Preparation method of anti-infiltration device and anti-infiltration device

Abstract

The invention belongs to the technical field of liquid containing, and relates to a preparation method of an anti-infiltration device and the anti-infiltration device. The anti-infiltration device is used for preventing to-be-stored liquid from infiltrating a container. The preparation method specifically comprises the following steps: providing an anti-infiltration layer; forming a plurality of first supporting microstructures and a plurality of second supporting microstructures located between two adjacent first supporting microstructures on the anti-infiltration layer; wherein the height of the first supporting microstructures is larger than that of the second supporting microstructures, and the distance between every two adjacent second supporting microstructures is smaller than the diameter of liquid. The anti-infiltration device prepared by the method provided by the scheme can effectively solve the problem that the to-be-stored liquid is suspended on the wall of the container during storage and containing, the utilization rate of the to-be-stored liquid is improved, waste is reduced, the inner wall of the container does not need to be treated by using an acid-base solution or a sand blasting and polishing process, and the cost is reduced. Pollution to the liquid to be stored caused by an acid-base solution or process residual materials is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of liquid holding, and in particular to a method for preparing an anti-infiltration device, an anti-infiltration device, and a containing device with an anti-infiltration function. Background Art

[0002] Liquid gallium can infiltrate the surface of all metals, so metal containers cannot be used as containers for liquid gallium to prevent metal contamination and infiltration. Usually, containers for liquid gallium are made of glass, ceramics or plastics, but liquid gallium also has a certain degree of infiltration on glass, ceramics or plastics, and it is easy to form a liquid film on them. For the most common plastic materials, whether it is polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylonitrile butadiene styrene (ABS) or nylon, after containing liquid gallium, a layer of gallium film is usually attached to the inner wall of the container, which cannot be removed. A 1000ml PE beaker can hang 6g of liquid gallium, a 3L PP bucket can hang 20g of liquid gallium, and a 5L PP bucket can hang 30g of liquid gallium. The larger the volume of the container, the larger its internal surface area, and the more liquid gallium can be suspended.

[0003] In order to reduce the amount of liquid metal gallium attached to the inner wall of the container, hydrochloric acid solution or sodium hydroxide solution is used in the prior art to clean the inner wall of the container, thereby increasing the contact angle between the liquid metal gallium and the plastic surface, so that the gallium film attached to the inner wall shrinks into small balls and falls off; however, the liquid metal gallium will be dissolved by hydrochloric acid or sodium hydroxide, causing losses, and hydrochloric acid or sodium hydroxide will also contaminate the liquid metal gallium, resulting in reduced purity of the liquid metal gallium. In addition, the prior art also uses a passivation method to form a rough surface on the inner wall of the container, so that the contact area between the liquid metal gallium and the inner wall of the container is reduced, the adhesion is reduced, and the amount of liquid metal gallium hanging on the inner wall is reduced to a certain extent. However, the uniformity of the rough surface is difficult to control, and the non-uniform surface is easy to have a good gallium-repellent performance in the rough area, avoiding the hanging of liquid metal gallium, while some areas with lower roughness still have hanging liquid metal gallium. At the same time, no matter whether the inner wall of the container is directly passivated by sandblasting or polishing, the sandblasting material or the polishing material will adhere to the inner wall, thereby causing pollution to the liquid metal gallium, resulting in a decrease in the purity of the liquid metal gallium.

[0004] In summary, the methods of preventing liquid metal gallium from wetting containers in the prior art have some disadvantages. The method of preventing liquid metal gallium from wetting the inner wall of the cleaning device using acid and alkali solutions will dissolve and contaminate the liquid metal gallium, resulting in loss of liquid metal gallium or reduced purity; and the use of sandblasting or polishing process to roughen the inner wall of the container cannot effectively prevent liquid metal gallium from hanging on the wall, and the sandblasting material or polishing material will contaminate the liquid metal gallium, resulting in reduced purity of the liquid metal gallium. Summary of the invention

[0005] To this end, the technical problem to be solved by the present application is to overcome the problem that the method of preventing liquid metal gallium from infiltrating the inner wall of the cleaning device using acid and alkali solutions in the prior art will dissolve and contaminate the liquid metal gallium, resulting in loss of liquid metal gallium or reduced purity; and the use of sandblasting or polishing process to roughen the inner wall of the container cannot effectively prevent liquid metal gallium from hanging on the wall, and the sandblasting material or polishing material will contaminate the liquid metal gallium, resulting in reduced purity of the liquid metal gallium.

[0006] In order to solve the above technical problems, the present application provides a method for preparing an anti-infiltration device, wherein the anti-infiltration device is used to prevent the liquid to be stored from infiltrating the container, comprising: Providing an anti-wetting layer; forming a plurality of first supporting microstructures and a plurality of second supporting microstructures located between two adjacent first supporting microstructures on the anti-wetting layer; Wherein, the height of the first supporting microstructure is greater than the height of the second supporting microstructure, and the distance between two adjacent second supporting microstructures is less than the diameter of the liquid to be stored.

[0007] In the present application, a plurality of first supporting microstructures are formed on the surface of the anti-infiltration layer, and a plurality of second supporting microstructures are formed between two adjacent first supporting microstructures, and the first supporting microstructures are used to reduce the contact area between the liquid to be stored and the anti-infiltration layer. At the same time, the height of the second supporting microstructure is smaller than the first supporting microstructure, and the spacing between adjacent second supporting microstructures is smaller than the diameter of the liquid to be stored. For droplets of liquid to be stored with a smaller diameter on the surface of the anti-infiltration layer, the smaller second supporting microstructure can be used to reduce the contact area between the droplets and the anti-infiltration layer, reduce the adhesion between the liquid to be stored and the anti-infiltration layer, and thus reduce the liquid to be stored. The adhesion of the body to the surface of the container prevents the liquid to be stored from wetting the container; and, since there is air between adjacent supporting microstructures (including the first supporting microstructure and the second supporting microstructure), the liquid to be stored cannot penetrate into the supporting microstructure, but flows on the surface of the supporting microstructure, presenting a phenomenon similar to super-hydrophobicity; in addition, the present application forms a supporting microstructure on the surface of the anti-wetting layer, and there is no need to use acid-base solution or sandblasting and polishing process to treat the container, which not only effectively solves the problem of the liquid to be stored hanging on the container wall during storage and holding, but also improves the utilization rate of the liquid to be stored, reduces waste, and avoids the liquid to be stored from being contaminated.

[0008] Preferably, the liquid to be stored may be liquid metal gallium, liquid metal indium or liquid metal tin, etc.

[0009] Preferably, the method further comprises: A plurality of nano-microstructures are formed on the surface of the first supporting microstructure and the second supporting microstructure away from the anti-wetting layer.

