System and method for monitoring and repairing wafer deformation of rapid heat treatment equipment

Abstract

The invention provides a system and method for monitoring and repairing wafer deformation of rapid heat treatment equipment, and belongs to the technical field of semiconductor manufacturing and processing.The system comprises a cavity and an adjusting structure, a rotating device is installed on the surface of the lower end of the cavity, and a plurality of heating lamps are arranged in the cavity; the heating lamps are connected with the cavity through an adjusting structure, three displacement sensors are installed in the cavity, seven thermometers are installed in the cavity, connecting wires are installed at the lower ends of the temperature sensors and the thermometers, temperature controllers are installed at the lower ends of the connecting wires, and a quartz window is installed in the cavity. According to the method, the deformation degree of the wafer in the technological process is monitored in real time, alarm monitoring and correction are carried out according to the actual deformation degree, and the OOP problem caused by inaccurate low-temperature temperature measurement and unreasonable temperature difference value setting range setting is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing and processing, and in particular relates to a system and method for rapid thermal processing equipment to monitor and repair wafer deformation. Background Art

[0002] ISSG (In-situ Steam Generation) is a rapid thermal processing equipment. Compared with traditional high-temperature furnace thermal annealing, this rapid thermal processing equipment has better ability to repair defects and activate impurities. It can quickly heat and cool silicon wafers in a short time. The temperature uniformity during the heating process is crucial to the process results. In actual application, if the wafer is heated unevenly, it will deform, which may cause problems such as slippage and fragmentation during the process. Therefore, it is necessary to monitor the wafer heating status in real time during the process to prevent OOP (Out of Pocket) problems as much as possible. In the prior art, there is an inaccurate temperature measurement problem when using an infrared radiation thermometer to measure in a low temperature area. The main reasons are as follows: According to the blackbody radiation law, the lower the wafer temperature, the lower its radiation energy density. Therefore, at low temperatures, the radiation energy received by the thermometer is weak and the signal-to-noise ratio is low. At this time, the temperature signal may fluctuate greatly and cannot reflect the actual temperature of the wafer. Wafers with structures have different heat absorption capabilities in different areas. It is difficult to apply temperature difference alarm monitoring to all types of wafers. If the setting range is too large, the monitoring function cannot be started, which directly causes OOP or even fragmentation problems. If the setting range is too small, it is very easy to cause false alarms and force the process to stop. The temperature difference cannot directly reflect the deformation of the wafer, resulting in the inability to timely and accurately alarm. The present invention combines a laser displacement sensor to monitor the real-time distance changes of fixed points on the wafer, directly detects wafer deformation, and then adjusts the power output of the heating lamp. The deformation of the wafer can be corrected and an alarm can be issued in time, minimizing the risk of OOP. Summary of the invention

[0003] Based on the problems existing in the prior art, the present invention proposes a system and method for rapid thermal processing equipment to detect and repair wafer deformation. The deformation and warping of the wafer can be monitored in real time during the heating process. By monitoring the deformation degree of the wafer during the process in real time, alarm monitoring and correction are performed according to the actual deformation degree, thereby avoiding the OOP problem caused by inaccurate low-temperature temperature measurement and unreasonable temperature difference setting range setting, and solving the problem that the existing temperature difference alarm monitoring method cannot reflect the actual wafer deformation, causing the appearance of slippery sheets and fragments during the heating process.

[0004] In order to achieve the above-mentioned purpose, according to the first aspect of the technical solution of the present invention, there is provided a system for rapid thermal processing equipment to monitor and repair wafer deformation, which includes a cavity and an adjustment structure, a rotating device is installed on the surface of the lower end of the cavity, and a plurality of heating lamps are arranged inside the cavity, and the plurality of heating lamps are connected to the cavity by means of the adjustment structure.

[0005] Preferably, three displacement sensors are installed inside the cavity, seven thermometers are installed inside the cavity, connecting wires are installed at the lower ends of the temperature sensors and the thermometers, and a temperature controller is installed at the lower ends of the connecting wires.

[0006] Preferably, a quartz window is installed inside the cavity, an edge ring is installed inside the cavity, a wafer is placed above the edge ring, and a reflector is installed inside the cavity.

[0007] Preferably, an upper surface of the cavity is provided with an adjustment structure, and the adjustment structure comprises a fixing plate, the fixing plate is fixedly connected to the cavity, and a hydraulic rod is installed on the upper surface of the fixing plate.

[0008] Furthermore, the arc surface of the output end of the hydraulic rod is rotatably connected to a swivel, the arc surface of the swivel is fixedly connected to a mounting rod, the end of the mounting rod away from the swivel is fixedly connected to an auxiliary rod, and the arc surface of the auxiliary rod is fixedly connected to a plurality of connecting rods.

[0009] Furthermore, the lower end of the connecting rod is fixedly connected to a circular plate, the lower surface of the circular plate is fixedly connected to a plurality of connecting rods, the lower end of the connecting rod is fixedly connected to the heating lamp, and the upper surface of the cavity is installed with a plurality of positioning rods.

[0010] Preferably, the arc surface of the circular plate is fixedly connected with a plurality of auxiliary plates, the auxiliary plates are slidably connected with the positioning rod, and the inner wall of the mounting rod is slidably connected with an insertion rod. Preferably, the arc surface of the output end of the hydraulic rod is fixedly connected with a mounting plate, the inner wall of the mounting plate is provided with an insertion hole, and the insertion rod is adapted to the insertion hole.

[0011] Preferably, the arc surface of the insertion rod is sleeved with a spring, and the two ends of the spring are fixedly connected to the insertion rod and the mounting rod respectively. Preferably, the connecting rod is a stainless steel rod, and the cross section of the stainless steel rod is circular.

