Tray bearing device, loading chamber, semiconductor process equipment and transmission method

Abstract

The invention discloses a tray bearing device, a loading cavity, semiconductor process equipment and a transmission method, in the tray bearing device, a base is used for bearing a tray, and the tray is used for bearing at least one substrate; the tray rotating mechanism and the at least two tray centering mechanisms are uniformly distributed around the base; the tray rotating mechanism is in contact with the edge of the tray, and the tray rotating mechanism is used for driving the tray to rotate by being in contact with the edge of the tray during rotation; the tray centering mechanisms make contact with the edge of the tray, and the tray centering mechanisms are used for pushing the tray to move in the direction from the outer side of the tray to the inner side of the tray or move in the direction away from the tray, so that the position of the tray is adjusted, it is avoided that the position of the tray on the base deviates, and the subsequent process effect is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a tray carrying device, a loading chamber, semiconductor process equipment and a transmission method. Background Art

[0002] Silicon carbide (SiC) is a Group IV-IV compound material with unique physical and chemical properties. The strong chemical bonds between Si atoms and C atoms give the material very high hardness, chemical stability and high thermal conductivity. As a semiconductor material, SiC exhibits wide bandgap, high critical electric field strength and high saturation mobility. In SiC, n-type and p-type doping can be controlled relatively easily over a wide range, which makes SiC stand out among wide-bandgap semiconductors. SiC's ability to form silicon dioxide (SiO2) as its natural oxide is an important advantage of SiC for device manufacturing. Due to these properties, SiC is a very promising semiconductor material for high-power and high-temperature electronics.

[0003] Vapor-phase epitaxy (VPE) involves the flow of a vapor-phase stream of material containing the epitaxial layer material toward a substrate, where a chemical reaction occurs, resulting in the growth of an epitaxial layer with the same crystal orientation as the substrate. During the epitaxial growth process, epitaxial gas enters the reactor, where the reactants in the gas are transported to the substrate in the vapor phase. Chemical reactions occur on the high-temperature substrate, resulting in the formation of epitaxial material that is regularly aligned along the substrate's crystal orientation, forming the epitaxial layer.

[0004] In traditional SiC epitaxial growth equipment, a robot is generally used to transfer the tray to a device that carries the tray. However, the position of the tray is prone to shifting, which affects the process effect. Summary of the Invention

[0005] In view of this, the present application provides a tray carrying device, a loading chamber, a semiconductor process equipment and a transmission method to automatically adjust the tray position in semiconductor process equipment such as SiC epitaxial equipment to ensure the subsequent process effect.

[0006] The present application provides a pallet carrying device, characterized by comprising: a base, a pallet rotating mechanism and at least two pallet centering mechanisms;

[0007] The base is used to carry a tray, and the tray is used to carry at least one substrate;

[0008] The pallet rotating mechanism and the at least two pallet centering mechanisms are evenly distributed around the base; the pallet rotating mechanism contacts the edge of the pallet, and the pallet rotating mechanism drives the pallet to rotate by contacting the edge of the pallet during rotation; each pallet centering mechanism contacts the edge of the pallet respectively, and the pallet centering mechanism is used to push the pallet to move from the outside of the pallet to the inside of the pallet, or to move away from the pallet.

[0009] Optionally, the tray carrying device further includes a lifting portion; the lifting portion is used to support the substrate away from or close to the tray.

[0010] Optionally, the tray is provided with at least one through hole in an area corresponding to each of the substrates; the lifting portion comprises: a lifting shaft and at least one support member supported by the lifting shaft; each of the support members corresponds to one of the through holes, the lifting shaft is used to drive the support member to move up and down in the corresponding through hole, and the at least one support member is used to support the substrate away from or close to the tray.

[0011] Optionally, the tray rotation mechanism includes a rotating wheel, a rotating shaft and a first drive motor; the side of the rotating wheel contacts the edge of the tray, and the rotating wheel is connected to the first drive motor through the rotating shaft; the first drive motor is used to drive the rotating shaft to rotate along the axis of the rotating shaft to drive the rotating wheel to rotate.

[0012] Optionally, the tray centering mechanism includes a centering roller, a crank shaft and a second drive motor; the side of the centering roller contacts the edge of the tray, and the centering roller is rotatably connected to the crank of the crank shaft so that the centering roller can rotate around the center of the centering roller relative to the crank; the shaft of the crank shaft is connected to the second drive motor; the distance between the shaft and the base is less than the length of the crank; the second drive motor is used to drive the shaft of the crank shaft to rotate along the axis of the shaft to drive the crank and the centering roller to rotate.

[0013] The present application also provides a loading chamber, comprising a chamber body and the tray carrying device described in any one of the above embodiments.

[0014] Optionally, the loading chamber further comprises a loading chamber cover, a loading chamber base and a circulation pipe located within the chamber body; the loading chamber cover is arranged above the base, and the loading chamber base is arranged below the base; the circulation pipe runs through the loading chamber cover and the loading chamber base, and is used to adjust the temperature inside the loading chamber by controlling the temperature of the liquid in the circulation pipe.

[0015] The present application also provides a semiconductor process equipment, comprising: a tray accommodating portion, a first substrate accommodating portion, a first robot, a second substrate accommodating portion, a second robot, at least one process chamber, a transfer chamber, and at least one loading chamber as described in any of the above embodiments;

[0016] The tray accommodating portion, the first substrate accommodating portion, and the second substrate accommodating portion are distributed at a first end of the semiconductor process equipment and enclose a robot space, the first robot is located in the robot space, the transfer chamber is located at a second end of the semiconductor process equipment, each of the loading chambers is mounted on a side of the transfer chamber close to the robot space, each of the process chambers is mounted on a side of the transfer chamber away from the robot space, and the second robot is located inside the transfer chamber;

[0017] The tray accommodating portion is used to store trays, the first substrate accommodating portion is used to store substrates to be processed, and the second substrate accommodating portion is used to store processed substrates;

[0018] The first robot is used to transfer the tray between the tray accommodating portion and the loading chamber, transfer the substrate to be processed between the first substrate accommodating portion and the loading chamber, and transfer the processed substrate between the loading chamber and the second substrate accommodating portion;

[0019] The second robot is used to transfer the tray carrying the substrate between the loading chamber and the process chamber;

[0020] The process chamber is used to perform semiconductor process on the substrate.

[0021] Optionally, the above-mentioned semiconductor process equipment also includes a position adjustment mechanism and an image recognition system; the image recognition system is used to obtain a first posture deviation of the tray in the loading chamber and a second posture deviation of the substrate, and send the first posture deviation and the second posture deviation to the position adjustment mechanism; the first robot is also used to transfer the tray in the loading chamber to the position adjustment mechanism when the first posture deviation exists, and transfer the tray after posture adjustment back to the loading chamber, and transfer the substrate in the loading chamber to the position adjustment mechanism when the second posture deviation exists, and transfer the substrate after posture adjustment back to the loading chamber; the position adjustment mechanism is used to adjust the posture of the tray according to the first posture deviation, and adjust the posture of the substrate according to the second posture deviation.

