lead support and the second lead support, a plurality of first frame modules are arranged on any of the first connecting strips, any of the first frame modules comprises a plurality of first frame units, and the plurality of first frame units of the same first frame module are mirror-distributed up and down;

[0005] Any one of the first frame units includes a first functional area, the first functional area includes a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge, and a third connecting bridge, the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, and the other ends of the first connecting bridge, the second connecting bridge, and the third connecting bridge are connected to the first connecting bar;

[0006] A fourth connecting bridge is connected between the first base island of any first frame unit of any first frame module and the first base island of the adjacent first frame unit, a fifth connecting bridge is connected between the fourth connecting bridge and the first connecting strip, and the fourth connecting bridge and the fifth connecting bridge are arranged in a T shape.

[0007] Furthermore, the first base island, the second base island and the third base island are arranged in a finished product shape, the first base island is far away from the first connecting strip, the second base island is located on the upper side of the first base island close to the first connecting strip, the third base island is located on the lower side of the first base island close to the first connecting strip, and the second base island and the third base island are symmetrically arranged on both sides of the first connecting bridge.

[0008] Furthermore, the width of the fourth connecting bridge is 0.5 mm-2 mm.

[0009] Furthermore, the width of the fifth connecting bridge is 0.5 mm-2 mm.

[0010] Furthermore, a chip bonding portion for placing an optical coupling chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

[0011] Furthermore, the depth of the circular groove or the cross-shaped groove is 0.05mm-0.2mm.

[0012] Furthermore, the diameter of the circular groove is 0.8 mm-2 mm.

[0013] Furthermore, the cross side length of the cross-shaped groove is 0.5 mm-2 mm.

[0014] Furthermore, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0015] Further, any one of the first connecting strips includes a first connecting rib and a second connecting rib, and the first connecting rib and the second connecting rib are parallel to each other;

[0016] The other end of the first connection bridge, the other end of the second connection bridge, the other end of the third connection bridge, and the other end of the fifth connection bridge are connected to the first connection rib.

[0017] Furthermore, the first frame unit also includes a first pin and a second pin, the first pin and the second pin are perpendicular to the first connecting strip, one end of the first pin and one end of the second pin are connected to the first connecting rib and the first functional area, and the other end of the first pin and the other end of the second pin are connected to the second connecting rib.

[0018] Furthermore, the first lead support and the second lead support are provided with a plurality of groups of docking notches, and each group of docking notches is symmetrical in the upper and lower parts.

[0019] Furthermore, a plurality of docking holes are provided on the first lead bracket and the second lead bracket.

[0020] Furthermore, a bend is formed at the connection between the first connecting strip and the first lead support and the second lead support.

[0021] Furthermore, a bend is formed at a connection between each first frame unit and the first connecting strip where each first frame unit is located.

[0022] Furthermore, the lead frame of the photoelectric coupler is made of one or more alloys of aluminum, iron, and copper.

[0023] The present invention also provides a stacking structure of a lead frame of an optocoupler, the stacking structure of the lead frame of the optocoupler comprising a first lead frame and a second lead frame, the first lead frame being the lead frame of the optocoupler mentioned above, the first lead frame and the second lead frame being stacked on each other, and the frame units arranged on the first lead frame being stacked one-to-one with the frame units arranged on the second lead frame.

[0024] The present invention further provides a photoelectric coupler, the photoelectric coupler comprising a plurality of frame units, a plurality of optical coupling chips, bonding wires, and a package body, the number of the plurality of frame units being 2N, N being a positive integer, wherein N frame units are the first frame units described above, and N frame units are the second frame units, the functional areas of the first frame units are arranged opposite to the functional areas of the second frame units one by one, the plurality of optical coupling chips and bonding wires are arranged on the plurality of frame units, the package body integrally packages and covers the functional areas of the plurality of frame units, the plurality of optical coupling chips, and the bonding wires, and the pins of the plurality of frame units extend out of the package body and are bent toward the same side outside the package body;

[0025] The second frame unit includes a second functional area, and the second functional area includes a fourth base island, a fifth base island, a sixth connecting bridge, and a seventh connecting bridge. The fourth base island is connected to one end of the sixth connecting bridge, the fifth base island is connected to one end of the seventh connecting bridge, and the fourth base island is arranged above the fifth base island.

[0026] Furthermore, the package body includes an outer package body and an inner package body, the inner package body encapsulates and covers the functional areas of the several frame units, several optical coupling chips, and bonding wires, and the outer package body covers the inner package body.

