Electronic component packaging device and method

Abstract

The invention relates to the technical field of electronic component packaging, in particular to an electronic component packaging device and method.The electronic component packaging device comprises a base, a glue storage box, a feeding pipe, a glue dispensing unit, a placement rotating unit, an electronic component, a base plate and a bubble removing assembly, the bubble removing assembly comprises a stirring claw, a pressing plate and a vacuum pump, and inclined grooves are formed in the upper portion of the pressing plate and the upper portion of the stirring claw; the glue is stirred by the stirring claw, the pressing plate is pressed downwards to be matched with the stirring claw to move downwards together to press the glue, or the lifting speed is increased to flap the glue, and internal bubbles are discharged; the vacuum pump is started, air in the glue storage box is pumped out, repeated formation of bubbles is avoided, the stored glue is stirred, pressed and flapped, meanwhile, the air in the glue storage box is pumped out, formation of the bubbles during glue dispensing is effectively avoided, and then the glue dispensing quality and effect are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging, and in particular to an electronic component packaging device and method. Background Art

[0002] Currently, in the processing of electronic components, they need to be packaged. The electronic components are placed on a substrate and packaged by dispensing resin or glue. After the sealing is completed, the electronic components are fixed on the substrate to avoid loosening and falling off. However, the traditional dispensing operation is done by manual dispensing, which is inefficient and has poor accuracy.

[0003] In the prior art, a glue dispensing machine is provided, and a slide rail or a mechanical arm is used to move the glue outlet to the connection between the electronic component and the substrate to perform the glue sealing operation, thereby improving efficiency and glue dispensing accuracy.

[0004] However, in the aforementioned prior art, the glue is stored in a glue storage box of the glue dispensing machine before dispensing so that it can be drawn out for use at any time; and there will be a portion of air in the glue cylinder, and external air will also be brought in when glue is added, resulting in a continuous increase in the air in the glue cylinder; when the internal air is in contact with the glue for a long time and the glue flows when it is drawn out, a portion of the air will be integrated into the glue to form bubbles, resulting in bubbles at the connection between the electronic component and the substrate during the final dispensing, affecting the dispensing quality. Summary of the invention

[0005] The purpose of the present invention is to provide an electronic component packaging device and method, so as to solve the problem that in the prior art, the glue is stored in a glue storage box of a glue dispensing machine before dispensing so that it can be drawn out for use at any time; there will be a part of air in the glue cylinder, and external air will be brought in when glue is added, resulting in a continuous increase in the air in the glue cylinder; when the internal air is in contact with the glue for a long time and the glue flows when it is drawn out, a part of the air will be integrated into the glue to form bubbles, resulting in bubbles at the connection between the electronic component and the substrate during the final dispensing, affecting the dispensing quality.

[0006] To achieve the above-mentioned purpose, the present invention provides an electronic component packaging device, comprising a base, a glue storage box, a feed pipe, a glue dispensing unit, a placement and rotation unit, an electronic component, a substrate and a bubble removal component, wherein the glue storage box is placed above the base, the feed pipe is connected to the top of the glue storage box, the glue dispensing unit is connected to one side of the glue storage box, the placement and rotation unit is arranged on the base, the substrate is placed on the placement and rotation unit, and the electronic component is placed above the substrate;

[0007] The debubble assembly includes a stirring claw, a pressing plate and a vacuum pump. The pressing plate has a plurality of flow holes. The pressing plate and the stirring claw are provided with inclined grooves above. The stirring claw is arranged inside the glue storage box. The pressing plate is arranged inside the glue storage box and is sleeved on the outside of the stirring claw. The stirring claw and the pressing plate are adapted to each other. The vacuum pump is arranged above the glue storage box.

[0008] Among them, the dispensing unit includes a telescopic hose, a glue pump, a mobile pipeline, a glue dispensing head and an adjustment mechanism. The glue pump is arranged on one side of the glue storage box, and the two ends of the telescopic hose are respectively connected to the glue pump and one end of the mobile pipeline, and the other end of the mobile pipeline is connected to the glue dispensing head. The adjustment mechanism is arranged on the glue dispensing head.