[0010] In the present application, by forming a nano-microstructure on the first supporting microstructure and the second supporting microstructure, the contact area between the liquid to be stored and the anti-wetting layer can be further reduced, the contact angle can be increased, and the adhesion amount of the liquid to be stored can be reduced.

[0011] Preferably, forming a plurality of first supporting microstructures and a plurality of second supporting microstructures between two adjacent first supporting microstructures on the anti-wetting layer comprises: Providing a nanoimprint base mold; Forming a plurality of first grooves distributed at intervals on the nanoimprint base mold, forming a plurality of second grooves distributed at intervals between two adjacent first grooves, and forming a plurality of nano-grooves at the bottom of the first groove and the second groove to obtain a nanoimprint mold; Using the nanoimprint mold to imprint the anti-wetting layer to form a plurality of first protrusions corresponding to the first grooves one by one, a plurality of second protrusions corresponding to the second grooves one by one, and a plurality of nano protrusions corresponding to the plurality of nano grooves one by one; The anti-wetting layer, the plurality of first protrusions, the plurality of second protrusions and the plurality of nano-protrusions are heated and cured, so as to form a plurality of the first supporting microstructures having the nano-microstructure and a plurality of the second supporting microstructures having the nano-microstructure on the anti-wetting layer.

[0012] In the present application, nanoimprinting technology is used to form a first supporting microstructure with a nano-microstructure on the surface and a second supporting microstructure with a nano-microstructure on the surface on the anti-wetting layer. There is no need to use sandblasting or polishing process to prepare the supporting microstructure, thereby avoiding the sandblasting material or polishing material from contaminating the liquid to be stored.

[0013] It is worth noting that due to the small size of the supporting microstructure, it is easy to cause deformation of the supporting microstructure during the nanoimprinting process. However, as long as the formed supporting microstructure can support the liquid to be stored, an air layer at the bottom of the support can reduce the contact area between the liquid to be stored and the anti-wetting layer, reduce the adhesion performance of the liquid to be stored, increase the contact angle, and thus reduce the adhesion amount of the liquid to be stored.

[0014] Preferably, forming a plurality of first supporting microstructures and a plurality of second supporting microstructures between two adjacent first supporting microstructures on the anti-wetting layer comprises: providing a transfer substrate and a temporary substrate; A plurality of first supporting microstructures with a plurality of nano-microstructures on the tops thereof are formed on the transfer substrate, and a plurality of second supporting microstructures with a plurality of nano-microstructures on the tops thereof are formed between two adjacent first supporting microstructures; transferring the plurality of first supporting microstructures and the plurality of second supporting microstructures on the transfer substrate to the temporary substrate; The plurality of first supporting microstructures and the plurality of second supporting microstructures on the temporary substrate are transferred onto the anti-wetting layer.

[0015] In the present application, a first supporting microstructure, a second supporting microstructure and a nano-microstructure with regular shapes are formed on the anti-wetting layer using transfer technology. There is also no need to use sandblasting or polishing processes to prepare the supporting microstructures, thereby avoiding the sandblasting material or polishing material from contaminating the liquid to be stored.

[0016] Preferably, after forming the first supporting microstructure and the second supporting microstructure, the method further comprises: The anti-wetting layer is subjected to a charging treatment so that the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by static electricity.

[0017] In the present application, the anti-wetting layer is charged to maintain the charge inside the anti-wetting layer, and the anti-wetting layer is attached to the surface of the inner wall of the container under a vacuum environment. There is no need to use a cross-linking agent or adhesive containing volatile organic matter to attach the anti-wetting layer to the inner wall of the container. This prevents the anti-wetting layer from being affected by bubbles or impurities between the anti-wetting layer and the inner wall of the container, and at the same time avoids the anti-wetting layer from falling off due to the failure of the cross-linking agent or adhesive due to long-term use.

[0018] Preferably, after the charging treatment, the surface resistivity of the anti-wetting layer in contact with the container is .

[0019] In the present application, the ease of implementation of the charging treatment and the charge retention performance are controlled by the surface resistivity of the anti-wetting layer after the charging treatment. When the charge during the charging treatment is easily transferred to the surface of the anti-wetting layer and escapes to the outside (for example, into the atmosphere), it is difficult to form a charge tendency on the surface or inside of the anti-wetting layer, which causes the anti-wetting layer to be unable to maintain the charge for a long time, and the electrostatic adsorption force is easily reduced, affecting the adsorption effect of the anti-wetting layer inside the container; when the surface resistivity of the anti-wetting layer in contact with the container after the charging treatment exceeds When the anti-wetting layer is used, more complicated equipment or process is needed to treat the anti-wetting layer so that the surface of the anti-wetting layer has high insulation, which increases the cost of live treatment.

[0020] Preferably, the distance between two adjacent first supporting microstructures is smaller than the diameter of the liquid to be stored; and / or The size of the first supporting microstructure is greater than that of the second supporting microstructure.

[0021] In the present application, the distance between adjacent first supporting microstructures is smaller than the diameter of the liquid to be stored, so that the liquid to be stored can be located on the surface of the anti-wetting layer under the support of the first supporting microstructures. For liquid to be stored whose diameter is smaller than the spacing between the first supporting microstructures, it can also be located on the surface of the anti-wetting layer under the support of the second supporting microstructures with smaller sizes, so that the liquid to be stored will not completely contact the surface of the anti-wetting layer and will not wet the container.

[0022] Preferably, the material of the anti-wetting layer is the same as that of the container; and / or The thickness of the anti-wetting layer is 0.1-0.3 mm; and / or The thickness of the anti-infiltration device is 0.3 mm to 0.5 mm; and / or The height of the first supporting microstructure is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device; and / or The plurality of first supporting microstructures are arranged in an equilateral triangle array; and / or Each of the first supporting microstructures is in the shape of a cylinder or a cuboid; and / or There are 3 to 5 second protrusions spaced apart between two adjacent first supporting microstructures; and / or Each of the second supporting microstructures is in the shape of a cylinder or a cuboid; and / or The size of the first supporting microstructure is 80 μm to 100 μm; the height of the first supporting microstructure is 150 μm to 200 μm; the distance between two adjacent first supporting microstructures is 100 μm to 180 μm; and / or The size of the second supporting microstructure is 10 μm to 50 μm; the height of the second supporting microstructure is 20 μm to 60 μm; the distance between two adjacent second supporting microstructures is 10 μm to 20 μm; and / or The shapes of the nanostructures include triangular pyramid, pentagon, hexagon, and claw shape; and / or The size of the nano-microstructure is 1nm-100nm; the height of the nano-microstructure is 1nm-100nm.