[0027] In the lead frame of the optocoupler provided by the present invention, a first frame module is provided, and a fourth connecting bridge and a fifth connecting bridge in a T shape are provided between adjacent first frame units in the same module, which can be used to improve the connection strength and support strength of the base island away from the connecting strip, reduce the risk of deformation due to jitter and vibration, improve the reliability and stability of the lead frame, and improve the production efficiency and quality of the optocoupler products; during packaging, the T-shaped connecting bridge can narrow the drainage glue path between adjacent frame units, reduce the glue consumption of the inner packaging body, and reduce the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 is a schematic diagram of the lead frame structure of the optocoupler in the first embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the structure of the first frame module in the first embodiment of the present invention;

[0031] Figure 3 is a schematic side view of the first frame unit structure in the first embodiment of the present invention;

[0032] Figure 4 is a schematic diagram of the second lead frame structure in the second embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of the structure of the second frame unit in the second embodiment of the present invention;

[0034] Figure 6 is a schematic side view of a second frame unit structure in Embodiment 2 of the present invention;

[0035] Figure 7 is a schematic diagram of the stacked structure of the lead frame of the optocoupler in the second embodiment of the present invention;

[0036] Figure 8 is a schematic diagram of the structure of the photoelectric coupler in the third embodiment of the present invention;

[0037] Fig. 9 Schematic diagram of the lead frame structure and stacking diagram of the optocoupler in the third embodiment of the present invention;

[0038] Fig.10 Schematic diagram of the structure of the plastic-encapsulated inner layer package of the photoelectric coupler in the third embodiment of the present invention;

[0039] Fig.11 It is a schematic diagram of the structure of the plastic-sealed outer layer package of the optocoupler in the third embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the present invention, it should be understood that terms such as "include" or "have" are intended to indicate the existence of features, numbers, steps, behaviors, components, parts or a combination thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, behaviors, components, parts or a combination thereof exist or are added.

[0042] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0043] Embodiment 1

[0044] Embodiment 1 of the present invention provides a lead frame of an optocoupler, wherein the lead frame of the optocoupler comprises a first lead support and a second lead support, wherein a plurality of mutually parallel first connecting strips are arranged between the first lead support and the second lead support, wherein a plurality of first frame modules are arranged on any of the first connecting strips, wherein any of the first frame modules comprises a plurality of first frame units, and the plurality of first frame units of the same first frame module are mirror-distributed up and down; wherein any of the first frame units comprises a first functional area, wherein the first functional area comprises a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge, and a third connecting bridge, wherein the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, and the other ends of the first connecting bridge, the second connecting bridge, and the third connecting bridge are connected to the first connecting strip; wherein a fourth connecting bridge is connected between the first base island of any first frame unit of any first frame module and the first base island of an adjacent first frame unit, a fifth connecting bridge is connected between the fourth connecting bridge and the first connecting strip, and the fourth connecting bridge and the fifth connecting bridge are arranged in a T-shape.

[0045] In an optional implementation of this embodiment, Figure 1 As shown, Figure 1 A schematic diagram of the lead frame structure of the optocoupler in Embodiment 1 of the present invention is shown, wherein the lead frame of the optocoupler comprises a first lead support 11 and a second lead support 12, wherein a plurality of mutually parallel first connecting strips 21 are arranged between the first lead support 11 and the second lead support 12, wherein the first connecting strips 21 are perpendicular to the first lead support 11 and the second lead support 12, and a plurality of first frame modules 3 are arranged on any one of the first connecting strips 21.

[0046] In an optional implementation of this embodiment, Figure 2 As shown, Figure 2 The schematic diagram of the structure of the first frame module in the first embodiment of the present invention is shown. The first frame module 3 includes two first frame units 31. The two first frame units 31 of the same first frame module 3 are mirror-distributed up and down.

[0047] It should be noted that the number of first frame units included in a single first frame module is determined according to actual design requirements.

[0048] In an optional implementation of the present embodiment, the first frame unit 31 includes a first functional area 41, and the first functional area 41 includes a first base island 51, a second base island 52, a third base island 53, a first connecting bridge 54, a second connecting bridge 55, and a third connecting bridge 56. The first base island 51 is connected to one end of the first connecting bridge 54, the second base island 52 is connected to one end of the second connecting bridge 55, and the third base island 53 is connected to one end of the third connecting bridge 56. The other end of the first connecting bridge 54, the other end of the second connecting bridge 55, and the other end of the third connecting bridge 56 are connected to the first connecting strip 21.