[0022] Optionally, the transfer chamber is polygonal, and one of the loading chambers or the process chambers is mounted on the outside of each side.

[0023] Optionally, the semiconductor process equipment further includes a tray picking arm and a wafer picking arm; the tray picking arm and the wafer picking arm are mounted on the first manipulator; the tray picking arm is used to grab the tray, and the wafer picking arm is used to grab the substrate.

[0024] The present application further provides a transmission method, which is applied to the semiconductor process equipment described in any of the above embodiments, and the transmission method includes:

[0025] Before performing a semiconductor process, the first robot transfers the tray from the tray receiving portion to the loading chamber;

[0026] If the posture of the tray in the loading chamber is correct, the loading chamber adjusts the tray to a preset position of the loading chamber;

[0027] The first robot transfers the substrate into the groove of the tray in the loading chamber;

[0028] If the substrate is positioned correctly within the tray, the loading chamber preheats the tray and the substrate;

[0029] The second robot transfers the preheated tray carrying the substrate to a process chamber to perform a semiconductor process on the substrate in the process chamber;

[0030] After the semiconductor process is completed, the second robot transfers the tray carrying the substrate to the loading chamber.

[0031] Optionally, when the semiconductor process equipment includes the position adjustment mechanism and the image recognition system; the transmission method also includes: if the posture of the tray in the loading chamber is inaccurate, the image recognition system obtains the first posture deviation of the tray, and transmits the tray to the position adjustment mechanism, so that the position adjustment mechanism adjusts the posture of the tray according to the first posture deviation, and the first robot transmits the tray with adjusted posture back to the loading chamber.

[0032] Optionally, when the semiconductor process equipment includes the position adjustment mechanism and the image recognition system; the transmission method also includes: if the position of the substrate in the tray is inaccurate, the image recognition system obtains the second posture deviation of the substrate, and transmits the substrate to the position adjustment mechanism, so that the position adjustment mechanism adjusts the posture of the tray according to the second posture deviation, and the first robot transmits the substrate with adjusted posture back to the tray of the loading chamber.

[0033] Optionally, the loading chamber includes a lifting part and a circulation pipe that passes through the loading chamber cover and the loading chamber base; after the semiconductor process is completed, the second robot transfers the tray carrying the substrate to the loading chamber, and the transfer method further includes: the loading chamber cools the tray and the substrate; and the loading chamber separates the cooled tray and the substrate.

[0034] Optionally, the lifting part includes a lifting shaft and a support for supporting the substrate; the tray carries a plurality of the substrates; the loading chamber separates and cools the tray and the substrate, including: the lifting shaft drives the upper support to rise so that the substrate currently supported by the support is separated from the tray; after the first robot takes away the substrate separated from the tray, the lifting shaft descends, and the tray rotating mechanism drives the tray to rotate so that the lifting shaft is aligned with the support corresponding to the next substrate, and returns to execute the step of the lifting shaft driving the upper support to rise so that the substrate currently supported by the support is separated from the tray, until all the substrates in the tray are taken away.

[0035] The above-mentioned tray carrying device, loading chamber, semiconductor process equipment and transmission method of the present application, the tray rotation mechanism can drive the tray to rotate, the tray centering mechanism can push the tray to move from the outside of the tray to the inside of the tray, or move the tray centering mechanism away from the tray. The tray rotation mechanism and the tray centering mechanism assist each other to make the tray concentric with the base, thereby avoiding the position of the tray on the base from being offset, and ensuring the subsequent process effect.

[0036] Furthermore, the tray rotation mechanism can drive the tray to rotate to adjust the substrate supported by the lifting part, so that the lifting part can support the corresponding substrate away from the tray, so that the corresponding substrate automatically detaches from the tray, and can also support the corresponding substrate close to the tray to drive the substrate to embed into the tray to achieve disc separation, thereby realizing automatic transmission of the substrate, saving human resources, and improving the transmission efficiency of the substrate.

[0037] Furthermore, the temperature inside the loading chamber can be adjusted by a circulation pipe running through the loading chamber cover and the loading chamber base, thereby improving the reliability of the corresponding semiconductor process and improving the corresponding process efficiency.

[0038] Furthermore, the semiconductor process equipment adopts a polygonal transfer chamber, and a loading chamber or a process chamber is mounted on the outside of each side of the polygonal transfer chamber. In this way, the side space of the transfer chamber can accommodate more process chambers and loading chambers, which can optimize the layout of the semiconductor process equipment in the factory. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0040] Figure 1 is a cross-sectional schematic diagram of a tray carrying device according to an embodiment of the present application;

[0041] Figure 2 This is a schematic diagram of the loading chamber structure according to an embodiment of the present application;

[0042] Figure 3 is a schematic diagram of the loading chamber structure of another embodiment of the present application;

[0043] Figure 4 This is a schematic cross-sectional view of a partial structure of a tray carrying device according to an embodiment of the present application;

[0044] Figure 5 is a schematic cross-sectional view of a partial structure of a tray carrying device according to another embodiment of the present application;

[0045] Figure 6 is a schematic cross-sectional view of a partial structure of a tray carrying device according to another embodiment of the present application;

[0046] Figure 7 This is a schematic diagram of the structure of a loading chamber portion of another embodiment of the present application;

[0047] Figure 8 This is a schematic structural diagram of a semiconductor process equipment according to an embodiment of the present application;

[0048] Figure 9a and Figure 9b is a schematic diagram of substrate placement during the study;

[0049] Figure 10 This is a schematic diagram of a substrate posture adjustment process according to an embodiment of the present application;

[0050] Figure 11 It is a schematic diagram of the structure of the semiconductor process equipment during the research process;

[0051] Figure 12 This is a schematic diagram of a quartz finger according to an embodiment of the present application;

[0052] Figure 13 This is a schematic diagram of a suction-type tablet-taking finger according to an embodiment of the present application;

[0053] Figure 14 This is a flow chart of a transmission method according to an embodiment of the present application. DETAILED DESCRIPTION

[0054] The following, in conjunction with the accompanying drawings, clearly and completely describes the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0055] The first aspect of the present application provides a tray carrier device, which can be used in various chambers in semiconductor process equipment that need to place trays. Taking semiconductor process equipment such as SiC epitaxial equipment as an example, the semiconductor process equipment may include chambers such as loading chambers and process chambers, wherein the process chamber can perform semiconductor process processing on the substrate, and the loading chamber can serve as an intermediate station for processing the substrate before and after the semiconductor process, for the substrate to undergo other processing such as position adjustment. The tray carrier device in the present application can be set in any of these chambers. Below, the present application takes the above-mentioned tray carrier device being set in the loading chamber as an example to provide a detailed introduction to the present application.