[0023] In the present application, the anti-wetting layer is made of the same material as the container, so that its electrical properties are consistent with those of the container surface, thereby ensuring that the electrostatic adsorption process is more stable and effective; the thickness of the anti-wetting layer will not affect the storage of the liquid to be stored, and the thickness of the anti-wetting layer is relatively thin and its own gravity is very small, so it is easier to adhere to the inner wall of the container. At the same time, through the above-mentioned limitation on the height of the supporting microstructure, the supporting microstructure can be firmly fixed on the anti-wetting layer, improving the stability of the first supporting microstructure and the second supporting microstructure. The first supporting microstructure is arranged in an equilateral triangle array, which can ensure that the distance between any two adjacent first supporting microstructures is the same, ensuring the uniformity of the first supporting microstructure, avoiding the problem that the first supporting microstructure cannot support the droplets of the liquid to be stored due to the large spacing between the first supporting microstructures, further improving the super-hydrophobic performance of the anti-wetting device, and reducing the adhesion performance of the liquid to be stored; 3 to 5 second supporting microstructures are set between two adjacent first supporting microstructures, which can not only use the second supporting microstructure to play a good supporting role for the liquid to be stored with a smaller diameter, but also ensure the uniformity of the second supporting microstructure.

[0024] Furthermore, when the liquid to be stored is liquid gallium, since the diameter of the liquid gallium droplets is about 200 μm to 500 μm, by limiting the size of the first supporting microstructure and controlling the distance between adjacent first supporting microstructures to be smaller than the diameter of the liquid gallium droplets, the liquid gallium droplets can be located on the surface of the anti-wetting layer under the support of the first supporting microstructure. At the same time, by limiting the size of the second supporting microstructure and the distance between adjacent second supporting microstructures, even if there are liquid gallium droplets with a diameter smaller than the distance between adjacent first supporting microstructures, the second supporting microstructures arranged between the first supporting microstructures can also have a good supporting effect on them, thereby preventing liquid gallium droplets with smaller diameters from adhering to the surface of the anti-wetting layer.

[0025] Furthermore, the shape of the nano-microstructures can be regular or irregular, and the size of the nano-microstructures is nanometer-scale, similar to the regularly arranged hills (i.e., the first supporting microstructure and the second supporting microstructure) formed on the surface of the anti-infiltration layer. The nano-microstructures on the top of the hills are similar to a raised bunker top growing on the hills, and the gaps in the hills are filled with air, thus forming an extremely thin air layer of only nanometer scale; since the liquid to be stored is larger than these microstructures, the nano-microstructures can support the liquid to be stored. When the liquid to be stored falls on the surface of the anti-infiltration layer, it can only form a few points of contact with the supporting microstructures and the bunker tops through a layer of nanometer air, and cannot further infiltrate, thereby increasing the contact angle and reducing the amount of liquid to be stored.

[0026] The present application also provides an anti-infiltration device, which is prepared by using the above-mentioned method for preparing the anti-infiltration device.

[0027] The present application also provides a containing device with an anti-infiltration function, which includes the above-mentioned anti-infiltration device and a container. The anti-infiltration device is adsorbed on the inner wall of the container to prevent the liquid to be stored from infiltrating the container.

[0028] Preferably, the liquid to be stored is liquid metal gallium, and the container is used to store and contain the liquid metal gallium. The material of the container can be plastic, such as polyvinyl chloride (PVC), Polyethylene (PE), polypropylene (PP) or acrylonitrile butadiene styrene (ABS).

[0029] By adopting an anti-wetting device with a supporting microstructure, it is possible to reduce the adhesion of liquid metal gallium to the inner wall of a plastic container during storage or placement, thereby improving the utilization rate of the liquid metal gallium and reducing waste.

[0030] The preparation method of the anti-infiltration device provided in the present application has the following beneficial effects: (1) The preparation method of the anti-infiltration device provided in the present application includes providing an anti-infiltration layer, forming a plurality of first supporting microstructures on the anti-infiltration layer, and forming a plurality of second supporting microstructures between two adjacent first supporting microstructures; wherein the height of the first supporting microstructure is greater than the height of the second supporting microstructure, and the distance between two adjacent second supporting microstructures is less than the diameter of the liquid to be stored. The present application reduces the contact surface between the liquid to be stored and the anti-infiltration layer by forming supporting microstructures on the anti-infiltration layer, and does not need to use acid-base solutions or sandblasting and polishing processes to treat the container, thereby avoiding the contamination of the liquid to be stored by acid-base solutions or process residual materials, thereby ensuring the purity of the liquid to be stored. The first supporting microstructure is used to reduce the contact area between the liquid to be stored and the anti-wetting layer. At the same time, since the spacing between adjacent second supporting microstructures is smaller than the diameter of the liquid to be stored, for liquid droplets to be stored with a smaller diameter on the surface of the anti-wetting layer, the smaller second supporting microstructure can be used to reduce the contact area between the liquid droplets to be stored and the anti-wetting layer, reduce the adhesion between the liquid to be stored and the anti-wetting layer, thereby reducing the adhesion of the liquid to be stored on the surface of the container, and preventing the liquid to be stored from wetting the container; and, since there is air between adjacent supporting microstructures, the liquid to be stored cannot penetrate into the supporting microstructure, but flows on the surface of the supporting microstructure, presenting a phenomenon similar to super-hydrophobicity, thereby achieving the effect of preventing the liquid to be stored from wetting the anti-wetting device.