[0049] In an optional implementation of the present embodiment, the first base island 51, the second base island 52, and the third base island 53 are arranged in a finished product shape, the first base island 51 is away from the first connecting strip 21, the second base island 52 is located on the upper side of the first base island 51 close to the first connecting strip 21, that is, the upper side on the right side, and the third base island 53 is located on the lower side of the first base island 51 close to the first connecting strip 21, that is, the lower side on the right side, and the second base island 52 and the third base island 53 are symmetrically arranged on both sides of the first connecting bridge 54.

[0050] In an optional implementation of the present embodiment, in the two first frame units 31 of the first frame module 3, a fourth connecting bridge 57 is connected between the first base island 51 of the upper first frame unit 31 and the first base island 51 of the lower first frame unit 31, wherein one end of the fourth connecting bridge 57 is connected to the lower side of the first base island 51 of the upper first frame unit 31, and the other end is connected to the upper side of the first base island 51 of the lower first frame unit 31.

[0051] In an optional implementation of the present embodiment, a fifth connecting bridge 58 is connected between the fourth connecting bridge 57 and the first connecting bar 21, the fourth connecting bridge 57 and the fifth connecting bridge 58 are arranged in a T shape, the fourth connecting bridge 57 and the first connecting bar 21 are parallel to each other, the fifth connecting bridge 58 and the first connecting bar 21 are perpendicular to each other, one end of the fifth connecting bridge 58 is connected to the fourth connecting bridge 57, and the other end is connected to the first connecting bar 21.

[0052] Specifically, since in the first frame unit, there is only a single first connecting bridge connection between the first base island away from the first connecting strip and the first connecting strip, the length of the first connecting bridge is relatively large, and the first connecting bridge is sandwiched between the second base island and the third base island, and its width is relatively small, and the support strength for the first base island is relatively small. A T-shaped connecting bridge composed of a fourth connecting bridge and a fifth connecting bridge is provided here, which can effectively improve the support strength of the first base island, thereby improving the strength, stability and reliability of the lead frame.

[0053] In an optional implementation of the present embodiment, the width w1 of the fourth connecting bridge 57 is 0.5 mm-2 mm, specifically a value among 0.5 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0054] In an optional implementation of the present embodiment, the width w2 of the fifth connecting bridge 58 is 0.5 mm-2 mm, and specifically can be a value among 0.5 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0055] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

[0056] Specifically, Figure 2 As shown, Figure 2 The chip bonding parts arranged on the first base island 51 , the second base island 52 and the third base island 53 in the first frame unit 31 are cross-shaped grooves.

[0057] In an optional implementation of this embodiment, the depth of the circular groove or the cross-shaped groove is 0.05 mm-0.2 mm, and can be specifically a value among 0.05 mm, 0.1 mm, 0.15 mm, and 0.2 mm, which is determined according to actual design requirements.

[0058] In an optional implementation of this embodiment, the diameter of the circular groove is 0.8 mm-2 mm, and can be specifically a value among 0.8 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0059] In an optional implementation of the present embodiment, the length of the cross side of the cross-shaped groove is 0.5 mm-2 mm, and can be specifically a value among 0.5 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0060] It should be noted that the cross sides of the cross-shaped groove are two mutually perpendicular line segments forming a "cross".

[0061] Here, a chip bonding portion is set on the base island, and the specific structure is a circular groove or a cross-shaped groove, which is used to place the optocoupler chip and fix the die.

[0062] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0063] Specifically, a high-reflective metal layer is electroplated on the first base island 51, the second base island 52, and the third base island 53 except for the groove structure of the chip bonding part.

[0064] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0065] Here, a highly reflective metal layer is arranged on the surface of the base island, so that the first base island, the second base island and the third base island can serve as a bonding wire connection medium when no optocoupler chip is placed, while improving the reflectivity of the light emitted by the light-emitting chip and the photoelectric conversion efficiency of the optocoupler device.

[0066] In an optional implementation of this embodiment, any one of the first connecting strips includes a first connecting rib and a second connecting rib, and the first connecting rib and the second connecting rib are parallel to each other.

[0067] Specifically, Figure 2 As shown, the first connecting strip 21 includes a first connecting rib 22 and a second connecting rib 23, and the first connecting rib 22 and the second connecting rib 23 are parallel to each other.