[0012] According to a second aspect of the technical solution of the present invention, a method for monitoring and repairing wafer deformation in a rapid thermal processing equipment is provided, which comprises the following steps: Step S1: After the wafer is passed into the cavity and falls on the edge ring, the laser displacement sensor emits laser to a fixed point to detect the initial height S0 of the wafer from the reflector, which is defined as the reference distance. The height difference of the three reference measurement points is monitored at the same time. If the difference is within the allowable range, it is considered that the wafer is level in the cavity and the process can be performed normally. Step S2: During the process, the wafer is rotated at a fixed speed by a magnetic suspension device, and the displacement sensor measures the distance of fixed emission points at a certain frequency. The real-time height of the three fixed points is defined as S1; Step S3: Calculate the wafer surface deformation through the real-time distance of the wafer detection point; Feedback the wafer deformation information to the temperature controller, and the temperature controller adjusts the voltage output of the three lamp areas according to the distance of the three distance measurement points. The relationship between the control voltage of each lamp area and the distance measurement height can be simplified as the relationship: V=P*(S1-S0)+I*S1 S0: initial height of the distance measurement point, S1: real-time height; V: output voltage of the sensor corresponding to the light area; P and I are both proportional coefficients of the control process; If S1>S0, the power output of the lamp area needs to be increased; if S1<S0, the power output of the corresponding lamp area needs to be reduced, and the distance between the three sampling points and S1 is compared in real time. When the real-time distance difference between the three points is adjusted to the allowable range, stop the power adjustment of the temperature controller.

[0013] Compared with the prior art, the advantages and positive effects of the present invention are: 1. The present invention achieves the method of monitoring and correcting wafer deformation in the present technology by setting an overall structure, monitors the deformation degree of the wafer in the process in real time, performs alarm monitoring and correction according to the actual deformation degree, and avoids the OOP problem caused by inaccurate low-temperature temperature measurement and unreasonable setting of the temperature difference setting range.

[0014] 2. The present invention provides an adjustment structure, so that the heating lamp can be quickly removed when the heating lamp stops in an emergency, and the heating lamp can be separated from the wafer, so as to avoid the difficulty in discharging the residual heat of the heating lamp after the heating stops.

[0015] 3. The present invention provides a recovery structure to facilitate external resetting of the wafer after displacement, thereby avoiding the difficulty in resetting the wafer after displacement and the manual resetting that easily leaves fingerprints on the wafer.

[0016] 4. The present invention provides a wire bundling structure, so that the connecting wires can be easily bundled, thereby preventing the connecting wires from getting tangled during use and accelerating the aging of the connecting wires. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A three-dimensional structural schematic diagram of a system for monitoring and repairing wafer deformation in rapid thermal processing equipment is provided in the present invention; Figure 2 The present invention provides a schematic diagram of the internal structure of a system for rapid thermal processing equipment to detect and repair wafer deformation; Figure 3 The present invention provides a top view of a system for monitoring and repairing wafer deformation in rapid thermal processing equipment; Figure 4 The present invention proposes a schematic diagram of the adjustment structure of a system for monitoring and repairing wafer deformation in rapid thermal processing equipment; Figure 5 A schematic diagram of the recovery structure of a system for monitoring and repairing wafer deformation in a rapid thermal processing device is provided for the present invention; Figure 6 The present invention proposes a system for monitoring and repairing wafer deformation in rapid thermal processing equipment Figure 5 A schematic diagram of the side structure of Figure 7 The present invention proposes a system for monitoring and repairing wafer deformation in rapid thermal processing equipment Figure 6 A magnified image of point A; Figure 8 The present invention proposes a schematic diagram of the beam structure of a system for monitoring and repairing wafer deformation in rapid thermal processing equipment; Fig. 9 The present invention proposes a system for monitoring and repairing wafer deformation in rapid thermal processing equipment Figure 8 Schematic diagram of part of the structure.

[0018] Legend: 1. Rotating device; 2. Heating lamp; 3. Quartz window; 4. Thermometer; 5. Reflecting plate; 6. Temperature controller; 7. Displacement sensor; 8. Wafer; 9. Edge ring; 10. Cavity; 11. Adjusting structure; 1101. Fixing plate; 1102. Mounting plate; 1103. Socket; 1104. Hydraulic rod; 1105. Rotating ring; 1106. Inserting rod; 1107. Spring; 1108. Connecting rod; 1109. Mounting rod; 1110. Auxiliary rod; 1111. Auxiliary plate; 1112. Positioning rod; 1113. Round plate; 1114. Connecting rod; 12. Restoring structure; 1201. Connecting rail; 1202. Limiting rod; 1203. Connecting block; 1204, sliding rod; 1205, reset plate; 1206, protective pad; 1207, notch; 1208, round pad; 1209, handle; 1210, rotating groove; 1211, rotating rod; 1212, snap ring; 1213, clamping block; 1214, fixing rod; 1215, connecting block; 1216, limiting block; 1217, coil spring; 1218, shaft rod; 1219, turntable; 13, wiring harness structure; 1301, connecting plate; 1302, clamping plate; 1303, rectangular plate; 1304, protective cover; 1305, sliding bar; 1306, connecting groove; 1307, round rod; 1308, magnetic sheet; 1309, iron sheet; 1310, wiring harness groove. DETAILED DESCRIPTION

[0019] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0020] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0021] The present invention provides a system and method for rapid thermal processing equipment to detect and repair wafer deformation. It is a technology for monitoring and correcting wafer deformation, real-time monitoring of the deformation degree of the wafer during the process, and alarm monitoring and correction according to the actual deformation degree, avoiding the OOP problem caused by inaccurate low-temperature temperature measurement and unreasonable temperature difference setting range. The present invention uses a displacement sensor to detect wafer deformation for alarm monitoring and correction (inventive point), which solves the problem of the prior art that in the low-temperature stage, the temperature difference alarm is not accurate enough, resulting in the appearance of sliding plates and fragments during the heating process, and achieves the effect of real-time monitoring and repairing the deformation of the wafer during the process, and preventing the OOP problem of the wafer during the process.

[0022] The present invention uses a displacement sensor to monitor wafer deformation, reducing the risk of wafer deformation being unable to be responded to in time through temperature difference alarm monitoring and causing debris. The present invention combines a displacement ranging sensor with a temperature controller, controls the temperature controller to adjust the power output after detecting wafer deformation, and corrects the wafer deformation in time.

[0023] The system for monitoring and repairing wafer deformation of rapid thermal processing equipment of the present invention comprises a rotating device 1, a heating lamp 2, a quartz window 3, a thermometer 4, a reflecting plate 5, a temperature controller 6, a displacement sensor 7, a wafer 8 and an edge ring 9, wherein the rotating device 1 is a ring structure and is installed outside the cavity structure; the heating lamp 1 heats the wafer 8; the quartz window 3 is a circular structure to isolate the heating lamp area from the environment in the chamber; the number of thermometers 4 is usually 5-8 and they are arranged along the radial direction of the reflecting plate 5; the reflecting plate 5 is a circular structure and is used to evenly reflect the thermal radiation emitted by the wafer back to the wafer; the temperature controller 6 is used to receive the temperature and displacement signals of the thermometer and the displacement sensor; the displacement sensor 7 is arranged along the radial direction of the reflecting plate 8 and is used to measure the distance from the wafer to the reflecting plate; the wafer 8 is placed on the edge ring 9.

