Semiconductor substrate cleaning device

Abstract

The invention discloses a semiconductor substrate cleaning device, and mainly relates to the technical field of semiconductor substrate cleaning. Comprising a cleaning head and a workbench used for locking a semiconductor substrate, a rotating shaft is arranged at the bottom of the workbench, a connecting piece is arranged on the outer wall of the cleaning head, at least one bending part is arranged on the connecting piece, and the end, away from the cleaning head, of the connecting piece is horizontally arranged; a first driving device used for driving the connecting piece to rotate around a horizontal shaft is arranged at the end, away from the cleaning head, of the connecting piece, a mounting frame is arranged at the end, away from the connecting piece, of the first driving device, and a second driving device used for driving the mounting frame to rotate around a vertical shaft is arranged at the bottom of the mounting frame. A locking piece for locking the semiconductor substrate is arranged at the top of the workbench; the present invention can apply the same cleaning force to the main surface and the side surface of the substrate, and can change the angle of the ejector during cleaning without changing the ejection distance.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor substrate cleaning, in particular to a semiconductor substrate cleaning device. Background Art

[0002] Existing devices for cleaning semiconductor substrates generally adopt a rotary structure, in which the substrate is placed on a rotating table and rotated horizontally to prevent the substrate from being broken, and a cleaning liquid, pure water or chemical solution is injected into the rotating table and sprayed onto the substrate using a sprayer. The sprayer is generally provided with a spray port, an ultrasonic vibrator is provided at the other end opposite to the spray port, and a cleaning liquid supply port is provided on the side. The supplied cleaning liquid can vibrate through the ultrasonic vibrator and spray out from the nozzle. The sprayer is fixed on an arm, and the arm is connected to a vertical support shaft near a fixed table. Then, the arm rotates with the rotation of the support shaft, and the sprayer rotates above the rotating table in parallel with the table, thereby cleaning the entire main surface of the substrate from the center to the periphery.

[0003] The substrate cleaning device with a rotary structure adopts an imaginary circle with the injection hole as the center of rotation of the injector along the substrate surface, and includes an arc-shaped guide member moving in the rotating plane, which can change the angle of the injector relative to the substrate surface, and can clean the rotation center of the substrate regardless of the film thickness or type of contaminants on the substrate surface. However, during use, if the angle of the sprayer is determined according to the thickness of the dirt on the substrate surface or the type of contaminants, the angle cannot be changed during cleaning, so the sound pressure of the liquid suspended on the side of the substrate is significantly weaker than the sound pressure sprayed on the main surface of the substrate; in addition, the distance from the spray nozzle to the cleaning liquid reaching the substrate becomes longer as the angle of the sprayer changes, so the sound pressure is attenuated and the cleaning power is reduced. Summary of the invention

[0004] The object of the present invention is to solve the problems existing in the prior art and to provide a semiconductor substrate cleaning device capable of applying the same cleaning force to the main surface and the side of the substrate and changing the angle of the injector during cleaning without changing the injection distance.

[0005] In order to achieve the above object, the present invention is implemented through the following technical solutions:

[0006] A semiconductor substrate cleaning device comprises a cleaning head and a workbench for locking the semiconductor substrate, wherein a rotating shaft is provided at the bottom of the workbench, a connecting piece is provided on the outer wall of the cleaning head, and at least one bending portion is provided on the connecting piece, the connecting piece is horizontally arranged at one end of the connecting piece away from the cleaning head, and a first driving device for driving the connecting piece to rotate around a horizontal axis is provided at the end of the connecting piece away from the cleaning head, a mounting frame is provided at the end of the first driving device away from the connecting piece, a second driving device for driving the mounting frame to rotate around a vertical axis is provided at the bottom of the mounting frame, and a locking piece for locking the semiconductor substrate is provided at the top of the workbench.

[0007] Preferably, the cleaning head comprises a nozzle and an ultrasonic vibrator mounted on the top of the nozzle.

[0008] Preferably, the locking member includes a plurality of locking columns evenly arranged along the circumference of the workbench, a locking plate is provided in the middle of the top of the locking column, the locking column is installed on the workbench by screws, a screw hole is provided at the bottom of the locking column, and the screw passes through the workbench from bottom to top and is screwed into the screw hole.

[0009] Preferably, the connecting member is an L-shaped frame, and a portion of the projection of the first driving device in the horizontal plane is located on the workbench or the entire projection is located on the workbench.