[0068] In an optional implementation of this embodiment, the other end of the first connection bridge, the other end of the second connection bridge, the other end of the third connection bridge, and the other end of the fifth connection bridge are connected to the first connection rib.

[0069] Specifically, Figure 2 As shown, the other end of the first connecting bridge 54, the other end of the second connecting bridge 55, the other end of the third connecting bridge 56, and the other end of the fifth connecting bridge 58 are connected to the first connecting rib.

[0070] In an optional implementation of this embodiment, the first frame unit also includes a first pin and a second pin, the first pin and the second pin are perpendicular to the first connecting strip, one end of the first pin and one end of the second pin are connected to the first connecting rib and the first functional area, and the other end of the first pin and the other end of the second pin are connected to the second connecting rib.

[0071] Specifically, Figure 2 As shown, the first frame unit 31 also includes a first pin 61 and a second pin 62, the first pin 61 and the second pin 62 are perpendicular to the first connecting strip 21, one end of the first pin 61 and one end of the second pin 61 are connected to the first connecting rib 22 and the first functional area 41, and the other end of the first pin 61 and the other end of the second pin 62 are connected to the second connecting rib 23.

[0072] The first pin and the second pin are set here to connect an external input source and an output source after a photoelectric coupler is subsequently formed, so as to support the photoelectric coupler to work.

[0073] In an optional implementation of this embodiment, a plurality of groups of docking notches are provided on the first lead support and the second lead support, and each group of docking notches is symmetrical in the upper and lower parts.

[0074] Specifically, Figure 1 As shown, a plurality of groups of butt joint notches 71 are provided on the first lead support 11 and the second lead support 12 , and each group of butt joint notches 71 is symmetrical up and down.

[0075] Specifically, the number of each group of docking notches 71 is 2-4.

[0076] It should be noted that the butt joint notch 71 is disposed between two adjacent first connecting strips on two lead supports.

[0077] In an optional implementation of this embodiment, a plurality of docking holes are provided on the first lead support and the second lead support.

[0078] Specifically, Figure 1 As shown, a plurality of docking holes 72 are provided on the first lead support 11 and the second lead support 12 .

[0079] In an optional implementation of this embodiment, a bend is formed at a connection between each first frame unit and the first connecting strip where each first frame unit is located.

[0080] Specifically, Figure 3 As shown, Figure 3 FIG. 4 shows a side view of the first frame unit structure in the first embodiment of the present invention. Figure 3 As shown, a bend is formed at the connection between the first frame unit 31 and the first connecting strip 21, and the bending angle α1 is 45°-90°, specifically a value among 45°, 60°, 75°, and 90°, and the bending height h1 is 0.4mm-0.8mm, specifically a value among 0.4mm, 0.5mm, 0.6mm, 0.7mm, and 0.8mm, which is determined according to actual design requirements.

[0081] If the bending angle is set too small, the functional area will be too small, affecting the position of the subsequent die bonding wire. If the bending height is too low, the arc height of the welding wire will be too low, making it impossible to perform welding. If the bending height is too high, the distance from the top of the welding wire arc to the surface of the package will be too short and the thickness will be too thin, affecting the airtightness of the optocoupler device.

[0082] In an optional implementation of this embodiment, the lead frame of the optocoupler is made of one or more alloys of aluminum, iron, and copper.

[0083] In summary, embodiment 1 of the present invention provides a lead frame of an optocoupler, which is provided with a first frame module, and a fourth connecting bridge and a fifth connecting bridge in a T shape are arranged between adjacent first frame units in the same module, which can be used to improve the connection strength and support strength of the base island away from the connecting strip, reduce the risk of deformation due to jitter and vibration, improve the reliability and stability of the lead frame, and improve the production efficiency and quality of the optocoupler products; during packaging, the T-shaped connecting bridge can narrow the drainage glue channel between adjacent frame units, reduce the glue consumption of the inner layer packaging body, and reduce the manufacturing cost.

[0084] Embodiment 2

[0085] Embodiment 2 of the present invention provides a stacking structure of a lead frame of an optocoupler, wherein the stacking structure of the lead frame of the optocoupler comprises a first lead frame and a second lead frame, wherein the first lead frame is the lead frame of the optocoupler in Embodiment 1, the first lead frame and the second lead frame are stacked on each other, and the frame units arranged on the first lead frame are stacked one-to-one with the frame units arranged on the second lead frame.