[0024] The temperature detector and displacement sensor are installed at equal distances below the cavity and arranged along the radial direction of the reflector. Usually, 7 thermometers can be selected and set, and the number of displacement sensors can be set according to actual use. In the present invention, 3 are taken as an example. Since the wafer is in a rotating state during the process, the thermometer and displacement sensor can collect the temperature and distance information on the circumference of the wafer with a fixed radius. At the same time, according to the number of displacement sensors, the upper heating lamp can be divided into 3 groups of lamp zones Zone 1, Zone 2 and Zone 3 from the inside to the outside; the displacement sensor transmits the ranging data signal to the temperature controller to complete the real-time adjustment of the power of the corresponding lamp zone. In the process of heating the wafer, if the wafer is heated unevenly, the above two deformations will occur. At this time, the real-time ranging of the displacement detector will change. Both of these deformations will cause the friction between the wafer and the support ring to decrease during the process, thereby increasing the risk of wafer OOP.

[0025] Furthermore, a method for monitoring and repairing wafer deformation in a rapid thermal processing device is provided, comprising the following steps: Step S1: After the wafer is passed into the cavity and falls on the edge ring, the laser displacement sensor emits laser to a fixed point to detect the initial height S0 of the wafer from the reflector, which is defined as the reference distance. The height difference of the three reference measurement points is monitored at the same time. If the difference is within the allowable range, it is considered that the wafer is level in the cavity and the process can be performed normally. Step S2: During the process, the wafer is rotated at a fixed speed by a magnetic suspension device, and the displacement sensor measures the distance of fixed emission points at a certain frequency. The real-time height of the three fixed points is defined as S1; Step S3: Calculate the wafer surface deformation through the real-time distance of the wafer detection point; Feedback the wafer deformation information to the temperature controller, and the temperature controller adjusts the voltage output of the three lamp areas according to the distance of the three distance measurement points. The relationship between the control voltage of each lamp area and the distance measurement height can be simplified as the relationship: V=P*(S1-S0)+I*S1 S0: initial height of the distance measurement point, S1: real-time height; V: output voltage of the sensor corresponding to the light area; P and I are both proportional coefficients of the control process; If S1>S0, the power output of the lamp area needs to be increased; if S1<S0, the power output of the corresponding lamp area needs to be reduced, and the distances of the three sampling points to S1 are compared in real time. When the real-time distance difference of the three points is adjusted to the allowable range, the power adjustment of the temperature controller is stopped. By timely compensating for the actual deformation of the wafer, the OOP problem caused by the reduction of friction between the wafer and the support ring due to deformation in the following two directions caused by uneven heating during the heating process can be prevented.

[0026] Furthermore, a system for rapid thermal processing equipment to detect and repair wafer deformation adopts the following technical scheme: a system for rapid thermal processing equipment to monitor and repair wafer deformation, comprising a cavity and an adjustment structure, a rotating device is installed on the surface of the lower end of the cavity, a plurality of heating lamps are arranged inside the cavity, and the plurality of heating lamps are connected to the cavity by means of the adjustment structure, three displacement sensors are installed inside the cavity, seven thermometers are installed inside the cavity, connecting wires are installed at the lower ends of the temperature sensors and the thermometers, a temperature controller is installed at the lower ends of the connecting wires, a quartz window is installed inside the cavity, an edge ring is installed inside the cavity, a wafer is placed above the edge ring, and a reflective plate is installed inside the cavity.

[0027] In one embodiment, an adjustment structure is provided on the upper surface of the cavity, and the adjustment structure includes a fixing plate, the fixing plate is fixedly connected to the cavity, a hydraulic rod is installed on the upper surface of the fixing plate, the arc surface of the output end of the hydraulic rod is rotatably connected to a swivel, the arc surface of the swivel is fixedly connected to a mounting rod, the end of the mounting rod away from the swivel is fixedly connected to an auxiliary rod, the arc surface of the auxiliary rod is fixedly connected to a plurality of connecting rods, the lower end of the connecting rod is fixedly connected to a circular plate, the lower surface of the circular plate is fixedly connected to a plurality of connecting rods, the lower end of the connecting rod is fixedly connected to a heating lamp, a plurality of positioning rods are installed on the upper surface of the cavity, the arc surface of the circular plate is fixedly connected to a plurality of auxiliary plates, the auxiliary plate is slidably connected to the positioning rod, the inner wall of the mounting rod is slidably connected to a plug rod, the arc surface of the output end of the hydraulic rod is fixedly connected to the mounting plate, the inner wall of the mounting plate is provided with a socket, and the plug rod is adapted to the socket. By adopting this scheme, when it is necessary to stop the heating urgently, in order to avoid the residual heat of the heating lamp from continuing to heat, the hydraulic rod is started to move, the output end of the hydraulic rod rises, the hydraulic rod drives the swivel to move, the swivel drives the mounting rod to move, the mounting rod drives the insertion rod and the auxiliary rod to move, the auxiliary rod drives the connecting rod to move, the connecting rod drives the circular plate to move upward, the circular plate drives the connecting rod to move, the connecting rod drives the heating lamp to rise and separate from the cavity, wherein the circular plate drives the auxiliary plate to move, the auxiliary plate is separated from the positioning rod, after moving to the appropriate height, the swivel is rotated to move, the swivel drives the mounting rod to move, after moving to the appropriate position, the insertion rod is pulled to move, and when the mounting rod and the mounting plate are aligned, the insertion rod is inserted into the socket for fixation.

[0028] In one embodiment, the arc surface of the insertion rod is covered with a spring, and the two ends of the spring are respectively fixedly connected to the insertion rod and the mounting rod. With this solution, when the insertion rod needs to be inserted for fixing, the insertion rod is pulled to move, the insertion rod drives the spring to stretch, and then the insertion rod is aligned with the mounting rod and the insertion hole, and then the insertion rod spring is released to contract and drive the insertion rod to be inserted for fixing.

[0029] In one embodiment, the connecting rod is a stainless steel rod, and the cross section of the stainless steel rod is circular. With this solution, the stainless steel material can increase the service life of the connecting rod and prevent the connecting rod from rusting during use.

