Hybrid integrated power circuit package

Abstract

The invention relates to the technical field of integrated circuits, in particular to a hybrid integrated power circuit package, which comprises an electro-gas bonding pad and at least one target power device, and is characterized in that the electro-gas bonding pad comprises an input electrode electrical board, an output electrode electrical board and a control electrode electrical board, the target power devices are in one-to-one correspondence with the control electrode electrical boards; each target power device is fixed on the input electrode electrical board, the output electrode of each target power device is bonded with the output electrode electrical board, and the control electrode of each target power device is bonded with the corresponding control electrode electrical board; according to the hybrid integrated power circuit package, heat dissipation function optimization design can be well achieved, wiring is effectively reduced, the package size can be reduced, and independent control over each target power device can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular to a hybrid integrated power circuit package. Background Art

[0002] Semiconductor power devices are essential components in modern electronic and power systems. They have the characteristics of large current flow, high heat generation and high power consumption, which poses a severe challenge to the packaging technology of semiconductor power devices. In addition, as the system size requirements are gradually miniaturized, this further exacerbates the difficulty of heat dissipation of semiconductor power devices.

[0003] Current packaging technology is usually suitable for packaging a single device. If there are multiple semiconductor devices, the packaged system is often large in size and difficult to meet the needs of system miniaturization. If the system size is reduced, it may cause heat dissipation difficulties for the entire system, affecting system performance. Summary of the invention

[0004] The present invention provides a hybrid integrated power circuit package to solve the problem that the existing packaging technology is difficult to simultaneously meet the requirements of system miniaturization and efficient heat dissipation.

[0005] The present invention provides a hybrid integrated power circuit package, comprising:

[0006] An electrical pad and at least one target power device, wherein the electrical pad includes: an input pole electrical plate, an output pole electrical plate, and a control pole electrical plate, and the target power device corresponds to the control pole electrical plate one by one;

[0007] Each of the target power devices is fixed to the input pole electrical plate, its output pole is bonded to the output pole electrical plate, and its control pole is bonded to the corresponding control pole electrical plate.

[0008] In one embodiment of the present invention, the input pole of the target power device is sintered to the input pole electrical plate, the output pole of the target power device is bonded to the output pole electrical plate via a bonding wire, and the control pole of the target power device is connected to the corresponding control pole electrical plate via a bonding wire.

[0009] In one embodiment of the present invention, when there are multiple target power devices, the input poles of the multiple target power devices are connected in parallel through the input pole electrical plate, the output poles of the multiple target power devices are connected in parallel through the output pole electrical plate, and the multiple control pole electrical plates are independently distributed and electrically insulated to independently control the corresponding target power devices.

[0010] In one embodiment of the present invention, the number of the input pole electrical plates is at least one. When there are multiple input pole electrical plates and multiple target power devices, the multiple input pole electrical plates are electrically connected in sequence, and the multiple target power devices are distributed in the input pole electrical plates.

[0011] In one embodiment of the present invention, if the input pole electrical plate includes a first input pole electrical plate and a second input pole electrical plate, and the target power device is multiple, the first input pole electrical plate, the output pole electrical plate, and the second input pole electrical plate are arranged in sequence in the electrical pad;

[0012] A plurality of first control pole electrical plates are provided on a side of the first input pole electrical plate away from the output pole electrical plate, and a plurality of second control pole electrical plates are provided on a side of the second input pole electrical plate away from the output pole electrical plate. The first control pole electrical plates correspond one-to-one to the target power devices in the first input pole electrical plate, and the second control pole electrical plates correspond one-to-one to the target power devices in the second input pole electrical plate. The control pole of the target power device in the first input pole electrical plate is bonded to the corresponding first control pole electrical plate, and the control pole of the target power device in the second input pole electrical plate is bonded to the corresponding second control pole electrical plate.