[0009] Among them, the adjustment mechanism includes a dispensing lifting component and a dispensing telescopic component, the dispensing lifting component is arranged above the base, the dispensing telescopic component is arranged at the output end of the dispensing lifting component, and the output end of the dispensing telescopic component is fixedly connected to the dispensing head.

[0010] Wherein, the rotating unit comprises a rotating component and a turntable, the rotating component is arranged below the base, the output end of the rotating component passes through the base and is fixedly connected to the turntable, the turntable is rotatably connected to the base, and the substrate is placed above the turntable.

[0011] Among them, the bubble removal assembly also includes a control panel, an air detector and a telescopic rod. The control panel is arranged on one side of the base, the air detector is arranged on the inner top wall of the glue storage box, and the two ends of the telescopic rod are respectively fixedly connected to the movable pipe and one side of the glue storage box.

[0012] Among them, the bubble removal component also includes an adjusting unit, which includes a stirring drive component, a stirring lifting component and two pressing lifting components. The stirring drive component is arranged on the inner top wall of the glue storage box, the stirring lifting component is fixedly connected to the output end of the stirring drive component, and the output end of the stirring lifting component is fixedly connected to the stirring claw. The two pressing lifting components are sequentially arranged above the glue storage box, and the output ends of the two pressing lifting components both pass through the glue storage box and are fixedly connected to the pressing plate.

[0013] Wherein, the bubble removal assembly further comprises a scraper unit, and the scraper unit is arranged on the base;

[0014] The glue scraper unit includes a glue scraper transverse moving component, a glue scraper lifting component, a glue scraper telescopic component, a glue scraper rotating mechanism, a camera and an infrared sensor. The glue scraper transverse moving component is arranged above the base, the glue scraper lifting component is arranged at the output end of the glue scraper transverse moving component, the glue scraper telescopic component is arranged at the output end of the glue scraper lifting component, the glue scraper rotating mechanism is arranged at the output end of the glue scraper telescopic component, and the camera and the infrared sensor are both arranged on the glue scraper rotating mechanism.

[0015] Among them, the scraper rotation mechanism includes a fixed groove, a scraper rotating component and a scraper plate, the fixed groove is fixedly connected to the output end of the scraper telescopic component, the scraper rotating component is arranged on one side of the fixed groove, the scraper plate is rotatably connected to the fixed groove and is located inside the fixed groove, the output end of the scraper rotating component is fixedly connected to the scraper plate, and the camera and the infrared sensor are symmetrically arranged on both sides of the scraper plate.

[0016] Wherein, the debubble assembly further comprises two clamping units, and the two clamping units are symmetrically arranged on the base;

[0017] The clamping unit includes a clamping component, a support plate, a pressure sensor and a rubber protective layer. The clamping component is arranged above the base and located on one side of the turntable. The output end of the clamping component is fixedly connected to the support plate. The pressure sensor is arranged on one side of the support plate, and the rubber protective layer is arranged on one side of the pressure sensor.

[0018] The present invention also provides an electronic component packaging method, using the above-mentioned electronic component packaging device, comprising the following steps:

[0019] Add glue to the feed pipe and place the electronic component on the substrate;

[0020] The stirring claw stirs the glue, and the pressing plate presses down, moving down together with the stirring claw to press the glue, or speeding up the lifting and lowering speed to beat the glue to discharge internal bubbles;

[0021] After the pressing plate is pressed down, the glue flows out from the flow hole, and then returns to the bottom of the glue storage box through the chute, and the process is repeated;

[0022] The vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles;

[0023] Starting the glue dispensing unit to dispense glue on the connection between the electronic component and the substrate;

[0024] The placement and rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the dispensing operation is completed;

[0025] The electronic components and the substrate are taken out for subsequent curing and testing, and finally the packaging is completed.