[0086] In an optional implementation of this embodiment, Figure 4 As shown, Figure 4 A schematic diagram of the second lead frame structure in embodiment 2 of the present invention is shown, wherein the second lead frame includes a third lead bracket 13 and a fourth lead bracket 14, a plurality of second connecting bars 24 parallel to each other are arranged between the third lead bracket 13 and the fourth lead bracket 14, the second connecting bars 24 are perpendicular to the third lead bracket 13 and the fourth lead bracket 14, and a plurality of second frame units 32 are arranged on any one of the second connecting bars 24.

[0087] In an optional implementation of this embodiment, Figure 5 As shown, Figure 5 A schematic diagram of the second frame unit structure in embodiment 2 of the present invention is shown, which includes two second frame units 32. The second frame unit 32 includes a second functional area 42. The second functional area 42 includes a fourth base island 66, a fifth base island 67, a sixth connecting bridge 68, and a seventh connecting bridge 69. The fourth base island 66 is connected to one end of the sixth connecting bridge 68, the fifth base island 67 is connected to one end of the seventh connecting bridge 69, and the fourth base island 66 is arranged above the fifth base island 67.

[0088] In an optional implementation of this embodiment, Figure 5As shown, the second connecting strip 24 includes a third connecting rib 25 and a fourth connecting rib 26 , the third connecting rib 25 and the fourth connecting rib 26 are parallel to each other, and the other end of the sixth connecting bridge 68 and the other end of the seventh connecting bridge 69 are connected to the third connecting rib 25 .

[0089] In an optional implementation of the present embodiment, the second frame unit 32 also includes a third pin 63 and a fourth pin 64, and the third pin 63 and the fourth pin 64 are perpendicular to the second connecting strip 24, one end of the third pin 63 and one end of the fourth pin 64 are connected to the third connecting rib 25 and the second functional area 42, and the other end of the third pin 63 and the other end of the fourth pin 64 are connected to the fourth connecting rib 26.

[0090] In an optional implementation of this embodiment, a chip bonding portion for placing an optocoupler chip is provided on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

[0091] Specifically, Figure 5 As shown, Figure 5 The chip bonding portion provided on the fourth base island 66 of the second frame unit 32 is a circular groove.

[0092] In an optional implementation of this embodiment, the depth of the circular groove is 0.05 mm-0.2 mm, and can be specifically a value among 0.05 mm, 0.1 mm, 0.15 mm, and 0.2 mm, which is determined according to actual design requirements.

[0093] In an optional implementation of this embodiment, the diameter of the circular groove is 0.8 mm-2 mm, and can be specifically a value among 0.8 mm, 1 mm, 1.5 mm, and 2 mm, which is determined according to actual design requirements.

[0094] Here, a chip bonding part is set on the base island, and the specific structure is a circular groove, which is used to place the optocoupler chip and fix the die.

[0095] In an optional implementation of this embodiment, a high-reflective metal layer is electroplated on a region of any base island except the chip bonding portion.

[0096] Specifically, a high-reflective metal layer is electroplated on the fourth base island 66 and the fifth base island 67 except for the groove structure of the chip bonding portion.

[0097] Furthermore, the highly reflective metal layer may be a gold-plated layer or a silver-plated layer.

[0098] A highly reflective metal layer is provided on the surface of the base island, so that the fourth base island and the fifth base island can serve as a bonding wire connection medium when no optocoupler chip is placed, while improving the reflectivity of the light emitted by the light-emitting chip and the photoelectric conversion efficiency of the optocoupler device.

[0099] In an optional implementation of this embodiment, a bend is formed at a connection between the second functional area of ​​the second frame unit and the second connecting strip.

[0100] Specifically, Figure 6 As shown, Figure 6 A side view schematic diagram of the second frame unit structure in the second embodiment of the present invention is shown, wherein a bend is formed at the connection between the second frame unit 32 and the second connecting strip 24, and the bending angle α2 is 45°-90°, specifically a value among 45°, 60°, 75°, and 90°, and the bending height h2 is 0.4mm-0.8mm, specifically a value among 0.4mm, 0.5mm, 0.6mm, 0.7mm, and 0.8mm, which is determined according to actual design requirements.

[0101] If the bending angle is set too small, the functional area will be too small, affecting the position of the subsequent die bonding wire. If the bending height is too low, the arc height of the welding wire will be too low, making it impossible to perform welding. If the bending height is too high, the distance from the top of the welding wire arc to the surface of the package will be too short and the thickness will be too thin, affecting the airtightness of the optocoupler device.