[0013] In one embodiment of the present invention, it further comprises: a plurality of insulating bases, wherein the insulating bases are arranged between the input pole electrical plate, the output pole electrical plate, and the control pole electrical plate for electrical insulation.

[0014] In one embodiment of the present invention, if the target power device is a MOS tube, the drain of the MOS tube is sintered to the input electrode electrical plate, the source of the MOS tube is bonded to the output electrode electrical plate, and the gate of the MOS tube is bonded to the corresponding control electrode electrical plate.

[0015] In one embodiment of the present invention, if the target power device is an IGBT transistor, the emitter of the IGBT transistor is sintered to the input electrode electrical plate, the collector of the IGBT transistor is bonded to the output electrode electrical plate, and the gate of the IGBT transistor is bonded to the corresponding control electrode electrical plate.

[0016] In one embodiment of the present invention, if the target power device is a thyristor, the anode of the thyristor is sintered to the input electrode electrical plate, the cathode of the thyristor is bonded to the output electrode electrical plate, and the gate of the thyristor is bonded to the corresponding control electrode electrical plate.

[0017] The present invention also provides a method for preparing a hybrid integrated power circuit package as described in any one of the above items, comprising:

[0018] Sintering the target power device to the input pole electrical plate in the electrical pad;

[0019] Bonding the output pole of the target power device to the output pole electrical plate in the electrical pad;

[0020] Furthermore, the control electrode of the target power device is bonded to the corresponding control electrode electrical board to obtain a hybrid integrated power circuit package.

[0021] Beneficial effects of the present invention: The hybrid integrated power circuit package provided by the present invention is provided with an electrical pad and at least one target power device, and an input pole electrical plate, an output pole electrical plate, and a control pole electrical plate are provided on the electrical pad, and the target power device corresponds to the control pole electrical plate one by one; the target power device is fixed to the input pole electrical plate, so that the heat of the target power device is directly transferred to the outside of the package through the input pole electrical plate, thereby realizing the optimized design of the heat dissipation function. Moreover, by bonding the output pole of the target power device to the output pole electrical plate, when there are multiple target power devices, the output poles of the multiple target power devices can be directly connected in parallel through the output pole electrical plate, thereby reducing wiring and facilitating the reduction of the package size. In addition, by bonding the control pole of the target power device to the corresponding control pole electrical plate, the target power device can be independently controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 An exemplary top view of a hybrid integrated power circuit package provided by an embodiment of the present invention;

[0023] Figure 2 is an exemplary cross-sectional view of a hybrid integrated power circuit package provided in one embodiment of the present invention;

[0024] Figure 3 An exemplary schematic diagram of physical connections of a hybrid integrated power circuit package provided by an embodiment of the present invention;

[0025] Figure 4 A schematic flow chart of a method for preparing a hybrid integrated power circuit package provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0027] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0028] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0029] Combine the following Figures 1 to 4 , the hybrid integrated power circuit package provided by the present invention is explained.

[0030] The hybrid integrated power circuit package provided in this embodiment includes:

[0031] An electrical pad and at least one target power device, wherein the electrical pad includes: an input pole electrical plate, an output pole electrical plate, and a control pole electrical plate, and the target power device corresponds to the control pole electrical plate one by one;

[0032] Each of the target power devices is fixed to the input pole electrical plate, its output pole is bonded to the output pole electrical plate, and its control pole is bonded to the corresponding control pole electrical plate.

[0033] It should be noted that the target power device is fixed to the input pole electrical plate by sintering, so that the target power device can be directly cooled by the input pole electrical plate, and the heat dissipation effect is better.

[0034] By bonding the output pole of the target power device to the output pole electrical board, the output poles of multiple target power devices can be directly connected in parallel. It can be understood that when there are multiple target power devices, the output poles of the multiple target power devices are respectively bonded to the output pole electrical board, and the electrical board is used to achieve electrical connection. Therefore, the output poles of the multiple target power devices are directly connected in parallel through the output pole electrical board, which effectively reduces wiring and is conducive to reducing the package size.