[0026] The present invention provides an electronic component packaging device and method, wherein glue is added to the feed pipe and the electronic component is placed on the substrate; the stirring claw stirs the glue, the pressing plate is pressed down, and the stirring claw moves downward together to press the glue, or the lifting speed is increased to beat the glue to expel internal bubbles; after the pressing plate is pressed down, the glue flows out from the flow hole, and then returns to the bottom of the glue storage box through the inclined groove, and this is repeated; the vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component and the substrate; the placement and rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the glue dispensing operation is completed; through the above-mentioned structural setting, the stored glue is stirred, pressed and beat, and the air in the glue storage box is extracted at the same time, so as to effectively avoid the formation of bubbles during glue dispensing, thereby greatly improving the glue dispensing quality and effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0029] Figure 2 It is a top view of the entire present invention.

[0030] Figure 3 The present invention Figure 2 AA line section view.

[0031] Figure 4 The present invention Figure 1 Enlarged view of the local structure at point B.

[0032] Figure 5 The present invention Figure 3 Enlarged view of the local structure at location C.

[0033] Figure 6 The present invention Figure 3 Enlarged view of the local structure at D.

[0034] Figure 7 It is a schematic diagram of the internal structure of the glue storage box of the present invention.

[0035] Figure 8 It is a flow chart of the steps of the electronic component packaging method of the present invention.

[0036] 1-base, 2-glue storage box, 3-feeding pipe, 4-electronic components, 5-substrate, 6-stirring claw, 7-pressing plate, 8-vacuum pump, 9-flow hole, 10-slanted slot, 11-telescopic hose, 12-glue pump, 13-moving pipeline, 14-glue dispensing head, 15-glue dispensing lifting component, 16-glue dispensing telescopic component, 17-rotating component, 18-turntable, 19-control panel, 20-air detector, 21-telescopic rod, 22-stirring drive component, 23-stirring lifting component, 24-pressing lifting component, 25-glue scraping lateral movement component, 26-glue scraping lifting component, 27-glue scraping telescopic component, 28-camera, 29-infrared sensor, 30-fixed slot, 31-glue scraping rotating component, 32-glue scraping plate, 33-clamping component, 34-support plate, 35-pressure sensor, 36-rubber protective layer. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0038] See also Figures 1 to 7 The present invention provides an electronic component packaging device, including a base 1, a glue storage box 2, a feed pipe 3, a glue dispensing unit, a placement rotating unit, an electronic component 4, a substrate 5 and a bubble removal component, the bubble removal component includes a stirring claw 6, a pressing plate 7 and a vacuum pump 8, the pressing plate 7 has a plurality of flow holes 9, and the pressing plate 7 and the stirring claw 6 are both provided with an inclined groove 10, the glue dispensing unit includes a telescopic hose 11, a glue pump 12, a moving pipeline 13, a glue dispensing head 14 and an adjustment mechanism, the adjustment mechanism includes a glue dispensing lifting component 15 and a glue dispensing telescopic component 16, the placement rotating unit includes a rotating component 17 and a turntable 18, and the bubble removal component also includes a control panel 19, an air detector 20 and a telescopic rod 21, the bubble removal component also includes an adjustment unit, the adjustment unit includes a stirring drive component 22, a stirring lifting component 23 and two pressing lifting components 24, the bubble removal component also includes a scraper unit, the scraper unit includes a scraper transverse movement component 25, a scraper lifting component 26, a scraper telescopic component 27, a scraper rotation mechanism, a camera 28 and an infrared sensor 29, the scraper rotation mechanism includes a fixing groove 30, a scraper rotation component 31 and a scraper plate 32, the bubble removal component also includes two clamping units, the clamping unit includes a clamping component 33, a support plate 34, a pressure sensor 35 and a rubber protective layer 36.