[0031] (2) The anti-wetting device prepared by the method provided in the present application effectively solves the problem of the liquid to be stored hanging on the container wall during storage and holding, thereby improving the utilization rate of the liquid to be stored and reducing waste. In addition, there is no need to treat the inner wall of the container, thereby avoiding contamination of the liquid to be stored. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to make the content of the present application easier to understand, the present application is further described in detail below based on the specific embodiments of the present application and in conjunction with the accompanying drawings, wherein: Figure 1 A flow chart of a method for preparing an anti-infiltration device provided in this application; Figure 2 A schematic diagram of the preparation structure of an anti-infiltration device provided in this application; wherein, Figure 2 (a) is a schematic diagram of the anti-wetting layer structure. Figure 2 (b) is a schematic diagram of forming a first supporting microstructure on the anti-wetting layer. Figure 2 (c) is a schematic diagram of forming a second supporting microstructure on the anti-wetting layer. Figure 2(d) is a schematic diagram of forming a nano-microstructure on the first supporting microstructure and the second supporting microstructure; Figure 3 A schematic diagram of the preparation process of an anti-wetting device provided in this application; wherein, Figure 3 (a) is a schematic diagram of the nanoimprint base mold. Figure 3 (b) is a schematic diagram of the structure of forming grooves on the nanoimprint base mold. Figure 3 (c) in the formula is Figure 3 (b) is a schematic diagram of the structure of the anti-wetting layer surface. Figure 3 (d) is a schematic diagram of forming a supporting microstructure on the anti-wetting layer; Figure 4 A schematic diagram of the preparation process of another anti-wetting device provided in this application; wherein, Figure 4 (a) is a schematic diagram of a structure for forming a supporting microstructure on a transfer substrate. Figure 4 (b) is a schematic diagram of the structure of transferring the supporting microstructure on the transfer substrate to the temporary substrate. Figure 4 (c) is a schematic diagram of the structure of transferring the supporting microstructure on the temporary substrate to the anti-wetting layer; Figure 5 A schematic diagram of the structure of the anti-infiltration device provided in the present application attached to the inner wall of the container; Figure 6 A top view of an anti-infiltration device provided in the present application; Figure 7 A schematic diagram of liquid metal gallium droplets with different diameters on the surface of an anti-wetting device provided in the present application; Figure 8 A schematic diagram of forming a nanostructure on the surface of a first supporting microstructure provided in the present application; wherein, Figure 8 (a) is a schematic diagram of a pentagonal nanostructure formed on the surface of the first supporting microstructure. Figure 8 (b) is a schematic diagram of a pyramid-shaped nano-microstructure formed on the surface of the first supporting microstructure; Fig. 9 The optical photographs of the surface of the anti-wetting device prepared by liquid metal gallium in Example 3 and Example 4; wherein, Fig. 9 (a) is an optical photograph of the surface of the anti-wetting device prepared in Example 4 in liquid metal gallium. Fig. 9 (b) is an optical photograph of the surface of the anti-wetting device prepared by liquid metal gallium in Example 3; Fig.10 A schematic diagram showing the comparison of contact angles of liquid metal gallium when the liquid metal gallium is placed in different containers; Explanation of the reference numerals in the drawings in the specification: 1. anti-wetting layer; 2. first supporting microstructure; 3. second supporting microstructure; 4. nano-microstructure; 5. nano-imprint base mold; 6. first groove; 7. second groove; 8. nano-groove; 9. transfer substrate; 10. temporary substrate; 11. container; 12. liquid metal gallium droplet. DETAILED DESCRIPTION

[0033] The present application is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present application and implement it, but the embodiments are not intended to limit the present application.

[0034] There are a large number of related literatures in the prior art that study the wettability of water and oil, and reduce the infiltration of water or oil to reduce the adhesion of dirt, etc. However, due to the large differences between water, oil and liquid gallium metal, including density, surface adhesion ability, chemical bonds between metal bonds and inorganic or organic matter, surface tension, etc., and liquid gallium metal is solid when it is below about 29 degrees Celsius, and liquid when it is above about 29 degrees Celsius, and the solid-liquid transition temperature is low, which is different from the characteristics of water and oil. Therefore, the related technical references about the contact angle and surface adhesion of water and oil in the prior art are not very useful. For example, the surface tension of liquid gallium metal is greater than that of water and oil, and the thin layer of liquid gallium metal surface in contact with air is the surface layer. The distribution of gallium metal atoms in the surface layer is sparser than that of gallium metal atoms in the interior, and the distance between atoms is larger than that in the liquid interior, and the mutual attraction is larger. Since there is a certain relationship between surface tension and contact angle, the surface tension of liquid gallium is relatively large, and its surface excess free energy is relatively large (the surface tension of water and liquid gallium is different, and the macroscopic manifestation is that when a small test tube is filled with water, the surface of the water in the test tube is concave, while when a small test tube is filled with liquid gallium, the surface of the liquid gallium is convex), the small droplets formed will not decompose into more and smaller droplets under the small support contact area when supported by the microstructure; and since metal gallium is a niche semiconductor material that has only emerged in recent years, its application field is relatively small, which also leads to the problem of gallium adhesion inside the container for liquid gallium. The industry rarely pays attention to it. Based on this, the present application provides a method for preparing an anti-wetting device to solve the problem of liquid gallium adhering to the inner wall of the container, thereby improving the utilization rate of liquid gallium. It can be understood that the anti-wetting device prepared by the present application can prevent liquid gallium from wetting the container, and is also suitable for other liquids, such as liquid indium and liquid tin.

[0035] Please refer to Figure 1 and Figure 2 , Figure 1 The figure shows a flow chart of the preparation method of the anti-infiltration device provided in the present application. Figure 2The figure shows a schematic diagram of the preparation structure of the anti-infiltration device provided in the present application. The anti-infiltration device is used to prevent the liquid to be stored from infiltrating the container. The preparation steps of the anti-infiltration device specifically include: S1: Figure 2 As shown in (a) in the figure, an anti-wetting layer 1 is provided.

[0036] The thickness of the anti-wetting layer 1 can be 0.1 mm to 0.3 mm, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm or 0.3 mm. The thickness of the anti-wetting layer 1 will not affect the storage of the liquid to be stored. When the thickness of the anti-wetting layer 1 is thin, its own gravity is very small and it is easier to adhere to the inner wall of the container.

[0037] S2: Figure 2 (b) in the above example is similar to Figure 2 As shown in (c), a plurality of first supporting microstructures 2 are formed on the anti-wetting layer 1 , and a plurality of second supporting microstructures 3 are formed between two adjacent first supporting microstructures 2 .

[0038] The height of the first supporting microstructure 2 is greater than the height of the second supporting microstructure 3 , and the distance between two adjacent second supporting microstructures 3 is less than the diameter of the liquid.

[0039] In one embodiment, if Figure 2 As shown in (d), the method for preparing the anti-wetting device further comprises: S3: forming a plurality of nano-microstructures 4 on the surface of the first supporting microstructure 2 and the second supporting microstructure 3 away from the anti-wetting layer 1 .

[0040] By forming the nano-microstructure 4 on the first supporting microstructure 2 and the second supporting microstructure 3, the contact area between the liquid to be stored and the anti-wetting layer 1 can be further reduced, the contact angle can be increased, and the adhesion amount of the liquid to be stored can be reduced.

[0041] Furthermore, when the liquid to be stored is liquid metal gallium, due to the large surface tension of liquid metal gallium and its large surface excess free energy, the small droplets formed by the liquid metal gallium will not decompose into more and smaller droplets under the smaller support contact surface. Therefore, by forming a nano-microstructure 4 on the top of the first supporting microstructure 2 and the second supporting microstructure 3, the contact area between the liquid metal gallium and the anti-wetting layer 1 can be further reduced, the contact angle can be increased, and the adhesion amount of the liquid metal gallium can be reduced.

[0042] In one embodiment, if Figure 3 As shown, the first supporting microstructure 2, the second supporting microstructure 3 and the nano-microstructure 4 can be prepared using nanoimprint technology, and the specific preparation process includes: S10: Figure 3 As shown in (a) in the figure, a nanoimprint base mold 5 is provided.

