Semiconductor wafer cutting equipment with adjustable cutting frequency

Abstract

The semiconductor wafer cutting equipment with the adjustable cutting frequency comprises a base plate, a groove is formed in the center of the top of the base plate, a machining table is arranged in the groove, a laser head is arranged over the machining table, and the laser head is arranged in the groove. An upper mounting plate and a lower mounting plate which are adjustable in position are respectively mounted at two ends of the top of the base plate. The upper mounting plate can be used for transporting wafers which are not cut yet, the wafers are placed on the top of the arc-shaped plate through the feeding device, then the upper mounting plate is moved to the top of the lower mounting plate, the wafers are adsorbed downwards through negative pressure generated by the through holes, and at the moment, the wafers move downwards to drive the arc-shaped plate to move towards the two ends; at the moment, the spring is in an extension state, when the wafer extrudes the arc-shaped plate until the wafer cannot be supported, the wafer falls on the lower mounting plate to be fixed, and the upper mounting plate and the lower mounting plate are used in cooperation to be used for mounting and fixing wafers of different sizes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a semiconductor wafer cutting device with adjustable cutting frequency. Background Art

[0002] Semiconductor device manufacturing is the foundation of the modern electronics industry. Its manufacturing process includes multiple steps such as wafer growth, wafer cutting, chip manufacturing and packaging. Wafer cutting is a crucial link in the semiconductor manufacturing process. Its quality and efficiency directly affect the quality of subsequent chip processing and packaging, as well as the cost and time of the entire production process.

[0003] When cutting existing semiconductor wafers, mechanical mechanisms are usually used to clamp and fix the wafers. However, when the clamps are rigid, it is easy to damage the wafers. In addition, this clamping has a certain impact on some wafers with irregular outer walls, which may cause unstable clamping.

[0004] Therefore, it is necessary to provide a semiconductor wafer cutting device with adjustable cutting frequency to solve the above technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor wafer cutting device with adjustable cutting frequency to solve the problems existing in the above-mentioned background technology. The technical solution of the present invention provides a solution that is significantly different from the prior art to address the technical problem that the prior art solution is too single.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer cutting device with adjustable cutting frequency, comprising a substrate, a groove is opened in the top center of the substrate, a processing table is arranged inside the groove, a laser head is arranged directly above the processing table, an upper mounting plate and a lower mounting plate with adjustable positions are respectively installed at the two ends of the top of the substrate, a first groove is opened in the center of the front and rear ends of the top of the substrate, and an adjustment mechanism for controlling the left and right movement of the laser head is arranged inside the first groove.

[0007] Preferably, the adjustment mechanism includes a first adjustment rod rotatably connected to the inside of the first slot, a first adjustment seat is installed on the outer wall of the first adjustment rod, a Z-axis is connected to the top of the first adjustment seat, a movable seat is movably installed on the outer wall of the Z-axis, a Y-axis movably connected to the laser head is arranged at the opposite end of the movable seat, a top groove is also provided on the top front end surface of the substrate, and a servo motor for driving the first adjustment rod to rotate is arranged inside the top groove.

[0008] Preferably, a second groove is further provided at the front and rear ends of the top of the base plate, a second adjusting rod is rotatably connected inside the second groove, second adjusting seats are installed at both ends of the outer wall of the second adjusting rod, a mounting seat is installed on the top of the second adjusting seat, the opposite end of the mounting seat on the left side is connected to the upper mounting plate, the opposite end of the mounting seat on the right side is connected to the lower mounting plate, and the bottom of the upper mounting plate is parallel to the top of the lower mounting plate.

[0009] Preferably, a spring is installed on the outer wall of the upper mounting plate, the other end of the spring is connected to an arc-shaped T-shaped plate, the inner side of the arc-shaped T-shaped plate is connected to an arc-shaped plate, and the arc-shaped plate is inclined downward from the outside to the inside.