[0039] Among them, the glue storage box 2 is placed above the base 1, the feed pipe 3 is connected to the top of the glue storage box 2, the glue dispensing unit is connected to one side of the glue storage box 2, the placement and rotation unit is arranged on the base 1, the substrate 5 is placed on the placement and rotation unit, the electronic component 4 is placed above the substrate 5, the pressing plate 7 has a plurality of flow holes 9, and the pressing plate 7 and the stirring claw 6 are provided with inclined grooves 10 above, the stirring claw 6 is arranged inside the glue storage box 2, the pressing plate 7 is arranged inside the glue storage box 2, and is sleeved on the outside of the stirring claw 6, the stirring claw 6 and the pressing plate 7 are adapted to each other, and the vacuum pump 8 is arranged above the glue storage box 2. A through hole is provided in the middle of the pressing plate 7 to match the stirring claw 6; a valve is installed on the feeding tube 3, glue is added to the feeding tube 3, and the electronic component 4 is placed on the substrate 5; the stirring claw 6 stirs the glue, and the pressing plate 7 is pressed down, and moves down together with the stirring claw 6 to press the glue, or the lifting speed is increased to beat the glue to expel internal bubbles; after the pressing plate 7 is pressed down, the glue flows out from the flow hole 9, and then returns to the bottom of the glue storage box 2 through the inclined groove 10, and this is repeated; the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component 4 and the substrate 5; the placement and rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the glue dispensing operation is completed; the electronic component 4 and the substrate 5 are taken out for subsequent curing and testing, and finally the packaging is completed.

[0040] Secondly, the glue pump 12 is arranged at one side of the glue storage box 2, the two ends of the telescopic hose 11 are respectively connected to the glue pump 12 and one end of the mobile pipe 13, the other end of the mobile pipe 13 is connected to the glue dispensing head 14, and the adjustment mechanism is arranged on the glue dispensing head 14. The adjustment mechanism drives the mobile pipe 13 to move so that the glue dispensing head 14 is close to the connection between the electronic component 4 and the substrate 5, and the telescopic hose 11 is adjusted to be telescopic, and then the glue pump 12 is started to extract the glue from the glue storage box 2 for dispensing.

[0041] At the same time, the dispensing lifting component 15 is arranged above the base 1, and the dispensing telescopic component 16 is arranged at the output end of the dispensing lifting component 15, and the output end of the dispensing telescopic component 16 is fixedly connected to the dispensing head 14. The dispensing lifting component 15 is an electric slide rail, and the dispensing telescopic component 16 is a cylinder; when the dispensing lifting component 15 is started, the dispensing telescopic component 16 is driven to rise and fall, and the dispensing height is adjusted. At the same time, when the dispensing telescopic component 16 is started, the dispensing head 14 is driven to extend, and the front and rear dispensing distance is adjusted.

[0042] In addition, the rotating component 17 is arranged below the base 1, the output end of the rotating component 17 passes through the base 1 and is fixedly connected to the turntable 18, the turntable 18 is rotatably connected to the base 1, and the substrate 5 is placed above the turntable 18. The rotating component 17 is a self-locking motor; when the rotating component 17 is started, the turntable 18 is driven to rotate to adjust the dispensing position.

[0043] Then, the control panel 19 is arranged on one side of the base 1, the air detector 20 is arranged on the inner top wall of the glue storage box 2, and the two ends of the telescopic rod 21 are respectively fixedly connected to the mobile pipe 13 and one side of the glue storage box 2. The control panel 19 is electrically connected to each device, so that the staff can perform glue dispensing operations by operating the control panel 19. The air detector 20 detects the air content inside the glue storage box 2. When the air content is detected to be more than 1%, the vacuum pump 8 is started; or when stirring and pressing the glue, the vacuum pump 8 is continuously started, so as to discharge the air in the glue in time to avoid the formation of bubbles again. In addition, when the mobile pipe 13 moves, the telescopic rod 21 follows the telescopic movement to maintain the stability of the mobile pipe 13.