[0043] S20: Figure 3 As shown in (b), a plurality of first grooves 6 are formed on the nanoimprint base mold 5, a plurality of second grooves 7 are formed between two adjacent first grooves 6, and a plurality of nano grooves 8 are formed at the bottom of the first grooves 6 and the second grooves 7 to obtain a nanoimprint mold.

[0044] Specifically, after obtaining the nanoimprint mold, the nanoimprint mold can be heated first, so as to facilitate imprinting the grooves on the nanoimprint mold onto the anti-wetting layer 1. The temperature for heating the nanoimprint mold can be 80°C to 120°C.

[0045] S30: Figure 3 As shown in (c), the anti-wetting layer 1 is imprinted using a nanoimprint mold to form a plurality of first protrusions corresponding to the first grooves 6 , a plurality of second protrusions corresponding to the second grooves 7 , and a plurality of nano protrusions corresponding to the plurality of nano grooves 8 .

[0046] S40: Figure 3 As shown in (d), the anti-wetting layer 1, the plurality of first protrusions, the plurality of second protrusions and the plurality of nano-protrusions are heated and cured, thereby forming a plurality of first supporting microstructures 2 having nano-microstructures 4 and a plurality of second supporting microstructures 3 having nano-microstructures 4 on the anti-wetting layer 1.

[0047] The first supporting microstructure 2, the second supporting microstructure 3 and the nano-microstructure 4 are formed on the anti-wetting layer 1 by nanoimprinting technology to obtain the anti-wetting layer 1 including the supporting microstructure. There is no need to use sandblasting or polishing process to prepare the supporting microstructure, thus avoiding the problem of contamination of the stored liquid by sandblasting materials or polishing materials.

[0048] It is worth noting that due to the small size of the supporting microstructure, it is easy to cause deformation of the supporting microstructure during the nanoimprinting process. However, as long as the formed supporting microstructure can support the liquid droplets to be stored, an air layer at the bottom of the support can reduce the contact area between the liquid droplets to be stored and the anti-wetting layer 1, reduce the adhesion performance of the liquid to be stored, increase the contact angle, and thus reduce the adhesion amount of the liquid to be stored.

[0049] In another embodiment, Figure 4 As shown, the first supporting microstructure 2, the second supporting microstructure 3 and the nano-microstructure 4 can also be prepared using nano-transfer printing technology, and the specific preparation process includes: S101: providing a transfer substrate 9 and a temporary substrate 10.

[0050] S102: Figure 4As shown in (a), a plurality of first supporting microstructures 2 having a plurality of nano-microstructures 4 on the tops thereof are formed on a transfer substrate 9, and a plurality of second supporting microstructures 3 having a plurality of nano-microstructures 4 on the tops thereof are formed between two adjacent first supporting microstructures 2.

[0051] In one embodiment, the support microstructures may be formed on the transfer substrate 9 using an injection molding or laser ablation process.

[0052] S103: Figure 4 As shown in (b) , the plurality of first supporting microstructures 2 and the plurality of second supporting microstructures 3 on the transfer substrate 9 are transferred to the temporary substrate 10 .

[0053] S104: Figure 4 As shown in (c) , the plurality of first supporting microstructures 2 and the plurality of second supporting microstructures 3 on the temporary substrate 10 are transferred onto the anti-wetting layer 1 .

[0054] Although the preparation of supporting microstructures on the anti-wetting layer 1 using nano-transfer technology requires two transfers and the process steps are more complicated than nano-imprinting technology, it is possible to form supporting microstructures with regular shapes on the anti-wetting layer 1, thus avoiding the problem of deformation of the supporting microstructures during the preparation process; similarly, there is no need to use sandblasting or polishing processes to prepare supporting microstructures, thus avoiding the problem of sandblasting materials or polishing materials causing contamination to the stored liquid.

[0055] In one embodiment, the anti-infiltration device prepared in the above embodiment is arranged on the inner wall of the container, so as to obtain a holding device with an anti-infiltration function. Specifically, after forming the supporting microstructure on the anti-infiltration layer 1, the following steps are further included: S4: Figure 5 As shown, the anti-wetting layer 1 is subjected to a charging treatment so that the anti-wetting layer 1 after the charging treatment is adsorbed on the inner wall of the container 11 by static electricity.

[0056] By subjecting the anti-wetting layer 1 to a charging treatment, the charge is maintained inside the anti-wetting layer, and the anti-wetting layer 1 is attached to the surface of the inner wall of the container 11 under a vacuum environment. There is no need to use a cross-linking agent or adhesive containing volatile organic matter to attach the anti-wetting layer 1 to the inner wall of the container 11, thereby preventing the anti-wetting layer 1 from being affected by bubbles or impurities between the anti-wetting layer 1 and the inner wall of the container 11, and preventing the anti-wetting layer 1 from falling off due to the failure of the cross-linking agent or adhesive due to long-term use.

[0057] Furthermore, after the charging treatment, the surface resistivity of the side of the anti-wetting layer 1 in contact with the container 11 is .

[0058] The ease of implementation of the charging treatment and the charge retention performance are controlled by the surface resistivity of the anti-wetting layer 1 after the charging treatment. When the charge during the charging treatment is easily transferred to the surface of the anti-wetting layer 1 and escapes to the outside (for example, into the atmosphere), it is difficult to form a charge tendency on the surface or inside of the anti-wetting layer 1, which causes the anti-wetting layer 1 to be unable to maintain the charge for a long time, and the electrostatic adsorption force is easily reduced, affecting the adsorption effect of the anti-wetting layer 1 inside the container 11; when the surface resistivity of the side of the anti-wetting layer 1 in contact with the container 11 after the charging treatment exceeds When the anti-wetting layer 1 is used, more complicated equipment or process is needed to be used to process the anti-wetting layer 1 so that the surface of the anti-wetting layer 1 has high insulation, which increases the cost of the live treatment.

[0059] Furthermore, the material of the anti-wetting layer 1 is the same as that of the container 11 .

[0060] The anti-wetting layer 1 is made of the same material as the container 11 so that its electrical properties are consistent with the surface of the container 11, thereby ensuring that the electrostatic adsorption process is more stable and effective.

[0061] For example, if the material of the container 11 is PVC, the material of the anti-wetting layer 1 is also PVC; PVC, PE, PP, ABS and other plastic materials are common plastic materials on the market, which are easy to purchase or customize and inexpensive.

[0062] Furthermore, the distance between two adjacent first supporting microstructures 2 is smaller than the diameter of the liquid.

[0063] Further, the size of the first supporting microstructure 2 is greater than that of the second supporting microstructure 3 ; or, the width of the first supporting microstructure 2 is greater than that of the second supporting microstructure 3 , and the length of the first supporting microstructure 2 is greater than that of the second supporting microstructure 3 .