[0010] Preferably, a circular plate is installed on the inner bottom of the lower mounting plate, and a through hole is penetrated through the top of the circular plate.

[0011] Preferably, a mounting groove is provided at one end of the top of the base plate, a driving device is installed inside the mounting groove, and an output end of the driving device is connected to a rotating rod connected to the second adjusting rod.

[0012] Preferably, a third slot is opened at the top center of the substrate and passes through one end of the processing table. The third slot is rotatably connected to a third adjusting rod inside, and a third adjusting seat is installed on the outer wall of the third adjusting rod. One end of the third adjusting seat is connected to a connecting plate, and the other end of the connecting plate is connected to a fixed plate.

[0013] Preferably, one end of the third adjusting rod is connected to a connecting rod penetrating into the mounting slot, and the connecting rod is connected to the rotating rod by setting a transmission assembly.

[0014] Preferably, an inner groove connected to the third groove is opened inside the processing table, and the top of the inner groove is as large as the through hole.

[0015] Preferably, a protective shell is also provided on the top of the substrate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The upper mounting plate provided in the present invention can be used to transport wafers that have not been cut. The wafer is placed on the top of the arc plate by a loading device, and then the upper mounting plate is moved to the top of the lower mounting plate. The negative pressure generated by the through hole adsorbs the wafer downward. At this time, the downward movement of the wafer will drive the arc plate to move toward both ends. At this time, the spring is in an extended state. When the wafer squeezes the arc plate to the point where it cannot support the wafer, the wafer will fall on the lower mounting plate to be fixed. The upper mounting plate and the lower mounting plate can be used in combination to install and fix wafers of different sizes. When the driving device drives the second adjusting rod to rotate, the third adjusting rod will also be driven to rotate, so that in the process of the upper mounting plate and the lower mounting plate moving toward each other, the third adjusting seat will also move. The third adjusting seat will first seal the inner groove during the movement, and then when the left end of the third adjusting seat is just flush with one end of the inner groove during the continued movement, negative pressure will be formed in the inner cavity formed by the third adjusting seat and the fixed plate during the continued movement, so that the wafer can be adsorbed on the top of the through hole, thereby realizing the automatic position transposition function of the wafer from the upper mounting plate to the lower mounting plate. After the cutting is completed, the upper mounting plate and the lower mounting plate are reset, and the wafer on the lower mounting plate can be unloaded by the unloading device at this time, thereby realizing the fully automatic loading and unloading function of the wafer, which greatly reduces the workload of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A perspective view of the present invention; Figure 2 A three-dimensional diagram of the present invention without the protective housing; Figure 3 A three-dimensional diagram of the upper mounting plate and the lower mounting plate of the present invention when combined; Figure 4 For the present invention Figure 3 An enlarged stereogram of the combination of the upper mounting plate and the lower mounting plate; Figure 5 It is a schematic diagram of the partial connection between the upper mounting plate and the lower mounting plate when combined with the base plate of the present invention.

[0018] In the figure: 1, substrate; 2, processing table; 201, inner groove; 3, laser head; 4, upper mounting plate; 401, spring; 402, arc-shaped T-shaped plate; 403, arc-shaped plate; 5, lower mounting plate; 501, round plate; 502, through hole; 6, first slot; 7, adjustment mechanism; 701, first adjustment rod; 702, first adjustment seat; 703, Z axis; 704, movable seat; 705, Y axis; 706, servo motor; 8, second slot; 9, second adjustment rod; 10, second adjustment seat; 11, mounting seat; 12, mounting slot; 13, driving device; 14, rotating rod; 15, third slot; 16, third adjustment rod; 17, third adjustment seat; 18, connecting plate; 19, fixing plate; 20, connecting rod; 21, protective shell. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0021] See also Figure 1-5 A semiconductor wafer cutting device with adjustable cutting frequency includes a substrate 1, a groove is opened at the center of the top of the substrate 1, a processing table 2 is arranged inside the groove, a laser head 3 is arranged directly above the processing table 2, an upper mounting plate 4 and a lower mounting plate 5 with adjustable positions are respectively installed at the two ends of the top of the substrate 1, a first groove 6 is opened at the center of the front and rear ends of the top of the substrate 1, and an adjustment mechanism 7 for controlling the left and right movement of the laser head 3 is arranged inside the first groove 6.