[0030] In one embodiment, the arc surface of the reflection plate is provided with a recovery structure, and the recovery structure includes a plurality of connecting rails, and the plurality of connecting rails are fixedly connected to the reflection plate, and a sliding rod is slidably connected inside the connecting rail, and a connecting block is fixedly connected to the upper end of the sliding rod, and a reset plate is fixedly connected to the end of the connecting block close to the wafer, and a circular pad is fixedly connected to the arc surface of the sliding rod, and a rotating groove is provided on the inner wall of the cavity, and a rotating rod is slidably connected to the inner wall of the rotating groove, and a rotating disk is fixedly connected to the upper end of the rotating rod, and a plurality of notches are provided on the inner wall of the rotating disk. The notch is slidably connected to the sliding rod, the arc surface of the cavity is fixedly connected to the limiting block, the inner wall of the limiting block is rotatably connected to an axle rod, the arc surface of the axle rod is fixedly connected to a connecting block, the end of the connecting block close to the cavity is fixedly connected to a fixing rod, the upper end of the fixing rod is fixedly connected to a clamping block, the lower end of the rotating rod is fixedly connected to a clamping ring, the clamping ring abuts against the clamping block, the end of the connecting block away from the fixing rod is fixedly connected to a handle rod, the arc surfaces at both ends of the axle rod are covered with coil springs, and the two ends of the coil spring are respectively fixedly connected to the connecting block and the limiting block. By adopting this solution, when the wafer deviates and needs to be reset, the handle bar is pulled to move, the handle bar drives the connecting block to move, the connecting block drives the shaft rod to rotate on the inner wall of the limit block, the connecting block drives the coil spring to contract, and then the connecting block drives the fixing rod to move, the fixing rod drives the clamping block to move, the clamping block is separated from the clamping ring, and then the clamping ring is rotated to move, the clamping ring drives the rotating rod to move, the rotating rod slides on the inner wall of the rotating groove, the rotating rod drives the turntable to move, the turntable drives the notch to move, the notch drives the sliding rod to move, the sliding rod drives the round pad to move, the sliding rod slides on the inner wall of the connecting rail, and the sliding rod drives the connecting block to move. Move, the connecting block drives the reset plate to move, the reset plate resets the wafer, after the reset is completed, the clamping ring is rotated in the opposite direction to move, the clamping ring drives the rotating rod to reset, the rotating rod drives the turntable to rotate in the opposite direction, the turntable drives the notch to move, the notch drives the sliding rod to move to the side away from the wafer, the sliding rod drives the connecting block to move, the connecting block drives the reset plate to move outward, drives the reset plate to expand outward, after moving to the appropriate position, release the handle coil spring to contract and drive, the coil spring drives the connecting block to reset, the connecting block drives the fixing rod to move upward, the fixing rod drives the clamping block and the clamping ring to be clamped and fixed, thereby completing the reset of the wafer.

[0031] In one embodiment, a limit rod is fixedly connected inside the connecting rail, and the limit rod is slidably connected to the sliding rod. With this solution, the limit rod can limit the sliding rod, thereby preventing the sliding rod from deflecting during use and improving the sliding stability of the round rod.

[0032] In one embodiment, a protective pad is fixedly connected to one side of the reset plate close to the wafer, and the protective pad is a rubber pad. With this solution, the protective pad can protect the wafer and prevent the wafer from being worn during use.

[0033] In one embodiment, a wire binding structure is provided at the lower end of the cavity, and the wire binding structure includes two connecting plates, the two connecting plates are fixedly connected to the cavity, the lower ends of the connecting plates are fixedly connected to a rectangular plate, the inner walls at both ends of the rectangular plate are provided with connecting grooves, the inner walls of the connecting grooves are slidably connected to connecting strips, the lower surface of the connecting strips is fixedly connected to a clamping plate, the bottom wall of the connecting grooves is fixedly connected to an iron sheet, the end of the sliding strip close to the iron sheet is fixedly connected to a magnetic sheet, the magnetic sheet and the iron sheet are adsorbed, and the inner walls of the rectangular plate and the clamping plate on the side close to each other are provided with wire binding grooves. By adopting this solution, when it is necessary to bundle the connecting wires, the clamping plate is pulled to move, the clamping plate drives the slide bar to move, the slide bar drives the magnetic sheet and the iron sheet to separate, and then the slide bar slides on the inner wall of the connecting groove, and then the rectangular plate is separated from the clamping plate, and then the connecting wires are placed in the wiring bundle groove, and then the clamping plate is pulled to drive the slide bar to move, align the slide bar with the connecting groove, and then insert the slide bar into the connecting groove, after moving to the appropriate position, the magnetic sheet and the iron sheet are adsorbed and fixed, and then the clamping plate and the rectangular plate bundle the connecting wires.

[0034] In one embodiment, a round rod is fixedly connected to the interior of the connection groove, and the round rod is slidably connected to the slide bar. With this solution, the round rod can limit the slide bar, prevent the slide bar from deflecting when it is moved, and improve the sliding stability of the slide bar.

[0035] In one embodiment, a protective sleeve is fixedly connected to the inner wall of the cable duct, and the cross section of the protective sleeve is semicircular. With this solution, the protective sleeve can protect the connecting wires and prevent the rectangular plate and the clamping plate from excessive wear when the connecting wires are bundled.

[0036] The specific technical solutions of the present invention are further described below in conjunction with the accompanying drawings and specific embodiments.

