Embedded sensor device

Abstract

The invention discloses an embedded sensor device which comprises a shell composed of an outer shell body and an inner shell body, the outer shell body and the inner shell body are connected in a buckled mode through buckles at the edges, and the inner shell body is used for being embedded into a wall of a detection interval; the sensing layer is located in the outer shell of the shell and used for detecting environmental parameters; the signal processing layer is located in the inner shell of the sensing layer and used for processing signals transmitted by the sensing layer; a sensing layer is arranged in the shell, functional modules are embedded in the sensing layer, the functional modules are all of modular structures and can be rapidly pulled and inserted into the sensing layer, the sensing layer is connected with the inner wall of an outer shell of the shell through elastic supporting pieces, and a heat dissipation channel is formed in the side edge of the outer shell of the shell. Through the multi-layer structural design, separation of a sensing layer and a signal processing layer is achieved, the detection precision and the data processing capacity of the device are improved, the device has high flexibility and expansibility due to the modular embedding design, and functional modules can be combined and embedded according to specific requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of embedded sensors, and in particular to an embedded sensor device. Background Art

[0002] With the rapid development of science and technology, embedded sensor devices are increasingly used in various fields and have become an important part of modern information technology. An embedded sensor device is an intelligent device that integrates sensors, data processing units and communication interfaces. It can monitor and collect environmental information in real time and convert it into electrical signals for processing and analysis. These devices are widely used in industrial automation, smart homes, environmental monitoring, medical health and other fields, bringing great convenience to people's lives and work.

[0003] In the field of embedded sensor technology, significant progress has been made in recent years. On the one hand, the types and functions of sensors are constantly enriched, including various types of sensors such as temperature, humidity, pressure, light, sound, etc., which can meet the needs of different application scenarios. On the other hand, the performance of data processing units is constantly improving, which can efficiently process and analyze the collected data and provide more accurate and reliable information. In addition, the development of communication interfaces also provides more options for data transmission of embedded sensor devices, such as wireless communication, Bluetooth, Wi-Fi, etc.

[0004] However, despite the continuous advancement of embedded sensor technology, there are still some technical problems in practical applications. First, the accuracy and stability of the sensor still need to be improved. In some high-precision situations, the measurement error of the sensor may have a significant impact on the performance of the system. In addition, there are many inconveniences when the sensor is damaged and needs to be replaced, and it is impossible to replace it quickly. Summary of the invention

[0005] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide an embedded sensor device.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] The present invention provides an embedded sensor device, comprising:

[0008] A housing, the housing comprising an outer housing and an inner housing, the outer housing and the inner housing being connected by snap fastening at the edges, the inner housing being used to be embedded in the wall of the detection zone;

[0009] a sensing layer, located inside the outer shell of the housing, for detecting environmental parameters;

[0010] A signal processing layer, located inside the inner shell of the sensing layer, for processing the signal transmitted by the sensing layer;

[0011] Functional modules are embedded in the sensing layer. The functional modules are modular in structure and can be quickly plugged in and out of the sensing layer. The sensing layer is connected to the inner wall of the outer shell of the shell through an elastic support. A heat dissipation channel is provided on the side of the outer shell of the shell.

[0012] As a preferred technical solution of the present invention, the functional module includes temperature, humidity, pressure and gas detection sensors, and each sensor works independently.

[0013] As a preferred technical solution of the present invention, the signal processing layer includes a data processing module and a wireless communication module. The data processing module is located in the center of the signal processing layer, and the wireless communication module is located at the edge of the signal processing layer. The data processing module fuses the data of multiple sensors through a multi-channel ADC and MCU, and performs real-time processing and analysis of the sensor data. The wireless communication module is used to transmit the processed data to an external device.

[0014] As a preferred technical solution of the present invention, the signal processing layer further includes:

[0015] Adaptive adjustment module, used to automatically adjust detection parameters according to historical data and environmental changes;

[0016] Fault self-diagnosis module, used to monitor the working status of the sensor in real time and automatically alarm when abnormalities are found;

[0017] Microprocessor, used to run preset algorithm programs and control the working parameters of the sensor.