[0022] like Figure 1-5As shown, the adjustment mechanism 7 includes a first adjustment rod 701 rotatably connected to the inside of the first slot 6, a first adjustment seat 702 is installed on the outer wall of the first adjustment rod 701, a Z-axis 703 is connected to the top of the first adjustment seat 702, a movable seat 704 is movably installed on the outer wall of the Z-axis 703, and a Y-axis 705 movably connected to the laser head 3 is arranged at the opposite end of the movable seat 704, a top groove is also opened on the top front end surface of the substrate 1, and a servo motor 706 that drives the first adjustment rod 701 to rotate is arranged inside the top groove, and the first adjustment rod 701 arranged on the top front end of the substrate 1 is a threaded rod, which is connected to the first adjustment seat 702. The joint seat 702 is threadedly connected, and the first adjustment rod on the rear side is a sliding rod, which is slidably connected to the first adjustment seat 702. By driving the threaded rod to rotate, the second adjustment seat 10 can be driven to move and adjust the left and right position of the laser head 3, so that the laser head 3 can be adjusted to cut at different positions on the wafer, and the set Y-axis 705 and Z-axis 703 can freely adjust the movement of the laser head 3 in the other two directions, and adjusting the position of the laser head 3 is a prior art and will not be elaborated here. The servo motor 706 can control the rotation speed of the threaded rod and thus control the cutting frequency of the laser head 3.

[0023] like Figure 1-5 As shown, a second slot 8 is also provided at the front and rear ends of the top of the base plate 1, and a second adjusting rod 9 is rotatably connected inside the second slot 8. Second adjusting seats 10 are installed at both ends of the outer walls of the second adjusting rod 9, and a mounting seat 11 is installed on the top of the second adjusting seat 10. The opposite end of the mounting seat 11 on the left is connected to the upper mounting plate 4, and the opposite end of the mounting seat 11 on the right is connected to the lower mounting plate 5, and the bottom of the upper mounting plate 4 is parallel to the top of the lower mounting plate 5. The second adjusting rod 9 arranged on the front side is a two-way threaded rod, which is threadedly connected to the second adjusting seat 10, and the second adjustment rod on the rear side is a sliding rod, which is slidably connected to the second adjusting seat 10. By driving the two-way threaded rod to rotate, the two second adjusting seats 10 can be driven to move toward each other, thereby making the upper mounting plate 4 and the lower mounting plate 5 move toward each other and thus combined into one.

[0024] like Figure 1-5 As shown, a spring 401 is installed on the outer wall of the upper mounting plate 4, and the other end of the spring 401 is connected to an arc-shaped T-shaped plate 402, and the inner side of the arc-shaped T-shaped plate 402 is connected to an arc-shaped plate 403, and the arc-shaped plate 403 is inclined downward from the outside to the inside. The upper mounting plate 4 can be used to transport wafers that have not been cut. The wafer is placed on the top of the arc-shaped plate 403 through a loading device, and then the upper mounting plate 4 is moved to the top of the lower mounting plate 5. The wafer is pushed downward by an external force. At this time, the downward movement of the wafer will drive the arc-shaped plate 403 to move toward both ends. At this time, the spring 401 is in an extended state. When the wafer squeezes the arc-shaped plate 403 to the point where it cannot support the wafer, the wafer will fall on the lower mounting plate 5 to complete fixation.

[0025] like Figure 1-5 As shown, a circular plate 501 is installed at the inner bottom of the lower mounting plate 5, and a through hole 502 is opened through the top of the circular plate 501. The through hole 502 can be used in conjunction with the third adjustment seat 17 to form negative pressure adsorption of the wafer.