[0064] The distance between adjacent first supporting microstructures 2 is smaller than the diameter of the liquid to be stored, so that the liquid to be stored can be located on the surface of the anti-wetting layer 1 with the support of the first supporting microstructures 2. For liquid to be stored whose diameter is smaller than the distance between the first supporting microstructures 2, it can also be located on the surface of the anti-wetting layer 1 with the support of the second supporting microstructures 3 with smaller sizes, so that the liquid to be stored will not completely contact the surface of the anti-wetting layer 1 and will not wet the container 11.

[0065] Furthermore, the thickness of the anti-infiltration device can be 0.3 mm to 0.5 mm, for example, 0.3 mm, 0.32 mm, 0.34 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.44 mm, 0.46 mm, 0.48 mm or 0.5 mm.

[0066] Furthermore, the height of the first supporting microstructure 2 is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device, for example: 1 / 4, 5 / 16, 3 / 8, 7 / 16 or 1 / 2, so that the supporting microstructure (including the first supporting microstructure 2 and the second supporting microstructure 3) can be firmly fixed on the anti-wetting layer 1, thereby improving the stability of the first supporting microstructure 2 and the second supporting microstructure 3.

[0067] In a specific embodiment, if Figure 6 As shown, a plurality of first supporting microstructures 2 are arranged in an equilateral triangle array on the surface of the anti-wetting layer 1; and 3 to 5 second supporting microstructures 3 are spaced apart between two adjacent first supporting microstructures 2.

[0068] The first supporting microstructures 2 are arranged in the form of three vertices of an equilateral triangle, which can ensure that the distance between adjacent first supporting microstructures 2 is constant, ensure the uniformity of the first supporting microstructures 2 on the surface of the anti-infiltration layer 1, and avoid the problem that the first supporting microstructures 2 cannot support the liquid droplets to be stored due to the large spacing between the first supporting microstructures 2, further improve the super-hydrophobic performance of the anti-infiltration device, and reduce the adhesion performance of the liquid to be stored. 3 to 5 second supporting microstructures 3 are set between two adjacent first supporting microstructures 2, which can not only use the second supporting microstructures 3 to play a good supporting role for the liquid droplets to be stored with a smaller diameter, but also ensure the uniformity of the second supporting microstructures 3 on the surface of the anti-infiltration layer 1.

[0069] Further, the first supporting microstructure 2 is in the shape of a cylinder or a cuboid; and / or the second supporting microstructure 3 is in the shape of a cylinder or a cuboid.

[0070] This embodiment does not limit the shapes of the first supporting microstructure 2 and the second supporting microstructure 3. For example, the first supporting microstructure 2 may be in the shape of a cylinder, a cuboid, a cube, or a prism; the second supporting microstructure 3 may be in the shape of a cylinder, a cuboid, a cube, or a prism. When the first supporting microstructure 2 and the second supporting microstructure 3 are in the shape of a cylinder, the size of the first supporting microstructure 2 and the second supporting microstructure 3 is the diameter of the cylinder; when the first supporting microstructure 2 and the second supporting microstructure 3 are in the shape of a cuboid or a cube, the size of the first supporting microstructure 2 and the second supporting microstructure 3 is the length and width of the cross section.

[0071] In a specific embodiment, the size of the first supporting microstructure 2 is 80μm~100μm, for example: 80μm, 83μm, 86μm, 89μm, 92μm, 95μm, 97μm or 100μm; the height of the first supporting microstructure 2 is 150μm~200μm, for example: 150μm, 160μm, 170μm, 180μm, 190μm or 200μm; the distance between two adjacent first supporting microstructures 2 is 100μm~180μm, for example: 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm or 180μm. The size of the second supporting microstructure 3 is 10μm~50μm, for example: 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm or 50μm; the height of the second supporting microstructure 3 is 20μm~60μm, for example: 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm or 60μm; the distance between two adjacent second supporting microstructures 3 is 10μm~20μm, for example: 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm or 20μm.

[0072] It can be understood that the above-mentioned size can be length, width, diameter or radius, etc. For example, the shape of the first supporting microstructure 2 is rectangular, and the length and width of the first supporting microstructure 2 are both 80 μm to 100 μm.

[0073] Specifically, taking liquid gallium as an example, the volume of a drop of liquid gallium is 0.05ml~0.1ml. Under ideal conditions, the shape of the drop is a sphere. According to the sphere volume formula , it can be calculated that the diameter of the droplet is about 200μm~500μm. Due to the high surface free energy of liquid metal gallium, multiple droplets can merge with each other to form larger droplets after contact. The larger the droplet, the heavier it is. Due to the large contact angle between the droplet and the anti-wetting layer 1, its adhesion to the surface of the anti-wetting layer 1 is also poor, so it is easier to roll off the surface of the anti-wetting layer 1. Figure 7The figure shows a schematic diagram of liquid metal gallium droplets 12 with different diameters on the surface of the anti-wetting device. By limiting the size of the first supporting microstructure 2 and controlling the distance between adjacent first supporting microstructures 2 to be smaller than the diameter of the liquid metal gallium droplets 12, the liquid metal gallium droplets 12 can be located on the surface of the anti-wetting layer 1 under the support of the first supporting microstructure 2. At the same time, by limiting the size of the second supporting microstructure 3 and the distance between adjacent second supporting microstructures 3, even if there are liquid metal gallium droplets 12 with a diameter smaller than the distance between adjacent first supporting microstructures 2, the second supporting microstructures 3 arranged between the first supporting microstructures 2 can also have a good supporting effect on them, thereby preventing the liquid metal gallium droplets 12 with smaller diameters from adhering to the surface of the anti-wetting layer 1.

[0074] Further, the shape of the nanostructure 4 includes a triangular pyramid, a pentagon, a hexagon, and a claw shape; and / or the size of the nanostructure 4 is 1nm-100nm, and the height of the nanostructure 23 is 1nm-100nm.

[0075] Specifically, the shape of the nanostructure 4 can be regular or irregular, such as Figure 8 As shown, Figure 8 (a) is a schematic diagram of arranging a pentagonal nanostructure 4 on the surface of the first supporting microstructure 2. Figure 8 (b) is a schematic diagram of setting a pyramid-shaped nanostructure 4 on the surface of the first supporting microstructure 2. The size of the nanostructure 4 is nanometer-scale, similar to the regularly arranged hills (i.e., the first supporting microstructure 2 and the second supporting microstructure 3) formed on the surface of the anti-infiltration layer 1. The nanostructure 4 on the top of the hill is similar to a raised bunker convex top growing on the hill, and the gaps in the hill are filled with air, thus forming an extremely thin air layer of only nanometer scale; since the size of the liquid to be stored is relatively large for these microstructures, the supporting microstructure can support the droplets of the liquid to be stored. When the droplets of the liquid to be stored are on the surface of the anti-infiltration layer 1, they can only form a few points of contact with the supporting microstructure and the bunker convex top through a layer of nanometer air, and cannot be further infiltrated, thereby increasing the contact angle and reducing the amount of attached liquid to be stored.