[0044] Furthermore, the regulating unit includes a stirring driving component 22, a stirring lifting component 23 and two pressing lifting components 24. The stirring driving component 22 is arranged on the inner top wall of the glue storage box 2. The stirring lifting component 23 is fixedly connected to the output end of the stirring driving component 22. The output end of the stirring lifting component 23 is fixedly connected to the stirring claw 6. The two pressing lifting components 24 are sequentially arranged above the glue storage box 2. The output ends of the two pressing lifting components 24 both penetrate the glue storage box 2 and are fixedly connected to the pressing plate 7. The stirring driving component 22 is a motor, the stirring lifting component 23 is a cylinder, and the pressing lifting component 24 is a cylinder; the stirring driving component 22 drives the stirring claw 6 to rotate, stirs the glue, and helps to discharge bubbles. The pressing lifting component 24 is started to drive the pressing plate 7 to move downward.

[0045] Furthermore, the scraper unit is arranged on the base 1; the scraper lateral movement component 25 is arranged above the base 1, the scraper lifting component 26 is arranged at the output end of the scraper lateral movement component 25, the scraper telescopic component 27 is arranged at the output end of the scraper lifting component 26, the scraper rotation mechanism is arranged at the output end of the scraper telescopic component 27, and the camera 28 and the infrared sensor 29 are both arranged on the scraper rotation mechanism. The scraper lateral movement component 25 is an electric slide rail, the scraper lifting component 26 is an electric slide rail, and the scraper telescopic component 27 is a cylinder; the scraper lateral movement component 25 and the scraper lifting component 26 cooperate to adjust the scraper position in lateral movement and up and down, the scraper rotation mechanism can adjust the scraper angle, the scraper telescopic component 27 is activated, and the front and rear positions of the scraper can be adjusted, the camera 28 and the infrared sensor 29 shoot the scraper position, transmit the information to the control panel 19, and move to the appropriate scraper position after calculation.

[0046] Thus, the fixed groove 30 is fixedly connected to the output end of the scraper telescopic component 27, the scraper rotating component 31 is arranged at one side of the fixed groove 30, the scraper plate 32 is rotatably connected to the fixed groove 30 and is located inside the fixed groove 30, the output end of the scraper rotating component 31 is fixedly connected to the scraper plate 32, and the camera 28 and the infrared sensor 29 are symmetrically arranged on both sides of the scraper plate 32. The fixed groove 30 supports the scraper rotating component 31, and the scraper rotating component 31 is a self-locking motor. When the scraper rotating component 31 is started, the scraper plate 32 is driven to rotate, the scraper angle is adjusted, and the glue is scraped by the scraper plate 32 to scrape the glue at the glue dispensing of the electronic component 4 and the substrate 5, so as to flatten the glue after dispensing, thereby improving the dispensing quality, ensuring the uniformity of dispensing, and further discharging bubbles formed during dispensing.

[0047] Finally, the two clamping units are symmetrically arranged on the base 1; the clamping component 33 is arranged above the base 1 and located on one side of the turntable 18, the output end of the clamping component 33 is fixedly connected to the support plate 34, the pressure sensor 35 is arranged on one side of the support plate 34, and the rubber protective layer 36 is arranged on one side of the pressure sensor 35. The clamping component 33 is a cylinder, and the clamping component 33 is started to drive the support plate 34 to move, and contact the substrate 5 through the rubber protective layer 36, thereby clamping and fixing the substrate 5 to avoid deviation, and the pressure sensor 35 detects the clamping pressure to avoid damage to the substrate 5 due to excessive clamping force.

[0048] When using an electronic component packaging device of the present embodiment, glue is added to the feed pipe 3, and the electronic component 4 is placed on the substrate 5; the stirring claw 6 stirs the glue, and after the stirring is completed, the pressing plate 7 and the stirring claw 6 are moved to the same horizontal line, and then the pressing plate 7 is pressed down, and the stirring claw 6 moves down together to press the glue, so that the glue flows out from the flow hole 9, and then returns to the bottom of the glue storage box 2 through the inclined groove 10, and the bubbles inside the glue are squeezed out; after the extrusion is completed, the lifting speed of the pressing plate 7 is accelerated, and the glue is patted to discharge the internal bubbles; at the same time, the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the regulating machine is started The structure adjusts the position of the dispensing head 14, and then starts the glue pump 12 to extract glue and dispense glue to the connection between the electronic component 4 and the substrate 5; the turntable 18 rotates to drive the electronic component 4 and the substrate 5 to rotate and adjust the angle until the dispensing operation is completed; at this time, the scraper plate 32 is used to scrape the glue on the dispensing points of the electronic component 4 and the substrate 5 to flatten the glue after dispensing, thereby improving the quality of dispensing, ensuring the uniformity of dispensing, and further discharging bubbles formed during dispensing; through the above-mentioned structural setting, the stored glue is stirred, pressed and patted, and the air in the glue storage box 2 is extracted at the same time, so as to effectively avoid the formation of bubbles during dispensing, thereby greatly improving the quality and effect of dispensing.