[0056] refer to Figures 1 to 3 As shown, Figure 1 It is a longitudinal cross-sectional view of the pallet carrying device. Figure 2 and Figure 3 As shown in a top view of the loading chamber 800 , the tray carrier includes a base 817 , a tray rotating mechanism 815 , and at least two tray centering mechanisms 816 .

[0057] The base 817 is used to carry the tray 14, and the tray 14 is used to carry at least one substrate 13, such as Figure 2 The tray 14 shown can carry three substrates 13, Figure 3 The tray 14 shown can carry one substrate 13. Optionally, the base 817 can be slightly smaller than the tray 14, in which case the base 817 is positioned within the tray 14 when carrying the tray 14. Alternatively, the base 817 can be slightly larger than the tray 14, in which case the edge of the base 817 extends beyond the edge of the tray 14 when carrying the tray 14. If the tray 14 shifts on the base 817, the robot will transfer the shifted tray 14 directly into the process chamber, causing the tray 14 to shift within the process chamber, affecting the process effect.

[0058] The tray rotating mechanism 815 and at least two tray centering mechanisms 816 are evenly distributed around the base 817; the tray rotating mechanism 815 contacts the edge of the tray 14, and the tray rotating mechanism 815 drives the tray 14 to rotate by contacting the edge of the tray 14 during rotation; each tray centering mechanism 816 contacts the edge of the tray 14 respectively, and the tray centering mechanism 816 is used to push the tray from the outside of the tray to the inside of the tray, or to move away from the tray.

[0059] In the above pallet carrying device, the pallet rotating mechanism 815 can drive the pallet 14 to rotate, and the pallet centering mechanism 816 can push the pallet from the outside of the pallet to the inside of the pallet, or move the pallet centering mechanism 816 away from the pallet. The pallet rotating mechanism 815 and the pallet centering mechanism 816 assist each other to make the pallet 14 concentric with the base 817, thereby avoiding the position of the pallet 14 on the base 817 from being offset, and ensuring the subsequent process effect.

[0060] In one embodiment, the tray supporting device may further include a lifting portion 820. The lifting portion 820 is used to support the substrate 13 away from the tray 14, so that the substrate 13 automatically detaches from the tray 14. The lifting portion 820 is also used to support the substrate 13 close to the tray 14, so as to drive the substrate 13 to embed into the tray 14, thereby achieving automatic nesting and detachment between the substrate 13 and the tray 14, that is, achieving disc separation.

[0061] Specifically, when the tray 14 carries multiple substrates, the tray rotation mechanism 815 can drive the tray 14 to rotate to adjust the substrate supported by the lifting part 820, so that the lifting part 820 can support the corresponding substrate 13 away from the tray 14, so that the corresponding substrate 13 automatically detaches from the tray 14, and can also support the corresponding substrate 13 close to the tray 14 to drive the substrate 13 to embed into the tray 14, realize disc separation, and thereby realize automatic transmission of the substrate 13, which can avoid manual intervention, save human resources, and improve the transmission efficiency of the substrate 13.

[0062] In one example, reference Figure 4 As shown, the tray 14 has at least one through-hole in an area corresponding to each substrate 13. The lifting portion 820 includes a lifting shaft 821 and at least one support member 14a supported by the lifting shaft 821. Each support member 14a corresponds to a through-hole. The lifting shaft 821 is used to move the support member 14a up and down within the corresponding through-hole. At least one support member 14a is used to support the substrate 13 away from or toward the tray 14.

[0063] Optionally, the through hole of the tray 14 may correspond to the center position of the substrate 13, so that the corresponding support member 14a can be supported in the center area of ​​the corresponding substrate 13, thereby improving reliability during the support process.

[0064] Optionally, the support member 14a includes a support tray that can be embedded in or detached from the corresponding through-hole. The support tray can also be called a small graphite tray. Optionally, the above-mentioned opening can be stepped or conical. Here, a support tray corresponding to each substrate 13 is provided at the through-hole of the tray 14. This can ensure the integrity of the groove surface within the entire tray 14, avoid the occurrence of abnormal points in the surface temperature and airflow field of the tray 14, and at the same time increase the contact area between the lifting portion 820 and the substrate 13, so that the substrate remains stable during the lifting process.

[0065] Optionally, the support member 14a includes a plurality of PIN pins for supporting the lifting of the substrate, for example, three PIN pins evenly distributed on a circumference with the center position of the corresponding substrate as the center. Here, the support member 14a is implemented with multiple PIN pins, which simplifies the structure of the support member 14a.

[0066] In one example, the lifting part 820 further includes a lifting motor 819. If the support member 14a is disposed at the top end of the lifting shaft 821, the lifting motor 819 can be disposed at the bottom end of the lifting shaft 821. The lifting motor 819 is used to control the lifting shaft 821 to perform lifting movements to drive the support member 14a to separate from the tray 14, thereby separating the substrate 13 from the tray 14, or to drive the support member 14a close to the tray 14, so that the substrate 13 is embedded in the tray 14.

[0067] In one example, the tray 14 carries multiple substrates 13 and is a multi-disc tray. The lifting shaft 821 is first aligned with the support member 14a corresponding to one of the substrates. The above-mentioned disc separation process may include:

[0068] The lifting shaft 821 drives the upper support member 14 a to rise, so that the substrate 13 currently supported by the support member 14 a is separated from the tray 14 ;

[0069] After the substrate 13 to be separated from the tray 14 is removed, the lifting shaft 821 descends, and the tray rotation mechanism 815 drives the tray 14 to rotate so that the lifting shaft 821 is aligned with the support 14a corresponding to the next substrate 13, and then returns to execute the step of the lifting shaft 821 driving the upper support 14a to rise so that the substrate 13 currently supported by the support 14a is separated from the tray 14, until all substrates 13 in the tray 14 are removed.

[0070] Furthermore, the substrate loading and unloading process for a single-sheet tray carrying substrates 13 is essentially the same as for a multi-sheet tray. The difference is that the lifting shaft 821 is located at the bottom center of the tray 14. During the disc separation process, the lifting system in the center of the tray 14 is used to support and lift the substrate 13 in the center. Optionally, the loading chamber 800 can be equipped with lifting shafts 821 at both the edge (e.g., the position aligned with one support member 14a in a multi-sheet tray) and the center (the position aligned with the center of the tray 14) to meet the usage requirements of both multi-sheet trays and single-sheet trays.