[0035] By bonding the control electrode of the target power device to the corresponding control electrode electrical board, each target power device can be independently controlled, thereby achieving control over the overcurrent capacity of the hybrid integrated power circuit package with better controllability.

[0036] It should also be noted that the input pole electrical plate, output pole electrical plate, and control pole electrical plate are all metal plates. By setting the above-mentioned metal plates on the electrical pads, the low resistance characteristics of the metal plates can be utilized to reduce the heat generated by the target power device and achieve low thermal resistance optimization design.

[0037] In addition, the hybrid integrated power circuit package is also compatible with the existing surface mount process and does not require drilling.

[0038] In some embodiments, the input pole of the target power device is sintered to the input pole electrical plate, the output pole of the target power device is bonded to the output pole electrical plate via a bonding wire, and the control pole of the target power device is connected to the corresponding control pole electrical plate via a bonding wire.

[0039] It should be noted that by sintering the input pole of the target power device to the input pole electrical plate, the parallel connection problem of multiple target power devices can be better solved. It is understandable that if there are multiple target power devices, then by sintering the input poles of multiple target power devices to the input pole electrical plate respectively, the input poles of the multiple target power devices can be directly connected in parallel on the input pole electrical plate, thereby effectively reducing wiring and facilitating heat dissipation of the target power devices.

[0040] It should also be noted that the bonding wire may be an aluminum wire or a gold wire.

[0041] It should be mentioned that the output pole electrical board can be bonded with multiple bonding wires, that is, it can be bonded with the output poles of multiple target power devices through bonding wires to ensure the overcurrent capacity of the output poles of the target power devices. In some embodiments, the output pole of a target power device can be bonded to the output pole electrical board through multiple bonding wires to achieve a redundant design. It is understandable that if a bonding wire has a problem, overcurrent can be achieved through the remaining bonding wires.

[0042] In some embodiments, when there are multiple target power devices, the input poles of the multiple target power devices are connected in parallel through the input pole electrical plate, the output poles of the multiple target power devices are connected in parallel through the output pole electrical plate, and the multiple control pole electrical plates are independently distributed and electrically insulated to independently control the corresponding target power devices.

[0043] It should be noted that by setting the above packaging structure, multiple target power devices can be connected in parallel well, and multiple target power devices can be independently controlled, thereby achieving control of the overcurrent capacity of the entire hybrid integrated power circuit package.

[0044] In some embodiments, the number of the input pole electrical plates is at least one. When there are multiple input pole electrical plates and multiple target power devices, the multiple input pole electrical plates are electrically connected in sequence, and the multiple target power devices are distributed in the input pole electrical plates.

[0045] It should be noted that by providing a plurality of input pole electrical plates, the input pole electrical plates can be flexibly provided when there are multiple target power devices, and it is only necessary to ensure that the input pole electrical plates are electrically connected. It is understandable that if the plurality of input pole electrical plates are electrically connected, the input poles of the plurality of target power devices can be connected in parallel.

[0046] Please refer to Figure 1 In some embodiments, if the input pole electrical plate includes a first input pole electrical plate 9 and a second input pole electrical plate 10, and there are multiple target power devices, the first input pole electrical plate 9, the output pole electrical plate 11, and the second input pole electrical plate 10 are arranged in sequence in the electrical pad;

[0047] A plurality of first control pole electric plates (such as Figure 1 The first control pole electric plate 1, the first control pole electric plate 2, the first control pole electric plate 3, the first control pole electric plate 4), the second input pole electric plate 10 is provided with a plurality of second control pole electric plates (such as Figure 1 The first control electrode electric plate corresponds one-to-one to the target power device in the first input electrode electric plate, the second control electrode electric plate corresponds one-to-one to the target power device in the second input electrode electric plate, the control electrode of the target power device in the first input electrode electric plate 9 is bonded to the corresponding first control electrode electric plate, and the control electrode of the target power device in the second input electrode electric plate 10 is bonded to the corresponding second control electrode electric plate.