[0049] See also Figure 8 The present invention also provides an electronic component packaging method, comprising the following steps:

[0050] S1: Add glue to the feed pipe 3 and place the electronic component 4 on the substrate 5;

[0051] S2: The stirring claw 6 stirs the glue, and the pressing plate 7 presses down, and moves down together with the stirring claw 6 to press the glue, or accelerates the lifting speed to beat the glue to discharge internal bubbles;

[0052] S3: After the pressing plate 7 is pressed down, the glue flows out from the flow hole 9, and then returns to the bottom of the glue storage box 2 through the chute 10, and the process repeats;

[0053] S4: The vacuum pump 8 is started to extract the air inside the glue storage box 2 to prevent bubbles from forming repeatedly;

[0054] S5: starting the glue dispensing unit to dispense glue on the connection between the electronic component 4 and the substrate 5;

[0055] S6: The placement and rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the dispensing operation is completed;

[0056] S7: taking out the electronic component 4 and the substrate 5 for subsequent curing and testing to finally complete the packaging.

[0057] Among them, the feed pipe 3 adds glue and places the electronic component 4 on the substrate 5; the stirring claw 6 stirs the glue, and the pressing plate 7 is pressed down, and moves down together with the stirring claw 6 to press the glue, or the lifting speed is increased to beat the glue to expel internal bubbles; after the pressing plate 7 is pressed down, the glue flows out from the flow hole 9, and then returns to the bottom of the glue storage box 2 through the inclined groove 10, and this is repeated; the vacuum pump 8 is started to extract the air inside the glue storage box 2 to avoid repeated formation of bubbles; the glue dispensing unit is started to dispense glue to the connection between the electronic component 4 and the substrate 5; the placement and rotation unit drives the electronic component 4 and the substrate 5 to rotate and adjust the angle until the glue dispensing operation is completed; the electronic component 4 and the substrate 5 are taken out for subsequent curing and testing, and finally the packaging is completed.

[0058] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An electronic component packaging device, comprising a base, a glue storage box, a feed pipe, a glue dispensing unit, a placement and rotation unit, an electronic component and a substrate, wherein the glue storage box is placed above the base, the feed pipe is connected to the top of the glue storage box, the glue dispensing unit is connected to one side of the glue storage box, the placement and rotation unit is arranged on the base, the substrate is placed on the placement and rotation unit, and the electronic component is placed above the substrate, characterized in that: Also included is a bubble removal assembly; The debubble assembly includes a stirring claw, a pressing plate and a vacuum pump. The pressing plate has a plurality of flow holes. The pressing plate and the stirring claw are provided with inclined grooves above. The stirring claw is arranged inside the glue storage box. The pressing plate is arranged inside the glue storage box and is sleeved on the outside of the stirring claw. The stirring claw and the pressing plate are adapted to each other. The vacuum pump is arranged above the glue storage box.

2. The electronic component packaging device according to claim 1, characterized in that: The glue dispensing unit includes a telescopic hose, a glue pump, a movable pipeline, a glue dispensing head and an adjusting mechanism. The glue pump is arranged on one side of the glue storage box. The two ends of the telescopic hose are respectively connected to the glue pump and one end of the movable pipeline. The other end of the movable pipeline is connected to the glue dispensing head. The adjusting mechanism is arranged on the glue dispensing head.