[0026] like Figure 1-5 As shown, a mounting groove 12 is provided at one end of the top of the substrate 1, and a driving device 13 is installed inside the mounting groove 12. The output end of the driving device 13 is connected to a rotating rod 14 connected to the second adjusting rod 9. The rotation of the second adjusting rod 9 can be controlled by the set driving device 13, and the driving device 13 can be a motor.

[0027] like Figure 1-5 As shown, a third slot 15 is provided at the top center of the substrate 1 and passes through one end of the processing table 2. The third slot 15 is internally rotatably connected to a third adjusting rod 16. A third adjusting seat 17 is installed on the outer wall of the third adjusting rod 16. A connecting plate 18 is connected to one end of the third adjusting seat 17, and a fixing plate 19 is connected to the other end of the connecting plate 18. When the driving device 13 drives the second adjusting rod 9 to rotate, the third adjusting rod 16 is also driven to rotate, thereby realizing that when the upper mounting plate 4 and the lower mounting plate 5 move toward each other, the third adjusting seat 17 will also move.

[0028] like Figure 1-5 As shown, one end of the third adjusting rod 16 is connected to a connecting rod 20 that passes through the mounting groove 12. The connecting rod 20 and the rotating rod 14 are connected by setting a transmission assembly. The transmission assembly enables the connecting rod 20 and the rotating rod 14 to rotate synchronously, thereby enabling the second adjusting rod 9 and the third adjusting rod 16 to work synchronously.

[0029] like Figure 1-5 As shown, an inner groove 201 connected to the third groove 15 is provided inside the processing table 2, and the top of the inner groove 201 is the same size as the through hole 502. The third adjusting seat 17 will first block the inner groove 201 during the movement, and then when the left end of the third adjusting seat 17 is just flush with one end of the inner groove 201 during the continued movement, a negative pressure will be formed in the inner cavity formed by the third adjusting seat 17 and the fixed plate 19 during the continued movement, so that the wafer can be adsorbed on the top of the through hole 502, realizing the automatic transposition function of the wafer from the upper mounting plate 4 to the lower mounting plate 5. After the cutting is completed, the upper mounting plate 4 and the lower mounting plate 5 are reset. At this time, the wafer on the lower mounting plate 5 can be unloaded by the unloading equipment, realizing the fully automatic loading and unloading function of the wafer, which greatly reduces the work intensity of the staff. The loading and unloading equipment can be realized by a rotatable suction cup.

[0030] like Figure 1-5As shown, a protective shell 21 is also provided on the top of the substrate 1, and the protective shell 21 can prevent waste chips from splashing during cutting.

[0031] Working principle: when in use, the wafer is placed on the top of the arc plate 403 through the loading device, and then the upper mounting plate 4 is moved to the top of the lower mounting plate 5, and then the two second adjustment seats 10 are driven to move toward each other by driving the two-way threaded rod to rotate, so that the upper mounting plate 4 and the lower mounting plate 5 move toward each other and are combined into one, and the wafer is pushed downward by external force. At this time, the downward movement of the wafer will drive the arc plate 403 to move toward both ends. At this time, the spring 401 is in an extended state. When the wafer squeezes the arc plate 403 to the point where it cannot support the wafer, the wafer will fall on the lower mounting plate 5 to be fixed. In the process of the driving device 13 driving the second adjusting rod 9 to rotate, it will also drive the third adjusting rod 16 to rotate, thereby realizing the process of the upper mounting plate 4 and the lower mounting plate 5 moving toward each other. During the cutting process, the third adjusting seat 17 will also move. During the movement, the third adjusting seat 17 will first block the inner groove 201. Then, when the left end of the third adjusting seat 17 is flush with one end of the inner groove 201, a negative pressure will be formed in the inner cavity formed by the third adjusting seat 17 and the fixed plate 19 during the continued movement, so that the wafer can be adsorbed on the top of the through hole 502, thereby realizing the automatic position change function of the wafer from the upper mounting plate 4 to the lower mounting plate 5. After the cutting is completed, the upper mounting plate 4 and the lower mounting plate 5 are reset. At this time, the wafer on the lower mounting plate 5 can be unloaded through the unloading equipment, thereby realizing the fully automatic loading and unloading function of the wafer, which greatly reduces the work intensity of the staff. The loading and unloading equipment can be realized by a rotatable suction cup.