[0037] like Figure 1-Figure 9As shown, the present invention provides a system for rapid thermal processing equipment to monitor and repair wafer deformation, which includes a cavity 10 and an adjustment structure 11. A rotating device 1 is installed on the surface of the lower end of the cavity 10. A plurality of heating lamps 2 are arranged inside the cavity 10. The plurality of heating lamps 2 are connected to the cavity 10 by means of the adjustment structure 11. Three displacement sensors 7 are installed inside the cavity 10. Seven thermometers 4 are installed inside the cavity 10. The lower ends of the temperature sensors and the thermometers are both installed with connecting wires. The lower ends of the connecting wires are installed with a temperature controller 6. A quartz window 3 is installed inside the cavity 10. An edge ring 9 is installed inside the cavity 10. A crystal Circle 8, a reflector 5 is installed inside the cavity 10, an adjustment structure 11 is provided on the upper surface of the cavity 10, a recovery structure 12 is provided on the arc surface of the reflector 5, a beam structure 13 is provided at the lower end of the cavity 10, a top view of the relative installation positions of the temperature detector and the displacement sensor 7, the temperature detector and the displacement sensor 7 are installed at equal distances below the cavity 10 and arranged along the radial direction of the reflector 5, usually 7 thermometers 4 can be selected and set, and the number of displacement sensors 7 can be set according to actual use. In this design, 3 are taken as an example. Since the wafer 8 is in a rotating state during the process, the thermometer and the displacement sensor 7 can collect the temperature and distance information on the fixed radius circumference of the wafer 8, At the same time, according to the number of displacement sensors 7, the upper heating lamp 2 can be divided into 3 groups of lamp zones Zone 1, Zone 2, and Zone 3 from the inside to the outside; the displacement sensor 7 transmits the ranging data signal to the temperature controller 6 to complete the real-time adjustment of the power of the corresponding lamp zone. During the heating process, if the wafer 8 is heated unevenly, the above two deformations will occur. At this time, the real-time ranging of the displacement detector will change. During the process, both of these deformations will cause the friction between the wafer 8 and the support ring to decrease, thereby increasing the risk of wafer 8 OOP. After the wafer 8 penetrates the cavity 10, it falls on the edge ring 9. At this time, the laser displacement sensor 7 emits a laser to a fixed point to detect the wafer 8. The initial height S0 of the distance reflector 5 is defined as the reference distance. The height difference of the three reference measurement points is monitored at the same time. If the difference is within the allowable range, it is considered that the wafer 8 is level in the cavity 10 and the process can be performed normally. During the process, the wafer 8 rotates at a fixed speed through the magnetic suspension device, and the displacement sensor 7 measures the distance of the fixed emission points at a certain frequency. The real-time height of the three fixed points is defined as S1. The surface deformation of the wafer 8 is calculated by the real-time distance of the monitoring points of the wafer 8; the deformation information of the wafer 8 is fed back to the temperature controller 6, and the temperature controller 6 adjusts the voltage output of the three lamp areas according to the distance of the three ranging points. The relationship between the control voltage of each lamp area and the ranging height can be simplified to the relationship: V=P*(S1-S0)+I*S1 S0: initial height of the distance measuring point, S1: real-time height; V: output voltage of the sensor corresponding to the lamp area; P / I: proportional coefficient of the control process; if S1>S0, the power output of the lamp area needs to be increased; if S1<S0, the power output of the corresponding lamp area needs to be reduced, and the distance S1 of the three sampling points is compared in real time. When the real-time distance difference of the three points is adjusted to the allowable range, the power adjustment of the temperature controller 6 is stopped. By timely compensating for the actual deformation of the wafer 8, the OOP problem caused by the reduction of friction between the wafer 8 and the support ring due to deformation in the following two directions caused by uneven heating during the heating process can be prevented.

[0038] The specific settings and functions of the adjustment structure 11, the recovery structure 12, and the wiring structure 13 are described in detail below.

[0039] like Figure 1 and Figure 4As shown, the adjustment structure 11 includes a fixed plate 1101, which is fixedly connected to the cavity 10, a hydraulic rod 1104 is installed on the upper surface of the fixed plate 1101, and the arc surface of the output end of the hydraulic rod 1104 is rotatably connected to a swivel 1105, and the arc surface of the swivel 1105 is fixedly connected to a mounting rod 1109, and the end of the mounting rod 1109 away from the swivel 1105 is fixedly connected to an auxiliary rod 1110, and the arc surface of the auxiliary rod 1110 is fixedly connected to a plurality of connecting rods 1108, and the lower end of the connecting rod 1108 is fixedly connected to a circular plate 1113, and the lower surface of the circular plate 1113 is fixedly connected to a plurality of connecting rods 1114, and the lower end of the connecting rod 1114 is fixedly connected to the heating lamp 2, and the upper surface of the cavity 10 is installed A plurality of positioning rods 1112, the arc surface of the circular plate 1113 is fixedly connected with a plurality of auxiliary plates 1111, the auxiliary plates 1111 are slidably connected with the positioning rods 1112, the inner wall of the mounting rod 1109 is slidably connected with the plug rod 1106, the arc surface of the output end of the hydraulic rod 1104 is fixedly connected with the mounting plate 1102, the inner wall of the mounting plate 1102 is provided with a socket 1103, the plug rod 1106 is adapted to the socket 1103, when it is necessary to stop the heating urgently, in order to avoid the residual heat of the heating lamp 2 from continuing to heat, the hydraulic rod 1104 is started to move, the output end of the hydraulic rod 1104 is raised, the hydraulic rod 1104 drives the swivel 1105 to move, the swivel 1105 drives the mounting rod 1109 to move, the mounting The rod 1109 drives the insertion rod 1106 and the auxiliary rod 1110 to move, the auxiliary rod 1110 drives the connecting rod 1108 to move, the connecting rod 1108 drives the circular plate 1113 to move upward, the circular plate 1113 drives the connecting rod 1114 to move, the connecting rod 1114 drives the heating lamp 2 to rise and separate from the cavity 10, wherein the circular plate 1113 drives the auxiliary plate 1111 to move, the auxiliary plate 1111 is separated from the positioning rod 1112, and after moving to a suitable height, the rotating ring 1105 is rotated to move, the rotating ring 1105 drives the installation rod 1109 to move, and after moving to a suitable position, the insertion rod 1106 is pulled to move, and when the installation rod 1109 and the installation plate 1102 are aligned, the insertion rod 1106 is pulled upward, and ... The rod 1106 is inserted into the socket 1103 for fixation, and the arc surface of the rod 1106 is covered with a spring 1107. The two ends of the spring 1107 are fixedly connected to the rod 1106 and the mounting rod 1109 respectively. When the rod 1106 needs to be inserted for fixation, the rod 1106 is pulled to move, and the rod 1106 drives the spring 1107 to stretch, and then the rod 1106 is aligned with the mounting rod 1109 and the socket 1103, and then the rod 1106 is released, and the spring 1107 contracts to drive the rod 1106 to be inserted and fixed. The connecting rod 1108 is a stainless steel rod with a circular cross-section. The stainless steel material can increase the service life of the connecting rod 1108 and prevent the connecting rod 1108 from rusting during use.

[0040] The whole adjustment structure 11 has the effect that the heating lamp can be quickly removed when the heating lamp stops in an emergency.