[0018] As a preferred technical solution of the present invention, the number of the elastic support members is four, and they are distributed at the four corners of the sensing layer. The elastic support members include a connecting rod, a positioning head and a spring. The bottom end of the connecting rod is provided with a threaded joint. Threaded seats connected to the threads of the bottom end of the connecting rod are installed at the four corners of the inner cavity of the shell of the shell. The number of the positioning heads is two. The spring is located between the sensing layer and the threaded seat, and is limited by the positioning head.

[0019] As a preferred technical solution of the present invention, a plurality of guide rails are arranged side by side on the surface of the sensing layer, an electrical connector is arranged at one end of the guide rail, and the electrical connector is located at the edge of the sensing layer, a female buckle is arranged on the side of the electrical connector, a slide groove matching the guide rail spacing is arranged at the bottom end of the functional module, a male buckle is arranged on the side of the functional module, and a pin matching the electrical connector is arranged at one end of the functional module.

[0020] As a preferred technical solution of the present invention, the heat dissipation channel includes a plurality of heat dissipation holes and heat dissipation fins.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention realizes the separation of the sensing layer and the signal processing layer through a multi-layer structural design, thereby improving the detection accuracy and data processing capability of the device. The modular embedded design makes the device highly flexible and extensible, and the functional modules can be combined and embedded according to specific needs.

[0023] The sensor device of the present invention integrates multiple sensing functions and can detect multiple environmental parameters at the same time. The multifunctional integrated design not only improves the detection capability of the device, but also reduces the complexity of installation and maintenance. It also facilitates the replacement of sensor types of functional modules and has stronger applicability.

[0024] The independent suspension structure design of the present invention can effectively reduce the influence of external vibration and impact on the sensor performance inside the outer shell, improve the measurement accuracy, and the integrated heat dissipation channel ensures the stable operation of the device in a high temperature environment.

[0025] The present invention integrates an adaptive adjustment module and a fault self-diagnosis module, can automatically adjust detection parameters according to environmental changes, and monitor the working status of the sensor in real time, thereby improving the intelligence level of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is an internal cross-sectional view of the overall structure of the present invention;

[0029] Figure 3 yes Figure 2 A schematic diagram of the structure enlargement in the middle;

[0030] Figure 4 is a schematic diagram of the sensing layer structure of the present invention;

[0031] Figure 5 It is a schematic diagram of the functional module structure of the present invention;

[0032] In the figure: 1, housing; 2, sensing layer; 3, signal processing layer; 4, functional module; 11, threaded seat; 21, connecting rod; 22, positioning head; 23, spring; 41, guide rail; 42, electrical connector; 43, female buckle; 44, slide groove; 45, male buckle. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0034] Example 1

[0035] like Figure 1-5 As shown, the present invention provides an embedded sensor device, comprising:

[0036] Shell 1, which consists of an outer shell and an inner shell. The outer shell and the inner shell are connected by snap fastening at the edge, and the inner shell is used to be embedded in the wall of the detection area;

[0037] The sensing layer 2 is located inside the outer shell of the shell 1 and is used to detect environmental parameters;

[0038] The signal processing layer 3 is located inside the inner shell of the sensing layer 2 and is used to process the signal transmitted by the sensing layer 2;

[0039] Functional modules 4 are embedded in the sensing layer 2. The functional modules 4 are modular in structure and can be quickly plugged in and out of the sensing layer 2. The sensing layer 2 is connected to the inner wall of the outer shell of the shell 1 through an elastic support. A heat dissipation channel is provided on the side of the outer shell of the shell 1.

[0040] Furthermore, the functional module 4 includes temperature, humidity, pressure and gas detection sensors, and each sensor works independently.

[0041] Furthermore, the signal processing layer 3 includes a data processing module and a wireless communication module. The data processing module is located in the center of the signal processing layer 3, and the wireless communication module is located at the edge of the signal processing layer 3. The data processing module fuses the data of multiple sensors through a multi-channel ADC and MCU, and performs real-time processing and analysis of the sensor data. The wireless communication module is used to transmit the processed data to an external device.

[0042] Furthermore, the signal processing layer 3 also includes:

[0043] Adaptive adjustment module, used to automatically adjust detection parameters according to historical data and environmental changes;

[0044] Fault self-diagnosis module, used to monitor the working status of the sensor in real time and automatically alarm when abnormalities are found;

[0045] Microprocessor, used to run preset algorithm programs and control the working parameters of the sensor.