[0048] It should be noted that in the above embodiment, the entire packaging structure is symmetrically distributed in the horizontal direction. By setting the above packaging structure, the volume occupied by multiple target power devices in parallel can be significantly reduced, the device area can be minimized, and the flexibility is high.

[0049] Please refer to Figure 2 In some embodiments, the hybrid integrated power circuit package further includes: a plurality of insulating bases, wherein the insulating bases are arranged between the input pole electrical plate, the output pole electrical plate, and the control pole electrical plate for electrical insulation.

[0050] It should be noted that, by providing the above-mentioned insulating base, the electrical insulation between different electrical boards can be better ensured to avoid interference between different electrical boards. In some embodiments, the insulating base can be a ceramic base or the like.

[0051] In some embodiments, the hybrid integrated power circuit package further includes: a metal frame, which is a bottom plate or a back plate of the electrical pad and serves as an interface for realizing an airtight sealing cap.

[0052] In some implementations, the electrical pad, the insulating base, and the metal frame are sealed as a whole by brazing to ensure the stability of the entire package.

[0053] In some implementations, if the target power device is a MOS tube (metal oxide semiconductor field effect transistor), the drain of the MOS tube is sintered to the input electrode electrical plate, the source of the MOS tube is bonded to the output electrode electrical plate, and the gate of the MOS tube is bonded to the corresponding control electrode electrical plate.

[0054] In some implementations, if the target power device is an IGBT transistor (insulated gate bipolar transistor), the emitter of the IGBT transistor is sintered to the input pole electrical plate, the collector of the IGBT transistor is bonded to the output pole electrical plate, and the gate of the IGBT transistor is bonded to the corresponding control pole electrical plate.

[0055] In some implementations, if the target power device is a thyristor, the anode of the thyristor is sintered to the input electrode electrical plate, the cathode of the thyristor is bonded to the output electrode electrical plate, and the gate of the thyristor is bonded to the corresponding control electrode electrical plate.

[0056] It should be noted that, through the above arrangement, the packaging of MOS tubes, IGBT transistors, and thyristors can be better achieved, with strong feasibility and low cost.

[0057] Figure 3 For an exemplary schematic diagram of the physical connection of a hybrid integrated power circuit package provided by an embodiment of the present invention, please refer to Figure 3, taking 8 target power devices as an example, 4 of the target power devices are sintered on the first input pole electrical plate, and the other 4 target power devices are sintered on the second input pole electrical plate. The first input pole electrical plate and the second input pole electrical plate are electrically connected to realize the parallel connection of the input poles of the 8 target power devices. The heat generated by the target power device can be directly transferred to the outside of the package through the first input pole electrical plate or the second input pole electrical plate to achieve thermal impedance optimization. The output poles of the 8 target power devices are respectively bonded to the output pole electrical plate through bonding wires to achieve parallel connection through the output pole electrical plate. The control poles of the 8 target power devices are respectively bonded to the corresponding control pole electrical plates (which can be the first control pole electrical plate or the second control pole electrical plate) through bonding wires, and the control pole electrical plates are electrically insulated to realize independent control of each target power device.

[0058] The hybrid integrated power circuit packaging in the above embodiment is explained below by taking a MOS tube as an example.

[0059] Assuming that 8 MOS tubes need to be packaged in parallel, the following structure can be used for packaging.

[0060] First, 8 MOS tubes are sintered to the input pole electrical plate respectively. Specifically, 4 MOS tubes are sintered to the first input pole electrical plate 9, and the other 4 MOS tubes are sintered to the second input pole electrical plate 10, and the first input pole electrical plate 9 and the second input pole electrical plate 10 are electrically connected. In some embodiments, other distribution methods can also be used to complete the sintering of the MOS tube, such as sintering 8 MOS tubes to the same input pole electrical plate. It should be mentioned that sintering the MOS tube to the input pole electrical plate means sintering the drain of the MOS tube to the input pole electrical plate, and, by sintering, the entire MOS tube is fixed on the input pole electrical plate to facilitate heat dissipation.