[0102] In an optional implementation of this embodiment, the material of the second frame unit is one or more alloys of aluminum, iron, and copper.

[0103] In an optional implementation of this embodiment, Figure 7 As shown, Figure 7 A schematic diagram of the overlapping structure of the lead frame of the optocoupler in Embodiment 2 of the present invention is shown, wherein the first lead frame 81 and the second lead frame 82 are overlapped with each other, the first frame unit arranged on the first lead frame 81 and the second frame unit arranged on the second lead frame 82 are overlapped one by one, and the light-emitting chip arranged on the base island of the first lead frame 81 and the photosensitive chip arranged on the base island of the second lead frame 82 are arranged opposite to each other.

[0104] In summary, embodiment 2 of the present invention provides a stacking structure of a lead frame of an optocoupler, wherein the stacking structure of the lead frame of the optocoupler includes a lead frame in embodiment 1, provided with a first frame module, and a fourth connecting bridge and a fifth connecting bridge in a T shape are provided between adjacent first frame units in the same module, which can be used to improve the connection strength and support strength of the base island away from the connecting strip, reduce the risk of deformation due to jitter and vibration, improve the reliability and stability of the lead frame, and improve the production efficiency and quality of the optocoupler products; during packaging, the T-shaped connecting bridge can narrow the drainage glue path between adjacent frame units, reduce the glue usage of the inner layer packaging body, and reduce manufacturing costs.

[0105] Embodiment 3

[0106] Embodiment 3 of the present invention provides a photoelectric coupler, which includes a plurality of frame units, a plurality of optocoupler chips, bonding wires, and a package body. The number of the plurality of frame units is 2N, where N is a positive integer, wherein N frame units are the first frame units described in Embodiment 1, and N frame units are the second frame units described in Embodiment 2. The functional areas of the first frame units and the functional areas of the second frame units are arranged one by one opposite to each other, the plurality of optocoupler chips and bonding wires are arranged on the plurality of frame units, and the package body integrally packages and covers the functional areas of the plurality of frame units, the plurality of optocoupler chips, and the bonding wires, and the pins of the plurality of frame units extend out of the package body and are bent toward the same side outside the package body.

[0107] In an optional implementation of this embodiment, Figure 8 As shown, Figure 8 A schematic diagram of the structure of the optocoupler in the third embodiment of the present invention is shown. The optocoupler 9 is a dual-channel optocoupler, including four frame units, two of which are the first frame units 91 in the first embodiment, and two are the second frame units 92 in the second embodiment. The first functional area of ​​the first frame unit 91 and the second functional area of ​​the second frame unit 92 are arranged one by one opposite to each other. The plurality of optocoupler chips and bonding wires are arranged on the first frame unit 91 and the second frame unit 92 according to actual design requirements. The package body 93 integrally packages and covers the first functional area of ​​the first frame unit 91, the second functional area of ​​the second frame unit 92, the plurality of optocoupler chips, and the bonding wires. The pins 94 of the first frame unit 91 and the second frame unit 92 extend out of the package body 93 and are bent toward the same side outside the package body 93.

[0108] In an optional implementation of this embodiment, the package body 93 includes an outer package body 95 and an inner package body 96, the inner package body 96 encapsulates and covers the functional areas of the several frame units, several optocoupler chips, and bonding wires, and the outer package body 95 covers the inner package body 96.

[0109] In an optional implementation of this embodiment, Fig. 9 As shown, Fig. 9 The schematic diagram of the lead frame structure and the stacking schematic diagram of the photocoupler in the third embodiment of the present invention are shown, wherein two first frame units 91 form a first frame module, a T-shaped connection bridge consisting of a fourth connection bridge and a fifth connection bridge is arranged between the first base islands of the two first frame units 91, a photovoltaic generator PVG (PhotovoltaicGenerator) chip or a PDA (Photo Diode Array) chip is placed on the first base islands of the two first frame units 91, and a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) chip, light-emitting chips are placed on the fourth base islands of the two second frame units 92, the PVG chip or PDA chip arranged on the first base island of the first frame unit 91 is connected to the MOSFET chips arranged on the second base island and the third base island based on bonding wires, and the high-reflective metal layer of the first base island is connected based on bonding wires, the MOSFET chip arranged on the second base island is connected to the high-reflective metal layer of the second base island based on bonding wires, the MOSFET chip arranged on the third base island is connected to the high-reflective metal layer of the third base island based on bonding wires, and the light-emitting chip arranged on the fourth base island of the second frame unit 92 is connected to the high-reflective metal layer of the fifth base island based on bonding wires. After the die bonding wires are completed, the two first frame units 91 and the two second frame units 92 are overlapped one by one, wherein the first base island of the first frame unit 91 is opposite to the fourth base island of the second frame unit 92.