[0071] In one embodiment, reference Figure 5 As shown, the tray rotation mechanism 815 includes a rotating wheel 15a, a rotating shaft 15b, and a first drive motor 818a. The side of the rotating wheel 15a contacts the edge of the tray 14, and the rotating wheel 15a is connected to the first drive motor 818a via the rotating shaft 15b. The first drive motor 818a is used to drive the rotating shaft 15b to rotate along its axis, thereby driving the rotating wheel 15a to rotate. Optionally, the first drive motor 818a may include a servo motor.

[0072] Specifically, the transmission mechanism between the rotating wheel 15a and the tray 14 can be a gear-type transmission structure or a cam-type transmission. The principle of both is that the rotation of the rotating wheel 15a drives the tray 14 to rotate. The entire tray rotation mechanism 15 is driven by the first drive motor 818a to rotate the upper rotating shaft 15b and the rotating wheel 15a, ultimately driving the rotating wheel 15a to rotate the tray 14 on the base 817. The installation position of the tray rotation mechanism 15 is predetermined by the mounting holes within the loading chamber 800 and is fixed and cannot be adjusted.

[0073] Optionally, refer to Figure 5 As shown, the tray rotation mechanism 815 may further include a first bearing 15c and a first coupling 15d; the first bearing 15c may be disposed on the periphery of the rotating shaft 15b for supporting the rotating shaft 15b; the first coupling 15d is used to connect the rotating shaft 15b with the first drive motor 818a.

[0074] In one embodiment, reference Figure 6 As shown, the tray centering mechanism 816 includes a centering roller 16a, a crank shaft 16b, and a second drive motor 818b. The side of the centering roller 16a contacts the edge of the tray 14. The centering roller 16a is rotatably connected to the crank of the crank shaft 16b, allowing the centering roller 16a to rotate relative to the crank around the center of the centering roller 16a. The shaft of the crank shaft 16b is connected to the second drive motor 818b. The distance between the shaft and the base 817 is less than the length of the crank. The second drive motor 818b is used to drive the shaft of the crank shaft 16b to rotate along the shaft axis, thereby driving the crank and the centering roller 16a to rotate.

[0075] Alternatively, the second drive motor 818b may include a servo motor. Further, the first drive motor 818a and the second drive motor 818b may be implemented using the same servo motor, so as to drive the rotating shaft 15b and the crank shaft 16b respectively in a time-sharing multiplexing manner through the same servo motor.

[0076] Alternatively, as Figure 6 As shown, the above-mentioned tray centering mechanism 816 may further include a second bearing 16c and a second coupling 16d; the second coupling 16d is used to connect the crank shaft 16b and the second drive motor 818b.

[0077] The movement principle of the above-mentioned tray centering mechanism 816 is similar to that of the tray rotation mechanism 815. After being guided by the second bearing 16c, the lower end is driven by the second drive motor 818b. Optionally, the tray centering mechanism 816 accurately positions the tray 14 from the outside to the inside during rotation. The rotation angle of the tray 14 can be controlled by real-time feedback from the visual recognition system (such as the image recognition system 9) of the loading chamber 800 and the second drive motor 818b. The purpose is to ensure that the angles between the left and right sides of the tray centering mechanism 816 remain equal during and after the movement stops. The final centering stop position of the tray 14 remains at a fixed preset position, thereby ensuring that the position of the tray 14 remains the same during multiple transfers.

[0078] In the above disk carrying device, the tray rotating mechanism 815 and the tray centering mechanism 816 assist each other to make the tray 14 concentric with the base 817, thereby avoiding the position of the tray 14 on the base 817 from being offset, ensuring the subsequent process effect, and the substrate supported by the lifting part 820 can also be adjusted by the tray rotating mechanism 815, so that the lifting part 820 can separate the tray 14 from the various substrates 13 it carries, contributing to the automatic transmission of the substrate 13, avoiding manual intervention in the substrate transmission process, saving human resources, and improving the transmission efficiency of the substrate, thereby improving the machine control efficiency.

[0079] A second aspect of the present application provides a loading chamber that can be provided in semiconductor processing equipment such as SiC epitaxial growth equipment. The loading chamber can include a chamber body and a tray support device as described in any of the above embodiments, whereby the tray support device can be used to perform processes such as disc separation and / or position adjustment between a substrate (e.g., a SiC substrate) and a tray.

[0080] In one embodiment, reference Figure 7As shown, the loading chamber 800 also includes a loading chamber cover 800a, a loading chamber base 800b and a circulation pipe 21 located in the chamber body; the loading chamber cover 800a is arranged above the base 817, and the loading chamber base 800b is arranged below the base 817; the circulation pipe 21 runs through the loading chamber cover 800a and the loading chamber base 800, and is used to adjust the temperature inside the loading chamber 800 by controlling the temperature of the liquid in the circulation pipe 21.

[0081] Specifically, the liquid within the circulation conduit 21 can also be referred to as a temperature control liquid. The temperature control liquid can include a heating liquid and a cooling liquid. The inlet and outlet of the circulation conduit 21 can be connected to a temperature control system. Before the semiconductor process, the heating liquid can flow through the circulation conduit 21 to preheat the internal environment of the loading chamber 800, thereby heating the tray 14 and susceptor 817. After the semiconductor process, the cooling liquid can flow through the circulation conduit 21 to quickly cool the tray 14 and substrate 13 after the semiconductor process.

[0082] In the semiconductor process, there is a reserved gap between the tray 14 and the substrate 13. When the tray 14 is heated to the process temperature in the process chamber, the grooves on the surface of the tray 14 will change as the graphite material expands. In the prior art, the tray 14 does not undergo a preheating process in the internal environment of the loading chamber 800. The shape change caused by the thermal expansion of the tray 14 in the process chamber will cause abnormal changes in the position of the substrate 13, and will also cause abnormal changes in the process results of the substrate 13. This embodiment preheats the tray 14 and the substrate 13 in advance in the loading chamber 800 to avoid the above-mentioned abnormal position changes and improve the reliability of the corresponding semiconductor process. After the semiconductor process is completed, the tray 14 and the substrate 13 are transferred back to the base 817. At this time, cooling liquid can be introduced into the circulation pipe 21 to quickly cool the substrate 13, thereby reducing waiting time and improving process efficiency.

[0083] The loading chamber 800 includes the tray carrier device described in any of the above embodiments. All the beneficial effects of the tray carrier device described in any of the above embodiments are not repeated here. In addition, the loading chamber 800 can also adjust the temperature inside the loading chamber 800 through the circulation pipe 21 that passes through the loading chamber cover 800a and the loading chamber base 800b, which can improve the reliability of the corresponding semiconductor process and improve the corresponding process efficiency.

[0084] The third aspect of the present application provides a semiconductor process equipment, which may include a SiC epitaxial device. Figure 8As shown, the semiconductor process equipment includes: a tray accommodating part 1, a first substrate accommodating part 2, a first robot 600, a second substrate accommodating part 7, a second robot 10, at least one process chamber 11, a transfer chamber 12 and at least one loading chamber 800 described in any of the above embodiments.