[0061] Next, the source electrodes of the MOS tubes are bonded to the output electrode electrical plate 11 respectively, so that the source electrodes of the eight MOS tubes are directly connected in parallel through the output electrode electrical plate 11 .

[0062] Finally, the gates of the MOS tubes are bonded to the corresponding control electrode electrical plates respectively, so as to realize independent control of each MOS tube and control of the overcurrent capacity of the hybrid integrated power circuit package.

[0063] Taking the commonly used high-current power devices as an example, the common package size of the commonly used high-current power devices is 10mm (millimeter) × 25mm, and "×" represents the multiplication sign. If the current packaging method is used to package 8 MOS tubes in parallel, the occupied area is 40mm × 50mm. If the hybrid integrated power circuit package provided by the above embodiment is used, the occupied area of ​​the final package is only 24mm × 34mm, which is a 59.2% reduction in area. In addition, the hybrid integrated power circuit package in the above embodiment can also reduce parasitic impedance while improving the reliability of the entire package.

[0064] The hybrid integrated power circuit package in the above embodiment is explained below by taking an IGBT transistor as an example.

[0065] Assuming that 6 IGBT transistors need to be packaged in parallel, the following structure can be used for packaging.

[0066] First, sinter the six IGBT transistors to the input pole electrical plate respectively. Specifically, sinter three IGBT transistors to the first input pole electrical plate 9, and sinter the other three IGBT transistors to the second input pole electrical plate 10, and the first input pole electrical plate 9 and the second input pole electrical plate 10 are electrically connected. It should be mentioned that sintering the IGBT transistor to the input pole electrical plate means sintering the drain of the IGBT transistor to the input pole electrical plate, and, by sintering, the IGBT transistor is fixed on the input pole electrical plate.

[0067] Next, the collectors of the IGBT transistors are bonded to the output electrode electrical plate 11 respectively, so that the collectors of the six IGBT transistors are directly connected in parallel through the output electrode electrical plate 11 .

[0068] Finally, the gates of the IGBT transistors are bonded to the corresponding control electrode electrical plates respectively, so as to realize independent control of each IGBT transistor and control of the overcurrent capability of the hybrid integrated power circuit package.

[0069] The hybrid integrated power circuit package in the above embodiment is explained below by taking an IGBT transistor as an example.

[0070] Assuming that three thyristors need to be packaged in parallel, the following structure can be used for packaging.

[0071] First, three thyristors are sintered to the same input pole electrical plate. Specifically, the anodes of the three thyristors are sintered to the input pole electrical plate to achieve parallel connection of the anodes of the three thyristors, and the three thyristors are fixed to the input pole electrical plate.

[0072] Secondly, the cathodes of the thyristors are bonded to the output pole electrical plate respectively, so that the cathodes of the six thyristors are directly connected in parallel through the output pole electrical plate.

[0073] Finally, the gates of the thyristors are bonded to the corresponding control electrode electrical plates respectively, so as to realize independent control of each thyristor and control of the overcurrent capacity of the hybrid integrated power circuit package.

[0074] Please refer to Figure 4 This embodiment also provides a method for preparing a hybrid integrated power circuit package as described in any one of the above items, comprising:

[0075] S410: Sintering the target power device to the input pole electrical plate in the electrical pad.

[0076] S420: Bonding the output electrode of the target power device to the output electrode electrical plate in the electrical pad.

[0077] S430: Bonding the control electrode of the target power device to the corresponding control electrode electrical board to obtain the hybrid integrated power circuit package.

[0078] It should be noted that the above steps S420 and S430 may be performed in sequence or simultaneously.

[0079] It should also be noted that, by adopting the above-mentioned preparation method, the preparation of the hybrid integrated power circuit package can be well completed, the feasibility is strong and the cost is low.