[0046] Furthermore, the number of elastic support members is four, and they are distributed at the four corners of the sensing layer 2. The elastic support members include a connecting rod 21, a positioning head 22 and a spring 23. A threaded joint is provided at the bottom end of the connecting rod 21. Threaded seats 11 threadedly connected to the bottom end of the connecting rod 21 are installed at the four corners of the inner cavity of the shell 1. The number of positioning heads 22 is two. The spring 23 is located between the sensing layer 2 and the threaded seat 11, and is limited by the positioning head 22.

[0047] Furthermore, a plurality of guide rails 41 are arranged side by side on the surface of the sensing layer 2, an electrical connector 42 is arranged at one end of the guide rail 41, and the electrical connector 42 is located at the edge of the sensing layer 2, a female buckle 43 is arranged on the side of the electrical connector 42, a slide groove 44 matching the spacing of the guide rail 41 is arranged at the bottom end of the functional module 4, a male buckle 45 is arranged on the side of the functional module 4, and a pin matching the electrical connector 42 is arranged at one end of the functional module 4.

[0048] Furthermore, the heat dissipation channel includes a plurality of heat dissipation holes and heat dissipation fins.

[0049] Specifically, installation and configuration:

[0050] First, the sensor device is installed in the environment to be monitored. Since the device adopts a modular design, a suitable functional module 4 can be selected according to specific needs to be embedded in the sensing layer 2.

[0051] During installation, first embed the inner shell of the housing 1 into the wall or moving object of the installation environment, and then install different types of sensors of the functional module 4. In this embodiment, the types of sensors integrated are: temperature, humidity, and pressure sensors. In addition, sensors such as light, sound, and vibration can also be integrated to expand the application scenarios. After selecting the functional module 4, align the slide groove 44 below the functional module 4 with the guide rail 41 on the sensing layer 2, and then push along the guide rail 41 to one side of the electrical connector 42 until the male buckle 45 and the female buckle 43 are buckled to make a "click" sound. At this time, the pin on the functional module 4 is also connected to the electrical connector 42, and finally the sensing layer 2 is installed in the outer shell 1 of the housing 1 through the elastic support. Align the connecting rod 21 with the threaded seat 11 and screw it in, so that the sensing layer 2 is elastically supported by the spring 23 as a whole, thereby reducing the impact on the sensor when it is subjected to external collision. Then connect the sensing layer 2 with the signal processing layer 3 circuit in the inner shell, and assemble the outer shell and the inner shell of the housing 1 together. Check that the heat dissipation on both sides of the shell 1 is unobstructed, and the heat dissipation holes and heat sinks are evenly distributed on both sides, so that efficient heat dissipation can be achieved through air convection, ensuring the stable operation of the sensor in a high temperature environment. Finally, the shell is integrated with other devices through the standardized interface below the shell 1.

[0052] Data collection and processing:

[0053] After the sensor device is started, the sensing layer 2 starts to detect environmental parameters and transmits the detected data to the signal processing layer 3. The microprocessor regularly runs the fault detection algorithm in the fault self-diagnosis module to monitor the output signal of the sensor. If a signal abnormality is detected (such as excessive noise or signal loss), the microprocessor generates a diagnostic report and sends it to the external device through the wireless communication module.

[0054] In addition, the microprocessor also regularly runs the adaptive algorithm in the adaptive adjustment module. For example, when the ambient temperature rises, the sampling frequency of the sensor is automatically increased to ensure the stability of the data.

[0055] The data processing module in the signal processing layer 3 processes and analyzes the sensor data in real time to extract useful information. The processed data is transmitted to external devices through the wireless communication module. Wireless communication technologies such as LoRa or NB-IoT achieve low-power and long-distance data transmission. After the external device receives the data transmitted by the sensor device, it can display and analyze the data through dedicated software. Users can monitor the changes in environmental parameters in real time and make corresponding adjustments and controls as needed. For example, in a smart home system, users can adjust the working status of air conditioners and humidifiers based on temperature and humidity data.