[0085] The tray accommodating portion 1, the first substrate accommodating portion 2 and the second substrate accommodating portion 7 are distributed at the first end of the semiconductor process equipment and form a robot space. The first robot 600 (also called an atmospheric robot) is located in the robot space, the transfer chamber 12 is located at the second end of the semiconductor process equipment, each loading chamber 800 is mounted on the side of the transfer chamber 12 close to the robot space, and each process chamber 11 is mounted on the side of the transfer chamber 12 away from the robot space. The second robot 10 (also called a vacuum robot) is located inside the transfer chamber 12; wherein, the first end of the semiconductor process equipment can be its front end, and the second end can be its rear end.

[0086] The tray accommodating portion 1 is used to store a tray 14, the first substrate accommodating portion 2 is used to store a substrate 13 to be processed, and the second substrate accommodating portion 7 is used to store a processed substrate 13. The tray 14 may include a graphite tray, and the substrate 13 may include a SiC substrate.

[0087] The first robot 600 is used to transfer the tray 14 between the tray accommodating portion 1 and the loading chamber 800, to transfer the substrate 13 to be processed between the first substrate accommodating portion 2 and the loading chamber 800, and to transfer the processed substrate 13 between the loading chamber 800 and the second substrate accommodating portion 7; wherein, the first robot 600 can be a single-arm structure or a double-arm structure.

[0088] The loading chamber 800 is used to perform pre-processing on the tray 14 and the substrate 13 before executing the semiconductor process, cool the tray 14 and the substrate 13 after executing the semiconductor process, and separate the tray 14 and the substrate 13; the above-mentioned pre-processing may include position adjustment and preheating.

[0089] The second robot 10 is used to transfer the tray 14 carrying the substrate 13 between the loading chamber 800 and the process chamber 11;

[0090] The process chamber 11 is used to perform semiconductor process on the substrate 13 .

[0091] The inventors studied the SiC substrate transfer process and found that some SiC substrate transfer solutions simply implement the automated separation function, but lack the positioning function for the substrate and the tray, and cannot achieve precise control. In actual production, the use of existing technology equipment often results in the substrate not being able to be accurately placed in the groove inside the tray, and the edge of a portion of the substrate falls outside the groove of the tray, such as Figure 9a and Figure 9b As shown. Due to insufficient positioning accuracy between the substrate and the tray, the tray may be placed outside the corresponding groove. Based on existing process results and theoretical analysis, the thickness and doping uniformity of the substrate process indicators are closely related to the airflow and temperature field distribution on the substrate surface. When the position of the substrate changes significantly, the process indicators will become significantly abnormal. After the tray and substrate in this state are processed in the process chamber, the uniformity of the substrate process results will be significantly reduced, and the portion of the substrate that exceeds the groove boundary area will not meet the requirements of the next process.

[0092] Based on the above problems, in one embodiment, the above-mentioned semiconductor process equipment also includes a position adjustment mechanism 3 and an image recognition system 9, so as to detect the posture deviation of the tray 14 and the substrate 13 through the image recognition system 9, and adjust the postures of the tray 14 and the substrate 13 respectively through the position adjustment mechanism 3.

[0093] The image recognition system 9 is used to obtain the first posture deviation of the tray 14 and the second posture deviation of the substrate 13 in the loading chamber 800, and send the first posture deviation and the second posture deviation to the position adjustment mechanism 3. Specifically, the image recognition system 9 can be installed above the loading chamber 800 to scan the tray 14 and / or substrate 13 in the loading chamber 800 from above to obtain the first posture deviation and the second posture deviation respectively. Optionally, the image recognition system 9 can obtain the first posture deviation and the second posture deviation by identifying the boundaries of the grooves in which the tray 14 and substrate 13 are placed. For example, after the tray 14, substrate 13, or a combination of the two enters the loading chamber 800, the image recognition system 9 can identify the substrate placement groove in the center of the tray 14, thereby determining a substrate placement boundary, and then performing image recognition on the actual substrate position to identify the specific position of the substrate 13 in the groove and calculate the corresponding posture deviation to determine the required adjustment amount.

[0094] The first robot 600 is also used to transfer the tray 14 in the loading chamber 800 to the position adjustment mechanism 3 when there is a first posture deviation, and transfer the tray 14 after the posture adjustment back to the loading chamber 800, and to transfer the substrate 13 in the loading chamber 800 to the position adjustment mechanism 3 when there is a second posture deviation, and transfer the substrate 14 after the posture adjustment back to the loading chamber 800.

[0095] The position adjustment mechanism 3 is used to adjust the posture of the tray 14 according to the first posture deviation so that the posture of the tray 14 is accurate, and to adjust the posture of the substrate 13 according to the second posture deviation so that the posture of the substrate 13 is accurate. Specifically, the posture adjustment of the substrate 13 is used as an example for explanation. Figure 10As shown, when the substrate 13 is placed on the position adjustment mechanism 3, the XY coordinate values ​​of the substrate 13 and the rotation angle corresponding to the substrate positioning edge can be adjusted in real time according to the second posture deviation. After the adjustment, it is transferred back to the tray 14 via the sheet-picking fingers of the first robot 600, and the image recognition system 9 can perform image recognition confirmation again to ensure that the substrate 13 is placed in the center of the corresponding groove.

[0096] Specifically, the workflow of the semiconductor process equipment includes: the first manipulator 600 mounts the tray-taking finger to first take out the tray 14 from the tray accommodating portion 1 and places it in the loading chamber 800, the image recognition system 9 scans the tray 14 and identifies whether the position of the tray 14 is accurate. When the position of the tray 14 is inaccurate, the first manipulator 600 mounts the tray-taking finger to transfer the tray 14 to the position adjustment mechanism 3, the position adjustment mechanism 3 adjusts the position of the tray 14, and the first manipulator 600 mounts the tray-taking finger to transfer the adjusted tray 14 to the loading chamber 800; after the image recognition system 9 records its position information After the information is received, the control system controls the robot 6 to mount the wafer-taking finger to take the substrate 13 out of the first substrate receiving portion 2, and after adjusting the position of the substrate 13 in combination with the position information of the tray 14, the substrate 13 is placed in the groove inside the tray 14; the image recognition system 9 scans the substrate 13 to identify whether the position of the substrate 13 is accurate. When the position of the substrate 13 is inaccurate, the first robot 600 mounts the wafer-taking finger to transfer the substrate 13 to the position adjustment mechanism 3. The position adjustment mechanism 3 adjusts the position of the substrate 13, and the first robot 600 mounts the wafer-taking finger to transfer the adjusted substrate 13 to the groove inside the tray 14. The second robot 10 transfers the tray 14 and substrate 13 placed in the loading chamber 800 to the process chamber 11 to complete the semiconductor process (such as epitaxial growth) of the substrate. After the process is completed, the second robot 10 mounts the tray retrieval finger and removes the substrate 13 to the loading chamber 800. The tray separation mechanism in the loading chamber 800 separates the substrate 13 from the tray 14. The processed substrate 13 is then placed in the second substrate receiving section 7 and transferred in batches after multiple processes. Trays 14 within their service life do not need to be returned to the tray receiving section 1, but instead remain in the loading chamber 800 to await the next substrate 13.