[0076] Based on the method for preparing the anti-infiltration device provided in the above embodiment, an embodiment of the present application further provides an anti-infiltration device, which is prepared by the method for preparing the anti-infiltration device described above.

[0077] In one embodiment, the liquid to be stored is liquid metal gallium, and the container is used to store and contain the liquid metal gallium. The material of the container can be plastic, such as PVC, PE, PP or ABS.

[0078] By adopting an anti-wetting device with a supporting microstructure, it is possible to reduce the adhesion of liquid metal gallium to the inner wall of a plastic container during storage or placement, thereby improving the utilization rate of the liquid metal gallium and reducing waste.

[0079] The technical solution of the present application is described in more detail below in combination with a plurality of embodiments, but it should be understood that the following embodiments are only for explaining and illustrating the technical solution and do not limit the scope of the present application. Example 1

[0080] This embodiment provides a method for preparing an anti-infiltration device, which specifically includes the following steps: S1: Provide an anti-wetting layer with a thickness of 0.1 mm.

[0081] The material of the anti-wetting layer is PVC material.

[0082] S2: A plurality of first supporting microstructures with a size of 80 μm and a height of 150 μm arranged in an equilateral triangle array are formed on the anti-wetting layer by nanoimprinting technology, and three second supporting microstructures with a size of 10 μm and a height of 20 μm are formed between two adjacent first supporting microstructures.

[0083] The temperature at which the nanoimprint mold is heated during the nanoimprint process is 80° C. The shapes of the first supporting microstructure and the second supporting microstructure are both rectangular parallelepipeds. The distance between two adjacent first supporting microstructures is 100 μm; the distance between two adjacent second supporting microstructures is 10 μm.

[0084] S3: The anti-wetting layer is subjected to a charging treatment, and the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by electrostatic adsorption.

[0085] After the charging treatment, the surface resistivity of the anti-wetting layer away from the supporting microstructure is .

[0086] Example 2 This embodiment provides a method for preparing an anti-infiltration device, which specifically includes the following steps: S1: Provide an anti-wetting layer with a thickness of 0.2 mm.

[0087] The material of the anti-wetting layer is PVC material.

[0088] S2: A plurality of first supporting microstructures with a size of 90 μm and a height of 175 μm arranged in an equilateral triangle array are formed on the anti-wetting layer by nanoimprinting technology, and four second supporting microstructures with a size of 30 μm and a height of 40 μm are formed between two adjacent first supporting microstructures.

[0089] The temperature at which the nanoimprint mold is heated during the nanoimprinting process is 100° C. The shapes of the first supporting microstructure and the second supporting microstructure are both rectangular parallelepipeds; the distance between two adjacent first supporting microstructures is 140 μm; and the distance between two adjacent second supporting microstructures is 15 μm.

[0090] S3: The anti-wetting layer is subjected to a charging treatment, and the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by electrostatic adsorption.

[0091] After the charging treatment, the surface resistivity of the anti-wetting layer away from the supporting microstructure is .

[0092] Example 3 This embodiment provides a method for preparing an anti-infiltration device, which specifically includes the following steps: S1: Provide an anti-wetting layer with a thickness of 0.3 mm.

[0093] The material of the anti-wetting layer is PVC material.

[0094] S2: A plurality of first supporting microstructures with a size of 100 μm and a height of 200 μm arranged in an equilateral triangle array are formed on the anti-wetting layer by nanoimprinting technology, and five second supporting microstructures with a size of 50 μm and a height of 60 μm are formed between two adjacent first supporting microstructures.

[0095] The temperature at which the nanoimprint mold is heated during the nanoimprinting process is 120° C. The shapes of the first supporting microstructure and the second supporting microstructure are both rectangular parallelepipeds; the distance between two adjacent first supporting microstructures is 180 μm; and the distance between two adjacent second supporting microstructures is 20 μm.

[0096] S3: The anti-wetting layer is subjected to a charging treatment, and the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by electrostatic adsorption.

[0097] After the charging treatment, the surface resistivity of the anti-wetting layer away from the supporting microstructure is .

[0098] Example 4 This embodiment provides a method for preparing an anti-infiltration device, which specifically includes the following steps: S1: Provide an anti-wetting layer with a thickness of 0.3 mm.

[0099] The material of the anti-wetting layer is PVC material.

[0100] S2: A plurality of first supporting microstructures with a size of 100 μm and a height of 200 μm arranged in an equilateral triangle array are formed on the anti-wetting layer by nanoimprinting technology, and five second supporting microstructures with a size of 50 μm and a height of 60 μm are formed between two adjacent first supporting microstructures. A nano-microstructure with a size of 100 nm and a height of 100 nm is formed on the surface of the first supporting microstructure and the second supporting microstructure away from the anti-wetting layer.

[0101] The temperature at which the nanoimprint mold is heated during the nanoimprinting process is 120°C; the shapes of the first supporting microstructure and the second supporting microstructure are both rectangular; the shape of the nano-microstructure is a pentagon; the distance between two adjacent first supporting microstructures is 180 μm; the distance between two adjacent second supporting microstructures is 20 μm.

[0102] S3: The anti-wetting layer is subjected to a charging treatment, and the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by electrostatic adsorption.

[0103] After the charging treatment, the surface resistivity of the anti-wetting layer away from the supporting microstructure is .

[0104] like Fig. 9 The optical photographs of the surface of the anti-wetting device prepared by liquid metal gallium in Example 3 and Example 4; wherein, Fig. 9 (a) is an optical photograph of the surface of the anti-wetting device prepared in Example 4 in liquid metal gallium. Fig. 9 (b) is an optical photograph of the surface of the anti-wetting device prepared in Example 3 using liquid metal gallium.

[0105] from Fig. 9 It can be seen that the same liquid metal gallium droplet has different adhesion levels in the two anti-wetting devices. Fig. 9 (a) The spherical shape of the liquid metal gallium droplet is better, and the contact angle between the droplet and the anti-wetting layer is larger, indicating that the liquid metal gallium has less adhesion on the surface of the anti-wetting layer, while Fig. 9 In (b), the spherical shape of the liquid metal gallium droplet is poor, and the contact angle between the droplet and the anti-wetting layer is small, indicating that there is still a risk of liquid metal gallium adhering to the surface of the anti-wetting layer; by comparison, it can be seen that forming a nano-microstructure on the surface of the first supporting microstructure and the second supporting microstructure can further increase the contact angle between the liquid metal gallium and the anti-wetting layer.