[0110] In an optional implementation of this embodiment, Fig.10 As shown, Fig.10 The schematic diagram of the structure of the plastic-sealed inner package of the photoelectric coupler in the third embodiment of the present invention is shown. When the plastic-sealed inner package 96 has a T-shaped connecting bridge structure composed of the fourth connecting bridge 57 and the fifth connecting bridge 58, the width d1 of the drainage rubber path at the overlap of the first frame unit and the second frame unit is one third to one half of the interval D from the first connecting rib 22 to the third connecting rib 25 (the drainage rubber path is Figure 8The width d2 of the drainage rubber channel between the first frame unit and the second frame unit at the overlap is equal to the interval from the fourth connecting bridge 57 to the third connecting rib 25, which is smaller than the interval D from the first connecting rib 22 to the third connecting rib 25, that is:

[0111]

[0112] d2 <D;

[0113] Compared with the traditional inner layer packaging body, it is necessary to fill the space D between the first connecting rib and the third connecting rib during packaging. In this embodiment, after a T-shaped connecting bridge composed of a fourth connecting bridge and a fifth connecting bridge is provided, the space between the fourth connecting bridge and the third connecting rib is used as a drainage glue path. Compared with the original space D between the first connecting rib 22 and the third connecting rib 25 as the drainage glue path, the drainage glue path between adjacent frame units can be narrowed, reducing the amount of glue used in the inner layer packaging body by more than 30%, thereby effectively reducing the manufacturing cost.

[0114] In an optional implementation of this embodiment, Fig.11 As shown, Fig.11 The schematic diagram of the structure of the plastic-sealed outer package of the optocoupler in the third embodiment of the present invention is shown. After the inner package 96 is plastic-sealed, the T-shaped connecting bridge composed of the fourth connecting bridge and the fifth connecting bridge is removed, and the outer package 95 is plastic-sealed.

[0115] In an optional implementation of this embodiment, after the outer packaging body is plastic-sealed, the pins are bent and formed to form a finished photoelectric coupler.

[0116] In summary, embodiment three of the present invention provides an optocoupler, which adopts the first frame unit of the lead frame in embodiment one and the second frame unit in embodiment two, wherein a fourth T-shaped connecting bridge and a fifth connecting bridge are arranged between the first frame units of the first frame module in embodiment one, which can be used to improve the connection strength and support strength of the base island away from the connecting strip, reduce the risk of deformation caused by jitter and vibration, improve the reliability and stability of the lead frame, and improve the production efficiency and quality of the optocoupler product; during packaging, the set T-shaped connecting bridge can narrow the drainage glue path between adjacent frame units, reduce the glue usage of the inner layer packaging body, and reduce manufacturing costs.

[0117] A person of ordinary skill in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0118] In addition, the embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A lead frame for an optocoupler, characterized in that: The lead frame of the photoelectric coupler includes a first lead support and a second lead support, a plurality of mutually parallel first connecting strips are arranged between the first lead support and the second lead support, a plurality of first frame modules are arranged on any of the first connecting strips, any of the first frame modules includes a plurality of first frame units, and the plurality of first frame units of the same first frame module are mirror-distributed up and down; Any one of the first frame units includes a first functional area, the first functional area includes a first base island, a second base island, a third base island, a first connecting bridge, a second connecting bridge, and a third connecting bridge, the first base island is connected to one end of the first connecting bridge, the second base island is connected to one end of the second connecting bridge, the third base island is connected to one end of the third connecting bridge, and the other ends of the first connecting bridge, the second connecting bridge, and the third connecting bridge are connected to the first connecting bar; A fourth connecting bridge is connected between the first base island of any first frame unit of any first frame module and the first base island of the adjacent first frame unit, a fifth connecting bridge is connected between the fourth connecting bridge and the first connecting strip, and the fourth connecting bridge and the fifth connecting bridge are arranged in a T shape.