[0097] The inventors studied the traditional SiC epitaxial equipment, such as Figure 11 As shown, traditional SiC epitaxial equipment adopts a single loading chamber and a single process chamber solution. Under this layout, the space on both sides of the process chamber is idle. The existing transfer chamber does not have process chambers mounted on both sides but is connected to cooling chambers or heating chambers as temporary storage places before and after the process, which does not contribute much to the production capacity of semiconductor process equipment.

[0098] Based on the above problem, in one embodiment, the transfer chamber 12 is polygonal, and a loading chamber 800 or a process chamber 11 is mounted on the outside of each side; for example Figure 8 The transfer chamber 12 of the semiconductor process equipment shown is heptagonal, and a loading chamber 800 or a process chamber 11 is mounted on the outer side of each side of the heptagonal transfer chamber 12. In this way, the semiconductor process equipment includes two loading chambers 800 and five process chambers 11 in total.

[0099] Optionally, the transfer chamber 12 can accommodate multiple process chambers corresponding to substrates of different sizes. The second robot 10 within the transfer chamber 12 can transfer substrates 13 carried by trays 14 to process chambers 11 of corresponding substrate sizes, thereby optimizing the process efficiency of the semiconductor process equipment and achieving compatibility with multiple process menus.

[0100] This embodiment utilizes a polygonal transfer chamber 12, with a loading chamber 800 or process chamber 11 mounted on each side of the polygonal transfer chamber 12. This allows the lateral space of the transfer chamber 12 to accommodate more process chambers 11 and loading chambers 800, optimizing the layout of semiconductor processing equipment within the fab. The polygonal transfer chamber 12 can accommodate an increased number of loading chambers 800 and process chambers 11 as needed.

[0101] In one embodiment, the semiconductor process equipment further includes a tray-taking arm 400 and a wafer-taking arm 500; the tray-taking arm 400 and the wafer-taking arm 500 are mounted on a first manipulator 600; the tray-taking arm 400 can be loaded with tray-taking fingers for transferring the tray 14, for grasping the tray 14, and the wafer-taking arm 500 can be loaded with wafer-taking fingers for transferring the wafer 13, for grasping the substrate 13. The first manipulator 600 provided in this embodiment is mounted with the tray-taking arm 400 and the wafer-taking arm 500 to form a dual-arm structure, which can improve the transmission speed. In the dual-arm structure, each arm can include two arm joints, and the end of each arm can rotate around the end to adjust the direction of the angle. The two joints can rotate relative to each other to complete the distance adjustment of the extension direction of the front finger. Each arm can move independently, which has higher flexibility.

[0102] Optionally, the disc-taking arm 400 is equipped with a disc-taking quartz finger, which is a hollow fork-shaped structure, such as Figure 12 As shown, the fork surface at the bottom of the quartz finger is used to insert and remove the tray 14 during transfer. A tray container 1 containing pre-processed trays is placed to the right of the first robot 600. Before processing, the pre-processed tray 14 is removed by the tray removal fingers mounted on the tray removal arm 400 and transferred to the loading chamber 800 by the first robot 600.

[0103] Optionally, the front end of the film picking arm 500 can adopt an adsorption-type film picking finger based on vacuum suction tray technology. The advantage of this finger is that the central adsorption is not limited to the shape and size of the substrate, and it is compatible with the transmission of substrates of different sizes without the need to switch quartz fingers; the use of this adsorption-type film picking finger can achieve compatible transmission of existing mass-produced substrates (such as 4 inches, 6 inches) and large-size substrates (such as 8 inches, 12 inches). The first substrate accommodating part 2 can be manually placed with the substrate in it before transmission, or it can be placed by automated equipment at the production site. Before the process, the film picking arm 500 takes out the substrate 13 placed in the first substrate accommodating part 2 through the film picking finger at the front end. The first substrate accommodating part 2 can have a layered substrate placement structure, so that each first substrate accommodating part 2 can accommodate multiple substrates arranged vertically; a single large-capacity substrate accommodating part can be used here, or a plurality of small-capacity substrate accommodating parts can be vertically stacked to form a corresponding first substrate accommodating part 2. The structure of the adsorption-type film picking finger is as follows Figure 13 As shown, there is a long strip opening at the front end of the finger, and the interior of the entire arm base should also be a hollow structure with a vacuum air duct. When in use, a controllable vacuum generating mechanism is connected to the tail of the vacuum air duct to freely control the placement of the substrate. The vacuum adsorption part is in a negative pressure state to adsorb the substrate, and after reaching the specified position, the vacuum adsorption part returns to a normal pressure state, and the substrate is placed. The second substrate accommodating part 7 is the placement area for the post-process substrate. A certain number of post-process substrates are stored in the second substrate accommodating part 7 in batches, and then the second substrate accommodating part 7 where the substrates are stored can be taken away regularly. The way to take away the second substrate accommodating part 7 after the process can be to take it away manually within a certain period, or to take it away regularly using automated equipment at the production site.

[0104] The above semiconductor process equipment includes the loading chamber described in any of the above embodiments, and has all the beneficial effects of the loading chamber described in any of the above embodiments, which will not be repeated here.

[0105] The fourth aspect of the present application further provides a transmission method, which is applied to the semiconductor process equipment described in any of the above embodiments to transmit a substrate processed by the semiconductor process equipment described in any of the above embodiments, and the substrate may include a SiC substrate. Figure 14 As shown, the above transmission method includes steps S901 to S906.

[0106] S901 , before performing a semiconductor process, the first robot 600 transfers the tray 14 from the tray receiving portion 1 to the loading chamber 800 .

[0107] At step S902, if the posture of the tray 14 in the loading chamber 800 is correct, the loading chamber 800 adjusts the tray 14 to a preset position of the loading chamber 800. Optionally, at step S902, the image recognition system 9 may be used to identify the posture of the tray 14 in the loading chamber 800 to determine whether the posture of the tray 14 in the loading chamber 800 is correct.

[0108] S903 , the first robot 600 transfers the substrate 13 to the groove of the tray 14 in the loading chamber 800 .

[0109] S904: If the substrate 13 is positioned correctly in the tray 14, the loading chamber 800 preheats the tray 14 and the substrate 13. Optionally, step S904 may use the image recognition system 9 to identify whether the substrate 13 is positioned correctly in the tray 14.