[0106] like Fig.10 The figure shows a comparison of the contact angles of liquid metal gallium when the liquid metal gallium is placed in different containers; the ordinate is the contact angle (CA); Fig.10(a) is the contact angle between the liquid metal gallium and the container when the liquid metal gallium is directly placed in a container without an anti-wetting device; Fig.10 (b) is the contact angle between the liquid metal gallium and the anti-wetting layer when the liquid metal gallium is placed in a container with the anti-wetting device prepared by the method provided in Example 3 attached to the inner wall; Fig.10 (c) is the contact angle between the liquid metal gallium and the anti-wetting layer when the liquid metal gallium is placed in a container with the anti-wetting device prepared by the method provided in Example 4 attached to the inner wall.

[0107] from Fig.10 It can be seen that when the liquid metal gallium is directly placed in a container without any treatment, the contact angle between the container and the liquid metal gallium droplet is 81.2°, which shows partial infiltration; after an anti-infiltration layer comprising a first supporting microstructure and a second supporting microstructure is arranged inside the container, the contact angle between the anti-infiltration layer and the liquid metal gallium droplet is 142.6°; this indicates that the anti-infiltration device prepared by the method provided in Examples 1 to 3 of the present application can effectively increase the contact angle between the liquid metal gallium and the anti-infiltration layer, thereby effectively preventing the liquid metal gallium from hanging on the inner wall of the container; in addition, after an anti-infiltration layer comprising a first supporting microstructure, a second supporting microstructure and a nano-microstructure is arranged in the container, the contact angle between the anti-infiltration layer and the liquid metal gallium is 158.5°; this indicates that the anti-infiltration device prepared by the method provided in Example 4 of the present application can further increase the contact angle between the liquid metal gallium and the anti-infiltration layer, and reduce the adhesion amount of the liquid metal gallium.

[0108] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection created by this application.

Claims

1. A method for preparing an anti-wetting device, characterized in that: The anti-wetting device is used to prevent the liquid to be stored from wetting the container, and the method comprises: Providing an anti-wetting layer; forming a plurality of first supporting microstructures and a plurality of second supporting microstructures located between two adjacent first supporting microstructures on the anti-wetting layer; Wherein, the height of the first supporting microstructure is greater than the height of the second supporting microstructure, and the distance between two adjacent second supporting microstructures is less than the diameter of the liquid to be stored.

2. The method for preparing the anti-wetting device according to claim 1, characterized in that: The method further comprises: A plurality of nano-microstructures are formed on the surface of the first supporting microstructure and the second supporting microstructure away from the anti-wetting layer.

3. The method for preparing the anti-wetting device according to claim 1, characterized in that: The method of forming a plurality of first supporting microstructures and a plurality of second supporting microstructures between two adjacent first supporting microstructures on the anti-wetting layer comprises: Providing a nanoimprint base mold; Forming a plurality of first grooves distributed at intervals on the nanoimprint base mold, forming a plurality of second grooves distributed at intervals between two adjacent first grooves, and forming a plurality of nano-grooves at the bottom of the first groove and the second groove to obtain a nanoimprint mold; Using the nanoimprint mold to imprint the anti-wetting layer to form a plurality of first protrusions corresponding to the first grooves one by one, a plurality of second protrusions corresponding to the second grooves one by one, and a plurality of nano protrusions corresponding to the plurality of nano grooves one by one; The anti-wetting layer, the plurality of first protrusions, the plurality of second protrusions and the plurality of nano-protrusions are heated and cured, so as to form a plurality of the first supporting microstructures having the nano-microstructure and a plurality of the second supporting microstructures having the nano-microstructure on the anti-wetting layer.

4. The method for preparing the anti-wetting device according to claim 1, characterized in that: The method of forming a plurality of first supporting microstructures and a plurality of second supporting microstructures between two adjacent first supporting microstructures on the anti-wetting layer comprises: providing a transfer substrate and a temporary substrate; A plurality of first supporting microstructures with a plurality of nano-microstructures on the tops thereof are formed on the transfer substrate, and a plurality of second supporting microstructures with a plurality of nano-microstructures on the tops thereof are formed between two adjacent first supporting microstructures; transferring the plurality of first supporting microstructures and the plurality of second supporting microstructures on the transfer substrate to the temporary substrate; The plurality of first supporting microstructures and the plurality of second supporting microstructures on the temporary substrate are transferred onto the anti-wetting layer.

5. The method for preparing the anti-wetting device according to claim 1, characterized in that: After forming the first supporting microstructure and the second supporting microstructure, the method further includes: The anti-wetting layer is subjected to a charging treatment so that the anti-wetting layer after the charging treatment is adsorbed on the inner wall of the container by static electricity.

6. The method for preparing the anti-wetting device according to claim 5, characterized in that: After the charging treatment, the surface resistivity of the anti-wetting layer in contact with the container is .

7. The method for preparing the anti-wetting device according to claim 1, characterized in that: The distance between two adjacent first supporting microstructures is smaller than the diameter of the liquid to be stored; and / or The size of the first supporting microstructure is greater than that of the second supporting microstructure.

8. The method for preparing the anti-wetting device according to claim 2, characterized in that: The material of the anti-wetting layer is the same as that of the container; and / or The thickness of the anti-wetting layer is 0.1-0.3 mm; and / or The thickness of the anti-infiltration device is 0.3 mm to 0.5 mm; and / or The height of the first supporting microstructure is 1 / 4 to 1 / 2 of the thickness of the anti-wetting device; and / or The plurality of first supporting microstructures are arranged in an equilateral triangle array; and / or Each of the first supporting microstructures is in the shape of a cylinder or a cuboid; and / or 3 to 5 second protrusions are spaced apart between two adjacent first supporting microstructures; and / or Each of the second supporting microstructures is in the shape of a cylinder or a cuboid; and / or The size of the first supporting microstructure is 80 μm to 100 μm; the height of the first supporting microstructure is 150 μm to 200 μm; the distance between two adjacent first supporting microstructures is 100 μm to 180 μm; and / or The size of the second supporting microstructure is 10 μm to 50 μm; the height of the second supporting microstructure is 20 μm to 60 μm; the distance between two adjacent second supporting microstructures is 10 μm to 20 μm; and / or The shapes of the nanostructures include triangular pyramid, pentagon, hexagon, and claw shape; and / or The size of the nano-microstructure is 1nm-100nm; the height of the nano-microstructure is 1nm-100nm.

9. An anti-wetting device, characterized in that: The anti-infiltration device is prepared by the method for preparing an anti-infiltration device according to any one of claims 1 to 8.

10. A container with anti-infiltration function, characterized in that: It comprises the anti-infiltration device as claimed in claim 9 and a container, wherein the anti-infiltration device is adsorbed on the inner wall of the container and completely covers the inner wall of the container to prevent the liquid to be stored from infiltrating the container.

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