[0080] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A hybrid integrated power circuit package, characterized in that: include: An electrical pad and at least one target power device, wherein the electrical pad includes: an input pole electrical plate, an output pole electrical plate, and a control pole electrical plate, and the target power device corresponds to the control pole electrical plate one by one; Each of the target power devices is fixed to the input pole electrical plate, its output pole is bonded to the output pole electrical plate, and its control pole is bonded to the corresponding control pole electrical plate.

2. The hybrid integrated power circuit package according to claim 1, characterized in that: The input pole of the target power device is sintered to the input pole electrical plate, the output pole of the target power device is bonded to the output pole electrical plate through a bonding wire, and the control pole of the target power device is connected to the corresponding control pole electrical plate through a bonding wire.

3. The hybrid integrated power circuit package according to claim 1, characterized in that: In the case where there are multiple target power devices, the input poles of the multiple target power devices are connected in parallel through the input pole electrical plate, the output poles of the multiple target power devices are connected in parallel through the output pole electrical plate, and the multiple control pole electrical plates are independently distributed and electrically insulated to independently control the corresponding target power devices.

4. The hybrid integrated power circuit package according to any one of claims 1 to 3, characterized in that: The number of the input pole electrical plates is at least one. When there are multiple input pole electrical plates and multiple target power devices, the multiple input pole electrical plates are electrically connected in sequence, and the multiple target power devices are distributed in the input pole electrical plates.

5. The hybrid integrated power circuit package according to claim 4, characterized in that: If the input pole electrical plate includes a first input pole electrical plate and a second input pole electrical plate, and the target power device is multiple, the first input pole electrical plate, the output pole electrical plate, and the second input pole electrical plate are arranged in sequence in the electrical pad; A plurality of first control pole electrical plates are provided on a side of the first input pole electrical plate away from the output pole electrical plate, and a plurality of second control pole electrical plates are provided on a side of the second input pole electrical plate away from the output pole electrical plate. The first control pole electrical plates correspond one-to-one to the target power devices in the first input pole electrical plate, and the second control pole electrical plates correspond one-to-one to the target power devices in the second input pole electrical plate. The control pole of the target power device in the first input pole electrical plate is bonded to the corresponding first control pole electrical plate, and the control pole of the target power device in the second input pole electrical plate is bonded to the corresponding second control pole electrical plate.

6. The hybrid integrated power circuit package according to claim 1, characterized in that: Also includes: A plurality of insulating bases are provided between the input pole electrical plate, the output pole electrical plate, and the control pole electrical plate for electrical insulation.

7. The hybrid integrated power circuit package according to claim 1, characterized in that: If the target power device is a MOS tube, the drain of the MOS tube is sintered to the input electrode electrical plate, the source of the MOS tube is bonded to the output electrode electrical plate, and the gate of the MOS tube is bonded to the corresponding control electrode electrical plate.

8. The hybrid integrated power circuit package according to claim 1, characterized in that: If the target power device is an IGBT transistor, the emitter of the IGBT transistor is sintered to the input electrode electrical plate, the collector of the IGBT transistor is bonded to the output electrode electrical plate, and the gate of the IGBT transistor is bonded to the corresponding control electrode electrical plate.

9. The hybrid integrated power circuit package according to claim 1, characterized in that: If the target power device is a thyristor, the anode of the thyristor is sintered to the input pole electrical plate, the cathode of the thyristor is bonded to the output pole electrical plate, and the gate of the thyristor is bonded to the corresponding control pole electrical plate.

10. A method for preparing a hybrid integrated power circuit package according to any one of claims 1 to 9, characterized in that: include: Sintering the target power device to the input pole electrical plate in the electrical pad; Bonding the output pole of the target power device to the output pole electrical plate in the electrical pad; Furthermore, the control electrode of the target power device is bonded to the corresponding control electrode electrical board to obtain the hybrid integrated power circuit package.

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