2. The lead frame of the optocoupler according to claim 1, wherein: The first base island, the second base island and the third base island are arranged in a triangular shape, the first base island is far away from the first connecting strip, the second base island is located on the upper side of the first base island close to the first connecting strip, the third base island is located on the lower side of the first base island close to the first connecting strip, and the second base island and the third base island are symmetrically arranged on both sides of the first connecting bridge.

3. The lead frame of the optocoupler according to claim 1, wherein: The width of the fourth connecting bridge is 0.5 mm-2 mm.

4. The lead frame of the optocoupler according to claim 1, wherein: The width of the fifth connecting bridge is 0.5 mm-2 mm.

5. The lead frame of the optocoupler according to claim 1, wherein: A chip bonding portion for placing an optical coupling chip is arranged on any base island, and the chip bonding portion is a circular groove or a cross-shaped groove.

6. The lead frame of the optocoupler according to claim 5, characterized in that: The depth of the circular groove or the cross-shaped groove is 0.05mm-0.2mm.

7. The lead frame of the optocoupler according to claim 5, characterized in that: The diameter of the circular groove is 0.8mm-2mm.

8. The lead frame of the optocoupler according to claim 5, wherein: The cross side length of the cross-shaped groove is 0.5mm-2mm.

9. The lead frame of the optocoupler according to claim 5, characterized in that: A high-reflective metal layer is electroplated on the area of ​​any base island except the chip bonding portion.

10. The lead frame of the optocoupler according to claim 1, wherein: Any one of the first connecting strips comprises a first connecting rib and a second connecting rib, wherein the first connecting rib and the second connecting rib are parallel to each other; The other end of the first connection bridge, the other end of the second connection bridge, the other end of the third connection bridge, and the other end of the fifth connection bridge are connected to the first connection rib.

11. The lead frame of the optocoupler according to claim 1, wherein: The first frame unit also includes a first pin and a second pin, the first pin and the second pin are perpendicular to the first connecting strip, one end of the first pin and one end of the second pin are connected to the first connecting rib and the first functional area, and the other end of the first pin and the other end of the second pin are connected to the second connecting rib.

12. The lead frame of the optocoupler according to claim 1, wherein: The first lead support and the second lead support are provided with a plurality of groups of butt joint notches, and each group of butt joint notches is symmetrical in the upper and lower parts.

13. The lead frame of the optocoupler according to claim 1, wherein: The first lead support and the second lead support are provided with a plurality of docking holes.

14. The lead frame of the optocoupler according to claim 1, wherein: A bend is formed at the connection between the first connecting bar and the first lead support and the second lead support.

15. The lead frame of the optocoupler according to claim 1, wherein: A bend is formed at a connection between each first frame unit and the first connecting strip where each first frame unit is located.

16. The lead frame of the optocoupler according to claim 1, wherein: The lead frame of the photoelectric coupler is made of one or more alloys of aluminum, iron and copper.

17. A stacked structure of a lead frame of an optocoupler, characterized in that: The stacked structure of the lead frame of the optocoupler includes a first lead frame and a second lead frame, wherein the first lead frame is the lead frame of the optocoupler according to any one of claims 1 to 16, the first lead frame and the second lead frame are stacked on each other, and the frame units arranged on the first lead frame are stacked one-to-one with the frame units arranged on the second lead frame.

18. A photoelectric coupler, characterized in that: The photoelectric coupler comprises a plurality of frame units, a plurality of optical coupling chips, bonding wires, and a package body, the number of the plurality of frame units is 2N, N is a positive integer, wherein N frame units are the first frame units according to any one of claims 1 to 16, and N frame units are the second frame units, the functional areas of the first frame units are arranged opposite to the functional areas of the second frame units one by one, the plurality of optical coupling chips and bonding wires are arranged on the plurality of frame units, the package body integrally packages and covers the functional areas of the plurality of frame units, the plurality of optical coupling chips, and the bonding wires, and the pins of the plurality of frame units extend out of the package body and are bent toward the same side outside the package body; The second frame unit includes a second functional area, and the second functional area includes a fourth base island, a fifth base island, a sixth connecting bridge, and a seventh connecting bridge. The fourth base island is connected to one end of the sixth connecting bridge, the fifth base island is connected to one end of the seventh connecting bridge, and the fourth base island is arranged above the fifth base island.

19. The photocoupler according to claim 18, wherein: The package body comprises an outer package body and an inner package body, the inner package body encapsulates and covers the functional areas of the plurality of frame units, a plurality of optical coupling chips, and bonding wires, and the outer package body covers the inner package body.

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