[0032] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A semiconductor wafer cutting device with adjustable cutting frequency, comprising a substrate (1), a groove is provided at the top center of the substrate (1), a processing table (2) is provided inside the groove, and a laser head (3) is provided directly above the processing table (2), characterized in that: An upper mounting plate (4) and a lower mounting plate (5) whose positions can be adjusted are respectively mounted at the two ends of the top of the substrate (1); a first slot (6) is provided at the center of the front and rear ends of the top of the substrate (1); and an adjustment mechanism (7) for controlling the left and right movement of the laser head (3) is provided inside the first slot (6).

2. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: The adjustment mechanism (7) comprises a first adjustment rod (701) rotatably connected to the inside of the first slot (6); a first adjustment seat (702) is installed on the outer wall of the first adjustment rod (701); a Z axis (703) is connected to the top of the first adjustment seat (702); a movable seat (704) is movably installed on the outer wall of the Z axis (703); a Y axis (705) movably connected to the laser head (3) is arranged at the opposite end of the movable seat (704); a top groove is also arranged on the top front end surface of the substrate (1); a servo motor (706) for driving the first adjustment rod (701) to rotate is arranged inside the top groove.

3. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: The top front and rear ends of the base plate (1) are also provided with second slots (8), the interior of the second slots (8) is rotatably connected to a second adjustment rod (9), the outer walls of the second adjustment rod (9) are provided with second adjustment seats (10) at both ends, the top of the second adjustment seat (10) is provided with a mounting seat (11), the opposite end of the mounting seat (11) on the left side is connected to an upper mounting plate (4), the opposite end of the mounting seat (11) on the right side is connected to a lower mounting plate (5), and the bottom of the upper mounting plate (4) is parallel to the top of the lower mounting plate (5).

4. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 3, characterized in that: A spring (401) is installed on the outer wall of the upper mounting plate (4); the other end of the spring (401) is connected to an arc-shaped T-shaped plate (402); the inner side of the arc-shaped T-shaped plate (402) is connected to an arc-shaped plate (403); and the arc-shaped plate (403) is inclined downward from the outside to the inside.

5. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 3, characterized in that: A circular plate (501) is installed on the inner bottom of the lower mounting plate (5), and a through hole (502) is provided through the top of the circular plate (501).

6. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: A mounting groove (12) is provided at one end of the top of the base plate (1), a driving device (13) is installed inside the mounting groove (12), and an output end of the driving device (13) is connected to a rotating rod (14) connected to the second adjusting rod (9).

7. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: A third slot (15) is provided at the top centre of the base plate (1) and passes through one end of the processing table (2); a third adjusting rod (16) is rotatably connected inside the third slot (15); a third adjusting seat (17) is mounted on the outer wall of the third adjusting rod (16); one end of the third adjusting seat (17) is connected to a connecting plate (18); and the other end of the connecting plate (18) is connected to a fixing plate (19).

8. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 7, characterized in that: One end of the third adjustment rod (16) is connected to a connecting rod (20) that passes through the installation groove (12), and the connecting rod (20) is connected to the rotating rod (14) by means of a transmission assembly.

9. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: An inner groove (201) communicating with the third groove (15) is provided inside the processing table (2), and the top of the inner groove (201) is as large as the through hole (502).

10. The semiconductor wafer cutting device with adjustable cutting frequency according to claim 1, characterized in that: A protective shell (21) is also provided on the top of the substrate (1).

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