[0010] Preferably, the connecting member is a U-shaped frame, and the projection of the first driving device in the horizontal plane is located outside the workbench.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] The present invention can change the angle of the cleaning head during cleaning without significantly changing the spray distance, thereby exerting the same cleaning force on the side of the substrate as on the main surface, so that every corner of the entire substrate is covered and can be kept clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is one of the structural schematic diagrams of the present invention in Example 1;

[0014] Figure 2 This is the second structural diagram of the present invention in Example 1;

[0015] Figure 3 It is a schematic diagram of the structure of the present invention in Example 2.

[0016] The numbers in the accompanying drawings are: 1, cleaning head; 2, workbench; 21, rotating shaft; 3, connecting piece; 31, bending portion; 4, first driving device; 5, mounting frame; 6, second driving device; 7, locking column; 71, locking plate; 72, screw; 8, semiconductor substrate. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the application equally.

[0018] Embodiment 1: As attached Figure 1-2 As shown, the present invention is a semiconductor substrate cleaning device, including a cleaning head 1 and a workbench 2 for locking a semiconductor substrate 8. A rotating shaft 21 is provided at the bottom of the workbench 2. The rotating shaft 21 is connected to a driving motor, and the driving motor drives the workbench 2 to rotate around a vertical axis.

[0019] Preferably, in order to improve the cleaning effect, the cleaning head 1 includes a nozzle and an ultrasonic vibrator installed on the top of the nozzle. The nozzle can be a sprayer that can perform directional spraying in one direction.

[0020] The internal space of the cleaning head 1 is in the shape of an inverted frustum of a cone that tapers from top to bottom, and a nozzle is installed at the bottom of the cleaning head 1. Cleaning liquid supply ports are provided on both sides of the bottom of the cleaning head 1, and the supply ports are connected to supply pipes. The ultrasonic vibrator is excited and vibrated by a voltage applied by an external power source through wiring, and the ultrasonic wave sprays the liquid supplied by the supply pipe from the nozzle.

[0021] A connecting member 3 is provided on the outer wall of the cleaning head 1, and at least one bending portion 31 is provided on the connecting member 3. The end of the connecting member 3 away from the cleaning head 1 is arranged horizontally, and a first driving device 4 for driving the connecting member 3 to rotate around a horizontal axis is provided at the end of the connecting member 3 away from the cleaning head 1. The axis center line of the end of the connecting member 3 close to the cleaning head 1 and the end of the connecting member 3 close to the first driving device 4 do not coincide. The bending portion on the connecting member 3 is preferably bent at 90°.

[0022] A mounting frame 5 is provided at one end of the first driving device 4 away from the connecting member 3, and a second driving device 6 for driving the mounting frame 5 to rotate around a vertical axis is provided at the bottom of the mounting frame 5. A locking member for locking the semiconductor substrate is provided on the top of the workbench 2.

[0023] Preferably, to facilitate locking of the semiconductor substrate, the locking member includes a plurality of locking columns 7 uniformly arranged along the circumference of the workbench 2, and three locking columns 7 can be used. A locking plate 71 is provided in the middle of the top of the locking column 7. The locking column 7 is installed on the workbench 2 by means of screws 72. A screw hole is provided at the bottom of the locking column 7. The screw 72 penetrates the workbench 2 from bottom to top and is screwed into the screw hole. The locking plates 71 are uniformly arranged along the circumference of the semiconductor substrate 8. The locking columns 7 are rotated to adjust the angle of the locking plates 71, thereby locking the semiconductor substrate 8. Tightening the screws 72 can prevent the locking columns 7 from rotating, thereby preventing the semiconductor substrate 8 from falling off.

[0024] Preferably, the connecting member 3 is an L-shaped frame, and the first driving device 4 can be a motor. One end of the L-shaped frame is fixed to the outer wall of the cleaning head 1, and the other end is transmission-connected to the first driving device through a connecting sleeve. A part of the projection of the first driving device 4 in the horizontal plane is located on the workbench 2 or the entirety is located on the workbench 2. When viewed from above, the L-shaped frame overlaps with the workbench 2, but the height of the L-shaped frame is higher than the workbench, so that the two will not interfere with each other.