[0041] like Figures 5 to 7As shown, the recovery structure 12 includes a plurality of connecting rails 1201, and the plurality of connecting rails 1201 are fixedly connected to the reflecting plate 5. The connecting rails 1201 are internally slidably connected to a sliding rod 1204, and the upper end of the sliding rod 1204 is fixedly connected to a connecting block 1203, and the end of the connecting block 1203 close to the wafer 8 is fixedly connected to a reset plate 1205, and the arc surface of the sliding rod 1204 is fixedly connected to a circular pad 1208. A rotating groove 1210 is provided on the inner wall of the cavity 10, and a rotating rod 1211 is slidably connected to the inner wall of the rotating groove 1210, and a rotating disk 1219 is fixedly connected to the upper end of the rotating rod 1211, and a plurality of notches 1207 are provided on the inner wall of the rotating disk 1219, and the notches 1207 are slidably connected to the sliding rod 1204. The arc surface of the cavity 10 is fixedly connected to the limited The inner wall of the limit block 1216 is rotatably connected with an axle rod 1218, and the arc surface of the axle rod 1218 is fixedly connected with a connecting block 1215, and the end of the connecting block 1215 close to the cavity 10 is fixedly connected with a fixing rod 1214, and the upper end of the fixing rod 1214 is fixedly connected with a clamping block 1213, and the lower end of the rotating rod 1211 is fixedly connected with a clamping ring 1212, and the clamping ring 1212 abuts against the clamping block 1213, and the end of the connecting block 1215 away from the fixing rod 1214 is fixedly connected with a handle bar 1209, and the arc surfaces at both ends of the axle rod 1218 are sleeved with coil springs 1217, and the two ends of the coil spring 1217 are respectively fixedly connected with the connecting block 1215 and the limit block 1216. When the wafer 8 deviates and needs to be reset, pull the handle bar 1209 To move, the handle bar 1209 drives the connecting block 1215 to move, the connecting block 1215 drives the shaft 1218 to rotate on the inner wall of the limit block 1216, the connecting block 1215 drives the coil spring 1217 to contract, and then the connecting block 1215 drives the fixing rod 1214 to move, the fixing rod 1214 drives the clamping block 1213 to move, the clamping block 1213 is separated from the clamping ring 1212, and then the clamping ring 1212 is rotated to move, the clamping ring 1212 drives the rotating rod 1211 to move, the rotating rod 1211 slides on the inner wall of the rotating groove 1210, the rotating rod 1211 drives the rotating disk 1219 to move, the rotating disk 1219 drives the notch 1207 to move, and the notch 1207 drives the sliding rod 1204 to move. The slide bar 1204 drives the round pad 1208 to move, and the slide bar 1204 slides on the inner wall of the connecting rail 1201, and the slide bar 1204 drives the connecting block 1203 to move, and the connecting block 1203 drives the reset plate 1205 to move, and the reset plate 1205 resets the wafer 8. After the reset is completed, the retaining ring 1212 is rotated in the reverse direction to move, and the retaining ring 1212 drives the rotating rod 1211 to reset, and the rotating rod 1211 drives the turntable 1219 to rotate in the reverse direction, and the turntable 1219 drives the notch 1207 to move, and the notch 1207 drives the slide bar 1204 to move to the side away from the wafer 8, and the slide bar 1204 drives the connecting block 1203 to move, and the connecting block 1203 drives the reset plate 1205 to move outward.The reset plate 1205 is driven to expand outwards. After moving to the appropriate position, the handle 1209 is released and the coil spring 1217 is contracted and driven. The coil spring 1217 drives the connection block 1215 to reset. The connection block 1215 drives the fixing rod 1214 to move upwards. The fixing rod 1214 drives the clamping block 1213 to clamp and fix with the clamping ring 1212, thereby completing the reset of the wafer 8. The internal fixed connection of the connecting rail 1201 is provided with a limit rod 1202. The limit rod 1202 is slidably connected with the slide rod 1204. The limit rod 1202 can limit the slide rod 1204 to prevent the slide rod 1204 from deflecting during use, thereby improving the sliding stability of the round rod 1307. The reset plate 1205 is fixedly connected with a protective pad 1206 on the side close to the wafer 8. The protective pad 1206 is a rubber pad. The protective pad 1206 can protect the wafer 8 to prevent the wafer 8 from being worn during use.

[0042] The whole recovery structure 12 has the effect of being able to easily perform external resetting after the wafer is chipped.

[0043] like Figure 8 and Fig. 9As shown, the harness structure 13 includes two connecting plates 1301, the two connecting plates 1301 are fixedly connected to the cavity 10, the lower end of the connecting plate 1301 is fixedly connected to a rectangular plate 1303, the inner walls of both ends of the rectangular plate 1303 are provided with connecting grooves 1306, the inner wall of the connecting groove 1306 is slidably connected to a connecting strip, the lower surface of the connecting strip is fixedly connected to a clamping plate 1302, the bottom wall of the connecting groove 1306 is fixedly connected to an iron sheet 1309, and one end of the sliding bar 1305 close to the iron sheet 1309 is fixedly connected A magnetic sheet 1308 is connected, and the magnetic sheet 1308 and the iron sheet 1309 are attracted to each other. The inner wall of the rectangular plate 1303 and the clamping plate 1302 on the side close to each other is provided with a cable tie groove 1310. When the connecting wire needs to be tied, the clamping plate 1302 is pulled to move, and the clamping plate 1302 drives the slide bar 1305 to move, and the slide bar 1305 drives the magnetic sheet 1308 and the iron sheet 1309 to separate, and then the slide bar 1305 slides on the inner wall of the connecting groove 1306, and then the rectangular plate 1303 and the clamping plate are connected. 1302 is separated, and then the connecting wire is placed in the wire harness groove 1310, and then the clamping plate 1302 is pulled to drive the slide bar 1305 to move, and the slide bar 1305 is aligned with the connecting groove 1306, and then the slide bar 1305 is inserted into the connecting groove 1306. After moving to the appropriate position, the magnetic sheet 1308 and the iron sheet 1309 are adsorbed and fixed, and then the clamping plate 1302 and the rectangular plate 1303 are used to harness the connecting wire. The interior of the connecting groove 1306 is fixedly connected with a round rod 1307, and the round rod 130 7 is slidably connected to the slide bar 1305, and the round rod 1307 can limit the slide bar 1305 to prevent the slide bar 1305 from deflecting when it is moved and used, thereby improving the sliding stability of the slide bar 1305. The inner wall of the cable tying groove 1310 is fixedly connected with a protective sleeve 1304, and the cross-section of the protective sleeve 1304 is semicircular. The protective sleeve 1304 can protect the connecting wires to prevent excessive wear of the rectangular plate 1303 and the clamping plate 1302 when the connecting wires are bundled.