3. The electronic component packaging device according to claim 2, characterized in that: The adjustment mechanism includes a dispensing lifting component and a dispensing telescopic component. The dispensing lifting component is arranged above the base, and the dispensing telescopic component is arranged at the output end of the dispensing lifting component. The output end of the dispensing telescopic component is fixedly connected to the dispensing head.

4. The electronic component packaging device according to claim 3, characterized in that: The rotating unit comprises a rotating component and a turntable. The rotating component is arranged below the base. The output end of the rotating component passes through the base and is fixedly connected to the turntable. The turntable is rotatably connected to the base. The substrate is arranged above the turntable.

5. The electronic component packaging device according to claim 4, characterized in that: The bubble removal assembly also includes a control panel, an air detector and a telescopic rod. The control panel is arranged on one side of the base, the air detector is arranged on the inner top wall of the glue storage box, and the two ends of the telescopic rod are respectively fixedly connected to the movable pipe and one side of the glue storage box.

6. The electronic component packaging device according to claim 5, characterized in that: The debubble assembly also includes an adjusting unit, which includes a stirring drive component, a stirring lifting component and two pressing lifting components. The stirring drive component is arranged on the inner top wall of the glue storage box, the stirring lifting component is fixedly connected to the output end of the stirring drive component, and the output end of the stirring lifting component is fixedly connected to the stirring claw. The two pressing lifting components are sequentially arranged above the glue storage box, and the output ends of the two pressing lifting components both pass through the glue storage box and are fixedly connected to the pressing plate.

7. The electronic component packaging device according to claim 6, characterized in that: The bubble removal assembly further includes a scraper unit, and the scraper unit is disposed on the base; The glue scraper unit includes a glue scraper transverse moving component, a glue scraper lifting component, a glue scraper telescopic component, a glue scraper rotating mechanism, a camera and an infrared sensor. The glue scraper transverse moving component is arranged above the base, the glue scraper lifting component is arranged at the output end of the glue scraper transverse moving component, the glue scraper telescopic component is arranged at the output end of the glue scraper lifting component, the glue scraper rotating mechanism is arranged at the output end of the glue scraper telescopic component, and the camera and the infrared sensor are both arranged on the glue scraper rotating mechanism.

8. The electronic component packaging device according to claim 7, characterized in that: The scraper rotating mechanism includes a fixed groove, a scraper rotating component and a scraper plate. The fixed groove is fixedly connected to the output end of the scraper telescopic component. The scraper rotating component is arranged on one side of the fixed groove. The scraper plate is rotatably connected to the fixed groove and is located inside the fixed groove. The output end of the scraper rotating component is fixedly connected to the scraper plate. The camera and the infrared sensor are symmetrically arranged on both sides of the scraper plate.

9. The electronic component packaging device according to claim 8, characterized in that: The debubble assembly further comprises two clamping units, and the two clamping units are symmetrically arranged on the base; The clamping unit includes a clamping component, a support plate, a pressure sensor and a rubber protective layer. The clamping component is arranged above the base and located on one side of the turntable. The output end of the clamping component is fixedly connected to the support plate. The pressure sensor is arranged on one side of the support plate, and the rubber protective layer is arranged on one side of the pressure sensor.

10. An electronic component packaging method, using the electronic component packaging device according to claim 9, characterized in that: The steps include: Add glue to the feed pipe and place the electronic component on the substrate; The stirring claw stirs the glue, and the pressing plate presses down, moving down together with the stirring claw to press the glue, or speeding up the lifting and lowering speed to beat the glue to discharge internal bubbles; After the pressing plate is pressed down, the glue flows out from the flow hole, and then returns to the bottom of the glue storage box through the chute, and the process is repeated; The vacuum pump is started to extract the air inside the glue storage box to avoid repeated formation of bubbles; Starting the glue dispensing unit to dispense glue on the connection between the electronic component and the substrate; The placement and rotation unit drives the electronic component and the substrate to rotate and adjust the angle until the dispensing operation is completed; The electronic components and the substrate are taken out for subsequent curing and testing, and finally the packaging is completed.

Images