[0025] When the present invention is in use, the semiconductor substrate 8 is first locked on the workbench 2 by using a locking piece 1, and then the cleaning head 1 sprays cleaning liquid onto the semiconductor substrate 8, the workbench 2 rotates, and at the same time the second driving device 6 drives the first driving device 4 and the cleaning head 1 to rotate around the vertical axis. When the cleaning head 1 is used to clean the main surface of the semiconductor substrate 8, the cleaning head 1 is upright or slightly tilted in the vertical direction; next, when cleaning the side of the semiconductor substrate 8, the first driving device 4 drives the cleaning head 1 to rotate around the horizontal axis, and the cleaning head 1 rotates in a direction away from the center of the semiconductor substrate 8 until it rotates to the point where when cleaning the main surface and side of the semiconductor substrate 8, the spray distance can be kept almost constant, so that the entire substrate can be cleaned evenly.

[0026] Embodiment 2: As attached Figure 3 As shown, on the basis of embodiment 1, this embodiment further improves the shape of the connecting member 3, the connecting member 3 is a U-shaped frame, the projection of the first driving device 4 in the horizontal plane is located outside the workbench 2, the connecting member 3 has two right-angle bending points, the two right-angle bending points are at an odd angle to each other, and there is a bending point at its tip, which is connected to the side of the cleaning head 1. The first bending point is located after the connection and the first driving device 4 exit the mating part, and the nozzle is fixed in the center line of the nozzle and the ultrasonic transducer is contained in the plane formed by the thickness center line of the second arm.

[0027] In this embodiment, when cleaning the semiconductor substrate 8, first, the cleaning liquid is sprayed from the nozzle to the semiconductor substrate 8, so that the workbench 1 rotates, and at the same time, the second driving device 6 drives the first driving device 4 and the cleaning head 1 to rotate around the vertical axis. When the cleaning head 1 is used to clean the main surface of the semiconductor substrate 8, the cleaning head 1 is upright or slightly tilted in the vertical direction; next, when cleaning the side of the semiconductor substrate 8, the nozzle is pushed out of the vertical projection range of the semiconductor substrate 8, and the nozzle is pushed out of the vertical projection range of the semiconductor substrate 8 by the rotating connecting member 3. The upper end of the nozzle moves away from the center of the semiconductor substrate 8.

[0028] According to the cleaning apparatus of the present invention, the main surface and the side surfaces of a thin substrate can be cleaned in detail, and thus it is suitable for cleaning semiconductor wafers and glass substrates for liquid crystal displays.

Claims

1. A semiconductor substrate cleaning device, comprising a cleaning head (1) and a workbench (2) for locking the semiconductor substrate, wherein a rotating shaft (21) is provided at the bottom of the workbench (2), characterized in that: A connecting piece (3) is provided on the outer wall of the cleaning head (1), and at least one bending portion (31) is provided on the connecting piece (3). The end of the connecting piece (3) away from the cleaning head (1) is arranged horizontally, and a first driving device (4) for driving the connecting piece (3) to rotate around a horizontal axis is provided at the end of the connecting piece (3) away from the cleaning head (1). A mounting frame (5) is provided at the end of the first driving device (4) away from the connecting piece (3). A second driving device (6) for driving the mounting frame (5) to rotate around a vertical axis is provided at the bottom of the mounting frame (5), and a locking piece for locking a semiconductor substrate is provided at the top of the workbench (2).

2. A semiconductor substrate cleaning device according to claim 1, characterized in that: The cleaning head (1) comprises a nozzle and an ultrasonic vibrator mounted on the top of the nozzle.

3. A semiconductor substrate cleaning device according to claim 1, characterized in that: The locking member comprises a plurality of locking columns (7) uniformly arranged along the circumference of the workbench (2); a locking plate (71) is provided in the middle of the top of the locking column (7); the locking column (7) is mounted on the workbench (2) by means of screws (72); a screw hole is provided at the bottom of the locking column (7); the screw (72) penetrates the workbench (2) from bottom to top and is screwed into the screw hole.

4. The semiconductor substrate cleaning device according to claim 1, characterized in that: The connecting member (3) is an L-shaped frame, and a portion of the projection of the first driving device (4) in the horizontal plane is located on the workbench (2) or the entire projection is located on the workbench (2).

5. The semiconductor substrate cleaning device according to claim 1, characterized in that: The connecting member (3) is a U-shaped frame, and the projection of the first driving device (4) in the horizontal plane is located outside the workbench (2).

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