[0044] The entire wire bundling structure 13 has the effect of facilitating bundling of the connecting wires.

[0045] The overall working principle is as follows: 1. A top view of the relative installation positions of the temperature detector and the displacement sensor 7. The temperature detector and the displacement sensor 7 are installed at equal distances below the cavity 10 and arranged along the radial direction of the reflector 5. Usually, 7 thermometers 4 can be selected and set, and the number of displacement sensors 7 can be set according to actual use. In this design, 3 are taken as an example. Since the wafer 8 is in a rotating state during the process, the thermometer and the displacement sensor 7 can collect the temperature and distance information on the circumference of the wafer 8 with a fixed radius. At the same time, according to the number of displacement sensors 7, the upper heating lamp 2 can be divided into 3 groups of lamp zones Zone 1, Zone 2, and Zone 3 from the inside to the outside; the displacement sensor 7 transmits the ranging data signal to the temperature controller 6 to complete the real-time adjustment of the power of the corresponding lamp zone. If the wafer 8 is heated unevenly during the heating process, deformations in the above two situations will occur. At this time, the real-time ranging of the displacement detector will change. The occurrence of these two deformations will lead to a decrease in the friction between the wafer 8 and the support ring, thereby increasing the risk of wafer 8 OOP. After the wafer 8 penetrates the cavity 10, it falls on the edge ring 9. At this time, the laser displacement sensor 7 emits a laser to a fixed point to detect the initial height S0 of the wafer 8 from the reflector 5, which is defined as the reference distance. At the same time, the height difference of the three reference measurement points is monitored. If the difference is within the allowable range, it is considered that the wafer 8 is level in the cavity 10 and the process can be performed normally. During the process, the wafer 8 rotates at a fixed speed through a magnetic suspension device, and the displacement sensor 7 measures the distance of the fixed emission points at a certain frequency. The real-time height of the three fixed points is defined as S1. The surface deformation of the wafer 8 is calculated by the real-time distance of the monitoring points of the wafer 8; the deformation information of the wafer 8 is fed back to the temperature controller 6, and the temperature controller 6 adjusts the voltage output of the three lamp areas according to the distance of the three ranging points. The relationship between the control voltage of each lamp area and the ranging height can be simplified to the relationship: V=P*(S1-S0)+I*S1 S0: initial height of the distance measuring point, S1: real-time height; V: output voltage of the sensor corresponding to the lamp area; P / I: proportional coefficient of the control process; if S1>S0, the power output of the lamp area needs to be increased; if S1<S0, the power output of the corresponding lamp area needs to be reduced, and the distance S1 of the three sampling points is compared in real time. When the real-time distance difference of the three points is adjusted to the allowable range, the power adjustment of the temperature controller 6 is stopped. By timely compensating for the actual deformation of the wafer 8, the OOP problem caused by the reduction of friction between the wafer 8 and the support ring due to deformation in the following two directions caused by uneven heating during the heating process can be prevented.

[0046] 2. When it is necessary to stop the heating urgently, in order to prevent the residual heat of the heating lamp 2 from continuing to heat, start the hydraulic rod 1104 to move, the output end of the hydraulic rod 1104 rises, the hydraulic rod 1104 drives the swivel 1105 to move, the swivel 1105 drives the installation rod 1109 to move, the installation rod 1109 drives the insertion rod 1106 and the auxiliary rod 1110 to move, the auxiliary rod 1110 drives the connecting rod 1108 to move, the connecting rod 1108 drives the circular plate 1113 to move upward, the circular plate 1113 drives the connecting rod 1114 to move, the connecting rod 1114 drives the heating lamp 2 to rise and separate from the cavity 10, wherein the circular plate 1113 drives the auxiliary plate 1111 to move, and the auxiliary plate 1111 and the positioning rod 1112 are separated. After moving to the appropriate height, rotate the swivel 1105 to move, and the swivel 1105 drives the mounting rod 1109 to move. After moving to the appropriate position, pull the insertion rod 1106 to move. When the mounting rod 1109 and the mounting plate 1102 are aligned, insert the insertion rod 1106 into the socket 1103 for fixation. When it is necessary to insert the insertion rod 1106 for fixation, pull the insertion rod 1106 to move, and the insertion rod 1106 drives the spring 1107 to stretch. Then align the insertion rod 1106 with the mounting rod 1109 and the socket 1103, then release the insertion rod 1106, and the spring 1107 contracts to drive the insertion rod 1106 to be inserted and fixed. The stainless steel material can increase the service life of the connecting rod 1108 and prevent the connecting rod 1108 from rusting during use.

[0047] 3. When the wafer 8 is offset and needs to be reset, the handle 1209 is pulled to move, the handle 1209 drives the connecting block 1215 to move, the connecting block 1215 drives the shaft 1218 to rotate on the inner wall of the limit block 1216, the connecting block 1215 drives the coil spring 1217 to shrink, and then the connecting block 1215 drives the fixing rod 1214 to move, the fixing rod 1214 drives the clamping block 1213 to move, the clamping block 1213 is separated from the clamping ring 1212, and then the clamping ring 1212 is rotated to move, and the clamping ring 1212 drives The rotating rod 1211 moves, the rotating rod 1211 slides on the inner wall of the rotating groove 1210, the rotating rod 1211 drives the rotating disk 1219 to move, the rotating disk 1219 drives the notch 1207 to move, the notch 1207 drives the sliding rod 1204 to move, the sliding rod 1204 drives the round pad 1208 to move, the sliding rod 1204 slides on the inner wall of the connecting rail 1201, the sliding rod 1204 drives the connecting block 1203 to move, the connecting block 1203 drives the reset plate 1205 to move, and the reset plate 1205 resets the wafer 8 After the reset is completed, the retaining ring 1212 is rotated in the opposite direction to move, the retaining ring 1212 drives the rotating rod 1211 to reset, the rotating rod 1211 drives the rotating disk 1219 to rotate in the opposite direction, the rotating disk 1219 drives the notch 1207 to move, the notch 1207 drives the sliding rod 1204 to move to the side away from the wafer 8, the sliding rod 1204 drives the connecting block 1203 to move, the connecting block 1203 drives the reset plate 1205 to move outward, drives the reset plate 1205 to expand outward, and releases the handle 1209 after moving to the appropriate position. The coil spring 1217 contracts and drives the connecting block 1215 to reset. The connecting block 1215 drives the fixing rod 1214 to move upward. The fixing rod 1214 drives the clamping block 1213 and the clamping ring 1212 to clamp and fix, thereby completing the reset of the wafer 8. The limiting rod 1202 can limit the sliding rod 1204 to prevent the sliding rod 1204 from deviating during use, thereby improving the sliding stability of the round rod 1307. The protective pad 1206 can protect the wafer 8 to prevent the wafer 8 from being worn during use.