[0056] Module replacement:

[0057] Since the device adopts modular design, each functional module 4 can be easily disassembled and replaced. When the sensor module fails, the outer shell can be removed, the connection between the sensor layer 2 and the signal processing layer 3 can be cut off, the male buckle 45 and the female buckle 43 can be separated, and the functional module 4 can be removed and replaced with a new sensor module to ensure the long-term stable operation of the device.

[0058] The present invention realizes the separation of the sensing layer and the signal processing layer through a multi-layer structural design, thereby improving the detection accuracy and data processing capability of the device. The modular embedded design makes the device highly flexible and extensible, and the functional modules can be combined and embedded according to specific needs.

[0059] The sensor device of the present invention integrates multiple sensing functions and can detect multiple environmental parameters at the same time. The multifunctional integrated design not only improves the detection capability of the device, but also reduces the complexity of installation and maintenance. It also facilitates the replacement of sensor types of functional modules and has stronger applicability.

[0060] The independent suspension structure design of the present invention can effectively reduce the influence of external vibration and impact on the sensor performance inside the outer shell, improve the measurement accuracy, and the integrated heat dissipation channel ensures the stable operation of the device in a high temperature environment.

[0061] The present invention integrates an adaptive adjustment module and a fault self-diagnosis module, can automatically adjust detection parameters according to environmental changes, and monitor the working status of the sensor in real time, thereby improving the intelligence level of the equipment.

[0062] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An embedded sensor device, characterized in that: include: A housing (1), the housing (1) comprising an outer housing and an inner housing, the outer housing and the inner housing being connected by snap fastening at the edges, the inner housing being used to be embedded in the wall of the detection zone; A sensing layer (2), located inside the outer shell of the shell (1), for detecting environmental parameters; A signal processing layer (3), located inside the inner shell of the sensing layer (2), and used for processing the signal transmitted by the sensing layer (2); The sensing layer (2) is embedded with a functional module (4), and the functional module (4) is a modular structure and can be quickly plugged in and out of the sensing layer (2). The sensing layer (2) is connected to the inner wall of the outer shell of the shell (1) via an elastic support member, and a heat dissipation channel is provided on the side of the outer shell of the shell (1).

2. The embedded sensor device according to claim 1, characterized in that: The functional module (4) comprises temperature, humidity, pressure and gas detection sensors, and each sensor works independently.

3. The embedded sensor device according to claim 2, characterized in that: The signal processing layer (3) comprises a data processing module and a wireless communication module, wherein the data processing module is located in the center of the signal processing layer (3), and the wireless communication module is located at the edge of the signal processing layer (3). The data processing module fuses the data of multiple sensors through a multi-channel ADC and an MCU, and processes and analyzes the sensor data in real time, and the wireless communication module is used to transmit the processed data to an external device.

4. The embedded sensor device according to claim 3, characterized in that: The signal processing layer (3) further comprises: Adaptive adjustment module, used to automatically adjust detection parameters according to historical data and environmental changes; Fault self-diagnosis module, used to monitor the working status of the sensor in real time and automatically alarm when abnormalities are found; Microprocessor, used to run preset algorithm programs and control the working parameters of the sensor.

5. The embedded sensor device according to claim 1, characterized in that: The elastic support members are four in number and are distributed at the four corners of the sensing layer (2). The elastic support members include a connecting rod (21), a positioning head (22) and a spring (23). The bottom end of the connecting rod (21) is provided with a threaded joint. The four corners of the inner cavity of the shell of the shell (1) are provided with threaded seats (11) threadedly connected to the bottom end of the connecting rod (21). The positioning heads (22) are two in number. The spring (23) is located between the sensing layer (2) and the threaded seat (11), and is limited by the positioning head (22).

6. The embedded sensor device according to claim 1, characterized in that: The surface of the sensing layer (2) is provided with a plurality of guide rails (41) arranged side by side, an electrical connector (42) is arranged at one end of the guide rails (41), and the electrical connector (42) is located at the edge of the sensing layer (2), a female buckle (43) is arranged on the side of the electrical connector (42), a slide groove (44) matching the spacing of the guide rails (41) is arranged at the bottom end of the functional module (4), a male buckle (45) is arranged on the side of the functional module (4), and a pin matching the electrical connector (42) is arranged at one end of the functional module (4).

7. The embedded sensor device according to claim 1, characterized in that: The heat dissipation channel includes a plurality of heat dissipation holes and heat dissipation fins.

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