[0110] S905: The second robot 10 transfers the preheated tray 14 carrying the substrate 13 to the process chamber 11, so as to perform a semiconductor process on the substrate 13 in the process chamber 11. The semiconductor process may be an epitaxial process.

[0111] S906 , after the semiconductor process is completed, the second robot 10 transfers the tray 14 carrying the substrate 13 to the loading chamber 800 .

[0112] In one embodiment, when the semiconductor process equipment includes a position adjustment mechanism 3 and an image recognition system 9; the transmission method also includes: if the posture of the tray 14 in the loading chamber 800 is inaccurate, the image recognition system 9 obtains the first posture deviation of the tray 14, and transmits the tray 14 to the position adjustment mechanism 3, so that the position adjustment mechanism 3 adjusts the posture of the tray 14 according to the first posture deviation, and the first robot 600 transmits the tray 14 with adjusted posture back to the loading chamber 800.

[0113] In one embodiment, when the semiconductor process equipment includes a position adjustment mechanism 3 and an image recognition system 9; the transmission method also includes: if the position of the substrate 13 in the tray 14 is inaccurate, the image recognition system 9 obtains the second posture deviation of the substrate, and transmits the substrate 13 to the position adjustment mechanism 3, so that the position adjustment mechanism 3 adjusts the posture of the tray 13 according to the second posture deviation, and the first robot 600 transmits the substrate 13 with adjusted posture back to the tray 14 of the loading chamber 800.

[0114] In one embodiment, the loading chamber 800 includes a lifting portion 820 and a circulation pipe 21 that passes through the loading chamber cover 800a and the loading chamber base 800b; after the semiconductor process is completed, the second robot 10 transfers the tray 14 carrying the substrate 13 to the loading chamber 800, and the transfer method also includes S907 and S908.

[0115] S907 , the loading chamber 800 cools the tray 14 and the substrate 13 .

[0116] S908 , the loading chamber 800 separates the cooled tray 14 and substrate 13 .

[0117] Optionally, after the loading chamber 800 separates the tray 14 and the substrate 13 , the first robot 600 may also transfer the substrate 13 to the second substrate receiving portion 7 to store the substrate 13 after the semiconductor process is completed in the second substrate receiving portion 7 .

[0118] In one example, the lifting portion 820 includes a lifting shaft 821 and a support member 14a for supporting the substrate 13. The tray 14 carries a plurality of substrates 13; the loading chamber 800 separates the cooled tray 14 and the substrate 13, including:

[0119] The lifting shaft 821 drives the upper support member 14 a to rise, so that the substrate 13 currently supported by the support member 14 a is separated from the tray 14 ;

[0120] After the first robot 600 takes away the substrate 13 that has been separated from the tray 16, the lifting shaft 821 descends, and the tray rotation mechanism 815 drives the tray 14 to rotate so that the lifting shaft 821 is aligned with the support 14a corresponding to the next substrate 13, and then returns to execute the step of the lowering shaft 820 driving the upper support 14a to rise so that the substrate 13 currently supported by the support 14a is separated from the tray 14, until all substrates 13 in the tray 14 are taken away.

[0121] The above transfer method can automatically transfer trays 14 and substrates 13, automatically adjust the tray position, and automatically separate the discs, thus avoiding manual intervention and improving the transfer efficiency of substrates 13. Furthermore, the edge of the substrate 13 can also be engraved with a substrate code such as a product serial number, a QR code, or a barcode that can be read by the image recognition system 9. The process menu corresponding to each substrate 13 should correspond one-to-one with the substrate code engraved on the surface, so that the automated transfer process of each substrate 13 can be monitored based on the substrate code.

[0122] The above-mentioned transmission method is used to transmit substrates processed by the semiconductor process equipment described in any of the above-mentioned embodiments, and has all the beneficial effects of the semiconductor process equipment described in any of the above-mentioned embodiments, which will not be described in detail here.

[0123] The above describes in detail the tray carrier device, loading chamber, semiconductor process equipment, and transfer method provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different emphases. For portions not detailed or documented in one embodiment, please refer to the relevant descriptions of other embodiments.

[0124] Although the present application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on reading and understanding this specification and the accompanying drawings. The present application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., it is functionally equivalent), even if it is not structurally equivalent to the disclosed structure that performs the function in the exemplary implementation of this specification shown herein.

[0125] That is, the above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structural or equivalent process transformations made using the contents of the description and drawings of this application, such as the mutual combination of technical features between the various embodiments, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

[0126] In addition, although the terms first, second, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. The terms "first" and "second" should not be understood to indicate or imply relative importance or implicitly indicate the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0127] In this application, the word "exemplary" is used to mean "serving as an example, illustration or description". Any embodiment described in this application as "exemplary" is not necessarily to be construed as being more preferred or more advantageous than other embodiments. The above description is provided to enable any person skilled in the art to implement and use the present application. In the above description, various details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other embodiments, well-known structures and processes will not be elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in this application.

Claims

1. A tray carrying device, characterized in that: include: A base (817), a tray rotating mechanism (815) and at least two tray centering mechanisms (816); The base (817) is used to carry a tray (14), and the tray (14) is used to carry at least one substrate (13); The tray rotating mechanism (815) and the at least two tray centering mechanisms (816) are evenly distributed around the base (817); the tray rotating mechanism (815) contacts the edge of the tray (14), and the tray rotating mechanism (815) is used to drive the tray (14) to rotate by contacting the edge of the tray (14); each of the tray centering mechanisms (816) is respectively in contact with the edge of the tray (14), and the tray centering mechanism (816) is used to push the tray to move from the outside of the tray to the inside of the tray, or to move away from the tray.

2. The tray carrying device according to claim 1, characterized in that: The tray carrying device further comprises a lifting portion (820); The lifting part (820) is used to support the substrate (13) to move away from or close to the tray (14).

3. The tray carrying device according to claim 2, characterized in that: The tray (14) is provided with at least one through hole in an area corresponding to each substrate (13); the lifting part (820) comprises: a lifting shaft (821) and at least one supporting member (14a) supported by the lifting shaft (821); Each of the support members (14a) corresponds to one of the through holes, and the lifting shaft (821) is used to drive the support member (14a) to be lifted and lowered in the corresponding through hole, and the at least one support member (14a) is used to support the substrate (13) to move away from or close to the tray (14).

4. The tray carrying device according to claim 1, characterized in that: The tray rotating mechanism (815) comprises a rotating wheel (15a), a rotating shaft (15b) and a first driving motor (818a); The side surface of the rotating wheel (15a) contacts the edge of the tray (14), and the rotating wheel (15a) is connected to the first driving motor (818a) via the rotating shaft (15b); The first driving motor (818a) is used to drive the rotating shaft (15b) to rotate along the axis of the rotating shaft (15b) to drive the rotating wheel (15a) to rotate.