[0048] 4. When the connecting wires need to be bundled, pull the clamping plate 1302 to move, the clamping plate 1302 drives the slide bar 1305 to move, the slide bar 1305 drives the magnetic sheet 1308 to separate from the iron sheet 1309, and then the slide bar 1305 slides on the inner wall of the connecting groove 1306, and then the rectangular plate 1303 is separated from the clamping plate 1302, and then the connecting wire is placed in the wire bundling groove 1310, and then the clamping plate 1302 is pulled to drive the slide bar 1305 to move, align the slide bar 1305 with the connecting groove 1306, and then the slide bar 1305 is moved. 05 is inserted into the connecting groove 1306. After moving to the appropriate position, the magnetic sheet 1308 and the iron sheet 1309 are adsorbed and fixed. Then the splint 1302 and the rectangular plate 1303 bundle the connecting wires. The round rod 1307 can limit the sliding bar 1305 to prevent the sliding bar 1305 from shifting when being moved and used, thereby improving the sliding stability of the sliding bar 1305. The protective cover 1304 can protect the connecting wires to prevent excessive wear of the rectangular plate 1303 and the splint 1302 when bundling the connecting wires.

[0049] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A system for monitoring and repairing wafer deformation in a rapid thermal processing device, comprising a chamber (10), a temperature sensor and an adjustment structure (11), characterized in that: A rotating device (1) is installed on the surface of the lower end of the cavity (10), and a plurality of heating lamps (2) are arranged inside the cavity (10). The plurality of heating lamps (2) are connected to the cavity (10) by means of an adjustment structure (11).

2. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 1, characterized in that: Three displacement sensors (7) are installed inside the cavity (10), seven thermometers (4) are installed inside the cavity (10), connecting wires are installed at the lower ends of the temperature sensors and the thermometers (4), and a temperature controller (6) is installed at the lower ends of the connecting wires.

3. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 1, characterized in that: A quartz window (3) is installed inside the cavity (10), an edge ring (9) is installed inside the cavity (10), a wafer (8) is placed above the edge ring (9), and a reflector (5) is installed inside the cavity (10).

4. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 1, characterized in that: An adjustment structure (11) is provided on the upper surface of the cavity (10), wherein the adjustment structure (11) comprises a fixing plate (1101), wherein the fixing plate (1101) is fixedly connected to the cavity (10), and a hydraulic rod (1104) is installed on the upper surface of the fixing plate (1101).

5. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 4, characterized in that: The circular arc surface of the output end of the hydraulic rod (1104) is rotatably connected to a swivel (1105), the circular arc surface of the swivel (1105) is fixedly connected to a mounting rod (1109), one end of the mounting rod (1109) away from the swivel (1105) is fixedly connected to an auxiliary rod (1110), and the circular arc surface of the auxiliary rod (1110) is fixedly connected to a plurality of connecting rods (1108).

6. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 5, characterized in that: The lower end of the connecting rod (1108) is fixedly connected to a circular plate (1113), the lower surface of the circular plate (1113) is fixedly connected to a plurality of connecting rods (1114), the lower ends of the connecting rods (1114) are fixedly connected to the heating lamp (2), and the upper surface of the cavity (10) is mounted with a plurality of positioning rods (1112).

7. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 6, characterized in that: A plurality of auxiliary plates (1111) are fixedly connected to the arc surface of the circular plate (1113); the auxiliary plates (1111) are slidably connected to the positioning rods (1112); and the inner wall of the mounting rod (1109) is slidably connected to the insertion rod (1106).

8. The system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 4, characterized in that: The arc surface of the output end of the hydraulic rod (1104) is fixedly connected to a mounting plate (1102), an inner wall of the mounting plate (1102) is provided with a plug hole (1103), and the plug rod (1106) is adapted to fit the plug hole (1103).

9. A system for monitoring and repairing wafer deformation in rapid thermal processing equipment according to claim 8, characterized in that: The arc surface of the insertion rod (1106) is sleeved with a spring (1107), and the two ends of the spring (1107) are respectively fixedly connected to the insertion rod (1106) and the installation rod (1109).

10. A method for monitoring and repairing wafer deformation in a rapid thermal processing equipment, comprising the following steps: Step S1: After the wafer is passed into the cavity and falls on the edge ring, the laser displacement sensor emits laser to a fixed point to detect the initial height S0 of the wafer from the reflector, which is defined as the reference distance. The height difference of the three reference measurement points is monitored at the same time. If the difference is within the allowable range, it is considered that the wafer is level in the cavity and the process can be performed normally. Step S2: During the process, the wafer is rotated at a fixed speed by a magnetic suspension device, and the displacement sensor measures the distance of fixed emission points at a certain frequency. The real-time height of the three fixed points is defined as S1; Step S3: Calculate the wafer surface deformation through the real-time distance of the wafer detection point; Feedback the wafer deformation information to the temperature controller, and the temperature controller adjusts the voltage output of the three lamp areas according to the distance of the three distance measurement points. The relationship between the control voltage of each lamp area and the distance measurement height can be simplified as the relationship: V=P*(S1-S0)+I*S1 S0: initial height of the distance measurement point, S1: real-time height; V: output voltage of the sensor corresponding to the light area; P and I are both proportional coefficients of the control process; If S1>S0, the power output of the lamp area needs to be increased; if S1<S0, the power output of the corresponding lamp area needs to be reduced, and the distance between the three sampling points and S1 is compared in real time. When the real-time distance difference between the three points is adjusted to the allowable range, stop the power adjustment of the temperature controller.

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