5. The tray carrying device according to claim 1, characterized in that: The tray centering mechanism (816) comprises a centering roller (16a), a crank shaft (16b) and a second drive motor (818b); The side surface of the centering roller (16a) contacts the edge of the tray (14), and the centering roller (16a) is rotatably connected to the crank of the crank shaft (16b), so that the centering roller (16a) can rotate relative to the crank around the center of the centering roller (16a); The shaft of the crank shaft (16b) is connected to the second drive motor (818b); the distance between the shaft and the base is smaller than the length of the crank; The second driving motor (818b) is used to drive the shaft body of the crank shaft (16b) to rotate along the axis of the shaft body, so as to drive the crank and the centering roller (16a) to rotate.

6. A loading chamber, characterized in that: It comprises a chamber body and a tray carrying device as described in any one of claims 1 to 5.

7. The loading chamber according to claim 6, characterized in that: The loading chamber further comprises a loading chamber upper cover (800a), a loading chamber base (800b) and a circulation pipe (21) located in the chamber body; The loading chamber upper cover (800a) is arranged above the base (817), and the loading chamber base (800b) is arranged below the base (817); the circulation pipe (21) runs through the loading chamber upper cover (800a) and the loading chamber base (800b), and is used to adjust the temperature inside the loading chamber by controlling the temperature of the liquid in the circulation pipe (21).

8. A semiconductor process equipment, characterized in that: include: A tray accommodating portion (1), a first substrate accommodating portion (2), a first robot (600), a second substrate accommodating portion (7), a second robot (10), at least one process chamber (11), a transfer chamber (12), and at least one loading chamber (800) as claimed in claim 6 or 7; The tray accommodating portion (1), the first substrate accommodating portion (2) and the second substrate accommodating portion (7) are distributed at the first end of the semiconductor process equipment and enclose a robot space, the first robot (600) is located in the robot space, the transfer chamber (12) is located at the second end of the semiconductor process equipment, each of the loading chambers (800) is mounted on a side of the transfer chamber (12) close to the robot space, each of the process chambers (11) is mounted on a side of the transfer chamber (12) away from the robot space, and the second robot (10) is located inside the transfer chamber (12); The tray accommodating portion (1) is used to store trays, the first substrate accommodating portion (2) is used to store substrates to be processed, and the second substrate accommodating portion (7) is used to store processed substrates; The first robot (600) is used to transfer the tray between the tray accommodating portion (1) and the loading chamber (800), to transfer the substrate to be processed between the first substrate accommodating portion (2) and the loading chamber (800), and to transfer the processed substrate between the loading chamber (800) and the second substrate accommodating portion (7); The second robot (10) is used to transfer the tray carrying the substrate between the loading chamber (800) and the process chamber (11); The process chamber (11) is used for performing semiconductor process treatment on the substrate.

9. The semiconductor process equipment according to claim 8, characterized in that: It also includes a position adjustment mechanism (3) and an image recognition system (9); The image recognition system (9) is used to obtain a first posture deviation of the tray and a second posture deviation of the substrate in the loading chamber (800), and send the first posture deviation and the second posture deviation to the position adjustment mechanism (3); The first robot (600) is further used to transfer the tray in the loading chamber (800) to the position adjustment mechanism (3) when the first posture deviation exists, and to transfer the tray after the posture adjustment back to the loading chamber (800); and to transfer the substrate in the loading chamber (800) to the position adjustment mechanism (3) when the second posture deviation exists, and to transfer the substrate after the posture adjustment back to the loading chamber (800); The position adjustment mechanism (3) is used to adjust the posture of the tray according to the first posture deviation, and to adjust the posture of the substrate according to the second posture deviation.

10. The semiconductor process equipment according to claim 8, characterized in that: The transfer chamber (12) is polygonal, and one of the loading chambers (800) or the process chamber (11) is mounted on the outside of each side.

11. The semiconductor process equipment according to claim 8, characterized in that: It also includes a disc-taking arm (400) and a film-taking arm (500); the disc-taking arm (400) and the film-taking arm (500) are mounted on the first robot (600); The tray-taking arm (400) is used to grab the tray, and the sheet-taking arm (500) is used to grab the substrate.

12. A transmission method, characterized in that: Applied to the semiconductor process equipment according to any one of claims 8 to 11, the transmission method comprises: Before performing a semiconductor process, the first robot transfers the tray from the tray receiving portion to the loading chamber; If the posture of the tray in the loading chamber is accurate, the loading chamber adjusts the tray to a preset position of the loading chamber; The first robot transfers the substrate to the groove of the tray in the loading chamber; If the position of the substrate in the tray is correct, the loading chamber preheats the tray and the substrate; The second robot transfers the preheated tray carrying the substrate to a process chamber to perform a semiconductor process on the substrate in the process chamber; After the semiconductor process is completed, the second robot transfers the tray carrying the substrate to the loading chamber.

13. The transmission method according to claim 12, characterized in that: When the semiconductor process equipment includes the position adjustment mechanism and the image recognition system; the transmission method further includes: If the posture of the tray in the loading chamber is inaccurate, the image recognition system obtains the first posture deviation of the tray and transmits the tray to the position adjustment mechanism so that the position adjustment mechanism adjusts the posture of the tray according to the first posture deviation. The first robot transmits the pallet with adjusted posture back to the loading chamber.

14. The transmission method according to claim 12, characterized in that: When the semiconductor process equipment includes the position adjustment mechanism and the image recognition system; the transmission method further includes: If the position of the substrate in the tray is inaccurate, the image recognition system obtains the second posture deviation of the substrate and transmits the substrate to the position adjustment mechanism so that the position adjustment mechanism adjusts the posture of the tray according to the second posture deviation. The first robot transmits the substrate with adjusted posture back to the tray of the loading chamber.

15. The transmission method according to claim 12, characterized in that: The loading chamber comprises a lifting part and a circulation pipe penetrating the upper cover of the loading chamber and the base of the loading chamber; after the semiconductor process is completed, the second robot transfers the tray carrying the substrate to the loading chamber, and the transfer method further comprises: The loading chamber cools the tray and the substrate; The loading chamber separates the cooled tray and the substrate.

16. The transmission method according to claim 15, characterized in that: The lifting part includes a lifting shaft and a support for supporting the substrate; the tray carries a plurality of the substrates; the loading chamber separates the tray and the substrate after cooling, and includes: The lifting shaft drives the upper support member to rise, so that the substrate currently supported by the support member is separated from the tray; After the first robot takes away the substrate that has detached from the tray, the lifting shaft descends, and the tray rotating mechanism drives the tray to rotate so that the lifting shaft is aligned with the support corresponding to the next substrate, and then returns to execute the step of the lifting shaft driving the upper support to rise so that the substrate currently supported by the support is detached from the tray, until all the substrates in the tray are taken away.

Images